A silicon photonic chip laser bonding apparatus

Abstract

The application relates to the technical field of semiconductor manufacturing equipment, in particular to a silicon optical chip laser bonding device which comprises a table body, a processing frame is fixedly installed on the upper surface of the table body, a lifting cylinder is installed on the processing frame, a laser bonder is fixedly installed at the bottom end of the driving shaft of the lifting cylinder; a refrigeration cabinet is fixedly installed on the upper surface of the mounting plate, a fixed block is fixedly sleeved on the driving shaft of the lifting cylinder, vertical rods are fixedly installed on the upper surface of the fixed block in a symmetrical mode, a gas groove is vertically arranged at the top end of the vertical rod, a piston rod is slidably and sealingly arranged in the gas groove, the top end of the piston rod is fixedly connected with the top wall in the processing frame, and a gas outlet pipe is fixedly installed at the bottom end of the vertical rod. The vertical reciprocating movement during the bonding process of the laser bonder is matched with the piston rod and the vertical rod, cold air in the refrigeration cabinet can be sprayed to the surface of the laser head after the bonding is completed, and the laser head can be cooled in time.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor manufacturing equipment, in particular to a silicon optical chip laser bonding device. BACKGROUND

[0002] In the process of manufacturing a silicon optical chip, a laser bonding device is needed to connect the silicon optical chip with other optical elements or substrates with high precision. The laser bonding device uses a high-energy-density laser beam to focus on the connecting part of the silicon optical chip and the object to be bonded. After the laser energy is absorbed by the material, it is converted into heat energy, which rapidly heats the material in the bonding area to the melting point or softening point. Under the joint action of pressure and temperature, the fusion or close combination between materials is realized, thereby forming a reliable optical and mechanical connection.

[0003] The laser head of the existing laser bonding device generates heat when bonding the silicon optical chip. Although the single bonding time is short, the heat will accumulate during long-term continuous bonding. The excessively high temperature will affect the performance and service life of the elements in the laser head, thereby adversely affecting the quality and efficiency of the silicon optical chip laser bonding. SUMMARY

[0004] The purpose of the application is to solve the following shortcomings in the prior art: the laser head of the existing laser bonding device generates heat when bonding the silicon optical chip. Although the single bonding time is short, the heat will accumulate during long-term continuous bonding. The excessively high temperature will affect the performance and service life of the elements in the laser head, thereby adversely affecting the quality and efficiency of the silicon optical chip laser bonding. To solve the above problems, a silicon optical chip laser bonding device is provided.

[0005] In order to achieve the above purpose, the application adopts the following technical scheme:

[0006] A silicon optical chip laser bonding device, comprising a table body, a processing frame is fixedly installed on the upper surface of the table body, a lifting cylinder is fixedly installed at the top of the processing frame, a laser bonder is fixedly installed at the bottom end of the drive shaft of the lifting cylinder, and a placing assembly for carrying a silicon optical chip and an object to be bonded is arranged on the upper surface of the table body;

[0007] A mounting plate is fixedly installed on the back of the processing frame, a refrigeration cabinet is fixedly installed on the upper surface of the mounting plate, a fixed block is fixedly sleeved on the drive shaft of the lifting cylinder, vertical rods are fixedly and symmetrically installed on the upper surface of the fixed block, a gas groove is vertically arranged at the top end of the vertical rod, a piston rod is slidably and sealingly inserted into the gas groove, the top end of the piston rod is fixedly connected with the top wall in the processing frame, an air outlet pipe is fixedly installed at the bottom end of the vertical rod, the air outlet pipe penetrates through the fixed block and is directed towards the laser head of the laser bonder, the vertical rod is in communication with the refrigeration cabinet through an air inlet pipe, and a one-way valve is arranged in the air inlet pipe and the air outlet pipe.

[0008] Preferably, the one-way valve in the air inlet pipe is arranged to be open from the inside of the refrigerator to the air channel, and the one-way valve in the air outlet pipe is arranged to be open from the inside of the air channel to the outside.

[0009] Preferably, the placing assembly comprises a placing box in sliding contact with the upper surface of the table body, the upper surface of the placing box is provided with a limiting groove matched with the shape of the object to be bonded, the inner wall of the limiting groove is fixedly installed with a limiting frame through a connecting rod, the hollow cross-section of the limiting frame is matched with the shape of the silicon optical chip, the limiting groove and the limiting frame are respectively used to limit the displacement of the object to be bonded and the silicon optical chip during the bonding process, the upper surface of the placing box is provided with a pushing opening in communication with the limiting groove, the surface of the placing box is provided with a discharging groove in communication with the limiting groove, the left and right side walls of the placing box are provided with through holes, the through holes are slidably inserted with slide rods, the ends of the two slide rods away from each other are fixedly installed with baffles, and the ends of the two slide rods close to each other are fixedly installed with mounting blocks, the mounting blocks are connected with the placing box through a telescopic component, the two baffles are used to carry the object to be bonded in the limiting groove, the bottom of the pushing opening is higher than the top of the baffle, the placing box is controlled to move horizontally through a pressing component, and the two slide rods are controlled to move away from each other through a driving assembly.

[0010] Preferably, the telescopic component comprises a telescopic spring sleeved on the slide rod, and the two ends of the telescopic spring are fixedly connected with the mounting block and the placing box respectively.

[0011] Preferably, the pressing component comprises two bent rods and two pressing rods fixedly installed on the two sides of the mounting block respectively, the surface of the bent rod is provided with a sliding rail, the sliding rail is composed of an integral forming inclined opening and a straight opening, the bottom ends of the two bent rods are fixedly connected with the upper surface of the placing box through bolts, and the ends of the two pressing rods away from each other are slidably arranged in the two sliding rails respectively.

[0012] Preferably, the bottom of the placing box is provided with a plurality of spherical grooves, a rolling ball is rollingly embedded in the spherical groove, and the rolling ball is in rolling contact with the table body.

[0013] Preferably, the driving assembly comprises two pushing rods symmetrically and vertically fixedly installed on the upper surface of the table body and two inclined plates, the lower surface of the mounting block is fixedly installed with a connecting rod, the two inclined plates are fixedly installed at the bottom ends of the two connecting rods respectively, and the two inclined plates are symmetrically arranged, the surface of the inclined plate is provided with a through opening, the top wall of the through opening is provided with a rotating opening, a rotating shaft is rotatably installed in the rotating opening, the top end of the rotating shaft is fixedly installed with a mounting block, the mounting block is connected with the inclined plate through an elastic component, the bottom end of the rotating shaft is fixedly installed with a rotating plate, the rotating direction of the rotating plate is limited through a limiting component, and the positions of the two through openings correspond to the positions of the two pushing rods respectively.

[0014] Preferably, the elastic component comprises a torsion spring sleeved on the rotating shaft, and two ends of the torsion spring are fixedly connected with the setting block and the inclined plate respectively.

[0015] Preferably, the rotating limiting component comprises a rotating limiting rod vertically and fixedly installed at the top end of the rotating plate, and an arc-shaped rotating limiting opening is formed in the top wall of the through opening with the rotating shaft as the center, and the rotating limiting rod is slidingly arranged in the rotating limiting opening.

[0016] Preferably, the surface of the processing frame is symmetrically and rotationally connected with a frame door, the surface of the frame door is provided with an observation opening, and the observation opening is embedded with a transparent glass.

[0017] Compared with the prior art, the application has the following beneficial effects:

[0018] 1. The vertical reciprocating movement during the bonding process of the laser bonder, in cooperation with the piston rod and the vertical rod, can spray the cold air in the refrigerator to the surface of the laser head after the bonding is completed, so as to achieve the effect of timely cooling the laser head.

[0019] 2. The cooperation between the limiting frame and the limiting groove can quickly complete the fixing of the silicon optical chip and the object to be bonded, so as to avoid the position deviation of the silicon optical chip and the object to be bonded, and affect the bonding quality.

[0020] 3. When the bonding is completed, the placing box will move during the upward movement of the laser bonder, and will no longer be located below the laser bonder, so as to avoid the safety hidden danger that the hand of the operator is located below the laser bonder when placing the subsequent silicon optical chip and the object to be bonded.

[0021] 4. When the laser bonder moves upward and the placing box moves laterally, the silicon optical chip after bonding can be automatically unloaded without manual taking, so as to improve the working efficiency of the bonding. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a front perspective structural schematic view of a silicon optical chip laser bonding device proposed by the application;

[0023] Figure 2 It is a back perspective structural schematic view of a silicon optical chip laser bonding device proposed by the application;

[0024] Figure 3 It is a partial front perspective structural schematic view of a table body and a processing frame in a silicon optical chip laser bonding device proposed by the application;

[0025] Figure 4 It is a partial top perspective structural schematic view of a table body and a processing frame in a silicon optical chip laser bonding device proposed by the application;

[0026] Figure 5 A part of the top view schematic diagram of the placement assembly in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0027] Figure 6 A part of the bottom view schematic diagram of the placement assembly in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0028] Figure 7 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0029] Figure 8 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0030] Figure 9 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure. Figure 3 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0031] Figure 10 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure. Figure 4 A part of the schematic diagram of the baffle and the inclined plate in the silicon optical chip laser bonding equipment proposed by the application is shown in the figure.

[0032] In the figure: 1 table body, 2 processing frame, 3 lifting cylinder, 4 laser bonder, 5 refrigeration cabinet, 6 fixed block, 7 vertical rod, 8 transparent glass, 9 piston rod, 10 air outlet pipe, 11 air inlet pipe, 12 placement box, 13 limiting groove, 14 limiting frame, 15 push opening, 16 unloading groove, 17 sliding rod, 18 baffle, 19 mounting block, 20 extension spring, 21 bent rod, 22 abutting rod, 23 inclined opening, 24 straight opening, 25 straight rod, 26 rolling ball, 27 push rod, 28 inclined plate, 29 through opening, 30 rotating shaft, 31 rotating plate, 32 torsional spring, 33 limiting rotating rod, 34 limiting rotating opening, 35 frame door. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application.

[0034] Referring to Figures 1-10 A silicon optical chip laser bonding equipment includes a table body 1, a processing frame 2 is fixedly installed on the upper surface of the table body 1, a lifting cylinder 3 is fixedly installed at the top in the processing frame 2, a laser bonder 4 is fixedly installed at the bottom of the drive shaft of the lifting cylinder 3, a placement assembly for bearing silicon optical chips and objects to be bonded is arranged on the upper surface of the table body 1, a frame door 35 is symmetrically and rotatably connected to the surface of the processing frame 2, an observation opening is formed in the surface of the frame door 35, and a transparent glass 8 is embedded in the observation opening.

[0035] The back of the processing frame 2 is fixedly installed with a mounting plate, the upper surface of the mounting plate is fixedly installed with a refrigeration cabinet 5 (the refrigeration cabinet 5 is prior art, mainly used for manufacturing and storing cold air, and the working principle thereof is not described in detail here), a fixed block 6 is fixedly sleeved on the driving shaft of the lifting cylinder 3, the upper surface of the fixed block 6 is symmetrically fixedly installed with vertical rods 7, the top end of the vertical rod 7 is vertically provided with a gas groove, a piston rod 9 is slidingly and sealingly inserted into the gas groove, the top end of the piston rod 9 is fixedly connected with the inner top wall of the processing frame 2, the bottom end of the vertical rod 7 is fixedly installed with an air outlet pipe 10, the bottom end of the air outlet pipe 10 penetrates out of the fixed block 6 and is directed towards the laser head of the laser bonder 4, the vertical rod 7 is connected with the refrigeration cabinet 5 through an air inlet pipe 11, one-way valves are arranged in the air inlet pipe 11 and the air outlet pipe 10, the conduction direction of the one-way valve in the air inlet pipe 11 is from the refrigeration cabinet 5 to the gas groove, and the conduction direction of the one-way valve in the air outlet pipe 10 is from the gas groove to the outside.

[0036] Firstly, the object to be bonded and the silicon optical chip are placed on the placement assembly, and the placement assembly is moved to a suitable position, then the lifting cylinder 3 is started, the laser bonder 4 is controlled to move downwards, the laser head of the laser bonder 4 performs laser bonding processing on the object to be bonded and the silicon optical chip located on the placement assembly, in the process of moving downwards of the laser bonder 4, the fixed block 6 moves downwards together with the two vertical rods 7, the space volume between the bottom of the gas groove and the bottom end of the piston rod 9 becomes larger, the pressure decreases, and the cold air in the refrigeration cabinet 5 enters the gas groove from the air inlet pipe 11, when the bonding processing is completed, the lifting cylinder 3 moves upwards together with the laser bonder 4, the fixed block 6 also moves upwards together with the two vertical rods 7, the space volume between the bottom of the gas groove and the bottom end of the piston rod 9 becomes smaller, the pressure increases, and the cold air in the gas groove is sprayed out from the air outlet pipe 10 and acts on the surface of the laser head of the laser bonder 4, so that the laser head is cooled in time.

[0037] The placing assembly comprises a placing box 12 in sliding contact with the upper surface of the table body 1, the upper surface of the placing box 12 is provided with a limiting groove 13 matched with the shape of the object to be bonded, the inner wall of the limiting groove 13 is fixedly installed with a limiting frame 14 through a connecting rod, the hollow cross-section shape of the limiting frame 14 is matched with the shape of the silicon optical chip, the limiting groove 13 and the limiting frame 14 are respectively used for limiting displacement of the object to be bonded and the silicon optical chip during the bonding process, the upper surface of the placing box 12 is provided with a push opening 15 in communication with the limiting groove 13, the surface of the placing box 12 is provided with a discharging groove 16 in communication with the limiting groove 13, the left and right side walls of the placing box 12 are both provided with a through hole, a sliding rod 17 is slidingly inserted into the through hole, the end of the two sliding rods 17 close to each other is fixedly installed with a baffle 18, the end of the two sliding rods 17 away from each other is fixedly installed with a mounting block 19, the mounting block 19 is connected with the placing box 12 through an extension component, the extension component comprises an extension spring 20 sleeved on the sliding rod 17, the two ends of the extension spring 20 are fixedly connected with the mounting block 19 and the placing box 12 respectively, the two baffles 18 are used for bearing the object to be bonded located in the limiting groove 13, the bottom of the push opening 15 is higher than the top of the baffle 18, the placing box 12 controls the transverse movement through a pressing component, the pressing component comprises two bent rods 21 and two pressing rods 22 fixedly installed on the two sides of the fixed block 6 respectively, the surface of the bent rod 21 is provided with a sliding rail, the sliding rail is composed of an integral forming inclined opening 23 and straight opening 24, the bottom end of the two bent rods 21 is fixedly connected with the upper surface of the placing box 12 through a bolt, the bolt fixing part is convenient for quickly replacing the placing box 12 with different shapes of limiting groove 13 and limiting frame 14, the end of the two pressing rods 22 away from each other is slidingly arranged in the two sliding rails respectively, the inner wall of the processing frame 2 is fixedly installed with a straight rod 25, the two bent rods 21 are slidingly sleeved on the two straight rods 25 respectively, the two sliding rods 17 are controlled to move away from each other through a driving assembly, the driving assembly comprises two push rods 27 symmetrically and vertically fixedly installed on the upper surface of the table body 1 and two inclined plates 28, the lower surface of the mounting block 19 is fixedly installed with a connecting rod, the two inclined plates 28 are fixedly installed at the bottom end of the two connecting rods respectively, and the two inclined plates 28 are symmetrically arranged, the surface of the inclined plate 28 is provided with a through opening 29, the top wall of the through opening 29 is provided with a rotating opening, a rotating shaft 30 is rotatably installed in the rotating opening, the top end of the rotating shaft 30 is fixedly installed with a mounting block, the mounting block is connected with the inclined plate 28 through an elastic component, the elastic component comprises a torsional spring 32 sleeved on the rotating shaft 30, the two ends of the torsional spring 32 are fixedly connected with the mounting block and the inclined plate 28 respectively, the bottom end of the rotating shaft 30 is fixedly installed with a rotating plate 31, the rotating direction of the rotating plate 31 is limited through a rotation limiting component, the rotation limiting component comprises a rotation limiting rod 33 vertically fixedly installed at the top end of the rotating plate 31, the top wall of the through opening 29 is provided with an arc-shaped rotation limiting opening 34 with the rotating shaft 30 as the center, the rotation limiting rod 33 is slidingly arranged in the rotation limiting opening 34, and the two through openings 29 correspond to the positions of the two push rods 27 respectively.

[0038] When the laser bonder 4 is at the highest position, at this time, the two abutting rods 22 will be at the highest position in the two bevels 23 respectively, and the placing box 12 will also be at the position close to the pipe opening of the processing frame 2, and will not be below the laser bonder 4, at this time, the two baffles 18 will abut, so as to close the groove bottom of the limiting groove 13, at this time, the object to be bonded can be pushed into the limiting groove 13 from the push opening 15, after the object to be bonded enters the limiting groove 13, the bottom thereof will abut the upper surface of the baffle 18, and the object to be bonded will be blocked by the groove wall of the limiting groove 13 and will not move, then at this time, the silicon optical chip is placed in the limiting frame 14, after the bottom of the silicon optical chip abuts the upper surface of the object to be bonded, the part of the silicon optical chip in contact with the object to be bonded is the part to be bonded.

[0039] Then at this time, the lifting cylinder 3 controls the laser bonder 4 to move downward, in this process, the two abutting rods 22 will slide in the two bevels 23 respectively, under the action of the bevel abutting, the placing box 12 will move towards the processing frame 2, in this process, the two push rods 27 will enter the two through openings 29 respectively, and push the rotating plate 31 in the through opening 29 to rotate, the limiting rotating rod 33 will rotate out of the limiting rotating opening 34, until the push rod 27 no longer contacts the rotating plate 31, at this time, the rotating plate 31 will rotate and reset rapidly under the elastic potential of the torsional spring 32, and the limiting rotating rod 33 will also enter the limiting rotating opening 34 again, until the part to be bonded moves to the position directly below the laser head of the laser bonder 4, at this time, with the downward movement of the laser head of the laser bonder 4, the two abutting rods 22 will slide into the two straight openings 24 from the two bevels 23 respectively, so that when the laser head moves downward, the abutting rod 22 will not abut the placing box 12 to move.

[0040] When the bonding is completed, in the process of upward movement of the laser bonder 4, the two abutting rods 22 will enter the two bevels 23 from the two straight openings 24 respectively, under the action of the bevel abutting, the placing box 12 will move towards the frame opening of the processing frame 2.

[0041] In this process, the two plates 31 will be with two push rods 27, because the plate 31 limited rotation rod 33 and limited rotation mouth 34 of the restriction, can not rotate to the processing frame 2 inside direction, so that the push rod 27 will be with the surface of the sliding contact of the plate 31, under the action of the inclined surface pressure, two inclined plate 28 will be with two slide rods 17 and two baffle 18 away from each other, until two baffle 18 moves to no longer cover the bottom of the limiting slot 13, the silicon optical chip will be from the bottom of the limiting slot 13 dropped into the unloading slot 16, when the laser bonder 4 up to the top, at this time, two inclined plate 28 will not be in contact with two push rods 27, two inclined plate 28, two slide rods 17 and two baffle 18 will be under the elastic potential of the extension spring 20, quickly move back to the original position, two baffle 18 will be again, so as to cover the bottom of the limiting slot 13, facilitate the placement of subsequent objects and silicon optical chip to be bonded.

[0042] That is, through the cooperation between the limiting frame 14 and the limiting slot 13, the silicon optical chip and the object to be bonded can be quickly fixed, avoiding the position deviation of the silicon optical chip and the object to be bonded, which affects the bonding quality.

[0043] When the bonding is completed, the placement box 12 will move during the upward movement of the laser bonder 4, and will not be located below the laser bonder 4, avoiding the safety hazard that the operator's hand is located below the laser bonder 4 when placing the subsequent silicon optical chip and object to be bonded.

[0044] When the laser bonder 4 moves upward and the placement box 12 moves horizontally, the silicon optical chip bonded is automatically unloaded without manual taking, improving the working efficiency of the bonding.

[0045] The bottom of the placement box 12 is provided with a plurality of spherical grooves, and a rolling ball 26 is embedded in the spherical groove and rolls in contact with the table body 1. The rolling ball 26 can reduce the friction between the contact surface of the placement box 12 and the table body 1.

[0046] In the application, firstly, the object to be bonded and the silicon optical chip are placed on the placing assembly, and the placing assembly is moved to a suitable position, then the lifting cylinder 3 is started, the laser bonder 4 is controlled to move downward, the laser head of the laser bonder 4 is used to carry out laser bonding processing on the object to be bonded and the silicon optical chip on the placing assembly, in the process of moving downward of the laser bonder 4, the fixed block 6 moves downward together with the two vertical rods 7, the space volume between the bottom of the air groove and the bottom end of the piston rod 9 becomes larger, the pressure decreases, the cold air in the refrigerator 5 enters the air groove from the air inlet pipe 11, when the bonding processing is completed and the lifting cylinder 3 moves upward together with the laser bonder 4, the fixed block 6 moves upward together with the two vertical rods 7, the space volume between the bottom of the air groove and the bottom end of the piston rod 9 becomes smaller, the pressure increases, the cold air in the air groove is sprayed out from the air outlet pipe 10 and acts on the surface of the laser head of the laser bonder 4, so that the effect of cooling the laser head in time is achieved.

[0047] The above is only the preferred embodiment of the application, but the protection scope of the application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the application within the technical range disclosed by the application, which should be covered in the protection scope of the application.

Claims

1. A silicon photonic chip laser bonding apparatus comprising a table body (1), characterized in that, The upper surface of the table body (1) is fixedly provided with a processing frame (2), the inner top of the processing frame (2) is fixedly provided with a lifting cylinder (3), the bottom end of the driving shaft of the lifting cylinder (3) is fixedly provided with a laser bonder (4), and the upper surface of the table body (1) is provided with a placing assembly for bearing a silicon optical chip and an object to be bonded; The back of the processing frame (2) is fixedly provided with a mounting plate, the upper surface of the mounting plate is fixedly provided with a refrigeration cabinet (5), the driving shaft of the lifting cylinder (3) is fixedly sleeved with a fixed block (6), the upper surface of the fixed block (6) is symmetrically fixedly provided with a vertical rod (7), the top end of the vertical rod (7) is vertically provided with an air groove, the air groove is slidably and sealingly provided with a piston rod (9), the top end of the piston rod (9) is fixedly connected with the inner top wall of the processing frame (2), the bottom end of the vertical rod (7) is fixedly provided with an air outlet pipe (10), the bottom end of the air outlet pipe (10) penetrates through the fixed block (6) and is directed to the laser head of the laser bonder (4), the vertical rod (7) is connected with the refrigeration cabinet (5) through an air inlet pipe (11), and the air inlet pipe (11) and the air outlet pipe (10) are both provided with one-way valves. In the process that the laser bonder (4) moves downward, the cold air in the refrigeration cabinet (5) enters the air groove from the air inlet pipe (11), when the bonding process is completed, the lifting cylinder (3) moves upward with the laser bonder (4), and the cold air in the air groove is sprayed out from the air outlet pipe (10) to cool the laser head.

2. The silicon photonic chip laser bonding apparatus of claim 1, wherein, The one-way valve in the air inlet pipe (11) is in a conduction direction from the refrigeration cabinet (5) to the air groove, and the one-way valve in the air outlet pipe (10) is in a conduction direction from the air groove to the outside.

3. The silicon photonic chip laser bonding apparatus of claim 1, wherein, The placing assembly comprises a placing box (12) in sliding contact with the upper surface of the table body (1), the upper surface of the placing box (12) is provided with a limiting groove (13) matched with the shape of the object to be bonded, the inner wall of the limiting groove (13) is fixedly provided with a limiting frame (14) through a connecting rod, the hollow cross section of the limiting frame (14) is matched with the shape of the silicon optical chip, and the limiting groove (13) and the limiting frame (14) are respectively used for limiting displacement of the object to be bonded and the silicon optical chip during the bonding process.

4. The silicon photonic chip laser bonding apparatus of claim 3, wherein, The telescopic part comprises a telescopic spring (20) sleeved on the slide rod (17), and two ends of the telescopic spring (20) are fixedly connected with the mounting block (19) and the placing box (12) respectively.

5. The silicon photonic chip laser bonding apparatus of claim 3, wherein, The pressing part comprises two bent rods (21) and two pressing rods (22) fixedly installed on two sides of the fixed block (6) respectively, the surface of the bent rod (21) is provided with a slide rail, the slide rail is composed of an integral forming inclined mouth (23) and straight mouth (24), the bottom end of the two bent rods (21) is fixedly connected with the upper surface of the placing box (12) through bolts, and the ends away from each other of the two pressing rods (22) are slidably arranged in the two slide rails respectively, and the inner wall of the processing frame (2) is symmetrically fixedly installed with straight rods (25), and the two bent rods (21) are slidably sleeved on the two straight rods (25) respectively.

6. The silicon photonic chip laser bonding apparatus of claim 3, wherein, A plurality of spherical grooves are formed in the bottom of the placing box (12), and a rolling ball (26) is rollingly arranged in the spherical groove.

7. The silicon photonic chip laser bonding apparatus of claim 3, wherein, The driving assembly comprises two symmetrically vertically fixedly installed push rods (27) on the upper surface of the table body (1) and two inclined plates (28), the lower surface of the mounting block (19) is fixedly installed with connecting rods, the two inclined plates (28) are fixedly installed at the bottom ends of the two connecting rods respectively, and the two inclined plates (28) are symmetrically arranged, the surface of the inclined plate (28) is provided with a through hole (29), the top wall of the through hole (29) is provided with a rotating hole, a rotating shaft (30) is rotatably installed in the rotating hole, the top end of the rotating shaft (30) is fixedly installed with a mounting block, the mounting block is connected with the inclined plate (28) through an elastic component, the bottom end of the rotating shaft (30) is fixedly installed with a rotating plate (31), the rotating direction of the rotating plate (31) is limited through a limiting component, and the two through holes (29) correspond to the positions of the two push rods (27) respectively.

8. The silicon photonic chip laser bonding apparatus of claim 7, wherein, The elastic component comprises a torsion spring (32) sleeved on the rotating shaft (30), and two ends of the torsion spring (32) are fixedly connected with the mounting block and the inclined plate (28) respectively.

9. The silicon photonic chip laser bonding apparatus of claim 7, wherein, The limiting component comprises a limiting rod (33) vertically fixedly installed at the top end of the rotating plate (31), the top wall of the through hole (29) is provided with an arc-shaped limiting hole (34) with the rotating shaft (30) as the center, and the limiting rod (33) is slidably arranged in the limiting hole (34).

10. The silicon photonic chip laser bonding apparatus of claim 1, wherein, The surface of the processing frame (2) is symmetrically rotatably connected with a frame door (35), the surface of the frame door (35) is provided with an observation hole, and the observation hole is embedded with a transparent glass (8).

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