Semiconductor centering mechanism and semiconductor bonding equipment

Abstract

The invention relates to a semiconductor centering mechanism and a bonding device. The centering mechanism comprises a bearing assembly; a driving assembly; the centering assembly comprises two sets of centering parts symmetrically arranged on the two sides of the bearing platform, and each set of centering parts comprises a sliding part arranged on one side of the bearing platform, an arc-shaped abutting part capable of sliding along the sliding part, an abutting connecting rod connected with the driving assembly and a rolling wheel located between the abutting connecting rod and the arc-shaped abutting part; the roller is always propped against the propping connecting rod; the side, facing the rolling wheels, of the abutting connecting rod is provided with an abutting face, a preset distance exists between the abutting faces of the two centering parts, and the preset distance is gradually reduced from top to bottom, so that when the driving assembly drives the abutting connecting rod to move upwards, the preset distance is gradually reduced, and the arc-shaped abutting part can move the cabinet in the direction close to the bearing platform; the wafer and bonding sheet centering mechanism is simple in structure and high in centering precision, and does not cause fragments to the wafer and the bonding sheet.

Description

[Technical Field]

[0001] This application relates to a semiconductor alignment mechanism and a semiconductor bonding device, belonging to the field of semiconductor processing technology. [Background Technology]

[0002] With the continuous development of the semiconductor industry, the demand for integration and performance of very large-scale integrated circuits (VLSI) is gradually increasing to adapt to the trend of electronic products becoming smaller and more powerful. However, this trend of increasing chip functionality and integration also brings increasingly higher technical requirements to various stages of the manufacturing process. The integration density of transistors within chips is gradually reaching its limit, leading to the emergence of 3D integrated circuit (IC) technology. 3D integrated circuits are defined as a system-level integrated structure. Through bonding processes, 3D integrated circuits achieve vertical interconnection between multiple chips, increasing chip space, improving transistor integration density, and simultaneously increasing the operating speed and reducing power consumption. Therefore, during wafer processing, the wafer and bonding wafer need to be aligned vertically for bonding, which is crucial for subsequent process steps and the performance of the final product.

[0003] Wafer bonding technology refers to the process of tightly joining two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical interactions. After bonding, the atoms at the interface react under external forces to form covalent bonds, achieving a specific bonding strength. The alignment accuracy between the wafer and the bonding sheet determines whether the various process parameters of the bonded wafer pair meet the requirements, directly affecting subsequent process flows.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. [Summary of the Invention]

[0005] In view of this, this application provides a semiconductor alignment mechanism to address at least one problem existing in the prior art, for aligning a wafer and a bonding wafer located on a support platform; the alignment mechanism includes:

[0006] A receiving component is disposed on one side of the support platform, capable of receiving the wafer / bonding sheet and moving it relative to the support platform;

[0007] A drive component, connected to the receiving component, is used to drive the receiving platform to move in the height direction;

[0008] The centering component includes two sets of centering parts symmetrically arranged on both sides of the bearing platform. Each set of centering parts includes a sliding part arranged on one side of the bearing platform, an arc-shaped abutment that can slide along the sliding part, an abutment connecting rod connected to the drive component, and a roller located between the abutment connecting rod and the arc-shaped abutment. The roller always abuts against the abutment connecting rod.

[0009] The abutting connecting rod has an abutting surface on the side facing the roller, and there is a preset distance between the abutting surfaces of the two centering components, which gradually decreases from top to bottom.

[0010] Optionally, in the above-described semiconductor centering mechanism, the arc-shaped abutment can be driven by the driving component to have a first state and a second state;

[0011] The drive component drives the abutment connecting rod to move downward, the preset distance gradually increases, the arc-shaped abutment switches from the first state to the second state, and the arc-shaped abutment moves in a direction away from the bearing platform;

[0012] The drive component drives the abutment connecting rod to move upward, the preset distance gradually decreases, the arc-shaped abutment switches from the second state to the first state, and the arc-shaped abutment moves toward the direction closer to the bearing platform.

[0013] Optionally, in the semiconductor alignment mechanism described above, the abutting surface includes at least a first stage and a second stage from top to bottom. The preset distance at the first stage gradually decreases, the preset distance at the second stage is equal at all points, and the preset distance at the second stage tends to be consistent with the diameter of the wafer / bonding sheet.

[0014] Optionally, in the above-described semiconductor centering mechanism, each of the arc-shaped abutments includes at least two abutment surfaces, and the at least two abutment surfaces are arranged in a stepped manner in height.

[0015] Optionally, in the semiconductor centering mechanism described above, each of the abutting surfaces is provided with at least two protrusions.

[0016] Optionally, in the above-described semiconductor alignment mechanism, the driving component includes a driving member and a mounting plate connected to the driving member, and the receiving component and the abutment connecting rod are respectively detachably connected to the mounting plate.

[0017] Optionally, in the semiconductor alignment mechanism described above, the sliding part includes a slide rail disposed on one side of the support platform and a slider disposed on the arc-shaped abutment, the slider being adapted to the slide rail.

[0018] Optionally, the semiconductor alignment mechanism described above further includes a cover located below the support platform, with a receiving space formed between the cover and the support platform, and at least a portion of the receiving component, driving component, and alignment component located within the receiving space.

[0019] This application also discloses a semiconductor bonding apparatus, comprising:

[0020] A support platform for placing wafers and bonding wafers;

[0021] A semiconductor alignment mechanism for aligning wafers and bonding wafers placed on the carrier platform;

[0022] The bonding mechanism is capable of bonding aligned wafers and bonding sheets;

[0023] Wherein, the semiconductor alignment mechanism is any one of the semiconductor alignment mechanisms described above.

[0024] Optionally, the semiconductor bonding apparatus described above further includes a drive cylinder connected to the bonding mechanism, the drive cylinder being capable of driving the bonding mechanism to move closer to or away from the support platform.

[0025] Compared with the prior art, this application has the following advantages: By symmetrically arranging two sets of alignment components, each set of alignment components includes a sliding part disposed on one side of the support platform, an arc-shaped abutment that can slide along the sliding part, an abutment connecting rod connected to the drive assembly, and a roller located between the abutment connecting rod and the arc-shaped abutment. The roller always abuts against the abutment connecting rod, and the abutment connecting rod has an abutment surface on the side facing the roller. There is a preset distance between the abutment surfaces of the two alignment components that gradually decreases from top to bottom, so that when the drive assembly drives the abutment connecting rod to move upward, the preset distance gradually decreases, and the arc-shaped abutment can move towards the direction closer to the support platform, thereby aligning the wafer and the bonding wafer. This alignment mechanism has a simple structure, high alignment accuracy, and will not cause fragmentation of the wafer and the bonding wafer. [Attached Image Description]

[0026] Figure 1 This is a schematic diagram of the semiconductor bonding device of this application;

[0027] Figure 2 for Figure 1 A cross-sectional view of the semiconductor bonding device shown.

[0028] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0029] Figure 4 for Figure 1 A cross-sectional view of the semiconductor bonding device shown from another direction;

[0030] Figure 5 for Figure 4 A magnified view of a portion of the image.

[0031] in,

[0032] 1- Supporting platform;

[0033] 2- Bonding mechanism;

[0034] 3-Alignment mechanism, 31-Receiving component, 32-Drive component, 321-Driver, 322-Mounting plate, 33-Alignment component, 331-Sliding part, 332-Arc-shaped support component, 3321-Supporting surface, 3322-Protrusion, 333-Abutting connecting rod, 3331-Abutting surface, 3332-First stage, 3333-Second stage, 334-Roller, 34-Cover;

[0035] 4-Drive cylinder.

Detailed Implementation Methods

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0037] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0038] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] Please see Figures 1 to 5As shown in the preferred embodiment of this application, a semiconductor bonding apparatus is used for bonding wafers and bonding wafers. The bonding apparatus includes a carrier platform 1 for placing the wafers and bonding wafers, a semiconductor alignment mechanism 3 for aligning the wafers and bonding wafers placed on the carrier platform 1, a bonding mechanism 2, and a drive cylinder 4 connected to the bonding mechanism 2. After the wafers and bonding wafers are placed on the carrier platform 1, the alignment mechanism 3 aligns the wafers and bonding wafers, and the drive cylinder 4 drives the bonding mechanism 2 to move closer to the carrier platform 1 until the bonding mechanism 2 aligns with the carrier platform 1, thus achieving bonding of the wafers and bonding wafers. After bonding is completed, the drive cylinder 4 drives the bonding apparatus to move away from the carrier platform 1, facilitating the removal of the bonded wafers and bonding wafers.

[0040] In this embodiment, the centering mechanism 3 includes a receiving component 31 disposed on one side of the support platform 1, a driving component 32 connected to the receiving component 31, and a centering component 33. The receiving component 31 is used to receive the wafer / bonded wafer grasped by the robotic arm and is driven by the driving component 32 to move relative to the support platform 1 in the height direction, thereby placing the wafer and the bonded wafer onto the support platform 1 in sequence.

[0041] In an optional embodiment, the centering assembly 33 includes two sets of centering components symmetrically arranged on both sides of the support platform 1, that is, the two sets of centering components are arranged on both sides along the central axis of the support platform 1. The two sets of centering components have the same structure, so only one set of centering components will be described in this embodiment.

[0042] Each set of centering components includes a sliding part 331 disposed on one side of the support platform 1, an arc-shaped abutment 332 that can slide along the sliding part 331, an abutment connecting rod 333 connected to the drive assembly 32, and a roller 334 located between the abutment connecting rod 333 and the arc-shaped abutment 332. The roller 334 is always in contact with the abutment connecting rod 333. The abutment connecting rod 333 has an abutment surface 3331 on the side facing the roller 334. There is a preset distance between the abutment surfaces 3331 of the two sets of centering components. The preset distance gradually decreases from top to bottom. It can also be understood that the abutment surface 3331 is not a straight surface, but has a stepped shape.

[0043] Specifically, the arc-shaped support member 332 can be driven by the drive assembly 32 to have a first state and a second state. When the drive assembly 32 drives the connecting rod 333 to move downward, the preset distance gradually increases, and the arc-shaped support member 332 switches from the first state to the second state. The arc-shaped support member 332 moves away from the support platform 1, and the arc-shaped support member 332 disengages from the wafer / bonded wafer on the support platform 1. When the drive assembly 32 drives the connecting rod 333 to move upward, the preset distance gradually decreases, and the arc-shaped support member 332 switches from the second state to the first state. The arc-shaped support member 332 moves towards the support platform 1 to hold and center the wafer / bonded wafer that has shifted position.

[0044] To prevent the arc-shaped support member 332 from moving excessively towards the support platform 1 and causing fragmentation of the wafer / bonding sheet, in this embodiment, the abutment surface 3331 is configured to include a first stage 3332 and a second stage 3333 from top to bottom. The preset distance at the first stage 3332 gradually decreases, while the preset distance at the second stage 3333 is equal at all points, and the preset distance at the second stage 3333 tends to be consistent with the diameter of the wafer / bonding sheet.

[0045] This can be understood as the abutting surface 3331 of the first stage 3332 and the abutting surface 3331 of the second stage 3333 forming an angle. In this embodiment, the angle of this abutting surface is not specifically limited, but is determined according to the actual situation, as long as the above effect can be achieved.

[0046] In an optional embodiment, the arc-shaped support member 332 includes a support surface 3321, and each support surface 3321 is provided with at least two protrusions 3322. When the component aligns the wafer / bonded sheet, the arc-shaped support member 332 drives the protrusions 3322 to contact the wafer / bonded sheet, thereby achieving alignment of the wafer / bonded sheet. The purpose of providing the protrusions 3322 is to reduce the contact area with the wafer / bonded sheet, thereby reducing contamination of the wafer / bonded sheet and ensuring its cleanliness.

[0047] In an optional embodiment, the sliding part 331 includes a slide rail disposed on one side of the support platform 1 and a slider disposed on the arc-shaped support member 332, the slide rail and the slider being adapted to each other. When the drive assembly 32 drives the abutment connecting rod 333 to move up and down, it can drive the arc-shaped support member 332 to move in a direction away from or towards the support platform 1 under the action of the slide rail and the slider, thereby reducing friction and achieving a labor-saving effect.

[0048] In an optional embodiment, the centering structure further includes a cover 34 located below the support platform 1, forming an accommodating space between the cover 34 and the support platform 1. At least a portion of the aforementioned receiving component 31, drive component 32, and centering component 33 are located within this accommodating space. This can be understood as the connection points between the receiving component 31 and the drive component 32, and the connection points between the abutment connecting rod 333 of the centering component 33 and the drive component 32, being located within this accommodating space to prevent dust from contacting the connections and causing jamming or other issues when the receiving component 31 or the abutment connecting rod 333 moves up and down.

[0049] In this embodiment, the driving assembly 32 includes a driving member 321 and a mounting plate 322 connected to the driving member 321. The mounting plate 322 is located within the aforementioned receiving space. The receiving assembly 31 and the abutment connecting rod 333 are detachably connected to the mounting plate 322 to facilitate adjustment of the holding space between the multiple receiving assemblies 31, thereby accommodating wafers / bonded wafers of different specifications. Correspondingly, each arc-shaped abutment member 332 includes at least two abutment surfaces 3321, which are arranged in a stepped manner in height.

[0050] In this embodiment, 4-inch and 6-inch wafers / bonding sheets can be aligned and bonded. In other embodiments, the specifications of the wafers / bonding sheets are not specifically limited. If it is necessary to replace the target wafer / bonding sheet, the holding space between the multiple receiving components 31 and the position of the abutment connecting rod 333 relative to the support platform 1 can be adjusted manually. The replacement process will not be described in detail here.

[0051] In summary, the working process of the semiconductor bonding device shown in this invention is as follows:

[0052] The drive cylinder drives the bonding mechanism away from the centering mechanism. The robot arm picks up the wafer / bonded piece and moves it above the receiving assembly. The drive assembly simultaneously raises the receiving assembly and the abutment connecting rod. The robot arm places the wafer / bonded piece on the receiving assembly. Then, the drive assembly simultaneously lowers the receiving assembly and the abutment connecting rod until the wafer / bonded piece is placed on the support platform. During the descent of the wafer / bonded piece, the first stage abutment surface on the abutment connecting rod abuts against the roller. Since the first stage abutment surface is inclined, the arc-shaped abutment is driven and gradually moves towards the support platform. The preset distance between the two arc-shaped abutment components gradually decreases. The initial alignment of the wafer / bonded wafer continues until the second stage, when the abutting surface meets the roller. During this time, the preset distance between the two arc-shaped abutting members remains constant, aligning with the diameter of the wafer / bonded wafer. This completes the alignment. Next, the drive cylinder drives the bonding mechanism to dock with the support platform, enabling the bonding process of the wafer and bonded wafer. After bonding, the drive cylinder again drives the bonding mechanism away from the support platform. The drive assembly then drives the support assembly and the abutting connecting rod to rise, allowing the arc-shaped abutting members to reset under the action of the return spring, increasing the preset distance to facilitate the alignment and bonding of the next wafer / bonded wafer.

[0053] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A semiconductor alignment mechanism, characterized in that, For aligning wafers and bonding pads located on a carrier platform; the alignment mechanism includes: A receiving component is disposed on one side of the support platform, capable of receiving the wafer / bonding sheet and moving it relative to the support platform; A drive component, connected to the receiving component, is used to drive the receiving platform to move in the height direction; The centering component includes two sets of centering parts symmetrically arranged on both sides of the bearing platform. Each set of centering parts includes a sliding part arranged on one side of the bearing platform, an arc-shaped abutment that can slide along the sliding part, an abutment connecting rod connected to the drive component, and a roller located between the abutment connecting rod and the arc-shaped abutment. The roller always abuts against the abutment connecting rod. The abutting connecting rod has an abutting surface on the side facing the roller, and there is a preset distance between the abutting surfaces of the two centering components, which gradually decreases from top to bottom.

2. The semiconductor alignment mechanism as described in claim 1, characterized in that, The arc-shaped abutment can be driven by the drive assembly to have a first state and a second state; The drive component drives the abutment connecting rod to move downward, the preset distance gradually increases, the arc-shaped abutment switches from the first state to the second state, and the arc-shaped abutment moves in a direction away from the bearing platform; The drive component drives the abutment connecting rod to move upward, the preset distance gradually decreases, the arc-shaped abutment switches from the second state to the first state, and the arc-shaped abutment moves toward the direction closer to the bearing platform.

3. The semiconductor alignment mechanism as described in claim 1, characterized in that, The contact surface includes at least a first stage and a second stage from top to bottom. The preset distance at the first stage gradually decreases, the preset distance at the second stage is equal at all points, and the preset distance at the second stage tends to be consistent with the diameter of the wafer / bonded wafer.

4. The semiconductor alignment mechanism as described in claim 1, characterized in that, Each of the arc-shaped abutments includes at least two abutment surfaces, which are arranged in a stepped manner in height.

5. The semiconductor alignment mechanism as described in claim 4, characterized in that, Each of the abutment surfaces is provided with at least two protrusions.

6. The semiconductor alignment mechanism as described in claim 1, characterized in that, The drive assembly includes a drive component and a mounting plate connected to the drive component, and the receiving component and the abutment connecting rod are respectively detachably connected to the mounting plate.

7. The semiconductor alignment mechanism as described in claim 1, characterized in that, The sliding part includes a slide rail disposed on one side of the bearing platform and a slider disposed on the arc-shaped support member, the slider being adapted to the slide rail.

8. The semiconductor alignment mechanism as described in claim 1, characterized in that, The centering structure also includes a cover located below the support platform, with a receiving space formed between the cover and the support platform, and at least a portion of the receiving component, the driving component, and the centering component located within the receiving space.

9. A semiconductor bonding apparatus, characterized in that, include: A support platform for placing wafers and bonding wafers; A semiconductor alignment mechanism for aligning wafers and bonding wafers placed on the carrier platform; The bonding mechanism is capable of bonding aligned wafers and bonding sheets; Wherein, the semiconductor alignment mechanism is the semiconductor alignment mechanism according to any one of claims 1-8.

10. The semiconductor bonding apparatus as claimed in claim 9, characterized in that, The bonding device also includes a drive cylinder connected to the bonding mechanism, the drive cylinder being able to drive the bonding mechanism closer to or further away from the support platform.

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