Case and near space aerostat

Abstract

The invention discloses a case and a near space aerostat, the case comprises a case body, a plurality of mounting cavities arranged at intervals in the height direction of the case body are defined in the case body, the case body is of a multi-layer structure stacked in sequence and comprises a metal layer, a matrix layer and a graphene layer, the matrix layer is located between the metal layer and the graphene layer, and the graphene layer is located between the metal layer and the graphene layer; the metal layer is located on the inner side of the base body layer, and the base body layer is a carbon fiber piece. According to the case, light weight can be achieved, the space utilization rate can be increased conveniently, and the case has good electromagnetic shielding performance, electrical conductivity and heat conduction performance.

Description

Technical Field

[0001] This invention relates to the field of near-space airship technology, and more specifically, to a chassis and a near-space airship. Background Technology

[0002] In related technologies, the chassis adopts a metal chassis structure design, but the weight of metal chassis is relatively heavy, which is not conducive to the requirements of lightweight development; or, the chassis adopts a carbon fiber sensing chassis structure design, but the thermal conductivity, electrical conductivity and electromagnetic shielding performance of carbon fiber sensing chassis are poor, which cannot meet the required usage requirements. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a chassis that is lightweight, facilitates improved space utilization, and has good electromagnetic shielding, electrical conductivity, and thermal conductivity.

[0004] Another object of the present invention is to provide a near-space airship having the above-described chassis.

[0005] According to an embodiment of the present invention, a chassis includes: a chassis body, wherein a plurality of mounting cavities are defined within the chassis body at intervals along the height direction of the chassis body, the chassis body is a multi-layer structure stacked sequentially and includes a metal layer, a substrate layer and a graphene layer, the substrate layer is located between the metal layer and the graphene layer, and the metal layer is located inside the substrate layer, the substrate layer being a carbon fiber component.

[0006] According to the embodiments of the present invention, the chassis defines multiple mounting cavities spaced apart along the height direction of the chassis body, enabling the spaced placement of multiple electronic components while ensuring a compact structure, which is beneficial for improving space utilization. Furthermore, the chassis body is a multi-layered structure stacked sequentially, including a metal layer, a substrate layer, and a graphene layer. The substrate layer is located between the metal layer and the graphene layer, with the metal layer situated inside the substrate layer. The substrate layer is made of carbon fiber, which reduces the weight of the chassis body, meeting the lightweight requirements of the chassis. It also improves the electromagnetic shielding and conductivity of the chassis, ensuring good grounding performance, and provides good thermal conductivity for easy heat dissipation.

[0007] In addition, the chassis according to the above embodiments of the present invention may also have the following additional technical features:

[0008] According to some embodiments of the present invention, the chassis body includes: a chassis body, wherein the chassis bodies are a plurality of chassis bodies stacked sequentially along the height direction of the chassis bodies, each chassis body includes a bottom plate and a plurality of side plates, the plurality of side plates are interconnected along the circumferential direction of the bottom plate and connected to the outer edge of the bottom plate, the bottom plate and the plurality of side plates together define the mounting cavity; and a cover plate, the cover plate being disposed over the opening of the uppermost mounting cavity.

[0009] According to some embodiments of the present invention, a plurality of first connecting blocks are provided on the lower end surface of the bottom plate of the upper box body in two adjacent box bodies, which are spaced apart along the circumferential direction of the bottom plate, and a plurality of the side plates of the other box body are connected to a plurality of the first connecting blocks.

[0010] According to some embodiments of the present invention, the first connecting block is provided with a first mounting hole, which extends along the length direction of the first connecting block and penetrates a portion of the first connecting block.

[0011] According to some embodiments of the present invention, the base plate is provided with heat dissipation grooves.

[0012] According to some embodiments of the present invention, the chassis body further includes a bottom cover, which covers the lower side of the chassis body located at the bottom.

[0013] According to some embodiments of the present invention, the end face of the cover plate facing the box body is provided with an extension extending in the circumferential direction of the cover plate, the extension extending into the opening of the uppermost mounting cavity.

[0014] According to some embodiments of the present invention, the extension is formed as an annular portion and a plurality of second connecting blocks are provided on the inner side of the annular portion at intervals along the extension direction of the extension portion, and the plurality of second connecting blocks are connected to the plurality of side plates located at the topmost position.

[0015] According to some embodiments of the present invention, the second connecting block is provided with a second mounting hole, the second mounting hole extends along the length direction of the second connecting block, one end of the second mounting hole in the length direction passes through the extension portion and the other end passes through a portion of the second connecting block.

[0016] According to some embodiments of the present invention, the thickness of at least one of the base plate and the side plate is less than or equal to 1 mm.

[0017] According to some embodiments of the present invention, the mounting cavity is provided with mounting posts for connecting circuit boards; and / or, the mounting cavity is provided with threaded holes.

[0018] According to some embodiments of the present invention, a mounting portion is provided on the outer peripheral wall of the box body, and two adjacent box bodies are connected through the mounting portion.

[0019] According to some embodiments of the present invention, the mounting portion located at the bottom is a metal part.

[0020] According to some embodiments of the present invention, the outer peripheral wall of the housing body is provided with a transition hole communicating with the mounting cavity. The housing further includes: a transition plate, wherein each of the transition holes is provided with a transition plate opposite to the transition hole, the transition plate is connected to the outer peripheral wall of the housing body, and the transition plate is provided with a through hole opposite to and communicating with the transition hole, and the connector passes through the through hole.

[0021] According to some embodiments of the present invention, a plurality of spaced-apart transition holes are provided on the outer peripheral wall of the box body, and at least two of the transition holes are arranged opposite to each other.

[0022] According to some embodiments of the present invention, the box body is a one-piece molded part.

[0023] According to some embodiments of the present invention, the metal layer is a copper element; and / or, at least one of the metal layer and the graphene layer is formed as a mesh structure; and / or, the thickness of the metal layer is less than or equal to 0.08 mm.

[0024] According to some embodiments of the present invention, the substrate layer includes a plurality of substrate components, which are stacked along the thickness direction, and adjacent substrate components are at an angle to each other in the thickness direction; and / or, a conductive coating is provided on the side of the metal layer away from the substrate layer.

[0025] The near-space airship according to an embodiment of the present invention includes the chassis described in the embodiment of the present invention.

[0026] According to an embodiment of the present invention, the near-space airship defines multiple mounting cavities spaced apart along the height of the chassis body, enabling the spaced placement of multiple electronic components while ensuring a compact structure, thus improving space utilization. The chassis body is a multi-layered structure consisting of a metal layer, a substrate layer, and a graphene layer. The substrate layer is located between the metal layer and the graphene layer, with the metal layer situated inside the substrate layer. The substrate layer is made of carbon fiber, which reduces the weight of the chassis body, meeting the lightweight requirements of the chassis. It also improves the electromagnetic shielding and conductivity of the chassis, ensuring good grounding performance and facilitating heat dissipation.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 This is a schematic diagram of the chassis structure according to an embodiment of the present invention;

[0030] Figure 2 This is a front view of the chassis according to an embodiment of the present invention;

[0031] Figure 3 This is a left view of the chassis according to an embodiment of the present invention;

[0032] Figure 4 This is a structural schematic diagram of the cooperation of multiple box bodies at one angle according to an embodiment of the present invention;

[0033] Figure 5 This is a structural schematic diagram of the cooperation of multiple box bodies according to an embodiment of the present invention from another angle;

[0034] Figure 6 This is a schematic diagram of the chassis body according to an embodiment of the present invention;

[0035] Figure 7 This is a top view of the chassis body according to an embodiment of the present invention;

[0036] Figure 8 This is a front view of the chassis body according to an embodiment of the present invention;

[0037] Figure 9 This is a left view of the chassis body according to an embodiment of the present invention;

[0038] Figure 10 This is a schematic diagram of the structure of the cover plate of the chassis according to an embodiment of the present invention;

[0039] Figure 11 This is a top view of the cover plate of the chassis according to an embodiment of the present invention;

[0040] Figure 12 This is a front view of the cover plate of the chassis according to an embodiment of the present invention;

[0041] Figure 13 This is a schematic diagram of the bottom cover of the chassis according to an embodiment of the present invention;

[0042] Figure 14 This is a top view of the bottom cover of the chassis according to an embodiment of the present invention;

[0043] Figure 15 This is a front view of the bottom cover of the chassis according to an embodiment of the present invention;

[0044] Figure 16 This is a schematic diagram of the structure of the metal layer, the substrate layer, and the graphene layer according to an embodiment of the present invention;

[0045] Figure 17 This is a partial structural diagram of the avionics compartment according to an embodiment of the present invention.

[0046] Figure label:

[0047] 100. Chassis; 200. Avionics bay;

[0048] 10. Chassis body; 11. Mounting cavity; 12. Opening; 13. Mounting part; 14. Adapter hole; 101. Chassis body; 102. Cover plate; 103. Bottom cover; 104. Extension part; 105. Connection hole; 111. Mounting post; 112. Threaded hole;

[0049] 21. Metal layer; 22. Substrate layer; 23. Graphene layer;

[0050] 31. Base plate; 32. Side plate; 311. Heat dissipation groove;

[0051] 40. Adapter plate; 41. Through hole;

[0052] 51. First connecting block; 52. Second connecting block; 53. Third connecting block; 511. First mounting hole; 521. Second mounting hole; 531. Third mounting hole. Detailed Implementation

[0053] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0054] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0055] In the description of this invention, "first feature" and "second feature" may include one or more of the features, "multiple" means two or more, "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them, and "above," "over," and "on top" the second feature may include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0056] The chassis 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0057] Reference Figures 1-3 As shown, the chassis 100 according to an embodiment of the present invention may include: chassis body 10. The chassis 100 may be a flight control computer chassis.

[0058] Specifically, the chassis body 10 defines multiple (two or more) mounting cavities 11, which are located along the height direction of the chassis body 10 (e.g., ...). Figure 2 As shown in the diagram, the vertical spacing allows for the placement of multiple electronic components within the chassis 100 through multiple mounting cavities 11, meeting the required placement needs while ensuring a compact structure and improving space utilization.

[0059] In addition, such as Figure 16 As shown, the chassis body 10 is a multi-layer structure stacked sequentially, and the chassis body 10 includes a base layer 22, which is a carbon fiber component. The carbon fiber component has high specific strength, high specific stiffness and low density properties. Therefore, the carbon fiber component as the base layer 22 can reduce the weight of the chassis body 10, which is convenient for achieving the lightweighting of the chassis body 10 and meeting the lightweighting requirements of the chassis 100.

[0060] At the same time, such as Figure 16 As shown, the chassis body 10 also includes a metal layer 21 and a graphene layer 23. A substrate layer 22 is located between the metal layer 21 and the graphene layer 23, with the metal layer 21 located inside the substrate layer 22. The metal layer 21 improves the electromagnetic shielding and conductivity of the chassis body 10, thereby meeting the electromagnetic shielding requirements of the chassis 100 and ensuring good grounding performance. The metal layer 21 also has good thermal conductivity, facilitating the transfer of heat from the mounting cavity 11 to the outside, preventing damage to components within the mounting cavity 11 due to high temperatures, and promoting heat dissipation. The graphene layer 23 reduces the conductivity of the chassis 100, for example, to no more than 10mΩ, further improving conductivity and effectively optimizing the thermal and electrical conductivity of the chassis 100, while also making the chassis body 10 aesthetically pleasing.

[0061] Therefore, compared with metal chassis (e.g., aluminum alloy chassis) in related technologies, the chassis 100 of the present invention can achieve a high degree of lightweighting, for example, more than 70% lightweighting, and has good electromagnetic shielding and conductivity performance, thus meeting the requirements for optimized electromagnetic shielding performance and good conductivity performance of the chassis 100. For example, it can meet the electromagnetic compatibility performance requirements of the chassis 100 for RS103 electric field radiation sensitivity (10kHz-40GHz).

[0062] In some embodiments, the carbon fiber components may be made of M40J carbon fiber, which has properties such as high modulus, high strength, high temperature resistance and corrosion resistance. It can maintain stable performance in extreme environments and is lightweight, which makes it easy to achieve lightweight chassis body 10.

[0063] In some embodiments, the matrix layer 22 is made of M40J high-modulus carbon fiber prepreg. The preparation process involves high-temperature graphitization treatment at temperatures above 2000°C and high-tensile stretching treatment, which makes the graphite microcrystals highly oriented along the fiber axis. This enables the matrix layer 22 to achieve high strength, high modulus, and low resistivity, ensuring good electrical conductivity and effectively improving the structural strength and electrical conductivity of the chassis 100.

[0064] According to an embodiment of the present invention, the chassis 100 has multiple mounting cavities 11 spaced apart along the height direction of the chassis body 10, which enables the spaced placement of multiple electronic components and ensures a compact structure, thus improving space utilization. The chassis body 10 is a multi-layered structure stacked sequentially, including a metal layer 21, a substrate layer 22, and a graphene layer 23. The substrate layer 22 is located between the metal layer 21 and the graphene layer 23, and the metal layer 21 is located inside the substrate layer 22. The substrate layer 22 is made of carbon fiber, which reduces the weight of the chassis body 10, meeting the lightweight requirements of the chassis 100. It also improves the electromagnetic shielding and conductivity of the chassis 100, ensuring good grounding performance and good thermal conductivity for easy heat dissipation.

[0065] In some embodiments of the present invention, such as Figures 1-12 As shown, the chassis body 10 includes a chassis body 101, and there are multiple chassis bodies 101 stacked sequentially along the height direction of the chassis body 10. The chassis body 101 includes a base plate 31 and multiple side plates 32. The multiple side plates 32 are connected to each other along the circumferential direction of the base plate 31, and the multiple side plates 32 are connected to the outer edge of the base plate 31, so that the base plate 31 and the multiple side plates 32 together define the mounting cavity 11, which makes the structure of the chassis body 101 simple, thereby making the structure of the chassis body 10 simple, easy to process, manufacture and assemble, and conducive to reducing production costs.

[0066] In addition, such as Figures 1-3 As shown, the chassis body 10 also includes a cover plate 102, which covers the opening 12 of the uppermost mounting cavity 11. The cover plate 102 can seal the mounting cavity 11, preventing the structure inside the uppermost chassis body 101 from being exposed and damaged, and can ensure the electromagnetic shielding performance and conductivity performance of the chassis 100.

[0067] In embodiments of the present invention, the number of box bodies 101 can be flexibly set according to actual conditions. For example, the side panels 32 can be as follows: Figure 1 The number shown is four, but it can also be two, three, five, six or more, all of which are within the protection scope of this invention.

[0068] In embodiments of the present invention, the number of side plates 32 can be flexibly set according to actual conditions. For example, there can be four side plates 32 as shown in the figure, or there can be two, three, five, six or more, all of which are within the protection scope of the present invention.

[0069] According to some embodiments of the present invention, such as Figures 4-6 , Figure 8 and Figure 9 As shown, the bottom plate 31 of the upper box body 101 of the two adjacent box bodies 101 is provided with multiple (two or more) first connecting blocks 51. The multiple first connecting blocks 51 are spaced apart along the circumferential direction of the bottom plate 31, and multiple side plates 32 of the other of the two adjacent box bodies 101 are connected to the multiple first connecting blocks 51. This enables the connection of the two adjacent box bodies 101 at multiple different positions, ensuring that the connection between the two adjacent box bodies 101 is reliable, ensuring that no electromagnetic leakage occurs, meeting the requirements of electromagnetic compatibility performance RS103, and having a simple structure that is easy to process and manufacture.

[0070] In some embodiments of the present invention, such as Figures 4-6 , Figure 8 and Figure 9 As shown, the first connecting block 51 is provided with a first mounting hole 511, which extends along the length of the first connecting block 51 and penetrates a portion of the first connecting block 51. Therefore, fasteners can pass through the side plate 32 to connect with the first mounting hole 511, achieving a detachable connection between two adjacent enclosure bodies 101, ensuring reliable connection, simple structure, and convenient assembly. Simultaneously, the first mounting hole 511 can be formed as a blind hole, avoiding electromagnetic leakage and other problems, further ensuring the electromagnetic shielding performance of the enclosure 100, while ensuring that the strength and rigidity of the connection meet mechanical performance requirements. For example, the fastener can be a screw, etc.

[0071] According to some embodiments of the present invention, such as Figures 4-7 As shown, the base plate 31 is provided with heat dissipation grooves 311, which facilitates heat dissipation in the mounting cavity 11 and ensures that the heat in each box body 101 can be effectively dispersed, which is beneficial to improving the heat dissipation effect.

[0072] In some embodiments, such as Figures 4-7 As shown, there are multiple heat dissipation slots 311, which are spaced apart along the circumferential direction of the chassis. The multiple heat dissipation slots 311 facilitate the dispersion of heat in the mounting cavity 11, thereby further improving the heat dissipation effect.

[0073] In embodiments of the present invention, the number of heat dissipation slots 311 can be flexibly set according to actual conditions. For example, the number of heat dissipation slots 311 can be as follows: Figure 7 The number shown is four, but it can also be two, three, five, six or more, all of which are within the protection scope of this invention.

[0074] In some embodiments of the present invention, such as Figures 1-3 As shown, the chassis body 10 also includes a bottom cover 103, which covers the lower side of the chassis body 101 located at the bottom. The bottom cover 103 can seal the chassis body 101 located at the bottom, thereby blocking the heat dissipation groove 311 and preventing dust and other impurities from entering the chassis body 101 through the heat dissipation groove 311. This can extend the service life and ensure the electromagnetic shielding performance and conductivity performance of the chassis 100.

[0075] In some embodiments, such as Figure 4 , Figure 5 , Figures 13-15 As shown, the lower end face of the bottom cover 101 is provided with multiple (two or more) third connecting blocks 53. The multiple third connecting blocks 53 are spaced apart along the circumferential direction of the bottom cover 103. The multiple third connecting blocks 53 are connected to the bottom cover 103, which can realize the connection between the bottom cover 103 and the bottom cover 101 at multiple different positions, ensuring that the connection between the bottom cover 103 and the bottom cover 101 is reliable, ensuring that no electromagnetic leakage occurs, meeting the electromagnetic compatibility performance RS103 index requirements, and the structure is simple and easy to process and manufacture.

[0076] In some embodiments, such as Figure 4 , Figure 5 , Figures 13-15As shown, the bottom cover 103 has multiple spaced connecting holes 105 in its circumferential direction. The third connecting block 53 has third mounting holes 531 that correspond one-to-one with the connecting holes 105, and the third mounting holes 531 penetrate through a portion of the third connecting block 53. Therefore, fasteners can pass through the connecting holes 105 to connect with the second mounting holes 521, achieving a detachable connection between the cover plate 102 and the housing body 101, ensuring reliable connection, simple structure, and convenient assembly. Simultaneously, the third mounting holes 531 can be formed as blind holes, avoiding electromagnetic leakage and other problems, further ensuring the electromagnetic shielding performance of the housing 100, while ensuring that the strength and rigidity of the connection meet mechanical performance requirements. For example, the fasteners can be screws, etc.

[0077] According to some embodiments of the present invention, such as Figures 10-12 As shown, the end face of the cover plate 102 facing the housing body 101 is provided with an extension 104. The extension 104 extends along the circumferential direction of the cover plate 102, which can improve the structural strength of the cover plate 102 and avoid deformation and other problems. The extension 104 extends into the opening 12 of the uppermost mounting cavity 11, which can increase the contact area between the housing body 101 and the cover plate 102, effectively prevent electromagnetic leakage, further improve the electromagnetic shielding performance of the chassis 100, and meet the electromagnetic compatibility performance RS103 index requirements.

[0078] In some embodiments of the present invention, such as Figures 10-12 As shown, the extension 104 is formed into a ring and the inner side of the ring is provided with a plurality of (two or more) second connecting blocks 52. The plurality of second connecting blocks 52 are spaced apart along the extension direction of the extension 104. The plurality of second connecting blocks 52 are connected to the plurality of side plates 32 located at the top, which can realize the connection of the cover plate 102 and the box body 101 at multiple different positions, ensuring that the connection between the cover plate 102 and the box body 101 is reliable, ensuring that no electromagnetic leakage occurs, meeting the electromagnetic compatibility performance RS103 index requirements, and the structure is simple and easy to process and manufacture.

[0079] According to some embodiments of the present invention, such as Figure 10 and Figure 12As shown, the second connecting block 52 is provided with a second mounting hole 521, which extends along the length of the second connecting block 52. One end of the second mounting hole 521 passes through the extension portion 104, and the other end of the second mounting hole 521 passes through a portion of the second connecting block 52. Therefore, fasteners can be inserted into the side plate 32 to connect with the second mounting hole 521, achieving a detachable connection between the adjacent cover plate 102 and the housing body 101, ensuring reliable connection, simple structure, and convenient assembly. Furthermore, the second mounting hole 521 can be formed as a blind hole to avoid electromagnetic leakage and other problems, further ensuring the electromagnetic shielding performance of the housing 100, while ensuring that the strength and rigidity of the connection meet mechanical performance requirements. For example, the fastener can be a screw, etc.

[0080] According to some embodiments of the present invention, such as Figure 16 As shown, the thickness of at least one of the base plate 31 and the side plate 32 is less than or equal to 1 mm, that is, the thickness of at least one of the base plate 31 and the side plate 32 is W1 and satisfies W1≤1 mm. Therefore, within the above range, at least one of the base plate 31 and the side plate 32 can be formed into a thin-walled structure, which has a good weight reduction effect and is conducive to achieving the lightweight requirement of the chassis 100. For example, in some specific embodiments, the thickness of at least one of the base plate 31 and the side plate 32 can be 1 mm, 0.8 mm, 0.6 mm, 0.4 mm, 0.2 mm, 0.1 mm, etc.

[0081] In some embodiments, the thickness of the bottom plate 31 and the side plate 32 is less than or equal to 1 mm, which enables the chassis body 10 to be formed as a thin-walled structure, ensuring good weight reduction effect and helping to achieve the lightweight requirements of the chassis 100. For example, compared with aluminum alloy chassis in related technologies, the weight reduction efficiency of the chassis 100 of the present invention can reach 75%.

[0082] In some embodiments, such as Figure 4 , Figure 6 and Figure 7 As shown, the mounting cavity 11 is provided with a mounting post 111, which can connect to the circuit board to ensure that the circuit board is installed in the mounting cavity 11, so that the circuit board is reliably installed in the mounting cavity 11 and meets the required assembly requirements.

[0083] In some embodiments, such as Figure 4 , Figure 6 and Figure 7 As shown, the mounting post 111 has an internal thread, and fasteners can be inserted into the circuit board to connect with the internal thread, thereby connecting the circuit board to the mounting post 111, ensuring that the circuit board is reliably fixed in the mounting cavity 11, and the structure is simple and easy to assemble.

[0084] In some embodiments, such as Figure 6 and Figure 7 As shown, the mounting cavity 11 is provided with a threaded hole 112. The internal structure can be fixed by fasteners passing through the internal structure and connecting with the threaded hole 112, thereby meeting the fixing requirements of the internal structure.

[0085] In some embodiments of the present invention, such as Figure 1 , Figures 5-9 As shown, a mounting portion 13 is provided on the outer peripheral wall of the housing body 101. Adjacent housing bodies 101 are connected through the mounting portion 13, thereby achieving the connection of multiple housing bodies 101, ensuring reliable connection, and ensuring that the strength and rigidity of the connection meet performance requirements. Simultaneously, the housing body 101 located at the bottom can be connected and fixed to the chassis body 10 through the mounting portion 13, meeting the fixing requirements of the chassis 100, and ensuring that the strength and rigidity of the connection meet performance requirements. For example, when the chassis 100 is used in a near-space aerostat, fixing the chassis 100 through the mounting portion 13 ensures that the connection strength and rigidity meet the mechanical performance requirements under flight conditions.

[0086] In some embodiments, such as Figure 1 , Figures 5-9 As shown, the mounting part 13 of the box body 101 can be multiple (two or more). The multiple mounting parts 13 are spaced apart along the circumferential direction of the box body 101. By connecting the multiple mounting parts 13 of two adjacent box bodies 101 to each other, it can be ensured that the two adjacent box bodies 101 are connected in multiple different positions, thus ensuring reliable connection.

[0087] In some embodiments, such as Figure 1 , Figures 5-9 As shown, there can be two mounting parts 13 spaced apart along the vertical direction of the box body 101. The two mounting parts 13 can connect the box body 101 to the upper box body 101 and the lower box body 101 respectively, meeting the required connection requirements and ensuring reliable connection.

[0088] In some embodiments, such as Figure 6 and Figure 7 As shown, the mounting part 13 is provided with a through hole, and fasteners can be inserted through the through hole to connect two adjacent box bodies 101, ensuring reliable connection and facilitating installation and disassembly.

[0089] According to some embodiments of the present invention, the lowermost mounting portion 13 is a metal component. The metal mounting portion 13 ensures good electrical conductivity when the chassis 100 is connected to other structures, thereby ensuring good grounding performance of the chassis 100 and meeting the required usage requirements. For example, when the chassis 100 is used for a near-space airship, the metal mounting portion 13 ensures good electrical conductivity when connected to the pod load mounting plate of the near-space airship.

[0090] In some embodiments of the chassis body 10 including the bottom cover 103, the bottom cover 103 is connected to the mounting part 13 located at the bottommost point, and the bottom cover 103 is a metal part. When the chassis body 10 is connected to other structures, it can ensure that the bottom cover 103 has good electrical conductivity when connected to other structures, thereby ensuring that the chassis 100 has good grounding performance and meets the required usage requirements.

[0091] In some embodiments of the present invention, such as Figure 1 , Figures 3-6 , Figure 8 As shown, the outer peripheral wall of the chassis body 10 is provided with an adapter hole 14, which communicates with the mounting cavity 11. The chassis 100 also includes an adapter plate 40. Each adapter hole 14 is provided with an adapter plate 40 opposite to the adapter hole 14. The adapter plate 40 is connected to the outer peripheral wall of the chassis body 101. The adapter plate 40 is provided with a through hole 41, which is opposite to and communicates with the adapter hole 14. The connector passes through the through hole 41, which can be installed on the chassis body 10 to facilitate the required assembly. The connector facilitates the connection between the wiring harness inside the chassis body 10 and the external wiring harness, making assembly easier. Moreover, the adapter plate 40 can be set according to the actual situation to adapt to the wiring requirements of different types of connectors, which facilitates universality.

[0092] According to some embodiments of the present invention, such as Figure 1 , Figures 3-6 , Figure 8 As shown, the outer peripheral wall of the box body 101 is provided with a plurality of (two or more) spaced transition holes 14. The assembly requirements of multiple connectors on the box body 101 can be met through the multiple transition holes 14, thereby satisfying the connection requirements of different wire harnesses.

[0093] In addition, such as Figure 4 and Figure 6 As shown, at least two adapter holes 14 are arranged opposite to each other. The oppositely arranged adapter holes 14 facilitate airflow convection, making the external air and the air inside the mounting cavity 11 flow smoothly. This helps to improve the heat dissipation inside the chassis body 10 and avoids problems such as damage to the components inside the mounting cavity 11 due to high temperature.

[0094] According to some embodiments of the present invention, the box body 101 is an integrally formed part. In other words, the bottom plate 31 and multiple side plates 32 can be integrally formed, which is simple to manufacture, has high connection strength, can realize the closed structure of the box body 101, ensures no electromagnetic leakage, enhances electromagnetic shielding performance, and ensures that the electromagnetic characteristics of multiple mounting cavities 11 do not affect each other. At the same time, it reduces assembly steps and has high production efficiency.

[0095] In some embodiments where mounting posts 111 for connecting circuit boards are provided within the mounting cavity 11, the mounting posts 111 are integrally formed with the base plate 31, which simplifies manufacturing, improves the connection rigidity and strength between the mounting posts 111 and the base plate 31, meets the electromagnetic compatibility performance RS103 requirements, and reduces assembly steps, resulting in high production efficiency. For example, the connecting posts are formed using secondary curing, which simplifies manufacturing.

[0096] In some embodiments where a mounting portion 13 is provided on the outer peripheral wall of the box body 101, the mounting portion 13 is integrally formed with the box body 101, which is simple to manufacture, can improve the connection rigidity and strength between the mounting portion 13 and the box body 101, and reduces assembly steps, resulting in high production efficiency.

[0097] In some embodiments, the metal layer 21 is made of copper, which has good electrical and thermal conductivity, ensuring that the electromagnetic shielding performance of the chassis 100 is optimized and the conductivity is good, thereby meeting the requirements of electromagnetic compatibility performance RS103. In addition, the copper metal layer 21 is easy to process, which helps to improve production efficiency.

[0098] In embodiments of the present invention, the specific structures of the metal layer 21 and the graphene layer 23 can be configured according to actual conditions. For example, the metal layer 21 and the graphene layer 23 can be formed by spraying.

[0099] For example, in some embodiments, at least one of the metal layer 21 and the graphene layer 23 is formed as a mesh structure, that is, the metal layer 21 can be formed as a mesh structure, or the graphene layer 23 can be formed as a mesh structure, or the metal layer 21 and the graphene layer 23 can be formed as a mesh structure, which can improve the structural strength of the metal layer 21 and / or the graphene layer 23, thereby further improving the structural strength of the chassis body 10, and the mesh structure of the metal layer 21 and / or the graphene layer 23 is easy to process and manufacture.

[0100] In some embodiments, such as Figure 16 As shown, the thickness of the metal layer 21 is less than or equal to 0.08 mm, that is, the thickness of the metal layer 21 is W2 and satisfies W2≤0.08 mm. Therefore, within the above range, the metal layer 21 can meet the electromagnetic compatibility performance requirements of RS103 and reduce production costs. For example, in some specific embodiments, the thickness of the metal layer 21 can be 0.08 mm, 0.07 mm, 0.06 mm, 0.04 mm, 0.02 mm, 0.01 mm, etc.

[0101] In some embodiments, the substrate layer 22 includes multiple (two or more) substrate components, which are stacked along the thickness direction. Adjacent substrate components are at an angle to each other in the thickness direction, allowing the multiple substrate components to be laid orthogonally. This improves the structural strength of the substrate layer 22 and prevents problems such as deformation of the chassis 100. For example, the angle formed by two adjacent substrate components in the thickness direction can be 90° or 45°. For instance, multiple substrate components can be laid in a staggered manner at 0°, ±45°, 0°, and 90° to meet the required assembly requirements.

[0102] In some embodiments, the thickness of the base component is 0.08mm-0.2mm, which allows the base component to meet structural strength requirements while reducing the overall thickness of the base layer 22, resulting in good weight reduction and facilitating the lightweighting of the chassis 100. For example, in some specific embodiments, the thickness of the base component can be 0.08mm, 0.10mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc.

[0103] In some embodiments, the side of the metal layer 21 away from the substrate layer 22 (e.g.) Figure 16 The inner side (shown in the diagram) is provided with a conductive coating. Through the cooperation of the metal layer 21 and the graphene layer 23 with the conductive coating, good conductivity is ensured on the surface of the chassis body 10, thereby ensuring conductive continuity and improving the conductivity of the chassis body 10, thus guaranteeing good grounding performance of the chassis 100. For example, the conductive coating is formed by spraying, which ensures the uniformity of the conductive coating and ensures conductive continuity.

[0104] In some embodiments, after the end face of the metal layer 21 away from the substrate layer 22 is polished, a conductive coating is sprayed onto the end face of the metal layer 21 away from the substrate layer 22. This can ensure that the conductive coating adheres reliably to the metal layer 21, prevent peeling, and ensure conductivity continuity.

[0105] The near-space airship according to an embodiment of the present invention includes a chassis 100 according to an embodiment of the present invention. Since the chassis 100 according to the embodiment of the present invention has the aforementioned beneficial technical effects, the near-space airship according to the embodiment of the present invention, by defining multiple mounting cavities 11 spaced apart along the height direction of the chassis body 10 within the chassis body 10, can achieve spaced placement of multiple electronic components and ensure a compact structure, which is beneficial to improving space utilization. Simultaneously, the chassis body 10 is a multi-layered structure stacked sequentially and includes a metal layer 21, a substrate layer 22, and a graphene layer 23. The substrate layer 22 is located between the metal layer 21 and the graphene layer 23, and the metal layer 21 is located inside the substrate layer 22. The substrate layer 22 is a carbon fiber component, which can reduce the weight of the chassis body 10, meeting the lightweight requirements of the chassis 100, and improving the electromagnetic shielding and conductivity performance of the chassis 100, ensuring good grounding performance, and also having good thermal conductivity for easy heat dissipation.

[0106] In some embodiments, such as Figure 17 As shown, the flight altitude of near-space airships is generally between 20km and 40km, and the flight conditions are in extreme environments (such as an environment with a pressure of 5KP and a temperature of -90℃). The avionics bay 200 of the near-space airship carries a chassis 100. By placing program modules in the chassis 100, the flight control requirements of the near-space airship can be met.

[0107] Near-space airships (LAS) possess advantages such as large size, heavy payload, and high service ceiling. As LAS develops towards standardization, the application requirements for their payloads are becoming increasingly stringent, placing new demands on the weight, size, and power consumption of the payloads. This necessitates new lightweighting requirements for LAS. In related technologies, all equipment within the avionics bay of LAS utilizes a metal chassis structure, which is not conducive to lightweighting. Therefore, the chassis 100 of this invention has a multi-layered structure with sequentially stacked components. The chassis 10 includes a base layer 22, which is made of carbon fiber. Using carbon fiber as the base layer 22 reduces the weight of the chassis 10, facilitating lightweighting and meeting the lightweighting requirements of the chassis 100. Meanwhile, by having the substrate layer 22 located between the metal layer 21 and the graphene layer 23, and the metal layer 21 located inside the substrate layer 22, the thermal conductivity, electromagnetic shielding performance, and electrical conductivity of the chassis body 10 can be improved, thus meeting the electromagnetic shielding performance requirements of the chassis 100 and ensuring that the chassis 100 has good grounding performance. This meets the requirements of lightweight structure, electromagnetic shielding characteristics, and good electrical conductivity of the chassis 100 in the near-space airship flight environment.

[0108] Other configurations and operations of the chassis 100 and the near-space airship according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0109] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0110] In the description of this specification, the references to terms such as "embodiment," "specific embodiment," and "example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0111] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chassis, characterized in that, include: The chassis body has multiple mounting cavities spaced apart along its height direction. The chassis body is a multi-layer structure stacked sequentially and includes a metal layer, a substrate layer, and a graphene layer. The substrate layer is located between the metal layer and the graphene layer, and the metal layer is located inside the substrate layer. The substrate layer is made of carbon fiber.

2. The chassis according to claim 1, characterized in that, The chassis body includes: The enclosure body comprises multiple enclosure bodies stacked sequentially along the height direction of the enclosure body. Each enclosure body includes a bottom plate and multiple side plates. The multiple side plates are interconnected along the circumferential direction of the bottom plate and connected to the outer edge of the bottom plate. The bottom plate and the multiple side plates together define the mounting cavity. A cover plate is provided over the opening of the uppermost mounting cavity.

3. The chassis according to claim 2, characterized in that, On the lower end surface of the bottom plate of the upper box body in two adjacent box bodies, there are a plurality of first connecting blocks spaced apart along the circumferential direction of the bottom plate, and the plurality of side plates of the other box body are connected to the plurality of first connecting blocks.

4. The chassis according to claim 3, characterized in that, The first connecting block is provided with a first mounting hole, which extends along the length of the first connecting block and penetrates a portion of the first connecting block.

5. The chassis according to claim 2, characterized in that, The base plate is provided with heat dissipation grooves.

6. The chassis according to claim 5, characterized in that, The chassis body also includes: A bottom cover is provided on the lower side of the box body located at the bottom.

7. The chassis according to claim 2, characterized in that, The end face of the cover plate facing the box body is provided with an extension that extends in the circumferential direction of the cover plate, and the extension extends into the opening of the uppermost mounting cavity.

8. The chassis according to claim 7, characterized in that, The extension is formed in a ring shape and the inner side of the ring is provided with a plurality of second connecting blocks spaced apart along the extension direction of the extension. The plurality of second connecting blocks are connected to the plurality of side plates located at the top.

9. The chassis according to claim 8, characterized in that, The second connecting block is provided with a second mounting hole, which extends along the length direction of the second connecting block. One end of the second mounting hole passes through the extension and the other end passes through a portion of the second connecting block.

10. The chassis according to claim 2, characterized in that, The thickness of at least one of the base plate and the side plate is less than or equal to 1 mm.

11. The chassis according to claim 2, characterized in that, The mounting cavity is provided with mounting posts for connecting circuit boards; And / or, the mounting cavity is provided with a threaded hole.

12. The chassis according to claim 2, characterized in that, The outer peripheral wall of the box body is provided with a mounting part, and two adjacent box bodies are connected through the mounting part.

13. The chassis according to claim 12, characterized in that, The mounting part located at the bottom is a metal part.

14. The chassis according to claim 2, characterized in that, The outer peripheral wall of the enclosure body is provided with a transition hole communicating with the mounting cavity, and the enclosure further includes: The adapter plate is provided at each of the adapter holes, and the adapter plate is connected to the outer peripheral wall of the box body. The adapter plate is provided with a through hole that is opposite to and communicates with the adapter hole, and the connector passes through the through hole.

15. The chassis according to claim 14, characterized in that, The outer peripheral wall of the box body is provided with a plurality of spaced-apart transition holes, and at least two of the transition holes are arranged opposite to each other.

16. The chassis according to any one of claims 2-15, characterized in that, The box body is a one-piece molded part.

17. The chassis according to claim 1, characterized in that, The metal layer is made of copper. And / or, at least one of the metal layer and the graphene layer is formed as a mesh structure; And / or, the thickness of the metal layer is less than or equal to 0.08 mm.

18. The chassis according to claim 1, characterized in that, The substrate layer includes multiple substrate components, which are stacked along the thickness direction, and adjacent substrate components are at an angle to each other in the thickness direction. And / or, the side of the metal layer away from the substrate layer is provided with a conductive coating.

19. A near-space airship, characterized in that, Includes the chassis according to any one of claims 1-18.

Images