Conductive colorants for electrical contacts

Abstract

A method of coating a contact to have various colors. The color may be selected to match a color of a portion of a device housing of an electronic device housing the contact. Examples alternatively provide a method of coating a contact to have a color that contrasts the color of a portion of the device housing. These methods can provide electrical contacts with low contact resistance and good corrosion and scratch resistance.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 644,879, filed May 9, 2024, which is incorporated herein by reference. Background Technology

[0003] The number of commercially available electronic devices has increased dramatically in recent years, and the pace of new device releases shows no signs of slowing down. Devices such as tablets, laptops, netbooks, desktop computers, standalone computers, smartphones, storage devices, portable media players, wearable computing devices, navigation systems, and monitors have become ubiquitous.

[0004] These electronic devices typically include one or more connector sockets through which the electronic device can provide and receive power and data. Power and data can be transmitted via cables, each end of which includes a connector insert. These connector inserts can be inserted into sockets in communication electronic devices.

[0005] In other electronic systems, contacts on the surface of a first device can directly contact contacts on a second device without the need for intermediary cables. Contacts on the surface of electronic devices can be positioned in highly visible locations. Therefore, their appearance reflects the manufacturing process and quality of the electronic device. The location of these contacts may also expose them to liquids or other substances that can cause corrosion or discoloration. Contacts on the surface of electronic devices may also be susceptible to scratches and other types of damage.

[0006] Some of these electronic devices may be very popular and can be mass-produced. Therefore, it may be desirable for these contacts to be easy to manufacture in order to meet the demand for electronic devices. It may also be desirable to reduce the consumption of resources, such as the consumption of rare or expensive materials used in their manufacture.

[0007] Therefore, what is needed are electrical contacts and methods for manufacturing them, wherein the electrical contacts have a desired appearance and low contact resistance. It may also be desirable for these contacts to have good corrosion protection and scratch resistance, and to be easy to manufacture while consuming fewer resources. Summary of the Invention

[0008] Therefore, embodiments of the present invention can provide electrical contacts and methods of manufacturing thereof, wherein the electrical contacts have a desired appearance and low contact resistance. These contacts can provide good corrosion protection and scratch resistance, and are easy to manufacture while consuming less rare or expensive materials. These contacts can be positioned on the surface of electronic devices, on the surface of connector inserts, in connector inserts on cables, in connector sockets on electronic devices, or elsewhere in connector systems.

[0009] Contacts on the surface of a device can be in a highly visible position. Therefore, embodiments of the invention can provide methods for coating contacts with various colors. The color can be selected to match the color of a portion of the device housing of the electronic device that houses the contacts. For example, the color of the contacts can be selected to match a portion of the device housing surrounding or adjacent to the contacts. This can provide an electronic device in which at least a portion of the contacts and the device housing appears to be made of the same material. This unified appearance enhances the perceived quality and value of the electronic device.

[0010] These and other embodiments of the invention may alternatively provide a method of coating contacts to provide a color that contrasts with the color of a portion of the device housing of the electronic device housing the contacts. This color may be a distinctive color that allows a user to quickly locate contacts used for mating with contacts in a second or accessory device. The contrasting color may also be chosen to indicate the source of manufacture or to match other electronic devices, such as a second or accessory device.

[0011] In these and other embodiments of the invention, the contact may have a specific finish, such as a matte or glossy finish. The color may also have a certain level of transparency. The contact may also have more than one color. For example, a logo or other distinctive, identifying, or other information may be conveyed through more than one color on the contact.

[0012] These and other embodiments of the present invention can provide electrical contacts with low contact resistance. For example, these contacts may have a textured surface comprising a plurality of posts. When the contacts mate with corresponding contacts on a second or accessory device, these posts can provide a large number of contact points between the contacts and the corresponding contacts.

[0013] In these and other embodiments of the invention, a contact substrate may be received. The contact substrate may be copper, aluminum, one of their alloys, stainless steel, or other materials. The contact substrate may be plastic with a copper layer or other material plated on its top surface. The plastic may have an affinity for the plated layer. For example, the plastic may be a thermoplastic polymer, such as acrylonitrile butadiene styrene, or other materials. An electrophoretic deposition coating may be formed on the top surface of the contact substrate. The electrophoretic deposition coating may be epoxy resin, acrylic, paint, or other materials. The electrophoretic deposition coating may include one or more pigments to provide a desired color to the electrophoretic deposition coating.

[0014] Holes can be formed in the electrophoretic deposition coating. These holes can be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, embossing, 3D printing, metal injection molding, printing, casting, or other methods. These holes can be formed through the electrophoretic deposition coating to the top surface of the contact substrate. The bottom of the holes can be plated to form several pillars, each in a corresponding hole. The pillars can have various cross-sectional shapes. For example, they can have circular, square, elliptical, rectangular, or other shaped cross-sections. The plating can be copper or other conductive materials. The plating allows the pillars to extend above the top surface of the electrophoretic deposition coating, where they can form an electrical connection with the corresponding contact when mating with a corresponding contact on a second device or accessory. That is, when the contact and its corresponding contact mate, the top surface of the pillar can form an electrical path with the corresponding contact on the corresponding connector or device. Because the pillars extend above the top surface of the electrophoretic deposition coating, the contact can also feel like metal.

[0015] One or more plating layers may be formed on the top of the pillar to help prevent or reduce damage and corrosion. For example, a copper layer may be formed to help flatten the top surface of the pillar. A nickel layer may be plated, which may be electroless nickel plating. A barrier layer may be formed, wherein the barrier layer is palladium or other materials. A top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, or other materials or combinations thereof may be plated or otherwise placed above the barrier layer. A dark rhodium layer (in which the rhodium is darkened through pores) may be plated or otherwise placed above the barrier layer. A gold glitter layer may be formed above the barrier layer before adding the top plate to improve adhesion. Plating the top of the pillar, rather than the entire top surface in contact with the substrate, significantly reduces the amount of area to be plated and helps conserve resources such as precious metals.

[0016] More generally, after forming the pillar, one or more plating layers can be applied to the surface of the pillar. For example, a top plate can be formed over the contact to provide corrosion and scratch protection. This top plate can be formed of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, or other materials or combinations thereof. The top plate can be formed of dark rhodium, where the rhodium is darkened through pores. Before forming the top plate, a barrier layer can be formed over the contact to prevent the copper substrate from discoloring the top plate. The barrier layer can be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel plating, or other materials. One or more adhesion layers can be applied before or after the barrier layer, or both. These adhesion layers can be a gold shimmer layer or other layers. Other layers may also be included. For example, before the barrier layer, layers of nickel-tungsten alloy, tin-nickel, electroless nickel plating, copper-nickel, silver, or other materials can be plated or formed over the substrate. Other combinations may be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, dark rhodium, or other materials or combinations thereof over silver, palladium, nickel, electroless nickel, nickel-tungsten alloys, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloys, which may include one or more gold layers. A gold layer over a nickel layer may also be used in these and other embodiments of the invention. After the aperture has been formed and before further plating, additional steps, such as electropolishing or copper plating, may be performed on the substrate to smooth areas damaged by the laser. In these and other embodiments of the invention, these layers may be formed by sputtering, vapor deposition, electroplating, or other methods. The order of these steps may vary in these and other embodiments of the invention.

[0017] To avoid lines or other artifacts, such as bright or dark spots, appearing in the pattern of the pillars, the pillar positions can be varied or randomized. For example, a laser can be used to vary or randomize the position information of some or all pillars to disperse straight lines or other regular or repeating patterns that might otherwise be visible. In these and other embodiments of the invention, the diameter of the pillars can be varied or randomized. Furthermore, pillars can be omitted from areas or zones on the contact where such pillars might interfere with the assembly or operation of the contact. For example, in cases where the contact is located within an injection-molded housing, pillars can be omitted from areas or zones below or near the injection-molded housing.

[0018] In these and other embodiments of the invention, a contact substrate may be received. The contact substrate may be copper, aluminum, one of their alloys, stainless steel, or other materials. The contact substrate may be plastic with a copper layer or other material plated on its top surface. The plastic may have an affinity for the plating layer. For example, the plastic may be a thermoplastic polymer, such as acrylonitrile butadiene styrene, or other materials. Several holes may be formed in the top surface of the contact substrate. These holes may be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, embossing, 3D printing, metal injection molding, printing, casting, or they may be formed by other means. The holes may have various cross-sections, such as circular, square, elliptical, rectangular, or other shaped cross-sections.

[0019] The top surface of the contact substrate may then optionally be plated with copper. A nickel layer may be plated, which may be electroless nickel plating. A barrier layer may be formed, wherein the barrier layer is palladium or other materials. A top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, dark rhodium, or other materials or combinations thereof may be placed above the barrier layer. A gold glitter layer may be formed above the barrier layer before adding the top plate to improve adhesion.

[0020] An electrophoretic deposition coating may be formed over the surface of the contact substrate. As previously mentioned, the electrophoretic deposition coating may be epoxy, acrylic, or other materials. The electrophoretic deposition coating may include pigments to provide a specific color to the contact substrate and the resulting contact. Excess electrophoretic deposition coating can then be wiped away, allowing the raised areas between the holes to form an electrical connection with corresponding contacts on a second device or accessory device.

[0021] In these and other embodiments of the invention, these steps may be performed in a different order. For example, after the holes are filled with an electrophoretic deposition coating and the excess is removed, some or all of the top plate and associated layers may be coated.

[0022] To avoid lines or other artifacts, such as bright or dark spots, in the pattern of the holes, the positions of the holes can be varied or randomized. For example, a laser can be used to vary or randomize the positional information of some or all the holes to disperse straight lines or other regular or repeating patterns that would otherwise be visible. In these and other embodiments of the invention, the diameter of the holes can be varied or randomized. Furthermore, holes can be omitted from areas or zones on the contact where such holes might interfere with the assembly or operation of the contact. For example, in cases where the contact is located within an injection-molded housing, holes can be omitted from areas or zones below or near the injection-molded housing.

[0023] While embodiments of the present invention are well-suited for electrical contacts and methods of their manufacture, these and other embodiments of the invention can be used to improve the appearance and corrosion resistance of other structures. For example, electronic device chassis and housings, connector housings and shielding, battery terminals, magnetic components, measuring and medical devices, sensors, fasteners, various parts of wearable computing devices such as clamps and strips, bearings, gears, chains, tools, or any of these parts can be covered with coatings, platings, and other layers as described herein and otherwise provided by embodiments of the invention. Coatings, platings, and other layers for these other structures can be formed or manufactured as described herein and otherwise provided by embodiments of the invention. For example, magnets and other structures for fasteners, connectors, speakers, receiver magnets, receiver magnet assemblies, microphones, and other devices can be improved by those structures and methods as shown herein and in other embodiments of the invention. Embodiments of the invention can be used in a variety of industries, including automotive, aerospace, electronics, and jewelry.

[0024] In various embodiments of the invention, the contacts and their connector assemblies can be formed from a variety of materials and in a variety of ways. For example, the contacts and other conductive parts can be formed by stamping, embossing, metal injection molding, machining, micromachining, 3D printing, or other manufacturing processes. Conductive parts can be formed from stainless steel, steel, copper, copper alloys, copper-titanium, phosphor bronze, palladium, palladium-silver, or other materials or combinations thereof, as described herein. They can be plated or coated with nickel, gold, palladium, rhodium, dark rhodium, ruthenium, or other materials, as described herein. Non-conductive parts can be formed using injection or other molding, 3D printing, machining, or other manufacturing processes. Non-conductive parts can be formed from silicon or silicone resin, polyester film, polyester tape, rubber, hard rubber, plastic, nylon, elastomer, liquid crystal polymer (LCP), ceramic, or other non-conductive materials or combinations thereof.

[0025] Embodiments of the present invention provide contacts and connector assemblies that can be located on or connected to various types of devices such as portable computing devices, tablet computers, desktop computers, laptops, standalone computers, wearable computing devices, cellular phones, smartphones, media phones, storage devices, keyboards, covers, chassis, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, chargers, and other devices. These contacts and connector assemblies provide pathways for signals conforming to various standards, such as Universal Serial Bus (USB). (HDMI), Digital Video Interface (DVI), Ethernet, DisplayPort, Thunderbolt TM , Joint Test Action Group (JTAG), Test Access Port (TAP), Directed Automatic Random Test (DART), Universal Asynchronous Receiver / Transmitter (UART), clock signals, power signals, and other types of standard, non-standard, and proprietary interfaces, and combinations thereof, that have been developed, are under development, or will be developed in the future. In various embodiments of the invention, these contacts provide interconnection paths that can be used to deliver power, ground, signals, test points, and other voltage, current, data, or other information.

[0026] Various embodiments of the present invention may include one or more of these and other features described herein. The spirit and advantages of the invention can be better understood by referring to the following detailed description and accompanying drawings. Attached Figure Description

[0027] Figure 1 An electronic system according to an embodiment of the present invention is illustrated; and

[0028] Figures 2 to 5 A method for manufacturing a contact element according to an embodiment of the present invention is illustrated;

[0029] Figures 6 to 9 Another method for manufacturing a contact element according to an embodiment of the present invention is illustrated; and

[0030] Figure 10 and Figure 11 An example of a method for avoiding visible patterns on the surface of a contact element according to an embodiment of the present invention is illustrated. Detailed Implementation

[0031] Figure 1 An electronic system according to an embodiment of the present invention is illustrated. Other included accessories... Figure 1 As such, the accompanying drawings are shown for illustrative purposes and do not limit the possible embodiments or claims of the invention.

[0032] In this example, host device 110 may be connected to accessory device 120 to share data, power, or both. Specifically, electrical contacts (or more simply, contacts) 112 on host device 110 may be electrically connected to contacts 122 on accessory device 120. Contacts 112 on host device 110 may be electrically connected to contacts 122 on accessory device 120 via cable 130. In other embodiments of the invention, contacts 112 on host device 110 may be physically in contact with and directly electrically connected to contacts 122 on accessory device 120. In yet another embodiment of the invention, one or more optical contacts (not shown) supporting one or more optical connections between host device 110 and accessory device 120 may be included in contacts 112 and 122.

[0033] To facilitate direct connection between the contacts 112 on the main unit 110 and the contacts 122 on the accessory device 120, the contacts 112 on the main unit 110 and the contacts 122 on the accessory device 120 may be located on the surface of their respective devices. However, this location may make them highly visible to the user and easily exposed to liquids, fluids, or other types of contaminants. This location may also make the contacts susceptible to scratches, damage, or other harm.

[0034] Therefore, embodiments of the present invention can provide a method for coating contacts to provide a specific color. The color can be selected to match the color of a portion of the device housing of the electronic device that houses the contacts. For example, the color of the contacts can be selected to match a portion of the device housing surrounding or adjacent to the contacts. This can provide an electronic device in which at least a portion of the contacts and the device housing appears to be made of the same material. This unified appearance can enhance the perceived quality and value of the electronic device.

[0035] These and other embodiments of the invention may alternatively provide a method of coating contacts to provide a color that contrasts with the color of a portion of the device housing of the electronic device housing the contacts. This color may be a distinctive color that allows a user to quickly locate contacts used for mating with contacts in a second or accessory device. The contrasting color may also be chosen to indicate the source of manufacture or to match other electronic devices, such as a second or accessory device.

[0036] In these and other embodiments of the invention, the contact may have a specific finish, such as a matte or glossy finish. The color may also have a certain level of transparency. The contact may also have more than one color. For example, a logo or other distinctive, identifying, or other information may be conveyed through more than one color on the contact, through the location of pillars or other raised surfaces, or a combination thereof.

[0037] These and other embodiments of the present invention can provide electrical contacts with low contact resistance. For example, these contacts may have a textured surface with a pattern of raised areas or ridges. When the contacts mate with corresponding contacts on a second or accessory device, these raised areas or ridges can provide a large number of contact points between the contacts and the corresponding contacts.

[0038] These and other embodiments of the present invention can provide electrical contacts with good corrosion and scratch resistance. For example, a coating for providing color can be applied over the surface of the contact. This coating may be distributed with conductive pillars or other protrusions that provide a degree of protection against corrosion or scratches. An example is shown in the figure below.

[0039] Figures 2 to 5A method for manufacturing a contact element according to an embodiment of the present invention is illustrated. Figure 2 In the middle, it can receive for contact 200 (which can be used as contact 112 (e.g.) Figure 1 The contact substrate 210 is shown. The contact substrate 210 can be used in the contact 122 or other contacts in other devices. The contact substrate 210 of the contact 200 can be formed of copper, copper alloy, stainless steel, aluminum, or other materials. The contact substrate 210 can be plastic with a copper layer (not shown) or other material plated on its top surface. The plastic can have an affinity for the plating layer. For example, the plastic can be a thermoplastic polymer, such as acrylonitrile butadiene styrene, or other materials. An electrophoretic deposition coating 220 can be formed on the top surface of the contact substrate. The electrophoretic deposition coating 220 can be epoxy resin, acrylic, paint, or other materials. The electrophoretic deposition coating 220 can include one or more pigments to provide a desired color to the electrophoretic deposition coating 220.

[0040] In these and other embodiments of the invention, instead of using the electrophoretic deposition coating 220, other materials, such as conductive inks or other types of inks, can be used. In these and other embodiments of the invention, coatings can be used. For example, polymer coatings, such as polytetrafluoroethylene (PTFE) based coatings, can be used. These inks or coatings can be applied using pad printing, inkjet printing, 3D printing, aerosol jet printing, or other types of printing.

[0041] exist Figure 3 In the electrophoretic deposition coating 220, a plurality of holes 310 may be formed. These holes 310 may be formed in at least a portion of one or more surfaces of the contact 200, for example, along the top side of the contact 200. These holes 310 may be formed in the electrophoretic deposition coating 220 in various ways. The holes 310 may be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, embossing, 3D printing, metal injection molding, printing, casting, or they may be formed in other ways. The holes 310 may extend to the top surface of the contact substrate 210.

[0042] exist Figure 4 In this process, several pillars 410 can be formed by plating the portion of the contact substrate 210 exposed by the holes 310. These pillars 410 can be formed of copper or other plating materials. Each pillar 410 can be formed in a corresponding hole in the holes 310. The pillars 410 can have various cross-sectional shapes. For example, the pillars 410 can have circular, square, elliptical, rectangular, or other shaped cross-sections. The pillars 410 can extend above the surrounding electrophoretic deposition coating 220 to form an electrical connection with a corresponding contact on a second device or accessory device. Because the pillars extend above the top surface of the electrophoretic deposition coating, the contact 200 can also feel like metal.

[0043] exist Figure 5In this embodiment, the top surface of the post 410 of the contact 200 may be plated with one or more plating layers 510. The plating layer 510 may include a top plate that can be formed above the post 410 to provide corrosion and scratch protection. This top plate may be formed of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, ruthenium, rhodium, or other materials or combinations thereof. The top plate may be formed of dark rhodium, wherein the rhodium is darkened through pores. Prior to forming the top plate, a barrier layer may be formed above the post 410 to prevent discoloration of the top plate by the contact substrate 210. The barrier layer may be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel plating, or other materials. One or more adhesive layers may be applied before or after the barrier layer, or both before and after the barrier layer. These adhesive layers may be a gold glitter layer or other layers. Other layers may also be included. For example, prior to the barrier layer, a layer of nickel-tungsten alloy, tin-nickel, electroless nickel plating, copper-nickel, silver, or other materials may be plated or formed on the substrate. Other combinations may be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other materials or combinations thereof above silver, palladium, nickel, electroless nickel plating, nickel-tungsten alloy, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloys, which may include one or more gold layers. In these and other embodiments of the invention, a gold layer may be used above a nickel layer. After the aperture has been formed and before plating, additional steps, such as electropolishing or copper plating, may be performed on the substrate to smooth the areas damaged by the laser. In these and other embodiments of the invention, these layers may be formed by sputtering, vapor deposition, electroplating, or other methods. By plating the plating layer 510 only on the top of the pillar 410, the area to be plated can be reduced, thereby saving resources, such as precious metals.

[0044] Figures 6 to 9 Another method for manufacturing a contact element according to an embodiment of the present invention is illustrated. Figure 6 In the middle, it can be received for contact 600 (which can be used as contact 112 (e.g.) Figure 1 The contact substrate 610 is shown. The contact substrate 610 can be used in the contact 122 or other contacts in other devices. The contact substrate 610 of the contact 600 can be formed of copper, copper alloy, stainless steel, aluminum, or other materials. The contact substrate 610 can be plastic, with a copper layer (not shown) or other material plated on its top surface. The plastic can have an affinity for the plating layer. For example, the plastic can be a thermoplastic polymer, such as acrylonitrile butadiene styrene, or other materials. Several holes 630 can be formed in the top surface of the contact substrate 610, leaving raised areas 620. The holes 630 can be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, embossing, 3D printing, metal injection molding, printing, casting, or other methods. The holes 630 can have various cross-sectional shapes. For example, the holes 630 can have circular, square, elliptical, rectangular, or other shaped cross-sections.

[0045] exist Figure 7 In this process, an optional layer, such as a copper layer 710, can be deposited on the top surface of the contact substrate 610. Figure 8 In this embodiment, the top surface of the contact substrate 610 may be plated with one or more plating layers 810. The plating layer 810 may include a top plate formed above the top surface of the contact substrate 610 to provide corrosion and scratch protection. The top plate may be formed of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other materials or combinations thereof. Prior to forming the top plate, a barrier layer may be formed above the top surface of the contact substrate 610 to prevent discoloration of the top plate by the contact substrate 610. The barrier layer may be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel plating, or other materials. One or more adhesion layers may be applied before or after the barrier layer, or both before and after the barrier layer. These adhesion layers may be a gold glitter layer or other layers. Other layers may also be included. For example, prior to the barrier layer, layers of nickel-tungsten alloy, tin-nickel, electroless nickel plating, copper-nickel, silver, or other materials may be plated or formed above the substrate. Other combinations may be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other materials or combinations thereof over silver, palladium, nickel, electroless nickel, nickel-tungsten alloys, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloys, which may include one or more gold layers. In these and other embodiments of the invention, a gold layer over a nickel layer may be used. After the apertures have been formed and before plating, additional steps, such as electropolishing or copper plating, may be performed on the substrate to smooth areas damaged by the laser. In these and other embodiments of the invention, these layers may be formed by sputtering, vapor deposition, electroplating, or other methods.

[0046] exist Figure 9 In this process, an electrophoretic deposition coating 910 may be formed on the top surface of the contact substrate 610. The electrophoretic deposition coating 910 may be epoxy resin, acrylic, paint, or other materials. The electrophoretic deposition coating 910 may include one or more pigments to provide a desired color to the electrophoretic deposition coating 910. After the electrophoretic deposition coating 910 is applied to the top surface of the contact substrate 610, excess may be wiped away to expose the raised area 620.

[0047] In these and other embodiments of the invention, these steps can be performed in a different order. For example, after the holes are filled with the electrophoretic deposition coating 910 and the excess is removed, some or all of the top plate and associated plating layer 810 can be plated. This helps to reduce the area of ​​the contacts 600 to be plated, thereby saving resources such as precious metals.

[0048] In these and other embodiments of the invention, instead of using the electrophoretic deposition coating 910, other materials, such as conductive inks or other types of inks, can be used. In these and other embodiments of the invention, coatings can be used. For example, polymer coatings, such as polytetrafluoroethylene (PTFE) based coatings, can be used. These inks or coatings can be applied using pad printing, inkjet printing, 3D printing, aerosol jet printing, or other types of printing.

[0049] Figure 10 and Figure 11 An example of a method for avoiding visible patterns on the surface of a contact element according to an embodiment of the present invention is illustrated. Figure 10 An example is illustrated by lines 1000 visible in the pattern of pillars 410 and the surrounding electrophoretic deposition coating 220. To avoid lines or other artifacts in the pattern of pillars 410, the positions of pillars 410 can be varied or randomized, or more specifically, pseudo-randomized. That is, the positions of pillars 410 formed in the electrophoretic deposition coating 220 can be varied or randomized. For example, a laser can be used to vary or randomize a portion of the positional information of some or all pillars 410 to disperse straight lines or other regular patterns that would otherwise be visible. Figure 11 In the meantime, the position or orientation of column 410 has been changed to prevent artifacts along line 1000.

[0050] Using these variations, the resulting pattern of the pillars 410 can appear randomized, and the occurrence of observable regular or repetitive lines, patterns, or bright or dark areas can be reduced. In these and other embodiments of the invention, the diameter of the pillars 410 can be varied or randomized to avoid lines, bright spots, dark spots, or other artifacts. Furthermore, pillars 410 can be omitted from areas or regions on the contact element where such pillars 410 might interfere with further assembly or operation of the contact element. For example, in cases where the contact element is located within an injection-molded housing, pillars 410 can be omitted from areas or regions below or near the injection-molded housing.

[0051] In these and other embodiments of the invention, the post 410 may be arranged to provide a texture to the contact 200, which may match or resemble the texture of the surrounding device housing (not shown). That is, the laser pattern may be adjusted so that the texture of the contact 200 provides an attractive effect when the contact 200 is placed against the surrounding material of the device housing. In these and other embodiments of the invention, the post 410 may be formed in the device housing and in the contact surface of the contact 200. In these and other embodiments of the invention, the post 410 may be arranged to provide other textures to the contact 200.

[0052] Although Figure 10 and Figure 11These concepts are explained in the context of the post 410 used for contact 200, but they can be applied to the hole 630 in contact 600.

[0053] While embodiments of the present invention are well-suited for electrical contacts and methods of their manufacture, these and other embodiments of the invention can be used to improve the appearance and corrosion resistance of other structures. For example, electronic device chassis and housings, connector housings and shielding, battery terminals, magnetic components, measuring and medical devices, sensors, fasteners, various parts of wearable computing devices such as clamps and strips, bearings, gears, chains, tools, or any of these parts can be covered with coatings, platings, and other layers as described herein and otherwise provided by embodiments of the invention. Coatings, platings, and other layers for these other structures can be formed or manufactured as described herein and otherwise provided by embodiments of the invention. For example, magnets and other structures for fasteners, connectors, speakers, receiver magnets, receiver magnet assemblies, microphones, and other devices can be improved by those structures and methods as shown herein and in other embodiments of the invention. Embodiments of the invention can be used in a variety of industries, including automotive, aerospace, electronics, and jewelry.

[0054] In these and other embodiments of the invention, additional layers having the aforementioned contacts may be included, such as barrier layers to prevent corrosion of internal structures. For example, barrier layers (such as zinc barrier layers) may be used to protect magnets or other internal structures from corrosion by means of a coating or plating layer. Catalyst layers may be used to increase the deposition rate of other layers, thereby improving the manufacturing process. These catalyst layers may be formed of palladium or other materials. Stress relief layers having the aforementioned contacts (such as those formed of copper) may also be included in these and other embodiments of the invention. Other scratch-resistant layers, passivation layers, and corrosion-resistant layers may also be included.

[0055] In various embodiments of the invention, the contacts and their connector assemblies can be formed using a variety of materials and in a variety of ways. For example, the contacts and other conductive parts can be formed by stamping, embossing, metal injection molding, machining, micromachining, 3D printing, or other manufacturing processes. Conductive parts can be formed from stainless steel, steel, copper, copper alloys, copper-titanium, phosphor bronze, palladium, palladium-silver, or other materials or combinations thereof, as described herein. They can be plated or coated with nickel, gold, palladium, rhodium, ruthenium, or other materials, as described herein. They can be plated with dark rhodium, wherein the rhodium is darkened through pores. Non-conductive parts can be formed using injection or other molding, 3D printing, machining, or other manufacturing processes. Non-conductive parts can be formed from silicon or silicone resin, polyester film, polyester tape, rubber, hard rubber, plastic, nylon, elastomer, liquid crystal polymer (LCP), ceramic, or other non-conductive materials or combinations thereof.

[0056] Embodiments of the present invention provide contacts and connector assemblies that can be positioned and connected to various types of devices such as portable computing devices, tablet computers, desktop computers, laptops, standalone computers, wearable computing devices, cellular phones, smartphones, media phones, storage devices, keyboards, covers, chassis, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, chargers, and other devices. These contacts and connector assemblies provide pathways for signals conforming to various standards, such as Universal Serial Bus (USB), High Definition Multimedia Interface (HDMI), Digital Video Interface (DVI), Ethernet, DisplayPort, Thunderbolt, etc. Joint Test Action Group (JTAG), Test Access Port (TAP), Directed Automatic Random Test (DART), Universal Asynchronous Receiver / Transmitter (UART), clock signals, power signals, and other types of standard, non-standard, and proprietary interfaces, and combinations thereof, that have been developed, are under development, or will be developed in the future. In various embodiments of the invention, these connectors provide interconnection paths that can be used to transmit power, ground, signals, test points, and other voltage, current, data, or other information.

[0057] The above description of embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive, nor is it intended to limit the invention to the precise forms described, and many modifications and variations are possible in accordance with the teachings above. These embodiments have been chosen and described to fully illustrate the principles of the invention and its practical application, thereby enabling others skilled in the art to fully utilize the invention in various embodiments and with various modifications suitable for the particular intended use. Therefore, it should be understood that the invention is intended to cover all modifications and equivalents within the scope of the following claims.

Claims

1. A method for manufacturing an electrical contact, the method comprising: Receive contact substrate; A coating layer is formed above the top surface of the contact substrate; A plurality of holes are formed in the coating layer, the holes extending to the top layer of the contact substrate; as well as The plurality of holes are plated in the top surface of the contact substrate to form a plurality of pillars.

2. The method according to claim 1, further comprising plating the top surface of each of the plurality of columns.

3. The method of claim 2, wherein the contact substrate comprises copper.

4. The method of claim 2, wherein the contact substrate comprises a plating layer over plastic.

5. The method of claim 2, wherein the coating layer comprises an electrophoretic deposition coating.

6. The method of claim 5, wherein the electrophoretic deposition coating comprises an epoxy resin.

7. The method of claim 5, wherein the electrophoretic deposition coating comprises acrylic acid.

8. The method of claim 5, wherein coating the plurality of pillars comprises coating the surface of each pillar with palladium, applying a gold glitter to the palladium, and coating the gold glitter with one of rhodium, rhodium-ruthenium, or platinum-ruthenium.

9. The method of claim 8, wherein the plurality of columns are formed at each location, wherein the location varies by a certain amount from a regular repeating pattern.

10. The method of claim 9, wherein the position of each of the plurality of columns varies by a first amount in a first direction and by a second amount in a second direction from a regular repeating pattern, wherein the first amount and the second amount vary among the plurality of columns.

11. The method of claim 9, wherein the width of the first column of the plurality of columns varies compared to the width of the second column of the plurality of columns.

12. An electrical contact for an electronic device, the electrical contact comprising: Contact substrate; The coating layer above the contact substrate has a plurality of pores; and Multiple posts, each post being formed in a corresponding hole among the multiple holes.

13. The electrical contact according to claim 12, wherein the electrical contact further comprises a plating layer on the top surface of each of the plurality of posts.

14. The electrical contact of claim 13, wherein the coating layer comprises an electrophoretic deposition coating.

15. The electrical contact of claim 14, wherein the electrophoretic deposition coating comprises a pigment such that the color of the electrical contact matches the color of the surrounding portion of the housing of the electronic device.

16. The electrical contact of claim 14, wherein the electrophoretic deposition coating comprises a pigment such that the color of the electrical contact contrasts with the color of the surrounding portion of the housing of the electronic device.

17. A method for manufacturing an electrical contact, the method comprising: Receive contact substrate; Multiple holes are formed in the top surface of the contact substrate; A coating layer is formed above the top surface of the contact substrate; as well as Remove excess coating from the top surface of the electrical contact substrate such that the coating remains in the hole in the top surface of the contact substrate.

18. The method according to claim 17, further comprising: The top surface of the contact substrate is plated before the coating layer is formed above the top surface of the contact substrate.

19. The method of claim 17, further comprising: After removing excess coating from the top surface of the contact substrate, the top surface of the contact substrate is plated.

20. The method of claim 17, wherein the coating layer comprises an electrophoretic deposition coating.

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