Method for manufacturing translucent member, translucent member, and light-emitting device

Abstract

Provided are a light-transmitting member having a good light extraction effect, a light-emitting device, and a method for manufacturing the light-transmitting member. This method for manufacturing a light-transmitting member comprises: a step for preparing a light-transmitting substrate having a first surface on which a first film containing a substance that can be removed by an acidic substance is disposed, and a second surface positioned on the opposite side of the first surface; and a step of bringing the first film into contact with an acidic material to obtain a translucent second film having voids, in which the first surface of the substrate includes a first region and a second region adjacent to the first region, the thickness of the second film disposed in the second region is smaller than the thickness of the second film disposed in the first region, and the thickness of the second film disposed in the first region is smaller than the thickness of the second film disposed in the second region. The light transmittance of the first region is greater than the light transmittance of the second region.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing a light-transmitting component, the light-transmitting component, and a light-emitting device. Background Technology

[0002] For example, Patent Document 1 discloses an absorptive multilayer ND filter, wherein the metal absorbing film layer has a film thickness distribution, the oxide dielectric film layer has a film thickness distribution opposite to that of the metal absorbing film layer, and the transmittance gradually decreases as it moves away from the center of the optical axis.

[0003] <Cited Documents>

[0004] <Patent Documents>

[0005] <Patent Document 1> Japanese Patent Application Publication No. 2010-128258 Summary of the Invention

[0006] <Technical problems to be solved>

[0007] The purpose of this disclosure is to provide a light-transmitting component, a light-emitting device, and a method for manufacturing a light-transmitting component with good light extraction effect.

[0008] <Technical Solution>

[0009] A method for manufacturing a light-transmitting component according to one embodiment of this disclosure includes:

[0010] A step of preparing a light-transmitting substrate, the substrate having a first surface and a second surface located opposite to the first surface, a first film disposed on the first surface side, the first film containing a substance removable by an acidic substance; and

[0011] The step of obtaining a second membrane with porosity and light transmittance by contacting the first membrane with an acidic substance.

[0012] The first surface of the substrate includes a first region and a second region adjacent to the first region. The thickness of the second film disposed in the second region is less than the thickness of the second film disposed in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

[0013] One embodiment of the light-transmitting component of this disclosure includes:

[0014] A light-transparent substrate having a first surface and a second surface located on the opposite side of the first surface, wherein the first surface includes a first region and a second region adjacent to the first region; and

[0015] An inorganic light reflection reduction film is disposed on the first surface side of the substrate and has voids.

[0016] The thickness of the light reflection reduction film in the second region is less than the thickness of the light reflection reduction film in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

[0017] One embodiment of the light-emitting device disclosed herein includes:

[0018] The light-transmitting component; and

[0019] A light source arranged along the direction of the first surface of the light-transmitting component.

[0020] The light source includes a light-emitting surface, and the first region overlaps with the light-emitting surface in the top view.

[0021] <Beneficial Effects>

[0022] According to embodiments of this disclosure, a light-transmitting component with good light extraction effect, a light-emitting device, and a method for manufacturing the light-transmitting component can be provided. Attached Figure Description

[0023] Figure 1 This is a top view showing the overall configuration of the light-emitting device in the embodiment.

[0024] Figure 2A It is along Figure 1 A cross-sectional view of the IIA-IIA line in the diagram.

[0025] Figure 2B yes Figure 2A Enlarged view of region IIB in the image.

[0026] Figure 3 This is a bottom view showing the first example of a light-transmitting component in the embodiment.

[0027] Figure 4 This is a cross-sectional view of a second example of the substrate included in the light-transmitting component of the embodiment.

[0028] Figure 5 This is a cross-sectional view of a third example of the substrate included in the light-transmitting component of the embodiment.

[0029] Figure 6A This is a cross-sectional view showing the first film in the light-transmitting component of the embodiment.

[0030] Figure 6B This is a cross-sectional view showing the second film in the light-transmitting component of the embodiment.

[0031] Figure 7This is a top view of the light source provided by the light-emitting device in the embodiment.

[0032] Figure 8 It is along Figure 7 A cross-sectional view of line VIII-VIII in the diagram.

[0033] Figure 9A This is a schematic diagram of the first and second regions in the light reflection reduction film of the light-transmitting component in the embodiment.

[0034] Figure 9B This is a schematic diagram of a first example of the thickness of the first region and the second region in the light reflection reduction film of the light-transmitting component of the embodiment.

[0035] Figure 9C This is a schematic diagram of a second example showing the thickness of the first and second regions in the light reflection reduction film of the light-transmitting component in the embodiment.

[0036] Figure 10 This is a flowchart illustrating the overall process of manufacturing a light-transmitting component according to an embodiment.

[0037] Figure 11 It is a detailed representation Figure 10 The flowchart shows the substrate preparation steps.

[0038] Figure 12 This is a cross-sectional view showing the first example of a support fixture.

[0039] Figure 13 This is an oblique view of the first example of the support clamp viewed from below.

[0040] Figure 14A This diagram illustrates the behavior of vapor-deposited particles in the vapor deposition process.

[0041] Figure 14B This is a schematic diagram of a film formed by vapor deposition.

[0042] Figure 15A This is a diagram illustrating the behavior of sputtered particles in the sputtering process.

[0043] Figure 15B This is a schematic diagram of a film formed by sputtering.

[0044] Figure 16 This is a bottom view showing the second example of a support clamp.

[0045] Figure 17 This is a bottom view showing the third example of a support clamp.

[0046] Figure 18 This is a bottom view showing the fourth example of a support clamp.

[0047] Figure 19 This is a bottom view showing the fifth example of a support clamp.

[0048] Figure 20 This is a cross-sectional view illustrating the structure of the light-transmitting component in the embodiments and comparative examples.

[0049] Figure 21 This is a schematic diagram showing the measurement results of the illuminance of light emitted from the light-transmitting components of the embodiments and comparative examples.

[0050] [Explanation of reference numerals in the attached figures]

[0051] 1. Light-transmitting components

[0052] 1G outer edge

[0053] 11 substrates

[0054] 11a First Surface

[0055] 11b Second Surface

[0056] 111 lens

[0057] 111C optical axis

[0058] 111G lens outer edge

[0059] 112 Support Section

[0060] 112a lower surface

[0061] 12 Light Reflection Reduction Film

[0062] 12-1 First Membrane

[0063] 12-2 Second membrane

[0064] 12a silicon dioxide layer

[0065] 12b1 First Mixed Layer

[0066] 12b2 Second Mixed Layer

[0067] 121 Area 1

[0068] 121G Region 1 Outer Edge

[0069] 122 Area 2

[0070] 122G Region 2 Outer Edge

[0071] 2 light sources

[0072] 2C corner

[0073] 2S edge

[0074] 20, 20-1 to 20-9 Light-emitting parts

[0075] 21, 21-1 to 21-9 light-emitting surfaces

[0076] 22 light-emitting elements

[0077] 23 electrodes

[0078] 24 Wavelength Conversion Components

[0079] 25 Covering Components

[0080] 3 substrates

[0081] 32 wiring

[0082] 33 Conductive components

[0083] 3a upper surface

[0084] 4 Adhesive components

[0085] 100 light-emitting devices

[0086] 110 bottom film

[0087] Figures 161 and 191

[0088] 200 support clamps

[0089] 210 Upper Clamp

[0090] 211 lower surface

[0091] 220 Lower Side Clamp

[0092] 221 lower surface

[0093] 222 protrusion

[0094] 222a upper surface

[0095] 223 upper surface

[0096] 240 First opening

[0097] 240a Wheel

[0098] 240C Center

[0099] 250 luminous area

[0100] 250G luminescent area outer edge

[0101] 260 Second opening

[0102] 261 Circular Opening

[0103] 262 arc-shaped opening

[0104] 262a opening portion

[0105] 262b Unopened portion

[0106] Holes 270 and 271

[0107] A1 Direction 1

[0108] A2, Direction 2

[0109] d Distance

[0110] L protrusion length

[0111] Lg Illuminance Characteristic Value

[0112] P particles

[0113] t film thickness

[0114] W opening width Detailed Implementation

[0115] The manufacturing method of the light-transmitting component, the light-transmitting component, and the light-emitting device according to the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that the following embodiments are merely examples of the manufacturing method of the light-transmitting component, the light-transmitting component, and the light-emitting device for realizing the technical concept of the present embodiments, and the present disclosure is not limited to the following. Furthermore, the dimensions, materials, shapes, and relative arrangements of the components described in the embodiments are merely illustrative examples, and unless otherwise stated, they are not intended to limit the scope of the present disclosure to that specific manner. Additionally, the size and positional relationships of the components shown in the accompanying drawings have been exaggerated for clarity. Furthermore, in the following description, the same names and reference numerals denote the same or similar components, and their detailed descriptions have been appropriately omitted. Also, as sectional views, end views showing only the cut surface may be used.

[0116] In the accompanying drawings shown below, directions are sometimes indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are mutually orthogonal directions. The X-direction along the X-axis and the Y-direction along the Y-axis indicate the direction along the light-emitting surface of the light-emitting portion of the light-emitting device in the embodiment. The Z-direction along the Z-axis indicates a direction orthogonal to the light-emitting surface. That is, the light-emitting surface of the light-emitting portion is parallel to the XY plane, and the Z-axis is orthogonal to the XY plane.

[0117] The direction indicated by the arrow in the X direction is designated as the +X side, and the opposite side of the +X side is designated as the -X side. The direction indicated by the arrow in the Y direction is designated as the +Y side, and the opposite side of the +Y side is designated as the -Y side. The direction indicated by the arrow in the Z direction is designated as the +Z side, and the opposite side of the +Z side is designated as the -Z side. As an example, the light-emitting portion of the light-emitting device in this embodiment emits light towards the +Z side. Furthermore, in the terminology of this embodiment, a top view refers to a view obtained by observing the object (hereinafter referred to as the object) from the emission surface side of the light-transmitting member of the embodiment. It should be noted that in this specification, in addition to the parts that can be directly seen from above, the term "top view" may also be used to describe parts that cannot be directly seen from above, to indicate that they appear transparent. The emission surface of the light-transmitting member in this embodiment refers to the surface from which light emitted from the light source of the light-emitting device of the embodiment passes through the light-transmitting member of the embodiment and exits. However, these do not limit the orientation of the light-transmitting component and the light-emitting device when they are used in the embodiment; the orientation of the light-transmitting component and the light-emitting device in the embodiment is arbitrary.

[0118] In this specification, the surface of an object viewed from the +Z side is called the "top surface" (note: "" is equivalent to ""), and the surface of an object viewed from the -Z side is called the "bottom surface". The view obtained by observing the object from the +Z side is called a top view, and the view obtained by observing the object from the -Z side is called a bottom view. Furthermore, there are cases where the +Z side of the object is referred to as the top and the -Z side as the bottom. In the embodiments shown below, along the X-axis, Y-axis, and Z-axis refers to the case where the object is tilted within a range of ±10° relative to these axes. Furthermore, in this embodiment, orthogonality may have an error within ±10° relative to 90°. "Configuration" is not limited to direct contact, but also includes indirect configuration, such as via other components.

[0119] In this specification or claims, when a constituent element is multiple and needs to be described separately, a prefix such as "first," "second," etc., is sometimes added before the constituent element for distinction. Furthermore, the objects distinguished in this specification and the claims may differ. Therefore, even if a constituent element with the same prefix as in this specification is described in the claims, the object defined by that constituent element may not be consistent between this specification and the claims.

[0120] For example, if there are constituent elements in this specification that are distinguished by the designations "first," "second," and "third," and the constituent elements designated "first" and "third" in this specification are also described in the claims, or if the constituent element designated "first" and the constituent element without a specific number are also described in the claims, then for ease of reading, these constituent elements may also be distinguished by the designations "first" and "second" in the claims. In this case, the constituent elements designated "first" and "second" in the claims respectively represent the constituent elements designated "first" and "third" in this specification, or the constituent element designated "first" and the constituent element without a specific number. It should be noted that the application of this rule is not limited to constituent elements and can be reasonably and flexibly applied to other objects.

[0121] [Implementation Method]

[0122] <Composition of the light-emitting device in the embodiment>

[0123] See Figure 1 , Figure 2A , Figure 2B , Figures 3-5 , Figure 6A , Figure 6B , Figure 7 and Figure 8 The configuration of the light-emitting device in the embodiment will be described. Figure 1 This is a top view showing an example of the overall configuration of the light-emitting device 100 in the embodiment. Figure 2A It is along Figure 1 A cross-sectional view of the IIA-IIA line in the diagram. Figure 2B yes Figure 2A Enlarged view of region IIB in the image. Figure 3 This is a bottom view showing the first example of the light-transmitting component 1 in the embodiment. Figure 4 This is a cross-sectional view showing a second example of the substrate 11 in the light-transmitting component 1 of the embodiment. Figure 5 This is a cross-sectional view of the third example of the substrate 11 in the light-transmitting component 1 of the embodiment. Figure 6A This is a cross-sectional view showing an example of the first film 12-1 in the light-transmitting component 1 of the embodiment. Figure 6B This is a cross-sectional view showing an example of the second film 12-2 in the light-transmitting component 1 of the embodiment. Figure 7 This is a top view showing an example of the light source 2 included in the light-emitting device 100 of the embodiment. Figure 8 It is along Figure 7 A cross-sectional view of line VIII-VIII in the diagram.

[0124] (Composition of the light-emitting device)

[0125] like Figure 1 and Figure 2A As shown, the light-emitting device 100 includes a light-transmitting component 1 and a light source 2. The light-transmitting component 1 has a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a, and includes a light-transmitting substrate 11 containing a first region 121 and a second region 122 adjacent to the first region 121 within the first surface 11a, and a light-reflection-reducing film 12 of an inorganic material disposed on the first surface 11a side of the substrate 11 and having gaps. The light source 2 is disposed in the direction of the first surface 11a of the light-transmitting component 1 and has a light-emitting surface 21.

[0126] Figure 1 and Figure 2A In the example shown, the light-emitting device 100 includes a substrate 3 on which a light-transmitting component 1 and a light source 2 are disposed, and an adhesive component 4 for bonding the light-transmitting component 1 and the substrate 3. The substrate 11 of the light-transmitting component 1 includes a lens 111 and a support portion 112 for supporting the lens 111. The substrate 11 is disposed on the upper surface 3a of the substrate 3 via the adhesive component 4 such that the lower surface 112a of the support portion 112 faces the upper surface 3a of the substrate 3.

[0127] The light source 2 is disposed on the upper surface 3a of the substrate 3. Figure 1 , Figure 2A , Figure 2B and Figure 3 The light source 2 shown includes nine roughly rectangular luminous surfaces 21. The nine luminous surfaces 21 are arranged in a 3x3 matrix in a virtual plane (e.g., the XY plane). Figure 3 In the example shown, the light-emitting region 250 is configured to include nine light-emitting surfaces 21. Furthermore, the outer edge 250G of the light-emitting region is approximately rectangular in shape in the top view. The light source 2 emits light from the nine light-emitting surfaces 21 towards the lens 111 of the light-transmitting component 1. It should be noted that the number of light-emitting surfaces 21 included in the light source 2 is not limited to nine; at least one is sufficient. The light-emitting region 250 is configured to include at least one light-emitting surface 21.

[0128] Figure 1 In the example shown, the outer edge of the light-emitting device 100 in the top view is approximately circular. However, the outer edge of the light-emitting device 100 in the top view can also be approximately rectangular, elliptical, polygonal, etc.

[0129] Figure 3In the example shown, the shape of the light source 2 in the top view is approximately rectangular. The center of the light source 2 and the optical axis 111C of the lens 111 overlap in the top view. The outer edge 111G of the lens is the outer edge of the lens 111. The outer edge 250G of the light-emitting area is the outer edge of the light-emitting area 250 of the light source 2 that includes the entire light-emitting surface 21. In this embodiment, the outer edge 250G of the light-emitting area is the outer edge of the light-emitting area 250 that includes all nine light-emitting surfaces 21. The outer edge 121G of the first region is the outer edge of the first region 121 of the light reflection reduction film 12. The outer edge 122G of the second region is the outer edge of the second region 122 of the light reflection reduction film 12. It should be noted that... Figure 3 In order to show the positional relationship between the light-transmitting component 1, the light source 2 and the light reflection reduction film 12, the light source 2, indicated by a dashed line, is superimposed in the bottom view of the light-transmitting component 1.

[0130] The light source 2 can illuminate each of the nine light-emitting surfaces 21 individually or in groups. By illuminating the nine light-emitting surfaces 21 individually or in groups with the desired brightness, the light-emitting device 100 can improve the contrast of the light on the illuminated surface. Furthermore, by illuminating the nine light-emitting surfaces 21 individually or in groups, the light-emitting device 100 can also provide localized illumination of the illuminated surface. Here, localized illumination means that light is directed to a specific area of ​​the illuminated surface.

[0131] When the light-emitting device 100 is used as a flash source for shooting by a shooting device, the light-emitting device 100 can illuminate the light by switching between a wide-angle mode and a narrow-angle mode, for example. The wide-angle mode is the operating mode of the light-emitting device 100 in which all light-emitting surfaces 21 are illuminated. The narrow-angle mode is the operating mode of the light-emitting device 100 in which only the light-emitting surfaces 21 located near the center of the light-emitting area 250 are illuminated, and the light-emitting surfaces 21 located near the outer edge 250G of the light-emitting area are not illuminated. The light distribution angle of the narrow-angle mode is narrower than that of the wide-angle mode. The light-emitting device 100 can switch the illumination light corresponding to the wide-angle mode and the narrow-angle mode, allowing the shooting device to use the light illuminating from the light-emitting device 100, for example, to perform shooting in shooting modes based on close-ups, telephotos, etc.

[0132] The light-emitting device 100 is not limited to Figure 1 and Figure 2A The light-transmitting component 1 and the lens 111 shown may also include at least one of two or more light-transmitting components and two or more lenses arranged along the optical axis 111C.

[0133] In the light-transmitting component 1 of this embodiment, the light reflection reducing film 12 is a light-transmitting film of an inorganic material with pores. For example... Figure 6BAs shown, the light reflection reduction film 12 becomes a thin film with a refractive index less than the square root of the refractive index of the substrate 11 by containing air with a refractive index of 1.0 inside the light reflection reduction film 12.

[0134] The light reflection reduction film 12 has numerous pores and is an optical thin film with a silicon dioxide (SiO2) framework and a refractive index of 1.300 or less. In this embodiment, the light reflection reduction film 12, having a refractive index between the refractive index of the substrate 11 and the air, is disposed between the substrate 11 and the air. By reducing the refractive index between the substrate 11 and the air, the reflection of light from the light source 2 on the first surface 11a of the substrate 11 can be reduced. Therefore, the light extraction effect of the light-transmitting component 1 can be improved.

[0135] like Figure 2A and Figure 2B As shown, in the light-emitting device 100 of this embodiment, regarding the light-transmitting component 1, the thickness of the light reflection reduction film 12 in the second region 122 is less than the thickness of the light reflection reduction film 12 in the first region 121, and the light transmittance of the first region 121 is greater than the light transmittance of the second region 122. By making the thickness of the second region 122 less than the thickness of the first region 121, the light transmittance of the first region 121 can be made greater than the light transmittance of the second region 122. By making the light transmittance of the first region 121 greater than the light transmittance of the second region 122, the light extraction efficiency of the first region 121 can be higher than the light extraction efficiency of the second region 122. Accordingly, in this embodiment, a light-transmitting component 1 with good light extraction effect can be provided. It should be noted that... Figure 2B In order to make it easier to understand, the film thickness in the first region 121 and the film thickness in the second region 122 of the light reflection reduction film 12 are exaggerated.

[0136] like Figure 3As shown, in the light-emitting device 100, the first region 121 of the light-transmitting member 1 overlaps with the light-emitting surface 21 in a top view. In this embodiment, the first region 121 of the light-transmitting member 1 overlaps with the light-emitting surface 21 in a top view except for the corner 2C of the outer edge 250G of the generally rectangular light-emitting area. From another angle, the outer edge 121G of the first region intersects with the outer edge 250G of the light-emitting area at eight points. Accordingly, the amount of light emitted from the light source 2 and passing through the second region 122 of the light-transmitting member 1 is less than the amount of light passing through the first region 121. The position of the corner 2C of the outer edge 250G of the light-emitting area is farther from the optical axis 111C of the lens 111 than the position of the edge 2S of the outer edge 250G of the light-emitting area. In this embodiment, the corner 2C of the outer edge 250G of the light-emitting area overlaps with the support portion 112 in a top view. Therefore, in the light-emitting device 100, light emitted from near the corner 2C of the outer edge 250G of the light-emitting area that does not incident on the first surface 11a of the lens 111 but is directed toward the support 112 is prone to become stray light. By reducing the amount of light passing through the second region 122, when the light-transmitting member 1 is applied to the light-emitting device 100, the stray light generated in the second region 122 of the light-transmitting member 1 can be reduced.

[0137] Figure 3 In the light-emitting device 100 shown, the light source 2, which has a roughly rectangular shape in the top view, is configured such that the four corners 2C of the light source 2, which are prone to generating stray light, overlap with the second region 122, and the four sides 2S of the light source 2 overlap with the first region 121. The light transmittance of the light reflection reduction film 12 in the second region 122 is lower than that in the first region 121. Therefore, the light emitted from the four corners 2C and passing through the light reflection reduction film 12 in the second region 122 is less than the light emitted from the four sides 2S and passing through the light reflection reduction film 12 in the first region 121. Accordingly, by reducing stray light and allowing more light from the four sides 2S to pass through the first region 121, more light can be extracted.

[0138] Figure 3 The first region 121 shown in the top view is positioned at a location overlapping the optical axis 111C of the lens 111. Accordingly, for example, when the operating mode of the light-emitting device 100 is the narrow-angle mode, light emitted from the light source 2 can more easily pass through the first region 121 of the light-transmitting member 1. Therefore, by means of the light-emitting device 100, illumination light corresponding to shooting modes such as telephoto that require more light can be obtained.

[0139] The components of the light-emitting device 100 will be described in detail below.

[0140] (Light-transmitting component 1)

[0141] The light-transmitting component 1 is a component that allows light from the light source 2 to pass through (transmit), and it includes a substrate 11 and a light reflection reducing film 12. The light-transmitting component 1 is configured to cover the light source 2. Figure 1 In the example shown, the light-transmitting component 1 has a roughly circular shape in the top view. However, the shape of the light-transmitting component 1 in the top view can also be roughly elliptical, rectangular, polygonal, etc.

[0142] The substrate 11 in the light-transmitting component 1 is light-transmitting relative to light emitted from the light source 2, and is constructed in a manner that includes at least one of a resin material such as polycarbonate resin, acrylic resin, silicone resin, epoxy resin, and glass material. Figure 1 In the example shown, the shape of the substrate 11 is roughly circular in the top view.

[0143] Figure 2A In the example shown, the lens 111 in the substrate 11 is a biconvex lens. The lens 111 is a biconvex single lens formed by a first surface 11a and a second surface 11b, which are convex surfaces respectively. However, the lens 111 is not limited to a biconvex single lens, and may also be a plano-convex single lens, a biconcave single lens, a plano-concave single lens, a Fresnel lens, an array lens, a meniscus single lens, an aspherical lens, a cylindrical lens, or other forms.

[0144] For example, Figure 4 In the second example of the substrate 11 shown, the lens 111 has a first surface 11a on the -Z side where the light source 2 is located, and is a plano-convex lens in which the first surface 11a is convex. Figure 5 In the third example of the substrate 11 shown, the lens 111 has a first surface 11a on the -Z side where the light source 2 is located, and is a Fresnel lens in which the first surface 11a includes a plurality of concentric circular convex portions. It should be noted that... Figure 4 and Figure 5 A cross-section of the optical axis 111C of the lens 111 in the substrate 11 is shown.

[0145] Figure 1 In the example shown, the shape of lens 111 in the top view is approximately circular. However, the shape of lens 111 in the top view can also be approximately rectangular, elliptical, polygonal, etc. Furthermore, the shape of lens 111 in the top view can also be rotationally symmetric. Considering that the shooting range of a typical imaging device is approximately rectangular, the shape of lens 111 in the top view is preferably a four-fold rotationally symmetric shape or a two-fold rotationally symmetric shape. The size of the radii of curvature of the first surface 11a and the second surface 11b, the relationship between their respective radii of curvature, and the thickness of the lens can also be appropriately changed.

[0146] The support portion 112 of the substrate 11 supports the lens 111, so that the lens 111 is positioned above the light source 2. Figure 1 and Figure 2A In the example shown, lens 111 and support 112 are integral parts without adhesive. However, lens 111 and support 112 can also be separate parts joined by adhesive.

[0147] As described later, the light reflection reduction film 12 in the light-transmitting component 1 has voids formed by dissolving indium oxide (In2O) and indium (In) from a vapor-deposited film (first film 12-1) containing silicon dioxide (SiO2), indium oxide (In2O), and indium (In). It is an optical thin film with a silicon dioxide (SiO2) framework and a refractive index of 1.300 or less. The refractive index of the light reflection reduction film 12 is preferably 1.250 or less, more preferably 1.200 or less, and even more preferably 1.170 or less. In the light reflection reduction film 12, a large number of voids are formed by the dissolution of indium oxide (In2O) and indium (In) in the first film 12-1, while the undissolved and residual silicon dioxide (SiO2) forms the framework. In addition to silicon dioxide (SiO2) that forms the framework, the light reflection reduction film 12 also contains a very small amount of indium oxide (III) (In2O3), the amount of which is such that the refractive index of the second film 12-2 obtained by contacting the first film 12-1 after being treated with an acidic solution with a strongly acidic solution with a pH value of less than 2.0 is reduced by about 0.01.

[0148] The refractive index of the light reflection reduction film 12 is below 1.300, thus improving the reflection reduction effect across the entire visible range. The refractive index of the optical film can be calculated by measuring the reflection spectrum using a spectrophotometer, then measuring the minimum reflected light intensity when the incident light intensity is 100 and using this as the reflectance, and then calculating using Fresnel coefficients based on this measured minimum reflectance.

[0149] In this embodiment, the substrate 11 containing the lens 111 is used as the substrate for forming the light reflection reduction film 12, so the reflectivity R' obtained by measurement includes multiple repeated reflections, including back reflection. Since the measured reflectivity R' includes multiple repeated reflections, the reflectivity R of the film can be expressed by the following formula (1).

[0150] [Formula 1]

[0151]

[0152] In equation (1) above, Ro is the reflectivity of the substrate 11 (the material to be coated). The reflectivity R of the light reflection reduction film 12 can be calculated based on the measured reflectivity R' of the light reflection reduction film 12 and equation (1). The reflectivity R of the film is the reflectivity without considering back reflection. If Fresnel coefficients are used, the reflectivity R of the light reflection reduction film 12 can be obtained using the refractive index n of the substrate 11 (the material to be coated). m The refractive index n of film 12 is reduced by light reflection and is expressed based on the following equation (2).

[0153] [Equation 2]

[0154]

[0155] Here, if the refractive index of the atmosphere is approximately 1, and the refractive index n of the light reflection reduction film 12 is greater than the refractive index n of the substrate 11. m The square root of the refractive index n of the light reflection reduction film 12 can be expressed by the following formula (3).

[0156] [Formula 3]

[0157]

[0158] Furthermore, if the refractive index n of the light reflection reduction film 12 is less than the refractive index n of the substrate 11 m The square root of the refractive index n of the thin film can be expressed by the following formula (4).

[0159] [Formula 4]

[0160]

[0161] The light reflection reduction film 12 can be calculated according to the above formulas (1) to (4). It should be noted that the refractive index n of the light reflection reduction film 12 can be found in "Kishin Kohiyama, "Basic Theory of Optical Thin Films - Filter Coefficients and Characteristic Metrics -", ​​Optronics Co., Ltd., February 25, 2011, Revised and Supplemented 1st Edition".

[0162] The porosity of the light reflection reduction film 12 is in the range of 30% or more and 90% or less. If the porosity of the light reflection reduction film 12 is 30% or more, the refractive index of the light reflection reduction film 12 can be reduced. If it is 90% or less, it can maintain the strength of the light reflection reduction film 12 formed on the substrate 11 and reduce the refractive index of the light reflection reduction film 12. The porosity of the light reflection reduction film 12 is preferably in the range of 40% or more and 90% or less, more preferably in the range of 50% or more and 90% or less, and most preferably in the range of 60% or more and 85% or less. The porosity (total porosity Vp) of the optical film can be calculated using the Lorentz-Lorenz formula shown in Equation (5). In Equation (5), n f The observed refractive index of film 12 is reduced by light reflection, n b This refers to the refractive index of the framework of the light reflection reduction film 12. The refractive index n of the light reflection reduction film 12... f The refractive index of the light reflection reduction film 12 with gaps is calculated based on equations (1) to (4) above. The refractive index n of the framework of the light reflection reduction film 12... b Since the framework is mainly composed of silicon dioxide (SiO2), the refractive index of silicon dioxide (SiO2) (1.460) can be used for determination.

[0163] [Formula 5]

[0164]

[0165] A light reflection reduction film 12 is disposed in a first region 121 and a second region 122 adjacent to the first region 121 in the first surface 11a of the substrate 11. The thickness of the light reflection reduction film 12 in the first region 121 is... The above and Below. The thickness of the light reflection reduction film 12 in region 2 122 is greater than... and less than In this embodiment, "the thickness of the light reflection reduction film 12 in the second region 122 is less than the thickness of the light reflection reduction film 12 in the first region 121" means that the maximum thickness of the light reflection reduction film 12 in the second region 122 is less than the maximum thickness of the light reflection reduction film 12 in the first region 121. In this embodiment, the first region 121 is located at the center of the lens 111 in the top view (overlapping with the optical axis 111C), and is the region where the difference between the thickness of the light reflection reduction film 12 and the maximum thickness of the light reflection reduction film 12 is less than 10%. The second region 122 is, for example, the region located outside the first region 121 when the optical axis 111C is inward. Regarding the boundary between the first region 121 and the second region 122, it can be a position where the difference between the thickness of the light reflection reduction film 12 and the maximum thickness of the light reflection reduction film 12 in the second region 122 is 10% on the side closest to the first region 121. It should be noted that as long as the above-mentioned boundary exists between the first region 121 and the second region 122, even if the light reflection reduction film 12 in the second region 122 has a portion that is locally close to the maximum film thickness of the first region 121, if that portion is smaller than the maximum film thickness of the first region 121, that portion is also considered to be included in the second region 122.

[0166] (Light source 2)

[0167] like Figure 7 As shown, the light source 2 has nine light-emitting parts 20, each including a light-emitting surface 21. The nine light-emitting parts 20 emit light from their light-emitting surfaces 21 toward the lens 111 of the light-transmitting component 1 located above the light source 2. The light-emitting surface 21 is the main light-extracting surface of the light-emitting parts 20.

[0168] The nine light-emitting parts 20 include light-emitting parts 20-1, 20-2, 20-3, 20-4, 20-5, 20-6, 20-7, 20-8, and 20-9. In the top view, the nine light-emitting parts 20 are arranged longitudinally, laterally, or in a matrix configuration. From another angle, the nine light-emitting parts 20 are arranged along the X-direction, or along the X-direction and a Y-direction orthogonal to the X-direction. Alternatively, the nine light-emitting parts 20 are arranged along both the X and Y directions.

[0169] Light-emitting part 20-1 includes light-emitting surface 21-1, light-emitting part 20-2 includes light-emitting surface 21-2, light-emitting part 20-3 includes light-emitting surface 21-3, light-emitting part 20-4 includes light-emitting surface 21-4, and light-emitting part 20-5 includes light-emitting surface 21-5. Furthermore, light-emitting part 20-6 includes light-emitting surface 21-6, light-emitting part 20-7 includes light-emitting surface 21-7, light-emitting part 20-8 includes light-emitting surface 21-8, and light-emitting part 20-9 includes light-emitting surface 21-9. Preferably, more than 80% of the nine light-emitting surfaces 21 are arranged inside the lens 111 (inside the outer shape of the lens 111) in the top view. Accordingly, light emitted from the light-emitting surfaces 21 can be efficiently incident on the lens 111, and good optical characteristics can be obtained. It should be noted that the light-emitting parts 20 and the light-emitting surfaces 21 overlap in the top view; therefore, Figure 7 In the example shown, the symbols for the light-emitting part 20 (i.e., reference numerals) and the light-emitting surface 21 are both shown. In the following text, when two or more constituent elements are substantially identical or overlap, their symbols will also be shown simultaneously. The nine light-emitting surfaces 21 in the top view are generally rectangular in shape. However, the nine light-emitting surfaces 21 in the top view may also be generally circular or elliptical, or may be generally polygonal such as triangles or hexagons.

[0170] The light-emitting part 20 has a light-emitting element 22, a wavelength conversion member 24 disposed on the light-emitting element 22, and a covering member 25 covering the side of the light-emitting element 22 and the side of the wavelength conversion member 24 respectively.

[0171] The light-emitting unit 20, by having a light-emitting element 22 and a wavelength conversion component 24, can emit light of a mixed color, in which the colors of the light emitted from the light-emitting element 22 and the light emitted from the wavelength conversion component 24 are mixed. In the light-emitting unit 20, the combination of the light-emitting element 22 and the wavelength conversion component 24 can increase the degree of freedom in the color of the light emitted from the light-emitting unit 20.

[0172] In addition, the light source 2 has multiple light-emitting parts 20, and the cover part 25 holds multiple light-emitting elements 22 and multiple wavelength conversion parts 24 together. Figure 7 In the example shown, the covering member 25, by being disposed between adjacent light-emitting elements 22 and adjacent wavelength conversion members 24, can hold the nine light-emitting elements 22 and the nine wavelength conversion members 24 of the nine light-emitting units 20 together as a single unit. By providing the covering member 25 to the light source 2, leakage light from the sides of the light-emitting units 20 and the sides of the wavelength conversion members 24 can be reduced, thereby improving the light extraction efficiency of the light-emitting units 20.

[0173] The light source 2 can increase the amount of light emitted from it by having multiple light-emitting parts 20. In addition, by using the cover member 25 to hold multiple light-emitting elements 22 and multiple wavelength conversion members 24 together, the implementation of the light source 2 can be easily carried out.

[0174] Here, light source 2 is described in more detail. Figure 8 In the example shown, the light-emitting part 20-1 is arranged on the +Z side surface of the substrate 3 with its upper surface as the light-emitting surface 21-1 and the surface opposite to the light-emitting surface 21-1 as the mounting surface. A wavelength conversion member 24 is disposed on the +Z side surface of the light-emitting element 22. A covering member 25 covers the side surfaces of the light-emitting element 22 and the wavelength conversion member 24, but does not cover the upper surface of the wavelength conversion member 24. The light-emitting surfaces 21 of adjacent light-emitting parts 20 among the nine light-emitting parts 20 of the light source 2 are isolated by the covering member 25. Adjacent light-emitting surfaces 21 can also be continuous. For example, one wavelength conversion member 24 can cover all the upper surfaces of multiple light-emitting elements 22.

[0175] The light-emitting element 22 has at least one pair of positive and negative electrodes 23 on the surface (i.e., the lower surface) opposite to the light-emitting surface 21-1.

[0176] The light-emitting element 22 can be made of a variety of semiconductors, such as III-V compound semiconductors and II-VI compound semiconductors. Indium is preferably used as the semiconductor. X Al Y Ga 1-X-Y Nitride semiconductors such as N (0≤X, 0≤Y, X+Y≤1) can also be used, such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc. The light-emitting element 22 is, for example, an LED (Light Emitting Diode) or an LD (Laser Diode). In terms of the peak emission wavelength of the light-emitting element 22, from the perspective of luminous efficiency and excitation of the wavelength conversion material included in the wavelength conversion component 24, it is preferably 400nm or more and 530nm or less, more preferably 420nm or more and 490nm or less, and even more preferably 450nm or more and 475nm or less.

[0177] The wavelength conversion component 24 is, for example, a generally rectangular component in a top view. The wavelength conversion component 24 is configured to cover the upper surface of the light-emitting element 22. The wavelength conversion component 24 contains a wavelength conversion material that converts the wavelength of at least a portion of the light from the light-emitting element 22. The wavelength conversion component 24 can be constructed from inorganic materials such as transparent resins, ceramics, or glass. As the resin material, thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, epoxy-modified resins, and phenolic resins can be used. Silicone resins or modified resins thereof, which have excellent light resistance and heat resistance, are particularly preferred. It should be noted that light transmittance here refers to the property of transmitting at least 60% of the light from the light-emitting element 22. Furthermore, the wavelength conversion component 24 can be made from thermoplastic resins such as polycarbonate resins, acrylic resins, methylpentene resins, and polynorbornene resins. Additionally, the wavelength conversion component 24 may also contain a light-diffusing material. For example, the wavelength conversion component 24 may be a component containing a wavelength conversion substance in a resin material, ceramic, glass, etc., or a sintered body containing a wavelength conversion substance. Furthermore, the wavelength conversion component 24 may also be a multilayer component in which a resin layer is disposed on the ±Z side surface of a molded body of resin, ceramic, glass, etc.

[0178] As the wavelength conversion material included in the wavelength conversion component 24, yttrium aluminum garnet phosphor (e.g., (Y,Gd)3(Al,Ga)5O) can be used, for example. 12 Ce), lutetium aluminum garnet phosphor (e.g., Lu3(Al,Ga)5O 12 Ce), terbium aluminum garnet phosphor (e.g., Tb3(Al,Ga)5O 12 Ce), CCA phosphor (e.g., Ca) 10 (PO4)6C l2 Eu), SAE phosphors (e.g., Sr4Al) 14 O 25 Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O) 16 Cl2:Eu), silicate phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-silicon phosphors (e.g., (Si,Al)3(O,N)4:Eu), or α-silicon phosphors (e.g., Ca(Si,Al)). 12 (O, N) 16 Nitrogen oxide phosphors such as Eu) and LSN phosphors (e.g., (La,Y)3Si6N) 11Nitride phosphors such as Ce), BSESN phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA phosphors (e.g., SrLiAl3N4:Eu), CASN phosphors (e.g., CaAlSiN3:Eu), or SCASN phosphors (e.g., (Sr,Ca)AlSiN3:Eu), KSF phosphors (e.g., K2SiF6:Mn), and KSAF phosphors (e.g., K2(Si)AlSiN3:Eu) are used in the production of phosphors. 1-x Al x )F 6-x The wavelength conversion materials are: Mn, where x satisfies 0 < x < 1; fluoride phosphors such as MGF phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn); quantum dots with perovskite structures (e.g., (Cs, FA, MA)(Pb, Sn)(F, Cl, Br, I)3, where FA and MA represent formamidinium and methylammonium, respectively); group II-VI quantum dots (e.g., CdSe); group III-V quantum dots (e.g., InP); and quantum dots with chalcopyrite structures (e.g., (Ag, Cu)(In, Ga)(S, Se)2). The wavelength conversion materials described above are particulates. Furthermore, one of these wavelength conversion materials can be used alone, or two or more can be used in combination.

[0179] In this embodiment, the light source 2 uses a blue LED as the light-emitting element 22, and the wavelength conversion component 24 contains a wavelength conversion material that converts the light emitted from the light-emitting element 22 into yellow light, thereby emitting white light. The wavelength or chromaticity of the light emitted from the light source 2 can be appropriately selected according to the intended use of the light-emitting device 100. The wavelength conversion component 24 contains a light-diffusing material. Examples of light-diffusing materials include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.

[0180] The covering member 25 is a member that covers the sides of the light-emitting element 22 and the wavelength conversion member 24. The covering member 25 directly or indirectly covers the sides of the light-emitting element 22 and the wavelength conversion member 24. The upper surface of the wavelength conversion member 24 is exposed from the covering member 25 and serves as the light-emitting surface 21-1 of the light-emitting part 20-1. The covering member 25 can isolate adjacent light-emitting parts among the nine light-emitting parts 20. To improve light extraction efficiency, the covering member 25 is preferably made of a component with high light reflectivity. For example, the covering member 25 can be made of an organic material such as a resin containing a light-reflecting substance such as white pigment. Alternatively, the covering member 25 can also be a light-reflective component made of an inorganic material containing boron nitride, alkali metal silicates, etc. In this case, titanium oxide or zirconium oxide may also be included.

[0181] Examples of light-reflecting materials include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, and silicon oxide. It is preferable to use one of these materials alone or in combination of two or more. Furthermore, as a resin material, it is preferable to use a resin material as the base material, with thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, and phenolic resin as the main component. It should be noted that, depending on the need, the covering component 25 may also be composed of components that are translucent or absorptive relative to visible light. Absorbent components include, for example, carbon black.

[0182] The light-emitting part 20 is electrically connected to the wiring 32 provided on the substrate 3. The substrate 3 preferably has the wiring 32 disposed on its surface. The substrate 3 may also have the wiring 32 internally. Regarding the light-emitting part 20 and the substrate 3, they are electrically connected via conductive members 33 to at least one pair of positive and negative electrodes 23 of the light-emitting element 22 through the wiring 32 of the substrate 3. It should be noted that the size (dimensions) of the wiring 32 on the substrate 3 is configured and set according to the structure and dimensions of the electrodes 23 of the light-emitting element 22.

[0183] The wiring 32 may be made of at least one of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys of these metals. In addition, from the perspective of wettability, light reflectivity, etc. of the conductive component 33, a layer of silver, platinum, aluminum, rhodium, gold, or alloys of these metals may be provided on the surface of the wiring 32.

[0184] (Substrate 3)

[0185] The substrate 3 is a plate-shaped component that is roughly circular in the top view. The substrate 3 has wiring for mounting various electronic components such as the light source 2. It should be noted that the shape of the substrate 3 in the top view can also be roughly rectangular, elliptical, polygonal, etc.

[0186] The substrate 3 preferably uses an insulating material as the base material, and more preferably uses a material that makes it difficult for light emitted from the light-emitting surface 21 or external light to be transmitted. Furthermore, the substrate 3 preferably uses a material with a predetermined strength. Specifically, the substrate 3 can be constructed using a ceramic material such as alumina, aluminum nitride, mullite, or silicon nitride, or a resin such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide, or polyester resin as the base material.

[0187] (Light reflection reduction film 12 thickness)

[0188] Next, see Figure 9A , Figure 9B and Figure 9CThe thickness of the light reflection reduction film 12 of the light-transmitting component 1 in the embodiment will be described. Figure 9A This is a diagram showing an example of the first region 121 and the second region 122 in the light reflection reduction film 12 of the light-transmitting component 1 of the embodiment. Figure 9B This is a diagram showing a first example of the thickness of the first region 121 and the second region 122 in the light reflection reduction film 12 of the light-transmitting component 1 in the embodiment. Figure 9C This is a second example diagram showing the thickness of the first region 121 and the second region 122 in the light reflection reduction film 12 of the light-transmitting component 1 according to the embodiment. It should be noted that... Figure 9B and Figure 9C The "position in the X direction" of the horizontal axis in the figure Figure 9A The positions in the X direction correspond to each other. In this embodiment, the thickness of the light reflection reduction film 12 is t. It should be noted that, for ease of description, the thickness of the light reflection reduction film 12 in the first region 121 is sometimes referred to as t1, and the thickness of the light reflection reduction film 12 in the second region 122 is referred to as t2.

[0189] Figure 9A A cross-section of the optical axis 111C including the lens 111 (substrate 11) is shown. Figure 9A In the example shown, the second region 122 is arranged adjacent to the first region 121 along the X direction. Figure 9B In the first example shown, the thickness t2 of the light reflection reduction film 12 in the second region 122 continuously decreases along the direction from the first region 121 toward the second region. On the other hand, Figure 9C In the second example shown, the thickness t2 of the light reflection reduction film 12 in the second region 122 decreases in a stepwise manner along the direction from the first region 121 toward the second region.

[0190] Within the second region 122, the thickness t of the light reflection reduction film 12 decreases continuously or in a stepwise manner. Accordingly, the light reflection reduction effect of the light reflection reduction film 12 decreases correspondingly with the film thickness t. Therefore, the light transmittance within the second region 122 decreases correspondingly with the film thickness t. In other words, in the light-transmitting component 1, the light transmittance decreases continuously or in a stepwise manner along the direction from the first region 121 towards the second region. By making the light transmittance of the first region 121 greater than that of the second region 122, a good light extraction effect can be obtained. Furthermore, by making the light transmittance decrease continuously or in a stepwise manner along the direction from the first region 121 towards the second region, stray light, which is more likely to occur from the first region 121 towards the second region, can be reduced.

[0191] Figure 9AIn the example shown, the thickness difference between the film thickness t1 of the light reflection reduction film 12 in the first region 121 and the film thickness t2 of the light reflection reduction film 12 in the second region 122 is 5% or more of the film thickness t1 of the light reflection reduction film 12 in the first region 121. Accordingly, the amount of light emitted from the light source 2 and passing through the light-transmitting member 1 in the second region 122 can be 5% or more less than the amount of light passing through the first region 121, thereby reducing stray light occurring in the second region 122. It should be noted that, from the perspective of reducing stray light, the aforementioned thickness difference is preferably 20% or more of the film thickness t of the light reflection reduction film 12 in the first region 121.

[0192] Figure 9A In the example shown, the maximum thickness of the light reflection reduction film 12 in region 121 is The above and Therefore, the amount of light emitted from the light source 2 and passing through the first region 121 of the light-transmitting component 1 can be increased, thereby improving the light extraction effect of the light extracted from the light-transmitting component 1.

[0193] In the light-transmitting component 1 of this embodiment, a light-transmitting base film is disposed between the substrate 11 and the light reflection reduction film 12. This light-transmitting base film has a refractive index lower than that of the substrate 11 and higher than that of the light reflection reduction film 12. By forming a base film with a refractive index lower than that of the substrate 11 and higher than that of the light reflection reduction film 12, the light reflection reduction effect can be improved. The base film can be a high-refractive-index film such as silicon oxide, magnesium fluoride (MgF2), aluminum oxide (Al2O3), tantalum oxide (Ta2O5), or niobium oxide (Nb2O5). The base film can also be a laminate containing two or more of the above-mentioned high-refractive-index films. Furthermore, by setting a base film between the substrate 11 and the light reflection reduction film 12 in such a way that the coefficient of thermal expansion (CTE) decreases from the substrate 11 toward the light reflection reduction film 12, the adhesion of the first film 12-1 to the substrate 11 can be improved, thereby making it difficult for the light reflection reduction film 12 formed by the first film 12-1 to peel off from the substrate 11.

[0194] In this embodiment, the light reflection reduction film 12 is disposed only on the light incident surface (also called the light incident surface), i.e., the first surface 11a side of the substrate 11. However, it is not limited to this, and the light reflection reduction film 12 may also be disposed on the light emitting surface (also called the light emitting surface), i.e., the second surface 11b side of the substrate 11. For example, the light-transmitting member 1 has a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. The second surface includes a light-transmitting substrate 11 containing a first region and a second region adjacent to the first region, and a light reflection reduction film 12 with gaps disposed on the second surface 11b side of the substrate 11. The film thickness of the light reflection reduction film 12 in the second region is less than the film thickness of the light reflection reduction film 12 in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region. By also disposing of the light reflection reduction film 12 on the second surface 11b side, the light reflection of the second surface 11b can be reduced, and the light extraction efficiency of the light from the light-emitting device 100 can be further improved. It should be noted that the light-emitting surface of the substrate 11 can also be the first surface, and the light reflection reduction film 12 can be disposed only on the first surface side of the light-emitting surface. Alternatively, the light reflection reduction film 12 can also be disposed on the light-incident surface of the substrate 11, i.e., the second surface side. In this case, the light extraction efficiency of the light from the light-emitting device can also be improved.

[0195] <Manufacturing Method of Light-Transmitting Component 1>

[0196] The manufacturing method of the light-transmitting component 1 according to the embodiment will be described below.

[0197] (Overall process of manufacturing method)

[0198] first, Figure 10 This is a flowchart illustrating an example of the overall flow of a method for manufacturing a light-transmitting component 1 according to an embodiment. The method for manufacturing the light-transmitting component 1 includes a step (S11) of preparing a light-transmitting substrate 11, the substrate 11 having a first surface 11a and a second surface 11b located opposite to the first surface 11a, and a first film 12-1 containing a substance removable by an acidic substance disposed on the first surface 11a side. Furthermore, the method for manufacturing the light-transmitting component 1 also includes a step (S12) of contacting the first film 12-1 with an acidic substance to obtain a second film 12-2 with voids and light transmittance. In the method for manufacturing the light-transmitting component 1 according to the embodiment, the first surface 11a of the substrate 11 includes a first region 121 and a second region 122 adjacent to the first region 121.

[0199] (Details of step (S11) for preparing substrate 11)

[0200] Figure 11 It is shown in detail Figure 10A flowchart illustrating an example of step (S11) of preparing substrate 11 is provided. Step (S11) of preparing substrate 11 includes preparing a support clamp 200 having a first opening 240 in the top view (S111) and positioning the first surface 11a of substrate 11 facing the first opening 240 so that the support clamp 200 supports substrate 11 (S112). Furthermore, step (S11) of preparing substrate 11 also includes supplying material, which will become the first film 12-1, onto the first surface 11a of substrate 11 via the first opening 240 of the support clamp 200, thereby positioning the first film 12-1 within a first region 121 overlapping the first opening 240 and a second region 122 adjacent to the first region 121 in the top view (S113).

[0201] The following reference Figure 12 , Figure 13 , Figure 14A , Figure 14B , Figure 15A and Figure 15B The steps included in the preparation of substrate 11 (S11) will be described in detail. Figure 12 This is a cross-sectional view showing the first example of the support fixture 200. Figure 12 A cross-section of the support clamp 200, including the central axis 200C of the support clamp 200, is shown. The central axis 200C of the support clamp 200 is an axis that passes through the center 240C of the first opening 240 of the support clamp 200 and extends in the normal direction of the first opening 240. Figure 13 This is an oblique view obtained from observing the first example of the support clamp 200 from below. Figure 12 and Figure 13 The support clamp 200 is shown in its state of supporting the light-transmitting component 1. It should be noted that... Figure 13 In the light-transmitting component 1, the light reflection reduction film 12 is omitted. Figure 14A This diagram illustrates the behavior of vapor-deposited particles P1 in the vapor deposition process. Figure 14B This is a diagram showing an example of a film formed by vapor deposition. Figure 15A This is a diagram illustrating an example of the behavior of sputtered particles P2 in a sputtering process. Figure 15B This is a diagram showing an example of a film formed by sputtering.

[0202] (S111: Steps for preparing support fixture 200)

[0203] In S111, a support clamp 200 with a first opening 240 is prepared in the top view. Figure 12 and Figure 13In this configuration, the support clamp 200 includes an upper clamp 210 and a lower clamp 220. The upper clamp 210 can be attached to and detached (i.e., installed / removed) relative to the lower clamp 220. In step S111, the support clamp 200 is prepared in the state before the upper clamp 210 is installed to the lower clamp 220, i.e., before supporting the substrate 11. It should be noted that... Figure 12 and Figure 13 In the example shown, in order to support the substrate 11, the support clamp 200 is shown with the upper clamp 210 mounted on the lower clamp 220.

[0204] Figure 12 and Figure 13 The image shows a support clamp 200 having a first opening 240 and supporting a substrate 11. (See image for details.) Figure 13 As shown, the support clamp 200 in the top view is approximately circular in shape. The upper clamp 210 and lower clamp 220 in the top view are also approximately circular in shape. In the top view, an opening penetrating the support clamp 200 is provided at its center. The lower clamp 220 includes four protrusions 222 on its lower surface 221 side that protrude towards the inside of the first opening 240. Figure 13 The protrusion length L of each of the four protrusions 222 shown protruding inward can be appropriately adjusted according to the thickness of the light reflection reduction film 12 disposed on the substrate 11. It should be noted that the shape of the first opening 240 in the top view is not limited to the shape including the protrusions 222, and can be appropriately changed according to the thickness of the light reflection reduction film 12 disposed on the substrate 11. It should also be noted that the support clamp 200 can support multiple substrates 11. For example, when the support clamp 200 has multiple first openings 240, multiple substrates 11 can be supported by the upper clamp 210 and the lower clamp 220 in a manner corresponding to the first openings 240 respectively.

[0205] (S112: Step of supporting the substrate 11 by the support clamp 200)

[0206] In step S112, the first surface 11a of the substrate 11 is positioned facing the first opening 240 so that the substrate 11 is supported by the support clamp 200. Specifically, firstly, the substrate 11 is placed on the surface of the protrusion 222 on the +Z side of the lower clamp 220 before the upper clamp 210 is installed, and the first surface 11a of the substrate 11 before the light reflection reducing film 12 is disposed, with the two surfaces facing each other. Next, the upper clamp 210 is disposed on the upper surface 223 of the lower clamp 220, with the upper surface 223 of the lower clamp 220 facing the lower surface 211 of the upper clamp 210, and a portion of the lower clamp 220 and a portion of the upper clamp 210 clamp the substrate 11 from above and below. Then, the upper clamp 210 is fixed to the lower clamp 220. Accordingly, the support clamp 200 can support the substrate 11 by clamping the substrate 11 from above and below by a portion of the lower clamp 220 and a portion of the upper clamp 210.

[0207] (S113: Step of arranging the first membrane 12-1 in the first region 121 and the second region 122)

[0208] In step S113, the material to be the first film 12-1 is supplied to the first surface 11a side of the substrate 11 via the first opening 240 of the support fixture 200, and the first film 12-1 is positioned in the first region 121 overlapping the first opening 240 and the second region 122 adjacent to the first region 121 in the plan view. The method for attaching the material to be the first film 12-1 to the first surface 11a side of the substrate 11 can be physical vapor deposition. Examples of physical vapor deposition methods include electron beam vapor deposition, resistance heating vapor deposition, ion plating, and sputtering. Electron beam vapor deposition or resistance heating vapor deposition is preferred, with electron beam vapor deposition being more preferable. In the plan view, the shape of the first opening 240 does not necessarily need to be similar to the shapes of the first region 121 and the second region 122.

[0209] Physical vapor deposition methods are all methods of forming films of inorganic materials onto an object in a vacuum environment. In this embodiment, a first film 12-1 is formed on the first surface 11a side of the substrate 11 using electron beam vapor deposition (sometimes referred to as vapor deposition) with ion-assisted vapor deposition. During the formation of the first film 12-1, the substrate 11, supported by a support fixture 200, is positioned inside the vacuum chamber with the first surface 11a facing the vapor deposition material. In this embodiment, the vapor deposition material comprises indium oxide and silicon oxide. The vapor deposition material uses a mixture comprising indium oxide and silicon oxide, wherein the content of indium oxide relative to 1 mole (mol) of silicon oxide is in the range of 0.230 mol or more and 0.270 mol or less.

[0210] The indium oxide used in the raw materials for vapor deposition is preferably indium(III)(In2O3). Indium(III)(In2O3) may contain unavoidable impurities (i.e., impurities). In the indium(III)(In2O3) used as a raw material, the content of indium(III)(In2O3) is preferably 90% by mass or more, more preferably 95% by mass or more, and even more preferably 99% by mass or more.

[0211] The silicon dioxide used in the raw materials for vapor deposition is preferably composed mainly of silicon monoxide (SiO). In this specification, "composed mainly of silicon monoxide (SiO)" means that the silicon dioxide content in the raw material is 50% by mass or more. More preferably, 90% by mass, and most preferably 99% by mass or more, the silicon dioxide content in the raw material is 80% by mass, more preferably 90% by mass, and most preferably 99% by mass or more.

[0212] First, the method for forming the first mixed layer 12b1 contained in the first film 12-1 will be described. The first mixed layer 12b1, comprising silicon dioxide (SiO2) and indium oxide (I) (In2O), can be formed on the substrate 11 by vapor deposition in a non-oxidizing atmosphere using the aforementioned vapor deposition material. The non-oxidizing atmosphere includes an inert atmosphere, a reducing atmosphere, and a vacuum; any one or more of these atmospheres are acceptable. The indium oxide (III) (In2O3) contained in the vapor deposition material is dissociated by heating into indium oxide (I) (In2O), indium (In), and oxygen (O). Regarding silicon monoxide (SiO) contained in the vapor deposition material, the standard free energy of formation for the oxidation of silicon monoxide (SiO) is lower than that for the oxidation of indium oxide (I) (In2O), therefore it preferentially reacts with oxygen (O) to form silicon dioxide (SiO2). Even when the first film 12-1 is formed using a vapor deposition material in a non-oxidizing atmosphere, the oxygen (O) dissociated from indium(III)(In2O3) is preferentially absorbed by silicon monoxide (SiO) and generates silicon dioxide (SiO2). Therefore, there is almost no silicon monoxide (SiO) residue in the first film 12-1.

[0213] When indium (In) is present in the vapor dissociated from indium(III)(In2O3), the standard free energy of formation of indium (In) to indium(III)(In2O3) is lower than the standard free energy of formation of silicon monoxide (SiO) to silicon dioxide (SiO2). Therefore, there is a possibility that indium(III)(In2O3) regenerated by the reaction of indium (In) with oxygen may be contained in the first membrane 12-1.

[0214] It should be noted that the mixture of vapor deposition materials is preferably a sintered mixture (sintered body). By means of vapor deposition, the vapor deposition material can be vaporized in a substantially uniform manner, thereby depositing a first mixed layer 12b1 on the substrate 11. The first mixed layer 12b1 is a mixture of indium oxide (I) (In2O) generated by the thermal decomposition of indium oxide (III) (In2O3) and silicon dioxide (SiO2) in a substantially uniform manner.

[0215] The pressure of the atmosphere during the formation of the first mixed layer 12b1 varies depending on the type of physical vapor deposition method used. If electron beam vapor deposition is used, the preferred pressure of the atmosphere during the formation of the first mixed layer 12b1 on the substrate 11 is 1.0 × 10⁻⁶. -4 Pa or higher and 5.0 × 10 -2 The pressure of the atmosphere during the formation of the first film 12-1 on the substrate 11 can be controlled, for example, by introducing oxygen into the vapor deposition apparatus.

[0216] Furthermore, the temperature of the substrate 11 during the formation of the first hybrid layer 12b1 is preferably 50°C or higher and 150°C or lower, more preferably 80°C or higher and 120°C or lower. If the temperature of the substrate 11 during the formation of the first hybrid layer 12b1 is within the above range, it is unlikely to have an adverse effect on the substrate 11 formed of a material such as a plastic with low heat resistance.

[0217] As described above, the substrate 11 is placed inside the vacuum chamber, allowing gaseous vaporized particles (in this embodiment, silicon oxide and indium oxide particles) that have vaporized from the vaporized material to pass through the inside of the first opening 240 of the support fixture 200 that supports the substrate 11. After the substrate 11 is placed inside the vacuum chamber, it collides with the gaseous vaporized particles. Upon reaching the substrate 11, the gaseous vaporized particles adhere to and deposit on the first surface 11a of the substrate 11. Through the deposition of vaporized particles on the first surface 11a of the substrate 11, a vapor-deposited film comprising indium oxide (I) (In₂O) and silicon dioxide (IV) (SiO₂) can be formed on the first surface 11a of the substrate 11, namely the first mixed layer 12b1.

[0218] The first film 12-1 may be formed solely by the first mixed layer 12b1, but it may also be a film formed by mixing the first mixed layer 12b1 and the silicon dioxide layer 12a. Figure 6AIn the example shown, a first film 12-1 is formed on the first surface 11a side of the substrate 11. The first film 12-1 is formed by mixing and stacking a first mixed layer 12b1 and a silicon dioxide layer 12a on the first surface 11a of the substrate 11. In this embodiment, a sintered body of silicon monoxide (SiO) is used as the vapor deposition material in addition to a sintered body of a mixture of silicon oxide and indium oxide. First, the first mixed layer 12b1 is formed on the first surface 11a side of the substrate 11 using electron beam evaporation as the vapor deposition material. Since silicon oxide and indium oxide do not chemically react on the substrate 11, and are only formed as a mixture, a film can be formed as shown. Figure 6A The first mixed layer 12b1 shown contains silicon oxide and indium oxide. Next, a silicon dioxide layer 12a is formed on the first mixed layer 12b1 formed on the first surface 11a side of the substrate 11 using a sintered silicon oxide as the vapor deposition material. It should be noted that the pressure, temperature, and other conditions during the formation of the silicon dioxide layer 12a are the same as those during the formation of the first mixed layer 12b1. In this way, film formation is performed by alternately stacking vapor deposition materials, such as... Figure 6A As shown, a first film 12-1 can be formed by alternating layers of a first mixed layer 12b1 and a silicon dioxide layer 12a. By alternating layers of the first mixed layer 12b1 and the silicon dioxide layer 12a, gaps and depressions generated during the formation of the first mixed layer 12b1 can be filled by the silicon dioxide layer 12a. Therefore, the surface unevenness of the first film 12-1 can be reduced, thereby improving the strength of the first film 12-1.

[0219] In electron beam evaporation methods that do not use treatment gases such as Ar gas, such as Figure 14A As shown, the vaporized particles P1, formed from the vaporized material, do not collide with the particles of the process gas but directly reach the surface of the substrate 11. Thus, because the vaporized particles P1 do not collide with the particles of the process gas, their direction of travel is restricted compared to sputtering. From another perspective, the directionality of the vaporized particles P1 is higher in the vapor deposition method than in the sputtering method. Therefore, as... Figure 14B As shown, it is difficult for the vapor-deposited particles P1 to reach the portion of the substrate 11 hidden by the protrusion 222 of the supported fixture 200. Therefore, it is difficult to form the first film 12-1 on the portion of the substrate 11 that the vapor-deposited particles P1 cannot reach.

[0220] In electron beam evaporation using ion-assisted deposition, ionized Ar particles collide with the deposited particles. The pressure during film formation using ion-assisted deposition is 10... -4 Pa or higher and 10 -2In the lower range below Pa, the flow rate of the ionized particles is less than 1 / 10 of the flow rate of the process gas in the sputtering method. Therefore, the effect caused by the collision between the vapor-deposited particles P1 and the ionized particles is negligible.

[0221] It should be noted that sputtering can be used as a method to attach the material that will become the first film 12-1 to the first surface 11a side of the substrate 11. Figure 15A In the sputtering method shown, film formation is performed while a processing gas, primarily composed of Ar gas, is filled into the vacuum chamber. Sputtered particles P2 ejected from the target material collide with Ar atoms, and a portion of them reach the substrate 11. Through collisions with Ar atoms, sputtered particles P2 can travel in various directions. Therefore, as... Figure 15B As shown, even in the portion of the substrate 11 that is hidden by the protrusion 222 of the support fixture 200, sputtered particles P2 can reach that portion, thereby enabling the formation of the first film 12-1.

[0222] By performing steps S111 to S113, a light-transmitting substrate 11 with a first film 12-1 can be prepared in step (S11) of preparing substrate 11.

[0223] (Details of step (S12) for obtaining the second membrane 12-2)

[0224] In the step of obtaining the second membrane 12-2, the first membrane 12-1 is brought into contact with an acidic solution containing an acidic substance with a pH value in the range of 2.5 or higher and 3.5 or lower, thereby obtaining the second membrane 12-2 with pores.

[0225] The first film 12-1 contains indium oxide (I) (In₂O), indium oxide (III) (In₂O₃), and silicon dioxide (IV) (SiO₂). Indium oxide (I) (In₂O) and indium (In) in the first film 12-1 have higher solubility relative to acidic substances. Therefore, by contacting the first film 12-1 with an acidic substance, indium oxide (I) and indium (In) can be preferentially dissolved from the first film 12-1, thereby obtaining a second film 12-2 with a desired refractive index and a framework composed of silicon dioxide (SiO₂). Furthermore, there is a situation where indium(III) oxide (In₂O₃) contained in the first membrane 12-1 dissolves from the first membrane 12-1 as the contact time with the acidic substance increases. Simultaneously with the dissolution of indium(III) oxide (In₂O₃) from the first membrane 12-1, a portion of the silicon dioxide (IV) (SiO₂) surrounded by indium(III) oxide (In₂O₃) also detaches from the first membrane 12-1. The material constituting the porous second membrane 12-2 is primarily silicon dioxide (IV) (SiO₂), but it also contains undissolved indium(III) oxide (In₂O₃).

[0226] In the manufacturing method of this embodiment, by using the above-mentioned vapor deposition material, a first film 12-1 comprising indium oxide (I) (In₂O), indium oxide (III) (In₂O₃), and silicon dioxide (IV) (SiO₂), which have relatively high solubility relative to acidic substances, can be formed. Then, by contacting the first film 12-1 with the acidic substance, the more soluble indium oxide (I) (In₂O) can be dissolved first without compromising the durability of the first film 12-1 and the second film 12-2. This increases the porosity of the second film 12-2, and by increasing the porosity, a second film 12-2 with a lower refractive index can be formed. The formed second film 12-2 is a light reflection reduction film 12.

[0227] like Figure 6B As shown, the second film 12-2 comprises a silicon dioxide layer 12a and a second mixed layer 12b2 having voids. The second mixed layer 12b2 comprises air and silicon dioxide. The second film 12-2 is formed by mixing and laminating the silicon dioxide layer 12a and the second mixed layer 12b2 on the first surface 11a of the substrate 11.

[0228] Examples of acidic substances included in the acidic solution include inorganic acids such as hydrochloric acid, sulfuric acid, and nitric acid, and organic acids such as acetic acid, citric acid, and oxalic acid. An acidic solution containing at least one of these inorganic and organic acids can be used. The acidic solution preferably contains oxalic acid and nitric acid. Oxalic acid dissolves indium oxide (I) (In₂O) and indium oxide (III) (In₂O₃) in the first membrane 12-1, while nitric acid oxidizes the indium reduced during dissolution by oxalic acid, thereby reducing excessive precipitation of indium. The pH value of the acidic solution is in the range of 2.5 or higher and 3.5 or lower, preferably in the range of 2.7 or higher and 3.2 or lower. If the pH value of the solution containing the acidic substance is less than 2.5, the adhesion between the obtained first membrane 12-1 and the substrate 11 is low, and there is a possibility that the first membrane 12-1 may peel off from the substrate 11 after contact with the solution containing the acidic substance. If the pH of the acidic solution is greater than 3.5, the dissolution rate of indium oxide (I)(In2O) and indium (In) contained in the first membrane 12-1 will be slower, and it will take time to completely dissolve indium oxide (In2O) and indium (In), which may lead to a decrease in manufacturing efficiency.

[0229] The temperature at which the first film 12-1 contacts the acidic solution is room temperature. Room temperature is preferably in the range of 15°C to 28°C, and more preferably 15°C to 25°C. Higher temperatures promote the dissolution of indium oxide (I) (In₂O) and indium (In) in the vapor-deposited film, thus shortening the contact time, which is preferable from a manufacturing perspective. If the temperature is too high, the solvent in the acidic solution will evaporate, and the pH value will decrease. Therefore, a sealed container or equipment for continuous monitoring and adjustment of the pH value is required, which may increase manufacturing costs. If the temperature is too low, a cooling device may be necessary, which may also increase manufacturing costs.

[0230] The contact time between the first film 12-1 and the acidic substance varies depending on the contact temperature and the concentration of the acidic substance, as long as it is the time required to obtain a second film 12-2 with a porosity that meets the desired refractive index. Regarding the contact time between the first film 12-1 and the acidic substance, to improve manufacturing efficiency and maintain the durability of the second film 12-2 and the substrate 11, it is preferably 10 seconds or more, more preferably 30 seconds or more, and more preferably 36 hours or less, more preferably 25 hours or less.

[0231] As a method for contacting the first film 12-1 with an acidic solution, examples include immersing the substrate 11 on which the first film 12-1 is formed in an acidic solution and immersing only the first film 12-1 formed on the substrate 11 in an acidic solution.

[0232] The thickness of the first film 12-1 disposed in the second region 122 is less than the thickness of the first film 12-1 disposed in the first region 121. In the step of obtaining the second film 12-2, the first film 12-1 is mainly composed of silicon dioxide as a framework, therefore, even with regard to the second film 12-2, the thickness of the second film 12-2 disposed in the second region 122 is maintained to be less than the thickness of the second film 12-2 disposed in the first region 121.

[0233] Furthermore, since the thickness of the second film 12-2 disposed in the second region 122 is less than the thickness of the second film 12-2 disposed in the first region 121, the light transmittance of the first region 121 is greater than the light transmittance of the second region 122. In other words, by performing the step of obtaining the second film 12-2, a second film 12-2 can be obtained in which the thickness of the second film 12-2 disposed in the second region 122 is less than the thickness of the second film 12-2 disposed in the first region 121, and the light transmittance of the first region 121 is greater than the light transmittance of the second region 122. By making the light transmittance of the first region 121 greater than the light transmittance of the second region 122, this embodiment provides a light-transmitting component 1 with good light extraction effect.

[0234] Figure 12 In the example shown, the substrate 11 includes a lens 111, and the first surface 11a has a convex surface 111a that includes an optical axis 111C. The distance between the convex surface 111a and the support fixture 200 increases in the direction away from the optical axis 111C. The distance d between the convex surface 111a and the upper surface 222a of the protrusion 222 of the support fixture 200 in the direction along the optical axis 111C increases in the direction away from (away from) the optical axis 111C. Accordingly, the film thickness of the first film 12-1 deposited on the convex surface 111a can be changed according to the distance d.

[0235] Figure 12 and Figure 13 In the example shown, the first region 121 in the top view is positioned inside the rim 240a of the first opening 240. Accordingly, the vapor-deposited particles can travel substantially unimpeded by the protrusion 222, thus making the thickness of the first film 12-1 formed on the first region 121 uniform regardless of its position.

[0236] In this embodiment, in the top view, the second region 122 surrounds the entire periphery of the first region 121. Accordingly, in the top view, the second region 122, which has a smaller light transmittance than the first region 121, can be arranged around the entire periphery outside the first region 121, thereby reducing stray light generated around the entire periphery outside the first region 121.

[0237] In the manufacturing method of the light-transmitting component 1 according to the embodiment, in the step (S11) of preparing the substrate 11, the thickness of the first film 12-1 in the second region 122 is made to decrease continuously or in a stepped manner along the direction from the first region 121 toward the second region 122. After S11, by performing... Figure 10 In step S12, obtaining the second film 12-2 results in a light reflection reduction film 12 composed of the light-transmitting second film 12-2 with pores. Accordingly, the light transmittance of the light-transmitting component 1 can be made to decrease continuously or in a stepwise manner along the direction from the first region 121 towards the second region. By making the light transmittance of the first region 121 greater than that of the second region 122, a good light extraction effect can be obtained. Furthermore, by making the light transmittance decrease continuously or in a stepwise manner along the direction from the first region 121 towards the second region, stray light, which is more likely to occur from the first region 121 towards the second region, is less likely to pass through the light-transmitting component 1. Accordingly, the light-transmitting component 1 can reduce stray light.

[0238] The step of preparing the substrate 11 (S11) may include forming a base film with light transmittance having a refractive index lower than that of the substrate 11 on a first surface 11a of the substrate 11. In the step of obtaining the second film 12-2 (S12), the refractive index of the second film 12-2 is made lower than that of the base film. For example, by sequentially stacking the base film and the second film 12-2 on the first surface 11a, the refractive index can decrease as it moves away from the substrate 11. Thus, by forming a base film with a refractive index lower than that of the substrate 11 and higher than that of the second film 12-2, the light reflection reduction effect can be improved.

[0239] (Other examples of support clamp 200)

[0240] The support clamp 200 can have a variety of shapes. See also Figures 16-19 Other examples of support clamp 200 are described below.

[0241] Figure 16 This is a bottom view showing the second example of the support clamp 200. It should be noted that... Figure 16 The image shows a support fixture 200 and a graphic 161, where graphic 161 represents the film thickness t within a cross-section passing through the center 240C of the first opening 240 of the light reflection reduction film 12 formed by the support fixture 200. The positions of the support fixture 200 and graphic 161 in the X direction correspond to each other.

[0242] Figure 16 In the top view, a first direction A1 is shown along the direction from the center 240C of the first opening 240 toward the outer edge of the first opening 240. Figure 16In the second example shown, the support clamp 200 has a second opening 260. In the top view, the second opening 260 is located outside the first opening 240, and the opening width W of the second opening 260 in the second direction A2, which is orthogonal to the first direction A1, increases towards the first direction A1. This point is related to... Figure 12 and Figure 13 The main difference in the first example of the support clamp 200 shown.

[0243] For example, in the case of a support fixture without the second opening 260, when a light reflection reduction film is formed using the support fixture, the number of vapor-deposited particles reaching the substrate 11 decreases as the distance from the center 240C of the first opening 240 along the direction toward the first direction A1 decreases. Accordingly, the thickness of the light reflection reduction film formed by the support fixture decreases from the center of the light reflection reduction film toward the outer edge.

[0244] However, regarding the support fixture 200 in the second example, the further away from the center 240C of the first opening 240 along the direction towards the first direction A1, the longer the opening width W of the second opening 260 in the second direction A2, which is orthogonal to the first direction A1. Accordingly, the further away from the center 240C of the first opening 240 along the direction towards the first direction A1, the smaller the reduction in the number of vapor-deposited particles reaching the substrate 11 can be, thereby keeping it substantially constant. By keeping the number of vapor-deposited particles reaching the substrate 11 substantially constant, such as... Figure 16 As shown in Figure 161, the film thickness t2 of the second region 122 can be kept essentially constant, and the film thickness t2 of the second region 122 can vary in a stepped manner relative to the film thickness t1 of the first region 121. In this way, by adjusting the opening width of the second opening 260 of the support fixture 200, the light reflection reduction film 12 with a stepped film thickness t can be easily configured.

[0245] Figure 16 The support fixture 200 shown is provided with a plurality of second openings 260 surrounding the entire periphery of the first opening 240. Accordingly, a light reflection reduction film 12 with a stepped thickness t can be formed in the second region 122 surrounding the entire periphery of the first region 121.

[0246] use Figure 16 In the manufacturing method of the light-transmitting component 1 of the support clamp 200 shown, the outer edge 122G of the second region 122 in the top view is located outside the rim of the second opening 260. Accordingly, a light reflection reduction film 12 with high light transmittance can be formed over a large area.

[0247] At once Figure 16In the top view of the support clamp 200, a plurality of holes 270 are provided on the outer side of the first opening 240. The plurality of holes 270 are provided on the outer periphery of a plurality of second openings 260 provided along the entire periphery of the outer side of the first opening 240. In step (S12) of obtaining the second film 12-2 with voids and light transmittance, an acidic substance contacts the first film 12-1 of the substrate 11 supported by the support clamp 200 through the holes 270. Accordingly, bubbles generated by the contact of the acidic substance with the first film 12-1 can easily escape from the support clamp 200 through the holes 270, thereby efficiently forming the light reflection reduction film 12.

[0248] The shape of the hole 270 in the top view is not limited to being roughly circular; it can also be roughly rectangular, elliptical, polygonal, etc. Furthermore, without reducing the mechanical strength of the support fixture 200, the support fixture 200 may also have a hole 270 with a larger area in the top view, and may also have multiple holes 270 arranged with equal spacing between adjacent holes 270.

[0249] Figure 17 This is a bottom view showing the third example of the support clamp 200. It should be noted that... Figure 17 Only the support clamp 200 of example 3 is shown. Figure 16 The region corresponding to the XVI region in the diagram.

[0250] Figure 17 In the third example shown, the second opening 260 includes a plurality of circular openings 261. The plurality of circular openings 261 are arranged in concentric circles with the center 240C of the first opening 240 as the center. Figure 17 In the example shown, the centers of multiple circular openings 261, each approximately the same size, are arranged concentrically around the center 240C of the first opening 240. The diameter of the multiple circular openings 261 increases as they move towards the first direction A1. Even with such a second opening 260, a similar effect to the second example of the support clamp 200 can be achieved.

[0251] Figure 18 This is a bottom view showing the fourth example of the support clamp 200. It should be noted that... Figure 18 Only the support clamp 200 of example 4 is shown. Figure 16 The region corresponding to the XVI region in the diagram.

[0252] Figure 18In the fourth example shown, the second opening 260 includes a plurality of arc-shaped openings 262. Each of the plurality of arc-shaped openings 262 includes an opening portion 262a that is intermittently arranged along a circumferential direction centered on the center 240C of the first opening 240. In other words, in each of the plurality of arc-shaped openings 262, the opening portion 262a and the non-opening portion 262b are alternately arranged along the circumferential direction.

[0253] For each of the plurality of arc-shaped openings 262, the width of the opening portion 262a in the first direction A1 is larger the further away from the center 240C. By increasing the width of the opening portion 262a in the first direction A1, the opening area of ​​each of the plurality of arc-shaped openings 262 is larger the further towards the first direction A1. Even with such a second opening 260, a similar effect to the second example of the support clamp 200 can be obtained. It should be noted that, for the plurality of arc-shaped openings 262, the width or length of the opening portion 262a along at least one of the first direction A1 and the circumferential direction centered on the center 240C may be larger the further towards the first direction A1.

[0254] Figure 19 This is a bottom view showing the fifth example of the support clamp 200. It should be noted that... Figure 19 The image shows a support clamp 200 and a graphic 191, where graphic 191 represents the film thickness t in a cross-section passing through the center 240C of the first opening 240 of the light reflection reduction film 12 formed by the support clamp 200. The support clamp 200 and graphic 191 are positioned opposite each other in the X direction.

[0255] In the fifth example of the support fixture 200, a hole 271 is provided on the outer side of the first opening 240. The hole 271 is an integrated hole of the hole 270 and the second opening 260. By integrating the hole 270 with the second opening 260, the width of the opening in the first direction A1 of the hole 271 is increased, thereby forming a large area of ​​the second region 122 and making it easier for solutions containing acidic substances and bubbles to escape. Here, if the opening width in the first direction A1 of the hole 271 is increased, the vapor-deposited particles incident obliquely from the +Z side (+Z direction) into the opening on the XY plane of the hole 271 of the support fixture 200 can reach a position in the substrate 11 away from the center 240C. For this reason, the film thickness t will be close to 100% near the outer edge of the second region 122. It should be noted that if the film thickness t is less than 100%, it can be said that it is within the range of the second region 122. In other words, regarding the film thickness t2 of the light reflection reduction film 12 in the second region 122, by adjusting the shape of at least one of the first opening 240, the second opening 260, and the hole 270 (hole 271) of the support fixture 200, it can be made larger in the direction from the first region 121 toward the second region 122. However, at this time, the film thickness t2 of the second region 122 is smaller than the film thickness t1 of the light reflection reduction film 12 in the first region 121. It should be noted that the hole 270 can be integrated with at least one of the first opening 240 and the second opening 260.

[0256] [Examples and Comparative Examples]

[0257] Next, specific embodiments and comparative examples of the light-transmitting components will be described. However, this disclosure is not limited to the embodiments described below. The elements, evaluation methods, and evaluation results of the light-transmitting components of the manufactured embodiments and comparative examples are shown below.

[0258] <Elements of Transparent Components>

[0259] (1) Composition

[0260] Figure 20 This is a cross-sectional view illustrating the configuration of the light-transmitting components of the respective embodiments and comparative examples. The light-transmitting components of the respective embodiments and comparative examples are components with a lens 111 and a support portion 112 on a substrate 11.

[0261] • Example 1: A base film and a light reflection reduction film 12 are sequentially disposed only on the second surface 11b of the substrate 11.

[0262] • Example 2: A base film and a light reflection reduction film 12 are sequentially disposed only on the first surface 11a of the substrate 11.

[0263] • Example 3: A base film and a light reflection reduction film 12 are sequentially disposed on the first surface 11a and the second surface 11b of the substrate 11.

[0264] • Comparative example: No base film and light reflection reduction film 12 are provided; only the substrate 11 is constructed.

[0265] (2) Material

[0266] The substrate 11 is made of polycarbonate. The bottom film is made of a silicon dioxide layer. The light reflection reducing film 12 is a film composed of a silicon dioxide layer 12a and voids.

[0267] (3) Base film

[0268] The substrate, namely the silicon dioxide layer, is formed by sputtering. The maximum thickness of the substrate is...

[0269] (4) Light reflection reduction film

[0270] When forming the light reflection reduction film 12, a support fixture was used. Figure 13 The fixture shows that the protruding length L of each of the four protrusions 222 of the first opening 240 is adjusted. The first film 12-1 is formed by alternating layers of a first mixed layer 12b1 and a silicon dioxide layer 12a. The first mixed layer 12b1 and the silicon dioxide layer 12a in the first film 12-1 are formed by electron beam evaporation using ion-assisted evaporation under Ar gas atmosphere, pressure below 0.01 Pa, and temperature at room temperature. The substrate 11 on which the first film 12-1 is formed is immersed at 25°C (room temperature) in a mixture of oxalic acid and nitric acid with a pH of 3, which is an acidic solution containing acidic substances, for 1 hour, thereby obtaining a substrate 11 on which the second film 12-2 (light reflection reduction film 12) is formed. The maximum film thickness of the light reflection reduction film 12 is The film thickness of the second region 122 varies continuously along the direction from the first region 121 toward the second region 122.

[0271] <Evaluation Methods>

[0272] A light source with nine light-emitting parts (light-emitting surfaces) arranged in a two-dimensional pattern was used. The light-emitting parts were LEDs. The illuminance of light emitted from the light source and passing through the light-transmitting components of Comparative Example, Example 1, Example 2, and Example 3 was measured using an illuminance meter. The illuminance was evaluated using the illuminance characteristic value Lg calculated by the following formula. It should be noted that the unit of the illuminance measurement is lux. Furthermore, (illuminance of the light source) in the following formula refers to the illuminance measured by the illuminance meter when light from the light source does not pass through the light-transmitting component and is directly incident on the illuminance meter.

[0273] Lg = (illuminance of light passing through the translucent component) / (illuminance of light from the light source)

[0274] <Evaluation Results>

[0275] Figure 21 This is a graph showing the measurement results of the illuminance of the light-transmitting component in the embodiment. (As shown) Figure 21 As shown, in Example 1, the illuminance characteristic value Lg was increased by 3.5% compared to the comparative example. In Example 2, the illuminance characteristic value Lg was increased by 7.2% compared to the comparative example. In Example 3, the illuminance characteristic value Lg was increased by 10.1% compared to the comparative example.

[0276] As can be seen from the above, in Examples 1 to 3, the illuminance characteristic values ​​were all improved compared with the comparative example.

[0277] Although the preferred embodiments have been described in detail above, they are not limited to the above embodiments. Various modifications and substitutions can be made to the above embodiments without departing from the scope of the claims.

[0278] The numbers used in the description of the embodiments to represent ordinal numbers, quantities, etc., are merely examples to illustrate the technology of this disclosure, and this disclosure is not limited to the illustrated numbers. Furthermore, the connections between constituent elements are also merely examples to illustrate the technology of this disclosure, and the connections used to achieve the functions of this disclosure are not limited thereto.

[0279] The light-emitting device disclosed herein has excellent light extraction performance and is therefore applicable to lighting fixtures, lighting devices, camera flashes, vehicle headlights, etc. Furthermore, the light-transmitting component of this disclosure is applicable to lenses and the like used in the light-emitting devices described above. The manufacturing method of the light-transmitting component of this disclosure is applicable to the manufacturing of light-transmitting components for the light-emitting devices used in the aforementioned applications. However, the manufacturing method of the light-guiding component, the light-guiding component, and the light-emitting device of this disclosure are not limited to these applications.

[0280] For example, the manner of this disclosure is as follows.

[0281] <Item 1>

[0282] A method for manufacturing a light-transmitting component, comprising:

[0283] A step of preparing a light-transmitting substrate, the substrate having a first surface and a second surface located opposite to the first surface, a first film disposed on the first surface side, the first film containing a substance removable by an acidic substance; and

[0284] The step of obtaining a second membrane with porosity and light transmittance by contacting the first membrane with an acidic substance.

[0285] The first film includes a first region and a second region adjacent to the first region. The thickness of the first film disposed in the second region is less than the thickness of the first film disposed in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

[0286] <Item 2>

[0287] The method for manufacturing a light-transmitting component as described in <Item 1>, wherein the step of preparing the substrate includes:

[0288] Steps for preparing a support fixture with the first opening in the top view;

[0289] The step of aligning the first surface of the substrate with the first opening so that the substrate is supported by the support clamp; and

[0290] The step of supplying material to the first surface of the substrate via the first opening of the support clamp to form the first film, thereby positioning the first film in the first region overlapping the first opening in the top view and the second region adjacent to the first region.

[0291] <Item 3>

[0292] The method for manufacturing a light-transmitting component as described in item 2, wherein,

[0293] The substrate includes a lens, the first surface has a convex surface including an optical axis, and the distance between the convex surface and the support clamp increases in the direction away from the optical axis.

[0294] <Item 4>

[0295] The method for manufacturing a light-transmitting component as described in item 2, wherein,

[0296] In the top view, the first region is positioned inside the rim of the first opening.

[0297] <Item 5>

[0298] The method for manufacturing a light-transmitting component as described in any of items 1 to 4, wherein,

[0299] In the top view, the second region surrounds the entire perimeter of the first region.

[0300] <Item 6>

[0301] The method for manufacturing a light-transmitting component as described in any one of items 1 to 5, wherein,

[0302] In the step of preparing the substrate, the thickness of the first film in the second region is made to decrease continuously or in a stepped manner along the direction from the first region toward the second region.

[0303] <Item 7>

[0304] The method for manufacturing a light-transmitting component as described in any of items 1 to 6, wherein,

[0305] The step of preparing the substrate includes forming a light-transmitting base film on the first surface of the substrate, the base film having a refractive index lower than that of the substrate, and in the step of obtaining the second film, the refractive index of the second film being lower than that of the base film.

[0306] <Item 8>

[0307] The method for manufacturing a light-transmitting component as described in item 2, wherein,

[0308] The support clamp is provided with a second opening located outside the first opening in the top view. The more the second opening is towards the first direction, the longer its opening width is in the second direction orthogonal to the first direction. The first direction is the direction along the direction from the center of the first opening toward the outer edge of the first opening.

[0309] <Item 9>

[0310] The method for manufacturing a light-transmitting component as described in item 8, wherein,

[0311] The support clamp is provided with a plurality of second openings that surround the entire periphery of the first opening.

[0312] <Item 10>

[0313] The method for manufacturing a light-transmitting component as described in item 8 or item 9, wherein,

[0314] In the top view, the outer edge of the second region is located outside the rim of the second opening.

[0315] <Item 11>

[0316] The method for manufacturing a light-transmitting component as described in item 2, wherein,

[0317] The support fixture has a hole located outside the first opening in a top view. In the step of obtaining the second membrane with the void, the acidic substance contacts the first membrane of the substrate supported by the support fixture via the hole.

[0318] <Item 12>

[0319] The method for manufacturing a light-transmitting component as described in item 8, wherein,

[0320] The support clamp is provided with a hole located outside the first opening in the top view, and the hole is integral with at least one of the first opening and the second opening.

[0321] <Item 13>

[0322] A light-transmitting component, comprising:

[0323] A light-transmitting substrate having a first surface and a second surface located on the opposite side of the first surface; and

[0324] An inorganic light reflection reduction film is disposed on the first surface of the substrate and has voids.

[0325] in,

[0326] The light reflection reduction film includes a first region and a second region adjacent to the first region. The thickness of the light reflection reduction film in the second region is less than the thickness of the light reflection reduction film in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

[0327] <Item 14>

[0328] As described in item 13, the light-transmitting component, wherein...

[0329] The thickness of the light reflection reduction film in the second region decreases continuously or in a stepped manner along the direction from the first region toward the second region.

[0330] <Item 15>

[0331] As described in item 13 or item 14, the light-transmitting component, wherein,

[0332] A transparent base film is disposed between the substrate and the light reflection reduction film. The refractive index of the base film is lower than that of the substrate and higher than that of the light reflection reduction film.

[0333] <Item 16>

[0334] A light-emitting device, comprising:

[0335] The light-transmitting component as described in any one of items 13 to 15; and

[0336] A light source arranged along the direction of the first surface of the light-transmitting component.

[0337] The light source includes a light-emitting surface, and the first region overlaps with the light-emitting surface in the top view.

[0338] <Item 17>

[0339] The light-emitting device as described in item 16, wherein...

[0340] The thickness difference between the film thickness of the light reflection reduction film in the first region and the film thickness of the light reflection reduction film in the second region is more than 5% of the film thickness of the light reflection reduction film in the first region.

[0341] <Item 18>

[0342] The light-emitting device as described in item 16 or item 17, wherein,

[0343] The maximum thickness of the light reflection reduction film in the first region is The above and the following.

[0344] <Item 19>

[0345] The light-emitting device as described in any one of items 16 to 18, wherein,

[0346] The light reflection reduction film is also disposed on the second surface.

[0347] <Item 20>

[0348] The light-emitting device as described in any one of items 16 to 19, wherein,

[0349] The substrate includes a lens, and the first region is located in a top view at a position overlapping the optical axis of the lens.

Claims

1. A method for manufacturing a light-transmitting component, comprising: A step of preparing a light-transmitting substrate, the substrate having a first surface and a second surface located on the opposite side of the first surface, a first film disposed on the first surface side, the first film containing a substance that can be removed by an acidic substance; and The step of obtaining a second, transparent membrane with pores by contacting the first membrane with an acidic substance, wherein... The first surface of the substrate includes a first region and a second region adjacent to the first region. The thickness of the second film disposed in the second region is less than the thickness of the second film disposed in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

2. The method for manufacturing the light-transmitting component as described in claim 1, wherein, The steps for preparing the substrate include: Steps for preparing a support fixture with the first opening in the top view; The step of aligning the first surface of the substrate with the first opening so that the substrate is supported by the support clamp; and The step of supplying material to the first surface of the substrate via the first opening of the support clamp to form the first film, thereby positioning the first film in the first region overlapping the first opening in the top view and the second region adjacent to the first region.

3. The method for manufacturing a light-transmitting component as described in claim 2, wherein, The substrate includes a lens, the first surface has a convex surface including an optical axis, and the distance between the convex surface and the support clamp increases in the direction away from the optical axis.

4. The method for manufacturing a light-transmitting component as described in claim 2, wherein, In the top view, the first region is positioned inside the rim of the first opening.

5. The method for manufacturing a light-transmitting component as described in any one of claims 1 to 4, wherein, In the top view, the second region surrounds the entire perimeter of the first region.

6. The method for manufacturing a light-transmitting component as described in any one of claims 1 to 5, wherein, In the step of preparing the substrate, the thickness of the first film in the second region is continuously or steppedly reduced along the direction from the first region toward the second region.

7. The method for manufacturing a light-transmitting component as described in any one of claims 1 to 6, wherein, The step of preparing the substrate includes forming a light-transmitting base film on the first surface of the substrate, the base film having a refractive index lower than that of the substrate. In the step of obtaining the second film, the refractive index of the second film is lower than that of the base film.

8. The method for manufacturing a light-transmitting component as described in claim 2, wherein, The support clamp is provided with a second opening located outside the first opening in the top view. The more the second opening is towards the first direction, the longer its opening width is in the second direction orthogonal to the first direction. The first direction is the direction along the direction from the center of the first opening toward the outer edge of the first opening.

9. The method for manufacturing a light-transmitting component as described in claim 8, wherein, The support clamp is provided with a plurality of second openings that surround the entire periphery of the first opening.

10. The method for manufacturing a light-transmitting component as described in claim 8 or 9, wherein, In the top view, the outer edge of the second region is located outside the rim of the second opening.

11. The method for manufacturing a light-transmitting component as described in claim 2, wherein, The support clamp is provided with a hole located outside the first opening in the top view. In the step of obtaining the second membrane having the voids, the acidic substance comes into contact with the first membrane of the substrate supported by the support fixture via the pores.

12. The method for manufacturing a light-transmitting component as described in claim 8, wherein, The support clamp is provided with a hole located outside the first opening in the top view. The hole is integral with at least one of the first opening and the second opening.

13. A light-transmitting component, comprising: A light-transparent substrate having a first surface and a second surface located on the opposite side of the first surface, wherein the first surface includes a first region and a second region adjacent to the first region: and An inorganic light reflection reduction film is disposed on the first surface side of the substrate and has voids, wherein, The thickness of the light reflection reduction film in the second region is less than the thickness of the light reflection reduction film in the first region, and the light transmittance of the first region is greater than the light transmittance of the second region.

14. The light-transmitting component as claimed in claim 13, wherein, The thickness of the light reflection reducing film in the second region decreases continuously or in a stepped manner along the direction from the first region toward the second region.

15. The light-transmitting component as claimed in claim 13 or 14, wherein, A transparent base film is disposed between the substrate and the light reflection reduction film. The refractive index of the base film is lower than that of the substrate and higher than that of the light reflection reduction film.

16. A light-emitting device, comprising: The light-transmitting component as described in any one of claims 13 to 15; and A light source arranged along the direction of the first surface of the light-transmitting component. in, The light source includes a light-emitting surface. The first region overlaps with the luminous surface in the top view.

17. The light-emitting device as claimed in claim 16, wherein, The thickness difference between the film thickness of the light reflection reduction film in the first region and the film thickness of the light reflection reduction film in the second region is more than 5% of the film thickness of the light reflection reduction film in the first region.

18. The light-emitting device as claimed in claim 16 or 17, wherein, The maximum thickness of the light reflection reduction film in the first region is The above and the following.

19. The light-emitting device according to any one of claims 16 to 18, wherein, The light reflection reduction film is also disposed on the second surface side.

20. The light-emitting device according to any one of claims 16 to 19, wherein, The substrate includes a lens. The first region is positioned in the top view at a location that overlaps with the optical axis of the lens.

Images