Electronic equipment heat dissipation assembly

Abstract

The invention discloses a heat dissipation assembly of electronic equipment, which comprises an internal circulation heat dissipation assembly and an external forced cooling assembly, and is characterized in that the internal circulation heat dissipation assembly is at least composed of a water cooling head assembled on a power heating source of a mainboard and a water heat dissipation plate connected with the water cooling head through a pipe; the inner circulation heat dissipation assembly is further connected with the outer forced cooling assembly circulation heat dissipation module through a pipe, so that working fluid can be utilized in the water cooling head through the heat dissipation module to quickly absorb working heat generated by the power heating source during working and flow to the water heat dissipation plate to conduct front-section heat dissipation in the case. And then the external forced cooling assembly is connected to the external forced cooling assembly to carry out rear-section forced heat dissipation, so that the overall cooling effect is improved by combining multi-stage heat dissipation, and the generation of heat accumulation in a power heating source and a host is avoided.

Description

Technical Field

[0001] This invention relates to a heat dissipation module for electronic devices, and more particularly to a heat dissipation module that can improve heat dissipation efficiency and prevent heat accumulation in power heat sources or the host. Background Technology

[0002] Currently, due to advancements in integrated circuits, multiple electronic device main units (servers, chassis) can be integrated into a single rack, effectively saving the working space occupied by the main unit or rack when constructing electronic devices. However, the space allocated to each main unit in each rack and the internal space of each main unit are extremely limited, directly affecting the heat dissipation efficiency of the heat generated by each power heat source during operation.

[0003] In existing technologies, the main unit primarily cools itself using either air cooling or water cooling circulation. Air cooling utilizes heat sinks, heat pipes, or cooling fins to transfer the heat from the power source into the chassis. A fan then pushes hot air out of the chassis and cool air into it, forming an air cooling circulation system. Water cooling, on the other hand, places at least one water cooling head inside the chassis at the location of the power source. This water head is connected via piping to an external forced cooling system located outside the chassis or on a server rack, circulating fluid to the water cooling head to cool the power source. The circulating heat dissipation and cooling function, and recently there have also been cases where an appropriate number of additional fans are set on the side of the chassis, and heat convection is generated in the internal space of the chassis through a suction and exhaust method to supplement the insufficient water cooling function; for example, Taiwan Invention Patent Publication No. 202415203A (hereinafter referred to as the prior art), the water cooling head directly contacts the power heat source, and the working heat generated by the power heat source is carried to the external forced cooling equipment for heat exchange and cooling through the working fluid. The working heat of other heat sources in the chassis is cooled and sent out of the chassis by the fans, so as to generate a cooling effect on the inside of the chassis.

[0004] Traditional air-cooled heat sinks use air as a medium, creating convection currents with the surrounding cool air for heat dissipation. However, air's heat transfer efficiency is very poor. Although three-dimensional cooling modules composed of heat pipes, heat sinks, or vapor chambers have been developed to improve cooling performance, the limited space within a typical computer case still prevents a significant increase in critical cooling efficiency. Furthermore, traditional air cooling has reached its limits and cannot handle environments requiring higher-powered heat sources. Current developments in cooling devices aim to provide better heat dissipation for integrated electronic devices (server racks, communication chassis). (Please refer to...) Figure 1 and Figure 2Currently, existing methods for cooling the power source 14 on the motherboard 5 inside electronic devices include: simple water-cooled circulation cooling systems or composite cooling circulation systems such as air-cooling combined with water cooling or water-cooling combined with water cooling, as mentioned in the previous proposal. Compared with traditional air-cooled modules, the water-cooled modules in the above systems incorporate external forced cooling components such as water cooling head 10, coolant distribution unit (CDU) 11, and air-type heat exchange cooler 12 or liquid-type heat exchange cooler 13 to form a cooling system.

[0005] Fans 15, typically used for air cooling, are typically located on the front or rear side of the main body or exterior of electronic devices. They use forced intake and exhaust to expel hot air from inside the server chassis to outside the electronic devices. Therefore, air cooling uses fans to provide convection circulation between hot air inside the electronic devices and cold air outside.

[0006] Since the electronic device already has an air-cooled fan, it can only provide convection circulation of airflow between the inside and outside of the electronic device. This fan cannot directly provide cooling for the water-cooling system, and therefore does not help to cool the working fluid. Therefore, after the water cooling head 10 absorbs the working heat generated by the power heat source 14 inside the electronic device using the working fluid, the high-temperature working fluid is first collected in the coolant distribution unit 11 and then sent to the air-cooled heat exchanger 12. The heat sink 120 and fan 121 of the air-cooled heat exchanger 12 cool the working fluid flowing through the air-cooled heat exchanger 12. The cooled working fluid is then sent back to the electronic device by the coolant distribution unit (CDU) 11 to circulate and cool each of the power heat sources 14.

[0007] The water-cooled circulating heat dissipation method mainly involves installing a water cooling head 10 at the location of the power heat source 14 inside the electronic device, and then connecting it to an external forced cooling component located outside the electronic device through a pipe 101. The cooling working fluid circulates and exchanges heat in the water-cooled circulating heat dissipation system, carrying the heat from the power heat source out of the electronic device. Then, the cooling working fluid is cooled by a gas heat exchange cooler 12 or a liquid heat exchange cooler 13. Finally, the coolant is pumped back into the electronic device through a coolant distribution unit (CDU) 11 to perform circulating cooling operations on each of the power heat sources.

[0008] However, the unresolved problem of existing heat dissipation components is that, due to the significant increase in the number of power heat sources 14 inside electronic devices to meet the increased computing demands, the high-heat working fluid circulated out during normal operation often fails to be cooled to the same or lower temperature as the expected operating temperature before being returned to the electronic device to provide circulating heat dissipation for the power heat sources. When this working fluid, which has not been fully cooled to the expected low temperature, returns to the electronic device with an unexpected medium to high temperature for circulating heat dissipation, the insufficient temperature difference (thermal step difference) between it and the power heat source not only significantly reduces the heat dissipation efficiency but also fails to provide sufficient cooling for the power heat source. Furthermore, the insufficient heat dissipation generated for the power heat source leads to continuous heat accumulation, eventually resulting in thermal shutdown or burnout of the power heat source. Although the industry has developed designs like the aforementioned previous cases, significant improvements have not yet been seen.

[0009] Therefore, how to solve the shortcomings of the existing water-cooled heat dissipation system in which the working fluid cannot be adequately cooled is one of the important lessons that practitioners in this industry need to actively improve.

[0010] To address the aforementioned needs, while water cooling is an effective heat dissipation method, it requires a water block to absorb the heat generated by the power source with a working fluid. This fluid is then conducted to an external forced cooling system located outside the chassis to circulate and cool the working fluid to the desired operating temperature. After cooling, the fluid is returned to the chassis for heat exchange with the power source. Current chassis cooling solutions utilize both air and water cooling methods. However, air cooling only facilitates thermal convection between hot air inside the chassis and cold air outside, failing to provide additional cooling for the heat directly generated by the power source. Water cooling directly cools and exchanges heat with the power source. When the heat generated by the power source increases significantly, the only solution currently is to further enhance the circulation cooling efficiency of a forced cooling system located inside or outside the main unit to provide sufficient cooling performance for each chassis.

[0011] While current heat dissipation technologies can provide sufficient cooling for the main unit, the increasing power requirements of modern electronic devices for all heat sources within a single chassis, along with the growing number of chassis within a single main unit, mean that simply adding more air-cooled fans and external forced cooling equipment will inevitably lead to insufficient cooling efficiency in the near future. Furthermore, this will continuously increase the overall cost of external forced cooling operations, making it clearly not an ideal solution.

[0012] Therefore, how to integrate air cooling and water cooling solutions to enhance heat dissipation and avoid the problem of insufficient heat dissipation that the host unit or the entire cabinet will encounter is indeed an urgent issue that needs to be addressed in this industry. Summary of the Invention

[0013] In order to effectively address the aforementioned shortcomings of traditional methods, the main objective of this invention is to provide an electronic device heat dissipation assembly that can improve the heat dissipation efficiency of the aforementioned high-power host.

[0014] To achieve the above objectives, the present invention provides a heat dissipation module for an electronic device, comprising an internal circulation heat dissipation component and an external forced cooling component. The internal circulation heat dissipation component consists of at least a water cooling head assembled on a power heat source on the motherboard and a water cooling plate connected to the water cooling head via piping. The internal circulation heat dissipation component is then connected to the external forced cooling component via piping, so that the heat dissipation module can utilize the working fluid in the water cooling head to quickly absorb the working heat of the heat source and circulate it to the water cooling plate for initial heat dissipation, and then circulate it again to the external forced cooling component for subsequent forced heat dissipation, forming a heat dissipation and cooling system with at least two stages of heat dissipation, thereby significantly improving the overall heat dissipation efficiency.

[0015] Based on the above heat dissipation module design, the water cooling plate, with its small size and large heat dissipation area, can provide at least one large-scale front-end heat dissipation operation in the narrow space between the chassis and the motherboard before the forced heat dissipation in the rear stage. This improves the cooling efficiency of the working fluid, so that when the working fluid is recirculated back to the water cooling head on the motherboard, it can be effectively cooled to below the expected operating temperature. This avoids the disadvantage of heat accumulation caused by insufficient heat dissipation from the power heat source or inside the chassis during operation.

[0016] Based on the heat dissipation module structure invented above, a stronger fan is added between the middle section and / or the rear section of the internal space of the chassis to increase the speed of air exchange between the internal and external air of the host, so that the heat dissipated by the water cooling plate can be effectively discharged to the outside of the chassis, avoiding heat accumulation inside the chassis. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the first traditional composite heat dissipation circulation system that combines air cooling and water cooling;

[0018] Figure 2 This is a schematic diagram of the first traditional combined air-cooling and water-cooling heat dissipation circulation system.

[0019] Figure 3 This is a schematic diagram of the heat dissipation assembly of the present invention;

[0020] Figure 4This is a top view schematic diagram of an embodiment of the present invention applied to an electronic device in which multiple heat sources are installed in a single motherboard;

[0021] Figure 5 This is the present invention. Figure 4 A side view of the embodiment shown;

[0022] Figure 6 This is a perspective view of an embodiment of the present invention applied to an electronic device in which only a single heat source is installed in a single motherboard;

[0023] Figure 7 This is the present invention. Figure 6 The above-view schematic diagram of the embodiment is shown.

[0024] Figure 8 This is the present invention. Figure 6 A side view of the embodiment shown;

[0025] Figure 9 This is the present invention. Figure 6 Another top view of the embodiment shown;

[0026] in,

[0027] 10: Water cooling block

[0028] 101: Piping

[0029] 11: Coolant Distribution Unit (CDU)

[0030] 12: Gas-type heat exchange cooler

[0031] 120: Radiator

[0032] 121: Fan

[0033] 13: Liquid heat exchange cooler

[0034] 14: Heat source

[0035] 15: Fan

[0036] 2: Internal circulation cooling component

[0037] 21: Water cooling block

[0038] 210: Series tube

[0039] 211: Inlet

[0040] 212: Outlet

[0041] 213: Heat exchange space

[0042] 22: Water cooling plate

[0043] 220: Series tube

[0044] 221: Entrance

[0045] 222: Export

[0046] 223: Flow channel

[0047] 3: External forced cooling components

[0048] 30: Coolant distribution unit group

[0049] 31: Input Allocation Unit

[0050] 32: Output Distribution Unit

[0051] 33: Gas-type heat exchange cooler

[0052] 34: Liquid heat exchange cooler

[0053] 4: Chassis

[0054] 5: Motherboard

[0055] 50: Power heating source

[0056] 60: Intra-connector

[0057] 70: Cooling water manifold assembly

[0058] 71:First tube body

[0059] 72:Second tube body

[0060] 90: Increase the power of the fan. Detailed Implementation

[0061] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described in light of the preferred embodiments illustrated in the accompanying drawings.

[0062] Please refer to Figure 3, which is a schematic diagram of a feasible embodiment of the heat dissipation assembly of the present invention. As shown in the figure, the heat dissipation assembly of the present invention includes an internal circulation heat dissipation component 2 and an external forced cooling component 3. The internal circulation heat dissipation component 2 is composed of at least one water cooling head 21 mounted on a power heat source 50 of a motherboard 5 and at least one water cooling plate 22 connected to the water cooling head 21 by pipes.

[0063] The water cooling head 21 is correspondingly disposed and in thermal contact with the power heat source 50, and provides heat conduction for the working heat generated by the power heat source 50. The water cooling head 21 has an inlet 211 and an outlet 212 and has at least one heat exchange space 213 inside. The outlet 212 is then connected to the water cooling plate 22 or another water cooling head 21.

[0064] Please also refer to Figures 4 to 9 As shown in the figure, Figure 4 and Figure 5 This indicates an implementation where multiple power heat sources are simultaneously installed on a single motherboard; Figures 6 to 9 This describes an implementation where multiple motherboards are housed in a single cabinet, and each motherboard has only a single power heat source. The water cooling plate 22 is connected to the aforementioned water cooling head 21 via an internal connecting pipe 60. The water cooling plate 22 has an inlet 221 and an outlet 222, and at least one flow channel 223 inside. The outlet 212 of the water cooling head 21 can be connected in series with the inlet 211 of another water cooling head 21 via a connecting pipe 210, or connected to the inlet 221 of a water cooling plate 22 via an internal connecting pipe 60, so that the heat exchange space 213 and the flow channel 223 are interconnected, allowing the working fluid to circulate within them. Furthermore, the water cooling plate 22 can also be connected in series with multiple plates via a connecting pipe 220 (e.g., ...). Figure 4 and Figure 5 ).

[0065] The water cooling plate 22 is thin, thus possessing the advantages of small size and large surface area. It can be appropriately positioned between the motherboard 5 and the chassis 4, in a space with a small height but large area parallel to the motherboard 5, for example... Figure 4 and Figure 5 The water cooling plates 22 are positioned on the bottom side of the motherboard 5 where related electronic components are not installed (or few are installed) or on the water cooling block 21 (in contact with or not in contact with the motherboard 5), or on the upper side of the water cooling block 21 or in the adjacent left and right sides parallel to the motherboard 5. Therefore, the limited usable space in the vertical distance (height) between the chassis 4 and the motherboard 5 can be fully utilized, significantly increasing the effective heat dissipation area that can be accommodated in this space. The number of water cooling plates 22 can also be multiple, and they can be spaced apart from each other (e.g., ...). Figure 4 and Figure 5 (as shown), or arranged in a way that is on the same level with adjacent spacing, to achieve the effect of greatly increasing the overall heat dissipation area inside the chassis 4.

[0066] The internal circulation heat dissipation component 2 described above, in particular, such as Figures 4 to 9As shown, if implemented in an integrated electronic device composed of multiple hosts, it is connected to the external forced cooling component 3 through a cooling water manifold group 70. The external forced cooling component 3 includes: a coolant distribution unit group 30 (CDU) and a heat exchange cooler connected to each other by pipelines. The heat exchange cooler can be at least one of a gas heat exchange cooler 33 or a liquid heat exchange cooler 34. The coolant distribution unit group 30 can also have an input distribution unit 31 and an output distribution unit 32. The external forced cooling component 3 can perform forced cooling and temperature reduction on the working fluid entering it, and the cooled working fluid is pumped back into the chassis 4 to cool the power heat source 50.

[0067] The cooling water manifold assembly 70 has a first pipe body 71 and a second pipe body 72. One end of the first and second pipe bodies 71 and 72 is connected to the inlet 211 of the water cooling head 21 and the outlet 222 of the water cooling plate 22, respectively. The other end is connected to the pipeline of the coolant distribution unit assembly 30. The working fluid flowing inside the entire internal circulation heat dissipation assembly 2 and the external forced cooling assembly 3 is responsible for carrying heat circulation in the entire system.

[0068] Therefore, when the working fluid entering through the inlet 211 of the first tube 71 and the water-cooling head 21 absorbs the working heat generated by the power heat source 50 and outputs the high-temperature working fluid to the water cooling plate 22, it can generate a preliminary cooling effect on the working fluid through its large heat dissipation area, causing the circulating working fluid to undergo a significant preliminary cooling. Then, the working fluid that has undergone preliminary cooling is input into the external forced cooling component 3 through the second tube 72, so that the working fluid undergoes a subsequent cooling operation, which can reduce the temperature of the working fluid more quickly and effectively, and increase the temperature difference (thermal level) between the working fluid and the power heat source 50. Therefore, when the working fluid is input into the water cooling head 21 through the first tube 71, it can generate a more efficient heat dissipation effect on the power heat source 50, effectively reducing the heat accumulation in the power heat source 50, and thus enabling the working heat of the power heat source 50 to be effectively and quickly cooled without heat accumulation.

[0069] Please refer to Figure 7 and Figure 9It is understandable that after the water cooling plate 22 has performed a large amount of heat dissipation inside the chassis 4, if the heat accumulated inside the chassis 4 cannot be further removed, the undesirable phenomenon of high temperature accumulation inside the chassis 4 (cabinet) will still occur. Therefore, in order to effectively achieve the purpose of the present invention, strengthening the heat dissipation inside the electronic device using the present invention is a further problem to be solved. To this end, the present invention further provides a booster fan 90 in at least the middle section inside the chassis 4 of the electronic device, which can improve the flow of hot air inside the chassis 4 and the speed of exhaust to the outside, so as to avoid the disadvantage of heat accumulation inside the chassis 4 due to the high-speed heat dissipation of the water cooling plate 22.

[0070] The number of the enhanced driving fans 90 can be one or more. When multiple enhanced driving fans 90 are selected, they are respectively set in at least one part of the middle or rear space inside the chassis 4, so as to provide sufficient heat dissipation and cooling of the hot air inside the chassis 4 (or cabinet) and avoid heat accumulation and high temperature.

[0071] Furthermore, if the internal space of the chassis 4 allows, the aforementioned enhanced drive fan 90 can be appropriately added to enhance the circulation and exhaust of air inside the chassis 4. This not only effectively dissipates the internal heat of the chassis 4, but also reduces the air temperature around the water cooling plate 22, directly improving the heat dissipation effect of the water cooling plate 22, and relatively improving the cooling effect of the aforementioned front-end heat dissipation.

[0072] In summary, the present invention, between the traditional internal circulation heat dissipation component 2 and the external forced cooling component 3, uses a water heat dissipation plate 22 that can be installed over a large area to pre-heat the heat absorbed by each power heat source 50 by the water cooling head 21, so that the working fluid can be cooled down in advance. Then, the working fluid that has obtained the initial cooling is circulated into the external forced cooling component 3 for subsequent forced cooling, so that the temperature of the working fluid can be reduced to the expected working temperature more easily, in order to meet the industrial demand for increasing heat dissipation. Furthermore, by having the fan 90 forcefully guide the hot airflow inside the chassis 4 to dissipate outwards and cool the environment near the water cooling plate 22 inside the chassis 4, the heat dissipation effect of the water cooling plate 22 can be further improved, making the front-end cooling effect more obvious. This directly reduces the cost of adding or increasing the power of external forced cooling components. In addition to significantly improving the heat exchange efficiency of the cooling system in a limited space, it can also save the energy consumed by adding or increasing the power of circulating cooling equipment in a traditional way, thereby achieving energy saving.

Claims

1. A heat dissipation assembly for an electronic device, characterized in that, It includes an internal circulation heat dissipation component (2) and an external forced cooling component (3) that is circulated and connected to the working fluid inside the internal circulation heat dissipation component (2); wherein the internal circulation heat dissipation component (2) is composed of at least one water cooling head (21) assembled on a power heat source (50) and a water cooling plate (22) connected to the water cooling head (21) by pipes, and the power heat source (50) is disposed on a motherboard (5) inside a chassis (4); The water cooling head (21) is correspondingly positioned and in thermal contact with the power heat source (50); The water cooling plate (22) is connected to the water cooling head (21) by pipes, and a working fluid circulates inside it. The water cooling plate (22) is located inside the chassis (4) between the motherboard (5) and in the remaining space parallel to the motherboard (5). The working fluid inside the water cooling head (21) can absorb the heat generated by the power heat source (50), and then when it enters the water cooling plate (22), it can perform a front-end heat dissipation to generate a cooling effect. Then, when it circulates into the external forced cooling component (3), it can perform a rear-end forced heat exchange cooling effect, thereby improving the cooling efficiency of the working fluid and ensuring that the temperature of the working fluid returned to the water cooling head (21) can be reduced to the expected low operating temperature.

2. The electronic device heat dissipation assembly as described in claim 1, characterized in that, The water cooling head (21) has a heat exchange space (213) inside, and an inlet (211) and an outlet (212) connected to the heat exchange space. The water cooling plate (22) has a flow channel (223) inside, and an inlet (221) and an outlet (222) to the outside. A cooling water manifold assembly (70) has a first pipe body (71) and a second pipe body (72). The first pipe body (71) is connected to the inlet (211) of the water cooling head (21), and the second pipe body (72) is connected to the outlet (222) of the water cooling plate (22). The other ends of the first pipe body (71) and the second pipe body (72) are respectively connected to the external forced cooling assembly (3) pipeline.

3. The electronic device heat dissipation assembly as described in claim 2, characterized in that, The outlet (212) of the water cooling head (21) can be connected to one of the inlet (211) of another water cooling head (21) and the inlet (221) of the water cooling plate (22).

4. The electronic device heat dissipation assembly as described in claim 2 or 3, characterized in that, The external forced cooling assembly (3) includes at least one coolant distribution unit group (30) and a heat exchange cooler connected thereto; and an input distribution unit (31) and an output distribution unit (32) of the coolant distribution unit group (30) are respectively connected to the first pipe body (71) and the second pipe body (72) via pipelines.

5. The electronic device heat dissipation assembly as described in claim 4, characterized in that, The heat exchange cooler is at least one of a gas-type heat exchange cooler (33) and a liquid-type heat exchange cooler (34).

6. The electronic device heat dissipation assembly as described in claim 1, 2, or 3, characterized in that, There are multiple water cooling plates (22), and the water cooling plates (22) are arranged in parallel and spaced apart from each other at least one above and below the main board (5), and are interconnected with each other.

7. The electronic device heat dissipation assembly as described in claim 4, characterized in that, There are multiple water cooling plates (22), and the water cooling plates (22) are arranged at least one above and below the main board (5) with spacing between them and parallel to each other, and are interconnected with each other.

8. The electronic device heat dissipation assembly as described in claim 5, characterized in that, There are multiple water cooling plates (22), and the water cooling plates (22) are arranged at least one above and below the main board (5) with spacing between them and parallel to each other, and are interconnected with each other.

9. The electronic device heat dissipation assembly as described in claim 1, 2, or 3, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

10. The electronic device heat dissipation assembly as claimed in claim 4, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

11. The electronic device heat dissipation assembly as described in claim 5, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

12. The electronic device heat dissipation assembly as described in claim 6, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

13. The electronic device heat dissipation assembly as described in claim 7, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

14. The electronic device heat dissipation assembly as described in claim 8, characterized in that, The chassis (4) has an enhanced drive fan (90) in at least the middle section.

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