Cleaning method for spray-washing circuit board based on portal frame spray-washing device

Abstract

The invention provides a cleaning method for spray-washing a circuit board based on a portal frame spray-washing device. The cleaning method for spray-washing the circuit board based on the portal frame spray-washing device comprises the following steps: carrying out spray-washing treatment on the circuit board through the portal frame spray-washing device; the portal frame spray-washing device is driven by the conveying mechanism to convey the circuit board subjected to spray-washing treatment to the primary cleaning mechanism; carrying out first-time water washing treatment on the circuit board through the first-time cleaning mechanism; performing secondary washing treatment on the circuit board through the secondary cleaning mechanism, and synchronously conveying wastewater generated by the secondary washing treatment into the primary cleaning mechanism; and the circuit board is subjected to third-time water washing treatment through the third-time cleaning mechanism, and waste water generated by the third-time water washing treatment is conveyed into the first-time cleaning mechanism synchronously. According to the cleaning method for spraying and washing the circuit board based on the portal frame spraying and washing device, the water-saving performance of a surface treatment horizontal line is good, the circuit board does not need to be shaken, the liquid medicine recycling effect can be improved, and meanwhile the line arranging efficiency is improved.

Description

Technical Field

[0001] This disclosure relates to the technical field of circuit board cleaning, and in particular to a cleaning method for circuit boards based on a gantry spray cleaning device. Background Technology

[0002] A printed circuit board (PCB) is an electronic component that forms electrical connections between electronic components by patterning conductive copper foil onto the surface of an insulating material. PCBs are widely used in automotive electronics, communication equipment, medical devices, consumer electronics, industrial automation, and aerospace.

[0003] In the manufacturing process of printed circuit boards (PCBs), surface treatment is a crucial step in ensuring circuit conductivity and solderability. Common surface treatment processes in existing technologies include OSP (Organic Solderability Preservatives), immersion tin, immersion silver, immersion gold, immersion copper, and nickel-gold plating. Currently, the industry commonly uses a horizontal continuous operation method for surface treatment. The horizontal line refers to the surface treatment level. After chemical treatment, a multi-stage triple ultrapure water rinsing system is typically installed to remove residual chemicals. That is, the surface treatment level has at least three triple water rinsing structures after the chemical bath, and each triple water rinsing structure uses ultrapure water for washing.

[0004] However, due to the high purity and high cost of ultrapure water, existing water washing methods generally adopt continuous overflow treatment, which results in the ultrapure water in the later stages of the triple water washing being directly discharged into the wastewater treatment station. That is, the ultrapure water in each triple water washing structure overflows directly to the wastewater treatment station at the end, resulting in the direct discharge of a large amount of ultrapure water from the surface treatment level. This makes it difficult to recycle the large amount of ultrapure water, resulting in a large amount of waste and thus poor water-saving performance of the surface treatment level.

[0005] On the other hand, in surface treatment processes (such as immersion gold, immersion copper, copper plating, etc.) using a "gantry crane + mother basket" system (i.e., gantry frame device), when the gantry frame device lifts the circuit board from the chemical tank, the circuit board often has a large amount of chemical residue. If this chemical residue on the circuit board directly enters the tank of the next process, it will not only accelerate the contamination of the tank solution, but also reduce the accuracy of the overall process control. Therefore, in order to reduce the carry-out of chemical residue, some manufacturers set the circuit board to "shake" after lifting it in the gantry frame device operation program to achieve the requirement of chemical residue discharge. However, the shaking time is short and the chemical residue recovery effect is poor; if the shaking time is extended, it will lead to a decrease in the efficiency of the entire line. Summary of the Invention

[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a cleaning method for cleaning circuit boards based on a gantry spray washing device that improves the water-saving performance of the surface treatment level line, eliminates the need to "shake" the circuit board, enhances the chemical recovery effect, and improves the overall line efficiency.

[0007] The purpose of this disclosure is achieved through the following technical solution:

[0008] A cleaning method for circuit boards based on a gantry spray cleaning device includes:

[0009] The circuit boards are sprayed and cleaned using a gantry spray cleaning device.

[0010] The gantry spray washing device is driven by a conveying mechanism to transport the spray-washed circuit board to the first cleaning mechanism.

[0011] The circuit board is first washed with water using the first cleaning mechanism.

[0012] The conveying mechanism drives the gantry spray washing device to transport the circuit board after the first water washing treatment to the secondary cleaning mechanism.

[0013] The circuit board is subjected to a second water washing process by the secondary cleaning mechanism, and the wastewater generated from the second water washing process is simultaneously transported to the primary cleaning mechanism.

[0014] The conveying mechanism drives the gantry spray washing device to transport the circuit board after the second water washing treatment to the third cleaning mechanism.

[0015] The circuit board is subjected to a third water wash by the three-stage cleaning mechanism, and the wastewater generated from the third water wash is simultaneously transported to the first-stage cleaning mechanism.

[0016] In one embodiment, the gantry spray washing device includes a hanger frame, a basket placement assembly, and a spray washing assembly. The power output end of the hanger frame is connected to the basket placement assembly, and the hanger frame is used to drive the basket placement assembly to move up and down. The hanger frame is provided with a water storage section for storing ultrapure water. The spray washing assembly is connected to the basket placement assembly and is connected to the water storage section through a pipe. The basket placement assembly is used to place the circuit board, and the spray washing assembly is arranged opposite to the circuit board. A return flow through hole is opened at the bottom of the basket placement assembly. The hanger frame is connected to the power output end of the conveying mechanism, and the conveying mechanism is used to drive the hanger frame to reciprocate along the arrangement direction of the first cleaning mechanism, the second cleaning mechanism, and the third cleaning mechanism.

[0017] In one embodiment, the spray washing assembly is provided with a plurality of spray washing heads, which are spaced apart. Each spray washing head is positioned opposite to a corresponding circuit board and is used to spray ultrapure water.

[0018] In one embodiment, the primary cleaning mechanism includes a first cleaning tank, a second cleaning tank, and a third cleaning tank arranged sequentially, the first cleaning tank, the second cleaning tank, and the third cleaning tank being sequentially connected; the third cleaning tank is arranged adjacent to the secondary cleaning mechanism, the third cleaning tank is provided with a first inlet pipe for inputting ultrapure water, and the first cleaning tank is provided with a first outlet pipe for outputting wastewater generated from the first water washing treatment.

[0019] In one embodiment, the secondary cleaning mechanism includes a fourth cleaning tank, a fifth cleaning tank, and a sixth cleaning tank arranged sequentially, and the fourth cleaning tank, the fifth cleaning tank, and the sixth cleaning tank are sequentially connected; the fourth cleaning tank is disposed adjacent to the third cleaning tank, and the sixth cleaning tank is disposed adjacent to the tertiary cleaning mechanism; the sixth cleaning tank is provided with a second inlet pipe for inputting the ultrapure water, and the fourth cleaning tank is provided with a second outlet pipe for outputting the wastewater generated by the second water washing treatment, and the second outlet pipe is connected to the first inlet pipe.

[0020] In one embodiment, the three-stage cleaning mechanism includes a seventh cleaning tank, an eighth cleaning tank, and a ninth cleaning tank arranged sequentially, and the seventh cleaning tank, the eighth cleaning tank, and the ninth cleaning tank are sequentially connected; the seventh cleaning tank is arranged adjacent to the sixth cleaning tank, the ninth cleaning tank is provided with a third inlet pipe for inputting the ultrapure water, and the seventh cleaning tank is provided with a third outlet pipe for outputting the wastewater generated by the third water washing treatment, and the third outlet pipe is connected to the first inlet pipe and the second outlet pipe respectively.

[0021] In one embodiment, the second water outlet pipe is provided with a first regulating valve, which is used to open or close the second water outlet pipe; the third water outlet pipe is provided with a second regulating valve, which is used to open or close the third water outlet pipe, and both the first regulating valve and the second regulating valve are used to be electrically connected to the controller.

[0022] In one embodiment, a first connecting pipe is provided between the second water outlet pipe and the third water outlet pipe, and the first connecting pipe is provided with a third regulating valve, which is used to open or close the first connecting pipe; a second connecting pipe is provided between the third water outlet pipe and the first water inlet pipe, and the second connecting pipe is provided with a fourth regulating valve, which is used to open or close the second connecting pipe; both the third regulating valve and the fourth regulating valve are used to be electrically connected to the controller.

[0023] In one embodiment, the step of conveying the wastewater generated from the second water washing process to the first cleaning mechanism includes: closing the third outlet pipe through the second regulating valve; opening the second connecting pipe through the fourth regulating valve; opening the first connecting pipe through the third regulating valve; opening the second outlet pipe through the first regulating valve; and conveying the wastewater to the first cleaning mechanism through the second outlet pipe, the first connecting pipe, the second connecting pipe, and the first inlet pipe.

[0024] In one embodiment, the step of conveying the wastewater generated from the third water washing treatment to the first cleaning mechanism includes: closing the second outlet pipe through the first regulating valve; opening the second connecting pipe through the fourth regulating valve; closing the first connecting pipe through the third regulating valve; opening the third outlet pipe through the second regulating valve; and conveying the wastewater to the first cleaning mechanism through the third outlet pipe, the second connecting pipe, and the first inlet pipe.

[0025] Compared with the prior art, this disclosure has at least the following advantages:

[0026] 1. The cleaning method for circuit boards based on the gantry spray washing device disclosed herein involves spraying the circuit board with ultrapure water when it is lifted from the chemical tank. This allows the ultrapure water to be used to rinse the surface of the circuit board, so that any residual chemicals can be returned to the chemical tank with the ultrapure water. This avoids a large loss of chemicals and effectively improves the chemical recovery efficiency. It also avoids the problem of discharging chemicals by "shaking" the circuit board. The gantry spray washing device can improve the chemical recovery effect without "shaking" the circuit board, and at the same time improve the overall line efficiency.

[0027] 2. Further, the gantry spray washing device driven by the conveying mechanism transports the spray-washed circuit board to the first cleaning mechanism, allowing the spray-washed circuit board to enter the first cleaning mechanism for subsequent first water washing. Then, the first cleaning mechanism performs the first water washing on the circuit board, rinsing the board surface and the inner walls of the holes with ultrapure water, effectively removing the chemicals from the chemical tank. Afterwards, the gantry spray washing device driven by the conveying mechanism transports the circuit board after the first water washing to the second cleaning mechanism, allowing the circuit board after the first water washing to... The circuit board enters the secondary cleaning unit for a second water wash. The secondary cleaning unit then performs a second water wash on the circuit board, simultaneously transferring the wastewater from this second wash to the primary cleaning unit. This allows ultrapure water to further rinse the board surface and the inner walls of the holes, effectively removing impurities and ions from the circuit board. Because the circuit board has very little chemical residue after the first wash, the wastewater from the second wash also contains very little chemical residue. The treatment process has low water quality requirements. Therefore, the wastewater from the second water washing process meets the requirements for the first water washing of the circuit boards, allowing the wastewater from the second water washing process to be reused and reducing the waste of ultrapure water. Afterwards, the circuit boards after the second water washing process are transported to the third cleaning mechanism via a conveying mechanism driven by a gantry spray washing device. The circuit boards then undergo a third water washing process in the third cleaning mechanism, and the wastewater from this process is simultaneously transported to the first cleaning mechanism. This allows for comprehensive cleaning of the circuit boards with ultrapure water, thoroughly cleaning the board surface. Since the circuit boards have undergone the first and second water washing processes, the chemical content on the circuit boards is negligible, resulting in negligible chemical content in the wastewater from the third water washing process. Therefore, the wastewater from the third water washing process meets the requirements for the first water washing of the circuit boards, allowing it to be reused and further reducing the waste of ultrapure water.

[0028] 3. The cleaning method for circuit boards based on a gantry spray washing device disclosed herein transports the wastewater generated from the second water washing process to the first cleaning mechanism, allowing the wastewater from the second water washing process to be reused, thus reducing the waste of ultrapure water. Simultaneously, the wastewater generated from the third water washing process is also transported to the first cleaning mechanism, allowing the wastewater from the third water washing process to be reused, further reducing the waste of ultrapure water. This avoids the problem in the prior art where the ultrapure water in each of the three-stage water washing structures directly overflows to the wastewater treatment station. In other words, it solves the problem of direct discharge of large amounts of ultrapure water from the surface treatment level line in the prior art, and further solves the problem of the difficulty in recycling large amounts of ultrapure water, leading to waste. The cleaning method for circuit boards based on a gantry spray washing device makes it easier to recycle large amounts of ultrapure water, thus resulting in better water-saving performance of the surface treatment level line. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a flowchart illustrating a cleaning method for cleaning circuit boards using a gantry spray cleaning device, according to one embodiment.

[0031] Figure 2 This is a schematic diagram of the structure of a surface treatment horizontal line according to one embodiment;

[0032] Figure 3 This is a schematic diagram of the structure of a gantry spray washing device according to one embodiment. Detailed Implementation

[0033] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] like Figures 1 to 3 As shown, an embodiment of a cleaning method for cleaning circuit boards using a gantry spray cleaning device is used to clean circuit board 600. Further, the cleaning method for cleaning circuit boards using a gantry spray cleaning device includes some or all of the following steps:

[0037] S101, the circuit board 600 is sprayed and cleaned by the gantry spray cleaning device 400.

[0038] In this embodiment, when the circuit board 600 is lifted from the chemical tank 500, it is first sprayed by the gantry spray washing device 400 so that ultrapure water is used to rinse the surface of the circuit board 600, so that the residual chemical solution flows back into the chemical tank 500 with the ultrapure water, thereby avoiding a large loss of chemical solution and effectively improving the chemical solution recovery efficiency.

[0039] Furthermore, the medicine is prone to evaporation under the influence of high temperature and process characteristics, which requires frequent water replenishment by the staff. By using ultrapure water to bring the residual medicine back into the medicine tank 500, the frequency of manual water replenishment can be reduced, the problem of water level fluctuation due to negligence can be avoided, and the stability of the medicine in the medicine tank 500 can be effectively improved.

[0040] S103, the gantry spray washing device 400 is driven by the conveying mechanism to transport the spray-washed circuit board 600 to the first cleaning mechanism 100.

[0041] In this embodiment, the gantry spray washing device 400 driven by the conveying mechanism transports the spray-washed circuit board 600 to the first cleaning mechanism 100, so that the spray-washed circuit board 600 enters the first cleaning mechanism 100 for subsequent first water washing treatment.

[0042] S105, the circuit board 600 is subjected to a first water wash by the first cleaning mechanism 100.

[0043] In this embodiment, the circuit board 600 is subjected to a first water wash by the first cleaning mechanism 100, so that ultrapure water washes the board surface and the inner wall of the holes, thereby effectively removing the chemical solution brought from the chemical solution tank 500 on the circuit board 600, and the ultrapure water and chemical solution are mixed to obtain the wastewater generated by the first water wash.

[0044] S107, the gantry spray washing device 400 driven by the conveying mechanism transports the circuit board 600 after the first water washing treatment to the secondary cleaning mechanism 200.

[0045] In this embodiment, the gantry spray washing device 400 driven by the conveying mechanism transports the circuit board 600 after the first water washing treatment to the secondary cleaning mechanism 200, so that the circuit board 600 after the first water washing treatment enters the secondary cleaning mechanism 200 for subsequent second water washing treatment.

[0046] S109, the circuit board 600 is subjected to a second water washing process by the secondary cleaning mechanism 200, and the wastewater generated by the second water washing process is simultaneously transported to the primary cleaning mechanism 100.

[0047] In this embodiment, the circuit board 600 undergoes a second water wash treatment via the secondary cleaning mechanism 200. Simultaneously, the wastewater generated from the second water wash is transported to the primary cleaning mechanism 100, allowing ultrapure water to further rinse the board surface and the inner walls of the holes, effectively removing impurity ions from the circuit board 600. Since the chemical content on the circuit board 600 after the first water wash is extremely low, the chemical content in the wastewater generated from the second water wash is also extremely low. Furthermore, the first water wash has lower water quality requirements; therefore, the wastewater generated from the second water wash meets the requirements for the first water wash of the circuit board 600, allowing it to be reused and reducing the waste of ultrapure water. Further, within the primary cleaning mechanism 100, the wastewater generated from the second water wash is mixed with the wastewater generated from the first water wash to obtain a first mixed water.

[0048] S111, the gantry spray washing device 400 is driven by the conveying mechanism to transport the circuit board 600 after the second water washing treatment to the third cleaning mechanism 300.

[0049] In this embodiment, the gantry spray washing device 400 driven by the conveying mechanism transports the circuit board 600 after the second water washing treatment to the third cleaning mechanism 300, so that the circuit board 600 after the second water washing treatment enters the third cleaning mechanism 300 for subsequent third water washing treatment.

[0050] S113, the circuit board 600 is subjected to a third water washing process by the three-stage cleaning mechanism 300, and the wastewater generated by the third water washing process is simultaneously transported to the first-stage cleaning mechanism 100.

[0051] In this embodiment, the circuit board 600 undergoes a third water wash treatment via a three-stage cleaning mechanism 300. Simultaneously, the wastewater generated from the third water wash is transported to the first cleaning mechanism 100, allowing ultrapure water to thoroughly clean the circuit board 600 from all angles, achieving a complete surface cleaning. Since the circuit board 600 has undergone the first and second water wash treatments, the chemical content on the circuit board 600 is negligible, resulting in a negligible chemical content in the wastewater generated from the third water wash. Therefore, the wastewater generated from the third water wash meets the requirements for the first water wash treatment of the circuit board 600, allowing it to be reused and further reducing the waste of ultrapure water. Furthermore, within the first cleaning mechanism 100, the wastewater generated from the third water wash, the wastewater generated from the second water wash, and the wastewater generated from the first water wash are mixed to obtain a second mixed water.

[0052] The above-described cleaning method for circuit boards based on a gantry spray washing device involves spraying the circuit board 600 from the chemical tank 500 when the circuit board 600 is lifted from the chemical tank 500. The gantry spray washing device 400 then sprays the circuit board 600 with ultrapure water to rinse its surface, allowing any residual chemicals to flow back into the chemical tank 500. This avoids significant chemical loss and effectively improves chemical recovery efficiency. It also avoids the need for the circuit board to be "shaken" to discharge chemicals, allowing the gantry spray washing device 400 to improve chemical recovery without shaking the circuit board, thus increasing overall line efficiency.

[0053] Furthermore, the gantry spray washing device 400, driven by a conveying mechanism, transports the spray-washed circuit board 600 to the first cleaning mechanism 100, allowing the spray-washed circuit board 600 to enter the first cleaning mechanism 100 for subsequent first water washing. Then, the first cleaning mechanism 100 performs a first water washing on the circuit board 600, rinsing the board surface and the inner walls of the holes with ultrapure water, effectively removing chemicals from the chemical tank. Afterwards, the gantry spray washing device 400, driven by a conveying mechanism, transports the circuit board 600 after the first water washing to the second cleaning mechanism 200, allowing the first water washing... The processed circuit board 600 enters the secondary cleaning unit 200 for a subsequent second water wash. Then, the secondary cleaning unit 200 performs a second water wash on the circuit board 600, simultaneously transferring the wastewater from the second water wash to the primary cleaning unit 100. This allows ultrapure water to further rinse the board surface and the inner walls of the holes, effectively removing impurity ions from the circuit board 600. Because the chemical content on the circuit board 600 after the first water wash is extremely low, the chemical content in the wastewater from the second water wash is also extremely low. The first water wash has lower water quality requirements; therefore, the wastewater from the second water wash meets the requirements for the first water wash of the circuit board 600, allowing it to be reused and reducing the waste of ultrapure water. Afterward, the gantry spray washing device 400, driven by a conveyor mechanism, transports the circuit board 600 after the second water wash to the third cleaning mechanism 300, facilitating the subsequent third water wash. The third water wash then applies a third water wash to the circuit board 600, simultaneously removing the third... Wastewater from the second washing process is transported to the first cleaning unit 100 to thoroughly clean the circuit board 600 with ultrapure water. Simultaneously, wastewater from the third washing process is also transported to the first cleaning unit 100. After the first and second washing processes, the chemical content on the circuit board 600 is negligible, resulting in negligible chemical content in the wastewater from the third washing process. Therefore, the wastewater from the third washing process meets the requirements for the first washing process of the circuit board 600, allowing it to be reused and further reducing the waste of ultrapure water.

[0054] Because the cleaning method for circuit boards based on a gantry spray washing device disclosed herein transports the wastewater generated from the second water washing process to the first cleaning mechanism 100, the wastewater generated from the second water washing process can be reused, reducing the waste of ultrapure water. At the same time, the wastewater generated from the third water washing process is also transported to the first cleaning mechanism 100, so that the wastewater generated from the third water washing process can be reused, further reducing the waste of ultrapure water. This avoids the problem in the prior art where the ultrapure water in each of the three-stage water washing structures overflows directly to the wastewater treatment station. In other words, it solves the problem of direct discharge of large amounts of ultrapure water from the surface treatment level line in the prior art, and further solves the problem that it is difficult to recycle large amounts of ultrapure water in the prior art, resulting in the waste of large amounts of ultrapure water. The cleaning method for circuit boards based on a gantry spray washing device makes it easier to recycle large amounts of ultrapure water, thus making the surface treatment level line have better water-saving performance.

[0055] like Figure 3 As shown, in one embodiment, the gantry spray washing device 400 includes a hanger frame 410, a basket assembly 420, and a spray washing assembly 430. The power output end of the hanger frame 410 is connected to the basket assembly 420, and the hanger frame 410 is used to drive the basket assembly 430 to move up and down. The hanger frame 410 is provided with a water storage section 411 for storing ultrapure water. The spray washing assembly 430 is connected to the basket assembly 420 and is connected to the gantry spray washing assembly 430 via a pipeline. 431 is connected to the water storage part 411. The placement basket assembly 420 is used to place the circuit board 600. The spray washing assembly 430 is arranged opposite to the circuit board 600. The bottom of the placement basket assembly 420 is provided with a return flow hole. The hanger frame 410 is connected to the power output end of the conveying mechanism. The conveying mechanism is used to drive the hanger frame 410 to reciprocate along the arrangement direction of the first cleaning mechanism 100, the second cleaning mechanism 200 and the third cleaning mechanism 300. In this embodiment, the lifting frame 410 is used to drive the placement basket assembly 420 to move up and down, so that the lifting frame 410 lifts the placement basket assembly 420 from the chemical tank 500 to a predetermined position, that is, the lifting frame 410 lifts the circuit board 600 from the chemical tank 500 to the predetermined position. The spray washing assembly 430 is arranged opposite to the circuit board 600, and the spray washing assembly 430 is connected to the water storage part 411 through the pipe body 431, so that ultrapure water is sprayed onto the circuit board 600 through the spray washing assembly 430 to perform directional spray washing treatment, so that the ultrapure water is used to rinse the surface of the circuit board 600, so that the residual chemical solution flows back into the chemical tank 500 with the ultrapure water through the return hole, thereby avoiding a large loss of chemical solution and effectively improving the chemical solution recovery efficiency.

[0056] like Figure 3As shown, in one embodiment, the spray washing assembly 430 is provided with a plurality of spray washing heads 432, which are spaced apart. Each spray washing head 432 is positioned opposite to a corresponding circuit board 600, and each spray washing head 432 is used to spray ultrapure water, so that the ultrapure water performs directional spray washing on the circuit board 600 through the spray washing head 432, so that the ultrapure water is used to rinse the surface of the circuit board 600, and so that the residual medicine flows back into the medicine tank 500 through the return through the return hole along with the ultrapure water, thereby avoiding a large loss of medicine and effectively improving the medicine recovery efficiency.

[0057] like Figure 2 As shown, in one embodiment, the primary cleaning mechanism 100 includes a first cleaning tank 110, a second cleaning tank 120, and a third cleaning tank 130 arranged sequentially, and the first cleaning tank 110, the second cleaning tank 120, and the third cleaning tank 130 are sequentially connected. The third cleaning tank 130 is located adjacent to the secondary cleaning mechanism 200, and the third cleaning tank 130 is provided with a first inlet pipe 131 for inputting ultrapure water. The first cleaning tank 110 is provided with a first outlet pipe 140 for outputting wastewater generated from the first water washing treatment. In this embodiment, the first outlet pipe 140 is used to connect to a wastewater treatment plant so that the wastewater generated from the first water washing treatment can be discharged to the wastewater treatment plant, which is beneficial for the centralized treatment of the wastewater generated from the first water washing treatment.

[0058] like Figure 2 As shown, in one embodiment, the secondary cleaning mechanism 200 includes a fourth cleaning tank 210, a fifth cleaning tank 220, and a sixth cleaning tank 230 arranged sequentially, and the fourth cleaning tank 210, the fifth cleaning tank 220, and the sixth cleaning tank 230 are sequentially connected; the fourth cleaning tank 210 is arranged adjacent to the third cleaning tank 130, and the sixth cleaning tank 230 is arranged adjacent to the tertiary cleaning mechanism 300; the sixth cleaning tank 230 is provided with a second inlet pipe 231 for inputting the ultrapure water, and the fourth cleaning tank 210 is provided with a second outlet pipe 211 for outputting the wastewater generated by the second water washing treatment, and the second outlet pipe 211 is connected to the first inlet pipe 131. In this embodiment, the second water outlet pipe 211 is connected to the first water inlet pipe 131 so that the second water outlet pipe 211 and the first water inlet pipe 131 are connected, so that the wastewater generated by the second water washing treatment is transported along the second water outlet pipe 211 and the first water inlet pipe 131 to the third cleaning tank 130, thereby making the water-saving performance of the surface treatment horizontal line 10 better.

[0059] like Figure 2As shown, in one embodiment, the three-stage cleaning mechanism 300 includes a seventh cleaning tank 310, an eighth cleaning tank 320, and a ninth cleaning tank 330 arranged sequentially, which are connected in sequence. The seventh cleaning tank 310 is located adjacent to the sixth cleaning tank 230. The ninth cleaning tank 330 is provided with a third inlet pipe 331 for inputting the ultrapure water and a third outlet pipe 311 for outputting the wastewater generated by the third water washing process. The third outlet pipe 311 is connected to the first inlet pipe 131 and the second outlet pipe 211, respectively, so that the wastewater generated by the third water washing process is transported to the third cleaning tank 130 along the third outlet pipe 311 and the first inlet pipe 131, thereby improving the water-saving performance of the surface treatment level line 10.

[0060] like Figure 2 As shown, in one embodiment, the second water outlet pipe 211 is provided with a first regulating valve 2111, which is used to open or close the second water outlet pipe 211; the third water outlet pipe 311 is provided with a second regulating valve 3111, which is used to open or close the third water outlet pipe 311. Both the first regulating valve 2111 and the second regulating valve 3111 are used to be electrically connected to the controller, so that the control of the surface treatment horizontal line 10 is more convenient.

[0061] like Figure 2 As shown, in one embodiment, a first connecting pipe 2112 is provided between the second water outlet pipe 211 and the third water outlet pipe 311. The first connecting pipe 2112 is provided with a third regulating valve 2112a, which is used to open or close the first connecting pipe 2112. A second connecting pipe 3112 is provided between the third water outlet pipe 311 and the first water inlet pipe 131. The second connecting pipe 3112 is provided with a fourth regulating valve 3112a, which is used to open or close the second connecting pipe 3112. Both the third regulating valve 2112a and the fourth regulating valve 3112a are used to be electrically connected to the controller, further improving the control convenience of the surface treatment level line 10.

[0062] like Figure 2As shown, in one embodiment, the step of conveying the wastewater generated from the second water washing process to the first cleaning mechanism 100 includes: firstly, closing the third water outlet pipe 311 through the second regulating valve 3111, so that the third water outlet pipe 311 cannot discharge the wastewater generated from the third water washing process; then, opening the second connecting pipe 3112 through the fourth regulating valve 3112a, so that the second connecting pipe 3112 is connected to the first water inlet pipe 131; then, opening the first connecting pipe 2112 through the third regulating valve 2112a, so that the first connecting pipe 2112 is connected to the second connecting pipe 3112. After connecting the two pipes, the second outlet pipe 211 is opened through the first regulating valve 2111, connecting the second outlet pipe 211 to the first connecting pipe 2112. Then, the wastewater is transported to the first cleaning mechanism 100 through the second outlet pipe 211, the first connecting pipe 2112, the second connecting pipe 3112 and the first inlet pipe 131. That is, the wastewater is transported to the first cleaning mechanism 100 along the second outlet pipe 211, the first connecting pipe 2112, the second connecting pipe 3112 and the first inlet pipe 131, so that the wastewater can be reused and the waste of ultrapure water is reduced.

[0063] like Figure 2 As shown, in one embodiment, the step of conveying the wastewater generated from the third water washing process to the first cleaning mechanism 100 includes: firstly, closing the second outlet pipe 211 through the first regulating valve 2111, preventing the second outlet pipe 211 from discharging the wastewater generated from the second water washing process; then, opening the second connecting pipe 3112 through the fourth regulating valve 3112a, connecting the second connecting pipe 3112 to the first inlet pipe 131; and then, closing the first connecting pipe 2112 through the third regulating valve 2112a to prevent the wastewater generated from the third water washing process from being discharged. The problem of water flowing back to the first connecting pipe 2112 is addressed; then, the third outlet pipe 311 is opened through the second regulating valve 3111, connecting the third outlet pipe 311 to the second connecting pipe 3112; subsequently, the wastewater is transported to the first cleaning mechanism 100 through the third outlet pipe 311, the second connecting pipe 3112, and the first inlet pipe 131, i.e., the wastewater is transported to the first cleaning mechanism 100 along the third outlet pipe 311, the second connecting pipe 3112, and the first inlet pipe 131, so that the wastewater can be reused, reducing the waste of ultrapure water.

[0064] In one embodiment, the conveying mechanism includes a conveying drive assembly and a main body. The conveying drive assembly is mounted on the main body, and the power output end of the conveying drive assembly is connected to the lifting frame 410. The conveying drive assembly is used to drive the lifting frame 410 to reciprocate along the arrangement direction of the first cleaning mechanism, the second cleaning mechanism and the third cleaning mechanism, so as to make the movement reliability of the lifting frame 410 better.

[0065] Furthermore, such as Figures 2 to 3 As shown, in one embodiment, the first cleaning tank 110 has a first water washing chamber, the second cleaning tank 120 has a second water washing chamber, and the third cleaning tank 130 has a third water washing chamber. The inner wall of the first water washing chamber has a first through hole, the inner wall of the second water washing chamber has a second through hole and a third through hole, and the inner wall of the third water washing chamber has a fourth through hole. The first through hole communicates with the second through hole, and the third through hole communicates with the fourth through hole, so that the first water washing chamber, the second water washing chamber, and the third water washing chamber are sequentially connected, and the first cleaning tank 110, the second cleaning tank 120, and the third cleaning tank 130 are sequentially connected, thereby allowing ultrapure water to flow well between the first water washing chamber, the second water washing chamber, and the third water washing chamber.

[0066] Furthermore, in one embodiment, the vertical distance from the center of the second through hole to the bottom wall of the second water washing chamber is less than the vertical distance from the center of the third through hole to the bottom wall of the second water washing chamber, so that the position of the second through hole is lower than the position of the third through hole, thereby creating a liquid level height difference between the first water washing chamber, the second water washing chamber and the third water washing chamber, so that ultrapure water overflows along the third water washing chamber, the second water washing chamber and the first water washing chamber, reducing the amount of ultrapure water used and reducing the cleaning cost of the horizontal line of surface treatment.

[0067] Furthermore, in one embodiment, the inner wall of the first cleaning chamber is provided with a water curtain nozzle, which is used to connect to an external water supply device so that the water curtain nozzle can spray ultrapure water. The water curtain nozzle is located adjacent to the circuit board 600, so that the ultrapure water sprayed by the water curtain nozzle acts on the circuit board 600 to rinse the board surface and the inner wall of the holes, thereby effectively removing the chemicals and impurities on the circuit board 600, so that the first water washing treatment has a better cleaning effect on the circuit board 600.

[0068] Furthermore, in one embodiment, the first water washing process of the circuit board 600 by the first cleaning mechanism 100 includes: firstly, using a water curtain nozzle to perform a water curtain rinsing process on the circuit board 600, so that the ultrapure water sprayed from the water curtain nozzle acts on the circuit board 600 to rinse the board surface and the inner walls of the holes, thereby effectively removing chemicals and impurities from the circuit board 600; then, immersing the circuit board 600 after the water curtain rinsing process into the ultrapure water in the first water washing chamber to facilitate subsequent heating treatment; then, using a heating device to heat the ultrapure water in the first water washing chamber to enable the ultrapure water to better clean the board surface and the inner walls of the holes, thereby improving cleaning efficiency. In this embodiment, the control terminal of the heating device is electrically connected to the controller. In one embodiment, the heating temperature of the ultrapure water in the first water washing chamber is 30-35°C to enable the ultrapure water to better clean the board surface and the inner walls of the holes, thereby improving cleaning efficiency. Furthermore, the step of heating the ultrapure water in the first water washing chamber using a heating device specifically involves: heating the ultrapure water in the first water washing chamber using a heating device, while simultaneously detecting the water temperature in the first water washing chamber in real time to obtain the actual temperature information of the ultrapure water in the first water washing chamber; then determining whether the actual temperature information is equal to the preset temperature; if so, controlling the heating device to stop heating to avoid overheating the ultrapure water, and simultaneously achieving real-time control and adjustment of the water temperature of the ultrapure water in the first water washing chamber to better match the effect of cleaning the board surface and inner walls of the holes of the circuit board 600 during the first water washing process. In this embodiment, the preset temperature range is 30-35℃, for example, the preset temperature is 32℃, 33℃, or 34℃.

[0069] Furthermore, in one embodiment, a first temperature sensor is installed on the inner wall of the first water washing chamber. The detection end of the first temperature sensor is located inside the ultrapure water. The first temperature sensor is electrically connected to the controller so that it transmits the temperature information of the ultrapure water to the controller, allowing operators to observe the temperature changes of the ultrapure water in the first water washing chamber in real time. This improves the convenience of temperature detection for the ultrapure water in the first water washing chamber. In this embodiment, the preset temperature is 32°C. When the temperature of the ultrapure water in the first water washing chamber is lower than 32°C, the first temperature sensor transmits the temperature information to the controller in real time. The controller then controls the heating device to start heating the ultrapure water. When the ultrapure water is heated to 32°C, the first temperature sensor transmits the temperature information to the controller in real time, and the controller stops the heating device. This results in a high level of automation for the surface treatment level 10.

[0070] Furthermore, in one embodiment, the step of heating the ultrapure water in the first water washing chamber using a heating device specifically involves: heating the ultrapure water in the first water washing chamber using a heating device, while simultaneously detecting the water level of the ultrapure water in the first water washing chamber in real time to obtain the actual water level information; then, determining whether the actual water level information is less than the highest water level value and greater than the lowest water level value; if not, performing compensation treatment or discharge treatment on the ultrapure water in the first water washing chamber. Specifically, when the actual water level information is less than the lowest water level value, compensation treatment is performed on the ultrapure water in the first water washing chamber; when the actual water level information is greater than the highest water level value, discharge treatment is performed on the ultrapure water in the first water washing chamber. It should be noted that the highest water level value is greater than the lowest water level value, and the specific values ​​of the highest and lowest water levels are not particularly limited here, and can be flexibly set according to actual usage needs. In this embodiment, a heating device is used to heat the ultrapure water in the first water washing chamber. At the same time, the water temperature and water level of the ultrapure water in the first water washing chamber are detected in real time. This allows the actual temperature and water level information of the ultrapure water in the first water washing chamber to be obtained in real time during heating, so that the ultrapure water in the first water washing chamber can better match the water washing requirements of the circuit board 600.

[0071] Furthermore, in one embodiment, the inner wall of the first water washing chamber is provided with a first liquid level sensor and a second liquid level sensor, a first through hole is located between the first liquid level sensor and the second liquid level sensor, the first liquid level sensor is located below the second liquid level sensor, and both the first liquid level sensor and the second liquid level sensor are used for electrical connection with the controller. In this embodiment, the first liquid level sensor is used to feed back the first liquid level information to the controller. At this time, the first liquid level is the lowest water level, and the first liquid level information is the lowest water level value. The second liquid level sensor is used to feed back the second liquid level information to the controller. At this time, the second liquid level is the highest water level, and the second liquid level information is the highest water level value. That is, when the first liquid level sensor detects the first liquid level information, the first water washing chamber is at the lowest water level. The first liquid level sensor feeds back the first liquid level information to the controller, and the controller controls the first water inlet pipe to allow water to overflow into the first water washing chamber, thereby raising the water level in the first water washing chamber. When the second liquid level sensor detects the second liquid level information, the first water washing chamber is at the highest water level. The second liquid level sensor feeds back the second liquid level information to the controller, and the controller controls the first water outlet pipe to allow water to flow out, thereby lowering the water level in the first water washing chamber. This results in a high level of automation for the surface treatment level 10.

[0072] Furthermore, in one embodiment, the fourth cleaning tank 210 has a fourth water washing chamber, the fifth cleaning tank 220 has a fifth water washing chamber, and the sixth cleaning tank 230 has a sixth water washing chamber. The inner wall of the fourth water washing chamber has a fifth through hole, the inner wall of the fifth water washing chamber has a sixth through hole and a seventh through hole, and the inner wall of the sixth water washing chamber has an eighth through hole. The fifth through hole communicates with the sixth through hole, and the seventh through hole communicates with the eighth through hole, so that the fourth water washing chamber, the fifth water washing chamber, and the sixth water washing chamber are sequentially connected, and the fourth cleaning tank 210, the fifth cleaning tank 220, and the sixth cleaning tank 230 are sequentially connected, thereby allowing ultrapure water to flow well between the fourth water washing chamber, the fifth water washing chamber, and the sixth water washing chamber.

[0073] Furthermore, in one embodiment, the vertical distance from the center of the sixth through hole to the bottom wall of the fifth water washing chamber is less than the vertical distance from the center of the seventh through hole to the bottom wall of the fifth water washing chamber, so that the position of the sixth through hole is lower than the position of the seventh through hole, thereby creating a liquid level height difference between the fourth, fifth and sixth water washing chambers, so that ultrapure water overflows along the sixth, fifth and fourth water washing chambers, reducing the amount of ultrapure water used and reducing the cleaning cost of the surface treatment level 10.

[0074] Furthermore, in one embodiment, the inner wall of the fourth cleaning chamber is provided with a spray assembly. The spray assembly is used to connect to an external water supply device so that the spray assembly can spray ultrapure water. The spray assembly is located adjacent to the circuit board 600 so that the ultrapure water sprayed by the spray assembly acts on the circuit board 600, spraying and rinsing the board surface and the inner wall of the holes to effectively remove chemicals and impurities on the circuit board 600, so that the second water washing treatment has a better cleaning effect on the circuit board 600.

[0075] Furthermore, in one embodiment, the spray assembly is provided with a conical nozzle at a 15° angle to facilitate better rinsing of the inner wall of the hole and improve the cleaning effect on the circuit board 600.

[0076] Furthermore, in one embodiment, the step of performing a second water wash on the circuit board 600 using the secondary cleaning mechanism 200 includes: firstly, using a spray assembly to spray and rinse the circuit board 600, so that the ultrapure water sprayed by the spray assembly acts on the circuit board 600, spraying and rinsing the board surface and the inner walls of the holes to effectively remove chemicals and impurities from the circuit board 600; then, immersing the spray-rinsed circuit board 600 in ultrapure water in a fourth water washing chamber to facilitate subsequent heating treatment; then, using a heating device to heat the ultrapure water in the fourth water washing chamber to better clean the board surface and the inner walls of the holes, thereby improving cleaning efficiency. In this embodiment, the water washing pressure for spraying and rinsing the circuit board 600 using the spray assembly is 3-5 kg / cm². 2 The ultrapure water in the fourth washing chamber is heated to a temperature of 30-35°C using a heating device to better clean the board surface and the inner walls of the holes, thereby improving cleaning efficiency. Furthermore, the specific steps for heating the ultrapure water in the fourth washing chamber are as follows: The ultrapure water in the fourth washing chamber is heated using a heating device, and the water temperature is monitored in real time to obtain the actual temperature information. Then, it is determined whether the actual temperature information equals the preset temperature. If so, the heating device is stopped to prevent overheating of the ultrapure water. This simultaneous real-time control and adjustment of the ultrapure water temperature in the fourth washing chamber better matches the cleaning effect on the board surface and the inner walls of the holes of the circuit board 600 during the second washing process. In this embodiment, the preset temperature range is 30-35°C, for example, 32°C, 33°C, or 34°C.

[0077] Furthermore, in one embodiment, a second temperature sensor is installed on the inner wall of the fourth water washing chamber. The detection end of the second temperature sensor is located inside the ultrapure water. The second temperature sensor is electrically connected to the controller so that it transmits the temperature information of the ultrapure water to the controller. This allows the operator to observe the temperature change of the ultrapure water in the fourth water washing chamber in real time, thus improving the convenience of temperature detection. In this embodiment, the preset temperature is 33°C. When the temperature of the ultrapure water in the fourth water washing chamber is lower than 33°C, the second temperature sensor transmits the temperature information to the controller in real time. The controller then controls the heating device to start working, i.e., to heat the ultrapure water. When the ultrapure water is heated to 33°C, the second temperature sensor transmits the temperature information to the controller in real time, and the controller then controls the heating device to stop working. This results in a high level of automation for the surface treatment level 10.

[0078] Furthermore, in one embodiment, the step of heating the ultrapure water in the fourth water washing chamber using a heating device specifically involves: heating the ultrapure water in the fourth water washing chamber using a heating device, while simultaneously detecting the water level of the ultrapure water in the fourth water washing chamber in real time to obtain the actual water level information; then, determining whether the actual water level information is less than the highest water level value and greater than the lowest water level value; if not, performing compensation treatment or discharge treatment on the ultrapure water in the fourth water washing chamber. Specifically, when the actual water level information is less than the lowest water level value, compensation treatment is performed on the ultrapure water in the fourth water washing chamber; when the actual water level information is greater than the highest water level value, discharge treatment is performed on the ultrapure water in the fourth water washing chamber. It should be noted that the highest water level value is greater than the lowest water level value, and the specific values ​​of the highest and lowest water levels are not particularly limited here, and can be flexibly set according to actual usage needs. In this embodiment, a heating device is used to heat the ultrapure water in the fourth water washing chamber. At the same time, the water temperature and water level of the ultrapure water in the fourth water washing chamber are monitored in real time. This allows the actual temperature and water level information of the ultrapure water in the fourth water washing chamber to be obtained in real time during heating, so that the ultrapure water in the fourth water washing chamber can better match the water washing requirements of the circuit board 600.

[0079] Furthermore, in one embodiment, the inner wall of the fourth water washing chamber is provided with a third liquid level sensor and a fourth liquid level sensor, the fifth through hole is located between the first liquid level sensor and the second liquid level sensor, the third liquid level sensor is located below the fourth liquid level sensor, and both the third liquid level sensor and the fourth liquid level sensor are used for electrical connection with the controller. In this embodiment, the third liquid level sensor is used to feed back the third liquid level information to the controller. At this time, the third liquid level is the lowest water level, and the third liquid level information is the lowest water level value. The fourth liquid level sensor is used to feed back the fourth liquid level information to the controller. At this time, the fourth liquid level is the highest water level, and the fourth liquid level information is the highest water level value. That is, when the third liquid level sensor detects the third liquid level information, the fourth water washing chamber is at the lowest water level. The third liquid level sensor feeds back the third liquid level information to the controller, and the controller controls the second water inlet pipe to allow water to overflow into the fourth water washing chamber, thereby raising the water level in the fourth water washing chamber. When the fourth liquid level sensor detects the fourth liquid level information, the fourth water washing chamber is at the highest water level. The fourth liquid level sensor feeds back the fourth liquid level information to the controller, and the controller controls the second water outlet pipe to allow water to flow out, thereby lowering the water level in the fourth water washing chamber. This results in a high level of automation for the surface treatment level line 10.

[0080] Furthermore, in one embodiment, the seventh cleaning tank 310 has a seventh water washing chamber, the eighth cleaning tank 320 has an eighth water washing chamber, and the ninth cleaning tank 330 has a ninth water washing chamber. The inner wall of the seventh water washing chamber has a ninth through hole, the inner wall of the eighth water washing chamber has a tenth through hole and an eleventh through hole, and the inner wall of the ninth water washing chamber has a twelfth through hole. The ninth through hole communicates with the tenth through hole, and the eleventh through hole communicates with the twelfth through hole, so that the seventh water washing chamber, the eighth water washing chamber, and the ninth water washing chamber are sequentially connected, and the seventh cleaning tank 310, the eighth cleaning tank 320, and the ninth cleaning tank 330 are sequentially connected, thereby allowing ultrapure water to flow well between the seventh water washing chamber, the eighth water washing chamber, and the ninth water washing chamber.

[0081] Furthermore, in one embodiment, the vertical distance from the center of the tenth through hole to the bottom wall of the eighth water washing chamber is less than the vertical distance from the center of the eleventh through hole to the bottom wall of the eighth water washing chamber, so that the position of the tenth through hole is lower than the position of the eleventh through hole, thereby creating a liquid level height difference between the seventh, eighth and ninth water washing chambers, so that ultrapure water overflows along the ninth, eighth and seventh water washing chambers, reducing the amount of ultrapure water used and reducing the cleaning cost of the horizontal line of surface treatment.

[0082] Furthermore, in one embodiment, the step of performing a third water wash on the circuit board 600 by the three-stage cleaning mechanism 300 includes: firstly, immersing the circuit board 600 in ultrapure water in the seventh water washing chamber to facilitate subsequent ultrasonic cleaning; then, using an ultrasonic cleaning device to perform ultrasonic cleaning on the circuit board 600 in the seventh water washing chamber to clean the circuit board 600 from all angles and improve the cleaning effect.

[0083] Furthermore, in one embodiment, the step of using an ultrasonic cleaning device to perform ultrasonic cleaning on the circuit board 600 in the seventh water washing chamber specifically involves: using an ultrasonic cleaning device to perform ultrasonic cleaning on the circuit board 600 in the seventh water washing chamber, while simultaneously detecting the water level of the ultrapure water in the seventh water washing chamber in real time to obtain the actual water level information of the ultrapure water in the seventh water washing chamber; then, determining whether the actual water level information of the ultrapure water is less than the highest water level value and greater than the lowest water level value; if not, performing compensation treatment or discharge treatment on the ultrapure water in the seventh water washing chamber. Specifically, when the actual water level information of the ultrapure water is less than the lowest water level value, compensation treatment is performed on the ultrapure water in the seventh water washing chamber; when the actual water level information of the ultrapure water is greater than the highest water level value, discharge treatment is performed on the ultrapure water in the seventh water washing chamber. It should be noted that the highest water level value is greater than the lowest water level value, and the specific values ​​of the highest and lowest water level values ​​are not particularly limited here, and can be flexibly set according to actual usage needs.

[0084] Furthermore, in one embodiment, the inner wall of the seventh water washing chamber is provided with a fifth liquid level sensor and a sixth liquid level sensor, the ninth through hole is located between the fifth liquid level sensor and the sixth liquid level sensor, the fifth liquid level sensor is located below the sixth liquid level sensor, and both the fifth liquid level sensor and the sixth liquid level sensor are used for electrical connection with the controller. In this embodiment, the fifth liquid level sensor is used to feed back the fifth liquid level information to the controller. At this time, the fifth liquid level is the lowest water level, and the fifth liquid level information is the lowest water level value. The sixth liquid level sensor is used to feed back the sixth liquid level information to the controller. At this time, the sixth liquid level is the highest water level, and the sixth liquid level information is the highest water level value. That is, when the fifth liquid level sensor detects the fifth liquid level information, the seventh water washing chamber is at the lowest water level. The fifth liquid level sensor feeds back the fifth liquid level information to the controller, and the controller controls the third water inlet pipe to allow water to overflow into the seventh water washing chamber, thereby raising the water level in the seventh water washing chamber. When the sixth liquid level sensor detects the sixth liquid level information, the seventh water washing chamber is at the highest water level. The sixth liquid level sensor feeds back the sixth liquid level information to the controller, and the controller controls the third water outlet pipe to allow water to flow out, thereby lowering the water level in the seventh water washing chamber. This results in a high level of automation for the surface treatment level 10.

[0085] Further, in one embodiment, the step of performing a first water wash on the circuit board 600 by the first cleaning mechanism includes: firstly, performing a first water wash on the circuit board 600 by the first cleaning mechanism, so that ultrapure water rinses the board surface and the inner walls of the holes, thereby effectively removing the chemical solution brought from the chemical tank 500 on the circuit board 600, and mixing the ultrapure water with the chemical solution to obtain wastewater generated from the first water wash; then, filtering the wastewater generated from the first water wash to remove the chemicals from the first water wash. The wastewater containing impurities and sediments is filtered to obtain the first filtered water. The first filtered water is then transported to the water storage unit 411, that is, it is transported to the water storage unit 411 through the first water outlet pipe 140. After removing impurities and sediments, the first filtered water contains only ultrapure water and chemicals, which allows the ultrapure water and chemicals to be recycled and reused. This effectively improves the recycling rate of ultrapure water and chemicals and further improves the water-saving performance of the cleaning method for cleaning circuit boards based on the gantry spray washing device.

[0086] Furthermore, in one embodiment, the step of performing a second water wash on the circuit board 600 through the secondary cleaning mechanism, and simultaneously conveying the wastewater generated from the second water wash to the primary cleaning mechanism, includes: firstly, performing a second water wash on the circuit board 600 through the secondary cleaning mechanism, and simultaneously conveying the wastewater generated from the second water wash to the primary cleaning mechanism, so that the wastewater generated from the second water wash is mixed with the wastewater generated from the first water wash to obtain a first mixed water; then, filtering the first mixed water to remove impurities and sediment. The sediment is removed to obtain the second filtered water. The second filtered water is then transported to the water storage unit 411, that is, it is transported to the water storage unit 411 through the first water outlet pipe 140. After removing impurities and sediment, the wastewater generated by the second water washing treatment has a very low content of chemicals, which dilutes the chemicals after the addition of the wastewater generated by the second water washing treatment. This allows the second filtered water to be used as ultrapure water, enabling the ultrapure water to be recycled and reused. This effectively improves the recycling rate of ultrapure water and further improves the water-saving performance of the cleaning method for cleaning circuit boards based on the gantry spray washing device.

[0087] Furthermore, in one embodiment, the step of performing a third water wash on the circuit board 600 through the three-stage cleaning mechanism, and simultaneously conveying the wastewater generated from the third water wash to the first cleaning mechanism, includes: firstly, performing a third water wash on the circuit board 600 through the three-stage cleaning mechanism, and simultaneously conveying the wastewater generated from the third water wash to the first cleaning mechanism, so that the wastewater generated from the third water wash, the wastewater generated from the second water wash, and the wastewater generated from the first water wash are mixed to obtain a second mixed water; then, the second mixed water is filtered to remove impurities and sediments to obtain a third filtered water; subsequently... The third filtered water is transported to the water storage section 411, that is, the third filtered water is transported to the water storage section 411 through the first water outlet pipe 140. After removing impurities and sediments, the third filtered water contains very little chemical solution in the wastewater generated from the second water washing treatment and a negligible amount of chemical solution in the wastewater generated from the third water washing treatment. This allows the chemical solution to be diluted after being added sequentially to the wastewater generated from the second and third water washing treatments, so that the third filtered water can be used as ultrapure water. This allows the ultrapure water to be recycled and reused, effectively improving the recycling rate of ultrapure water and further improving the water-saving performance of the cleaning method for cleaning circuit boards based on the gantry spray washing device.

[0088] Specifically, the overflow water flow rate of a surface treatment horizontal line is normally 6-8 L / min. Calculated based on 22 hours per day, the amount of ultrapure water lost per day by a single triple water washing structure is (22×60×6) / 1000=7.92 tons. Calculated based on 28 days of production per month, a single surface treatment horizontal line can save 7.92×28×3=665 tons of water per month. That is, by adopting the cleaning method of spraying circuit boards using a gantry spray washing device, the overflow water volume of three triple water washing structures can be saved. In other words, each surface treatment horizontal line can save 665 tons of ultrapure water per month, making the surface treatment horizontal line have good water-saving performance.

[0089] Compared with the prior art, this disclosure has at least the following advantages:

[0090] 1. The cleaning method for circuit boards based on the gantry spray washing device disclosed herein involves spray washing the circuit board 600 when it is lifted from the chemical tank 500. The gantry spray washing device 400 first sprays the circuit board 600 to use ultrapure water to rinse the surface of the circuit board 600, so that the residual chemicals flow back into the chemical tank 500 with the ultrapure water. This avoids a large loss of chemicals and effectively improves the chemical recovery efficiency. It also avoids the problem of the circuit board needing to be "shaken" to discharge chemicals. The gantry spray washing device 400 does not need to "shake" the circuit board to improve the chemical recovery effect and improve the overall line efficiency.

[0091] 2. Further, the gantry spray washing device 400, driven by a conveying mechanism, transports the spray-washed circuit board 600 to the first cleaning mechanism 100, so that the spray-washed circuit board 600 enters the first cleaning mechanism 100 for subsequent first water washing treatment; then, the first cleaning mechanism 100 performs the first water washing treatment on the circuit board 600, so that ultrapure water rinses the board surface and the inner wall of the holes, thereby effectively removing the chemicals brought from the chemical tank on the circuit board; then, the gantry spray washing device 400, driven by a conveying mechanism, transports the circuit board 600 after the first water washing treatment to the second cleaning mechanism 200, so that the first... After the initial water washing, the circuit board 600 enters the secondary cleaning unit 200 for a second water washing process. The secondary cleaning unit 200 then performs a second water washing on the circuit board 600, simultaneously transferring the wastewater from this second washing process to the primary cleaning unit 100. This allows ultrapure water to further rinse the board surface and the inner walls of the holes, effectively removing impurities and ions from the circuit board 600. Because the chemical content on the circuit board 600 after the first water washing is extremely low, the chemical content in the wastewater from the second washing process is also very low. Furthermore, the first water washing process has lower water quality requirements. Therefore, the wastewater generated from the second water washing process meets the requirements for the first water washing of the circuit board 600, allowing the wastewater from the second water washing process to be reused and reducing the waste of ultrapure water. Afterwards, the gantry spray washing device 400, driven by a conveying mechanism, transports the circuit board 600 after the second water washing process to the third cleaning mechanism 300, so that the circuit board 600 after the second water washing process enters the third cleaning mechanism 300 for subsequent third water washing. Then, the circuit board 600 undergoes a third water washing process through the third cleaning mechanism 300, simultaneously removing the wastewater from the first water washing process. Wastewater from the third washing process is transported to the first cleaning unit 100 to thoroughly clean the circuit board 600 with ultrapure water. Simultaneously, wastewater from the third washing process is also transported to the first cleaning unit 100. After the first and second washing processes, the chemical content on the circuit board 600 is negligible, resulting in negligible chemical content in the wastewater from the third washing process. Therefore, the wastewater from the third washing process meets the requirements for the first washing process of the circuit board 600, allowing it to be reused and further reducing the waste of ultrapure water.

[0092] 3. The cleaning method for circuit boards based on a gantry spray washing device disclosed herein transports the wastewater generated from the second water washing process to the first cleaning mechanism 100, allowing the wastewater from the second water washing process to be reused, thus reducing the waste of ultrapure water. Simultaneously, the wastewater generated from the third water washing process is also transported to the first cleaning mechanism 100, allowing the wastewater from the third water washing process to be reused, further reducing the waste of ultrapure water. This avoids the problem in the prior art where the ultrapure water in each of the three-stage water washing structures directly overflows to the wastewater treatment station. In other words, it solves the problem of directly discharging large amounts of ultrapure water from the surface treatment level line in the prior art, and further solves the problem of the difficulty in recycling large amounts of ultrapure water in the prior art, leading to the waste of large amounts of ultrapure water. The cleaning method for circuit boards based on a gantry spray washing device makes it easier to recycle large amounts of ultrapure water, thus resulting in better water-saving performance of the surface treatment level line.

[0093] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A cleaning method for circuit boards based on a gantry spray cleaning device, characterized in that, include: The circuit boards are sprayed and cleaned using a gantry spray cleaning device. The gantry spray washing device is driven by a conveying mechanism to transport the spray-washed circuit board to the first cleaning mechanism. The circuit board is first washed with water using the first cleaning mechanism. The conveying mechanism drives the gantry spray washing device to transport the circuit board after the first water washing treatment to the secondary cleaning mechanism. The circuit board is subjected to a second water washing process by the secondary cleaning mechanism, and the wastewater generated from the second water washing process is simultaneously transported to the primary cleaning mechanism. The conveying mechanism drives the gantry spray washing device to transport the circuit board after the second water washing treatment to the third cleaning mechanism. The circuit board is subjected to a third water wash by the three-stage cleaning mechanism, and the wastewater generated from the third water wash is simultaneously transported to the first-stage cleaning mechanism.

2. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 1, characterized in that, The gantry spray washing device includes a hanger frame, a basket placement assembly, and a spray washing assembly. The power output end of the hanger frame is connected to the basket placement assembly, and the hanger frame is used to drive the basket placement assembly to move up and down. The hanger frame is provided with a water storage section for storing ultrapure water. The spray washing assembly is connected to the basket placement assembly and is connected to the water storage section through a pipe. The basket placement assembly is used to place the circuit board, and the spray washing assembly is arranged opposite to the circuit board. A return flow through hole is opened at the bottom of the basket placement assembly. The hanger frame is connected to the power output end of the conveying mechanism, and the conveying mechanism is used to drive the hanger frame to reciprocate along the arrangement direction of the first cleaning mechanism, the second cleaning mechanism, and the third cleaning mechanism.

3. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 2, characterized in that, The spray washing assembly is provided with multiple spray washing heads, which are spaced apart. Each spray washing head is positioned opposite to a corresponding circuit board and is used to spray ultrapure water.

4. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 1, characterized in that, The primary cleaning mechanism includes a first cleaning tank, a second cleaning tank, and a third cleaning tank arranged in sequence, which are connected sequentially. The third cleaning tank is located adjacent to the secondary cleaning mechanism and is provided with a first inlet pipe for inputting ultrapure water. The first cleaning tank is provided with a first outlet pipe for outputting wastewater generated from the first water washing treatment.

5. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 4, characterized in that, The secondary cleaning mechanism includes a fourth cleaning tank, a fifth cleaning tank, and a sixth cleaning tank arranged sequentially, and the fourth cleaning tank, the fifth cleaning tank, and the sixth cleaning tank are connected sequentially. The fourth cleaning tank is located adjacent to the third cleaning tank, and the sixth cleaning tank is located adjacent to the tertiary cleaning mechanism. The sixth cleaning tank is provided with a second inlet pipe for inputting the ultrapure water, and the fourth cleaning tank is provided with a second outlet pipe for outputting the wastewater generated by the second water washing treatment. The second outlet pipe is connected to the first inlet pipe.

6. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 5, characterized in that, The three-stage cleaning mechanism includes a seventh cleaning tank, an eighth cleaning tank, and a ninth cleaning tank arranged sequentially, and the seventh cleaning tank, the eighth cleaning tank, and the ninth cleaning tank are connected sequentially. The seventh cleaning tank is located adjacent to the sixth cleaning tank. The ninth cleaning tank is provided with a third inlet pipe for inputting the ultrapure water, and the seventh cleaning tank is provided with a third outlet pipe for outputting the wastewater generated by the third water washing treatment. The third outlet pipe is connected to the first inlet pipe and the second outlet pipe, respectively.

7. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 6, characterized in that, The second water outlet pipe is equipped with a first regulating valve, which is used to open or close the second water outlet pipe; the third water outlet pipe is equipped with a second regulating valve, which is used to open or close the third water outlet pipe; both the first regulating valve and the second regulating valve are used to be electrically connected to the controller.

8. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 7, characterized in that, A first connecting pipe is provided between the second water outlet pipe and the third water outlet pipe. The first connecting pipe is provided with a third regulating valve, which is used to open or close the first connecting pipe. A second connecting pipe is provided between the third water outlet pipe and the first water inlet pipe. The second connecting pipe is provided with a fourth regulating valve, which is used to open or close the second connecting pipe. Both the third regulating valve and the fourth regulating valve are used to be electrically connected to the controller.

9. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 8, characterized in that, The step of conveying the wastewater generated from the second water washing treatment to the first cleaning unit includes: The third water outlet pipe is closed by the second regulating valve; The second connecting pipe is opened by the fourth regulating valve; The first connecting pipe is opened by the third regulating valve; Open the second water outlet pipe by using the first regulating valve; The wastewater is transported to the initial cleaning mechanism through the second outlet pipe, the first connecting pipe, the second connecting pipe, and the first inlet pipe.

10. The cleaning method for circuit boards based on a gantry spray cleaning device according to claim 8, characterized in that, The step of conveying the wastewater generated from the third water washing treatment to the first cleaning unit includes: The second water outlet pipe is closed by the first regulating valve; The second connecting pipe is opened by the fourth regulating valve; The first connecting pipe is shut off by the third regulating valve; The third water outlet pipe is opened by the second regulating valve; The wastewater is transported to the initial cleaning mechanism through the third outlet pipe, the second connecting pipe, and the first inlet pipe.

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