Component mounting device and component mounting system provided with same

Abstract

The invention provides a component carrying device capable of responding to external component supply and a component carrying system provided with the component carrying device. The component mounting apparatus includes: a component supply unit that supplies a first component to be mounted on a substrate mounted on a first stage; a first pickup head for taking out the first component from the component supply unit; a second stage on which the first component taken out by the first pickup head and the second component transported from the outside of the housing to the internal space are temporarily placed; a mounting head for taking out the first component or the second component mounted on the second stage and mounting the component on the substrate; a carrying head moving mechanism that moves the carrying head between the first stage and the second stage; and a stage moving mechanism that moves the second stage between a first position on which the first component taken out by the first pickup head is placed and a second position on which the second component is received.

Description

Technical Field

[0001] The present invention relates to a component mounting device and a component mounting system having the component mounting device. Background Technology

[0002] Conventionally, in component mounting apparatuses that mount electronic components such as integrated circuits (ICs) onto substrates, the component supply unit, as a supply component, has been configured to supply ICs from wafers or trays, and to supply ICs from reels containing ICs using a feeder. For example, Patent Document 1 describes a configuration where chip-type electronic components are supplied from wafers.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-108961 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] When mounting a component with a different supply form than the component supplied from the component mounting device inside the component mounting device onto the substrate, a component mounting device with a component supply unit having a different supply form may be provided to continuously mount the component onto the substrate, or a component mounting device with a component supply unit having both forms may be used.

[0008] However, depending on the type of substrate, there are cases where only one type of component is mounted on the substrate. When using two component mounting devices or when using a component mounting device with two types of component supply units, each device is relatively large, which limits the production line layout.

[0009] Therefore, the object of the present invention is to provide a component mounting device capable of handling component supplies from external sources, and a component mounting system having the component mounting device.

[0010] Solution for solving the problem

[0011] The component mounting apparatus of the present invention mounts a first component and a second component onto a substrate placed on a first platform within an internal space inside a housing. The component mounting apparatus includes: a component supply unit for supplying a first component for mounting onto the substrate placed on the first platform; a first pickup head for removing the first component from the component supply unit; a second platform for temporarily mounting the first component removed by the first pickup head and a second component transported from the outside of the housing to the internal space; a mounting head for removing the first component or the second component placed on the second platform and mounting it onto the substrate; a mounting head moving mechanism for moving the mounting head between the first platform and the second platform; and a platform moving mechanism for moving the second platform between a first position for mounting the first component removed by the first pickup head and a second position for receiving the second component.

[0012] The component mounting system of the present invention mounts a first component and a second component onto a substrate placed on a first stage within an internal space inside a housing. The component mounting system includes: a component mounting device for mounting the first component and the second component onto the substrate placed on the first stage; and a component supply device for supplying the second component to the component mounting device. The component mounting device includes: a component supply section for supplying the first component; a first pickup head for removing the first component from the component supply section; a second stage for temporarily mounting the first component removed by the first pickup head and the second component transferred from the component supply device; a mounting head for removing the first component or the second component placed on the second stage and mounting the first component or the second component onto the substrate; a mounting head moving mechanism for moving the mounting head between the first stage and the second stage; and a stage moving mechanism for moving the second stage between a first position for mounting the first component removed by the first pickup head and a second position for receiving the second component.

[0013] Invention Effects

[0014] According to the present invention, a component mounting device capable of handling component supply from an external source and a component mounting system having the component mounting device can be provided. Attached Figure Description

[0015] Figure 1 This is a perspective view showing the appearance of the component mounting system according to the embodiment.

[0016] Figure 2 This is a perspective view showing the appearance of the component supply device.

[0017] Figure 3 This is a side view showing the outline of the structure within the component mounting device.

[0018] Figure 4This is a perspective view showing the main structure within the component mounting device.

[0019] Figure 5 This is a side view of the platform moving mechanism.

[0020] Figure 6 This is an explanatory diagram showing the direction of component transport.

[0021] Figure 7 This is a block diagram showing the control structure of the component mounting system.

[0022] Explanation of reference numerals in the attached figures

[0023] 1. Component mounting system

[0024] 3-component mounting device

[0025] 4. Shell

[0026] 5. Component supply device

[0027] 7, 8 Side Views

[0028] 9 First opening

[0029] 10 Second opening

[0030] 11. Component Supply Department

[0031] 12 equipped with head

[0032] 13 First Platform

[0033] 14 Second Platform

[0034] 15 Second platform moving mechanism

[0035] 16 Equipped with a head moving mechanism

[0036] 17 Liang

[0037] 18 cameras

[0038] 19 Control Department

[0039] 20 Touch Panel

[0040] 21 Abutment

[0041] 23. Component Supply Department Moving Section

[0042] 25 First platform moving mechanism

[0043] 31 First Pickup Head

[0044] 33 First moving mechanism

[0045] 34 orbits

[0046] 35 tools

[0047] 37 Component heating section

[0048] 39 Tool Temperature Sensor

[0049] 41 Tool lifting mechanism

[0050] 43 Pressure Sensor

[0051] 45. Ultrasonic oscillator

[0052] 51 Second Pickup Head

[0053] 53 Second Head Moving Mechanism

[0054] 61 Drive Motor

[0055] 63 Ball Screw

[0056] 65 nuts

[0057] 67 Base

[0058] 73 Equipped with a control unit

[0059] 75 Storage Section

[0060] 76 Production Process

[0061] 201 substrate

[0062] 202 components

[0063] 203 First Component

[0064] 205 Second Component

[0065] Pa mounting position

[0066] Pb junction position

[0067] P1 First Position

[0068] P2 Second Position

[0069] P3, third position. Detailed Implementation

[0070] The component mounting apparatus of the first aspect of the present invention mounts a first component and a second component onto a substrate placed on a first stage within an internal space inside a housing. The component mounting apparatus includes: a component supply unit for supplying a first component for mounting onto the substrate placed on the first stage; a first pickup head for removing the first component from the component supply unit; a second stage for temporarily mounting the first component removed by the first pickup head and the second component transported from the outside of the housing to the internal space; a mounting head for removing the first component or the second component placed on the second stage and mounting it onto the substrate; a mounting head moving mechanism for moving the mounting head between the first stage and the second stage; and a stage moving mechanism for moving the second stage between a first position for mounting the first component removed by the first pickup head and a second position for receiving the second component.

[0071] Even if the second component has a different supply form than the first component supplied within the component mounting apparatus, the component mounting apparatus can still accept the second component from an external component supply device and mount it onto the substrate, thus accommodating different component supply forms. Furthermore, since both the first and second components are mounted on a common second stage, and both are mounted onto the substrate using a common mounting head, the size of the component mounting apparatus can be reduced. Additionally, when the second component is not needed, the component supply device, which is smaller than the component mounting apparatus, can be removed, thus increasing the flexibility of the production line layout.

[0072] According to a second aspect of the invention, based on the component mounting device of the first aspect, a second platform and a first platform are separately configured in a first direction, and a mounting head moving mechanism causes the mounting head to reciprocate between the second platform and the first platform along the first direction. A second position is a position separated from the first position in a second direction that intersects the first direction, and a platform moving mechanism causes the second platform to move between the first position and the second position.

[0073] According to a third aspect of the present invention, based on the component mounting device of the first or second aspect, the housing has a first opening for supplying a second component from the outside of the housing to the interior space. The first opening is disposed on the extension line of the direction in which the second platform travels from the first position to the second position.

[0074] According to a fourth aspect of the present invention, based on the component mounting device of the third aspect, the housing has a second opening for moving a substrate into or out of the internal space along a second direction relative to the internal space. The second opening is arranged at a distance from the first opening in a first direction.

[0075] According to a fifth aspect of the present invention, based on any of the component mounting devices in the first to fourth aspects, a second platform is disposed between the first platform and the component supply unit.

[0076] According to a sixth aspect of the present invention, in addition to the component mounting device of any of the first to fifth aspects, a camera is further provided for photographing the first or second component mounted on the second platform. The camera is positioned above a third position located between the first and second positions, and photographs the first or second component from the third position.

[0077] According to the seventh aspect of the present invention, based on the component mounting device of the sixth aspect, a control unit is further provided. The control unit controls the mounting head moving mechanism based on the shooting results captured by the camera, so that the mounting head can remove the first component or the second component placed on the second platform.

[0078] The eighth aspect of the present invention provides a component mounting system that mounts a first component and a second component onto a substrate placed on a first stage within an internal space inside a housing. The component mounting system includes: a component mounting device for mounting the first component and the second component onto the substrate placed on the first stage; and a component supply device for supplying the second component to the component mounting device. The component mounting device includes: a component supply section for supplying the first component; a first pickup head for removing the first component from the component supply section; a second stage for temporarily mounting the first component removed by the first pickup head and the second component transferred from the component supply device; a mounting head for removing the first component or the second component placed on the second stage and mounting the first component or the second component onto the substrate; a mounting head moving mechanism for moving the mounting head between the first stage and the second stage; and a stage moving mechanism for moving the second stage between a first position for mounting the first component removed by the first pickup head and a second position for receiving the second component.

[0079] Even if the second component has a different supply form than the first component supplied in the component mounting device, the component mounting device can still accept the second component from the component supply device and mount it onto the substrate, thus accommodating component supplies of different forms. Furthermore, since both the first and second components are mounted on a common second stage, and both are mounted onto the substrate using a common mounting head, the large size of the component mounting system can be prevented. Additionally, when the second component is not needed, the component supply device, which is smaller than the component mounting device, can be removed, thus increasing the flexibility of the production line layout.

[0080] According to a ninth aspect of the present invention, based on the component mounting system of the eighth aspect, a second platform and a first platform are separately configured in a first direction. A mounting head moving mechanism causes the mounting head to reciprocate between the second platform and the first platform along the first direction. A second position is a position separated from the first position in a second direction that is an intersecting direction with the first direction, and a platform moving mechanism causes the second platform to move between the first position and the second position.

[0081] According to a tenth aspect of the present invention, based on the component mounting system of the ninth aspect, the housing includes a first opening for supplying a second component from the component supply device to the internal space. The first opening is disposed on the extension line of the direction in which the second platform travels from the first position to the second position.

[0082] According to the eleventh aspect of the present invention, based on the component mounting system of the tenth aspect, the housing has a second opening for moving the substrate into or out of the internal space along the second direction relative to the internal space. The second opening is arranged at a distance from the first opening in the first direction.

[0083] According to the twelfth aspect of the present invention, based on any of the eighth to eleventh aspects of the component mounting system, the second platform is disposed between the first platform and the component supply unit.

[0084] The thirteenth embodiment of the present invention, based on any of the eighth to twelfth embodiments of the component mounting system, further includes a camera for photographing a first or second component mounted on a second platform. The camera is positioned above a third position located between the first and second positions, and photographs the first or second component from the third position.

[0085] The component mounting system of the fourteenth embodiment of the present invention, based on the component mounting system of the thirteenth embodiment, further includes a control unit. The control unit controls the mounting head moving mechanism based on the shooting results captured by the camera, so that the mounting head can remove the first component or the second component placed on the second platform.

[0086] The component loading system of the fifteenth aspect of the present invention is based on the component loading system of the tenth or eleventh aspect, wherein the component supply device includes a second pickup head, which transports a second component to a second platform at a second position. The second pickup head passes through a first opening.

[0087] Hereinafter, exemplary embodiments of the component mounting device and component mounting system of the present invention will be described with reference to the accompanying drawings. The present invention is not limited to the specific structures of the following embodiments; structures based on the same technical concept are included in the present invention.

[0088] [Implementation Method]

[0089] (Overall structure)

[0090] The following is for reference Figures 1 to 3 The component mounting system 1 and component mounting device 3 in the embodiments of the present invention will be described. Figure 1 This is a perspective view showing the appearance of the component mounting system 1 according to an embodiment of the present invention. Figure 2 This is a perspective view showing the appearance of component mounting device 3. Figure 3 This is a side view showing the general structure within the component mounting device 3. It should be noted that the direction in which the substrate 201 is transported is defined as the X-axis direction, the direction orthogonal to the X-axis direction is defined as the Y-axis direction, and the longitudinal direction orthogonal to the XY plane is defined as the Z-axis direction.

[0091] like Figure 1 As shown, the component mounting system 1 includes a component mounting device 3 and a component supply device 5.

[0092] The component mounting device 3 mounts a first component 203, such as a semiconductor chip, onto a substrate 201 that is being transported internally. The component mounting device 3 has a housing 4 that houses each internal component. The component mounting device 3 has a component supply unit 11 inside the housing 4, so that the first component 203 can be mounted onto the substrate 201 even if the component mounting device 3 is a single unit. When mounting a component that cannot be handled by the component supply unit 11 alone onto the substrate 201, a component supply unit 5, which serves as an external component, is arranged on the side of the component mounting device 3.

[0093] The component supply device 5 supplies the second component 205 to the component mounting device 3. The component supply device 5 includes a second pickup head 51 (see reference). Figure 4 ), second moving mechanism 53 (refer to) Figure 7 And, for example, a tape feeder. A tape feeder equipped with a reel feeds the components, using a second pick-up head 51 and a second head moving mechanism 53 to transport the second component 205 to the component mounting device. The reel is wound with a carrier tape containing the chip-type second component 205. It should be noted that, in the following description, both the first component 203 and the second component 205 are referred to as component 202.

[0094] The housing 4 of the component mounting device 3 has two sides 7 and 8 that intersect the transport direction (X-axis direction) of the substrate 201, a first opening 9 for supplying the second component 205 from the outside of the housing 4 to the internal space, and a second opening 10 for moving the substrate 201 into or out of the housing 4.

[0095] After the component 202 is mounted on the substrate 201, which is moved into the component mounting device 3 through the second opening 10 disposed on the side 7 of the housing 4, the substrate 201 is moved out through the second opening 10 disposed on the side 8 of the housing 4.

[0096] A first opening 9 is provided on the side 8 of the housing 4 on the side where the substrate 201 is removed, for the second component 205 to be brought in from the outside of the housing 4.

[0097] Thus, the housing 4 has a second opening 10 for moving the substrate 201 into the internal space along the X-axis direction (second direction) or moving the substrate 201 out of the internal space along the X-axis direction. The second opening 10 and the first opening 9 are arranged at a distance from each other in the Y-axis direction (first direction).

[0098] Additionally, the component supply device 5 includes a second pickup head 51 that transports the second component 205 to the second platform 14 at the second position P2. The second pickup head 51 passes through the first opening 9. Thus, the size of the opening of the first opening 9 is such that the second pickup head 51 can pass through to a certain extent.

[0099] Next, refer to Figure 3 as well as Figure 4 The structure of component mounting device 3 will be explained. Figure 4 This is a perspective view showing the main structure within the component mounting device 3.

[0100] The component mounting device 3 includes a component supply unit 11, a mounting head 12, a first platform 13, a second platform 14, a second platform moving mechanism 15, a mounting head moving mechanism 16, and a first pickup head 31. The component mounting device 3 also includes a camera 18, a control unit 19, a touch panel 20, a base 21, a component supply unit moving unit 23, and a first platform moving mechanism 25.

[0101] The component mounting device 3 mounts a first component 203, such as a semiconductor chip, onto a substrate 201, which serves as a workpiece. A first stage 13 for holding the substrate 201 and a component supply unit 11 are arranged along the Y-axis on the base 21.

[0102] The component supply section 11 supplies first components 203. Multiple first components 203 are held on the upper part of the component supply section 11. The component supply section 11 may be, for example, a wafer comprising multiple first components 203 formed by dicing, or a tray containing multiple first components 203. The first components 203 are held either attached to an adhesive sheet or placed on a tray. The component supply section 11 is provided on the component supply section moving section 23.

[0103] The component supply unit moving part 23 is controlled by the control unit 19, which moves the component supply unit 11 in two dimensions, for example, along the X-axis and Y-axis. The component supply unit moving part 23 is, for example, a combination of a ball screw and a guide, or a combination of a rack and pinion.

[0104] The first component 203 is held on the component supply section 11 with the electrode formed on the surface of the first component 203 facing upwards. A first pickup head 31 is disposed above the component supply section 11. The first pickup head 31 picks up and removes the first component 203 from the component supply section 11.

[0105] The first pickup head 31 can be moved by the first head moving mechanism 33 controlled by the control unit 19. Figure 7 The first head drive unit causes the first pickup head 31, which has the first component 203 adsorbed at the component supply unit 11, to rise in the positive direction of the Z-axis and move in the negative direction of the Y-axis to the junction position Pb, and then descend in the negative direction of the Z-axis to place the first component 203 on the second platform 14.

[0106] The mounting head 12 holds the first component 203 placed on the second stage 14 and mounts it onto the substrate 201 supported on the first stage 13. The mounting head 12 moves along the Y-axis direction by means of the mounting head moving mechanism 16 controlled by the control unit 19.

[0107] The mounting head moving mechanism 16 includes a beam 17, a track 34 arranged along the Y-axis on the beam 17, and a linear motor (not shown) for moving the mounting head 12. The driving amount of the linear motor is controlled by the control unit 19, and the mounting head 12 can move along the track 34 on the beam 17 by the driving amount of the linear motor.

[0108] Beam 17 is a member extending along the Y-axis that supports the mounting head 12. Although in Figure 2 The details are omitted, but the two ends of beam 17 in the Y-axis direction are supported, for example, on the shell 4.

[0109] A tool 35 is provided at the lower end of the mounting head 12 to hold and hold the first component 203 and the second component 205. At the junction position Pb, the tool 35 adsorbs the component 202 placed on the second stage 14. The mounting head moving mechanism 16 moves the mounting head 12 from the junction position Pb to the mounting position Pa on the substrate 201 where the component 202 is mounted.

[0110] The mounting head 12 includes a component heating unit 37 for heating the component 202 adsorbed by the tool 35, and a tool temperature sensor 39 for measuring the temperature of the tool 35 heated by the component heating unit 37. The component heating unit 37 is, for example, an electric heater. The component heating unit 37 is controlled by the control unit 19 to heat the tool 35 to a specified temperature. The temperature of the tool 35 measured by the tool temperature sensor 39 is sent to the control unit 19.

[0111] The mounting head 12 includes a tool lifting mechanism 41 that raises and lowers the tool 35 and a pressure sensor 43 that measures the load on the tool lifting mechanism 41 that pushes the tool 35 holding the component 202 against the substrate 201.

[0112] The tool lifting mechanism 41 is driven and controlled by the mounting control unit 73 of the control unit 19, so that the tool 35 is lowered such that the component 202 is mounted on the base plate 201 with a specified load. The tool lifting mechanism 41 includes, for example, a linear motor for raising and lowering the tool 35 and an encoder for measuring the drive amount of the linear motor. The load measured by the pressure sensor 43 is sent to the control unit 19.

[0113] The mounting head 12 also includes an ultrasonic oscillator 45 that causes the tool 35 to vibrate ultrasonically. The ultrasonic oscillator 45 is driven and controlled by the control unit 19, and when the component 202 is assembled onto the substrate 201 by ultrasonic pressing, the tool 35 is made to vibrate ultrasonically with a specified ultrasonic power, amplitude, and frequency.

[0114] The first stage 13 is disposed on the upper part of the first stage moving mechanism 25. The first stage moving mechanism 25 is controlled by the control unit 19 to move the first stage 13 along the X and Y directions. The first stage 13, for example, uses a transport rail to transport the substrate 201 in, positions the substrate 201 and holds it in the position for mounting the component 202. In addition, the first stage 13, for example, uses a transport rail to move the substrate 201 with the component 202 mounted to the next process.

[0115] When the mounting head 12 reaches the mounting position Pa, the tool 35 is lowered by the tool lifting mechanism 41 to mount the component 202 on the substrate 201 on the first platform 13, and the component 202 is assembled onto the substrate 201 by the ultrasonic oscillator 45.

[0116] The touch panel 20, which is connected to the control unit 19, displays the operation menu and operating status information of the component mounting device 3 on its display screen. Data input to the control unit 19 and operation of the component mounting device 3 can be performed using the operation buttons displayed on the screen. The touch panel 20 can be mounted on the component mounting device 3 or used as a portable terminal. Alternatively, a combination of an LCD monitor, operation buttons, a keyboard, and a mouse can be used instead of the touch panel 20.

[0117] Next, refer to Figures 4 to 6 The transport direction of component 202 being transported to the second platform 14 will be explained. Figure 5 This is a side view of the second platform moving mechanism 15. Figure 6 This is an explanatory diagram showing the transport direction of component 202.

[0118] The second platform moving mechanism 15 moves the second platform 14 to any one of the following positions: first position P1, second position P2, and third position P3. The first position P1 is the position where the mounting head 12 removes the components 202 (first component 203 and second component 205) from the second platform 14, i.e., the handover position Pb. The second position P2 is the position where the second platform 14 receives the second component 205 from the component supply device 5. The third position P3 is the position where the camera 18 photographs the component 202 to identify its location. The second position P2 is located on the extension of the straight line connecting the first position P1 and the third position P3.

[0119] The second platform 14 is separately positioned from the first platform 13 along the Y-axis (first direction). The mounting head moving mechanism 16 causes the mounting head 12 to reciprocate between the second platform 14 and the first platform 13 along the Y-axis. The second position P2 is a position separated from the first position P1 in the X-axis (second direction), which intersects the Y-axis. The second platform moving mechanism 15 moves the second platform 14 between the first position P1 and the second position P2.

[0120] like Figure 5 As shown, the second platform moving mechanism 15 includes a drive motor 61, a ball screw 63, a nut 65, and a base 67. The ball screw 63 may also be a single-axis actuator integrated with the guide.

[0121] The drive motor 61 causes the ball screw 63 to rotate clockwise and counterclockwise, thereby causing the nut 65 engaged with the ball screw 63 to reciprocate. The lower part of the second platform 14 is connected to the upper part of the nut 65, so the second platform 14 reciprocates along the X-axis direction (second direction) as the ball screw 63 rotates. The base 67 supports the drive motor 61.

[0122] Camera 18 is positioned above a third position P3, located between the first position P1 and the second position P2, and captures images of the component 202 placed on the second stage 14 from the third position P3. The captured image information is sent to the control unit 19. Based on the received image information, the control unit 19 identifies the shape of the component 202 and its rotation and position offset relative to a reference position through image processing. During the component mounting operation performed by the mounting head 12 to mount the component 202 onto the substrate 201, the control unit 19 corrects the orientation of the component 202 and the position offset in the X-axis and Y-axis directions based on the images of the component 202 captured by the camera 18.

[0123] In this way, a single camera 18 can capture images of both the first component 203 supplied within the component mounting device 3 and the second component 205 supplied from outside the component mounting device 3. Therefore, it is possible to reduce costs and save space without the need for a dedicated camera for the second component 205.

[0124] Furthermore, the second stage 14 is movable along the X-axis via the second stage moving mechanism 15. The component 202 placed on the second stage 14 is photographed by the camera 18. The second stage 14 is positioned between the first stage 13 and the component supply unit 11.

[0125] The second platform 14 is located between the first platform 13 and the component supply unit 11, and can move along the X-axis (second direction), so the movement of the second platform 14 can be achieved through simple reciprocating motion. In addition, the second platform moving mechanism 15 may not be designed with a complex structure.

[0126] Next, refer to Figure 6 This describes the movement path of component 202 up to the substrate 201 mounted on the first stage 13.

[0127] First, the path from the component supply unit 11 to the first platform 13 will be described. The first pickup head 31 transports the first component 203 supplied from the component supply unit 11 to the second platform 14 located at the junction position Pb and the first position P1 (path R1). Next, the second platform moving mechanism 15 moves the second platform 14 from the first position P1 to the third position P3 (path R2). When the second platform 14 reaches the third position P3, the camera 18 takes a picture of the first component 203 placed on the second platform 14. After the picture is taken, the second platform moving mechanism 15 moves the second platform 14 from the third position P3 to the first position P1 (path R3). Next, the mounting head 12 removes the first component 203 placed on the second platform 14 located at the junction position Pb and the first position P1 and transports it onto the first platform 13 located at the mounting position Pa, and mounts it onto the substrate 201 (path R4).

[0128] Next, the path from the component supply device 5 to the first platform 13 will be described. When the component mounting device 3 receives the second component 205 from the component supply device 5, the mounting control unit 73 drives the second platform moving mechanism 15 to move the second platform 14 to the second position P2. After moving the second platform 14 to the second position P2, the mounting control unit 73 sends a completion signal to the control unit 81 of the component supply device 5. Upon receiving the completion signal, the control unit 81 drives the second head moving mechanism 53 to remove the second component 205 from the component supply device 5 and transport it through the first opening 9 to the second platform 14 located at the second position P2 inside the housing 4 of the component mounting device 3 (path R1a).

[0129] When the second pickup head 51 places the second component 205 onto the second platform 14, the control unit 81 of the component supply device 5 sends a completion signal to the loading control unit 73. Upon receiving the completion signal, the loading control unit 73 drives the second platform moving mechanism 15 to move the second platform 14 from the second position P2 to the third position P3 (path R2a).

[0130] When the second stage 14 reaches the third position P3, the camera 18 takes a picture of the second component 205 placed on the second stage 14. After the picture is taken, the second stage moving mechanism 15 moves the second stage 14 from the third position P3 to the first position P1 (path R3). Next, the mounting head 12 removes the second component 205 placed on the second stage 14 located at the junction position Pb and the first position P1 and transports it onto the first stage 13 located at the mounting position Pa, and mounts it onto the substrate 201 (path R4).

[0131] Both the first component 203 and the second component 205 share the same path from the end of the shooting at the third position P3 to the first platform 13, thus preventing the component mounting device 3 from becoming too large.

[0132] Next, refer to Figure 7 The control structure of the component mounting system will be described. The control unit 19 of the component mounting device 3 and the control unit 81 of the component supply device 5 are connected in a communicable manner.

[0133] The control unit 19 of the component mounting device 3 is connected to the second platform moving mechanism 15, the mounting head moving mechanism 16, the touch panel 20, the component supply moving unit 23, the first platform moving mechanism 25, the first pickup head 31, the first head moving mechanism 33, the component heating unit 37, the tool temperature sensor 39, the tool lifting mechanism 41, the pressure sensor 43, the ultrasonic oscillator 45, and the drive unit 54 in a communicable manner.

[0134] The control unit 81 of the component supply device 5 is connected to the second pickup head 51 and the second head moving mechanism 53 in a communicable manner.

[0135] Control unit 19 controls the operation of various elements of component mounting device 3, and control unit 81 controls the operation of various elements of component supply device 5. Control units 19 and 81 are circuits including semiconductor elements, such as general-purpose processors like CPUs, MPUs, FPGAs, DSPs, and ASICs that execute programs to achieve predetermined functions. Control unit 19 includes a mounting control unit 73 and a storage unit 75. Storage unit 75 is, for example, a memory, hard disk, or SSD. Control unit 19 performs its functions by executing programs stored in storage unit 75.

[0136] The control unit 73 controls the operation of the second platform moving mechanism 15, the mounting head moving mechanism 16, the component supply moving unit 23, the first platform moving mechanism 25, the first head moving mechanism 33, and the tool lifting mechanism 41 based on the production program 76 of the storage unit 75.

[0137] In addition, the mounting control unit 73 controls the mounting head moving mechanism 16 based on the shooting results captured by the camera 18, so that the mounting head 12 takes out the component 202 placed on the second platform 14.

[0138] Based on the image information of component 202 obtained by camera 18, and considering the placement position and angle of component 202, the mounting control unit 73 enables the mounting head 12 to properly remove component 202. In cases where the first pickup head 31 and the second pickup head 51 fail to mount component 202 onto the second stage 14, such as when a component is brought back, the mounting control unit 73 identifies, based on the image information from camera 18, that component 202 is not mounted on the second stage 14. In this case, the mounting control unit 73 displays an error message on the touch panel 20.

[0139] Production process 76 is the process required to make the component mounting device 3 work. Production process 76 also includes the component mounting position (coordinates) of the substrate 201 and information such as the name and mounting order of the component 202 mounted at that position.

[0140] (Effect)

[0141] As described above, in Embodiment 1, the component mounting device 3 mounts the first component 203 and the second component 205 onto the substrate 201 placed on the first stage 13 in the internal space inside the housing 4. The component mounting device 3 includes: a component supply unit 11 that supplies a first component 203 for mounting on a substrate 201 placed on a first platform 13; a first pickup head 31 for removing the first component 203 from the component supply unit 11; a second platform 14 that temporarily mounts the first component 203 removed by the first pickup head 31 and a second component 205 transported from the outside of the housing 4 to the internal space; a mounting head 12 that removes the first component 203 or the second component 205 placed on the second platform 14 and mounts it on the substrate 201; a mounting head moving mechanism 16 that moves the mounting head 12 between the first platform 13 and the second platform 14; and a second platform moving mechanism 15 that moves the second platform 14 between a first position P1 for mounting the first component 203 removed by the first pickup head 31 and a second position for receiving the second component 205.

[0142] Furthermore, in Embodiment 1, the component mounting system 1 mounts the first component 203 and the second component 205 onto the substrate 201 placed on the first stage 13 within the internal space inside the housing 4. The component mounting system 1 includes: a component mounting device 3 that mounts the first component 203 and the second component 205 onto the substrate 201 placed on the first stage 13; and a component supply device 5 that supplies the second component 205 to the component mounting device 3.

[0143] Because the component supply device 5 can accept a second component 205 in a different supply form than the first component 203 supplied in the component mounting device 3 and mount it onto the substrate 201, it can handle component supply in different forms. For example, it can supply ICs not only from wafers or trays, but also from reels. Furthermore, since both the first component 203 and the second component 205 are mounted on a common second stage 14, and both the first component 203 and the second component 205 are mounted onto the substrate 201 using a common mounting head 12, the size of the mounting device can be reduced. Additionally, when mounting components onto the substrate 201 only using the supply form of the first component 203 supplied in the component mounting device 3, the component supply device 5, which is smaller than the component mounting device 3, can be removed, and component mounting can be performed solely by the component mounting device 3, thus increasing the flexibility of the production line layout. In this way, the second component 205 can be supplied from the component supply device 5 only when necessary.

[0144] Additionally, the housing 4 has a first opening 9 for supplying the second component 205 from the outside of the housing 4 into the internal space. The first opening 9 is disposed on the extension line of the second platform 14 in the direction of travel from the first position P1 to the second position P2.

[0145] Since the first opening 9 is provided at the part of the housing 4 on the extension line of the movement of the second platform 14, the second component 205 of the component supply device 5 externally mounted from the component mounting device 3 can be received in a straight line with high efficiency.

[0146] This invention has been fully described with reference to the accompanying drawings and preferred embodiments, but it will be apparent to those skilled in the art that various modifications and alterations can be made. Such modifications and alterations should be understood to be included therein, as long as they do not depart from the scope of this invention based on the appended patented technology. Furthermore, variations in the combination and order of elements in each embodiment can be achieved without departing from the scope and spirit of this invention.

[0147] It should be noted that by appropriately combining any of the various embodiments and variations described above, the respective effects can be achieved.

[0148] Industrial applicability

[0149] The component mounting apparatus and component mounting system of the present invention can be applied to component mounting apparatus and component mounting system for mounting components onto a substrate.

Claims

1. A component mounting device, wherein a first component and a second component are mounted on a substrate placed on a first stage within an internal space inside a housing, wherein, The component mounting device includes: A component supply unit supplies the first component for mounting on the substrate placed on the first stage; A first pickup head is used to remove the first component from the component supply unit; The second platform temporarily holds the first component picked up by the first pickup head and the second component transported from the outside of the housing to the interior space. A mounting head that removes the first or second component placed on the second stage and mounts it onto the substrate; A head-moving mechanism that moves the head between the first platform and the second platform; as well as A platform moving mechanism that moves the second platform between a first position and a second position, the first position for placing the first component picked up by the first pickup head, and the second position for receiving the second component.

2. The component mounting device according to claim 1, wherein, The second stage is configured separately from the first stage in a first direction. The mounting head moving mechanism causes the mounting head to reciprocate between the second platform and the first platform along the first direction. The second position is a position that separates from the first position in a second direction that intersects the first direction. The platform moving mechanism moves the second platform between the first position and the second position.

3. The component mounting device according to claim 2, wherein, The housing has a first opening for supplying the second component from the outside of the housing into the interior space. The first opening is located on the extension line of the direction in which the second platform travels from the first position to the second position.

4. The component mounting device according to claim 3, wherein, The housing has a second opening for moving the substrate into or out of the internal space along the second direction relative to the internal space. The second opening is arranged at a distance from the first opening in the first direction.

5. The component mounting device according to claim 1, wherein, The second platform is disposed between the first platform and the component supply unit.

6. The component mounting device according to claim 1, wherein, The component mounting device also includes a camera that captures images of the first component or the second component mounted on the second platform. The camera is positioned above a third position located between the first position and the second position, and takes a picture of the first component or the second component from the third position.

7. The component mounting device according to claim 6, wherein, The component mounting device also includes a control unit that controls the mounting head moving mechanism based on the shooting results captured by the camera, so that the mounting head can remove the first component or the second component placed on the second platform.

8. The component mounting device according to claim 1, wherein, The component mounting device includes a component supply section moving section, which moves the component supply section in two dimensions.

9. A component mounting system, wherein a first component and a second component are mounted on a substrate placed on a first stage within an internal space inside a housing, wherein, The component mounting system includes: A component mounting device that mounts a first component and a second component onto a substrate placed on a first stage; and A component supply device that supplies the second component to the component mounting device. The component mounting device includes: A component supply department that supplies the first component; A first pickup head is used to remove the first component from the component supply unit; The second platform temporarily holds the first component picked up by the first pickup head and the second component transferred from the component supply device. A mounting head that removes the first or second component placed on the second stage and mounts the first or second component onto the substrate; A head-moving mechanism that moves the head between the first platform and the second platform; as well as A platform moving mechanism that moves the second platform between a first position and a second position, the first position for placing the first component picked up by the first pickup head, and the second position for receiving the second component.

10. The component mounting system according to claim 9, wherein, The second stage is configured separately from the first stage in a first direction. The mounting head moving mechanism causes the mounting head to reciprocate between the second platform and the first platform along the first direction. The second position is a position that separates from the first position in a second direction that intersects the first direction. The platform moving mechanism moves the second platform between the first position and the second position.

11. The component mounting system according to claim 10, wherein, The housing has a first opening for supplying the second component from the component supply device into the internal space. The first opening is located on the extension line of the direction in which the second platform travels from the first position to the second position.

12. The component mounting system according to claim 11, wherein, The housing has a second opening for moving the substrate into or out of the internal space along the second direction relative to the internal space. The second opening is arranged at a distance from the first opening in the first direction.

13. The component mounting system according to claim 9, wherein, The second platform is disposed between the first platform and the component supply unit.

14. The component mounting system according to claim 9, wherein, The component mounting system also includes a camera that captures images of the first component or the second component mounted on the second platform. The camera is positioned above a third position located between the first position and the second position, and takes a picture of the first component or the second component from the third position.

15. The component mounting system according to claim 14, wherein, The component mounting system also includes a control unit that controls the mounting head moving mechanism based on the shooting results captured by the camera, so that the mounting head removes the first component or the second component from the second platform.

16. The component mounting system according to claim 11, wherein, The component supply device includes a second pickup head that transports the second component to the second platform at the second position. The second pickup head passes through the first opening.

17. The component mounting system according to claim 9, wherein, The component mounting system includes a component supply unit moving part, which moves the component supply unit in two dimensions.

Images