Power supply module with sandwich structure

Abstract

The invention discloses a power module with a sandwich structure. The power module comprises an inductor group, a PCB (Printed Circuit Board) and a power device chip which are stacked, wherein the inductor group comprises a magnetic core and a winding. The two ends of the winding are bent, then extend on the plane of the PCB and are welded to the PCB. Meanwhile, the surface of the magnetic core is covered with a metal sheet, and the metal sheet is used for being connected to a high-power pin of a power device chip through a PCB. Compared with the prior art, the power supply module has the advantages that the area on a PCB (Printed Circuit Board) can be reduced, so that the load current / power density is improved. Moreover, the power supply module transmits the output current through the pin (winding) of the inductor, so that the wiring of an output current loop on the PCB can be reduced, the high impedance of the wiring of the PCB is avoided, and the circuit efficiency is improved. In addition, the structure that the power device chip is arranged on the upper portion and the inductor group is arranged on the lower portion can greatly benefit from top cooling systems usually adopted in GPU, CPU and ASIC systems.

Description

[0001] This application is a divisional application of invention patent application No. 202210194822.2 entitled "A power module with a sandwich structure", filed on March 1, 2022. Technical Field

[0002] This invention relates to electronic components, and more specifically, to power module structures. Background Technology

[0003] Typically, power converters are used to convert input power into output power with appropriate voltage and current to supply a load. Multiphase power converters consist of multiple parallel, staggered power stages, thus offering advantages such as low output voltage ripple, fast transient response, and low rated ripple current requirements for the input capacitor. Due to these advantages, multiphase power converters are widely used in applications requiring high output current and low voltage, such as servers and microprocessors.

[0004] The rapid development of modern GPUs (Graphics Processing Units) and CPUs (Central Processing Units) has placed increasingly higher demands on the current-carrying capacity of multiphase power converters. At the same time, these processors are becoming smaller and smaller, meaning that the size of the multiphase power converter needs to be reduced accordingly. The increasing current and decreasing size further complicate the heat dissipation of multiphase power converters. In other words, a power converter with high current density, high efficiency, and excellent heat dissipation capabilities is needed. Summary of the Invention

[0005] The purpose of this invention is to provide a power module with a sandwich structure, wherein the power module integrates the inductor, power switch and driver of the power circuit system into a smaller module.

[0006] A power module according to an embodiment of the present invention includes: an inductor assembly, a PCB (printed circuit board) top plate located above the inductor assembly, a PCB bottom plate located below the inductor assembly, a connector, and a first power device chip and a second power device chip. The inductor assembly includes a magnetic core and a first winding and a second winding passing through the magnetic core. Each winding has a first end, a second end, and an intermediate portion connecting the first end and the second end, the intermediate portion being located within the magnetic core. The first end is bent and extends in a plane perpendicular to the length direction of the intermediate portion, and the second end is bent and extends in a plane perpendicular to the length direction of the intermediate portion. The connector is used to connect the PCB top plate and the PCB bottom plate, wherein the connector has multiple metal pillars, respectively soldered to the PCB top plate and the PCB bottom plate. The first power device chip is electrically connected to the first winding through the PCB top plate, and the second power device chip is electrically connected to the second winding through the PCB top plate.

[0007] A power module according to an embodiment of the present invention includes an inductor assembly, a top PCB plate above the inductor assembly, a bottom PCB plate below the inductor assembly, a connector, a first power switch, a second power switch, a third power switch, and a fourth power switch. The inductor assembly includes a magnetic core and a first winding and a second winding passing through the magnetic core. The connector is used to connect the top PCB plate and the bottom PCB plate, wherein the connector has a plurality of metal posts and extends from a first corner of the top PCB plate to a second corner of the top PCB plate. The first power switch has a first terminal, a second terminal, and a control terminal. The second power switch has a first terminal, a second terminal, and a control terminal, wherein the first terminal of the second power switch is electrically connected to the second terminal of the first power switch to form a first connection terminal. The third power switch has a first terminal, a second terminal, and a control terminal. The fourth power switch has a first terminal, a second terminal, and a control terminal, wherein the first terminal of the fourth power switch is electrically connected to the second terminal of the third power switch to form a second connection terminal. The first connection terminal is electrically connected to a first winding, and the second connection terminal is electrically connected to a second winding.

[0008] According to an embodiment of the present invention, a power module with a sandwich structure has the following advantages: (1) compared with the power module with a flat structure in the prior art, it can reduce the area on the PCB board, thereby increasing the load current / power density; (2) by transmitting the output current through the inductor's lead (winding), it can reduce the traces of the output current loop on the PCB board, avoid the high impedance of the PCB board traces, and thus improve the circuit efficiency; and (3) the structure of the power module of the present invention with the power device chip on top and the inductor group on the bottom can greatly benefit from the top cooling system commonly used in GPU, CPU and ASIC systems. Attached Figure Description

[0009] To better understand this invention, it will be described in detail with reference to the following figures:

[0010] Figure 1 A schematic diagram of the circuit structure of an existing multiphase power converter 10 is shown;

[0011] Figure 2 A schematic diagram of a power module 20 with a mezzanine structure integrating a dual-phase power converter according to an embodiment of the present invention is shown.

[0012] Figure 3 An exploded three-dimensional view of an inductor assembly 30 according to an embodiment of the present invention is shown;

[0013] Figure 4 An exploded three-dimensional view of an inductor assembly 40 according to an embodiment of the present invention is shown;

[0014] Figure 5 An exploded three-dimensional view of an inductor assembly 50 according to an embodiment of the present invention is shown;

[0015] Figure 6 A schematic diagram of the structure of a magnetic core 60 according to an embodiment of the present invention is shown;

[0016] Figure 7 A schematic diagram of the structure of a magnetic core 70 according to an embodiment of the present invention is shown. Detailed Implementation

[0017] In the following description, specific details, such as the specific circuit structures and parameters of these circuit elements in the embodiments, are provided to provide a better understanding of the embodiments of the present invention. Those skilled in the art will understand that embodiments of the present invention can be implemented even in the absence of certain details or other combinations of methods, elements, materials, etc. Furthermore, the term "coupled" as used herein means a direct connection or an indirect connection via other circuit elements.

[0018] The embodiments described below will illustrate the devices and operating methods of various embodiments of the present invention using specific implementation devices and application backgrounds as examples, so that those skilled in the art can better understand the present invention. However, those skilled in the art should understand that these descriptions are merely exemplary and are not intended to limit the scope of the present invention.

[0019] Figure 1 A schematic diagram of the circuit structure of a conventional multiphase power converter 10 is shown. Figure 1 As shown, the multiphase power converter 10 includes a controller 101, N power devices 103, and N inductors L1, where N is an integer and N>1. Figure 1 As shown, each power stage 102, also referred to as each phase 102, includes a power device 103 and an inductor L1. Each power device 103 includes power switches M1 and M2, and a driver DR1 for driving the power switches M1 and M2. The controller 101 provides N-phase control signals 105-1 to 105-N to control the N power devices 103 respectively, so as to control the N-phase 102 to operate in staggered phases. That is, the N inductors L1 sequentially draw energy from the input terminal and sequentially provide energy to the load 104. It should be understood that in Figure 1 In this example, connecting the outputs of each phase of the multiphase power converter 10 together to provide energy to the load is just one application. In other applications, the multiphase power converter 10 can also operate as multiple single-phase power converters, meaning that each phase can be connected to an independent load and provide different output voltages to meet the needs of different loads.

[0020] Figure 1The power stage 102 with BUCK topology shown is merely an example. Those skilled in the art will understand that power stages with other topologies are also applicable to the multiphase power converters of this embodiment.

[0021] In the following embodiments of the invention, the inductor L1 can be implemented using a coupled inductor or N single inductors.

[0022] When N=2, the multiphase power converter 10 is used as a two-phase power converter, or two independent power converters.

[0023] Figure 2 A schematic diagram of a power module 20 with a mezzanine structure integrating a dual-phase power converter, according to an embodiment of the present invention, is shown. Figure 1 In this configuration, when N=2, the power stage 102 can be implemented using a power module 20. The mezzanine power module 20 includes: a PCB (Printed Circuit Board) base plate 201 located at the bottom of the power module 20; an inductor group 206 located on the PCB base plate 201, including two inductors, each having a first terminal and a second terminal; a PCB top plate 202 located on the inductor group 206; a connector 204 having multiple metal pillars 205, each metal pillar 205 being soldered to corresponding pads PD1 and PD2 on the PCB top plate 202 and the PCB base plate 201 respectively; and two power device chips 203 located on top of the PCB top plate 202, each power device chip 203 having one or more pins (e.g., ...). Figure 1 The pin SW connected to inductor L1 is shown and connected to the second end of the inductor in inductor group 206 via PCB top plate 202; wherein each inductor has a winding 207, the two ends of which are bent to a plane perpendicular to the length direction of winding 207 and extend on PCB top plate 202 and PCB bottom plate 201. Figure 2 As shown, after being assembled with the inductor group 206, the PCB base plate 201 has an upper surface 201-t facing the inductor group 206 and a lower surface 201-b opposite to the upper surface 201-t. After being assembled with the inductor group 206, the PCB top plate 202 has a lower surface 202-b facing the inductor group 206 and an upper surface 201-t opposite to the lower surface 202-b.

[0024] exist Figure 2In the power module 20, discrete components 208 are further located on the top plate 202 of the PCB. Discrete components 208 is a general term that includes discrete resistors, discrete capacitors, etc. involved in the power converter 10, such as the input capacitor used to provide pulse current at the input terminal of the power converter 10, and the filter capacitors and resistors used to power the power switch driver and internal logic circuits.

[0025] In one embodiment, the metal pillar 205 comprises a copper pillar for soldering the PCB base plate 201 to the PCB top plate 202. Those skilled in the art will understand that any metal pillar suitable for electrically connecting two PCBs can be used in this invention.

[0026] The power module 20 is typically mounted on the processor's motherboard and provides power to the devices on the motherboard. A PCB base plate 201 is soldered to the motherboard, and some pins of the power module 20 are soldered to the motherboard via the PCB base plate 201. In some embodiments, the PCB base plate 201 may be omitted. The power module 20 can be directly soldered to the motherboard via a connector 204 and an inductor assembly 206. In one embodiment, the connector has multiple metal posts 205, and the multiple metal posts 205 of the connector 204 extend from a first corner of the PCB top plate 202 to a second corner of the PCB top plate 202. In one embodiment, the metal posts 205 have the same size and shape.

[0027] In this invention, the power device chip is stacked on top of the inductor array, such as... Figure 2 As shown, this saves space on the PCB board for the power converter 10. Each power device chip 203 integrates, as shown in the diagram. Figure 1 The power device 103 shown includes, for example, the following. Figure 1 The power switches M1 and M2 shown, and the driver DR1 used to drive the power switches M1 and M2, and Figure 1The circuitry connected to the auxiliary winding is not shown in the diagram. In one embodiment, each power device chip 203 includes a power pin VIN for receiving an input voltage Vin, a pin SW for supplying power to the load 104 via inductor L1, a pin PWM for receiving control signals (e.g., 105-1 to 105-N) from the controller 101, and a ground pin GND. The pins of the power device chip 203 are soldered to pads on the top plate of the PCB 202, and then the pads on the top plate of the PCB 202 are electrically connected to the pads on the bottom plate of the PCB 201 via the inductor group 206 and connector 204. Thus, the bottom plate of the PCB 201 provides electrical connection to the power device chip 203. The power module 20 also includes a metal sheet 209 for conducting large current signals such as a reference ground. The metal sheet 209 covers a portion of the core area of ​​the inductor group 206 and is soldered to both the top plate of the PCB 202 and the bottom plate of the PCB 201. The position of the metal sheet 209 depends on the position of the ground pin of the power device chip 203. Figure 2 In this embodiment, the metal sheet 209 mainly wraps around the side of the inductor group 206, with its two ends bent to form a soldering area on the upper and lower surfaces of the inductor group 206 that is close to the corresponding pads on the PCB board. Thus, on the horizontal plane, i.e. the plane of the PCB board, a large area of ​​metal sheet 209 is used to replace PCB traces to carry large current, thereby reducing circuit loss and improving circuit efficiency.

[0028] Figure 3 An exploded three-dimensional view of an inductor assembly 30 according to an embodiment of the present invention is shown. The inductor assembly 30 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 3 As shown, the inductor assembly 30 includes: a magnetic core, including a first magnetic core portion 301 and a second magnetic core portion 302, wherein the first magnetic core portion 301 and the second magnetic core portion 302 are combined together to form two channels 303-1 and 303-2 at their joint surface; and windings 304-1 and 304-2, which pass through channels 303-1 and 303-2 respectively.

[0029] exist Figure 3 In the embodiment, when the inductor group 30 is applied Figure 2 When the power module 20 is shown, channels 303-1 and 303-2 are parallel to the PCB base plate 201 and the PCB top plate 202, that is, channels 303-1 and 303-2 have a direction along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis A shown.

[0030] exist Figure 3In this embodiment, the winding 304-1 has a first end 304-3 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 304-5 that is bent at 90 degrees and extends along the surface of the magnetic core, covering a portion of the surface. This extended portion also extends along the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 304-3 and the second end 304-5 of the winding 304-1 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the sides of their extended surfaces also extend along the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 304-2 has a first end 304-4 that is bent at 90 degrees and extends on the surface of the magnetic core, covering a portion of the surface. This extended portion also extends on the surface of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 304-6 that is bent at 90 degrees and extends on the surface of the magnetic core, covering a portion of the surface. This extended portion also extends on the surface of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 304-4 and the second end 304-6 of the winding 304-2 extend along a plane perpendicular to the magnetic core channels 303-1 and 303-2, and the sides of their extended surfaces also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0031] exist Figure 3 In this embodiment, the shapes of the first magnetic core portion 301 and the second magnetic core portion 302 are not symmetrical. The first magnetic core portion 301 has a planar shape, and the second magnetic core portion 302 has two channels. Channels 303-1 and 303-2 are respectively formed by the two channels of the second magnetic core portion 302 and one surface 301-1 of the first magnetic core portion 301. Figure 3 As shown.

[0032] exist Figure 3 In this embodiment, winding 304-1 has a first end 304-3, a second end 304-5, and an intermediate portion 304-7 connecting the first end 304-3 and the second end 304-5. The intermediate portion 304-7 is located within the magnetic core. The intermediate portion 304-7 has a length L parallel to the PCB top plate 202 and the PCB bottom plate 201, and a depth D perpendicular to the PCB top plate 202 and a width W. The depth D of the intermediate portion 304-7 is greater than the width W. Winding 304-2 has a first end 304-4, a second end 304-6, and an intermediate portion 304-8 connecting the first end 304-4 and the second end 304-6. The intermediate portion 304-8 is located within the magnetic core. The depth D of the intermediate portion 304-8 is greater than the width W.

[0033] exist Figure 3 In this embodiment, windings 304-1 and 304-2 are C-shaped. The opening of the C-shape of winding 304-1 faces the first side (e.g., the left side) of the magnetic core, and the opening of the C-shape of winding 304-2 faces the second side (e.g., the right side) of the magnetic core, with the first and second sides parallel to each other. Figure 3 In the embodiment, the first end 304-3 of winding 304-1 and the first end 304-4 of winding 304-2 cover part of the third side of the magnetic core, and the second end 304-5 of winding 304-1 and the second end 304-6 of winding 304-2 cover part of the fourth side of the magnetic core, and the third side and the fourth side are parallel to each other.

[0034] exist Figure 3 In this embodiment, the first end 304-3 of the winding 304-1 is soldered to the top plate of the PCB 202 to receive a first signal from the connection terminal (via pin SW) of the first power device chip 203, and the first end 304-4 of the winding 304-2 is soldered to the top plate of the PCB 202 to receive a second signal from the connection terminal (via pin SW) of the second power device chip 203.

[0035] exist Figure 3 In this embodiment, metal sheets 305-1 and 305-2 are L-shaped. Both ends of metal sheets 305-1 and 305-2 are soldered to the top plate 202 and the bottom plate 201 of the PCB, respectively. One end of metal sheets 305-1 and 305-2 soldered to the top plate 202 is bent at 90 degrees and extends on the surface of the magnetic core, which is equivalent to extending on the surface of the top plate 202. It is electrically connected to the ground pin of the power device chip 203 through the pads of the top plate 202, thereby reducing the traces and their impedance on the top plate 202.

[0036] Figure 4 An exploded three-dimensional view of an inductor assembly 40 according to an embodiment of the present invention is shown. The inductor assembly 40 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 4 As shown, the inductor assembly 40 includes: a magnetic core comprising a first magnetic core portion 401 and a second magnetic core portion 402, wherein the first magnetic core portion 401 and the second magnetic core portion 402 are combined together to form two channels 403-1 and 403-2 at their joint surface; and windings 404-1 and 404-2, wherein winding 404-1 has an intermediate portion 404-7 connecting a first end 404-3 and a second end 404-5, and winding 404-2 has an intermediate portion 404-8 connecting a first end 404-4 and a second end 404-6. The intermediate portions 404-7 and 404-8 of windings 404-1 and 404-2 respectively pass through channels 403-1 and 403-2.

[0037] exist Figure 4 In the embodiment, when the inductor group 40 is applied Figure 2 When the power module 20 is shown, channels 403-1 and 403-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 403-1 and 403-2 have a direction along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis B shown.

[0038] exist Figure 4 In this embodiment, the winding 404-1 has a first end 404-3 that is bent at 90 degrees and extends along the surface 410-t of the magnetic core 410, covering a portion of the surface. This extended portion also extends along the surface 202-b of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 404-5 that is bent at 90 degrees and extends along the surface 410-b of the magnetic core 410, covering a portion of the surface. This extended portion also extends along the surface 201-t of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 404-3 and the second end 404-5 of the winding 404-1 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and their extension surfaces also extend along the surfaces of the PCB top plate 202 and the PCB bottom plate 201. Similarly, the winding 404-2 has a first end 404-4 bent at 90 degrees and extending on the surface 410-t of the magnetic core 410, covering a portion of the surface. This extended portion also extends on the surface 202-b of the PCB top plate 202 and is soldered to the PCB top plate 202. It also has a second end 404-6 bent at 90 degrees and extending on the surface 410-b of the magnetic core 410, covering a portion of the surface. This extended portion also extends on the surface 201-t of the PCB bottom plate 201 and is soldered to the PCB bottom plate 201. In other words, the first end 404-4 and the second end 404-6 of the winding 404-2 extend along a plane perpendicular to the magnetic core channels 403-1 and 403-2, and their extension surfaces also extend on the surfaces of the PCB top plate 202 and the PCB bottom plate 201.

[0039] In some embodiments, the second end 404-5 of winding 404-1 and the second end 404-6 of winding 404-2 may not be bent. Whether the second end of the winding is bent, the direction of the bend, and the shape of the extension surface depend on the position of the corresponding pad on the PCB base plate 201, or if there is no PCB base plate 202, it depends on the position of the corresponding pad on the motherboard where the power module 20 is located.

[0040] exist Figure 4In this embodiment, the first magnetic core portion 401 and the second magnetic core portion 402 of the magnetic core 410 are not symmetrically aligned. The first magnetic core portion 401 has a planar shape, and the second magnetic core portion 402 has two channels. The channels 403-1 and 403-2 are respectively formed by the two channels of the second magnetic core portion 402 and one surface 401-1 of the first magnetic core portion 401.

[0041] exist Figure 4 In this embodiment, metal sheets 405-1 and 405-2 are C-shaped. Both ends of metal sheets 405-1 and 405-2 are soldered to the top plate 202 and the bottom plate 201 of the PCB, respectively. One end 405-1b and 405-2b of metal sheets 405-1 and 405-2, which are soldered to the bottom plate 201, are bent at 90 degrees and extended on the surface of the magnetic core, i.e., extended on the upper surface 201-t of the bottom plate 201. This extended surface is soldered to the corresponding pads of the bottom plate 201, thereby reducing the traces and their impedance on the bottom plate 201. Similarly, metal sheets 405-1 and 405-2 are soldered to one end 405-1a and 405-2a of the PCB top plate 202, bent at 90 degrees, and extended on the surface of the magnetic core, which is equivalent to extending on the lower surface 202-b of the PCB top plate 202. They are electrically connected to the ground pin of the power device chip 203 through the pads of the PCB top plate 202, thereby reducing the traces and their impedance on the PCB top plate 202.

[0042] Figure 5 An exploded three-dimensional view of an inductor assembly 50 according to an embodiment of the present invention is shown. The inductor assembly 50 can be used as... Figure 2 Inductor group 206 in the power module. For example... Figure 5 As shown, the inductor assembly 50 includes: a magnetic core 510, comprising a first magnetic core portion 501 and a second magnetic core portion 502, wherein the first magnetic core portion 501 and the second magnetic core portion 502 are combined together to form two channels 503-1 and 503-2 at their joint surface; and windings 504-1 and 504-2, wherein winding 504-1 has an intermediate portion 504-7 connecting a first end 504-3 and a second end 504-5, and winding 504-2 has an intermediate portion 504-8 connecting a first end 504-4 and a second end 504-6. The intermediate portions 504-7 and 504-8 of windings 504-1 and 504-2 respectively pass through channels 503-1 and 503-2 of the magnetic core 510. Figure 5 In the embodiment, the first end 504-3 of the winding 504-1 extends in at least two dimensions on the surface of the magnetic core 510 to form an "L" shape.

[0043] exist Figure 5 In the embodiment, when the inductor group 50 is applied Figure 2When the power module 20 is shown, channels 503-1 and 503-2 are perpendicular to the PCB base plate 201 and the PCB top plate 202, that is, channels 503-1 and 503-2 have a direction along the PCB base plate 201 and the PCB top plate 202. Figure 2 The radial direction of axis B shown.

[0044] exist Figure 5 In this embodiment, the metal sheet 505 is C-shaped. Both ends of the metal sheet 505 are soldered to the top PCB plate 202 and the bottom PCB plate 201, respectively. One end 505-a of the metal sheet 505 soldered to the bottom PCB plate 201 is bent at a 90-degree angle and extends on the surface of the magnetic core, i.e., it extends on the upper surface 201-t of the bottom PCB plate 201. This extended surface is soldered to the corresponding pads on the bottom PCB plate 201, thereby reducing the traces and their impedance on the bottom PCB plate 201. Similarly, one end 505-b of the metal sheet 505 soldered to the top PCB plate 202 is bent at a 90-degree angle and extends on the surface of the magnetic core, i.e., it extends on the lower surface 202-b of the top PCB plate 202, and is electrically connected to the ground pin of the power device chip 203 through the pads on the top PCB plate 202, thereby reducing the traces and their impedance on the top PCB plate 202. Figure 5 In this embodiment, the portion of the metal sheet 505 that wraps around the side of the magnetic core is extended as much as possible to increase the area and reduce its own impedance.

[0045] and Figure 4 Compared to the inductor group 40 shown, Figure 5 The inductor group 50 has a single metal plate 505 for electrically connecting the ground pin of the power device chip 203 to the PCB substrate 201. Figure 4 compared to, Figure 5 With one less metal sheet, the metal sheet 505 and windings 504-1 and 504-2 can have a larger area that can be extended on the upper and lower surfaces of the magnetic core, thus giving the power device chip 203 more flexibility in the distribution of ground pins.

[0046] Figure 5 In the middle, the first magnetic core portion 501 and the second magnetic core portion 502 of the magnetic core are... Figure 4 The magnetic core structures are similar, and for the sake of brevity, they will not be described in detail here.

[0047] Figure 6 A schematic diagram of the structure of a magnetic core 60 according to an embodiment of the present invention is shown. Figure 6 In this configuration, the magnetic core 60 includes a first magnetic core portion 601 and a second magnetic core portion 602 with symmetrical and consistent shapes, wherein each magnetic core portion has two channels. When the magnetic core 60 is used... Figures 3-5 In the embodiment of the inductor assembly, the channels of the two magnetic core portions overlap to form two channels through which the winding passes.

[0048] Figure 7 A schematic diagram of the structure of a magnetic core 70 according to an embodiment of the present invention is shown. Figure 7 In this structure, the magnetic core 70 includes a first magnetic core portion 701, a second magnetic core portion 702, and third magnetic core portions 703-1 to 703-3. The first magnetic core portion 701, the second magnetic core portion 702, and the third magnetic core portions 703-1 and 703-2 form a first channel 704-1. The first magnetic core portion 701, the second magnetic core portion 702, and the third magnetic core portions 703-2 and 703-3 form a second channel 704-2. Figure 7 As can be seen, more core channels can be constructed when there are more third core sections. The first core section 701, the second core section 702, and the third core sections 703-1 to 703-3 can be made of different materials, thereby providing a more flexible and adjustable inductance-current curve.

[0049] In some embodiments of the present invention, the various core portions of the magnetic core may be made of the same material but have different shapes, or they may be made of different materials, such as ferrite, iron powder, or other suitable materials, in order to achieve the desired inductance-current characteristic curve, for example, having a large inductance value at small currents and a small inductance value at large currents. Having a large inductance value at small currents can make the system more efficient, while having a small inductance value at large currents can make the system's transient response better.

[0050] For the purpose of concisely explaining the principles of this invention, Figures 3-5 The embodiments shown only depict magnetic cores with dual channels that can pass through dual windings. Those skilled in the art will understand that, depending on the application requirements, the magnetic core can have any number of channels passing through any number of windings; single-channel or multi-channel configurations are both consistent with the spirit of this invention.

[0051] In some embodiments, air gaps may exist between different core portions of the magnetic core to form coupled inductors. In other embodiments, there are no air gaps between the core portions, thereby forming multiple single inductors.

[0052] In some embodiments of the present invention, in order to make the surface of the inductor module flat, the windings and metal sheets covering the surface of the magnetic core are embedded in the surface of the magnetic core, such as... Figures 3-5 As shown.

[0053] Based on the above teachings, many modifications and variations of the present invention are obviously possible. Therefore, it should be understood that the present invention may not be practiced according to the specific description above, within the scope defined by the claims. It should also be understood that the above disclosure relates only to some preferred embodiments of the present invention, and modifications may be made to the present invention without departing from the spirit and scope defined by the claims. When only one preferred embodiment is disclosed, it is readily apparent to those skilled in the art that modifications can be made and implemented without departing from the spirit and scope defined by the claims.

Claims

1. A power supply module, comprising: An inductor assembly includes a magnetic core and a first winding and a second winding passing through the magnetic core, wherein each winding has a first end, a second end, and an intermediate portion connecting the first end and the second end, the intermediate portion being located within the magnetic core, the first end being bent and extending in a plane perpendicular to the length direction of the intermediate portion, and the second end being bent and extending in a plane perpendicular to the length direction of the intermediate portion. The PCB (printed circuit board) top plate is located above the inductor group; The PCB base plate is located below the inductor group; A connector for connecting the PCB top plate and the PCB bottom plate, wherein the connector has a plurality of metal posts, which are respectively soldered to the PCB top plate and the PCB bottom plate; as well as A first power device chip and a second power device chip, wherein the first power device chip is electrically connected to the first winding via the PCB top plate, and the second power device chip is electrically connected to the second winding via the PCB top plate.

2. The power module as claimed in claim 1, wherein the length direction of the middle portion is perpendicular to the top plate of the PCB and perpendicular to the bottom plate of the PCB, the first end covers a portion of the upper surface of the magnetic core, and the second end covers a portion of the lower surface of the magnetic core.

3. The power module as claimed in claim 1, wherein the length direction of the middle portion is parallel to the top plate of the PCB and parallel to the bottom plate of the PCB, and the middle portion also has a depth perpendicular to the top plate of the PCB and a width perpendicular to the length and the depth, wherein the depth of the middle portion is greater than the width.

4. The power module as claimed in claim 1, wherein the first winding and the second winding are C-shaped, the opening of the C-shape of the first winding faces the first side of the magnetic core, the opening of the C-shape of the second winding faces the second side of the magnetic core, and the first side and the second side are parallel to each other.

5. The power module of claim 3, wherein the first end covers a portion of the third side surface of the magnetic core, the second end covers a portion of the fourth side surface of the magnetic core, and the third side surface and the fourth side surface are parallel to each other.

6. The power module of claim 1, wherein the first end of the first winding and the first end of the second winding are embedded in a portion of the surface of the magnetic core, and the second end of the first winding and the second end of the second winding are embedded in a portion of the surface of the magnetic core.

7. The power module of claim 1, wherein the magnetic core has two channels, and the middle portion of the first winding and the middle portion of the second winding respectively pass through the two channels.

8. The power module of claim 1 further includes at least one metal sheet, wherein the metal sheet is "C" shaped and has a first end bent to extend and be soldered to the top plate of the PCB and a second end bent to extend and be soldered to the bottom plate of the PCB.

9. The power module of claim 1, further comprising at least one metal sheet, wherein the metal sheet is L-shaped, the metal sheet having a first end bent to extend and be soldered to the top plate of the PCB and a second end soldered to the bottom plate of the PCB.

10. The power module of claim 1, further comprising at least one metal sheet, wherein the metal sheet is used for electrical connection via the PCB top plate to the ground pins of the first power device chip and the second power device chip.

11. The power module of claim 1, wherein the first power device chip and the first power device chip each comprise: A first power switch has a first terminal, a second terminal, and a control terminal; as well as The second power switch has a first terminal, a second terminal, and a control terminal, wherein the first terminal of the second power switch is electrically connected to the second terminal of the first power switch, and the connection terminal of the first power switch and the second power switch is electrically connected to the first terminal corresponding to the first winding or the second winding.

12. The power module of claim 11, wherein the first end of the first winding is soldered to the top plate of the PCB to receive a first signal from the connection terminal of the first power device chip, and the first end of the second winding is soldered to the top plate of the PCB to receive a second signal from the connection terminal of the second power device chip.

13. A power supply module, comprising: An inductor assembly includes a magnetic core and a first winding and a second winding passing through the magnetic core; The PCB (printed circuit board) top plate is located above the inductor group; The PCB base plate is located below the inductor group; A connector for connecting the PCB top plate and the PCB bottom plate, wherein the connector has a plurality of metal posts and extends from a first corner of the PCB top plate to a second corner of the PCB top plate; A first power switch has a first terminal, a second terminal, and a control terminal; A second power switch has a first terminal, a second terminal, and a control terminal, wherein the first terminal of the second power switch is electrically connected to the second terminal of the first power switch to form a first connection terminal; A third power switch, having a first terminal, a second terminal, and a control terminal; and A fourth power switch has a first terminal, a second terminal, and a control terminal, wherein the first terminal of the fourth power switch is electrically connected to the second terminal of the third power switch to form a second connection terminal; The first connection terminal is electrically connected to the first winding, and the second connection terminal is electrically connected to the second winding.

14. The power module of claim 13, wherein each winding has a first end, a second end, and an intermediate portion connecting the first end and the second end, the intermediate portion being located within the magnetic core, the first end being bent and extending in a plane perpendicular to the length direction of the intermediate portion, and the first end and the second end being bent and extending in a plane perpendicular to the length direction of the intermediate portion.

15. The power module of claim 14, wherein the length direction of the middle portion is perpendicular to the top plate of the PCB and perpendicular to the bottom plate of the PCB.

16. The power module of claim 14, wherein the first end covers a portion of the upper surface of the magnetic core, and the second end covers a portion of the lower surface of the magnetic core.

17. The power module of claim 14, wherein the first end is embedded in a portion of the upper surface of the magnetic core, and the second end is embedded in the lower surface of the magnetic core.

18. The power module of claim 13, wherein the first winding and the second winding are C-shaped, the opening of the C-shape of the first winding faces the first side of the magnetic core, the opening of the C-shape of the second winding faces the second side of the magnetic core, and the first side and the second side are parallel to each other.

19. The power module of claim 14, wherein the length direction of the middle portion is parallel to the top plate of the PCB and parallel to the bottom plate of the PCB.

20. The power module of claim 14, wherein the first end covers a portion of the third side surface of the magnetic core, the second end covers a portion of the fourth side surface of the magnetic core, and the third side surface and the fourth side surface are parallel to each other.

21. The power module of claim 14, wherein the first end is embedded in a portion of the third surface of the magnetic core, and the second end is embedded in the fourth surface of the magnetic core, and the third side and the fourth side are parallel to each other.

22. The power module of claim 14, wherein the first end extends in an "L" shape in at least two dimensions of a portion of the surface of the magnetic core.

23. The power module of claim 14, wherein the magnetic core has two channels, and the middle portion of the first winding and the middle portion of the second winding respectively pass through the two channels.

24. The power module of claim 13, further comprising at least one metal sheet, wherein the metal sheet is C-shaped and has a first end bent to extend and be soldered to the top plate of the PCB and a second end bent to extend and be soldered to the bottom plate of the PCB.

25. The power module of claim 13, further comprising at least one metal sheet, wherein the metal sheet is L-shaped and has a first end bent to extend and be soldered to the top plate of the PCB and a second end soldered to the bottom plate of the PCB.

26. The power module of claim 13, further comprising at least one metal sheet, wherein the metal sheet is used for electrical connection to a reference ground via the top plate of the PCB.

27. The power module of claim 13, wherein the metal pillars have the same size and shape.

28. The power module of claim 14, wherein the first end of the first winding is soldered to the top plate of the PCB to receive a first signal from the first connection end, and the first end of the second winding is soldered to the top plate of the PCB to receive a second signal from the second connection end.

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