Heat dissipation device and system and electronic equipment

Abstract

The invention provides a heat dissipation device and system and electronic equipment, and relates to the technical field of heat dissipation, the heat dissipation device comprises a shell, the shell is provided with a containing cavity, and the containing cavity conducts heat dissipation on a heating device through cooling liquid; the heat dissipation assembly is arranged in the containing cavity and connected with the shell to form a heat dissipation flow channel; when the heat dissipation assembly is not at the target temperature, the heat dissipation flow channel is in a first state; when the heat dissipation assembly is at the target temperature, the heat dissipation assembly deforms so that the heat dissipation flow channel can be switched from the first state to the second state, and local turbulent flow can be generated on the cooling liquid.

Description

Technical Field

[0001] At least one embodiment of this disclosure relates to the field of heat dissipation technology, and more particularly to a heat dissipation device, system, and electronic device. Background Technology

[0002] With the continuous development of high-performance computing and data centers, the power consumption of central processing units (CPUs) is increasing day by day, and traditional air cooling methods often fall short when dealing with high-power, low-heat CPUs.

[0003] Traditional liquid cooling systems often require higher water flow and pressure to ensure sufficient cooling capacity when the CPU generates a lot of heat. However, this undoubtedly increases the energy consumption of the circulating pump and also leads to higher system costs and maintenance complexity. Summary of the Invention

[0004] In view of this, the present disclosure provides a heat dissipation device, system and electronic device that can match the heat dissipation requirements of the heat-generating device and improve the heat dissipation capacity of the heat dissipation device.

[0005] As one aspect of this disclosure, a heat dissipation device is provided, comprising: a housing having a receiving cavity, the receiving cavity dissipating heat to a heat-generating device through a coolant; a heat dissipation assembly disposed within the receiving cavity and connected to the housing to form a heat dissipation channel; when the heat dissipation assembly is not at a target temperature, the heat dissipation channel is in a first state; when the heat dissipation assembly is at the target temperature, the heat dissipation assembly deforms to switch the heat dissipation channel from the first state to a second state, thereby generating local turbulence in the coolant.

[0006] According to an embodiment of this disclosure, the heat dissipation assembly includes: a plurality of heat dissipation fins, the plurality of heat dissipation fins being spaced apart on the bottom plate of the housing and forming an angle with the bottom plate; the heat dissipation fins are made of shape memory alloy material; wherein, the target temperature is the temperature at which the shape memory alloy material deforms; in response to the temperature of the heat dissipation fins being lower than the target temperature, the heat dissipation fins extend along an extension direction parallel to the bottom plate, and the heat dissipation channel is in the first state; in response to the temperature of the heat dissipation fins exceeding the target temperature, the heat dissipation fins bend relative to the extension direction, and the heat dissipation channel is in the second state.

[0007] According to an embodiment of the present disclosure, the heat dissipation fin includes: a fixed portion disposed on the base plate; and a first free portion formed on one side of the fixed portion and separated from the base plate. In response to the temperature of the heat dissipation fin being lower than the target temperature, the first free portion extends from the fixed portion along the extension direction. In response to the temperature of the heat dissipation fin exceeding the target temperature, the first free portion bends relative to the fixed portion to generate local turbulence on the coolant.

[0008] According to an embodiment of the present disclosure, the heat dissipation fins further include: a second free portion formed on the side of the fixed portion opposite to the first free portion, wherein the second free portion bends relative to the fixed portion to generate local turbulence on the coolant.

[0009] According to embodiments of the present disclosure, the spacing between two adjacent heat dissipation fins in the thickness direction of the heat dissipation fins is configured to be 2mm-5mm; and / or, the thickness of each of the heat dissipation fins is configured to be 1mm-3mm.

[0010] According to an embodiment of the present disclosure, the housing further includes: a cover plate disposed opposite to the bottom plate; an annular portion disposed between the cover plate and the bottom plate to define the receiving cavity with the bottom plate and the cover plate; and a support member extending from the bottom plate toward the cover plate, the support member being configured to be flush with or protrude from the heat dissipation fins.

[0011] As another aspect of the present disclosure, a heat dissipation system is provided, comprising: a first heat dissipation device for dissipating heat from a first heat-generating device; a second heat dissipation device connected in series with the first heat dissipation device and using a coolant to dissipate heat from a second heat-generating device, the second heat dissipation device being disposed downstream of the first heat dissipation device along the flow direction of the coolant; the second heat dissipation device comprising: a housing having a receiving cavity; a heat dissipation assembly disposed within the receiving cavity and connected to the housing to form a heat dissipation channel; when the heat dissipation assembly is not at a target temperature, the heat dissipation channel is in a first state; when the heat dissipation assembly is at the target temperature, the heat dissipation assembly deforms to switch the heat dissipation channel from the first state to a second state, thereby generating local turbulence in the coolant.

[0012] According to the embodiments of this disclosure, the inlet temperature of the second heat dissipation device is greater than the inlet temperature of the first heat dissipation device, and the heat dissipation efficiency of the second heat dissipation device is higher than that of the first heat dissipation device.

[0013] According to an embodiment of this disclosure, the heat dissipation system further includes: an adjustment component connected to the first heat dissipation device and / or the second heat dissipation device, capable of adjusting the water pressure and flow rate of the first heat dissipation device based on the temperature of the first heat dissipation device; capable of adjusting the water pressure and flow rate of the second heat dissipation device based on the temperature of the second heat dissipation device; and the structure of the second heat dissipation device is configured to be the same as that of the first heat dissipation device.

[0014] As another aspect of the present disclosure, an electronic device is provided, comprising: a main body having a heating device; a heat dissipation device connected to the heating device to dissipate heat from the heating device, the heat dissipation device comprising: a housing having a receiving cavity having a coolant disposed therein; a heat dissipation assembly disposed within the receiving cavity and connected to the housing to form a heat dissipation channel; wherein when the heat dissipation assembly is not at a target temperature, the heat dissipation channel is in a first state; and when the heat dissipation assembly is at the target temperature, the heat dissipation assembly deforms to switch the heat dissipation channel from the first state to a second state, thereby generating local turbulence in the coolant.

[0015] According to the heat dissipation device of this disclosure, when the heat generated by the heating device is low, i.e., the temperature of the heat dissipation component has not reached the target temperature, the heat dissipation channel remains in a first state, and the coolant flows through at a relatively stable rate. When the heat generated by the heating device is high, causing the temperature of the heat dissipation component to rise and reach the target temperature, the heat dissipation component deforms, causing the heat dissipation channel to switch from the first state to a second state. The heat dissipation component generates local turbulence on the coolant, disrupting any boundary layer that may form within the channel, extending the flow path of the coolant, increasing the relative velocity and contact area between the coolant and the heat dissipation component, enhancing the convective heat transfer coefficient, and improving the heat dissipation capacity of the heat dissipation device. The heat dissipation component adaptively deforms according to the heat dissipation requirements (heat generation) of the heating device, changing the structure of the heat dissipation channel to match the heat dissipation requirements of the heating device in different states, thereby improving the heat dissipation capacity of the heat dissipation device. Attached Figure Description

[0016] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0017] Figure 1 A perspective view of a heat dissipation device according to an embodiment of the present disclosure is shown schematically;

[0018] Figure 2 A partial top view of a heat dissipation device according to an embodiment of the present disclosure is schematically shown, wherein the heat dissipation channel is in a first state;

[0019] Figure 3A partial top view of a heat dissipation device according to an embodiment of the present disclosure is schematically shown, wherein the heat dissipation channel is in a second state;

[0020] Figure 4 Schematic illustration Figure 1 A partial enlarged view of part A of the heat dissipation assembly shown;

[0021] Figure 5 A perspective view of a heat dissipation device according to another embodiment of the present disclosure is shown schematically;

[0022] Figure 6 Schematic illustration Figure 5 A partial enlarged view of part B of the heat dissipation device shown;

[0023] Figure 7 A partial cross-sectional view of a heat dissipation device according to an embodiment of the present disclosure is schematically shown.

[0024] Figure 8 A block diagram of a heat dissipation system according to an embodiment of the present disclosure is shown schematically;

[0025] Figure 9 A block diagram of a heat dissipation system according to another embodiment of the present disclosure is shown schematically;

[0026] Figure 10 A block diagram of a heat dissipation system according to yet another embodiment of the present disclosure is schematically shown; and

[0027] Figure 11 A partial perspective view of an electronic device according to an embodiment of the present disclosure is shown schematically.

[0028] The annotations in the attached figures are explained as follows:

[0029] 1. Heat dissipation device;

[0030] 11. Shell; 111. Base plate; 112. Annular part; 113. Support member; 114. Liquid inlet; 115. Liquid outlet; 116. Through hole; 12. Heat dissipation assembly; 121. Heat dissipation fins; 1211. Fixing part; 1212. First free part; 1213. Second free part;

[0031] 2. Heat dissipation system;

[0032] 21. First heat dissipation device; 22. Second heat dissipation device;

[0033] 23. Regulating components; 231. Circulating pump; 232. Valves;

[0034] 3. Electronic equipment; 31. Main body. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0036] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0037] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0038] When using expressions such as "at least one of A, B, and C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C. Similarly, when using expressions such as "at least one of A, B, or C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C.

[0039] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure.

[0040] Figure 1 A perspective view of a heat dissipation device according to an embodiment of the present disclosure is shown schematically.

[0041] Reference Figure 1 As shown, the heat dissipation device 1 provided in this disclosure has a length direction (X direction), a width direction (Y direction), and a thickness direction (Z direction). Correspondingly, the X direction can also be understood as the length direction of the housing 11, the Y direction can also be understood as the width direction of the housing 11, and the Z direction can also be understood as the thickness direction of the housing 11. Unless otherwise stated, the length direction, width direction, and thickness direction can be referred to... Figure 1As shown.

[0042] Figure 2 A partial top view of a heat dissipation device according to an embodiment of the present disclosure is shown schematically, wherein the heat dissipation channel is in a first state. Figure 3 A partial top view of a heat dissipation device according to an embodiment of the present disclosure is schematically shown, wherein the heat dissipation channel is in a second state. Figure 2 and Figure 3 The arrows in the diagram indicate the direction of coolant flow.

[0043] As one aspect of this disclosure, a heat dissipation device 1 is provided. For example... Figures 1 to 3 As shown, the heat dissipation device 1 includes a housing 11 and a heat dissipation assembly 12. The housing 11 has a receiving cavity, through which a coolant dissipates heat to a heat-generating device (not shown). The heat dissipation assembly 12 is arranged within the receiving cavity and connected to the housing 11 to form a heat dissipation channel. When the heat dissipation assembly 12 is not at the target temperature, the heat dissipation channel is in a first state (…). Figure 2 (As shown in the diagram); when the heat dissipation component 12 is at the target temperature, the heat dissipation component 12 deforms to switch the heat dissipation channel from the first state to the second state (as shown in the diagram). Figure 3 The state shown is used to create localized turbulence in the coolant.

[0044] According to the heat dissipation device 1 of this disclosure, when the heat generated by the heating device is low, i.e., the temperature of the heat dissipation component 12 has not reached the target temperature, the heat dissipation channel remains in a first state, and the coolant flows through at a relatively stable rate. When the heat generated by the heating device is high, causing the temperature of the heat dissipation component 12 to rise and reach the target temperature, the heat dissipation component 12 deforms, causing the heat dissipation channel to switch from the first state to the second state. The heat dissipation component 12 generates local turbulence on the coolant, disrupting any boundary layer that may form within the channel, extending the flow path of the coolant, increasing the relative velocity and contact area between the coolant and the heat dissipation component 12, enhancing the convective heat transfer coefficient, and improving the heat dissipation capacity of the heat dissipation device 1. The heat dissipation component 12 adaptively deforms according to the heat dissipation requirements (heat generation) of the heating device, changing the structure of the heat dissipation channel to match the heat dissipation requirements of the heating device in different states, thereby improving the heat dissipation capacity of the heat dissipation device 1.

[0045] According to embodiments of this disclosure, the heat-generating device may be a component with high power consumption and large heat generation, requiring special heat dissipation measures to maintain normal operation, such as at least one of a central processing unit (CPU), a graphics processing unit (GPU), a memory module (RAM), and other heat-generating devices.

[0046] In some illustrative embodiments, the heating surface of the heating device can be directly and tightly fitted with the contact surface of the heat dissipation device 1. For example, pressure can be applied by screws, clips, or other fasteners to make the heating device fit with the heat dissipation device 1.

[0047] Furthermore, thermal grease, thermal pads, etc. can be provided between the contact surfaces of the heating device and the heat dissipation device 1 to increase the actual contact area between the heating device and the heat dissipation device 1 and reduce thermal resistance.

[0048] According to embodiments of this disclosure, the heat dissipation component 12 can deform in response to the heat generated by the heat-generating device, thereby switching the heat dissipation channel between a first state and a second state.

[0049] The target temperature is preset, for example, it can be determined based on the normal operating temperature of the heating element. For example, if the normal operating temperature of the heating element is 75°C, the target temperature can be set to 70°C, 65°C, 60°C, or any other arbitrary value.

[0050] The housing 11 forms an inlet 114 and an outlet 115. A heat dissipation assembly 12 is disposed within the cavity formed by the housing 11, located between the inlet 114 and the outlet 115. The heat dissipation assembly 12 forms numerous narrow heat dissipation channels within the cavity. Coolant flows in through the inlet 114, passes through the heat dissipation channels, and flows out through the outlet 115. During the flow of coolant, it exchanges heat with the heat dissipation assembly 12 and the housing 11, carrying away the heat generated by the heat-generating device.

[0051] Turbulence refers to the chaotic and irregular phenomena that occur during fluid flow. In heat dissipation devices, turbulence helps to break the boundary layer and promote convective heat transfer.

[0052] In the first state, when the heat dissipation component 12 has not reached the target temperature, the heat dissipation channel is in the first state. At this time, the heat dissipation channel may be a roughly straight channel. The coolant flows in the straight heat dissipation channel and carries away the heat generated by the heat-generating device.

[0053] As the temperature of the heating device gradually increases, when the heat dissipation component 12 exceeds the target temperature, the heat dissipation component 12 deforms, changing from a straight flow channel to a curved flow channel, entering a second state. At this time, the flow of coolant in the curved heat dissipation flow channel is disturbed, forming local turbulence. Local turbulence can increase the contact area and time between the coolant and the heat dissipation surfaces (casing 11 and heat dissipation component 12), thereby improving heat dissipation efficiency.

[0054] In some illustrative embodiments, the coolant may include any of the following: water (e.g., purified water or deionized water), aqueous propylene glycol solution, and other cooling media.

[0055] The pressure of the coolant flowing into the inlet 114 can be configured to be approximately 1 atmosphere, or about 90 kPa - 110 kPa. Under normal operating conditions, the cooling device 1 fills the containment cavity with coolant.

[0056] like Figure 1 As shown, the housing 11 may also include a cover plate (not shown) and an annular portion 112. The cover plate is disposed opposite to the bottom plate 111, and the annular portion 112 is disposed between the cover plate and the bottom plate 111 to define a receiving cavity with the bottom plate 111 and the cover plate.

[0057] In some illustrative embodiments, the annular portion 112 may be integrally formed with the base plate 111 or the cover plate, or it may be installed between the cover plate and the base plate 111 by welding, bonding, screwing, snapping and other installation methods.

[0058] In some illustrative embodiments, such as Figure 1 As shown, the liquid inlet 114 and the liquid outlet 115 can be formed at opposite ends of the annular portion 112, and the heat dissipation assembly 12 is disposed between the liquid inlet 114 and the liquid outlet 115. For example, the liquid inlet 114 and the liquid outlet 115 can be formed at both ends in the length direction of the housing 11. Alternatively, the liquid inlet 114 and the liquid outlet 115 can be formed at both ends in the width direction of the housing 11.

[0059] In some other illustrative embodiments, the inlet 114 and the outlet 115 may be formed on the cover plate and located at opposite ends of the receiving cavity. It is understood that the embodiments of this disclosure are not limited thereto; the arrangement of the inlet 114 and the outlet 115 is sufficient to allow the coolant to flow into the receiving cavity from the inlet 114 and out from the outlet 115 after passing through the heat dissipation assembly 12.

[0060] According to embodiments of this disclosure, the cross-sectional area of ​​the inlet 114 is configured to be larger than that of the outlet 115. The larger inlet 114 allows the coolant to flow into the receiving cavity more smoothly and evenly, reducing the impact and turbulence when the coolant flows into the receiving cavity, and reducing local resistance loss of the coolant at the inlet 114, allowing the coolant to enter the heat dissipation assembly 12 more smoothly. The smaller outlet 115 can increase the flow rate of the coolant exiting the outlet 115, thereby allowing the cooled coolant to carry away heat more quickly after heat exchange, improving the heat dissipation efficiency of the heat dissipation device 1.

[0061] In some illustrative embodiments, such as Figure 1 As shown, the annular component can also form multiple through holes 116 to connect to the cover plate or the heating device through the multiple through holes 116.

[0062] like Figure 2 and Figure 3As shown, the housing 11 may also include a support 113 extending from the base plate 111 toward the cover plate, the support 113 being configured to be flush with or protrude from the heat dissipation assembly 12.

[0063] Furthermore, the support member 113 is configured to be flush with or protrude from the heat sink 121 (which will be described in detail later).

[0064] The support member 113 is configured to be approximately flush with the heat dissipation fins 121. That is, there is no height difference between the support member 113 and the heat dissipation fins 121 along the thickness direction of the heat dissipation device 1. When the coolant flows in the heat dissipation channel, it will not generate flow separation or low-speed vortex areas (dead zones) in the channel. It can flow evenly over the entire heat dissipation surface of the heat dissipation component 12, ensuring that the effective heat dissipation area of ​​the heat dissipation component 12 is fully utilized, avoiding local overheating, and making the overall heat dissipation more uniform and efficient.

[0065] The support member 113 is configured to protrude from the heat dissipation fins 121. That is, along the thickness direction of the heat dissipation device 1, the support member 113 is higher than the heat dissipation fins 121. The protruding support member 113 provides sufficient movement space for the deformation of the heat dissipation fins 121, ensuring that the heat dissipation assembly 12 can complete its preset deformation without obstruction, thereby reliably realizing the switching from the first state to the second state and ensuring the normal triggering of the turbulence function. Furthermore, when subjected to external impact, the support member 113 can play a buffering and protective role, directly bearing the impact force and protecting the heat dissipation assembly 12 from damage.

[0066] According to embodiments of this disclosure, the support member 113 can be configured as a column or rod structure. The support member 113 can be integrally formed with the base plate 111 or the cover plate, or it can be abutted between the base plate 111 and the cover plate by welding, bonding or other installation methods.

[0067] In such an embodiment, the support member 113 extends from the base plate 111 to the cover plate, providing support between the base plate 111 and the cover plate. This can effectively resist the deformation of the housing 11 under external impact, improve the mechanical strength and rigidity of the heat dissipation device 1, and prevent the housing 11 from denting, cracking, or other problems during long-term operation or transportation.

[0068] In some illustrative embodiments, the housing 11 can be made of a material with good thermal conductivity, such as any material among copper, copper alloys, aluminum alloys, etc.

[0069] Figure 4 Schematic illustration Figure 1 A partial enlarged view of part A of the heat dissipation component shown.

[0070] According to embodiments of this disclosure, such as Figures 1 to 4As shown, the heat dissipation assembly 12 includes a plurality of heat dissipation fins 121. The plurality of heat dissipation fins 121 are spaced apart on the bottom plate 111 of the housing 11 and form an angle α with the bottom plate 111.

[0071] According to embodiments of this disclosure, the angle α formed by the heat dissipation fins 121 and the base plate 111 is configured to be greater than or equal to 45° and less than or equal to 135°, i.e., 45°≤α≤135°.

[0072] For example, the angle α formed by the heat dissipation fins 121 and the base plate 111 is configured to be any value among 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, 90°, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130° and 135° and other angle values.

[0073] According to embodiments of this disclosure, the heat dissipation fins 121 are made of shape memory alloy material. The target temperature is the temperature at which the shape memory alloy material undergoes deformation. In response to the temperature of the heat dissipation fins 121 being lower than the target temperature, the heat dissipation fins 121 extend along an extension direction parallel to the base plate 111, and the heat dissipation channel is in a first state; in response to the temperature of the heat dissipation fins 121 exceeding the target temperature, the heat dissipation fins 121 bend relative to the extension direction, and the heat dissipation channel is in a second state.

[0074] Shape memory alloys (SMA) are smart materials with unique shape memory effects and superelasticity (pseudoelasticity).

[0075] When the heat sink 121 is shaped into a specific shape (called the "austenitic phase" shape, i.e., a shape that bends relative to the extension direction) at a high temperature (above the deformation temperature of the shape memory alloy), and then cooled to a low temperature (below the deformation temperature of the shape memory alloy), the heat sink 121 will transform into another crystal structure (called the "martensite phase", i.e. a shape that extends along the extension direction).

[0076] In some illustrative embodiments, the heat sink 121 can be made of copper-based shape memory alloy or nickel-titanium shape memory alloy.

[0077] In some illustrative embodiments, the shape of the heat dissipation fin 121 at low temperatures (i.e., the temperature of the heat dissipation fin 121 is lower than the target temperature) and at high temperatures (i.e., the temperature of the heat dissipation fin 121 is higher than the target temperature) can be set according to the actual situation, so that the heat dissipation fin 121 deforms according to the set shape.

[0078] For example, at low temperatures, the heat dissipation fins 121 extend in a direction parallel to the base plate 111. At this time, the shape of the heat dissipation fins 121 can be plate-shaped or sheet-shaped, and the extension direction is approximately straight.

[0079] At high temperatures, the heat dissipation fins 121 bend relative to their extension direction. For example, along a section parallel to the base plate 111, the cross-sectional shape of the heat dissipation fins 121 can be approximately curved or polygonal, such as an S-shape.

[0080] In such an embodiment, in response to the temperature of the heat dissipation fin 121 exceeding the target temperature, the heat dissipation fin 121 bends relative to the extension direction, changing the geometry of the flow channel of the heat dissipation assembly 12, causing local turbulence and eddies in the coolant, which can disrupt the thermal boundary layer and may increase the local flow velocity, thereby further improving the heat exchange efficiency.

[0081] In some illustrative embodiments, the target temperature can be configured between 45°C and 60°C. For example, the target temperature can be configured as any value among 45°C, 50°C, 55°C, or 60°C and other temperature values. It is understood that the embodiments of this disclosure are not limited thereto.

[0082] In some illustrative embodiments, heat dissipation fins 121 with different deformation temperatures can be provided in different areas of the cavity according to the different heat generated at different locations of the heating device, so that the heat dissipation fins 121 corresponding to different locations of the heating device can deform based on different temperatures, thereby improving heat exchange efficiency.

[0083] For example, for areas with high heat generation (e.g., the core of the CPU or GPU), heat dissipation fins 121 with lower deformation temperature can be set in the housing cavity, so that the heat dissipation component 12 can trigger turbulence at a lower temperature and prioritize heat dissipation. For areas with low heat generation (e.g., edge areas), heat dissipation fins 121 with higher deformation temperature can be set, so that these heat dissipation fins 121 can maintain normal heat dissipation and avoid unnecessary fluid resistance.

[0084] When the local temperature of a heat-generating device (such as the CPU core) rises, the heat dissipation fins 121 in the corresponding area of ​​the heat dissipation assembly 12 will deform due to reaching the deformation temperature, reducing the cross-sectional area of ​​the local heat dissipation channel and forcing the coolant flow rate to increase. At the same time, the curved structure of the heat dissipation fins 121 will generate local turbulence and eddies in the heat dissipation channel of the microchannel, enhancing the convective heat transfer coefficient, so that the coolant can more efficiently remove the heat in this area, thereby reducing the overall temperature of the heat-generating device and eliminating local hot spots, achieving uniform heat distribution and efficient heat dissipation.

[0085] It should be understood that the embodiments disclosed herein are not limited thereto. For example, in the heat dissipation assembly 12, the deformation temperatures of multiple heat dissipation fins 121 can also be configured to be the same. This simplifies the design process of the heat dissipation assembly 12, reduces design parameters and variables, allows for mass production using the same materials and processes, reduces manufacturing costs, reduces identification and sorting work during assembly, and improves production efficiency.

[0086] In some illustrative embodiments, the coolant flows into the receiving cavity in a direction parallel to the length direction of the housing 11, and the extension direction of the plurality of heat dissipation fins 121 forms an angle with the length direction of the housing 11 in the range of 0° to 90°, for example, it can be any value among 0°, 20°, 30°, 45°, 60° and 90° and other angles.

[0087] In some illustrative embodiments, the extension direction of the heat dissipation fins 121 may be perpendicular to the direction in which the coolant flows into the receiving cavity.

[0088] For example, such as Figure 1 As shown, the direction in which the coolant flows into the receiving cavity is parallel to the length direction of the housing 11, and the extension direction of the multiple heat dissipation fins 121 is parallel to the width direction of the housing 11.

[0089] In some other illustrative embodiments, the extension direction of the heat dissipation fins 121 may be parallel to the direction in which the coolant flows into the receiving cavity.

[0090] For example, such as Figure 4 As shown, the coolant flows into the receiving cavity in a direction parallel to the length direction of the housing 11, and the extension direction of the plurality of heat dissipation fins 121 is parallel to the length direction of the housing 11. It should be understood that the embodiments of this disclosure are not limited thereto; for example, the extension direction of the plurality of heat dissipation fins 121 forms a 45° angle with the length direction of the housing 11.

[0091] In such an embodiment, when the heat-generating device (such as a CPU, GPU, etc.) causes the heat dissipation component 12 to reach a preset target temperature, the heat dissipation component 12 deforms, changing the structure of the heat dissipation channel (e.g., the heat dissipation fins 121 bend), thereby generating local turbulence within the heat dissipation channel. This local turbulence can disrupt the boundary layer of the coolant, increasing the convective heat transfer coefficient between the fluid and the surface of the heat dissipation component 12, and improving the heat dissipation efficiency in that area. The deformation of the heat dissipation component 12 only occurs when needed (when the temperature reaches the target temperature), avoiding unnecessary flow resistance to the coolant at low temperatures. Compared to traditional heat sinks with fixed heat dissipation capacity, the adaptive heat dissipation device 1 provided in this disclosure can more accurately control the temperature of the heat-generating device within the target range, reducing the risk of overheating.

[0092] Figure 5 A perspective view of a heat dissipation device according to another embodiment of the present disclosure is schematically shown. Figure 6 Schematic illustration Figure 5 A partial enlarged view of part B of the heat dissipation device shown.

[0093] like Figures 1 to 6 As shown, multiple heat dissipation fins 121 are arranged in an array on the base plate 111.

[0094] Furthermore, multiple heat dissipation fins 121 are arranged in an array along the extension direction and at an angle β with the extension direction on the base plate 111.

[0095] According to embodiments of this disclosure, the angle β between the extension direction and the arrangement direction is configured to be greater than or equal to 45° and less than or equal to 135°, i.e., 45°≤α≤135°.

[0096] For example, the angle β between the extension direction and the arrangement direction is configured as any value among 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, 90°, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130° and 135° and other angles.

[0097] In some illustrative embodiments, the extending direction of the plurality of heat dissipation fins 121 may be orthogonal to the arrangement direction, for example, as shown in the figure. Figure 1 As shown, the extension direction can be parallel to the width direction of the housing 11, and the arrangement direction can be parallel to the length direction of the housing 11.

[0098] In this embodiment, the liquid inlet 114 and the liquid outlet 115 are respectively located at both ends of the length direction of the housing 11, forming a transverse flow heat dissipation path.

[0099] When the coolant enters the housing cavity from the inlet 114, it is diverted by multiple heat dissipation fins 112 extending in a direction parallel to the width of the housing 11 into multiple parallel, narrow heat dissipation channels. The heat dissipation channels extend in parallel along the width of the housing 11 and finally converge at the outlet 115.

[0100] The extension direction (heat conduction direction) of the heat dissipation fins 121 is perpendicular to the flow direction (length direction) of the coolant from the inlet 114 to the outlet 115. This allows the coolant to flow at an angle across the surface of the heat dissipation fins 112, which better disrupts the fluid boundary layer than parallel flow (parallel to the heat dissipation fins 112), thus enhancing convective heat transfer and resulting in greater heat transfer per unit area. The coolant is evenly distributed into all the narrow flow channels, and because the channels are parallel, the flow velocity and temperature distribution within each channel are relatively uniform. Because the heat conduction path is short and consistent, the temperature distribution across the entire array of heat dissipation fins 121 is very uniform. This avoids hot spots caused by localized channel blockage or design flaws, ensuring comprehensive and balanced cooling of the heat-generating device.

[0101] In other illustrative embodiments, such as Figure 5 and Figure 6 As shown, the extension direction of the multiple heat dissipation fins 121 can be parallel to the length direction of the housing 11, and the arrangement direction can be parallel to the width direction of the housing 11.

[0102] In this embodiment, the inlet 114 and outlet 115 are respectively located at both ends of the length of the housing 11, forming a longitudinal (or axial) heat dissipation path. After entering through the inlet 114, the coolant flows through the heat dissipation fins 112 in a relatively straight heat dissipation channel, absorbing heat through convection heat transfer and overcoming frictional resistance with the surface of the heat dissipation fins 112, finally flowing out through the outlet 115. Since the extension direction of the heat dissipation fins 121 is parallel to the flow direction (length direction) of the coolant from the inlet 114 to the outlet 115, the heat dissipation channel is parallel to the length direction of the heat dissipation assembly 12, i.e., parallel to the flow direction of the coolant. This eliminates the need for frequent changes in coolant direction, reducing frictional and local resistance, and lowering pumping power consumption and operating noise.

[0103] In some illustrative embodiments, multiple heat dissipation fins 121 may be configured to have the same size along the extension direction.

[0104] Figure 7 A partial cross-sectional view of a heat dissipation device according to an embodiment of the present disclosure is shown schematically.

[0105] According to an embodiment of this disclosure, the heat dissipation fin 121 includes a fixing portion 1211 and a first free portion 1212. The fixing portion 1211 is disposed on the base plate 111, and the first free portion 1212 is formed on one side of the fixing portion 1211 and is separate from the base plate 111 (having, for example,...). Figure 7As shown in the gap H), in response to the temperature of the heat dissipation fin 121 being lower than the target temperature, the first free portion 1212 extends from the fixed portion 1211 along the extension direction; in response to the temperature of the heat dissipation fin 121 exceeding the target temperature, the first free portion 1212 bends relative to the fixed portion 1211 to generate local turbulence for the coolant.

[0106] According to an embodiment of this disclosure, the fixing part 1211 can be installed on the base plate 111 by welding.

[0107] According to embodiments of this disclosure, the size of the gap H can be configured to be 0.01 mm to 0.05 mm. For example, the size of the gap H can be any value among 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, and 0.05 mm, and other sizes. It should be understood that the embodiments of this disclosure are not limited thereto; for example, the size of the gap H can also be configured to be 0.06 mm or 0.07 mm.

[0108] According to embodiments of the present disclosure, the heat dissipation fins 121 can be configured as sheet-like or plate-like structures.

[0109] One end of the heat dissipation fin 121 along the extension direction is a fixing part 1211, which is connected to the base plate 111. The other part of the heat dissipation fin 121 connected to the fixing part 1211 is a first extension part 1212. There is a gap H between the first extension part 1212 and the base plate 111, which can deform or bend in response to temperature changes.

[0110] In some illustrative embodiments, when the temperature of the heat dissipation fin 121 is lower than the target temperature, the extension direction of the heat dissipation fin 121 may be parallel to the length direction of the housing 11, and the heat dissipation channel formed by two adjacent heat dissipation fins 121 may be parallel to the length direction of the housing 11.

[0111] Alternatively, the extension direction of the heat dissipation fins 121 can be parallel to the width direction of the housing 11, and the heat dissipation channel formed by two adjacent heat dissipation fins 121 can be parallel to the width direction of the housing 11.

[0112] Alternatively, the extension direction of the heat dissipation fins 121 can form an angle with the length direction of the housing 11, and the heat dissipation channel formed by two adjacent heat dissipation fins 121 can be inclined to the length direction of the housing 11.

[0113] When the temperature of the heat dissipation fin 121 exceeds the target temperature, the first free portion 1212 bends relative to the fixed portion 1211. The cross-sectional shape of the heat dissipation fin 121 along the length and width directions can be a polygonal or curved shape. For example, after the first free portion 1212 bends, the cross-sectional shape of the heat dissipation fin 121 can be approximately V-shaped, S-shaped, or arc-shaped.

[0114] According to an embodiment of the present disclosure, the heat dissipation fin 121 further includes a second free portion 1213. The second free portion 1213 is formed on the side of the fixed portion 1211 opposite to the first free portion 1212, and the second free portion 1213 is bent relative to the fixed portion 1211 to generate local turbulence for the coolant.

[0115] In some illustrative embodiments, the deformation direction of the first free portion 1212 may be opposite to the deformation direction of the first free portion 1212. For example, as Figure 3 From the perspective shown, the first free part 1212 bends downward to produce deformation, and the second free part 1213 bends upward to produce deformation.

[0116] Alternatively, the deformation direction of the first free portion 1212 can be the same as the deformation direction of the second free portion 1213. That is, the first free portion 1212 and the second free portion 1213 deform toward the same side relative to the extension direction. Furthermore, the deformation directions of the first free portion 1212 and the second free portion 1213 of two adjacent heat dissipation fins 121 along the extension direction can be opposite.

[0117] In this embodiment, when the temperature of the heat dissipation fins 121 exceeds the target temperature, the first free portion 1212 and / or the second free portion 1213 bends relative to the extension direction of the heat dissipation fins 121 at low temperatures. The bending of the first free portion 1212 and / or the second free portion 1213 alters the geometry of the flow channel, disrupting or disturbing the thermal boundary layer tightly adhering to the surface of the heat dissipation fins 121. The thermal boundary layer is the region tightly adhering to the surface of the heat dissipation fins 121, with extremely low or zero flow velocity and the largest temperature gradient, and is the main resistance to heat transfer. By bending the first free portion 1212 and / or the second free portion 1213, the coolant is turbulent, which can thin or even intermittently disrupt the thermal boundary layer, allowing more coolant at lower temperatures to contact the surface of the heat dissipation fins 121, thereby improving the heat transfer coefficient.

[0118] According to embodiments of this disclosure, such as Figure 3 As shown, the spacing L between two adjacent heat dissipation fins 121 in the thickness direction can be configured to be 2mm-5mm, i.e., 2mm≤L≤5mm. And / or, the thickness D of each heat dissipation fin 121 can be configured to be 1mm-3mm, i.e., 1mm≤D≤3mm.

[0119] For example, the spacing L between two adjacent heat dissipation fins 121 in the thickness direction of the heat dissipation fins 121 can be configured as any value among 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm and 5 mm and other spacings.

[0120] For example, the thickness D of each heat sink fin 121 can be configured to any value among 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, and other thicknesses.

[0121] In this embodiment, the thickness D of each heat sink fin 121 can be configured to be 1mm-3mm, ensuring that the heat sink fin 121 has a sufficient cross-sectional area to reduce the thermal resistance from the floor to the surface of the heat sink fin 121, so that heat can be effectively conducted to the surface of the heat sink fin 121. At the same time, it can also provide a good balance between deformation capability and structural strength.

[0122] The spacing L between two adjacent heat dissipation fins 121 in the thickness direction can be configured to be 2mm-5mm. This ensures a sufficient number of heat dissipation fins 121 to provide a large heat dissipation area, while maintaining a relatively reasonable flow channel width so that the coolant can flow smoothly. At the same time, it can also form a certain vortex or disturbance between multiple heat dissipation fins 121 to enhance the convective heat transfer effect.

[0123] In the process of developing this disclosure, it was discovered that in a series-connected cold plate heat dissipation system, the coolant first flows through the upstream first cold plate, absorbing the heat generated by the first cold plate and thus increasing its temperature. Subsequently, this now-heated coolant continues to flow to the downstream second cold plate. Therefore, the second cold plate starts operating at a higher inlet temperature baseline than the first cold plate.

[0124] This "preheating effect" directly leads to a relative reduction in the heat dissipation capacity of the downstream second cold plate. Even if the first and second cold plates are designed identically, the second cold plate must handle a higher initial fluid temperature. This makes it more difficult for the second cold plate to effectively dissipate the heat from the second CPU under the same heat dissipation conditions, resulting in the second CPU ultimately operating at a higher temperature than the first CPU. This temperature difference can sometimes even reach 5°C or higher.

[0125] This uneven temperature distribution causes the secondary CPU, which is constantly exposed to higher temperatures, to experience greater thermal stress, accelerating material aging (such as solder joint fatigue and packaging material degradation), thereby reducing the long-term reliability of the secondary CPU and shortening its expected lifespan.

[0126] Figure 8 A block diagram of a heat dissipation system according to an embodiment of the present disclosure is shown schematically.

[0127] As another aspect of the embodiments of this disclosure, a heat dissipation system 2 is provided. For example... Figure 8As shown, the heat dissipation system 2 includes a first heat dissipation device 21 and a second heat dissipation device 22. The first heat dissipation device 21 is used to dissipate heat from a first heat-generating device. The second heat dissipation device 22 is connected in series with the first heat dissipation device 21 and uses coolant to dissipate heat from a second heat-generating device. The second heat dissipation device 22 is located downstream of the first heat dissipation device 21 along the flow direction of the coolant. The second heat dissipation device 22 includes a housing 11 and a heat dissipation assembly 12. The housing 11 has a receiving cavity, and the heat dissipation assembly 12 is arranged in the receiving cavity and connected to the housing 11 to form a heat dissipation channel. When the heat dissipation assembly 12 is not at the target temperature, the heat dissipation channel is in a first state; when the heat dissipation assembly 12 is at the target temperature, the heat dissipation assembly 12 deforms to switch the heat dissipation channel from the first state to a second state, which is used to generate local turbulence in the coolant.

[0128] The second heat dissipation device 22 may have the same or corresponding structure as any of the heat dissipation devices described above. Other features have become obvious in the above embodiments and will not be repeated here.

[0129] According to embodiments of this disclosure, both the first heating device and the second heating device can be components with high power consumption and large heat generation, requiring specialized heat dissipation measures to maintain normal operation. For example, they can be any of the following: a central processing unit (CPU), a graphics processing unit (GPU), or a memory module (RAM). The type of the first heating device can be the same as or different from that of the second heating device.

[0130] According to embodiments of this disclosure, the inlet temperature of the second heat dissipation device 22 is greater than the inlet temperature of the first heat dissipation device 21, and the heat dissipation efficiency of the second heat dissipation device 22 is higher than that of the first heat dissipation device 21.

[0131] The coolant flows through the first heat dissipation device 21, dissipates heat from the first heat-generating device, and then flows into the second heat dissipation device 22. The coolant carries the heat from the first heat-generating device, making the inlet temperature of the second heat dissipation device 22 greater than the inlet temperature of the first heat dissipation device 21.

[0132] In this embodiment, when the heat dissipation component 12 is not at the target temperature, the heat dissipation channel remains in a normal state; when the heat dissipation component 12 reaches the target temperature, the heat dissipation component 12 will deform, change the structure of the heat dissipation channel, and form local turbulence. This dynamic adjustment mechanism makes the heat dissipation efficiency of the second heat dissipation device 22 higher than that of the first heat dissipation device 21. The second heat dissipation device 22 can effectively transfer the heat generated by the second heating device to the coolant, which is already at a higher temperature (relative to the inlet temperature of the first heat dissipation device 21), so that the second heating device will not heat up too quickly or too much due to the high inlet temperature, thereby reducing the temperature difference between the second heating device and the first heating device, eliminating the negative impact of the large temperature difference between the second heating device and the first heating device on the second heat dissipation device 21, and controlling the temperature of the downstream second heating device within a safe range, so that the coolant can carry away the heat generated by the two second heating devices and the first heating device more evenly.

[0133] Figure 9 A block diagram of a heat dissipation system according to another embodiment of the present disclosure is shown schematically. Figure 10 A block diagram of a heat dissipation system according to yet another embodiment of the present disclosure is shown schematically.

[0134] According to embodiments of this disclosure, such as Figures 8 to 10 As shown, the heat dissipation system 2 also includes an adjustment component 23. The adjustment component 23 is connected to the first heat dissipation device 21 and / or the second heat dissipation device 22, and can adjust the water pressure and flow rate of the first heat dissipation device 21 based on the temperature of the first heat dissipation device; and can adjust the water pressure and flow rate of the second heat dissipation device 22 based on the temperature of the second heat dissipation device. The structure of the second heat dissipation device 22 is configured to be the same as that of the first heat dissipation device 21.

[0135] According to embodiments of this disclosure, the structure of the second heat dissipation device 22 being configured to be the same as that of the first heat dissipation device 21 means that the basic structure and form of the second heat dissipation device 22 are consistent with those of the first heat dissipation device 21, and that their functions are similar.

[0136] The consistency of basic structure and form means that the core features such as the type of constituent parts, overall shape, relative positional relationship, and connection method are the same. For example, if the first heat dissipation device 21 includes a housing 11 and a heat dissipation component 12, then the second heat dissipation device 22 with the same structure should also include a housing 11 and a heat dissipation component 12, but the number of heat dissipation fins 121 and the angle with the direction of coolant inflow into the receiving cavity can be different.

[0137] Similar functions mean that the physical principles of the first heat dissipation device 21 and the second heat dissipation device 22 are the same.

[0138] In some alternative embodiments, the structure of the second heat dissipation device 22 may be configured to differ from that of the first heat dissipation device 21.

[0139] For example, the heat dissipation fins 121 of the first heat dissipation device 21 can be made of the same material as the housing 11, instead of using shape memory alloy material, thereby reducing the cost of raw materials.

[0140] In some illustrative embodiments, such as Figures 8 to 10 As shown, the regulating component 23 includes a circulation pump 231 and a valve 232. The circulation pump 231 is adapted to circulate the coolant between the first heat dissipation device 21 and the second heat dissipation device 22. The valve is disposed between the circulation pump 231 and the second heat dissipation device 22, or between the circulation pump 231 and the first heat dissipation device 21. In response to deformation of the heat dissipation component 12 of the second heat dissipation device 22, the pressure difference between the inlet 114 of the second heat dissipation device 22 and the outlet 115 of the first heat dissipation device 21 increases. The valve 232, in response to the increased pressure difference, increases its opening, thereby increasing the flow rate of coolant flowing into the inlet 114 of the second heat dissipation device 22, and consequently increasing the flow rate of coolant flowing into the first heat dissipation device 21.

[0141] When the heat dissipation component 12 of the second heat dissipation device 22 deforms (reaches the target temperature), the heat dissipation flow resistance of the second heat dissipation device 22 increases, resulting in an increase in the pressure difference between the inlet of the second heat dissipation device 22 and the outlet of the first heat dissipation device. In response to the change in the pressure difference between the inlet of the second heat dissipation device 22 and the outlet of the first heat dissipation device, the valve 232 automatically increases its opening degree, increasing the flow rate, water pressure and flow rate of the coolant flowing to the second heat dissipation device.

[0142] The heat dissipation component 12 of the second heat dissipation device 22 deforms at the target temperature, which can enhance the turbulence of the heat dissipation channel of the second heat dissipation device 22, improve the heat exchange efficiency of the high temperature coolant, eliminate the excessive temperature difference between the first heat-generating device and the second heat-generating device, prevent the second heat-generating device (such as the GPU) from overheating due to the high inlet temperature of the coolant, and ensure the overall temperature balance of the heat dissipation system.

[0143] During the operation of the heat dissipation device, the power of the circulating pump 231 can remain constant. When necessary (due to deformation of the heat dissipation component 12 of the second heat dissipation device 22), the valve 232 increases the flow rate of coolant to the second heat dissipation device 22. When the load of the heat dissipation system is low or the heat dissipation demand is not large, the valve 232 will automatically reduce the opening to limit unnecessary flow. At the same time, the circulating pump 231 maintains the basic water circulation pressure with minimal energy consumption, avoiding energy waste caused by continuous high power operation of traditional heat dissipation systems. In addition, the heat dissipation component 12 maintains a low-resistance flow channel state at low temperature (when the heat dissipation component 12 of the second heat dissipation device 22 does not deform), enabling the coolant to dissipate heat efficiently with a small pressure drop and flow rate, further reducing the load of the circulating pump 231, and ultimately achieving on-demand power supply and precise heat dissipation, minimizing energy consumption.

[0144] In some illustrative embodiments, such as Figure 8 As shown, the outlet 115 of the second heat dissipation device 22 is connected to the inlet 114 of the first heat dissipation device 21 via a pipe. The outlet of the circulation pump 231 is connected to the inlet of the valve 232 via a pipe. The inlet of the circulation pump 231 is connected to the outlet 115 of the second heat dissipation device 22 via a pipe, and the storage end of the valve 232 is connected to the inlet 114 of the first heat dissipation device 21 via a pipe, thus realizing the series connection of the second heat dissipation device 22 and the first heat dissipation device 21.

[0145] With valve 232 positioned at the rear end of circulating pump 231 along the coolant flow direction, regardless of valve 232's adjustment, there is always a path for coolant (from the second heat dissipation device 22) to flow directly to the circulating pump, thus preventing the circulating pump 231 from running dry (i.e., no coolant entering). This provides a minimum level of liquid supply to the circulating pump, effectively preventing the risk of dry running and damage to the circulating pump 231 due to accidental complete closure of valve 232 or pipe blockage.

[0146] In other illustrative embodiments, the outlet 115 of the second heat dissipation device 22 is connected to the inlet 114 of the first heat dissipation device 21 via a pipe. The inlet of the circulation pump 231 is connected to the outlet of the valve 232 via a pipe. The outlet of the circulation pump 231 is connected to the inlet 114 of the first heat dissipation device 21 via a pipe, and the inlet of the valve 232 is connected to the outlet of the second heat dissipation device 22 via a pipe, thereby connecting the second heat dissipation device 22 and the first heat dissipation device 21 in series.

[0147] A valve 232 is positioned upstream of the circulating pump 231 along the flow direction of the coolant. The valve 232 directly controls the total amount of coolant entering the circulating pump 231. By adjusting the opening of the valve 231, the suction flow rate of the circulating pump 231 can be linearly controlled, thereby precisely distributing it to the first and second cooling devices 21 and 22 connected in series. This allows the cooling system to flexibly adjust the overall coolant circulation rate according to different operating conditions or load requirements, achieving an optimal balance between heat dissipation performance and energy consumption. This is particularly suitable for intelligent temperature control systems that require dynamic adjustment of heat dissipation capacity.

[0148] In some other illustrative embodiments, such as Figure 9 As shown, the outlet of the second heat dissipation device 22 is connected to the inlet of the circulation pump 231 via a pipe. The outlet of the circulation pump 231 is connected to the inlet of the first heat dissipation device 21 via a pipe. The outlet of the first heat dissipation device 21 is connected to the inlet of the valve 232 via a pipe, and the outlet of the valve 232 is connected to the inlet of the second heat dissipation device 22 via a pipe, thus realizing the series connection of the second heat dissipation device 22 and the first heat dissipation device 21.

[0149] Along the flow direction of the coolant, valve 232 is set at the rear end of the first heat dissipation device 21 and the front end of the second heat dissipation device 22. Valve 232 can respond to the pressure difference change between the inlet 114 of the second heat dissipation device 22 and the outlet 115 of the first heat dissipation device 21, and dynamically adjust the flow rate into the second heat dissipation device 22. This can effectively eliminate local hot spots caused by heat conduction crosstalk in the series system, ensure that the temperature of the two heat dissipation devices is more balanced, improve the overall stability of the heat dissipation system, and avoid providing excessive coolant to the second heat dissipation device when it is not necessary, thereby achieving a balance between heat dissipation efficiency and system energy consumption.

[0150] It is understood that the embodiments disclosed herein are not limited thereto. For example, along the flow direction of the coolant, the circulation pump 231 can be disposed at the rear end of the first heat dissipation device 21 and the front end of the second heat dissipation device 22, and the valve 232 can be disposed at the front end of the first heat dissipation device 21 and the rear end of the second heat dissipation device 22. In this way, the amount of coolant entering the circulation pump 231 can be controlled by adjusting the total back pressure of the heat dissipation system through the valve 232, so that the valve 232 can make a sensitive dynamic response to rapid changes in the total load of the heat dissipation system and realize on-demand power supply.

[0151] In some alternative embodiments, such as Figure 10 As shown, the second heat dissipation device 22 and the first heat dissipation device 21 can also be connected in parallel.

[0152] In this embodiment, the first heat dissipation device 21 and the second heat dissipation device 22 are connected in parallel. The coolant is diverted to their respective independent heat dissipation branches via valve 232 and circulating pump 231, thereby achieving heat dissipation decoupling between the first heat dissipation device 21 and the second heat dissipation device 22. The parallel connection of the first heat dissipation device 21 and the second heat dissipation device 22 avoids the efficiency degradation problem caused by uneven flow distribution and increased inlet temperature of subsequent heat dissipation devices in the series configuration. This ensures that each heat dissipation device can operate at the optimal inlet temperature and independent flow rate, improving the overall heat dissipation efficiency and balance of the cooling system. Simultaneously, the parallel architecture of the first heat dissipation device 21 and the second heat dissipation device 22 has stronger fault tolerance; even if a single heat dissipation branch (e.g., the first heat dissipation device 21) fails, the cooling system can still maintain part of the heat dissipation function (of the second heat dissipation device 22).

[0153] For example, the outlet of the circulating pump 231 is connected to the inlet of the valve 232 through a pipe, the outlet of the valve 232 is connected to the inlet 114 of the first heat dissipation device 21 and the inlet 114 of the second heat dissipation device 22, and the inlet of the circulating pump 231 is connected to the outlet 115 of the first heat dissipation device 21 and the outlet 115 of the second heat dissipation device 22 through a pipe, thereby realizing the parallel connection of the second heat dissipation device 22 and the first heat dissipation device 21.

[0154] Alternatively, the inlet of the circulating pump 231 is connected to the outlet of the valve 232 through a pipe, the inlet of the valve 232 is connected to the outlet 115 of the first heat dissipation device 21 and the outlet 115 of the second heat dissipation device 22, and the outlet of the circulating pump 231 is connected to the inlet 114 of the first heat dissipation device 21 and the inlet 114 of the second heat dissipation device 22 through a pipe, thereby realizing the parallel connection of the second heat dissipation device 22 and the first heat dissipation device 21.

[0155] Other features of this implementation have become apparent in the above embodiments and will not be repeated here.

[0156] In some illustrative embodiments, valve 232 can be a self-operated pressure valve, which automatically adjusts its opening degree through the principle of mechanical force balance and drives the valve core to move using the pressure difference, without the need for external energy.

[0157] In this embodiment, when the heat dissipation component 12 of the second heat dissipation device 22 deforms due to increased temperature, the heat dissipation flow channel changes (e.g., narrows or generates local resistance), resulting in increased resistance to the coolant flowing through the heat dissipation fins 121. This leads to a larger pressure difference between the inlet 114 of the second heat dissipation device 22 and the outlet 115 of the first heat dissipation device 21. In response to the increased pressure difference, valve 232 increases its opening, increasing the flow rate of coolant into the first heat dissipation device 21, thereby increasing the flow rate of coolant through the second heat dissipation device 22. This allows the coolant to absorb heat more effectively and lowers the temperature of the second heat-generating device.

[0158] The heat dissipation system 2 provided in this embodiment can dynamically adjust the coolant flow distribution according to the real-time heat dissipation demand of the downstream second heat dissipation device 22, ensuring that both the first heat dissipation device 21 and the second heat dissipation device 22 can obtain sufficient coolant flow, thereby maximizing the heat exchange efficiency of the entire heat dissipation system 2 while keeping the total flow of the circulating pump 231 constant, reducing the temperature difference between the second heat-generating device and the first heat-generating device, and achieving balanced temperature control.

[0159] Other features of this implementation have become apparent in the above embodiments and will not be repeated here.

[0160] Figure 11 A partial perspective view of an electronic device according to an embodiment of the present disclosure is shown schematically.

[0161] As another aspect of the embodiments of this disclosure, an electronic device 3 is provided, such as... Figure 11 As shown, the electronic device 3 includes a main body 31 and a heat dissipation device 1. The main body 31 is equipped with a heating element, and the heat dissipation device 1 is connected to the heating element to dissipate heat from it. Figure 1 As shown, the heat dissipation device 1 includes a housing 11 and a heat dissipation assembly 12. The housing 11 has a receiving cavity in which coolant is disposed. The heat dissipation assembly 12 is arranged in the receiving cavity and connected to the housing 11 to form a heat dissipation channel. When the heat dissipation assembly 12 is not at the target temperature, the heat dissipation channel is in a first state; when the heat dissipation assembly 12 is at the target temperature, the heat dissipation assembly 12 deforms to switch the heat dissipation channel from the first state to a second state, thereby generating local turbulence for the coolant.

[0162] According to embodiments of this disclosure, the main body 31 may be a core functional module (e.g., a printed circuit board, PCB) or substrate (e.g., an integrated circuit (IC) packaging substrate) in an electronic device 3 that generates heat and needs to be cooled. The main body 31 may have multiple heat-generating devices. The number of heat dissipation devices 1 may also be multiple, and the multiple heat dissipation devices 1 can dissipate heat from the multiple heat-generating devices respectively.

[0163] Electronic device 3 can include any type of computer, server, etc.

[0164] According to embodiments of this disclosure, deformation (especially bending) of the heat dissipation fins 121 exacerbates the separation of the coolant flow, causing the coolant to generate more and stronger eddies. These increased eddies and velocity changes enhance the turbulence (turbulence) of the water flow. The enhanced turbulence and increased local flow velocity (especially in areas requiring heat dissipation) increase the local and overall heat transfer coefficient, disrupt the thermal boundary layer, and more effectively transfer heat from the heat dissipation fins 121 and the surface of the heat-generating device to the coolant, thereby improving the heat transfer efficiency of the heat dissipation device 1 and improving the stability and service life of the electronic device 3.

[0165] Other features of this implementation have become apparent in the above embodiments and will not be repeated here.

[0166] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A heat dissipation device, comprising: The housing has a receiving cavity through which the heating device dissipates heat via a coolant; A heat dissipation assembly is arranged within the receiving cavity and connected to the housing to form a heat dissipation channel; When the heat dissipation component is not at the target temperature, the heat dissipation channel is in the first state; When the heat dissipation component is at the target temperature, the heat dissipation component deforms to switch the heat dissipation channel from the first state to the second state, thereby generating local turbulence in the coolant.

2. The heat dissipation device according to claim 1, wherein, The heat dissipation component includes: Multiple heat dissipation fins are spaced apart on the bottom plate of the housing and form an angle with the bottom plate; The heat dissipation fins are made of shape memory alloy material; wherein, the target temperature is the temperature at which the shape memory alloy material undergoes deformation; In response to the temperature of the heat dissipation fins being lower than the target temperature, the heat dissipation fins extend along an extension direction parallel to the base plate, and the heat dissipation channel is in the first state; in response to the temperature of the heat dissipation fins exceeding the target temperature, the heat dissipation fins bend relative to the extension direction, and the heat dissipation channel is in the second state.

3. The heat dissipation device according to claim 2, wherein, The heat dissipation fins include: A fixing part is provided on the base plate; and A first free portion is formed on one side of the fixed portion and is separated from the base plate. In response to the temperature of the heat dissipation fins being lower than the target temperature, the first free portion extends from the fixed portion along the extension direction. In response to the temperature of the heat dissipation fins exceeding the target temperature, the first free portion bends relative to the fixed portion to create local turbulence on the coolant.

4. The heat dissipation device according to claim 3, wherein, The heat dissipation fins also include: A second free portion is formed on the side of the fixed portion opposite to the first free portion, and the second free portion bends relative to the fixed portion to create local turbulence on the coolant.

5. The heat dissipation device according to any one of claims 2-4, wherein, The spacing between two adjacent heat dissipation fins in the thickness direction of the heat dissipation fins is configured to be 2mm-5mm; and / or, The thickness of each heat dissipation fin is configured to be 1mm-3mm.

6. The heat dissipation device according to any one of claims 2-4, wherein, The housing also includes: A cover plate is disposed opposite to the base plate; An annular portion is disposed between the cover plate and the bottom plate to define the receiving cavity with the bottom plate and the cover plate; A support member extends from the base plate toward the cover plate, and the support member is configured to be flush with or protrude from the heat dissipation fins.

7. A heat dissipation system, comprising: The first heat dissipation device is used to dissipate heat from the first heat-generating device; The second heat dissipation device is connected in series with the first heat dissipation device and uses coolant to dissipate heat from the second heat-generating device. The second heat dissipation device is located downstream of the first heat dissipation device along the flow direction of the coolant. The second heat dissipation device includes: A housing having a receiving cavity; A heat dissipation assembly is arranged within the receiving cavity and connected to the housing to form a heat dissipation channel; When the heat dissipation component is not at the target temperature, the heat dissipation channel is in the first state; When the heat dissipation component is at the target temperature, the heat dissipation component deforms to switch the heat dissipation channel from the first state to the second state, thereby generating local turbulence in the coolant.

8. The heat dissipation system according to claim 7, wherein, The inlet temperature of the second heat dissipation device is higher than that of the first heat dissipation device, and the heat dissipation efficiency of the second heat dissipation device is higher than that of the first heat dissipation device.

9. The heat dissipation system according to claim 7 or 8, wherein, Also includes: An adjustment component, connected to the first heat dissipation device and / or the second heat dissipation device, is capable of adjusting the water pressure and flow rate of the first heat dissipation device based on the temperature of the first heat dissipation device; and is capable of adjusting the water pressure and flow rate of the second heat dissipation device based on the temperature of the second heat dissipation device. The structure of the second heat dissipation device is configured to be the same as that of the first heat dissipation device.

10. An electronic device, comprising: The main body is equipped with a heating device; A heat dissipation device, connected to the heat-generating device, is used to dissipate heat from the heat-generating device. The heat dissipation device includes: A housing having a receiving cavity containing coolant; A heat dissipation assembly is arranged within the receiving cavity and connected to the housing to form a heat dissipation channel; When the heat dissipation component is not at the target temperature, the heat dissipation channel is in the first state; When the heat dissipation component is at the target temperature, the heat dissipation component deforms to switch the heat dissipation channel from the first state to the second state, thereby generating local turbulence in the coolant.

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