High-power phased-array antenna integrated heat dissipation system

Abstract

The invention provides an integrated heat dissipation system for a high-power phased-array antenna. The integrated heat dissipation system comprises a platform heat dissipation surface, an externally-pasted heat pipe, an internal heat pipe and a heat collection plate, internal components of the phased-array antenna collect and export heat through the internal heat pipe, the T / R assembly is thermally coupled with the internal heat pipe, and the space between the T / R assembly and the internal heat pipe is filled with heat-conducting silicone grease. The parts, extending out of the two sides of the phased-array antenna, of the plurality of internal heat pipes are embedded in the heat collecting plate, and heat conducting filler is filled between the contact surfaces of the internal heat pipes and the heat collecting plate; the plurality of externally-pasted heat pipes are sequentially arranged and are orthogonally coupled with the parts, extending out of the two sides of the phased-array antenna, of the internal heat pipes respectively, and heat-conducting silicone grease is filled between the externally-pasted heat pipes and the internal heat pipes; the two sides of each row of externally-attached heat pipes are coupled with the platform heat dissipation face of the platform radiator respectively, and heat is transmitted to the platform heat dissipation face.

Description

Technical Field

[0001] This invention belongs to the field of thermal control technology for high-orbit spacecraft and proposes an integrated heat dissipation system for high-power phased array antennas. Background Technology

[0002] With the development of phased array antenna technology, the functional integration of components has continuously improved. This has led to a continuous increase in the heat flux density of its core component, the T / R assembly, and the overall heat dissipation of the phased array antenna has risen from the hundreds of watts to the kilowatts. The heat flux density of the T / R assembly of the satellite main payload phased array antenna is 0.21 W / cm². 2 ~0.34W / cm 2 The total heat consumption outside the cabin reaches 2kW.

[0003] If the traditional thermal control scheme is followed, with the external payload and the entire satellite being thermally insulated, the external payload will transfer heat to an independent radiator for heat dissipation through heat transfer methods such as externally attached heat pipes. However, this would require a significant amount of weight and resources for telemetry channels for the individual unit.

[0004] If heat is dissipated through the platform's heat dissipation surface, the setting of the thermal interface between the stand-alone machine and the platform will require each to have a margin in the design, thereby increasing the resource consumption of the stand-alone machine and the platform.

[0005] Given the current limited resources of the entire satellite, how to adopt a better thermal control scheme to solve the problem of heat dissipation of high heat-consuming payloads outside the cabin under the premise of limited resources requires an integrated coupling design of the payload and the platform. Summary of the Invention

[0006] The technical problem to be solved by this invention is: This invention provides an integrated heat dissipation system for a high-power phased array antenna. Considering both resource optimization and heat transfer enhancement, the heat dissipation of the phased array is optimized along the entire heat transfer link. Through passive thermal control methods and integrated thermal coupling design of the payload and satellite platform, the thermal control weight is further reduced and heat transfer is enhanced while ensuring the long life and high reliability of the satellite.

[0007] The technical solution adopted in this invention is: an integrated heat dissipation system for a high-power phased array antenna, comprising: a platform heat dissipation surface, an external heat pipe, an internal heat pipe, and a heat collection plate;

[0008] The internal components of the phased array antenna collect and dissipate heat through internal heat pipes. The T / R assembly is thermally coupled to the internal heat pipes, and thermally conductive silicone grease is filled between the T / R assembly and the internal heat pipes. Several internal heat pipes extend from both sides of the phased array antenna and are embedded in the heat collection plate. Thermally conductive filler is filled between the contact surfaces of the internal heat pipes and the heat collection plate.

[0009] Several external heat pipes are arranged in sequence and orthogonally coupled to the portions of the internal heat pipes extending from both sides of the phased array antenna. Thermally conductive silicone grease is filled between the external heat pipes and the internal heat pipes. The two sides of each row of external heat pipes are coupled to the heat dissipation surface of the platform radiator to transfer heat to the platform heat dissipation surface.

[0010] Furthermore, the mounting surfaces of several internal heat pipes and T / R components should be kept in the same plane, and the overall flatness should be better than 0.2mm.

[0011] Furthermore, the internal heat pipe mounting surface of the T / R module must be kept in the same plane as the internal heat pipe mounting surface in the heat collector plate, with a global flatness of less than or equal to 0.2 mm.

[0012] Furthermore, the upper surface of the internal heat pipe after installation is on the same mounting surface, with a global flatness of less than or equal to 0.2 mm.

[0013] Furthermore, on the heat collector plate, each external heat pipe is installed on the heat collector plate by several clamps and is perpendicular to the internal heat pipe embedded in the heat collector plate. The clamps press the external heat pipe body tightly. Several clamps are distributed along the external heat pipes, with one clamp for each internal heat pipe. Silicone rubber is coated between the clamps and the external heat pipes.

[0014] Furthermore, if the gap between the clamp and the external heat pipe body is less than or equal to 0.1mm, the thickness of the silicone rubber coating between the upper surface of the external heat pipe and the clamp is increased; if the gap between the clamp and the external heat pipe body is greater than 0.1mm, an adjusting shim is installed between the clamp and the external heat pipe, and the two sides of the adjusting shim are coated with silicone rubber to ensure that the clamp presses tightly against the external heat pipe body.

[0015] Furthermore, the external heat pipe is coupled to the outer surface of the platform radiator compartment, and the external heat pipe is coupled to the platform heat dissipation surface at a set coupling length; a set of screws is pre-embedded at set intervals on the inner surface of the compartment, and the fins on both sides of the external heat pipe are pressed by pressure plates at the screws, and thermally conductive gel is filled between the external heat pipe and the platform radiator compartment.

[0016] Furthermore, a stainless steel-based CCAg flexible thermal control film coating is pasted on the outer surface of the external heat pipe installed on the platform heat dissipation surface to compensate for the heat dissipation area at the platform compartment plate that is blocked.

[0017] Furthermore, the platform radiator compartment is equipped with mutually perpendicular Z-direction and X-direction pre-embedded heat pipes. The Z-direction pre-embedded heat pipes are located at the same position as the external heat pipes installed on the outer surface of the compartment. In areas where they do not overlap, pre-embedded aluminum blocks are used to increase the heat conduction between the external heat pipes and the X-direction pre-embedded heat pipes.

[0018] Furthermore, the phased array antenna collects heat through an internal heat pipe and conducts the heat to the heat collection plate and the external heat pipe, which then transfers the heat to the platform's heat dissipation surface.

[0019] The advantages of this invention compared to the prior art are:

[0020] (1) This invention can be used to solve the heat dissipation problem of resource shortage and high temperature control requirements faced by high heat dissipation loads outside the cabin. It proposes an integrated coupling design scheme of load and platform, which makes full use of the heat dissipation surface of the platform and reduces or eliminates the need for separate heat radiators, thereby reducing the weight of thermal control, reducing assembly difficulty and reducing the impact on platform layout; it breaks the thermal interface setting between load and platform, and no longer leaves separate margins for load and platform; it minimizes the contact thermal resistance between heat source and heat dissipation surface in the heat transfer path; it adopts passive temperature control methods, which can adapt to the high and low temperature conditions of the whole satellite in orbit, and has high reliability.

[0021] (2) In this invention, the internal heat pipe is directly thermally coupled to the T / R component and the external heat pipe, which further reduces the interfacial thermal resistance on the heat transfer path and increases the heat transfer capacity of the system. Multiple external heat pipes can be coupled to the north and south heat dissipation surfaces of the platform compartment at the same time through the internal heat pipes of the same phased array. The internal heat pipes of the phased array, as the intermediate link of heat exchange, play the role of north-south coupling of the satellite compartment, which indirectly increases the heat dissipation capacity of the whole satellite.

[0022] (3) The installation process of the internal heat pipe and related components in this invention is used to enhance the contact heat exchange effect. The global flatness requirement of the mounting surface of the T / R component and the internal heat pipe should be better than 0.2mm, which can ensure good contact heat exchange effect between the T / R component and the internal heat pipe; the upper surface of the internal heat pipe after installation is on the same mounting surface, with a global flatness of 0.2mm. The negative tolerance of the mounting boss of the heat collector plate ensures good coupling and contact heat exchange between the external heat pipe and multiple internal heat pipes, and also plays a role in temperature uniformity of the internal heat pipe.

[0023] (4) The coupling method between the external heat pipe and the platform radiating heat dissipation surface in this invention is used to enhance heat transfer. The Z-direction heat pipe inside the cabin plate coincides with the external heat pipe. In areas where they do not coincide, pre-embedded aluminum blocks are used instead of aluminum honeycomb filling to increase the thermal conductivity between the external heat pipe and the X-direction pre-embedded heat pipe. Ultimately, this increases the heat transfer capacity of the entire heat dissipation system. The external heat pipe is attached to the outer surface of the platform cabin plate radiator, reducing the assembly difficulty during the final assembly stage and not affecting the layout of equipment inside the cabin. A stainless steel-based CCAg flexible thermal control film coating is pasted on the outer surface of the external heat pipe, simplifying thermal control implementation and compensating for the area loss of the heat dissipation surface covered by the external heat pipe. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the heat transfer path of the phased array antenna of the present invention;

[0025] Figure 2 This is a schematic diagram of the external heat pipe installation of the phased array antenna of the present invention;

[0026] Figure 3 This is a schematic diagram of the phased array antenna assembly of the present invention;

[0027] Figure 4 This is a schematic diagram of the heat pipe installation on the side of the radiation compartment panel of the platform of the present invention.

[0028] 1-Platform heat dissipation surface, 11-Z-Pre-embedded heat pipe, 12-X-Pre-embedded heat pipe, 13-Pre-embedded aluminum block.

[0029] 2-External heat pipe, 21-External heat pipe compartment side pressure plate, 22-External heat pipe compartment side fixing screw, 23-External heat pipe compartment side thermal conductive filler, 24-External heat pipe compartment side thermal control coating.

[0030] 3-Phase array antenna; 31-Phase array internal heat pipe; 32-Thermoconductive filler at the interface between the phased array internal heat pipe and the external heat pipe; 33-Phase array side mounting screw; 34-Adjusting shim; 35-Phase array side clamp; 36-Phase array heat collector plate; 37-Phase array power supply. Detailed Implementation

[0031] The present invention will be described in conjunction with the accompanying drawings.

[0032] like Figure 1 , Figure 2 As shown, a high-power phased array antenna integrated heat dissipation system includes: a platform heat dissipation surface 1, an external heat pipe 2, an internal heat pipe 31, and a heat collection plate 36.

[0033] (1) Heat collection

[0034] The phased array antenna 3 is a highly integrated electronic device. The internal components collect and dissipate heat through internal heat pipes 31. The T / R assembly is directly thermally coupled to the internal heat pipes 31, and thermally conductive silicone grease is filled between the T / R assembly and the internal heat pipes 31. The internal heat pipes 31 extend from the phased array body to the heat collection plate 36. The heat collection plate 36 has a certain width and is adapted according to the specific size of the phased array. The phased array adopts a groove design to embed the internal heat pipes 31 into the heat collection plate 36. The contact surface between the internal heat pipes 31 and the heat collection plate 36 needs to be filled with thermally conductive filler to ensure good heat exchange between the internal heat pipes 31 and the heat collection plate 36.

[0035] (2) Heat transfer and dissipation

[0036] The external heat pipe 2 is directly orthogonally coupled to the internal heat pipe 31, and heat is transferred to the heat dissipation surface 1 of the platform through the external heat pipe 2. By orthogonally coupling the external heat pipe 2 to the multiple internal heat pipes 31 of the heat collection plate 36, the temperature uniformity among the internal heat pipes 31 is improved, thereby ensuring the temperature uniformity among the modules of the T / R component.

[0037] On the side of the heat collector plate 36: thermally conductive silicone grease 32 is filled between the external heat pipe 2 and the internal heat pipe 31; every other internal heat pipe 31, the external heat pipe 2 and the heat pipe mounting boss on the heat collector plate 36 (boobs are formed on both sides of the groove on the heat collector plate 36 where the internal heat pipe 31 is mounted) are fastened by clamps 35 and screws 33, with the clamps 35 pressing the body of the external heat pipe 2;

[0038] Platform radiator side: External heat pipe 2 is coupled to the outer surface of the platform radiator to transfer heat to the platform's heat dissipation surface. External heat pipe 2 and platform heat dissipation surface 1 need to have a certain coupling length. External heat pipe 2 is attached to the outer surface of the platform compartment plate. An M4mm screw is pre-embedded approximately every 160mm on the inner surface of the compartment plate. The heat pipe fins are pressed together at screw 22 by pressure plates 21. Thermal conductive gel 23 is filled between external heat pipe 2 and the platform compartment plate to prevent thermal grease from seeping onto the platform heat dissipation surface 1. A stainless steel-based CCAg flexible thermal control film coating 24 is adhered to the outer surface of external heat pipe 2 to compensate for the heat dissipation area at the obstructed platform compartment plate. The Z-axis heat pipe 11 inside the platform compartment plate coincides with the external heat pipe 2. In areas where there is no overlap, pre-embedded aluminum blocks 13 are used to increase the thermal conductivity between external heat pipe 2 and the X-axis pre-embedded heat pipe 12, as shown in the schematic diagram. Figure 4 As shown.

[0039] Multiple external heat pipes 2 can be coupled to the south and north heat dissipation surfaces of the platform panel through the same set of internal heat pipes 31 of the phased array, or coupled to both the north and south heat dissipation surfaces simultaneously. The internal heat pipes 31 of the phased array serve as an intermediate link for heat exchange, achieving the effect of north-south coupling of the satellite panel and indirectly increasing the overall heat dissipation capacity of the satellite.

[0040] The entire heat transfer path is controlled by passive thermal management methods.

[0041] Example:

[0042] Phased array side:

[0043] like Figure 3 As shown, the internal heat pipes 31 should be placed horizontally between the T / R components, with both ends extending out of the antenna body and embedded in the heat collector plate 36. Thermal grease is used to fill the spaces between the internal heat pipes 31 and the transmitting components and the heat collector plate 36. Before filling, the contact surfaces of the transmitting components, the heat collector plate 36, and the internal heat pipes 31 must be cleaned and dried. Then, thermal grease is evenly applied to the contact surfaces of the T / R components, the heat collector plate 36, and the internal heat pipes 31, making the surfaces as smooth as possible. The total thickness of the thermal grease should not exceed 0.2 mm. The portion of the internal heat pipe 31 extending out of the heat collector plate 36 and the portion not in contact with other components do not require thermal grease application.

[0044] Place the internal heat pipe 31 horizontally in the channel of the heat collector plate 36, aligning the heat pipe mounting holes on the phased array antenna 3 with the mounting holes on the heat collector plate 36. After the two surfaces align, gently shake the heat pipe back and forth and side to side by hand to fill the contact surfaces with thermal grease. Then install the positioning screws of the internal heat pipe 31, tightening them gradually in a symmetrical manner to ensure even force distribution on the internal heat pipe 31. Finally, install the transmitting assembly, ensuring a tight fit between the T / R assembly and the internal heat pipe 31.

[0045] To ensure that the internal heat pipe 31 can fit tightly with the heat collector plate 36 and the T / R assembly and achieve high heat conduction efficiency, certain requirements need to be put forward for the installation of related components: (1) The heat pipe direct contact parts of the phased array antenna and the heat pipe mounting surface of the heat collector plate 36 must be kept on the same plane, and the global flatness should be better than 0.2mm; (2) For the part of the heat pipe that extends out of the internal structure and extends to the heat collector plate 36, the upper surface of all heat pipes must be kept on the same mounting surface, and its global flatness should be better than 0.2mm. The height of the L heat pipe mounting boss on the heat collector plate 36 (used to transfer the heat dissipation of the antenna to the satellite body) is negatively tolerant (-0.05mm) relative to the height of the internal heat pipe; (3) The T / R assembly must fit tightly with the heat pipe, and the flatness of the contact surface between the T / R assembly and the heat pipe should be better than 0.2mm; (4) All other components must fit tightly together, and the specific installation must follow the requirements of the designer.

[0046] When installing the external heat pipe 2, mark the bonding area of ​​the external heat pipe 2 on the phased array internal heat pipe 31 according to the drawing requirements. At this time, the external heat pipe 2 is positioned using the mounting screw holes. Clean the mounting surface and the bonding surface of the external heat pipe within the bonding area and dry them. Fill the space between the mounting surface of the external heat pipe and the bonding area of ​​the phased array internal heat pipe with RKTL-DRZ-1 type thermal grease. After assembly, thermal grease must overflow around the bottom surface of the heat pipe. After removing the overflowing thermal grease, seal the edges with GD414 silicone rubber and tighten the screws with a test screw. When installing the external heat pipe fixing device (clamp 35), after tightening the screws, the fixing device must be pressed firmly onto the body of the external heat pipe 2. If there is a gap between the clamp 35 and the upper surface of the external heat pipe 2 body, an adjustment shim 34 of appropriate height (the thickness of the adjustment shim 34 is 0.1mm and 0.2mm) needs to be added. Apply silicone rubber to both sides of the shim to ensure that the clamp 35 presses firmly against the tube body. If the gap between clamp 35 and the heat pipe body is less than or equal to 0.1mm, increase the thickness of the silicone rubber coating between the upper surface of the external heat pipe 2 and the clamp. If the gap between clamp 35 and the heat pipe body is greater than 0.1mm, adjust shims of appropriate height (shims with thicknesses of 0.05mm, 0.1mm, and 0.2mm) must be installed, with silicone rubber applied to both sides of the shims to ensure the clamp is tightly pressed against the pipe body. The fixing screws require force measurement; the force measurement requirements should refer to the construction specifications. All screw heads are sealed with 420 adhesive dots.

[0047] Platform panel (radiative heat dissipation surface) side:

[0048] like Figure 4 As shown, before installing the external heat pipe 2 on the side of the platform compartment, clean the surface of the structural plate with gauze soaked in acetone in the pasting area, and clean the heat pipe mounting surface at the same time, and blow dry; fill the L-shaped external heat pipe 2 and the outer surface of the platform compartment with RKTL-DRNJ-1 type thermal conductive gel 23, and fix it with pressure plate 21 and screw 22.

[0049] a) Before installation, the gap between the L-shaped external heat pipe 2 and the outer surface of the north panel of the communication compartment should be measured and required to be less than 0.2mm.

[0050] b) The thickness of the thermal conductive gel 23 should be such that it fills the gap between the external heat pipe 2 and the outer surface of the compartment plate; the thickness of the thermal conductive gel 23 should be controlled to be ≤0.2mm as much as possible, and the thickness requirement of the thermal conductive gel can be relaxed according to the specific installation situation.

[0051] c) After assembly, thermally conductive gel must overflow around the bottom surface of the external heat pipe 2.

[0052] All holes on the external heat pipe are secured with screws and mounting clips. The middle and outermost holes are secured with clip 2. All screws must be tightened to ensure even pressure application. During screw installation, ensure the heat pipe does not move. The fixing screw 22 requires a force test; refer to the construction specifications for the required force. All screw heads are sealed with 420 adhesive. See details for further information. Figure 4 Indication.

[0053] The parts of this invention not described in detail are well-known to those skilled in the art.

Claims

1. A high-power phased array antenna integrated heat dissipation system, characterized in that, include: Platform heat dissipation surface (1), external heat pipe (2), internal heat pipe (31) and heat collection plate (36); The internal components of the phased array antenna (3) collect and dissipate heat through internal heat pipes (31). The T / R assembly is thermally coupled to the internal heat pipes (31), and thermally conductive silicone grease is filled between the T / R assembly and the internal heat pipes (31). The portions of several internal heat pipes (31) extending from both sides of the phased array antenna are embedded in the heat collection plate (36), and thermally conductive filler is filled between the contact surfaces of the internal heat pipes (31) and the heat collection plate (36). Several external heat pipes (2) are arranged in sequence and orthogonally coupled to the portions of the internal heat pipes (31) extending from both sides of the phased array antenna. Thermal grease is filled between the external heat pipes (2) and the internal heat pipes (31). The two sides of each row of external heat pipes (2) are coupled to the platform heat dissipation surface (1) of the platform radiator to transfer heat to the platform heat dissipation surface (1).

2. The integrated heat dissipation system for a high-power phased array antenna according to claim 1, characterized in that, Several internal heat pipes (31) are kept in the same plane as the mounting surface of the T / R assembly, and the overall flatness should be better than 0.2 mm.

3. The integrated heat dissipation system for a high-power phased array antenna according to claim 2, characterized in that, The internal heat pipe mounting surface of the T / R component must be kept in the same plane as the internal heat pipe mounting surface in the heat collector plate (36), and the global flatness is less than or equal to 0.2mm.

4. The integrated heat dissipation system for a high-power phased array antenna according to claim 3, characterized in that, The upper surface of the internal heat pipe (31) after installation is on the same mounting surface, and the global flatness is less than or equal to 0.2mm.

5. The integrated heat dissipation system for a high-power phased array antenna according to claim 1, characterized in that, On the heat collection plate (36), each external heat pipe (2) is installed on the heat collection plate (36) by several clamps (35) and is perpendicular to the internal heat pipe embedded in the heat collection plate. The clamps (35) press the body of the external heat pipe (2). Several clamps (35) are distributed along the external heat pipe (2), and one clamp (35) is set for each internal heat pipe (31). Silicone rubber is coated between the clamps (35) and the external heat pipe (2).

6. The integrated heat dissipation system for a high-power phased array antenna according to claim 5, characterized in that, If the gap between the clamp (35) and the external heat pipe (2) is less than or equal to 0.1 mm, the thickness of the silicone rubber coating between the upper surface of the external heat pipe (2) and the clamp (35) is increased; if the gap between the clamp (35) and the external heat pipe (2) is greater than 0.1 mm, an adjusting shim (34) is installed between the clamp (35) and the external heat pipe (2), and the two sides of the adjusting shim are coated with silicone rubber to ensure that the clamp (35) presses the external heat pipe body tightly.

7. The integrated heat dissipation system for a high-power phased array antenna according to claim 1, characterized in that, The external heat pipe (2) is coupled to the outer surface of the platform radiator compartment and installed with the platform heat dissipation surface (1) at a set coupling length; a set of screws are pre-embedded at a set distance on the inner surface of the compartment, and the fins on both sides of the external heat pipe (2) are pressed by the pressure plate (21) at the screws, and thermal conductive gel is filled between the external heat pipe (2) and the platform radiator compartment.

8. The integrated heat dissipation system for a high-power phased array antenna according to claim 7, characterized in that, The outer surface of the external heat pipe (2) installed on the heat dissipation surface (1) of the platform is coated with a stainless steel-based CCAg flexible thermal control film coating (24) to compensate for the heat dissipation area at the blocked platform panel.

9. The integrated heat dissipation system for a high-power phased array antenna according to claim 8, characterized in that, The platform radiator compartment is equipped with Z-direction pre-embedded heat pipes (11) and X-direction pre-embedded heat pipes (12) that are perpendicular to each other. The Z-direction pre-embedded heat pipe (11) is located at the same position as the external heat pipe (2) installed on the outer surface of the compartment. In areas where there is no overlap, the heat conduction between the external heat pipe (2) and the X-direction pre-embedded heat pipe (12) is increased by pre-embedded aluminum blocks (13).

10. A high-power phased array antenna integrated heat dissipation system according to any one of claims 1 to 9, characterized in that, The phased array antenna (3) collects heat through an internal heat pipe (31) and conducts the heat to a heat collection plate (36) and an external heat pipe (2). The external heat pipe (2) transfers the heat to the heat dissipation surface (1) of the platform.

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