Wafer box information automatic management system and method

Abstract

The invention provides a wafer cassette information automatic management system and method, and belongs to the technical field of semiconductor manufacturing, and the system comprises a loading platform which is allowed to move among a plurality of process stations; the wafer box is placed on the loading platform, the wafer box is used for containing wafers, a plurality of identification codes are attached to the surface of a box body of the wafer box, and a radio frequency tag is installed on the wafer box; the radio frequency scanning device is installed on the loading platform, the antenna scanning range of the radio frequency scanning device covers the identification code and the radio frequency tag, the radio frequency scanning device is allowed to read identification information from the identification code, and the radio frequency scanning device is allowed to write the identification information into the radio frequency tag after establishing non-contact communication connection with the radio frequency tag; and the control system is electrically connected to the radio frequency scanning device, preset clamping control conditions are stored in the control system, and when the identification information violates the preset clamping control conditions, the control system adjusts the identification information of the wafer box. According to the invention, the transmission process of the front open type wafer transmission box can be automated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor integration technology, and in particular to an automatic management system and method for wafer cell information. Background Technology

[0002] A front-opening unified pod (FOUP) is a container used in semiconductor manufacturing to protect, transport, and store wafers. It can hold multiple wafers and is an important transport container for automated management systems within 12-inch (300mm) wafer fabs.

[0003] In the semiconductor manufacturing process, different factories read front-opening wafer transfer boxes in different ways, and equipment in different processes also read front-opening wafer transfer boxes in different ways. Therefore, the transfer of front-opening wafer transfer boxes between wafer fabs or different equipment relies on manual handling, which results in low handling efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic management system and method for wafer cassette information, which can automate the transmission process of front-opening wafer transfer boxes and improve the transfer efficiency of wafer cassettes.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention provides an automatic management system for wafer cassette information, comprising: A loading platform is provided with multiple workstations, each of which is connected to a different process station. The loading platform is allowed to perform parallel operations on the wafer cells of the multiple process stations. A workstation refers to the connection position between the loading platform and the process station.

[0006] A wafer box is placed on the loading platform. The wafer box is used to hold wafers. The surface of the wafer box is covered with multiple identification codes, and radio frequency tags are installed on the wafer box. An RFID scanning device is mounted on the loading platform, and the antenna scanning range of the RFID scanning device covers the identification code and the RFID tag. The RFID scanning device is allowed to read identification information from the identification code and, after establishing a contactless communication connection with the RFID tag, write the identification information to the RFID tag. A control system is electrically connected to the radio frequency scanning device. The control system stores preset card control conditions. When the identification information violates the preset card control conditions, the control system adjusts the identification information of the wafer cell.

[0007] In one embodiment of the present invention, the wafer cassette information automatic management system includes an installation platform, which is fixed on the loading platform. A plurality of positioning pins are fixed on the installation platform. The bottom of the wafer cassette is provided with a plurality of pin holes, and the pin holes are adapted to the positioning pins. After the positioning pins are inserted into the pin holes, the wafer cassette is positioned on the installation platform.

[0008] In one embodiment of the present invention, the wafer cassette information automatic management system includes: Multiple enclosure panels are fixed to the mounting platform, connected together, and each enclosure panel faces a first, third, or fourth surface of the wafer cassette. The first surface of the wafer cassette is the opening / closing surface of the wafer cassette, and the third and fourth surfaces are connected to the first surface and are opposite to each other. A support is fixed to the mounting platform, the support is connected to the box plate, and the support faces the second surface of the wafer cassette, wherein the second surface of the wafer cassette is opposite to the first surface of the wafer cassette.

[0009] In one embodiment of the present invention, the radio frequency scanning device is mounted on the mounting platform, the support, or the box plate, wherein the antenna scanning range of the radio frequency scanning device mounted on the mounting platform covers a portion of the second surface or the third surface, the antenna scanning range of the radio frequency scanning device mounted on the box plate covers a portion of the first surface, and the antenna scanning range of the radio frequency scanning device mounted on the support covers a portion of the second surface, wherein the antenna coverage ranges of different radio frequency scanning devices do not overlap.

[0010] In one embodiment of the present invention, the identification code affixed to the wafer cassette includes an identification code of the wafer cassette, a body code of the wafer cassette, and a door panel code of the wafer cassette, wherein the body code is the cassette body number, the door panel code is the door panel number of the wafer cassette, and the radio frequency scanning device is allowed to write the door panel code, the body code, and the identification code into the radio frequency tag.

[0011] In one embodiment of the present invention, the identification code includes a process code, a carrier type number, a wafer type code, a serial number, and a factory code, wherein the process code is an identifier for the process in which the wafer in the wafer cassette is manufactured, the carrier type number is an identifier for the model of the wafer cassette, the wafer type code is an identifier for the wafer type, the serial number is an identifier for different wafer cassettes, and the factory code is an identifier for the foundry.

[0012] In one embodiment of the present invention, the control system includes a storage module that stores parameter interpretation information of the identification code and the binding relationship of multiple identification codes of the same wafer cassette.

[0013] In one embodiment of the present invention, the control system includes an identification module electrically connected to the radio frequency scanning device. When the identification information read by the radio frequency scanning device does not conform to the binding relationship of the identification code, the identification module outputs an alarm signal.

[0014] In one embodiment of the present invention, the control system includes a start unit electrically connected to the radio frequency scanning device, which allows the start unit to send a start command to the radio frequency scanning device, wherein upon receiving the start command, the radio frequency scanning device reads the identification information from the antenna scanning range.

[0015] This invention provides an automatic wafer cassette information management method, based on any of the above-described automatic wafer cassette information management systems, the automatic wafer cassette information management method comprising the following steps: A wafer box is placed on a loading platform, wherein the wafer box is used to hold wafers, the surface of the wafer box is covered with multiple identification codes, and radio frequency tags are installed on the wafer box; The radio frequency scanning device is activated, which scans the surface of the wafer cell and reads the identification information from the identification code; The radio frequency scanning device establishes a contactless communication connection with the radio frequency tag and writes the identification information into the radio frequency tag; and According to the preset card control conditions stored in the control system, when the identification information violates the preset card control conditions, the control system adjusts the identification information of the wafer cell.

[0016] As described above, this invention provides an automated wafer cassette information management system and method. Its unexpected technical effect lies in achieving automated transfer of wafer cassettes within a factory area, between different factory areas, and between different manufacturing plants, while ensuring that the information of the wafer cassettes matches their current state. This invention can automatically update the identification information of wafer cassettes, reducing the proportion of manual operations and achieving automated warehouse management of wafer storage. The automated wafer cassette information management system provided by this invention is adaptable to all nodes in the entire wafer manufacturing cycle, and when there are process updates, the automated management system can quickly make adaptive adjustments and can support various factory areas at any time.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the loading platform structure of the automatic management system in one embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the location structure of the barcode scanner on the mounting platform and back plate in one embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the mounting platform in one embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of the installation structure of the wafer transmission box in one embodiment of the present invention.

[0023] Figure 5 This is a top view of the loading platform in one embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of an identification code on the second surface of a wafer cell in one embodiment of the present invention.

[0025] Figure 7 This is a schematic diagram of an identification code on the third surface of a wafer cell in one embodiment of the present invention.

[0026] Figure 8 This is a schematic diagram of an identification code on the first surface of a wafer cell in one embodiment of the present invention.

[0027] Figure 9 This is a schematic diagram of the scanning range of laser scanning in one embodiment of the present invention.

[0028] Figure 10 This is a schematic diagram of the control system in one embodiment of the present invention.

[0029] In the diagram: 110, Loading platform; 111, Installation platform; 1111, First barcode scanner; 1112, Second barcode scanner; 1113, Positioning pin; 112, Side plate; 113, Support; 1131, Third barcode scanner; 114, Back plate; 1141, Fourth barcode scanner; 1142, Fifth barcode scanner; 115, Roller; 116, Fixing bracket; 117, Display device; 120, Wafer box; a, First surface; b, Second surface; c, Third surface; d, Fourth surface; 200, Control system; 210, Scanning module; 211, Radio frequency scanning device; 212, Start-up unit; 220, Read / write module; 230, Identification module; 231, Binding unit; 232, Judgment unit; 233, Alarm unit; 240, Storage module. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figure 1 and Figure 5 As shown, this invention provides an automated wafer pod information management system. The automated wafer pod information management system includes a wafer pod 120. In this invention, the wafer pod 120 is a front-opening unified pod (FOUP) or a front-opening shipping box (FOSB). The wafer pod 120 stores multiple wafers and can carry wafers within a manufacturing plant or between manufacturing plants. Multiple identification codes are fixed on the wafer pod 120. In this embodiment, the wafer pod 120 is a polyhedron, and at least hexahedron. The wafer pod 120 has a first surface a, a second surface b, a third surface c, and a fourth surface d. The first surface a is defined by the opening direction of the wafer pod 120, and the first surface a can be a plane. The second surface b is defined by the surface opposite to the first surface a, and the second surface b can be a curved surface or a plane. The two sides between the second surface b and the first surface a are designated as the third surface c and the fourth surface d. The third surface c and the fourth surface d can be a combination of a flat surface and a curved surface, with the curved portion connected to the second surface b and the flat portion connected to the first surface a. Multiple identification codes are fixed on the first surface a and the second surface b, and the identification codes can also be fixed on either the third surface c or the fourth surface d.

[0032] Please see Figure 1and Figure 5 As shown, in one embodiment of the present invention, at least three identification codes are provided on the wafer cassette 120. In this embodiment, the identification codes can be affixed to the surface of the wafer cassette 120 in the form of barcodes. One of the identification codes is located on the first surface a of the wafer cassette 120 and serves as the door code of the wafer cassette 120, for example... Figure 8 Barc4 and Barc5 are shown. One of the identification codes is set on the second surface b of the wafer cassette 120 and serves as the identification code for the wafer cassette 120, for example... Figure 6 The Barc1 shown. One of the identification codes is set on the third surface c or the first surface a of the wafer cassette 120, and serves as the body code of the wafer cassette 120, for example. Figure 6 The Barc2 or shown Figure 7 The Barc3 shown refers to the body code, which is the box number of wafer cassette 120. In this invention, multiple types of wafer cassettes 120 can be produced simultaneously. Different combinations of coding positions can be used for different types of wafer cassettes 120. For example... Figures 6 to 8 As shown, the identification codes on wafer cassette 120 can be Barc1, Barc2, and Barc4, or they can be Barc1, Barc3, ​​and Barc5. In this embodiment, the body code of wafer cassette 120 is the production batch number of the carrier provided by the carrier supplier, which facilitates tracing the binding relationship between the FOUP ID and FOSB ID jointly established by the carrier supplier and the wafer foundry in the event of a production anomaly. In this embodiment, the door plate code and the body code of wafer cassette 120 are the same. In this embodiment, for identification codes located on the same surface, the relative positional relationship of the identification codes is not limited when the identification codes are within the scanning range. For example, on the second surface b, the body code can be either Barc2 or Barc1.

[0033] Please see Figure 1As shown, in one embodiment of the present invention, the identification code of the wafer cassette 120 is used to identify the batch number of the wafers currently mounted in the wafer cassette 120. In this embodiment, the identification code of the wafer cassette 120 is an EAN-13 barcode. From left to right, the identification code of the wafer cassette 120 includes a manufacturer code, model number, process code, manufacturer code, year code, month code, serial number, and secondary digit. The manufacturer code, model number, process code, month code, and secondary digit are each one digit. The year code and manufacturer code are each two digits. The serial number is four digits. The manufacturer code is the code of the shipping manufacturer; it is a fixed code and remains unchanged after being determined by the customer. The model number is the identifier of the wafer cassette 120, which can be used to identify the manufacturer and model of the wafer cassette 120; the model number is a unique code. When a new code type for the wafer cassette 120 is added, the model number can be redefined and stored. For example, M can represent wafer cassette 120 with model number MW300GT. K can represent wafer cassette 120 with model number KT-3004-3. The process code represents the code of the process that the wafer in wafer cassette 120 has just undergone or is about to undergo. After defining the process code, the defined process code is stored. The manufacturer code is used to represent the wafer manufacturer. The year code is used to represent the production year of the wafer in wafer cassette 120. The year code can be the last two digits of the year, for example, the year code for 2022 is 22. The month code can be defined by numbers and letters. For example, the month codes for January to September are the corresponding month numbers, October's month code can be A, November's month code can be B, and December's month code can be C. The serial number is used for new wafer supplier deliveries and to distinguish the number on each wafer cassette 120. For example, the serial number can be defined as 0001…9999. If the number of serial numbers exceeds 9999, letters can be added to further distinguish them. For example, serial numbers can be defined as A001 to A999, B001 to B999, and so on. The secondary digit indicates the number of times the wafer cassette 120 has been used. For example, 1-9 represent 1 to 9 uses, and after 10 uses, they are represented by A, B, C…Z, where A represents 10 uses, B represents 11 uses, and so on. In this invention, wafer usage can be controlled based on the secondary digit. For example, when the wafer cassette 120 is used upon entering the factory, the secondary digit is 1, and it can be returned to a new wafer supplier after use. When the same wafer cassette 120 enters the factory again, the secondary digit is 2. This process is repeated 15 times. When the secondary digit reaches 15 uses, the wafer cassette 120 can no longer be returned to a new wafer supplier, but instead is transferred to a recycling company or used for scrapped wafers.

[0034] Please see Figure 1As shown, in another embodiment of the present invention, the identification code of the wafer cassette 120 is an EAN-8 barcode. From left to right, the identification code of the wafer cassette 120 includes a process code, carrier type number, wafer type code, serial number, and fab code. The process code, carrier type number, wafer type code, and fab code are each one digit. The serial number is four digits. In this embodiment, the serial number and process code are defined the same as in the previous embodiment. The carrier type number is used to distinguish the carrier supplier and carrier model. The wafer type code is used to distinguish the type of wafer. In this embodiment, the letter P can represent a product wafer shipped to a customer. The letter N can represent a non-product wafer, such as a wafer used for testing equipment stability. The serial number is used for supplier returns of new wafers and to distinguish the number on each wafer cassette 120. For example, the serial number can be defined as 0001…9999. If the number of serial numbers exceeds 9999, letters can be added to further differentiate them. For example, serial numbers can be defined as A001 to A999, B001 to B999, and so on. The plant area code is used to distinguish different plant areas; for example, A1, A2, A3, etc., can represent wafer production plants.

[0035] Please see Figure 1 As shown, in this invention, the letters in the process code can be used to represent the process content, process segment, or process segment of a specific product within the wafer cassette 120. For example, A represents the post-metallization process. B represents the pre-metallization process. I represents the post-metallization process and can specifically represent the PV verification (Physical Verification) process. F represents the post-metallization process and can specifically represent the Wafer Acceptance Test (WAT) process. P represents the metal silicide preparation process. C represents the process of forming metal layers and contact plugs. D represents the non-chemical mechanical polishing (CMP) process in a back-side illuminator (BSI). U represents the chemical mechanical polishing process in a back-side illuminator. K represents a process involving high-dielectric materials. M represents the process of manufacturing MOSFETs with a small number of wafers, and R represents the process of manufacturing MOSFETs with a large number of wafers. R can also be used as the process code for wafers used in testing. A small number of wafers can be, for example, 13 wafers, and a large number of wafers can be, for example, 25 wafers.

[0036] Please see Figures 1 to 4As shown, in one embodiment of the present invention, the wafer cassette information automatic management system includes a loading platform 110. The loading platform 110 refers to a machine capable of placing and moving wafer cassettes 120. In this embodiment, the loading platform 110 may be box-shaped. A mounting platform 111 is fixedly mounted on the loading platform 110, and the mounting platform 111 is used to support the wafer cassettes 120. A box panel is vertically fixed on the mounting platform 111, and according to the distribution of the box panel, the box panel is divided into side panels 112 and a back panel 114. The back panel 114 faces the first surface a of the wafer cassette 120. There are two side panels 112, and the two side panels 112 are connected to the back panel 114. One side panel 112 faces the third surface c of the wafer cassette 120, and the other side panel 112 faces the fourth surface d of the wafer cassette 120. The two side panels 112 are arranged parallel to each other. The side panels 112 and the back panel 114 are connected, thereby achieving multi-faceted enclosure of the wafer cassette 120. The mounting platform 111 is provided with a support 113, which is connected between two side plates 112 and faces the second surface b. In this embodiment, the height of the support 113 can be less than or equal to the height of the side plates 112. The heights of the two side plates 112 and the back plate 114 can be equal.

[0037] Please see Figure 1 and Figure 2 As shown, in one embodiment of the present invention, a plurality of rollers 115 and a plurality of fixed supports 116 are installed at the bottom of the loading platform 110. When the wafer cassette 120 needs to be moved, the fixed supports 116 are suspended on the ground, and the rollers 115 contact the ground and drive the wafer cassette 120 to move. The rollers 115 and the loading platform 110 are hinged, and the hinge structure can be a universal joint structure. The fixed supports 116 are connected to the loading platform 110, and the fixed supports 116 can move in a direction perpendicular to the ground. Their movement can be driven by cylinders, hydraulic cylinders, etc., or the position of the fixed supports 116 can be adjusted by bolts and screw holes. When the loading platform 110 needs to be fixed, the fixed supports 116 are moved so that they contact the ground, thereby supporting the loading platform 110. At this time, the rollers 115 can be suspended or in contact with the ground. Due to the friction or supporting force between the fixed supports 116 and the ground, the position of the loading platform 110 is fixed. In this invention, the loading platform 110 can move the wafer cassette 120 between multiple process stations. This invention does not limit the driving method of the loading platform 110; it can be manually driven or driven by an engine as a mobile cart. The movement route of the loading platform 110 can be set by the operator.

[0038] Please see Figures 1 to 4As shown, in one embodiment of the present invention, a plurality of positioning pins 1113 are provided on the mounting platform 111. These positioning pins 1113 are located at the bottom of the wafer cassette 120 and can engage with pin holes on the wafer cassette 120. In this embodiment, the number of positioning pins 1113 is, for example, three, and the three positioning pins 1113 can be distributed in the shape of an isosceles triangle or even an equilateral triangle. When placing the wafer cassette 120, the pin holes at the bottom of the wafer cassette 120 are aligned with the positioning pins 1113, thereby positioning the wafer cassette 120 on the mounting platform 111. In other embodiments of the present invention, a positioning plate can be fixed to the bottom of the wafer cassette 120, and the pin holes are provided on the positioning plate, so that the distribution of the positioning pins 1113 on the mounting platform 111 can adapt to all types of wafer cassettes 120.

[0039] Please see Figure 1 and Figure 2 , Figures 5 to 8 , Figure 10As shown, in one embodiment of the present invention, multiple barcode scanners are provided on the enclosure plate and the mounting platform 111. These scanners are located on the mounting platform 111, the support 113, or the back plate 114. In this embodiment, for example, there are five scanners: a first scanner 1111, a second scanner 1112, a third scanner 1131, a fourth scanner 1141, and a fifth scanner 1142. The first scanner 1111 is located on the mounting platform 111, between the support 113 and the second surface b. The second scanner 1112 is located on the mounting platform 111, between the side plate 112 and the third surface c. The third scanner 1131 is located on the support 113, on the side of the support 113 closest to the wafer cassette 120. The fourth and fifth scanning ports 1141 and 1142 are disposed on the back plate 114. It should be noted that, in this invention, the scanning port refers to the location for installing the radio frequency identification (RFID) scanning device 211. The scanning port can be represented as a groove on the board or described as the coordinate point of the laser emitter of the RFID scanning device 211 in a three-dimensional coordinate system. In this embodiment, the RFID scanning device 211 is installed at the scanning port. The RFID scanning device 211 performs non-contact bidirectional data communication via radio frequency, using radio frequency to read and write the identification code on the wafer cassette 120. Specifically, the laser scanning range of the RFID scanning device 211 at the first scanning port 1111 covers the body code Barc2 located on the second surface b. The laser scanning range of the RFID scanning device 211 at the second scanning port 1112 covers the body code on the third surface c. The laser scanning range of the RFID scanning device 211 at the third scanning port 1131 covers the identification code on the second surface b. The laser scanning range of the RF scanning device 211 at the fourth scanning port 1141 covers one door panel code on the first surface a. The laser scanning range of the RF scanning device 211 at the fifth scanning port 1142 covers another door panel code on the first surface a.

[0040] Please see Figure 1 and Figure 2 , Figure 9 and Figure 10 As shown, in one embodiment of the present invention, the antenna mounting position of the radio frequency scanning device 211 is as follows. Figure 7The rectangular area shown is used. In this embodiment, a three-dimensional coordinate system is established with the center of the antenna scanning range as the origin, where the horizontal axis X and the vertical axis Y are located on a horizontal plane parallel to the mounting platform 111, and the Z-axis is perpendicular to the surface of the mounting platform 111. In this embodiment, the optimal installation position of the antenna of the RF scanning device 211 and the center of the RF tag / identification code can be represented as A and B, where the vertical distance between the optimal installation position of the antenna and the center of the tag / identification code is less than, for example, 75 mm, and the distance between the optimal installation position of the antenna and the center of the RF tag / identification code is less than, for example, 100 mm. In this embodiment, the position of the RF scanning device 211 is adjustable. The position of the RF scanning antenna is adjusted according to the shape and size of the wafer cassette 120 to ensure that even if the position of the RF tag and identification code is offset, they are still within the scanning range of the RF scanning device 211. In this embodiment, the dimensions of the laser scanning device are, for example, a length of 50 mm and a width and height of 20 mm. The size of the RF tag or identification code can be, for example, an area with a length of 32 mm and a diameter of 3.85 mm. In this embodiment, the RFID tag can be a memory chip. When scanned by the antenna of the RFID scanning device 211, the RFID scanning device 211 can wirelessly connect to the RFID tag, read the contents of the RFID tag, and write content to the RFID tag. In this embodiment, the RFID tag can be installed within the scanning range of the first scanning port 1111. When scanning the wafer cassette 120 for the first time, the RFID scanning device 211 reads the information in the identification code and then writes the read identification information into the RFID tag. When reading the wafer cassette 120 subsequently, the information in the RFID tag can be directly used as the identification information of the wafer cassette 120. When updating the identification code, the read / write module 220 can be remotely operated to directly update the RFID tag through the RFID scanning device 211. When updating the identification code, for example, by reapplying a new identification code, the information in the RFID tag can be reset according to the newly applied identification code. Even if the identification code is blurred, the scanning device provided by this invention can still accurately obtain the state and process of the wafer cassette 120.

[0041] Please see Figure 1 and Figure 10As shown, in one embodiment of the present invention, the wafer cassette information automatic management system includes a control system 200. The control system 200 includes a scanning module 210, a read / write module 220, an identification module 230, and a storage module 240. The scanning module 210 can scan the surface of the wafer cassette 120 and acquire tag information. The read / write module 220 is electrically connected to the scanning module 210 and can read and write tags on the surface of the wafer cassette 120 through the scanning module 210, thereby adjusting the tag information. The identification module 230 is electrically connected to the read / write module 220. Based on the read tag information, the identification module 230 can determine whether the tag information is correct and, according to the set card control conditions, determine the object to which the wafer cassette 120 should be transferred. When the wafer cassette 120 encounters a situation other than the card control conditions, the identification module 230 can also issue an alarm to promptly remind the operator to intervene. The storage module 240 is electrically connected to the read / write module 220 and the identification module 230, and is used to store the interpretation information of the identification code. For example, F represents the post-metal processing. When there are updates to the process or workflow management, such as the introduction of a new wafer cassette 120, the read / write module 220 can name the newly introduced wafer cassette 120 and interpret and store the named identification code in the storage module 240. In this embodiment, the control system 200 can be installed in the loading platform 110 in the form of chips and circuits, and the control system can be connected to an internal local area network to achieve remote control. The control system 200 is equipped with a display device 117 installed on the loading platform 110. The display device 117 can be a programmable automation controller with a touch editing screen, which can be used to control the control system 200 via touch screen.

[0042] Please see Figure 1 , Figure 9 and Figure 10As shown, in one embodiment of the present invention, the scanning module 210 includes a startup unit 212 and multiple radio frequency (RF) scanning devices 211. The startup unit 212 is electrically connected to the RF scanning devices 211 and is used to start the RF scanning devices 211. In this embodiment, the startup unit 212 can start the RF scanning devices 211 by sending a startup signal or startup command to them. For example, a startup switch is provided on the power supply circuit of the RF scanning devices 211, and the switch is controlled by the startup unit 212. When the startup unit 212 sends an electrical signal to the startup switch to close it, the power supply circuit can then supply power to the RF scanning devices 211 normally, thereby starting the RF scanning devices 211. The startup switch can be an electromagnetic switch or a MOSFET. After the RF scanning devices 211 are started, they read the information of the RFID tags or identification codes in the corresponding scanning range. In this embodiment, the number of scanning ports is greater than the number of RFID tags on the wafer cassette 120. For example, there are 5 scanning ports, while the number of RFID tags is 3. All radio frequency scanning devices 211 can be activated simultaneously. When there is no identification code within the antenna scanning range, the information read by the radio frequency scanning device 211 can be empty. The read / write module 220 is electrically connected to the radio frequency scanning device 211 and receives the tag information read by the radio frequency scanning device 211. In this embodiment, the information read by the radio frequency scanning device 211 can be temporarily stored in the read / write module 220 or the storage module 240.

[0043] Please see Figure 1 and Figure 10As shown, in one embodiment of the present invention, the identification module 230 includes a binding unit 231, a judgment unit 232, and an alarm unit 233. When the identification code of the wafer cassette 120 is read for the first time, the binding unit 231 binds the three identification codes belonging to the same wafer cassette 120 together and stores the binding relationship of the wafer cassette 120 in the storage module 240. The binding relationship can be represented as an information combination table, which stores multiple identification codes of the same wafer cassette 120. After the RF scanning device 211 reads the identification information, the judgment unit 232 determines whether the current transportation status of the wafer cassette 120 is incorrect based on whether the identification information of the three identification codes is the same as the stored information in the information combination table. Specifically, when the identification information of the three identification codes is the same as the stored information in the information combination table, the transportation status of the wafer cassette 120 is correct, and the read / write module 220 writes the read identification information into the RFID tag through the RF scanning device 211. If the identification information of the three identification codes differs from the stored information in the information combination table, the transportation status of the wafer cassette 120 is incorrect. The read / write module 220 can output an alarm signal to the alarm unit 233 to remind the operator to intervene and check the identification codes in time before the wafer cassette 120 enters the next process station. When the wafer cassette 120 is transferred within the factory, between factories, or between manufacturing plants, it can avoid the information update delay caused by identification code damage and ensure that the stored information is not incorrect. After scanning the tag information, the judgment unit 232 determines the next station of the wafer cassette 120 according to the preset card control conditions input by the operator. If the identification information does not meet the preset card control conditions, the wafer cassette 120 is adjusted to the scrap yard or used for the storage of scrapped wafers.

[0044] Please see Figure 1 and Figure 10 As shown, in one embodiment of the present invention, when it is necessary to change the identification information of the wafer cassette 120, for example, to increase the number of times the secondary digit of the wafer cassette 120 needs to be increased, the identification code of the wafer cassette 120 can be adjusted through remote control of the read / write module 220. The read / write module 220 modifies the stored information of the RFID tag through the RFID scanning device 211 and updates the information combination table synchronously so that the judgment module can determine the binding relationship based on the latest information. In this embodiment, after the identification information of the wafer cassette 120 is entered for the first time, the latest identification information of the wafer cassette 120 is stored in the RFID tag. In another embodiment of the present invention, when the information of the wafer cassette 120 needs to be changed, the identification code can be modified before entering a new process station, and the new identification code can be affixed to the surface of the wafer cassette 120. Before the wafer cassette 120 enters the storage station or the next process station, the RFID scanning device 211 stores the binding relationship of the new identification information in the storage module 240 and writes the new identification information into the RFID tag.

[0045] Please see Figure 1 and Figure 10As shown, this invention provides a management method based on an automated wafer cassette information management system, which can be used throughout the entire wafer fabrication cycle and can be readily used to support various fabs or process stations. The wafer cassette 120 can be circulated to manufacturing plants or stations including the wafer cassette 120 manufacturer, wafer fabrication plant, Reclaimed Wafer (RLM) station, quality inspection station, Non-Production Wafer Center (NPWC), storage and transportation station, and wafer cassette 120 recycling plant. The wafer cassette 120 manufacturer provides new wafer cassettes 120, their body codes, and the number of times they can be checked. New wafer cassettes 120 can be transported to the wafer fabrication plant for use. In the wafer fabrication plant, if a wafer passes testing, it can be used as a new wafer; if a wafer fails testing, it is directly discarded. New wafers can be loaded into new wafer cassettes 120. Next, wafer cassette 120 is sent to the quality inspection station. If the quality inspection station finds that the number of scrapped wafer cassette 120s is less than the number of control limits provided by the manufacturer, the new wafer cassette 120 is returned. If the quality inspection station finds that the number of scrapped wafer cassette 120s is greater than or equal to the number of control limits provided by the manufacturer, the new wafer cassette 120 can be used in the foundry. Based on the identification code and preset control conditions of wafer cassette 120, it is determined whether wafer cassette 120 meets the requirements. If any identification information of wafer cassette 120 does not meet the preset control conditions, wafer cassette 120 can be recycled or returned. If wafer cassette 120 has not been returned or recycled after wafer manufacturing is completed, it is sent to the storage and transportation station. At the storage and transportation station, wafer cassette 120s are packaged. The packaged wafer cassette 120 can undergo another test to determine the preset control conditions. If the test is passed, the packaged wafer cassette 120 can be returned to the wafer manufacturing plant to continue the wafer storage task. If the wafer cassette 120 does not meet the preset control conditions, it can be sent to a wafer cassette 120 recycling plant. At the recycling plant, the wafer cassette 120 can be repaired and salvaged. If the adjusted wafer cassette 120 meets the wafer manufacturing plant's storage requirements, it can be reused. If the adjusted wafer cassette 120 does not meet the wafer manufacturing plant's storage requirements, its subsequent use is not within the scope of this invention. In this embodiment, the preset control condition is, for example, that the number of times the wafer cassette 120 enters the plant does not exceed 15. The preset control conditions can be adjusted according to the requirements of different manufacturers.

[0046] Please see Figure 1 and Figure 10As shown, in this invention, if the wafer cassette 120 does not meet the preset control conditions in the foundry, the wafer cassette 120 can be downgraded to a wafer cassette 120 for reused wafers and sent to a reused wafer manufacturing plant, or the wafer cassette 120 can be kept as a wafer cassette 120 for scrapped wafers.

[0047] This invention provides an automated wafer cassette information management system and method. Its unexpected technical effect lies in achieving automated transfer of wafer cassettes within a factory area, between different factory areas, and between different manufacturing plants, while ensuring that the information of the wafer cassettes matches their current status. This invention can automatically update the identification information of wafer cassettes, reducing the proportion of manual operations and achieving automated warehouse management of wafer storage. The automated wafer cassette information management system provided by this invention is adaptable to all nodes in the entire wafer manufacturing cycle, and can quickly adapt to changes in the process, providing timely support to various factory areas.

[0048] The embodiments of the present invention disclosed above are merely illustrative of the invention. The embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An automatic management system for wafer cassette information, characterized in that, include: Loading platform; A wafer box is placed on the loading platform. The wafer box is used to hold wafers. The surface of the wafer box is covered with multiple identification codes, and radio frequency tags are installed on the wafer box. An RF scanning device is installed on the loading platform, and the antenna scanning range of the RF scanning device covers the identification code and the RF tag, allowing the RF scanning device to read identification information from the identification code, and allowing the RF scanning device to write the identification information to the RF tag after establishing a contactless communication connection with the RF tag; as well as A control system is electrically connected to the radio frequency scanning device. The control system stores preset card control conditions. When the identification information violates the preset card control conditions, the control system adjusts the identification information of the wafer cell.

2. The wafer cassette information automatic management system according to claim 1, characterized in that, The wafer cassette information automatic management system includes an installation platform, which is fixed to the loading platform. Multiple positioning pins are fixed on the installation platform. The bottom of the wafer cassette is provided with multiple pin holes, and the pin holes are adapted to the positioning pins. After the positioning pins are inserted into the pin holes, the wafer cassette is positioned on the installation platform.

3. The wafer cassette information automatic management system according to claim 2, characterized in that, The wafer cassette information automatic management system includes: Multiple enclosure panels are fixed to the mounting platform, connected together, and each enclosure panel faces a first, third, or fourth surface of the wafer cassette. The first surface of the wafer cassette is the opening / closing surface of the wafer cassette, and the third and fourth surfaces are connected to the first surface and are opposite to each other. A support is fixed to the mounting platform, the support is connected to the box plate, and the support faces the second surface of the wafer cassette, wherein the second surface of the wafer cassette is opposite to the first surface of the wafer cassette.

4. The wafer cassette information automatic management system according to claim 3, characterized in that, The radio frequency scanning device is mounted on the mounting platform, the support, or the enclosure plate. The antenna scanning range of the radio frequency scanning device mounted on the mounting platform covers a portion of the second surface or the third surface. The antenna scanning range of the radio frequency scanning device mounted on the enclosure plate covers a portion of the first surface. The antenna scanning range of the radio frequency scanning device mounted on the support covers a portion of the second surface. The antenna coverage ranges of different radio frequency scanning devices do not overlap.

5. The wafer cassette information automatic management system according to claim 4, characterized in that, The identification code affixed to the wafer box includes the wafer box identification code, the wafer box body code, and the wafer box door code, wherein the body code is the box body number of the wafer box, and the door code is the door number of the wafer box. The radio frequency scanning device is allowed to write the door code, the body code, and the identification code into the radio frequency tag.

6. The wafer cassette information automatic management system according to claim 1, characterized in that, The loading platform is equipped with multiple workstations, and each of the multiple workstations is connected to a different process station, wherein the loading platform is allowed to perform parallel operations on the wafer cells of the multiple process stations.

7. The wafer cassette information automatic management system according to claim 1, characterized in that, The control system includes a storage module that stores parameter explanation information of the identification code and the binding relationship of multiple identification codes of the same wafer cassette.

8. The wafer cassette information automatic management system according to claim 7, characterized in that, The control system includes an identification module, which is electrically connected to the radio frequency scanning device. When the identification information read by the radio frequency scanning device does not conform to the binding relationship of the identification code, the identification module outputs an alarm signal.

9. The wafer cassette information automatic management system according to claim 1, characterized in that, The control system includes a start unit electrically connected to the radio frequency scanning device, which allows the start unit to send a start command to the radio frequency scanning device. Upon receiving the start command, the radio frequency scanning device reads the identification information from the antenna scanning range.

10. A method for automatic management of wafer cassette information, based on an automatic management system for wafer cassette information as described in any one of claims 1 to 9, characterized in that, The automatic management method for wafer cassette information includes the following steps: A wafer box is placed on a loading platform, wherein the wafer box is used to hold wafers, the surface of the wafer box is covered with multiple identification codes, and radio frequency tags are installed on the wafer box; The radio frequency scanning device is activated, which scans the surface of the wafer cell and reads the identification information from the identification code; The radio frequency scanning device establishes a contactless communication connection with the radio frequency tag and writes the identification information into the radio frequency tag; and According to preset card control conditions stored in the control system, when the identification information violates the preset card control conditions, the control system adjusts the identification information of the wafer cell.

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