Semiconductor moisture sensor with two patterned capacitors and integrated heating element

Abstract

In one aspect, a device includes: a first patterned metal layer; the first dielectric layer is arranged on the first patterned metal layer; the second patterned metal layer is arranged on the first dielectric layer, and the first patterned metal layer, the first dielectric layer and the second patterned metal layer form a first capacitor; the second moisture sensitive dielectric layer is arranged on the second patterned metal layer; and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, where the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a moisture-sensitive second capacitor, and the first patterned metal layer is further configured as a heating element to assist in removing moisture from the second moisture-sensitive dielectric layer of the second capacitor in response to the provision of power to the first patterned metal layer.

Description

Technical Field

[0001] This disclosure relates in general to semiconductor devices, including electronic devices incorporating semiconductor devices, and more specifically, but not exclusively, to moisture sensing devices and techniques for their manufacture. Background Technology

[0002] Integrated circuit technology has made significant strides in improving computing power through the miniaturization of active components. Various packaging technologies are found in many electronic devices, including processors, servers, and radio frequency (RF) integrated circuits. Advanced packaging and processing technologies enable complex devices such as multi-die devices and system-on-a-chip (SoC) devices, which can include multiple functional blocks, each designed to perform a specific function, such as microprocessor functions, graphics processing unit (GPU) functions, communication functions (e.g., Wi-Fi, Bluetooth, and other communications).

[0003] Moisture sensors can be constructed using integrated circuit processing technology. In some cases, such moisture sensors can be used to detect the humidity of the surrounding environment, or they can be configured relative to other components of the integrated circuit to detect humidity levels that may damage the integrated circuit. In the latter case, the moisture sensor can be used to provide a humidity warning before the integrated circuit or components controlled by the integrated circuit fail due to humid conditions. Summary of the Invention

[0004] The following is a simplified overview relating to one or more aspects disclosed herein. Therefore, this overview should not be considered an exhaustive overview relating to all aspects of the conception, nor should it be considered to identify key or decisive elements relating to all aspects of the conception or to depict the scope associated with any particular aspect. Thus, the sole purpose of the following overview is to present, in a simplified form, certain concepts relating to one or more aspects involving the mechanisms disclosed herein, prior to the detailed descriptions presented below.

[0005] In one aspect, a device includes: a first patterned metal layer; a first dielectric layer disposed on the first patterned metal layer; a second patterned metal layer disposed on the first dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor; a second moisture-sensitive dielectric layer disposed on the second patterned metal layer; and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, wherein the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor, the second patterned metal layer being shared with the first capacitor, and the first patterned metal layer being further configured to be connected to a power source as a heating element to aid in the removal of moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0006] In one aspect, a method of forming a moisture sensor includes: forming a first patterned metal layer covering a substrate; forming a first dielectric layer on the first patterned metal layer; forming a second patterned metal layer on the first dielectric layer; forming a second moisture-sensitive dielectric layer on the second patterned metal layer; and forming a third patterned metal layer on the second moisture-sensitive dielectric layer; wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor, the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor, the second patterned metal layer being shared with the first capacitor, and the first patterned metal layer being further configured to be connected to a power source as a heating element to aid in removing moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0007] In one aspect, a moisture sensor includes: a first capacitor having a first patterned metal layer, a first dielectric layer disposed on the first patterned metal layer, and a second patterned metal layer disposed on the first dielectric layer; a second capacitor having a second moisture-sensitive dielectric layer disposed on the second patterned metal layer and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, wherein the second patterned metal layer is shared with the first capacitor; a first frequency-sensitive circuit formed using at least the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes at least based on a variable capacitance value of the second capacitor generated by the second moisture-sensitive dielectric layer being exposed to moisture; and a heating control circuit configured to provide power to the first patterned metal layer to control heating of the first patterned metal layer, thereby aiding in the removal of moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0008] Based on the accompanying drawings and detailed description, other objects and advantages associated with the aspects disclosed herein will be apparent to those skilled in the art. Attached Figure Description

[0009] When considered in conjunction with the accompanying drawings, a more complete understanding of the various aspects of this disclosure and its many advantages therefrom will become better understood by referring to the following detailed description, which is presented for illustrative purposes only and does not constitute any limitation on this disclosure.

[0010] Figure 1A , Figure 1B and Figure 1C Various views of example moisture sensors according to aspects of this disclosure are depicted.

[0011] Figure 2A and Figure 2B Various views of a moisture sensor according to aspects of this disclosure are depicted.

[0012] Figures 3 to 8 Various examples of moisture sensors according to aspects of this disclosure are described.

[0013] Figure 9 An example of an electronic system that can be coupled to a moisture sensor according to various aspects of this disclosure is shown.

[0014] Figure 10 An example of a humidity detection cycle that can be performed by an electronic system according to various aspects of this disclosure is illustrated.

[0015] Figure 11 This is a schematic diagram of an example filter circuit that can be incorporated into a frequency filter / generator according to various aspects of this disclosure.

[0016] Figure 12 This is a schematic diagram of an example active filter circuit that can be used to implement a frequency filter / generator according to various aspects of this disclosure.

[0017] Figure 13 It is a graph of example frequency response curves of active filter circuits under various humidity conditions according to various aspects of this disclosure.

[0018] Figure 14 An example moisture sensor with a fixed-value inductor is illustrated according to various aspects of this disclosure.

[0019] Figure 15 This is a schematic diagram of a passive filter circuit formed by using a fixed-value inductor and a moisture-sensitive capacitor based on various aspects of this disclosure.

[0020] Figure 16This is a graph showing the example frequency response curves of a passive filter circuit with a fixed-value inductor under various humidity conditions according to various aspects of this disclosure.

[0021] Figure 17 An example package scenario for an electronic circuit including multiple moisture sensors is illustrated according to various aspects of this disclosure.

[0022] Figure 18 An example package scenario for an electronic circuit including multiple moisture sensors is illustrated according to various aspects of this disclosure.

[0023] Figure 19 Example packaging scenarios for electronic circuits including a moisture sensor according to various aspects of this disclosure are illustrated.

[0024] Figure 20 An example method for manufacturing a moisture sensor according to various aspects of this disclosure is shown.

[0025] Figure 21 A cross-sectional view of a package including a surface mount substrate, an integrated device, and an integrated moisture sensor device according to various aspects of this disclosure is illustrated.

[0026] Figure 22 An exemplary flowchart illustrating a method for manufacturing a package including a substrate, integrated devices, and integrated passive devices is shown.

[0027] Figure 23 Examples are provided of various electronic devices that can integrate the dies, electronic circuits, integrated devices, integrated passive devices, passive components, packages and / or device packages described herein.

[0028] By convention, the features depicted in the accompanying drawings may not be drawn to scale. Accordingly, for clarity, the dimensions of the depicted features may be arbitrarily enlarged or reduced. By convention, some drawings are simplified for clarity. Therefore, the drawings may not depict all components of a particular device or method. Furthermore, similar reference numerals are used throughout the specification and accompanying drawings to indicate similar features. Detailed Implementation

[0029] Various aspects of this disclosure are illustrated in the following description and related figures with respect to specific embodiments. Alternative aspects or embodiments may be designed without departing from the scope of this teaching. Furthermore, well-known elements of the illustrative embodiments herein will not be described in detail or will be omitted to avoid obscuring the relevant details of the teachings in this disclosure.

[0030] In some of the described example implementations, instances are identified where various parts of the component structures and operations are available from known conventional techniques and are subsequently arranged according to one or more exemplary embodiments. In such instances, internal details of the parts of known conventional component structures and / or operations may be omitted to help avoid potential confusion with the concepts illustrated in the exemplary embodiments disclosed herein.

[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “an,” “a,” and “described” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the term “comprising,” as used herein, specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It will also be understood that when a layer is described as “on top of,” “overlaying,” “under,” or “below,” another layer does not necessarily exclude the use of intermediate layers and / or materials that may otherwise be used to ensure adhesion between layers.

[0032] To fully illustrate the various aspects of the design disclosed herein, manufacturing methods are proposed. Other manufacturing methods are also possible, and the manufacturing methods discussed are only for the purpose of helping to understand the concepts disclosed herein.

[0033] Certain aspects of this disclosure relate to moisture sensing devices formed as integrated circuit structures. In one aspect, such moisture sensing devices can be manufactured as separate moisture sensing devices that are subsequently surface-mounted to a substrate for connection with other electronic components. In another aspect, such moisture sensing devices can be manufactured in the same substrate as other electronic components. As will be understood, various electrical connections can exist between the moisture sensing device and other electronic components.

[0034] Figure 1A , Figure 1B and Figure 1C (Collectively referred to as FIG1) depicts various views of an example moisture sensor 100 according to various aspects of the present disclosure. Figure 1A This is a top cross-sectional view of the humidity sensor 100. Figure 1B It is along Figure 1A The cross-sectional view of the moisture sensor 100 taken from line 1B-1B, and Figure 1C This is a cross-sectional view of the moisture sensor 100 taken along line 1C-1C.

[0035] As shown in Figure 1, the moisture sensor 100 includes a patterned refractory metal layer 102 formed of a refractory metal (e.g., tungsten, tungsten alloys, tantalum, tantalum alloys, niobium, niobium alloys, rhenium, rhenium alloys, etc.). The patterned refractory metal layer 102 may be deposited or otherwise formed on a substrate 104 (such as a silicon dioxide (SiO2) or silicon nitride (SiN) substrate). As will be explained in more detail below, the patterned refractory metal layer 102 can serve a dual function. In one aspect, the patterned refractory metal layer 102 may form the plate of a capacitor and serve as a heating element for controlling the temperature of the moisture sensor 100. In Figure 1, a dielectric material (such as SiO2 or SiN) may be deposited or otherwise formed to fill the void regions between the traces of the patterned refractory metal layer 102.

[0036] In one aspect, a dielectric layer 106 formed of a moisture-insensitive dielectric material covers the patterned refractory metal layer 102. The dielectric layer 106 shown in FIG. 1 may be formed of the same dielectric material as the substrate 104. In one aspect, the dielectric material used to form the dielectric layer 106 may be a moisture-insensitive material (e.g., SiO2 or SiN) because the dielectric value of the dielectric material remains substantially unchanged in the presence of moisture.

[0037] In one aspect, a patterned metal layer 108 covers the dielectric layer 106. The patterned metal layer 108 may be formed of a conductive material (such as copper, aluminum, etc.). The patterned refractory metal layer 102, the dielectric layer 106, and the patterned metal layer 108 together form a capacitor 110, as schematically shown in FIG1. ​​In this example, the capacitor 110 is formed to have a fixed capacitance value, at least in the sense that the capacitance value does not change significantly in the presence of moisture. In FIG1, a dielectric material (such as SiO2 or SiN) may be deposited or otherwise formed to fill the void regions between the traces of the patterned metal layer 108.

[0038] In one aspect, another dielectric layer 112 is disposed on the patterned metal layer 108. In this example, the dielectric layer 112 is formed of a moisture-sensitive dielectric material having a low dielectric constant (low K) or an extremely low dielectric constant (ELK). In one aspect, the low K and / or ELK dielectric material may have a small dielectric constant relative to other dielectric materials (SiO2, SiN, ceramics, mica, etc.) used in the fabrication of integrated devices. In one aspect, such a moisture-sensitive dielectric may have a dielectric constant below 4.3, and typically below 3.0. In one aspect, the moisture-sensitive dielectric material may be porous and / or hydrophilic to allow moisture to permeate from the surrounding environment into the moisture-sensitive dielectric material. In Figure 1, a moisture-insensitive dielectric material (such as SiO2 or SiN) may be deposited or otherwise formed to fill the void regions between the traces of the patterned metal layer 108.

[0039] In one aspect, another patterned metal layer 114 covers the dielectric layer 112 and can be formed using the same material as the patterned metal layer 108. The patterned metal layer 108, dielectric layer 112, and patterned metal layer 114 together form a capacitor 116, as schematically shown in FIG1. ​​The patterned metal layer 108 is shared by both capacitor 110 and capacitor 116. In this example, capacitor 116 has a variable capacitance value, at least in the sense that the capacitance value changes in a detectable manner in the presence of moisture. In FIG1, a dielectric material (such as SiO2 or SiN) can be deposited or otherwise formed to fill the void regions between the traces of the patterned metal layer 114.

[0040] In one aspect, the patterned refractory metal layer 102 and the patterned metal layers 114 and 108 have substantially the same pattern, such that the traces of the layers are aligned and have the same height and width. By using substantially the same pattern, any detectable difference between the capacitances of capacitors 110 and 116 will be primarily based on the moisture content of the moisture-sensitive dielectric layer 112. In some cases, capacitor 110 can be used as a reference capacitor for the variable capacitance relative to the moisture-sensitive capacitor 116.

[0041] Figure 2A and Figure 2B Various views of an example moisture sensor 200 according to various aspects of this disclosure are depicted. Figure 2A This is a top cross-sectional view of the moisture sensor 200 including the air gap 216. Figure 2B It is along Figure 2A A cross-sectional view of the moisture sensor 200 taken from line 2B-2B.

[0042] exist Figure 2B In this embodiment, the moisture sensor 200 includes separate capacitor banks 202 and 204 arranged in a side-by-side architecture. Here, capacitor bank 204 includes a fixed-value capacitor 206 and a moisture-sensitive capacitor 208, while capacitor bank 202 includes fixed-value capacitors 210 and 212. Capacitor banks 202 and 204 are formed as an integrated structure in region 214 having dielectric material configured to isolate capacitor banks 202 and 204 from each other. In one aspect, capacitor banks 202 and 204 may be further isolated from each other by forming an air gap 216 in the dielectric material of region 214. Capacitor bank 204 may be formed in the same or a similar manner as shown in the moisture sensor 100 of FIG. 1.

[0043] In one aspect, some structures of capacitor bank 202 can be formed in the same processing operations used to form the corresponding structures of capacitor bank 204. For example... Figure 2BAs shown, the capacitor bank 202 includes a patterned refractory metal layer 218 disposed on a substrate 220. The patterned refractory metal layer 218 may be disposed coplanarly with the patterned refractory metal layer 222. In one aspect, the patterned refractory metal layers 218 and 222 are formed of the same refractory metal.

[0044] The capacitor bank 202 includes a dielectric layer 224 formed of a moisture-insensitive dielectric material disposed on a patterned refractory metal layer 218. The dielectric layer 224 is coplanar with the dielectric layer 226 of the capacitor bank 204 and may be formed of the same material as the dielectric layer 226. Another patterned metal layer 228 is disposed on the dielectric layer 224 and is coplanar with the patterned metal layer 230 of the capacitor bank 204. The patterned refractory metal layer 218, the dielectric layer 224, and the patterned metal layer 228 form a fixed-value capacitor 210.

[0045] The capacitor bank 202 also includes a dielectric layer 232 formed of a moisture-sensitive dielectric material, which is disposed on the patterned metal layer 228 and coplanar with the dielectric layer 234 of the capacitor bank 204. The material used to form the dielectric layer 232 may be the same as the dielectric material used to form the dielectric layer 224. Another patterned metal layer 236 is disposed on the dielectric layer 232 and coplanar with the patterned metal layer 238 of the capacitor bank 204. In this example, the patterned metal layer 236, the dielectric layer 232, and the patterned metal layer 228 form a capacitor 212, which shares the patterned metal layer 228 with the capacitor 210.

[0046] In one aspect, the patterned refractory metal layer and the patterned metal layer may all have substantially identical patterns, such that the traces forming the respective capacitors are aligned and have the same height and width. By using substantially identical patterns, any detectable difference in capacitance between capacitors 206, 208, 210, and 212 will be primarily based on the moisture content of the moisture-sensitive dielectric layer 234. In some cases, capacitors 206, 210, and 212 are fixed-value capacitors, which can be used as reference capacitors relative to the variable capacitance of the moisture-sensitive capacitor 208.

[0047] Figure 3 An example humidity sensor 300 according to various aspects of this disclosure is depicted. The construction of the humidity sensor 300 is similar to... Figure 2A and Figure 2BThe moisture sensor 200 shown has a similar construction. As shown, the moisture sensor 300 includes a pair of side-by-side capacitor banks 302 and 304 separated from each other by an insulating dielectric material 322 including an air gap 324. Capacitor bank 302 includes capacitors 306 and 308, while capacitor bank 304 includes capacitors 310 and 312. In this example, the dielectric layer 314 of capacitor 306 is formed of a moisture-sensitive dielectric material, thus making capacitor 306 a moisture-sensitive capacitor. Similarly, the dielectric layer 316 of capacitor 310 is formed of a moisture-sensitive dielectric material, thus making capacitor 310 a moisture-sensitive capacitor. In contrast, capacitors 308 and 312 can be fixed-value capacitors.

[0048] Capacitor 308 includes a plate that can be used as capacitor 308 and a patterned refractory metal layer 318 for both a heating element for removing moisture from dielectric layer 314. Similarly, capacitor 312 includes a patterned refractory metal layer 320 for both a plate that can be used as capacitor 312 and a heating element for removing moisture from dielectric layer 316. A moisture sensor having multiple moisture-sensitive capacitors can be used in scenarios where it is desired to measure relative humidity.

[0049] Figure 4 An example humidity sensor 400 according to various aspects of this disclosure is depicted. The construction of the humidity sensor 400 is similar to... Figure 2A and Figure 2B The humidity sensor 200 shown has a similar construction. The humidity sensor 400 includes a pair of side-by-side capacitor banks 402 and 404 separated by an insulating dielectric material 422 including an air gap 424. Capacitor bank 402 includes capacitors 406 and 408, while capacitor bank 404 includes capacitors 410 and 412. In this example, the dielectric layer 414 of capacitor 410 is formed of a moisture-sensitive dielectric material, thus making capacitor 410 a moisture-sensitive capacitor. Similarly, the dielectric layer 416 of capacitor 412 is formed of a moisture-sensitive dielectric material, thus making capacitor 412 a moisture-sensitive capacitor. In contrast, capacitors 406 and 408 can be fixed-value capacitors. A humidity sensor with multiple moisture-sensitive capacitors can be used in scenarios where it is desired to measure relative humidity.

[0050] Capacitor 408 includes a patterned refractory metal layer 418 that serves as a plate for use as capacitor 408 and a heating element that can be used, for example, to control the temperature of humidity sensor 400. Similarly, capacitor 412 includes a patterned refractory metal layer 418 that serves as a plate for use as capacitor 412 and a heating element that can be used to reduce moisture in dielectric layers 414 and 416. As described above, a humidity sensor having multiple humidity-sensitive capacitors can be used in scenarios where it is desired to measure relative humidity.

[0051] Figure 5An example moisture sensor 500 according to various aspects of this disclosure is depicted. In this example, the moisture sensor 500 includes a moisture-sensitive capacitor 502 formed by patterned metal layers 504 and 506 and a moisture-sensitive dielectric layer 508. The moisture sensor 500 also includes a fixed-value capacitor 510 formed by a patterned metal layer 506, a dielectric layer 512 formed by a moisture-insensitive dielectric material, and a patterned refractory metal layer 514. The patterned refractory metal layer 514 can serve as both a plate for the capacitor 510 and a heating element that can be used to reduce moisture in the dielectric layer 512.

[0052] According to various aspects of this disclosure, the moisture sensor 500 may include an additional layer covering the structures forming capacitors 502 and 510. Figure 5 In this process, the additional layers of the moisture sensor 500 include a fluorosilicate glass (FSG) or silicon nitride layer 516 disposed on portions of the dielectric layer 512 and the patterned metal layer 504. A polyimide layer 518 may be disposed on portions of the layer 516 and the patterned metal layer 504 exposed by the layer 516. A polymer coating 520, allowing moisture to pass through the dielectric layer 508, may be disposed around the exterior of the moisture sensor 500.

[0053] Figure 6 An example moisture sensor 600 according to various aspects of this disclosure is depicted. In this example, the moisture sensor 600 includes parallel capacitor banks 602, 604 isolated from each other by an air gap 606. Capacitor bank 602 includes a moisture-sensitive capacitor 608 and a fixed-value capacitor 610. Capacitor bank 604 includes a moisture-sensitive capacitor 612 and a fixed-value capacitor 614. In one aspect, the fixed-value capacitors 610, 614 may share a common refractory metal layer 616, which may serve as a plate for each capacitor 610, 614 and a heating element for reducing moisture in the moisture-sensitive dielectric layers 618, 620 of the moisture-sensitive capacitors 608, 612. In some cases, the refractory metal layer 616 may be patterned to form separate plates for the fixed-value capacitors 610, 614 and separate heating elements that can operate independently of each other in some respects.

[0054] According to various aspects of this disclosure, the moisture sensor 600 may include an additional layer covering the structures forming capacitors 608 and 612. Figure 6 In this process, the additional layers of the moisture sensor 600 may include a fluorosilicate glass (FSG) or silicon nitride layer 622 and a polyimide layer 624 disposed on layer 622. A polymer coating 626 that allows moisture to pass through dielectric layers 618 and 620 may be disposed around the exterior of the moisture sensor 600.

[0055] Figure 7An example moisture sensor 700 according to various aspects of this disclosure is depicted. In this example, the moisture sensor 700 includes a moisture-sensitive capacitor 702 and a fixed-value capacitor 704. The moisture-sensitive capacitor 702 is formed from patterned metal layers 706, 708 disposed on opposite sides of a moisture-sensitive dielectric layer 710. The fixed-value capacitor 704 is formed from the patterned metal layer 708, a dielectric layer 712 formed of a moisture-insensitive dielectric material, and a refractory metal layer 714. In one aspect, the refractory metal layer 714 may be patterned using a pattern matching the pattern of the patterned metal layer 708.

[0056] According to various aspects of this disclosure, the moisture sensor 700 may include an additional layer covering the structure forming the capacitor 702. Figure 7 In this process, the additional layers of the moisture sensor 700 may include a fluorosilicate glass (FSG) or silicon nitride layer 716 and a polyimide layer 718 disposed on the layer 716. A polymer coating 720 that allows moisture to pass through the window region 722 to the dielectric layer 710 may be disposed around the exterior of the moisture sensor 700.

[0057] Figure 8 An example moisture sensor 800 according to various aspects of this disclosure is depicted. In this example, the moisture sensor 800 includes a moisture-sensitive capacitor 802 formed by patterned metal layers 804 and 806 and a moisture-sensitive dielectric layer 808. The moisture sensor 800 also includes a fixed-value capacitor 810 formed by patterned metal layer 806, a dielectric layer 812 formed by a moisture-insensitive dielectric material, and a patterned refractory metal layer 814. The patterned refractory metal layer 814 can serve as both a plate for the capacitor 810 and a heating element that can be used to reduce moisture in the dielectric layer 812.

[0058] In one aspect, the example moisture sensor 800 may include an additional heating element for reducing moisture in the dielectric layer 812. In another aspect, the patterned metal layer 804 may be formed of a refractory metal and connected to a power source as an additional heating element. Figure 8 In the example shown, the additional heating element includes a patterned refractory metal layer 816 disposed on a patterned metal layer 804. The patterned metal layer 804 may be formed of the same refractory metal as the refractory metal layer 816, or it may be formed of a different metal. Figure 8 In this configuration, a dielectric layer 818 is disposed on a patterned refractory metal layer 816, and another patterned metal layer 820 is disposed on the dielectric layer 818. The patterned refractory metal layer 816, the dielectric layer 818, and the patterned metal layer 820 may together form another capacitor 822. In one aspect, the other capacitor 822 may be coupled to a frequency-sensitive circuit (such as one or more frequency-sensitive circuits as described herein).

[0059] According to various aspects of this disclosure, the moisture sensor 800 may include an additional layer covering the structures forming capacitors 802, 810, and 810. Figure 8 In this process, the additional layers of the moisture sensor 800 include a fluorosilicate glass (FSG) or silicon nitride layer 824 disposed on portions of the dielectric layer 812 and the patterned metal layer 820. A polyimide layer 826 may be disposed on portions of the layer 824 and the patterned metal layer 820 exposed by the layer 824. A polymer coating 828 allowing moisture to pass through to the dielectric layer 808 may be disposed around the exterior of the moisture sensor 800. However...

[0060] Figure 9 An example of an electronic system 900 that can be coupled to a moisture sensor 902 according to aspects of this disclosure is shown. In one aspect, the electronic system 900 is a frequency-sensitive electronic circuit that responds to a change in capacitance caused by exposure of a moisture-sensitive dielectric layer included in the moisture sensor 902 to moisture. In this example, passive components 904 (e.g., a moisture sensor assembly such as a moisture-sensitive capacitor and a reference assembly such as a fixed-value reference capacitor) may be used with other electronic components to form a frequency filter and / or a frequency generator 906. The frequency filter / generator 906 has a frequency response that depends on the value of the moisture-sensitive assembly (e.g., a moisture-sensitive capacitor). In one aspect, the frequency response corresponds to the amount of moisture absorbed by the moisture-sensitive dielectric material of the moisture-sensitive assembly, which may be related to humidity (e.g., ambient humidity, relative humidity, etc.). The frequency response of the frequency filter / generator 906 may be detected by a sensing circuit 908 that can provide an output signal indicating the measured humidity.

[0061] The electronic system 900 may also include a heating element control system 910 connected to a refractive metal layer 912 of at least some of the passive components in the passive components 904 used to form the moisture sensor 902. When activated, the heating element control system 910 provides power to the refractive metal layer 912 to heat any moisture-sensitive dielectric layer adjacent to the refractive metal layer 912.

[0062] Figure 10 An example of a humidity detection cycle that can be performed by an electronic system 900 according to various aspects of this disclosure is illustrated. In this example, moisture in the moisture-sensitive dielectric material of the moisture sensor 902 is driven to a baseline level. Graph 1000 shows an example of the baseline frequency response curve 1002 of the frequency filter / generator 906. In one aspect, moisture in the moisture-sensitive dielectric material can be driven to a baseline level by heating the moisture-sensitive dielectric material by applying electricity to the refractive metal layer 912 by a heating element control system 910.

[0063] During the sensing cycle, moisture (e.g., from the surrounding environment) is allowed to permeate the moisture-sensitive dielectric material of the moisture sensor 902. The increase in moisture in the moisture-sensitive dielectric material causes a corresponding change in the dielectric constant of the moisture-sensitive dielectric material used to form the passive moisture-sensitive component of the moisture sensor 902. This change in dielectric constant causes a corresponding change in the frequency response of the frequency filter / generator 906. Graph 1004 illustrates an example of this change in the frequency response of the frequency filter / generator 906, where the response curve 1006 corresponds to the frequency response of the moisture sensor 902 during the sensing cycle. In this example, the peak value of the frequency response curve 1006 is offset from the peak value of the baseline frequency response curve 1002 by a frequency difference Δfr. In some cases, the frequency response curve 1006 may also experience an amplitude offset of ΔAmp from the peak amplitude of the baseline frequency response curve 1002. Once the humidity is measured by the electronic system 900, the heating element control system 910 can provide power to the refractive metal layer to heat the moisture-sensitive dielectric layer of the moisture sensor 902 and drive the response frequency of the frequency filter / generator 906 to the baseline response indicated by the baseline frequency response curve 1002.

[0064] Figure 11 This is a schematic diagram of an example filter circuit 1100 that can be incorporated into a frequency filter / generator 906 according to various aspects of this disclosure. The filter circuit 1100 can be implemented using capacitors C1, C2 of a single capacitor bank of the moisture sensor 902. In this example, a pair of resistors R1 and R2 are configured together with capacitors C1, C2 to form the filter circuit 1100. In one aspect, either or both of capacitors C1 and C2 can be moisture-sensitive capacitors. Therefore, the frequency response Vout / Vin of the filter depends on the moisture content of the moisture-sensitive dielectric layer of the moisture-sensitive capacitor of the moisture sensor 902.

[0065] Figure 12 This is a schematic diagram of an example active filter circuit 1200 that can be used to implement a frequency filter / generator 906 according to various aspects of this disclosure. The active filter circuit 1200 includes an operational amplifier 1202 with capacitors C1, C2, C3, and C4 coupled to a plurality of capacitor banks for a moisture sensor. In this example, capacitor C1 is a moisture-sensitive capacitor and is depicted as a variable capacitor. In contrast, capacitors C2, C3, and C4 are fixed-value capacitors from the plurality of capacitor banks. However, based on the teachings of this disclosure, it will be appreciated that capacitors C1, C2, C3, and C3 of the active filter circuit 1200 may comprise any combination of a moisture-sensitive capacitor and a fixed-value reference capacitor, and still have a frequency response Vout / Vin that varies with the moisture content of the moisture-sensitive dielectric layer of the moisture-sensitive capacitor.

[0066] Figure 13 Graph 1300 shows example frequency response curves of an active filter circuit (e.g., active filter circuit 1200) under various humidity conditions according to aspects of this disclosure. In this example, frequency response curve 1302 represents the baseline frequency response. Frequency response curve 1304 represents an example frequency response of the active filter circuit when the relative humidity is 10%. Frequency response curve 1306 represents an example frequency response of the active filter when the relative humidity is 50%. Frequency response curve 1308 represents an example frequency response of the active filter when the relative humidity is 100%. Based on the teachings of this disclosure, it will be appreciated that various active filter configurations will provide different frequency response curves under different humidity conditions.

[0067] According to certain aspects of this disclosure, the moisture sensor can be configured to implement a fixed-value inductor. Figure 14 An example moisture sensor 1400 with a fixed-value inductor according to aspects of the present disclosure is illustrated. In this example, the fixed-value inductor 1402 is implemented as a winding pattern of at least one of the patterned layers (e.g., patterned metal layers and / or patterned refractory metal layers) of the moisture sensor. Figure 15 This is a schematic diagram of a passive filter circuit 1500 formed by a fixed-value inductor 1402 and a moisture-sensitive capacitor C1 using a moisture sensor 1400, according to various aspects of this disclosure.

[0068] Figure 16 Graph 1600 shows example frequency response curves of a passive filter circuit (e.g., passive filter circuit 1500) including a fixed-value inductor under various humidity conditions according to aspects of this disclosure. In this example, frequency response curve 1602 represents the baseline frequency response. Frequency response curve 1604 represents an example frequency response of passive filter circuit 1500 when the relative humidity is 10%. Frequency response curve 1606 represents an example frequency response of passive filter circuit 1500 when the relative humidity is 50%. Frequency response curve 1608 represents an example frequency response of passive filter circuit 1500 when the relative humidity is 100%. Based on the teachings of this disclosure, it will be appreciated that various filter configurations combining a fixed inductor and a moisture-sensitive capacitor will provide different frequency response curves under different humidity conditions.

[0069] The disclosed moisture sensor can be used in different packaging scenarios. Figure 17 An example package scenario 1700 for electronic circuitry including multiple moisture sensors according to various aspects of this disclosure is illustrated. In package scenario 1700, electronic circuitry 1702 is mounted on or formed in substrate 1704. Electronic circuitry 1702 is defined on all sides by moisture barriers 1710. (Figures 1 to...) Figure 7In any of the disclosed moisture sensor configurations shown, a plurality of moisture sensors 1708 are mounted on or formed in a region outside the moisture barrier 1710 of the same substrate 1704 as the electronic circuitry 1702. According to certain aspects of this disclosure, the electronic circuitry 1702 may include components (e.g., frequency filter / generator components, sensing circuit components, heating element control system components, etc.) connected to facilitate the functioning of the moisture sensors 1708 when they act as humidity detectors.

[0070] Figure 18 An example package scenario 1800 for electronic circuitry including multiple moisture sensors according to various aspects of this disclosure is illustrated. In package scenario 1800, electronic circuitry 1802 is mounted on or formed in a substrate 1804. (Figures 1 to...) Figure 8 In any of the disclosed moisture sensor configurations shown, a plurality of moisture sensors 1806 are mounted on or formed in a substrate 1804. Each moisture sensor 1806 is separated from the electronic circuitry 1802 by a corresponding moisture barrier 1808. According to certain aspects of this disclosure, the electronic circuitry 1802 may include components (e.g., frequency filter / generator components, sensing circuit components, heating element control system components, etc.) connected to facilitate the functioning of the moisture sensors 1806 when they are acting as humidity detectors.

[0071] Figure 19 An example package scenario 1900 for electronic circuitry including a moisture sensor according to various aspects of the present disclosure is illustrated. In package scenario 1900, electronic circuitry 1902 is mounted on or formed in a substrate 1904. A moisture sensor 1906 having a moisture sensor configuration such as that shown in FIG. 1 is mounted on or formed in the substrate 1904 around the periphery of electronic circuitry 1902. In one aspect, moisture sensor 1906 may be isolated from electronic circuitry 1902 by a moisture barrier 1908. According to certain aspects of the present disclosure, electronic circuitry 1902 may include components (e.g., frequency filter / generator components, sensing circuit components, heating element control system components, etc.) connected to facilitate the functioning of moisture sensor 1906 in its role as a humidity detector.

[0072] Figure 20An example method 2000 for manufacturing a moisture sensor according to various aspects of this disclosure is shown. In operation 2002, a first patterned refractory metal layer is formed over a substrate. In operation 2004, a first dielectric layer is formed on the first patterned refractory metal layer. In operation 2006, a second patterned metal layer is formed on the first dielectric layer. In operation 2008, a second moisture-sensitive dielectric layer is formed on the second patterned metal layer. In operation 2010, a third patterned metal layer is formed on the second moisture-sensitive dielectric layer. Operation 2012 describes an assembly formed from various layers formed in Operations 2002 to 2010, wherein a first patterned refractory metal layer, a first dielectric layer, and a second patterned metal layer form a first capacitor, and a third patterned metal layer, a second moisture-sensitive dielectric layer, and a second patterned metal layer form a moisture-sensitive second capacitor, wherein the second patterned metal layer is shared with the first capacitor, and the first patterned refractory metal layer is further configured to be connected to a power source as a heating element to assist in removing moisture from the second moisture-sensitive dielectric layer of the first capacitor in response to the supply of power to the first patterned refractory metal layer.

[0073] Figure 21 A cross-sectional view of a package 2100, including a surface mount substrate 2102, an integrated device 2103, and an integrated passive device 2105 (e.g., a moisture sensor), is illustrated according to various aspects of this disclosure. The package 2100 may be coupled to a printed circuit board (PCB) 2106 via a plurality of solder interconnects 2110. The PCB 2106 may include at least one board dielectric layer 2160 and a plurality of board interconnects 2162.

[0074] Surface mount substrate 2102 includes at least one dielectric layer 2120 (e.g., a substrate dielectric layer), a plurality of interconnects 2122 (e.g., substrate interconnects), a solder mask layer 2140, and a solder mask layer 2142. Integrated device 2103 can be coupled to surface mount substrate 2102 via a plurality of solder interconnects 2130. Integrated device 2103 can be coupled to surface mount substrate 2102 via a plurality of solder interconnects 2132 and a plurality of solder interconnects 2130. Integrated passive device 2105 can be coupled to surface mount substrate 2102 via a plurality of solder interconnects 2150. Integrated passive device 2105 can be coupled to surface mount substrate 2102 via a plurality of solder interconnects 2152 and a plurality of solder interconnects 2150.

[0075] The package (e.g., 2100) may be implemented in a radio frequency (RF) package. This RF package may be a radio frequency front-end (RFFE) package. The package (e.g., 2100) may be configured to provide wireless fidelity (WiFi) communication and / or cellular communication (e.g., 2G, 3G, 4G, 5G). The package (e.g., 2100) may be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE). The package (e.g., 2100) may be configured to transmit and receive signals with different frequencies and / or communication protocols.

[0076] Figure 22 Example method 2200 for providing or manufacturing a package including an integrated device with a moisture sensor, according to various aspects of this disclosure, is illustrated. In some specific embodiments, Figure 22 Method 2200 can be used to provide or manufacture the invention described in this disclosure. Figure 21 Package 2100. However, method 2200 can be used to provide or manufacture any package described in this disclosure.

[0077] It should be pointed out that, Figure 22 The method may combine one or more processes to simplify and / or clarify the methods for providing or manufacturing packages that include integrated devices (including magnetic layers) and / or integrated passive devices (including magnetic layers). In some specific implementations, the order of the processes may be changed or modified.

[0078] The method (at 2205) provides a substrate (e.g., 2102). The substrate 2102 may be supplied by a vendor or manufactured. The substrate 2102 includes at least one dielectric layer 2120 and a plurality of interconnects 2122. The substrate 2102 may include an embedded trace substrate (ETS). In some embodiments, at least one dielectric layer 2120 may include a prepreg material layer.

[0079] This method (at 2210) couples at least one integrated device (e.g., 2103) to a first surface of a substrate (e.g., 2102). For example, the integrated device 2103 may be coupled to the substrate 2102 via a plurality of solder interconnects 2132 and a plurality of solder interconnects 2130. The plurality of solder interconnects 2132 may be optional. The plurality of solder interconnects 2130 are coupled to a plurality of interconnects 2122. A solder reflow process may be used to couple the integrated device 2103 to the plurality of interconnects via the plurality of solder interconnects 2130.

[0080] The method (at 2210) also couples at least one integrated passive device (e.g., 2105) to a first surface of the substrate (e.g., 2102). For example, the integrated passive device 2105 can be coupled to the substrate 2102 via the plurality of solder interconnects 2152 and the plurality of solder interconnects 2150. The plurality of solder interconnects 2152 can be optional. The plurality of solder interconnects 2150 are coupled to the plurality of interconnects 2122. A solder reflow process can be used to couple the integrated passive device 2105 to the plurality of interconnects via the plurality of solder interconnects 2150.

[0081] This method (at 2215) couples a plurality of solder interconnects (e.g., 2110) to a second surface of a substrate (e.g., 2102). A solder reflow process can be used to couple the plurality of solder interconnects 2110 to the substrate.

[0082] Figure 23 Examples are illustrated of various electronic devices that may integrate any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposer packages, stacked packages (PoP), system-in-package (SiP), or system-on-a-chip (SoC). For example, mobile phone device 2302, laptop computer device 2304, fixed-location terminal device 2306, wearable device 2308, or motor vehicle 2310 may include device 2300 as described herein. For example, device 2300 may be any of the devices and / or integrated circuit (IC) packages described herein. Figure 23 The devices 2302, 2304, 2306, and 2308, as well as vehicle 2310, illustrated herein are merely exemplary. Other electronic devices may also feature device 2300, including but not limited to a group of devices (e.g., electronic devices) comprising: mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units (such as meter reading devices), communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device or any combination thereof that stores or retrieves data or computer instructions.

[0083] Specific implementation examples are described in the following numbering section:

[0084] Aspect 1. A device comprising: a first patterned metal layer; a first dielectric layer disposed on the first patterned metal layer; a second patterned metal layer disposed on the first dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor; a second moisture-sensitive dielectric layer disposed on the second patterned metal layer; and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, wherein the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor, the second patterned metal layer being shared with the first capacitor, and the first patterned metal layer being further configured to be connected to a power source as a heating element to aid in the removal of moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0085] Aspect 2. The device according to aspect 1, the device further comprising: a first frequency-sensitive circuit formed using at least the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes based at least on a variable capacitance value of the second capacitor generated by the second moisture-sensitive dielectric layer being exposed to moisture.

[0086] Aspect 3. The device according to aspect 2, wherein: the first dielectric layer is formed of a moisture-insensitive dielectric material; and the first capacitor is configured as a first reference capacitor in the first frequency-sensitive circuit.

[0087] Aspect 4. The device according to aspect 1, wherein: the first dielectric layer is formed as a moisture-sensitive dielectric layer to form the first capacitor as a moisture-sensitive capacitor.

[0088] Aspect 5. The device according to aspect 4, the device further comprising: a second frequency-sensitive circuit formed using the first capacitor and the second capacitor, wherein the second frequency-sensitive circuit has a second frequency response that is changed at least based on the variable capacitance values ​​of the first capacitor and the second capacitor caused by exposure of the first dielectric layer and the second moisture-sensitive dielectric layer to moisture.

[0089] Aspect 6. The device according to any one of Aspects 1 to 5, the device further comprising: a fourth patterned metal layer, the fourth patterned metal layer being disposed coplanar with the first patterned metal layer, wherein the first patterned metal layer and the fourth patterned metal layer are formed of the same metal; a third dielectric layer, the third dielectric layer being disposed on the fourth patterned metal layer and coplanar with the first dielectric layer; a fifth patterned metal layer, the fifth patterned metal layer being disposed on the third dielectric layer and coplanar with the second patterned metal layer, wherein the fourth patterned metal layer, the third dielectric layer and the fifth patterned metal layer form a third capacitor; a fourth dielectric layer, the fourth dielectric layer being disposed on the fifth patterned metal layer and coplanar with the second moisture-sensitive dielectric layer; and a sixth patterned metal layer, the sixth patterned metal layer being disposed on the fourth dielectric layer and coplanar with the third patterned metal layer, wherein the sixth patterned metal layer, the fourth dielectric layer and the fifth patterned metal layer form a fourth capacitor, wherein the fifth patterned metal layer is shared with the third capacitor.

[0090] Aspect 7. The device according to aspect 6, wherein: the first dielectric layer, the third dielectric layer and the fourth dielectric layer are formed of a moisture-insensitive dielectric material.

[0091] Aspect 8. The device according to any one of Aspects 6 to 7, the device further comprising: a third frequency-sensitive circuit formed using the first capacitor, the second capacitor, the third capacitor and the fourth capacitor, wherein the third frequency-sensitive circuit has a third frequency response that is changed at least based on the variable capacitance value of the second capacitor caused by the second moisture-sensitive dielectric layer being exposed to moisture.

[0092] Aspect 9. The device according to aspect 6, wherein: the fourth dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer to form the fourth capacitor as a moisture-sensitive capacitor.

[0093] Aspect 10. The device according to aspect 9, further comprising: a fourth frequency-sensitive circuit formed using the first capacitor, the second capacitor, the third capacitor, and the fourth capacitor, wherein the fourth frequency-sensitive circuit has a fourth frequency response that is changed at least based on the variable capacitance values ​​of the second capacitor and the fourth capacitor caused by exposure of the second moisture-sensitive dielectric layer and the fourth dielectric layer to moisture.

[0094] Aspect 11. The device according to aspect 10, wherein: the first dielectric layer and the third dielectric layer are formed of the same moisture-insensitive dielectric material; and the first capacitor and the third capacitor are configured as reference capacitors in the fourth frequency-sensitive circuit.

[0095] Aspect 12. The device according to any one of Aspects 6 to 11, wherein: the first capacitor and the second capacitor are separated from the third capacitor and the fourth capacitor by an isolation structure formed of a dielectric material, wherein the dielectric material includes an air gap for further isolating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor.

[0096] Aspect 13. The device according to any one of Aspects 1 to 12, wherein: the third patterned metal layer is further configured to be connected to the power supply as another heating element to help remove moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0097] Aspect 14. The device according to any one of Aspects 1 to 12, the device further comprising: a seventh patterned metal layer disposed on the third patterned metal layer, wherein the seventh patterned metal layer is further configured to be connected to the power source as another heating element.

[0098] Aspect 15. The device according to aspect 14, wherein the third patterned metal layer and the seventh patterned metal layer are formed of the same metal.

[0099] Aspect 16. The device according to any one of Aspects 14 to 15, the device further comprising: a fifth dielectric layer disposed on the seventh patterned metal layer; and an eighth patterned metal layer disposed on the fifth dielectric layer, wherein the seventh patterned metal layer, the fifth dielectric layer, and the eighth patterned metal layer form a fifth capacitor.

[0100] Aspect 17. The device according to any one of Aspects 1 to 16, the device further comprising: a heating element control system configured to provide power to the first patterned metal layer to control the heating of the first patterned metal layer.

[0101] Aspect 18. A method of forming a moisture sensor, the method comprising: forming a first patterned metal layer overlying a substrate; forming a first dielectric layer on the first patterned metal layer; forming a second patterned metal layer on the first dielectric layer; forming a second moisture-sensitive dielectric layer on the second patterned metal layer; and forming a third patterned metal layer on the second moisture-sensitive dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor, the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor, the second patterned metal layer being shared with the first capacitor, and the first patterned metal layer being further configured to be connected to a power source as a heating element to aid in removing moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0102] Aspect 19. The method according to aspect 18, the method further comprising: connecting a first frequency-sensitive circuit to the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes based at least on a variable capacitance value of the second capacitor generated by the second moisture-sensitive dielectric layer being exposed to moisture.

[0103] Aspect 20. The method according to any one of Aspects 18 to 19, wherein the first dielectric layer is formed of a moisture-insensitive dielectric material.

[0104] Aspect 21. The method according to aspect 18, wherein: the first dielectric layer is formed as a moisture-sensitive dielectric layer to form the first capacitor as a moisture-sensitive capacitor.

[0105] Aspect 22. The method according to any one of Aspects 18 to 21, the method further comprising: connecting a heating control circuit to provide power to the first patterned metal layer to control the heating of the first patterned metal layer.

[0106] Aspect 23. The method according to any one of Aspects 18 to 22, the method further comprising: forming a fourth patterned metal layer, the fourth patterned metal layer being disposed coplanar with a first patterned metal layer, wherein the first patterned metal layer and the fourth patterned metal layer are formed of the same metal; forming a third dielectric layer, the third dielectric layer being disposed on the fourth patterned metal layer and coplanar with the first dielectric layer; forming a fifth patterned metal layer, the fifth patterned metal layer being disposed on the third dielectric layer and coplanar with the second patterned metal layer; forming a fourth dielectric layer, the fourth dielectric layer being disposed on the fifth patterned metal layer and coplanar with the second moisture-sensitive dielectric layer; and forming a sixth patterned metal layer, the sixth patterned metal layer being disposed on the fourth dielectric layer and coplanar with the third patterned metal layer, wherein the fourth patterned metal layer, the third dielectric layer and the fifth patterned metal layer form a third capacitor, and the sixth patterned metal layer, the fourth dielectric layer and the fifth patterned metal layer form a fourth capacitor, wherein the fifth patterned metal layer is shared with the third capacitor.

[0107] Aspect 24. The method according to aspect 23, wherein: the first dielectric layer, the third dielectric layer and the fourth dielectric layer are formed of a moisture-insensitive dielectric material.

[0108] Aspect 25. The method according to aspect 23, wherein: the fourth dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer to form the fourth capacitor as a moisture-sensitive capacitor.

[0109] Aspect 26. The method according to aspect 25, wherein: the first dielectric layer and the third dielectric layer are formed of the same moisture-insensitive dielectric material.

[0110] Aspect 27. The method according to any one of Aspects 23 to 26, the method further comprising: forming an isolation structure separating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor, wherein the isolation structure comprises a dielectric material, and wherein the dielectric material further comprises an air gap formed therein for further isolating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor.

[0111] Aspect 28. A moisture sensor, the moisture sensor comprising: a first capacitor having a first patterned metal layer, a first dielectric layer disposed on the first patterned metal layer, and a second patterned metal layer disposed on the first dielectric layer; a second capacitor having a second moisture-sensitive dielectric layer disposed on the second patterned metal layer and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, wherein the second patterned metal layer is shared with the first capacitor; a first frequency-sensitive circuit formed using at least the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes at least based on a variable capacitance value of the second capacitor resulting from exposure of the second moisture-sensitive dielectric layer to moisture; and a heating control circuit configured to provide power to the first patterned metal layer to control heating of the first patterned metal layer, thereby aiding in the removal of moisture from the second moisture-sensitive dielectric layer of the second capacitor.

[0112] Aspect 29. The moisture sensor according to aspect 28, wherein: the first dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer.

[0113] Aspect 30. A moisture sensor according to any one of Aspects 28 to 29, the moisture sensor further comprising: a third capacitor having a fourth patterned metal layer coplanar with the first patterned metal layer, a third dielectric layer disposed on the fourth patterned metal layer and coplanar with the first dielectric layer, and a fifth patterned metal layer disposed on the third dielectric layer and coplanar with the second patterned metal layer; and a fourth capacitor having a fourth moisture-sensitive dielectric layer disposed on the fifth patterned metal layer and coplanar with the second moisture-sensitive dielectric layer, and a sixth patterned metal layer disposed on the fourth moisture-sensitive dielectric layer, wherein the fifth patterned metal layer is shared with the third capacitor.

[0114] Aspect 31. The moisture sensor according to aspect 30, wherein: the first frequency-sensitive circuit is further formed using the third capacitor and the fourth capacitor.

[0115] Aspect 32. The moisture sensor according to aspect 31, wherein: the fourth moisture-sensitive dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer.

[0116] Aspect 33. The moisture sensor according to aspect 32, wherein: the first frequency response is based at least on the variable capacitance values ​​of the second capacitor and the fourth capacitor generated by the exposure of the second moisture-sensitive dielectric layer and the fourth moisture-sensitive dielectric layer to moisture.

[0117] Aspect 34. A moisture sensor according to any one of Aspects 30 to 33, the moisture sensor further comprising: an insulating dielectric material separating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor, wherein the insulating dielectric material includes an air gap formed therein for further isolating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor.

[0118] It should be noted that the accompanying drawings in this disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some instances, the drawings may not be to scale. In some instances, not all components and / or parts are shown for clarity. In some instances, the positioning, location, size, and / or shape of the various parts and / or components in the drawings may be exemplary. In some specific embodiments, the various components and / or parts in the drawings may be optional.

[0119] The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any specific implementation or aspect described herein as “exemplary” is not necessarily to be construed as superior to or better than other aspects of this disclosure. Similarly, the term “aspect” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupled” is used herein to refer to direct or indirect coupling between two objects (e.g., mechanical coupling). For example, if object A physically contacts object B, and object B contacts object C, objects A and C can still be considered coupled to each other, even if they are not in direct physical contact. The term “electrical coupling” can mean that two objects are directly or indirectly coupled together such that current (e.g., signal, power, ground) can ripple between the two objects. Electrically coupled objects may or may not have current flowing between them. The use of the terms “first,” “second,” “third,” and “fourth” (and / or anything above the fourth) is arbitrary. Any component described can be a first component, a second component, a third component, or a fourth component. For example, a component referred to as a second component can be a first component, a second component, a third component, or a fourth component. The term "encapsulation" means that an object may partially or completely encapsulate another object. The terms "top" and "bottom" are arbitrary. A component located at the top may be located above a component located at the bottom. A top component may be considered a bottom component, and vice versa. As described in this disclosure, a first component located "above" a second component may mean that the first component is located above or below the second component, depending on how bottom or top is arbitrarily defined. In another example, a first component may be located above (e.g., on top of) a first surface of the second component, while a third component may be located above (e.g., below) a second surface of the second component, where the second surface is opposite the first surface. It should also be noted that the term "above," as used in this application in the context of one component being on another component, may be used to mean that a component is on and / or in another component (e.g., on the surface of a component or embedded in a component). Therefore, for example, "above the second component" can mean: (1) the first component is above the second component but does not directly contact the second component; (2) the first component is above the second component (e.g., on the surface of the second component); and / or (3) the first component is within the second component (e.g., embedded in the second component). A first component located "in" the second component can be partially or completely within the second component. The terms "about 'value X'" or "approximately value X" as used in this disclosure mean within 10 percent of 'value X'. For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9 to 1.1.

[0120] In some embodiments, an interconnect is a component or assembly in a device or package that allows or facilitates an electrical connection between two points, elements, and / or assemblies. In some embodiments, an interconnect may include traces, vias, pads, pillars, metallization layers, redistribution layers, and / or under-bump metallization (UBM) layers / interconnects. In some embodiments, an interconnect may include a conductive material configured to provide an electrical path for signals (e.g., data signals), ground, and / or power. An interconnect may include more than one element or assembly. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Different embodiments may use different processes and / or steps to form interconnects. In some embodiments, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, spraying, and / or plating processes may be used to form interconnects.

[0121] It should also be noted that the various disclosures contained herein can be described as processes depicted as work diagrams, flowcharts, structural diagrams, or block diagrams. Although flowcharts may describe operations as sequential processes, many operations within an operation can be performed in parallel or concurrently. Furthermore, the order of operations can be rearranged. The process terminates when its operations are completed.

[0122] As can be seen in the detailed description above, different features are grouped together in the examples. This manner of disclosure should not be construed as an intention to have more features in the example aspects than are explicitly mentioned in each aspect. Rather, the various aspects of this disclosure may include fewer features than those in the individual example aspects disclosed. Therefore, the following aspects should be regarded accordingly as incorporated into the description, where each aspect can be considered as a separate example on its own. Although each dependent aspect may refer in the aspect to a particular combination with one aspect of other aspects, the aspect of the dependent aspect is not limited to that particular combination. It should be understood that other example aspects may also include combinations of the subject matter of a dependent aspect with any other dependent or independent aspect, or any feature combined with other dependent and independent aspects. The various aspects disclosed herein explicitly include these combinations unless explicitly stated or can be readily inferred that a particular combination is not intended for use (e.g., contradictory aspects, such as defining an element as both an electrical insulator and an electrical conductor). Furthermore, it is contemplated that aspects of an aspect may be included in any other independent aspect, even if that aspect does not directly depend on the independent aspect.

[0123] While the foregoing disclosure illustrates exemplary aspects of this disclosure, it should be noted that various changes and modifications may be made herein without departing from the scope of this disclosure as defined by the appended claims. The functions, steps, and / or actions of the method claims according to the aspects of this disclosure described herein need not be performed in any particular order. Furthermore, although elements of this disclosure may be described or claimed in the singular, the plural form may also be considered unless explicitly stated as limited to the singular.

Claims

1. A device, the device comprising: First patterned metal layer; A first dielectric layer is disposed on the first patterned metal layer; A second patterned metal layer is disposed on the first dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor; The second moisture-sensitive dielectric layer is disposed on the second patterned metal layer; and A third patterned metal layer is disposed on the second moisture-sensitive dielectric layer, wherein... The third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor. The second patterned metal layer is shared with the first capacitor, and The first patterned metal layer is further configured to be connected to a power source as a heating element to help remove moisture from the second moisture-sensitive dielectric layer of the second capacitor.

2. The device according to claim 1, further comprising: A first frequency-sensitive circuit, formed using at least the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes based at least on the variable capacitance value of the second capacitor caused by the second moisture-sensitive dielectric layer being exposed to moisture.

3. The device according to claim 2, wherein: The first dielectric layer is formed of a moisture-insensitive dielectric material; and The first capacitor is configured as the first reference capacitor in the first frequency-sensitive circuit.

4. The device according to claim 1, wherein: The first dielectric layer is formed as a moisture-sensitive dielectric layer to form the first capacitor as a moisture-sensitive capacitor.

5. The device according to claim 4, further comprising: A second frequency-sensitive circuit is formed using the first capacitor and the second capacitor, wherein the second frequency-sensitive circuit has a second frequency response that is changed based at least on the variable capacitance values ​​of the first capacitor and the second capacitor caused by the exposure of the first dielectric layer and the second moisture-sensitive dielectric layer to moisture.

6. The device according to claim 1, further comprising: A fourth patterned metal layer, wherein the fourth patterned metal layer is disposed on the same plane as the first patterned metal layer, and wherein the first patterned metal layer and the fourth patterned metal layer are formed of the same metal; A third dielectric layer is disposed on the fourth patterned metal layer and is coplanar with the first dielectric layer; A fifth patterned metal layer is disposed on the third dielectric layer and is coplanar with the second patterned metal layer, wherein the fourth patterned metal layer, the third dielectric layer and the fifth patterned metal layer form a third capacitor; A fourth dielectric layer is disposed on the fifth patterned metal layer and is coplanar with the second moisture-sensitive dielectric layer; and A sixth patterned metal layer is disposed on the fourth dielectric layer and is coplanar with the third patterned metal layer, wherein the sixth patterned metal layer, the fourth dielectric layer, and the fifth patterned metal layer form a fourth capacitor, wherein the fifth patterned metal layer is shared with the third capacitor.

7. The device according to claim 6, wherein: The first dielectric layer, the third dielectric layer, and the fourth dielectric layer are formed of a moisture-insensitive dielectric material.

8. The device according to claim 6, further comprising: A third frequency-sensitive circuit is formed using the first capacitor, the second capacitor, the third capacitor, and the fourth capacitor, wherein the third frequency-sensitive circuit has a third frequency response that changes based at least on the variable capacitance value of the second capacitor caused by the second moisture-sensitive dielectric layer being exposed to moisture.

9. The device according to claim 6, wherein: The fourth dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer to form the fourth capacitor as a moisture-sensitive capacitor.

10. The device according to claim 9, further comprising: A fourth frequency-sensitive circuit is formed using the first capacitor, the second capacitor, the third capacitor, and the fourth capacitor, wherein the fourth frequency-sensitive circuit has a fourth frequency response that is changed based at least on the variable capacitance values ​​of the second capacitor and the fourth capacitor caused by the exposure of the second moisture-sensitive dielectric layer and the fourth dielectric layer to moisture.

11. The device according to claim 10, wherein: The first dielectric layer and the third dielectric layer are formed of the same moisture-insensitive dielectric material; and The first capacitor and the third capacitor are configured as reference capacitors in the fourth frequency-sensitive circuit.

12. The device according to claim 6, wherein: The first capacitor and the second capacitor are separated from the third capacitor and the fourth capacitor by an isolation structure formed of dielectric material, wherein the dielectric material includes an air gap for further isolating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor.

13. The device according to claim 1, wherein: The third patterned metal layer is further configured to be connected to the power source as another heating element to help remove moisture from the second moisture-sensitive dielectric layer of the second capacitor.

14. The device according to claim 1, further comprising: A seventh patterned metal layer is disposed on the third patterned metal layer, wherein the seventh patterned metal layer is further configured to be connected to the power source as another heating element.

15. The device according to claim 14, wherein: The third patterned metal layer and the seventh patterned metal layer are formed of the same metal.

16. The device of claim 14, further comprising: The fifth dielectric layer is disposed on the seventh patterned metal layer; and An eighth patterned metal layer is disposed on the fifth dielectric layer, wherein the seventh patterned metal layer, the fifth dielectric layer, and the eighth patterned metal layer form a fifth capacitor.

17. The device according to claim 1, further comprising: A heating element control system configured to provide power to the first patterned metal layer to control the heating of the first patterned metal layer.

18. A method for forming a moisture sensor, the method comprising: A first patterned metal layer is formed covering the substrate; A first dielectric layer is formed on the first patterned metal layer; A second patterned metal layer is formed on the first dielectric layer; A second moisture-sensitive dielectric layer is formed on the second patterned metal layer; as well as A third patterned metal layer is formed on the second moisture-sensitive dielectric layer, wherein... The first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor. The third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor. The second patterned metal layer is shared with the first capacitor, and The first patterned metal layer is further configured to be connected to a power source as a heating element to help remove moisture from the second moisture-sensitive dielectric layer of the second capacitor.

19. The method according to claim 18, further comprising: A first frequency-sensitive circuit is connected to the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes based at least on the variable capacitance value of the second capacitor caused by the second moisture-sensitive dielectric layer being exposed to moisture.

20. The method of claim 18, wherein The first dielectric layer is formed of a moisture-insensitive dielectric material.

21. The method according to claim 18, wherein: The first dielectric layer is formed as a moisture-sensitive dielectric layer to form the first capacitor as a moisture-sensitive capacitor.

22. The method according to claim 18, further comprising: A heating control circuit is connected to provide power to the first patterned metal layer to control the heating of the first patterned metal layer.

23. The method according to claim 18, further comprising: A fourth patterned metal layer is formed, the fourth patterned metal layer being disposed coplanarly with the first patterned metal layer, wherein the first patterned metal layer and the fourth patterned metal layer are formed of the same metal; A third dielectric layer is formed, which is disposed on the fourth patterned metal layer and is coplanar with the first dielectric layer; A fifth patterned metal layer is formed, the fifth patterned metal layer being disposed on the third dielectric layer and coplanar with the second patterned metal layer; A fourth dielectric layer is formed, which is disposed on the fifth patterned metal layer and is coplanar with the second moisture-sensitive dielectric layer; as well as A sixth patterned metal layer is formed, which is disposed on the fourth dielectric layer and is coplanar with the third patterned metal layer. in The fourth patterned metal layer, the third dielectric layer, and the fifth patterned metal layer form a third capacitor, and The sixth patterned metal layer, the fourth dielectric layer, and the fifth patterned metal layer form a fourth capacitor, wherein the fifth patterned metal layer is shared with the third capacitor.

24. The method according to claim 23, wherein: The first dielectric layer, the third dielectric layer, and the fourth dielectric layer are formed of a moisture-insensitive dielectric material.

25. The method according to claim 23, wherein: The fourth dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer to form the fourth capacitor as a moisture-sensitive capacitor.

26. The method of claim 25, wherein: The first dielectric layer and the third dielectric layer are formed of the same moisture-insensitive dielectric material.

27. The method according to claim 23, further comprising: An isolation structure is formed to separate the first capacitor and the second capacitor from the third capacitor and the fourth capacitor, wherein the isolation structure includes a dielectric material, and wherein the dielectric material further includes an air gap formed therein for further isolating the first capacitor and the second capacitor from the third capacitor and the fourth capacitor.

28. A moisture sensor, the moisture sensor comprising: A first capacitor has a first patterned metal layer, a first dielectric layer disposed on the first patterned metal layer, and a second patterned metal layer disposed on the first dielectric layer. The second capacitor has a second moisture-sensitive dielectric layer disposed on the second patterned metal layer and a third patterned metal layer disposed on the second moisture-sensitive dielectric layer, wherein the second patterned metal layer is shared with the first capacitor. A first frequency-sensitive circuit, the first frequency-sensitive circuit being formed using at least the first capacitor and the second capacitor, wherein the first frequency-sensitive circuit has a first frequency response that changes based at least on the variable capacitance value of the second capacitor caused by the second moisture-sensitive dielectric layer being exposed to moisture; and A heating control circuit is configured to provide power to the first patterned metal layer to control the heating of the first patterned metal layer, thereby helping to remove moisture from the second moisture-sensitive dielectric layer of the second capacitor.

29. The moisture sensor according to claim 28, wherein: The first dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer.

30. The moisture sensor according to claim 28, further comprising: The third capacitor has a fourth patterned metal layer coplanar with the first patterned metal layer, a third dielectric layer disposed on the fourth patterned metal layer and coplanar with the first dielectric layer, and a fifth patterned metal layer disposed on the third dielectric layer and coplanar with the second patterned metal layer. and The fourth capacitor has a fourth moisture-sensitive dielectric layer disposed on the fifth patterned metal layer and coplanar with the second moisture-sensitive dielectric layer, and a sixth patterned metal layer disposed on the fourth moisture-sensitive dielectric layer, wherein the fifth patterned metal layer is shared with the third capacitor.

31. The moisture sensor according to claim 30, wherein: The first frequency-sensitive circuit is further formed using the third capacitor and the fourth capacitor.

32. The moisture sensor according to claim 31, wherein: The fourth moisture-sensitive dielectric layer is formed of the same moisture-sensitive dielectric material as the second moisture-sensitive dielectric layer.

33. The moisture sensor according to claim 32, wherein: The first frequency response is based at least on the variable capacitance values ​​of the second capacitor and the fourth capacitor caused by the exposure of the second moisture-sensitive dielectric layer and the fourth moisture-sensitive dielectric layer to moisture.

34. The moisture sensor according to claim 30, further comprising: An isolation dielectric material that separates the first and second capacitors from the third and fourth capacitors, wherein the isolation dielectric material includes air gaps formed therein for further isolating the first and second capacitors from the third and fourth capacitors.

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