Resistance test system and test method

Abstract

The invention relates to the technical field of resistance testing, in particular to a resistance testing system and method, and the system comprises a rack which is internally provided with a feeding table, an x-axis motion module, a normal-temperature resistance positioning platform and a high-temperature resistance positioning platform. The normal-temperature resistor positioning platform and the high-temperature resistor positioning platform are adjacently arranged and located between the feeding table and the x-axis movement module, a y-axis movement module is arranged on the x-axis movement module, and a probe positioning mechanism, a probe testing mechanism and a suction mechanism are arranged on the y-axis movement module. The suction mechanism is used for moving the resistor from the feeding table to the normal-temperature resistor positioning platform or the high-temperature resistor positioning platform, and the probe positioning mechanism is used for acquiring the position information of the resistor and controlling the probe testing mechanism to adjust the butt joint position with the resistor. According to the invention, the butt joint precision between the probe plate and the chip resistor can be improved, and the reliability of batch test of resistors is ensured.

Description

Technical Field

[0001] This application relates to the field of resistance testing technology, and in particular to a resistance testing system and testing method. Background Technology

[0002] As mobile terminal products become increasingly feature-rich, mobile phones integrate a large number of electronic components. Among these, surface mount resistors (SMRs) are fundamental and critical components, and their performance stability directly determines the reliability of the phone's operation and the overall performance of the device. Therefore, to ensure the consistency and reliability of the final product, SMRs must undergo rigorous performance testing after production, especially resistance value testing under different operating conditions such as room temperature and high temperature, to evaluate their stability in various temperature environments.

[0003] In existing resistance testing processes, batch testing is typically employed to improve efficiency when dealing with a large number of surface mount resistors. Specifically, common testing setups include a positioning platform and a probe board with multiple probes. During testing, the surface mount resistors to be tested are neatly placed on the positioning platform. The probe board is then moved above the resistors and descends vertically until the probes make electrical contact with the resistors, completing a single batch of resistance tests. This method is characterized by its simple structure and intuitive operation, and has been widely adopted in actual production lines. In this process, the number and distribution of probes on the probe board correspond one-to-one with the arrangement of resistors on the positioning platform, enabling simultaneous testing of multiple resistors, significantly improving testing efficiency and meeting the needs of large-scale production.

[0004] However, the aforementioned traditional testing methods have significant shortcomings. Since the connection between the probe plate and the resistor relies primarily on the initial placement of the positioning platform and the overall movement of the probe plate, the matching accuracy between the probes and resistors is often difficult to guarantee during actual connection. Any positional shift or angular error may cause some probes to fail to make proper contact with the resistor, thus affecting the accuracy of the resistance test. More seriously, in high-temperature testing scenarios, the materials of the platform and probe plate may experience thermal expansion, further exacerbating connection errors. Therefore, improving the connection accuracy between the probe plate and the surface mount resistor, and ensuring the reliability of batch resistor testing, has become a pressing issue that needs to be addressed in current technology. Summary of the Invention

[0005] In order to improve the mating accuracy between the probe plate and the chip resistor and ensure the reliability of batch resistor testing, this application provides a resistor testing device.

[0006] Firstly, this application provides the following technical solution: A resistance testing system includes a frame, within which are a loading platform, an x-axis motion module, a room-temperature resistance positioning platform, and a high-temperature resistance positioning platform. The room-temperature resistance positioning platform and the high-temperature resistance positioning platform are arranged adjacent to each other and located between the loading platform and the x-axis motion module. The x-axis motion module is equipped with a y-axis motion module, which is provided with a probe positioning mechanism, a probe testing mechanism, and a suction mechanism. The suction mechanism is used to move the resistor from the loading platform to the room-temperature resistance positioning platform or the high-temperature resistance positioning platform. The probe positioning mechanism is used to acquire the position information of the resistor and control the probe testing mechanism to adjust its docking position with the resistor.

[0007] In one specific implementation scheme, the top of the loading platform is provided with a blowing block, and the suction mechanism includes a vertically arranged drive cylinder, a vibration cylinder and a suction cup. The drive cylinder is mounted on the y-axis motion module, and the output end of the drive cylinder is connected to a base plate. The suction cup is vertically mounted on the base plate, and the vibration cylinder is mounted on the top surface of the base plate.

[0008] In one specific implementation, the probe positioning mechanism is located between the probe testing mechanism and the aspiration mechanism, and the probe positioning mechanism includes a first camera and a light source, with the first camera positioned directly above the light source.

[0009] In one specific implementation scheme, the y-axis motion module is provided with a fixed plate; the probe testing mechanism includes a first drive module, a fixed frame, a rotating platform, a second drive module, a test plate, and a probe plate. The first drive module is disposed on the fixed plate and can move in the vertical direction. The fixed frame is mounted on the first drive module. The rotating platform is adjustablely disposed on the bottom surface of the fixed frame. The second drive module is disposed at the bottom end of the rotating platform. The test plate is connected to the second drive module. The second drive module can drive the test plate to move in the horizontal direction. The probe plate is adjustablely disposed on the bottom surface of the test plate.

[0010] In one specific implementation, a second camera and a prism are provided between the test board and the second driving module. The second camera and the prism are both installed at the bottom of the second driving module and are located on the same horizontal line. The middle part of the test board and the probe board are both provided with holes in the vertical direction. The prism is located directly above the middle part of the test board. The second driving module is also connected to an adjustment knob.

[0011] In one specific implementation, a plurality of heating rods are inserted into the high-temperature resistance positioning platform, and the plurality of heating rods are evenly distributed in the high-temperature resistance positioning platform.

[0012] In one specific implementation scheme, the frame is further provided with a third drive module, which is located on one side of the high-temperature resistor positioning platform. The third drive module is provided with a defective resistor positioning platform and a laser mechanism. The defective resistor positioning platform is arranged in parallel with the high-temperature resistor positioning platform and the room-temperature resistor positioning platform. The third drive module is used to feed the defective resistor positioning platform into the laser mechanism.

[0013] In one specific implementation, a through hole is provided on one side of the laser mechanism for the defective resistor positioning platform to enter, and a baffle is provided on one side of the defective resistor positioning platform, the size of which is the same as the size of the through hole.

[0014] In one specific implementation, the laser mechanism is equipped with a vacuum cleaner and a lifting knob, the lifting knob being used to control the laser mechanism to engrave resistors.

[0015] Secondly, this application provides the following technical solution: A resistance testing method, applied in the resistance testing system as described in the first aspect, the method comprising: The suction mechanism is controlled to suck up the resistors on the loading platform. During suction, the blower block is activated to blow air and the vibrating cylinder is activated to shake. Move the sampled resistor to the room temperature resistor positioning platform, move the probe positioning mechanism to directly above the room temperature resistor positioning platform, and control the camera to take pictures at three points on the resistor that form a right triangle to confirm the displacement parameters and rotation angle of the probe testing mechanism. The probe testing mechanism is moved to the top of the room temperature resistance positioning platform. The first drive module, the second drive module, and the rotating platform are adjusted based on the displacement parameters and rotation angle. The resistance is observed again through the second camera and prism. The adjustment knob is used for secondary fine-tuning. Finally, the probe plate is docked with the resistance to complete the room temperature resistance test. In the high-temperature resistor positioning platform, repeat the above operations to complete the high-temperature resistance test. After the resistance test is completed, if the resistance test fails, the control suction mechanism places the resistor on the defective resistor positioning platform, and the control third drive module sends the defective resistor positioning platform into the laser mechanism for defective product engraving.

[0016] In summary, the beneficial effects of this application include at least the following: 1) Resistors are stacked vertically in the loading chamber, facilitating the suction cup to pick them up one by one from the top layer. The driving cylinder precisely moves the suction cup up and down, ensuring accurate placement. Simultaneously, after the suction cup picks up a resistor, the blowing block and vibrating cylinder are activated in sync. The blowing block uses airflow to laterally blow the resistor, while the vibrating cylinder applies slight vibration to the suction cup base plate. This dual separation effectively prevents adhesion or electrostatic coupling between the suction cup and the lower layer of resistors, ensuring that each resistor can be smoothly and independently extracted. Therefore, this design not only ensures the continuity and stability of the loading process, avoiding loading failures or incorrect picks due to resistor adhesion, but also reduces time loss caused by repeated picking, improving the efficiency of automated loading and the overall reliability of the testing process.

[0017] 2) The first camera provides uniform illumination using a light source, ensuring clear and reliable imaging. The first camera selects three points on the resistor surface arranged in a right-angled triangle for image recognition. This point arrangement has a mathematical advantage of determinism: the coordinate information of three non-collinear points can uniquely determine the resistor's position and rotation angle in the plane, thus accurately calculating the overall spatial orientation of the resistor. If only one or two points are collected, the resistor's rotation direction cannot be completely determined, easily leading to deviations in the probe-resistor docking. Selecting three points forming a right-angled triangle not only ensures stable calculations and unique positioning results but also improves anti-interference capabilities, avoiding cumulative deviations caused by image recognition errors. Therefore, accurate resistor positioning can be achieved under both room temperature and high-temperature testing environments, providing a reliable guarantee for the precise docking of subsequent probe testing mechanisms and fundamentally solving the problem of insufficient probe-resistor docking accuracy in existing technologies.

[0018] By employing a collaborative mechanism of extraction separation, visual positioning, dual calibration, and automatic identification of defective products, the problem of insufficient docking accuracy between probe boards and surface mount resistors in existing technologies is solved. Specifically, firstly, during resistor extraction, a blower block and a vibrating cylinder are used to effectively prevent resistors from sticking together, ensuring stable handling of individual resistors. Then, on a room temperature or high temperature resistor positioning platform, a first camera captures images of the three right-angled triangle points of the resistor, accurately obtaining the resistor's displacement parameters and rotation angle, achieving unique determination of the resistor's spatial orientation. Next, coarse adjustments are made using the first and second drive modules and the rotating platform, combined with real-time observation using a second camera and a prism, and secondary fine adjustments are completed using adjustment knobs to ensure precise docking between the probe board and the resistor pads. After testing, a third drive module, in conjunction with a laser mechanism, automatically identifies and traces defective resistors. Through these multi-level positioning and calibration methods, the docking accuracy between the probe board and the surface mount resistor is effectively improved, avoiding contact deviations, pad damage, and docking errors caused by temperature changes, thereby ensuring the stability and reliability of batch testing of resistors in both room temperature and high temperature environments. Meanwhile, by leveraging the automated defect identification process, the integrity of the testing process and the level of production quality management have been further improved, solving the technical problems of insufficient resistance testing accuracy and poor batch testing reliability in existing technologies.

[0019] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the resistance testing system in this embodiment.

[0021] Figure 2 This is a schematic diagram of the resistance testing system in this embodiment.

[0022] Figure 3 yes Figure 2 Enlarged view of part A in the middle.

[0023] Figure 4 This is a schematic diagram of the structure of the room temperature resistor positioning platform, the high temperature resistor positioning platform, and the defective product resistor positioning platform in this embodiment.

[0024] Figure 5 This is a schematic diagram of the probe testing mechanism in this embodiment.

[0025] Reference numerals: 1. Frame; 11. Loading platform; 111. Blowing block; 12. X-axis motion module; 13. Y-axis motion module; 14. Fixing plate; 2. Suction mechanism; 21. Drive cylinder; 22. Vibration cylinder; 23. Suction cup; 24. Base plate; 3. Probe positioning mechanism; 31. First camera; 32. Light source; 4. Probe testing mechanism; 41. Probe plate; 42. Second camera; 43. First drive module; 44. Fixing frame; 45. Rotating platform; 46. Prism; 47. Adjustment knob; 48. Second drive module; 49. Test plate; 5. Room temperature resistance positioning platform; 6. High temperature resistance positioning platform; 61. Heating rod; 7. Defective product resistance positioning platform; 71. Baffle; 8. Laser mechanism; 81. Lifting knob; 82. Vacuum cleaner; 9. Third drive module. Detailed Implementation

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0028] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] This application discloses a resistance testing system.

[0031] Reference Figure 1 and Figure 2 The resistance testing system includes a frame 1, within which are a loading platform 11, an x-axis motion module 12, and a y-axis motion module 13. The loading platform 11 is located on one side of the x-axis motion module 12, and the y-axis motion module 13 is mounted on the x-axis motion module 12. A fixing plate 14 is fixedly mounted on the top of the y-axis motion module 13. Figure 3 The fixed plate 14 is provided with a probe testing mechanism 4, a probe positioning mechanism 3, and a suction mechanism 2 arranged sequentially along the horizontal direction. Figure 4 Between the loading platform 11 and the x-axis motion module 12, a normal temperature resistance positioning platform 5, a high temperature resistance positioning platform 6, a defective product resistance positioning platform 7, and a laser mechanism 8 are arranged in sequence along the horizontal direction. Among them, a number of heating rods 61 are inserted into the high temperature resistance positioning platform 6. The heating rods 61 are evenly distributed in the high temperature resistance positioning platform 6 to realize the high temperature test scenario.

[0032] Reference Figure 2 and Figure 3 The resistors in the loading platform 11 are stacked vertically in the loading chamber. A blower block 111 is located on one side of the loading port at the top of the loading platform 11. The suction mechanism 2 includes a vertically arranged drive cylinder 21, a vibration cylinder 22, and suction cups 23. The drive cylinder 21 is mounted on a fixed plate 14, and a base plate 24 is fixedly mounted on the output end of the drive cylinder 21. The base plate 24 is horizontally arranged. Several suction cups 23 are provided and vertically fixed to the base plate 24. The vibration cylinder 22 is mounted on the top surface of the base plate 24. When the resistors are being loaded, the drive cylinder 21 is activated to control the suction cups 23 to descend until they can pick up the resistors from the loading platform 11. Then, the suction cups 23 are controlled to rise. At this time, the blower block 111 and the vibration cylinder 22 are activated, making it less likely for the picked-up resistors to stick to the next resistor to be loaded. In implementation, resistors are stacked vertically in the loading chamber, facilitating the suction cup 23 to pick them up one by one from the top layer. The driving cylinder 21 enables precise up-and-down movement of the suction cup 23, ensuring accurate suction position. Simultaneously, after the suction cup 23 picks up the resistor, the blowing block 111 and the vibration cylinder 22 are activated synchronously. The blowing block 111 uses airflow to laterally blow the resistor, while the vibration cylinder 22 applies slight vibration to the base plate 24 of the suction cup 23. This dual separation effectively prevents adhesion or electrostatic coupling between the suction cup 23 and the lower layer resistors when the suction cup 23 picks up the resistor, ensuring that each resistor can be smoothly and independently extracted. Therefore, the above design not only ensures the continuity and stability of the loading process, avoiding loading failures or mis-picking due to resistor adhesion, but also reduces time loss caused by repeated picking, improving the efficiency of automated loading and the overall reliability of the testing process.

[0033] Reference Figure 2 and Figure 3The probe positioning mechanism 3 includes a first camera 31 and a light source 32. Both the first camera 31 and the light source 32 are mounted on the fixed plate 14, with the first camera 31 located directly above the light source 32. Figure 4 After the absorption mechanism 2 places the resistor on the ambient temperature resistor positioning platform 5 or the high temperature resistor positioning platform 6, the x-axis motion module 12 and the y-axis motion module 13 control the camera to move it directly above the ambient temperature resistor positioning platform 5 or the high temperature resistor positioning platform 6. The camera takes pictures of three points on the resistor forming a right-angled triangle, obtaining the displacement parameters and rotation angles for subsequent testing by the probe testing mechanism 4. In implementation, the first camera 31 provides uniform illumination with the help of the light source 32, ensuring clear and reliable imaging. The first camera 31 selects three points on the resistor surface arranged in a right-angled triangle for image recognition. This point arrangement has a mathematical deterministic advantage: the coordinate information of three non-collinear points can uniquely determine the position and rotation angle of the resistor in the plane, thereby accurately calculating the overall spatial attitude of the resistor. If only one or two points are collected, the rotation direction of the resistor cannot be completely determined, which can easily lead to deviations in the probe-resistance connection; however, selecting three points forming a right-angled triangle not only ensures the stability of the calculation process and the uniqueness of the positioning result, but also improves anti-interference ability and avoids cumulative deviations caused by image recognition errors. Therefore, it can achieve accurate positioning of the resistor under both normal and high temperature testing environments, providing a reliable guarantee for the accurate docking of the subsequent probe testing mechanism 4, and fundamentally solving the problem of insufficient probe-resistor docking accuracy in the existing technology.

[0034] Reference Figure 3 and Figure 5 The probe testing mechanism 4 includes a first drive module 43, a fixed frame 44, a rotating platform 45, a second drive module 48, a test plate 49, and a probe plate 41. The first drive module 43 is mounted on the fixed plate 14 and can move vertically. The fixed frame 44 is mounted on the first drive module 43. The rotating platform 45 is adjustablely mounted on the bottom surface of the fixed frame 44. The second drive module 48 is located at the bottom end of the rotating platform 45. The test plate 49 is connected to the second drive module 48, and the second drive module 48 can drive the test plate 49 to move horizontally. The probe plate 41 is adjustablely mounted on the bottom surface of the test plate 49. Figure 4 After the first camera 31 confirms that it has obtained the displacement parameters and rotation angle of the control probe testing mechanism 4 for subsequent testing, it controls the x-axis motion module 12 and the y-axis motion module 13 to move the probe plate 41 directly above the room temperature resistance positioning platform 5 or the high temperature resistance positioning platform 6. Based on the displacement parameters and rotation angle obtained by the first camera 31, it controls the first drive module 43, the second drive module 48 and the rotation platform 45 to make adjustments.

[0035] Reference Figure 3 and Figure 5A second camera 42 and a prism 46 are provided between the test board 49 and the second drive module 48. Both the second camera 42 and the prism 46 are mounted at the bottom of the second drive module 48 and are on the same horizontal line. The middle portions of both the test board 49 and the probe plate 41 have vertically oriented openings. The prism 46 is located directly above the middle portion of the test board 49. The second drive module 48 is also connected to an adjustment knob 47. Figure 4 After adjusting the first drive module 43, the second drive module 48, and the rotating platform 45, the operator observes the resistor position information refracted by the prism 46 on the room-temperature resistor positioning platform 5 or the high-temperature resistor positioning platform 6 through the second camera 42. The position of the probe plate 41 is then fine-tuned by adjusting the knob 47, and finally, the probe plate 41 is lowered until it connects with the resistor. This design, by introducing the combination of the second camera 42 and the prism 46 between the test plate 49 and the second drive module 48, achieves visualized and precise adjustment of the probe plate 41's connection process with the resistor, thus significantly improving the reliability and operational accuracy of the testing process. Specifically, both the test plate 49 and the probe plate 41 have vertically oriented openings in their middle sections. The prism 46 is positioned directly above the central opening of the test plate 49, allowing the resistor located on the room-temperature resistor positioning platform 5 or the high-temperature resistor positioning platform 6 to be captured by the second camera 42 after refraction through the prism 46. In this way, the operator does not need to observe directly from above the probe plate 41 but can obtain the precise position information of the resistor in real time through the second camera 42. After initial adjustments to the probe plate 41 using the first drive module 43, the second drive module 48, and the rotating platform 45, operators can use the adjustment knob 47 for more precise fine-tuning to ensure the probe plate 41 is aligned as perfectly as possible with the resistor, guaranteeing accurate contact between the probe and the resistor surface during subsequent vertical descent. This structure avoids the risk of poor contact or damage due to probe-resistor misalignment, enhances the intuitiveness and controllability of the connection process, and ensures stable and accurate electrical connections for batch resistance testing in both normal and high-temperature environments.

[0036] Reference Figure 2 and Figure 4 The frame 1 also houses a third drive module 9, located on one side of the high-temperature resistor positioning platform 6. The defective resistor positioning platform 7 and the laser mechanism 8 are mounted on the third drive module 9. The third drive module 9 is used to feed the defective resistor positioning platform 7 into the laser mechanism 8. One side of the laser mechanism 8 has a through hole for the defective resistor positioning platform 7 to enter and exit, and one side of the defective resistor positioning platform 7 has a baffle 71, the size of which is the same as the through hole. The laser mechanism 8 is equipped with a vacuum cleaner 82 and a lifting knob 81, which is used to control the laser mechanism 8 to engrave the resistor. Figure 3In implementation, if the resistance test fails, the suction mechanism 2 needs to be controlled to place the resistor on the defective resistor positioning platform 7 for defective product engraving. The third drive module 9 can drive the defective resistor positioning platform 7 to move along the trajectory, accurately sending the identified defective resistor into the laser mechanism 8. A through hole is opened on one side of the laser mechanism 8, and a baffle 71 of the same size as the through hole is designed to form a sealed space after the defective resistor positioning platform 7 enters. The laser mechanism 8 adjusts its height using the lifting knob 81 to precisely engrave the surface of the defective resistor, thereby identifying or coding the defective product for subsequent differentiation and processing. At the same time, the vacuum cleaner 82 installed on the laser mechanism 8 can promptly remove dust and debris generated during the engraving process, ensuring a clean processing environment and preventing contamination of other components or affecting the engraving accuracy. Through the above coordination, this solution not only realizes the automated sorting and identification of defective resistors, avoiding inefficiency and inconsistent marking caused by manual intervention, but also enhances the traceability in production quality management, providing a reliable basis for subsequent defective product analysis and improvement.

[0037] This application also discloses a resistance testing method applied to the above-mentioned resistance testing system. The method includes at least the following steps: S1. Control the suction mechanism 2 to suction the resistor on the loading platform 11. When suctioning, start the blowing block 111 to blow air and start the vibration cylinder 22 to shake. S2. Move the sampled resistor to the room temperature resistor positioning platform 5, move the probe positioning mechanism 3 directly above the room temperature resistor positioning platform 5, and control the camera to take pictures at three points on the resistor that form a right triangle to confirm the displacement parameters and rotation angle of the probe testing mechanism 4. S3. Control the probe testing mechanism 4 to move directly above the room temperature resistance positioning platform 5, adjust the first drive module 43, the second drive module 48 and the rotating platform 45 based on the displacement parameters and rotation angle; observe the resistance again through the second camera 42 and prism 46, control the adjustment knob 47 to make secondary fine adjustments, and finally control the probe plate 41 to dock with the resistance to complete the room temperature resistance test operation. S4. Repeat the above operation in the high temperature resistor positioning platform 6 to complete the high temperature test operation of the resistor. S5. After the resistance test is completed, if the resistance test fails, control the suction mechanism 2 to place the resistor on the defective resistor positioning platform 7, and control the third drive module 9 to send the defective resistor positioning platform 7 into the laser mechanism 8 for defective product engraving.

[0038] In summary, the problem of insufficient docking accuracy between the probe plate 41 and the surface mount resistor in the prior art is solved by the collaborative mechanism of absorption separation, visual positioning, dual calibration, and automatic identification of defective products. Specifically, firstly, when absorbing resistors, the blower block 111 and the vibrating cylinder 22 are used to effectively prevent the resistors from sticking together and ensure the stable handling of individual resistors. Then, on the room temperature or high temperature resistor positioning platform 6, the first camera 31 is used to photograph the three right-angled triangle points of the resistor to accurately obtain the displacement parameters and rotation angle of the resistor, so as to achieve a unique determination of the spatial attitude of the resistor. Then, the first drive module 43, the second drive module 48 and the rotating platform 45 are used for coarse adjustment, and the second camera 42 and the prism 46 are used for real-time observation. The adjustment knob 47 is used to complete the secondary fine adjustment to ensure the precise docking of the probe plate 41 and the resistor pad. After the test, the third drive module 9 and the laser mechanism 8 are used to automatically identify and trace defective resistors. Through the aforementioned multi-level positioning and calibration methods, the mating accuracy between the probe board 41 and the surface mount resistors is effectively improved, avoiding contact deviations, pad damage, and mating errors caused by temperature changes. This ensures the stability and reliability of resistor batch testing under both room temperature and high temperature environments. Simultaneously, the automated defect identification process further enhances the integrity of the testing process and the level of production quality management, resolving the technical problems of insufficient resistor testing accuracy and poor batch testing reliability in existing technologies.

[0039] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A resistance testing system, characterized in that, The device includes a frame, within which are a loading platform, an x-axis motion module, a room-temperature resistor positioning platform, and a high-temperature resistor positioning platform. The room-temperature resistor positioning platform and the high-temperature resistor positioning platform are arranged adjacent to each other and located between the loading platform and the x-axis motion module. The x-axis motion module is equipped with a y-axis motion module, which is equipped with a probe positioning mechanism, a probe testing mechanism, and a suction mechanism. The suction mechanism is used to move the resistor from the loading platform to the room-temperature resistor positioning platform or the high-temperature resistor positioning platform. The probe positioning mechanism is used to acquire the position information of the resistor and control the probe testing mechanism to adjust the docking position with the resistor.

2. The resistance testing system according to claim 1, characterized in that, The top of the loading platform is equipped with a blowing block. The suction mechanism includes a vertically arranged drive cylinder, a vibration cylinder, and a suction cup. The drive cylinder is mounted on the y-axis motion module. The output end of the drive cylinder is connected to a base plate. The suction cup is vertically mounted on the base plate. The vibration cylinder is mounted on the top surface of the base plate.

3. The resistance testing system according to claim 1, characterized in that, The probe positioning mechanism is located between the probe testing mechanism and the aspiration mechanism. The probe positioning mechanism includes a first camera and a light source, with the first camera positioned directly above the light source.

4. The resistance testing system according to claim 2, characterized in that, The y-axis motion module is equipped with a fixed plate; the probe testing mechanism includes a first drive module, a fixed frame, a rotating platform, a second drive module, a test plate, and a probe plate. The first drive module is mounted on the fixed plate and can move vertically. The fixed frame is mounted on the first drive module. The rotating platform is adjustablely mounted on the bottom surface of the fixed frame. The second drive module is located at the bottom end of the rotating platform. The test plate is connected to the second drive module. The second drive module can drive the test plate to move horizontally. The probe plate is adjustablely mounted on the bottom surface of the test plate.

5. The resistance testing system according to claim 4, characterized in that, A second camera and a prism are provided between the test board and the second driving module. The second camera and the prism are both installed at the bottom of the second driving module and are located on the same horizontal line. The middle part of the test board and the probe board are both opened in the vertical direction. The prism is located directly above the middle part of the test board. The second driving module is also connected to an adjustment knob.

6. The resistance testing system according to claim 1, characterized in that, The high-temperature resistance positioning platform is provided with several heating rods, which are evenly distributed in the high-temperature resistance positioning platform.

7. The resistance testing system according to claim 1, characterized in that, The frame is also equipped with a third drive module, which is located on one side of the high-temperature resistor positioning platform. The third drive module is equipped with a defective resistor positioning platform and a laser mechanism. The defective resistor positioning platform is arranged in parallel with the high-temperature resistor positioning platform and the room-temperature resistor positioning platform. The third drive module is used to feed the defective resistor positioning platform into the laser mechanism.

8. The resistance testing system according to claim 7, characterized in that, The laser mechanism has a through hole on one side for the defective resistor positioning platform to enter, and a baffle is provided on one side of the defective resistor positioning platform. The size of the baffle is the same as the size of the through hole.

9. The resistance testing system according to claim 7, characterized in that, The laser mechanism is equipped with a vacuum cleaner and a lifting knob, which is used to control the laser mechanism to engrave resistors.

10. A resistance testing method, applied to the resistance testing system as described in any one of claims 1 to 9, characterized in that, The method includes: The suction mechanism is controlled to suck up the resistors on the loading platform. During suction, the blower block is activated to blow air and the vibrating cylinder is activated to shake. Move the sampled resistor to the room temperature resistor positioning platform, move the probe positioning mechanism to directly above the room temperature resistor positioning platform, and control the camera to take pictures at three points on the resistor that form a right triangle to confirm the displacement parameters and rotation angle of the probe testing mechanism. The probe testing mechanism is moved to the top of the room temperature resistance positioning platform. The first drive module, the second drive module, and the rotating platform are adjusted based on the displacement parameters and rotation angle. The resistance is observed again through the second camera and prism. The adjustment knob is used for secondary fine-tuning. Finally, the probe plate is docked with the resistance to complete the room temperature resistance test. In the high-temperature resistor positioning platform, repeat the above operations to complete the high-temperature resistance test. After the resistance test is completed, if the resistance test fails, the control suction mechanism places the resistor on the defective resistor positioning platform, and the control third drive module sends the defective resistor positioning platform into the laser mechanism for defective product engraving.

Images