Structure for light-emitting panel and method for manufacturing same

Abstract

Provided is a method for manufacturing a structure for a light-emitting panel, whereby partition walls can be formed with excellent resolution. A method for manufacturing a structure for a light-emitting panel includes: disposing a laminated resin layer on a substrate having a pattern conductor, the laminated resin layer including a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer; applying an active energy ray to the laminated resin layer for exposure, and then developing to form a pattern image on the substrate; performing heat treatment on the pattern image to form a laminated partition wall on the substrate, wherein the laminated partition wall comprises a first partition wall and a second partition wall; and disposing a semiconductor light-emitting element in a recess defined by the laminated partition wall, the semiconductor light-emitting element being connected to the pattern conductor. The first photosensitive thermosetting resin layer is disposed so as to be in contact with the base material, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer so as to be isolated from the base material. The first partition wall is disposed in contact with the base material, and the second partition wall is disposed on the first partition wall so as to be isolated from the base material. The first partition walls have an average reflectance of 30% or more in a wavelength range of 430 nm to 750 nm inclusive, and the second partition walls have an average absorbance of 0.5 to 10 inclusive in a wavelength range of 430 nm to 750 nm inclusive.

Description

Technical Field

[0001] This invention relates to a structure for a light-emitting panel and a method for manufacturing the same. Background Technology

[0002] As a flat panel display, a micro LED display is known, which is constructed by arranging small light-emitting elements on a substrate. For example, Japanese Patent Application Publication No. 2020-205417 discloses a micro LED display device, which is formed by forming a partition on a micro LED array substrate. The partition has an inverted conical or T-shaped light-shielding part and a reflective part provided on the side of the light-shielding part. Summary of the Invention

[0003] The problem to be solved by the present invention One embodiment of the present invention aims to provide a method for manufacturing a light-emitting panel structure that can form the partition with excellent resolution.

[0004] Methods for solving problems The present invention includes the following embodiments.

[0005] [1] A method for manufacturing a structure for a light-emitting panel, comprising: A laminated resin layer is disposed on a substrate having a patterned conductor, the laminated resin layer comprising a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer. The laminated resin layer is exposed to active energy rays and then developed to form a patterned image on the substrate. The pattern image is heat-treated to form a stacked partition wall on a substrate, the stacked partition wall comprising a first partition wall and a second partition wall; and A semiconductor light-emitting element is disposed in the recess defined by the stacked partitions, and the semiconductor light-emitting element is connected to the patterned conductor, wherein... The first photosensitive thermosetting resin layer is configured to be in contact with the substrate, and the second photosensitive thermosetting resin layer is configured on the first photosensitive thermosetting resin layer in a manner that isolates it from the substrate. The first partition wall is configured to be in contact with the substrate, and the second partition wall is configured on the first partition wall in a manner that isolates it from the substrate. The first partition has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, and the second partition has an average absorbance of 0.5 or more and 10 or less in the wavelength range of 430 nm to 750 nm.

[0006] [2] The method for manufacturing a light-emitting panel structure as described in [1], wherein the first photosensitive thermosetting resin layer comprises a white pigment, an alkali-soluble resin, and a thermosetting resin. The second photosensitive thermosetting resin layer comprises a colorant, an alkali-soluble resin, and a thermosetting resin.

[0007] [3] A method for manufacturing a light-emitting panel structure as described in [1] or [2], wherein the laminated resin layer is configured by a forming method comprising the following steps: A first photosensitive thermosetting resin layer is formed by applying a first photosensitive thermosetting resin composition to the substrate; and A second photosensitive thermosetting resin layer is formed by applying a second photosensitive thermosetting resin composition onto a first photosensitive thermosetting resin layer.

[0008] [4] A method for manufacturing a light-emitting panel structure as described in [1] or [2], wherein the laminated resin layer is configured by a forming method comprising the following steps: A dry film is laminated on the substrate, the dry film being composed of a first photosensitive thermosetting resin layer, a second photosensitive thermosetting resin layer, and a support film; and Remove the support membrane.

[0009] [5] A method for manufacturing a light-emitting panel structure as described in any one of [1] to [4], wherein the thickness of the first partition wall in a direction orthogonal to the main surface of the substrate is 0.5µm or more and 50µm or less, and the thickness of the second partition wall in a direction orthogonal to the main surface of the substrate is 0.5µm or more and 10µm or less.

[0010] [6] A structure for a light-emitting panel, comprising: Substrate with patterned conductors; A stacked partition wall, disposed on the substrate and comprising a first partition wall and a second partition wall; and A semiconductor light-emitting element is disposed in the recess defined by the stacked partitions and connected to the patterned conductor, wherein... The first partition is configured to be in contact with the substrate and has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm. The second partition is disposed on the first partition in a way that isolates it from the substrate, and has an average absorbance of 0.5 or more and 10 or less in a wavelength range of 430 nm or more and 750 nm or less.

[0011] [7] The light-emitting panel structure as described in [6], wherein the thickness of the first partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 50µm or less, and the thickness of the second partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 10µm or less.

[0012] The effects of the invention According to one embodiment of the present invention, a method for manufacturing a light-emitting panel structure that can form partitions with excellent resolution can be provided. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing an example of a structure for a light-emitting panel. Detailed Implementation

[0014] In this specification, the term "step" does not refer only to an independent step. Even if it cannot be clearly distinguished from other steps, it is included in this term if the desired purpose of the step can be achieved. Furthermore, regarding the content of each component in the composition, if multiple substances conforming to each component are present in the composition, unless otherwise specified, it refers to the total amount of the multiple substances present in the composition. In addition, the upper and lower limits of the numerical ranges described in this specification can be arbitrarily selected as the numerical values ​​exemplified in the numerical ranges and combined. The solid components in the composition and its components are the residues after removing volatile components (e.g., organic solvents) from the composition and its components. Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. However, the embodiments shown below are examples of a light-emitting panel structure and its manufacturing method used to embody the technical concept of the present invention, and the present invention is not limited to the light-emitting panel structure and its manufacturing method shown below.

[0015] Manufacturing method of structure for light-emitting panel A method for manufacturing a structure for a light-emitting panel includes: a first step of disposing a laminated resin layer on a substrate having a patterned conductor, the laminated resin layer comprising a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer; a second step of exposing the laminated resin layer to active energy rays and then developing it to form a pattern image on the substrate; a third step of heat-treating the pattern image to form a laminated partition on the substrate, the laminated partition comprising a first partition and a second partition; and a fourth step of disposing a semiconductor light-emitting element in a recess defined by the laminated partition, the semiconductor light-emitting element being connected to the patterned conductor. In the first step, the first photosensitive thermosetting resin layer is disposed in contact with the substrate, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer in a manner isolated from the substrate. The first partition formed in the third step is disposed in contact with the substrate, and the first partition has an average reflectance of 30% or more in a wavelength range of 430 nm or more and 750 nm or less. In addition, the second partition is disposed on the first partition in a way that isolates it from the substrate, and the average absorbance of the second partition is 0.5 or more and 10 or less in the wavelength range of 430 nm or more and 750 nm or less.

[0016] In the manufacturing method of the light-emitting panel structure, after exposing the laminated resin layers to active energy rays and then developing them, laminated spacers can be formed with excellent resolution. This can be attributed, for example, to the fact that the second photosensitive thermosetting resin layer, with its lower reflectivity, suppresses reflections from the first photosensitive thermosetting resin layer, which has higher reflectivity. Furthermore, since the semiconductor light-emitting elements are placed after the laminated spacers are pre-formed, the semiconductor light-emitting elements can be precisely positioned. Moreover, because the position and height of the spacers can be precisely controlled, a light-emitting panel structure achieving good color balance and high current efficiency can be effectively manufactured.

[0017] First step In the first step, a laminated resin layer is disposed on a substrate having a patterned conductor. This laminated resin layer comprises a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer. Examples of substrates for which the laminated resin layer is disposed include silicon wafers, silicon oxide wafers, glass substrates, and epoxy glass substrates. The thickness of the substrate can be, for example, 0.1 mm or more and 2.5 mm or less. The substrate has a patterned conductor that can be connected to a semiconductor light-emitting element. The patterned conductor can also form a circuit in a manner that allows power to be supplied to the semiconductor light-emitting element. The material forming the patterned conductor can be, for example, copper. Alternatively, the patterned conductor can be treated with an anti-oxidation coating of gold, tin, silver, nickel / gold, nickel / palladium / gold, etc.

[0018] The laminated resin layers disposed on a substrate include a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer. The first photosensitive thermosetting resin layer is disposed in contact with the substrate, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer in a manner isolated from the substrate. The first and second photosensitive thermosetting resin layers can be directly laminated to be in contact with each other, or they can be laminated with other layers in between. Furthermore, the first photosensitive thermosetting resin layer can be formed from a first photosensitive thermosetting resin composition, and the second photosensitive thermosetting resin layer can be formed from a second photosensitive thermosetting resin composition. Details regarding the first and second photosensitive thermosetting resin compositions will be described later.

[0019] The thickness of the first photosensitive thermosetting resin layer in the laminated resin layers can be, for example, 0.5µm or more and 50µm or less, preferably 5µm or more, and more preferably 10µm or more. Furthermore, the thickness of the first photosensitive thermosetting resin layer in the laminated resin layers is preferably 30µm or less, and more preferably 20µm or less. The thickness of the second photosensitive thermosetting resin layer can be, for example, 0.5µm or more and 10µm or less, preferably 2µm or more, and more preferably 3µm or more. Furthermore, the thickness of the second photosensitive thermosetting resin layer is preferably 6µm or less, and more preferably 5µm or less. The ratio of the thickness of the first photosensitive thermosetting resin layer to the thickness of the second photosensitive thermosetting resin layer can be, for example, 0.5 or more and 10 or less, preferably 1 or more and 5 or less. Here, the thickness of the first photosensitive thermosetting resin layer refers to its thickness in the direction orthogonal to the main surface of the substrate; the same applies to the thickness of the second photosensitive thermosetting resin layer and the laminated resin layers.

[0020] As a method for configuring a laminated resin layer, an example is the following: after forming a first photosensitive thermosetting resin layer by applying a first photosensitive thermosetting resin composition to a substrate, a second photosensitive thermosetting resin composition is applied to form a second photosensitive thermosetting resin layer. The first photosensitive thermosetting resin layer may be a dried film formed by drying the applied first photosensitive thermosetting resin composition through heating, vacuum drying, or the like, or a semi-cured film obtained by heat treatment after drying. Similarly, the second photosensitive thermosetting resin layer may be a dried film formed by drying the applied second photosensitive thermosetting resin composition through heating, vacuum drying, or the like, or a semi-cured film obtained by heat treatment after drying. Furthermore, the laminated resin layer may also be configured by simultaneously applying two layers, with the first photosensitive thermosetting resin composition as the lower layer and the second photosensitive thermosetting resin composition as the upper layer.

[0021] Examples of methods for applying the first or second photosensitive thermosetting resin composition include: dip coating, flow coating, roller coating, bar coating, screen printing, curtain coating, die coating, spin coating, etc. Examples of drying methods for the first or second photosensitive thermosetting resin composition include: using equipment equipped with a heat source that utilizes steam heating, such as a hot air circulating drying oven, IR oven, heating plate, or convection oven, and making the hot air inside the dryer convect and contact the components; and methods that blow air onto the support through nozzles.

[0022] Alternatively, for the deposition of the laminated resin layer onto a substrate, a dry film formed by depositing a resin composition layer on a film can be used. The laminated resin layer can be configured by: separately preparing a first photosensitive thermosetting resin composition and a second photosensitive thermosetting resin composition into dry film forms, and then sequentially laminating the resulting substances onto a substrate. Alternatively, the laminated resin layer can also be configured by: preparing a two-layer dry film form of the first photosensitive thermosetting resin composition and the second photosensitive thermosetting resin composition, and then laminating the resulting substance onto a substrate.

[0023] The laminator can be a commercially available vacuum heating and pressurizing type laminator. Lamination can also be performed continuously using a laminator. Furthermore, the lamination step can be performed using other equipment. In this case, in addition to using a vacuum laminator, a roller laminator, a vacuum roller laminator, or a vacuum press can also be used. Vacuum pressing can be performed using commercially available equipment, such as multi-stage pressing, multi-stage vacuum pressing, rapid pressing, continuous forming, and autoclave forming machines. The operating conditions for the above-mentioned laminators are, for example, within the range of 60°C to 130°C, pressure 0.1MPa to 0.7MPa, heating and pressurizing time 1 second to 90 seconds, vacuum degree 10Pa to 10,000Pa, and vacuum time 1 second to 90 seconds.

[0024] The film constituting the dry film can be either a support film or a protective film. The film can be a plastic film that can be peeled off from the resin composition layer. There are no particular limitations on the film thickness, but it can be appropriately selected in the range of, for example, 10µm to 150µm. When the resin composition layer consists of two layers, the interfaces between the layers can also fuse from the viewpoint of coating strength.

[0025] A dry film is formed by supporting or protecting at least one side of a resin composition layer. The resin composition layer of the dry film can be composed of either a first photosensitive thermosetting resin composition or a second photosensitive thermosetting resin composition. Alternatively, it can be formed by laminating a second photosensitive thermosetting resin layer onto the film, and then laminating a first photosensitive thermosetting resin layer onto the second photosensitive thermosetting resin layer, wherein the second photosensitive thermosetting resin layer is formed of the second photosensitive thermosetting resin composition, and the first photosensitive thermosetting resin layer is formed of the first photosensitive thermosetting resin composition. The dry film can be manufactured, for example, by first diluting the resin composition constituting the resin composition layer with an organic solvent to adjust it to an appropriate viscosity, and then applying the resin composition to a support film (also called a carrier film) using conventional methods such as a corner-roller coater. Then, drying is performed at a temperature of, for example, 50°C to 140°C for 1 to 30 minutes, thereby producing a dry film, which is a dried coating film, i.e., a resin composition layer, formed on a support film. When the resin composition layer is formed from multiple different resin compositions, the resin composition layers forming the upper layers are sequentially formed on the support film as described above. To prevent dust from adhering to the coating surface, a peelable protective film (covering film) can be further laminated on the dry film. Existing known plastic films can be appropriately used for both the support film and the protective film, and regarding the protective film, its adhesion force is preferably less than the adhesion force between the resin layer and the support film when peeling it off.

[0026] Second step In the second step, the laminated resin layer formed on the substrate in the first step is exposed to active energy rays and then developed to form a pattern image with the desired shape on the substrate. By exposing the laminated resin layer comprising a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer to active energy rays, a pattern image can be formed with high precision. This pattern image can form laminated partitions, which include a first partition with high average reflectivity and a second partition with high average absorbance. Furthermore, the second photosensitive thermosetting resin layer can suppress the reflection of active energy rays, thus enabling the formation of a pattern image with high resolution.

[0027] The active energy rays are applied to form a pattern and then exposed, thereby photocuring the exposed portion of the laminated resin layer to form a patterned image. The exposure machine used for irradiating with active energy rays can be equipped with a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a mercury short-arc lamp, etc., and can irradiate ultraviolet light in a wavelength range of 350 nm to 450 nm. The mask used to form the patterned image can be a negative mask. Furthermore, a direct drawing device (e.g., a direct imaging device that can directly irradiate active energy rays to form an image based on CAD data from a computer) can also be used for irradiation with active energy rays. As the light source for the direct drawing device, a light source with a maximum wavelength in the range of 350 nm to 410 nm can be used. The exposure amount used to form the patterned image varies depending on the film thickness, but can be, for example, 20 mJ / cm². 2 Above 800mJ / cm 2 The value is below, and preferably set to 20 mJ / cm. 2 Above and 600mJ / cm 2 Within the following range.

[0028] As a developing method, methods such as immersion, spraying, misting, and brushing can be used. As a developing solution, alkaline aqueous solutions of inorganic bases such as potassium hydroxide, sodium hydroxide, sodium carbonate, sodium phosphate, and sodium silicate, as well as organic bases such as ammonia, amines, and tetramethylammonium hydroxide, can be used.

[0029] Third step In the third step, the pattern image formed on the substrate is heat-treated to form a stacked partition wall on the substrate, which includes a first partition wall and a second partition wall. In the third step, the pattern image is cured with a thermosetting resin to form the stacked partition wall including the first and second partition walls. The curing of the thermosetting resin is, for example, a ring-opening reaction of epoxy resin, thus suppressing strain or curing shrinkage compared to curing using photoradical reactions.

[0030] The heat treatment temperature in the third step can be, for example, 120°C or higher, preferably 150°C or higher and 190°C or lower. The heat treatment time can be, for example, 20 minutes or more and 180 minutes or less, preferably 50 minutes or more and 100 minutes or less. The heat treatment can be carried out using, for example, a hot air circulating drying oven or an IR furnace.

[0031] The laminated partition formed in the third step includes a first partition and a second partition. The first partition is configured to be in contact with the substrate, and the second partition is disposed on the first partition in a way that isolates it from the substrate. The first partition and the second partition can be laminated together, either in contact or with an intermediate partition. The thickness of the first partition in the direction orthogonal to the main surface of the substrate (hereinafter also referred to as "first partition height") is, for example, 0.5µm or more and 50µm or less, preferably 5µm or more, more preferably 10µm or more, and more preferably 30µm or less, more preferably 20µm or less. The thickness of the second partition in the direction orthogonal to the main surface of the substrate (hereinafter also referred to as "second partition height") is, for example, 0.5µm or more and 10µm or less, preferably 2µm or more, more preferably 3µm or more, and more preferably 6µm or less, more preferably 5µm or less. The ratio of the height of the second partition wall to the sum of the heights of the first partition wall and the second partition wall may be, for example, 0.1 or more and 0.8 or less, preferably 0.15 or more, more preferably 0.2 or more, and more preferably 0.6 or less, more preferably 0.4 or less, and even more preferably 0.3 or less.

[0032] Multiple recesses, defined by the stacked partitions, can be formed on the substrate in the third step. The arrangement pattern of the recesses on the substrate can be, for example, a grid pattern.

[0033] The average reflectance of the first partition wall in the wavelength range of 430 nm to 750 nm is 30% or more, preferably 50% or more, and more preferably 60% or more. Furthermore, the average reflectance of the first partition wall may be, for example, 99% or less. The average reflectance of the first partition wall can be measured, for example, in the following manner: A resin composition layer with a thickness of 10 µm is formed from the first photosensitive thermosetting resin composition forming the first partition wall, and light with a peak wavelength in the wavelength range of 350 nm to 450 nm at 300 mJ / cm² is applied. 2 The material is then photocured, developed with 1% sodium carbonate, and the unexposed areas are removed. After drying, it is heat-treated at 150°C for 60 minutes to obtain a cured product. The reflectance of the cured product is measured every 1 nm in the entire wavelength range of 430 nm to 750 nm using a spectrophotometer, and the arithmetic mean is calculated as the average reflectance. In other words, an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm means that the average reflectance in this range is 30% or more. Furthermore, the reflectance of the first partition wall in the entire wavelength range of 430 nm to 750 nm can also be 30% or more.

[0034] The average absorbance of the second partition wall in the wavelength range of 430 nm to 750 nm is 0.5 or more and 10 or less, preferably 0.8 or more, and more preferably 1.0 or more. Furthermore, the average absorbance of the second partition wall is preferably 5.0 or less. The average absorbance of the second partition wall can be measured, for example, in the following manner: A resin composition layer with a thickness of 3 µm is formed from the second photosensitive thermosetting resin composition forming the second partition wall, and light with a peak wavelength in the wavelength range of 350 nm to 450 nm at 300 mJ / cm² is applied. 2 The material was then photocured, followed by development with 1% sodium carbonate to remove unexposed areas. After drying, it was heat-treated at 150°C for 60 minutes to obtain the cured product. The absorbance of the cured product was measured per 1 nm using an ultraviolet-visible spectrophotometer in the wavelength range above 430 nm and below 750 nm, and the arithmetic mean of the measured absorbance was calculated as the average absorbance.

[0035] Fourth step In the fourth step, a semiconductor light-emitting element is placed in the recess defined by the stacked partitions formed in the third step, and the semiconductor light-emitting element is electrically connected to the patterned conductor of the substrate. Thus, the semiconductor light-emitting element is positioned in the recess defined by the stacked partitions, thereby creating a light-emitting panel structure that achieves good color balance and high current efficiency. The semiconductor light-emitting element can be, for example, a light-emitting diode (LED) or a semiconductor laser. The emission wavelength of the semiconductor light-emitting element can be selected according to requirements. For example, semiconductor light-emitting elements that emit red, green, or blue light can also be combined for use.

[0036] In the fourth step, for example, the semiconductor light-emitting element is configured such that the patterned conductor exposed in the recess is electrically connected to the semiconductor light-emitting element. Specifically, for example, the semiconductor light-emitting element and the patterned conductor can be connected by placing the semiconductor light-emitting element in the recess and performing heat treatment.

[0037] The heat treatment temperature in the fourth step can be, for example, 150°C or higher, preferably 200°C or higher and 300°C or lower. The heat treatment time can be, for example, 1 minute or more and 30 minutes or less, preferably 3 minutes or more and 10 minutes or less. The heat treatment can be performed, for example, in a reflow oven.

[0038] The light-emitting panel structure manufactured by the manufacturing method of this embodiment, which manufactures a light-emitting panel structure as described above, can be used in image display devices such as television receivers, PC monitors, tablets, and smartphones.

[0039] The following describes in detail the first photosensitive thermosetting resin composition for forming the first photosensitive thermosetting resin layer and the second photosensitive thermosetting resin composition for forming the second photosensitive thermosetting resin layer.

[0040] The first photosensitive thermosetting resin composition forming the first photosensitive thermosetting resin layer may be any composition capable of forming a thermosetting pattern image by exposure and development, and capable of forming a cured product with a desired average reflectance after thermosetting. The first photosensitive thermosetting resin composition includes, for example, a white pigment, an alkali-soluble resin, and a thermosetting resin, and may include other components as needed.

[0041] The first photosensitive thermosetting resin composition contains at least one white pigment. Examples of white pigments include zinc oxide, potassium titanate, zirconium oxide, antimony oxide, lead white, zinc sulfide, and lead titanate. From the viewpoint of reflectivity and the effect of inhibiting discoloration, the white pigment preferably contains at least titanium oxide. Titanium oxide can be manufactured by the sulfuric acid process, chlorination process, etc., and can be either rutile titanium oxide or anatase titanium oxide. In addition, titanium oxide can be titanium oxide that has been surface-treated with an aqueous metal oxide or titanium oxide that has been surface-treated with an organic compound. From the viewpoint of colorability, opacity, and stability, rutile titanium oxide is preferred. One type of white pigment can be used alone, or two or more types can be used in combination.

[0042] The volume average particle size of the white pigment can be, for example, 0.05µm or more and 10µm or less, preferably 0.01µm or more and 5µm or less. The volume average particle size of the white pigment is, for example, measured as the particle size corresponding to 50% of the cumulative volume from the smallest diameter side in the cumulative particle size distribution based on the volume standard measured using a laser diffraction particle size distribution measuring device.

[0043] Examples of commercially available white pigments, such as rutile titanium dioxide, include: TIPAQUE R-820, TIPAQUE R-830, TIPAQUE R-930, TIPAQUE R-550, TIPAQUE R-580, TIPAQUE R-630, TIPAQUE R-680, TIPAQUE R-670, TIPAQUE R-680, TIPAQUE R-670, TIPAQUE R-780, TIPAQUE R-820, TIPAQUE R-850, TIPAQUE CR-50, TIPAQUE CR-57, TIPAQUE CR-Super70, TIPAQUE CR-80, TIPAQUE CR-90, TIPAQUE CR-93, TIPAQUE CR-95, TIPAQUE CR-97, TIPAQUE CR-60, TIPAQUE CR-63, TIPAQUE CR-67, and TIPAQUE R-680. CR-58, TIPAQUE CR-85, TIPAQUE UT771 (all manufactured by Ishihara Sangyo Co., Ltd.), Ti-Pure R-100, Ti-Pure R-101, Ti-Pure R-102, Ti-Pure R-103, Ti-Pure R-104, Ti-Pure R-105, Ti-Pure R-108, Ti-Pure R-900, Ti-Pure R-902, Ti-Pure R-960, Ti-Pure R-706, Ti-Pure R-931 (manufactured by DuPont), R-25, R-21, R-32, R-7E, R-5N, R-61N, R-62N, R-42, R-45M, R-44, R-49S, GTR-100, GTR-300, D-918, TCR-29, TCR-52, FTR-700 (manufactured by Sakai Chemical Industry Co., Ltd.), TR-600, TR-700, TR-750, TR-840 (manufactured by Fuji Titanium Industry Co., Ltd.), KR270, KR310, KR380 (manufactured by Titanium Industry Co., Ltd.), etc.

[0044] In addition, examples of anatase titanium oxide include: TITON A-110, TITON TCA-123E, TITON A-190, TITON A-197, TITON SA-1, TITON SA-1L (all manufactured by Sakai Chemical Industry Co., Ltd.), TA-100, TA-200, TA-300, TA-400, TA-500, TP-2 (all manufactured by Fuji Titanium Industry Co., Ltd.), TITANIX JA-1, TITANIX JA-3, TITANIX JA-4, TITANIX JA-5, TITANIX JA-C (all manufactured by Teika Co., Ltd.), KA-10, KA-15, KA-20, KA-30, KA-35, KA-90 (all manufactured by Titanium Industry Co., Ltd.), TIPAQUE A-100, TIPAQUE A-220, TIPAQUE W-10 (all manufactured by Ishihara Sangyo Co., Ltd.), etc.

[0045] The content of white pigment in the first photosensitive thermosetting resin composition, in terms of the solid content in the total solids content, can be, for example, 10% by mass or more and 95% by mass or less, preferably 15% by mass or more, more preferably 20% by mass or more, and more preferably 80% by mass or less, more preferably 65% ​​by mass or less. If the content of white pigment is 10% by mass or more, sufficient reflectivity can be achieved in the cured product. In addition, if the content of white pigment is 95% by mass or less, the viscosity increase of the composition can be suppressed, resulting in good coating and forming properties, and a tendency to suppress the brittleness of the cured product.

[0046] Furthermore, in terms of solid content, relative to 100 parts by weight of the alkali-soluble resin described later, the content of white pigment in the first photosensitive thermosetting resin composition may be, for example, 20 parts by weight or more and 1800 parts by weight or less, preferably 50 parts by weight or more, more preferably 100 parts by weight or more, and more preferably 1000 parts by weight or less, more preferably 500 parts by weight or less.

[0047] Alkali-soluble resins The first photosensitive thermosetting resin composition comprises at least one alkali-soluble resin. The alkali-soluble resin may be any resin that can be developed with an alkaline aqueous solution, such as carboxyl-containing resins and phenolic hydroxyl-containing resins. Carboxyl-containing resins are preferred due to their excellent developability. The alkali-soluble resin may also have vinyl unsaturated double bonds. One alkali-soluble resin may be used alone, or two or more may be used in combination.

[0048] Specific examples of carboxyl-containing resins include the following compounds (which can be either oligomers or polymers).

[0049] (1) A carboxyl-containing resin obtained by copolymerization of unsaturated carboxylic acids such as (meth)acrylic acid with styrene, α-methylstyrene, lower alkyl (meth)acrylates, isobutylene and other compounds containing unsaturated groups.

[0050] (2) A carboxyl-containing polyurethane resin obtained by polyaddition reaction of diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates, as well as carboxyl-containing diol compounds such as dimethylolpropionic acid and dimethylolbutyric acid, and diol compounds such as polycarbonate polyols, polyether polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A epoxy alkyl adduct diols, and compounds with phenolic hydroxyl and alcoholic hydroxyl groups.

[0051] (3) A polyurethane resin with a carboxyl group at the end is obtained by reacting anhydride with a polyurethane resin through a polyaddition reaction of diisocyanates such as aliphatic diisocyanate, branched aliphatic diisocyanate, alicyclic diisocyanate, and aromatic diisocyanate with diols such as polycarbonate polyol, polyether polyol, polyester polyol, polyolefin polyol, acrylic polyol, bisphenol A epoxy alkyl adduct diol, and compounds with phenolic hydroxyl and alcoholic hydroxyl groups.

[0052] (4) A carboxyl-containing polyurethane resin obtained by polyaddition reaction of diisocyanate with (meth)acrylate or its partial anhydride modified by bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin, biphenol type epoxy resin, etc., carboxyl-containing diol compound and diol compound.

[0053] (5) In the synthesis of the resin in (2) or (4) above, a carboxyl-containing polyurethane resin is obtained by adding a compound such as (meth)acrylate hydroxyalkyl ester with one hydroxyl group and one or more (meth)acryloyl groups in the molecule and performing terminal (meth)acrylation.

[0054] (6) In the synthesis of the resin in (2) or (4) above, a compound having one isocyanate group and one or more (meth)acryloyl groups in the same equimolar reactant of isophorone diisocyanate and neopentyl tert-tetrate triacrylate is added and terminally (meth)acrylated to obtain a carboxyl-containing polyurethane resin.

[0055] (7) A carboxyl-containing resin is obtained by reacting (meth)acrylic acid with a multifunctional epoxy resin and adding dibasic anhydrides such as phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride to hydroxyl groups present in the side chain.

[0056] (8) A multifunctional epoxy resin obtained by reacting (meth)acrylic acid with the hydroxyl groups of a difunctional epoxy resin further epoxidized with epichlorohydrin, and by adding a dibasic acid anhydride to the generated hydroxyl group.

[0057] (9) A carboxyl-containing polyester resin is obtained by reacting a dicarboxylic acid with a polyfunctional oxobutane resin and adding a dicarboxylic acid anhydride to the generated primary hydroxyl group.

[0058] (10) A carboxyl-containing resin is obtained by reacting a monocarboxylic acid containing an unsaturated group with a compound having multiple phenolic hydroxyl groups in one molecule with an epoxide such as ethylene oxide or propylene oxide, and by reacting the obtained reaction product with a polyacid anhydride.

[0059] (11) A carboxyl-containing resin is obtained by reacting a monocarboxylic acid containing an unsaturated group with a compound having multiple phenolic hydroxyl groups in one molecule and a cyclic carbonate compound such as ethyl carbonate or propyl carbonate, and by reacting the obtained reaction product with a polyacid anhydride.

[0060] (12) A carboxyl-containing resin is obtained by reacting a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group in one molecule, such as p-hydroxyphenylethanol, and a monocarboxylic acid containing an unsaturated group, such as (meth)acrylic acid, with an epoxy compound having multiple epoxy groups in one molecule, and by reacting the alcoholic hydroxyl group of the obtained reaction product with polyacid anhydride such as maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyrolithic anhydride, and adipic anhydride.

[0061] (13) A carboxyl-containing resin obtained by further adding (meth)acrylate, α-methylepoxypropyl(meth)acrylate and other compounds having one epoxy group and one or more (meth)acryloyl groups to the carboxyl-containing resins described in (1) to (12) above.

[0062] There are no particular restrictions on the presence of phenolic hydroxyl groups in the main chain or side chain of a phenolic hydroxyl resin, meaning that the main chain or side chain contains hydroxyl groups already bonded to a benzene ring. Preferably, the phenolic hydroxyl resin contains two or more phenolic hydroxyl groups per molecule. Examples of resins containing two or more phenolic hydroxyl groups in one molecule include: resins derived from catechol, resorcinol, hydroquinone, dihydroxytoluene, naphthol, tributylcatechol, tributylhydroquinone, gallol, phloroglucinol, bisphenol A, bisphenol F, bisphenol S, biphenol, bixylenol, etc.; phenolic varnish-type phenolic resins; phenolic varnish-type alkylphenol resins; phenolic varnish-type bisphenol A phenolic varnish resins; dicyclopentadiene-type phenolic resins; xylok-type phenolic resins; terpene-modified phenolic resins; polyvinylphenol resins; condensates of phenols and aromatic aldehydes with phenolic hydroxyl groups; condensates of 1-naphthol or 2-naphthol and aromatic aldehydes, etc., but are not limited to these.

[0063] From the viewpoint of developability and resolution, among the above-mentioned alkali-soluble resins, the first photosensitive thermosetting resin composition is preferably an alkali-soluble resin comprising (7). Furthermore, in this specification, (meth)acrylate is a general term for acrylates, methacrylates, and mixtures thereof, as are other similar expressions.

[0064] As described above, the alkali-soluble resin has hydrophilic groups such as carboxyl groups in its main chain or side chains, and therefore can be developed using alkaline aqueous solutions. Furthermore, the acid value of the alkali-soluble resin containing carboxyl groups can be, for example, 40 mg KOH / g or more and 200 mg KOH / g or less, preferably 45 mg KOH / g or more and 120 mg KOH / g or less. If the acid value of the carboxyl-containing resin is within the above range, its alkali solubility is good, making patterning easier by alkaline development.

[0065] The weight-average molecular weight of the alkali-soluble resin varies depending on the resin skeleton, but it can be, for example, 2,000 or more and 150,000 or less, preferably 5,000 or more and 100,000 or less. If the weight-average molecular weight is within the above range, the balance between the development speed and the developability of the patterned area in the development step will be better.

[0066] In terms of solid content, the content of alkali-soluble resin in the first photosensitive thermosetting resin composition can be, for example, 5% by mass or more and 75% by mass or less, preferably 15% by mass or more and 70% by mass or less, and more preferably 40% by mass or less. When the content of alkali-soluble resin is 15% by mass or more, the film strength is good. On the other hand, when it is 75% by mass or less, the viscosity of the composition does not become too high, while the coatability and other properties are good.

[0067] thermosetting resins The first photosensitive thermosetting resin composition comprises at least one thermosetting resin. As the thermosetting resin, commonly known resins such as isocyanate compounds, terminal isocyanate compounds, amino resins, maleimide compounds, benzo[a] resins, carbodiimide resins, cyclic carbonate compounds, epoxy resins, polyfunctional oxobutane compounds, and cyclic sulfide resins can be used. Among these, the thermosetting resin is preferably at least one of a plurality of cyclic ether groups and cyclic thioether groups (hereinafter referred to as cyclic (thio)ether groups) in one molecule. A wide variety of thermosetting components having such cyclic (thio)ether groups are commercially available, and their structures can impart various properties. One thermosetting resin can be used alone, or two or more can be used in combination.

[0068] Thermosetting resins having multiple cyclic (thio)ether groups in their molecules are compounds having at least one type of cyclic ether group or cyclic thioether group among multiple 3-membered rings, 4-membered rings, or 5-membered rings. Examples include: compounds having multiple epoxy groups in their molecules, i.e., polyfunctional epoxy compounds; compounds having multiple oxetyl groups in their molecules, i.e., polyfunctional oxetane compounds; and compounds having multiple thioether groups in their molecules, i.e., cyclic sulfide resins, etc.

[0069] The thermosetting resin is preferably a compound that can undergo a thermosetting reaction with an alkali-soluble resin, and the thermosetting resin may contain at least an epoxy resin. Examples of epoxy resins include: bisphenol A type epoxy resin, brominated epoxy resin, phenolic varnish type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, alicyclic epoxy resin, trihydroxyphenylmethane type epoxy resin, xylenol type epoxy resin or biphenol type epoxy resin or mixtures thereof, bisphenol S type epoxy resin, bisphenol A type phenolic varnish epoxy resin, heterocyclic epoxy resin, biphenol phenolic varnish type epoxy resin, naphthyl-containing epoxy resin, and epoxy resin having a dicyclopentadiene backbone. Furthermore, resins obtained by introducing halogen atoms such as chlorine and bromine, and atoms such as phosphorus into their structure can also be used as epoxy resins. This imparts properties such as flame retardancy. Epoxy resin can be used alone or in combination of two or more types.

[0070] In terms of solid content, the content of thermosetting resin in the first photosensitive thermosetting resin composition in the total solid content can be, for example, 70% by mass or less, preferably 5% by mass or more and 60% by mass or less, more preferably 20% by mass or less. If the thermosetting resin content is 70% by mass or less, it is less likely to cause development residue due to reduced solubility of unexposed parts in the developer.

[0071] Furthermore, in terms of solid content, relative to 100 parts by weight of alkali-soluble resin, the content of thermosetting resin in the first photosensitive thermosetting resin composition may be, for example, 5 parts by weight or more and 80 parts by weight or less, preferably 10 parts by weight or more, more preferably 30 parts by weight or more, and more preferably 60 parts by weight or less.

[0072] Other ingredients The first photosensitive thermosetting resin composition may further comprise at least one compound having an ethylene unsaturated bond. By including a compound having an ethylene unsaturated bond, it becomes easier to adjust the viscosity of the resin composition, and effects such as improved photocurability and enhanced developability can be obtained. The molecular weight of the compound having an ethylene unsaturated bond may, for example, be 1000 or less.

[0073] Examples of compounds containing ethylene-like unsaturated bonds include polyester (meth)acrylates, polyether (meth)acrylates, polyurethane (meth)acrylates, carbonate (meth)acrylates, epoxy (meth)acrylates, and other (meth)acrylate monomers. Specific compounds include: hydroxyalkyl methacrylates such as 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate; dimethacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; methacrylamides such as N,N-dimethylmethacrylamide, N-hydroxymethylmethacrylamide, and N,N-dimethylaminopropylmethacrylamide; aminoalkyl methacrylates such as N,N-dimethylaminoethyl methacrylate and N,N-dimethylaminopropyl methacrylate; and polyols such as hexanediol, trimethylolpropane, neopentyl tertrol, dinepentyl tertrol, and tris(hydroxyethyl)triisocyanate, or their ethylene oxide additions. Poly(meth)acrylates such as propylene oxide adducts, ε-caprolactone adducts, etc.; poly(meth)acrylates such as phenoxyacrylates, bisphenol A diacrylates, and ethylene oxide adducts or propylene oxide adducts of these phenols; poly(meth)acrylates of glycidyl ethers such as glycerol diglycidyl ether, glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanate; and, not limited to the above, also include: acrylates formed by directly (meth)acrylate esterifying polyethers such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadiene, and polyester polyols, or by esterifying urethane (meth)acrylates through diisocyanate, and melamine (meth)acrylates, etc. Compounds with vinyl unsaturated bonds can be used alone or in combination of two or more.

[0074] In terms of solid content, the content of compounds containing vinyl unsaturated bonds in the first photosensitive thermosetting resin composition in the total solid content can be, for example, 50% by mass or less, preferably 1% by mass or more, more preferably 3% by mass or more, and more preferably 30% by mass or less, more preferably 10% by mass or less. If the content of compounds containing vinyl unsaturated bonds is 1% by mass or more, development resistance can be easily obtained by light irradiation, thereby further improving resolution. On the other hand, if it is 50% by mass or less, the cured product has excellent flexibility.

[0075] Furthermore, in terms of solid content, relative to 100 parts by mass of alkali-soluble resin, the content of the compound having ethylene unsaturated bonds in the first photosensitive thermosetting resin composition may be, for example, 1 part by mass or more and 100 parts by mass or less, preferably 10 parts by mass or more and 50 parts by mass or less, and more preferably 30 parts by mass or less.

[0076] The first photosensitive thermosetting resin composition may further comprise at least one photopolymerization initiator. Examples of photopolymerization initiators include: diphenyl ketone-based, acetophenone-based, aminoacetophenone-based, benzoin ether-based, benzyl ketal-based, acylphosphine oxide-based, oxime ether-based, oxime ester-based, and titanium ceramsite-based photopolymerization initiators. One photopolymerization initiator may be used alone, or two or more may be used in combination.

[0077] Examples of oxime ester-based photopolymerization initiators include compounds having a partial structure as shown in formula (I). Examples of aminoacetophenone-based photopolymerization initiators include α-aminoacetophenone-based photopolymerization initiators having a partial structure as shown in formula (II). Examples of acylphosphine oxide-based photopolymerization initiators include compounds having a partial structure as shown in formula (III). Examples of diacetictazone-based photopolymerization initiators include compounds as shown in formula (IV).

[0078] [Chemical Formula 1]

[0079] In equation (I), R 1 Represents a hydrogen atom, phenyl group, alkyl group, cycloalkyl group, alkanoyl group, or benzoyl group. R 2 Represents phenyl, alkyl, cycloalkyl, alkylacyl, or benzoyl. R 1 or R 2 The phenyl group represented may have substituents, such as alkyl groups having 1 to 6 carbon atoms, phenyl groups, halogen atoms, etc. R 1 or R 2 The alkyl group represented is preferably an alkyl group having 1 to 20 carbon atoms. The alkyl group can be either straight-chain or branched. Furthermore, the alkyl chain may contain one or more oxygen atoms, and may be substituted with one or more hydroxyl groups. 1 or R 2 The cycloalkyl group represented is preferably a cycloalkyl group having 5 to 8 carbon atoms. R 1 or R 2 The alkanoyl group represented is preferably an alkanoyl group having 2 to 20 carbon atoms. R 1 or R 2 The benzoyl group may have substituents, such as alkyl groups having 1 to 6 carbon atoms, phenyl groups, etc.

[0080] In equation (II), R 3 and R 4 Each of the following can be independently represented as an alkyl or aralkyl group having 1 to 12 carbon atoms. R 5 and R 6 Each can be independently represented by a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R 5 and R 6 They can also bond with each other to form cyclic alkyl ether groups.

[0081] In equation (III), R 7 and R 8 Each of the following can be independently represented as an alkyl, cyclohexyl, cyclopentyl, aryl or halogen atom having 1 to 10 carbon atoms, an aryl group substituted with an alkyl or alkoxy group, or an acyl group having 2 to 20 carbon atoms (except where both are acyl groups having 2 to 20 carbon atoms).

[0082] In equation (IV), R 9 and R 10 Each of these can be used to independently represent a halogen atom, an aryl group, a halogenated aryl group, or a heterocyclic halogenated aryl group.

[0083] Examples of oxime ester photopolymerization initiators containing the partial structure represented by formula (I) include: oxime ester compounds with a thioxanthone skeleton such as 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyl oxime)] and 2-(acetoxyiminomethyl)thioxanthone-9-one, and oxime ester compounds with a carbazole skeleton such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-ethanol-1-(O-acetyl oxime).

[0084] Examples of α-aminoacetophenone photopolymerization initiators that include the partial structure represented by formula (II) include: 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylacetone-1, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-but-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone, etc.

[0085] Examples of acylphosphine oxide photopolymerization initiators that include the partial structure represented by formula (III) include: 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, etc.

[0086] Examples of bis(η)-based photopolymerization initiators represented by formula (IV) include: 5 -2,4-Cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrolo-1-yl)-phenyl)titanium, etc.

[0087] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the photopolymerization initiator in the first photosensitive thermosetting resin composition can be, for example, 0.01 parts by weight or more and 100 parts by weight or less, preferably 0.5 parts by weight or more, more preferably 1 part by weight or more, and even more preferably 5 parts by weight or more. Furthermore, it is preferably 80 parts by weight or less, more preferably 40 parts by weight or less, and even more preferably 20 parts by weight or less. When the content of the photopolymerization initiator is 0.01 parts by weight or more relative to 100 parts by weight of the alkali-soluble resin, the photocurability on copper is good, resulting in a coating that is not easily peeled off and exhibits good coating properties such as chemical resistance. On the other hand, when the content of the photopolymerization initiator is 100 parts by weight or less relative to 100 parts by weight of the alkali-soluble resin, the light absorption of the photopolymerization initiator is good, and the deep curing performance is improved.

[0088] The first photosensitive thermosetting resin composition may further include at least one thermosetting catalyst. Examples of thermosetting catalysts include: imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; amine compounds such as dicyandiamine, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, and 4-methyl-N,N-dimethylbenzylamine; hydrazine compounds such as adipate dihydrazide and sebacate dihydrazide; and phosphorus compounds such as triphenylphosphine. In addition, commercially available catalysts include, for example: 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, and 2P4MHZ (all trade names of imidazole compounds) manufactured by Shikoku Chemical Industry Co., Ltd.; U-CAT3503N and U-CAT3502T (both trade names of dimethylamine-terminated isocyanate compounds) manufactured by San-Apro Co., Ltd.; and DBU, DBN, U-CATSA102, and U-CAT5002 (all bicyclic amidine compounds and their salts). Furthermore, it is not limited to these; any thermosetting catalyst that is an epoxy resin or oxetane compound, or a catalyst that can promote the reaction of at least one of the epoxy group and oxetane group with a carboxyl group, can be used. They can be used alone or in combination of two or more. Alternatively, S-triazine derivatives such as guanidine, acetylguanidine, benzoguanidine, melamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine-isocyanuric acid adduct, and 2,4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanuric acid adduct can be used. Preferably, these compounds, which also function as adhesive agents, are used in conjunction with a thermosetting catalyst. A single thermosetting catalyst can be used, or two or more can be used in combination.

[0089] For example, in terms of solid content, relative to 100 parts by mass of alkali-soluble resin, the content of thermosetting catalyst in the first photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 20 parts by mass or less, preferably 0.5 parts by mass or more and 15.0 parts by mass or less.

[0090] The first photosensitive thermosetting resin composition may further contain the following additives as required: melamine; polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, tributylcatechol, gallophenol, and phenanthrene; inorganic fillers such as barium titanate, silica powder, clay, magnesium carbonate, calcium carbonate, aluminum hydroxide, and mica powder; thickeners such as micronized silica, organobentonite, and montmorillonite; at least one of defoamers and leveling agents such as polysiloxane, fluorine, and polymeric agents; antioxidants, photopolymerization sensitizers, light stabilizers, dispersants, curing accelerators, flame retardants, flame retardant additives, and silane coupling agents.

[0091] In addition, the first photosensitive thermosetting resin composition may also contain organic solvents. Examples of organic solvents include: ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; alcohol ethers such as acetone alcohol, methyl acetone alcohol, butyl acetone alcohol, carbitropol, methyl carbitropol, butyl carbitropol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether; esters such as ethyl acetate, butyl acetate, butyl lactate, cellulose acetate, butyl cellulose acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propenyl carbonate; aliphatic hydrocarbons such as octane and decane; and petroleum-based solvents such as petroleum ether, naphtha, and solvent naphtha. These organic solvents may be used alone or in combination of two or more.

[0092] Second photosensitive thermosetting resin composition The second photosensitive thermosetting resin composition forming the second photosensitive thermosetting resin layer is only required to be capable of forming a thermosetting pattern image by exposure and development, and to form a cured product with an average absorbance within a predetermined range of wavelengths from 430 nm to 750 nm after thermosetting. The second photosensitive thermosetting resin composition may, for example, include a colorant, an alkali-soluble resin, and a thermosetting resin, and may include other components as needed.

[0093] Colorant The second photosensitive thermosetting resin composition contains at least one colorant. The colorant only needs to achieve the desired average absorbance, and the colorant can be a black colorant or a colorant other than black.

[0094] Black colorants can be either organic or inorganic. Suitable pigments include, for example: carbon black pigments such as Pigment Black 6, 7, 9, 18, Pigment Black 8, 10, graphite pigments, Pigment Black 11, 12, 27, and Pigment Brown 35; iron oxide pigments such as KN-370 manufactured by Toda Industries, Ltd., titanium black 13M-T manufactured by Mitsubishi Materials Corporation, anthraquinone pigments such as Pigment Black 20, cobalt oxide pigments such as Pigment Black 13, 25, 29, copper oxide pigments such as Pigment Black 15, 28, manganese pigments such as Pigment Black 14, 26, antimony oxide pigments such as Pigment Black 23, nickel oxide pigments such as Pigment Black 30, pigments such as Pigment Black 31, 32, perylene pigments such as Lumogen Black FK4280 manufactured by BASF Japan, aniline pigments such as Pigment Black 1, and molybdenum sulfide and bismuth sulfide. The preferred black colorant is a carbon black-based pigment or a perylene-based pigment. In the case of a carbon black-based or perylene-based pigment, due to L... * a * b * a in color space * value and b * The absolute value of the black colorant will be closer to 0, making it easier to blacken and thus preferred. These black colorants can be used alone or in combination of two or more.

[0095] In terms of solid content, the content of the black colorant in the second photosensitive thermosetting resin composition, in terms of its content in the total solid content, can be, for example, 1% by mass or more and 30% by mass or less, preferably 2% by mass or more, more preferably 3% by mass or more, and more preferably 25% by mass or less, more preferably 20% by mass or less. If the black colorant content is 1% by mass or more, it is easy to achieve sufficient blackening. In addition, if it is 30% by mass or less, light transmittance is less likely to deteriorate.

[0096] Furthermore, from the viewpoint of resolution, in terms of solid content, relative to 100 parts by mass of alkali-soluble resin, the content of black colorant in the second photosensitive thermosetting resin composition can be, for example, 1 part by mass or more and 50 parts by mass or less, preferably 5 parts by mass or more and 30 parts by mass or less.

[0097] The second photosensitive thermosetting resin composition may also contain colorants other than black. Examples of colorant hues include red, blue, green, and yellow. Colorants other than black can be any of pigments, dyes, or colorants. Specific examples include substances bearing the following Pigment Index (CI; issued by the British Institute of Colorants). However, from the viewpoint of reducing environmental impact and human health, halogen-free is preferred.

[0098] Red colorants include: monoazo, diazo, azo lake, benzimidazolone, perylene, pyrrolopyrroledione, condensed azo, anthraquinone, quinacrine, etc. Specifically, substances with the following pigment index numbers can be cited.

[0099] Monoazo series: Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269; Diazonium series: Pigment Red 37, 38, 41; Monoazo lake series: Pigment Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58:4, 63:1, 63:2, 64:1, 68; Benzimidazole series: Pigment Red 171, 175, 176, 185, 208; Perylene series: Solvent Red 135, 179; Pigment Red 123, 149, 166, 178, 179, 190, 194, 224; Pyrrolopyrroledione series: Pigment Red 254, 255, 264, 270, 272; Condensed azo series: Pigment Red 144, 166, 214, 220, 221, 242; Anthraquinone series: Pigment Red 168, 177, 216; Solvent Red 149, 150, 52, 207; Quinacrine series: Pigment Red 122, 202, 206, 207, 209.

[0100] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the red colorant in the second photosensitive thermosetting resin composition can be, for example, 0 parts by weight or more and 1 part by weight or less, preferably 0.1 parts by weight or more and 1 part by weight or less, more preferably 0.1 parts by weight or more and 0.8 parts by weight or less. When the content is 1 part by weight or less, the light transmittance is less likely to deteriorate. On the other hand, when the content is 0.1 parts by weight or more, it is easy to blacken.

[0101] Blue colorants include phthalocyanine, anthraquinone, diazine, and cobalt compounds. In the pigment category, there are compounds classified as pigments, and in the dye category, there are compounds classified as solvents. Specifically, substances with the following pigment index numbers can be cited. Furthermore, in addition to these, metal-substituted or unsubstituted phthalocyanine compounds can also be used.

[0102] Pigment series: Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 60; Dye series: Solvent Blue 35, 45, 63, 67, 68, 70, 83, 87, 94, 97, 104, 122, 136.

[0103] Based on solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the blue colorant in the second photosensitive thermosetting resin composition can be, for example, 0.1 parts by weight or more and 2.5 parts by weight or less, preferably 0.2 parts by weight or more and 1.5 parts by weight or less. When the content is 0.1 parts by weight or more, it is easy to blacken. When the content is 2.5 parts by weight or less, the light transmittance is less likely to deteriorate.

[0104] Yellow colorants include monoazo, diazo, condensed azo, benzimidazole, isoindolinone, and anthraquinone types. Specifically, the following colorants can be cited.

[0105] Monoazo series: Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62; 1, 65, 73, 74, 75, 97, 100, 101, 104, 105, 111, 116, 167, 168, 169, 182, 183; Diazo series: Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198; Condensed azo series: Pigment Yellow 93, 94, 95, 128, 155, 166, 180; Benzimidazole series: Pigment Yellow 120, 151, 154, 156, 175, 181; Isoindolinetone series: Pigment Yellow 109, 110, 139, 179, 185; Anthraquinone series: Solvent Yellow 163; Pigment Yellow 24, 108, 193, 147, 199, 202.

[0106] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the yellow colorant in the second photosensitive thermosetting resin composition can be, for example, 0.1 parts by weight or more and 1.5 parts by weight or less. When the content is 0.1 parts by weight or more, it is prone to blackening. When it is 1.5 parts by weight or less, the light transmittance does not easily deteriorate. Furthermore, the combined content of the yellow colorant and the red colorant relative to 100 parts by weight of the carboxyl-containing resin can be, for example, 0.1 parts by weight or more and 2.5 parts by weight or less. When the combined content is 0.1 parts by weight or more, it is prone to blackening. When it is 2.5 parts by weight or less, the light transmittance does not easily deteriorate.

[0107] Phthalocyanine and anthraquinone compounds can be used as green colorants. Specifically, Pigment Green 7 and 36, Solvent Green 3, 5, 20, and 28 can be used. In addition to the above, metal-substituted or unsubstituted phthalocyanine compounds can also be used.

[0108] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the green colorant in the second photosensitive thermosetting resin composition can be, for example, 0.2 parts by weight or more and 2.0 parts by weight or less. When the content is 0.2 parts by weight or more, it is easy to blacken. When it is 2.0 parts by weight or less, the light transmittance does not easily deteriorate.

[0109] Specifically, examples of purple colorants include: Pigment Violet 19, 29, 32, 36, 38, and 42; Solvent Violet 13 and 36, etc.

[0110] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the purple colorant in the second photosensitive thermosetting resin composition can be, for example, 0.1 parts by weight or more and 2.5 parts by weight or less, preferably 0.2 parts by weight or more and 2.5 parts by weight or less. When the content is 0.1 parts by weight or more, it is easy to blacken. When it is 2.5 parts by weight or less, the light transmittance is less likely to deteriorate.

[0111] As an orange colorant, examples include Pigment Orange 1, 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 61, 63, 64, 71, and 73.

[0112] In terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, the content of the orange colorant in the second photosensitive thermosetting resin composition can be, for example, 0.05 parts by weight or more and 1 part by weight or less, preferably 0.1 parts by weight or more and 0.8 parts by weight or less. When the content is 0.05 parts by weight or more, it is easy to blacken. When it is 1 part by weight or less, the light transmittance is less likely to deteriorate.

[0113] As brown colorants, examples include Pigment Brown 23 and 25.

[0114] Two or more colorants other than black can be combined. Based on solid content, relative to 100 parts by weight of the alkali-soluble resin, the total content of colorants other than black in the second photosensitive thermosetting resin composition can be, for example, 0.35 parts by weight or more and 9.5 parts by weight or less. When the total content of colorants other than black is 0.35 parts by weight or more, blackening is easier. When it is 9.5 parts by weight or less, light transmittance does not easily deteriorate.

[0115] The second photosensitive thermosetting resin composition comprises at least one alkali-soluble resin. Details of the alkali-soluble resin are as described above. From the viewpoint of developability and resolution, the second photosensitive thermosetting resin composition preferably comprises the alkali-soluble resin described in (7) as the alkali-soluble resin.

[0116] In terms of solid content, the content of alkali-soluble resin in the second photosensitive thermosetting resin composition can be, for example, 15% by mass or more and 75% by mass or less, preferably 20% by mass or more and 70% by mass or less. When the content of alkali-soluble resin is 15% by mass or more, the film strength is good. On the other hand, when it is 75% by mass or less, the viscosity of the composition does not become too high, while the coatability and other properties are good.

[0117] The second photosensitive thermosetting resin composition comprises at least one thermosetting resin. Details of the thermosetting resin are as described above.

[0118] In terms of solid content, the content of thermosetting resin in the second photosensitive thermosetting resin composition in the total solid content can be, for example, 70% by mass or less, preferably 5% by mass or more and 60% by mass or less. If the thermosetting resin content is 70% by mass or less, it is less likely to cause development residue due to reduced solubility of unexposed parts in the developer.

[0119] Furthermore, in terms of solid content, relative to 100 parts by mass of alkali-soluble resin, the content of thermosetting resin in the second photosensitive thermosetting resin composition may be, for example, 10 parts by mass or more and 100 parts by mass or less, preferably 15 parts by mass or more and 60 parts by mass or less.

[0120] The second photosensitive thermosetting resin composition may also contain other components as needed. Examples of other components include: compounds with vinyl unsaturated bonds, photopolymerization initiators, thermosetting catalysts, and other additives. Details regarding compounds with vinyl unsaturated bonds, photopolymerization initiators, thermosetting catalysts, and other additives are as described above.

[0121] When the second photosensitive thermosetting resin composition contains a compound having vinyl unsaturated bonds, the content of the compound having vinyl unsaturated bonds in the first photosensitive thermosetting resin composition, in terms of solid content, is, for example, 50% by mass or less, preferably 1% by mass or more, more preferably 3% by mass or more, and more preferably 30% by mass or less. If the content of the compound having vinyl unsaturated bonds is 1% by mass or more, development resistance can be easily obtained by light irradiation, thereby further improving resolution. On the other hand, if it is 50% by mass or less, the cured product has excellent flexibility.

[0122] Furthermore, in terms of solid content, relative to 100 parts by mass of alkali-soluble resin, the content of compounds having vinyl unsaturated bonds in the second photosensitive thermosetting resin composition may be, for example, 1 part by mass or more and 100 parts by mass or less, preferably 10 parts by mass or more and 50 parts by mass or less.

[0123] When the second photosensitive thermosetting resin composition contains a photopolymerization initiator, the content of the photopolymerization initiator in the second photosensitive thermosetting resin composition, in terms of solid content, relative to 100 parts by weight of the alkali-soluble resin, can be, for example, 0.01 parts by weight or more and 100 parts by weight or less, preferably 0.5 parts by weight or more, more preferably 1 part by weight or more, and more preferably 80 parts by weight or less, more preferably 40 parts by weight or less, and even more preferably 20 parts by weight or less. When the content of the photopolymerization initiator is 0.01 parts by weight or more relative to 100 parts by weight of the alkali-soluble resin, the photocurability on the substrate is good, resulting in a coating that is not easily peeled off and exhibits good coating properties such as chemical resistance. On the other hand, when the content of the photopolymerization initiator is 100 parts by weight or less relative to 100 parts by weight of the alkali-soluble resin, the photopolymerization initiator has good light absorption, improving deep curing properties.

[0124] When the second photosensitive thermosetting resin composition contains a thermosetting catalyst, for example, in terms of solid content, relative to 100 parts by weight of alkali-soluble resin, the content of the thermosetting catalyst in the second photosensitive thermosetting resin composition may be, for example, 0.1 parts by weight or more and 20 parts by weight or less, preferably 0.5 parts by weight or more and 15.0 parts by weight or less.

[0125] Structure for light-emitting panels The structure for a light-emitting panel includes: a substrate having a patterned conductor; stacked partitions disposed on the substrate and including a first partition and a second partition; and a semiconductor light-emitting element disposed in a recess defined by the stacked partitions and connected to the patterned conductor. The first partition is configured to be in contact with the substrate and has an average reflectance of 30% or more in a wavelength range of 430 nm to 750 nm. The second partition is disposed on the first partition in isolation from the substrate and has an average absorbance of 0.5 or more and 10 or less in a wavelength range of 430 nm to 750 nm.

[0126] In the structure for a light-emitting panel, the semiconductor light-emitting element is separated by a stacked partition formed by a first partition with high reflectivity and a second partition with high absorbency, with the second partition on top. Therefore, good color balance and high current efficiency can be achieved. The structure for a light-emitting panel can be manufactured, for example, by the aforementioned manufacturing method for a structure for a light-emitting panel.

[0127] An example of the structure for a light-emitting panel is illustrated with reference to the accompanying drawings. Figure 1 This is a schematic cross-sectional view of a light-emitting panel structure 100. The light-emitting panel structure 100 includes: a substrate 10 having a patterned conductor (not shown); a stacked partition 20 disposed on the substrate 10 and including a first partition 21 and a second partition 22; and semiconductor light-emitting elements 30a, 30b, and 30c disposed in recesses defined by the stacked partition 20 and connected to the patterned conductor. The substrate 10 may be, for example, a silicon wafer, a silicon oxide wafer, a glass substrate, an epoxy glass substrate, etc. The patterned conductor provided on the substrate is, for example, formed of copper, and has a circuit formed in a manner capable of supplying power to the semiconductor light-emitting elements. The patterned conductor is disposed on the side of the substrate 10 where the semiconductor light-emitting elements are disposed. The stacked partition 20 includes: a first partition 21, configured to be in contact with the substrate 10, having an average reflectance of 30% or more in a wavelength range of 430 nm to 750 nm; and a second partition 22, disposed on the first partition 21 and isolated from the substrate 10, having an average absorbance of 0.5 or more and 10 or less in a wavelength range of 430 nm to 750 nm. A plurality of recesses defined by the stacked partition 20 are formed on the substrate 10, exposing a patterned conductor. Semiconductor light-emitting elements 30a, 30b, and 30c are respectively disposed in the recesses defined by the stacked partition 20 and electrically connected to the patterned conductor. Semiconductor light-emitting elements 30a, 30b, and 30c may each have different emission peak wavelengths. Semiconductor light-emitting element 30a is a red light-emitting diode, semiconductor light-emitting element 30b is a green light-emitting diode, and semiconductor light-emitting element 30c is a blue light-emitting diode. In the structure 100 for the light-emitting panel, adjacent semiconductor light-emitting elements may have different emission peak wavelengths.

[0128] As another embodiment of the present invention, it also includes the use of the light-emitting panel structure in the manufacture of an image display device, and the light-emitting panel structure used in the manufacture of an image display device.

[0129] Example The present invention will now be specifically described through examples, but the present invention is not limited to these examples. The following materials are prepared as materials for preparing the first photosensitive thermosetting resin composition and the second photosensitive thermosetting resin composition.

[0130] Synthetic alkali-soluble resin 220g of cresol phenolic varnish-type epoxy resin (manufactured by DIC, EPICLON N-695, epoxy equivalent: 220g / eq.) was placed in a four-necked flask equipped with a stirrer and reflux cooler. 214g of carbitol acetate was added and heated to dissolve. Next, 0.1g of hydroquinone as a polymerization inhibitor and 2.0g of dimethylbenzylamine as a reaction catalyst were added. The mixture was heated to 95°C to 105°C, and 72g of acrylic acid was slowly added dropwise, allowing the reaction to proceed for 16 hours. The reaction product was cooled to 80°C to 90°C, and 106g of tetrahydrophthalic anhydride was added, allowing the reaction to proceed for 8 hours. After cooling, the solution containing carboxyl groups was obtained as described above, with a solid content of 65%, an acid value of 100 mg KOH / g, and a weight-average molecular weight (Mw) of approximately 3500.

[0131] White pigment TIPAQUE CR58: Manufactured by Ishihara Sangyo Co., Ltd.; Rutile titanium oxide; Black pigment MA-100: Manufactured by Mitsubishi Chemical Corporation; carbon black; thermosetting resins jER870: Manufactured by Mitsubishi Chemical Corporation; epoxy equivalent 205 g / eq; acrylate monomers DPHA: Manufactured by Dassault Systèmes; Dipentaerythritol hexaacrylate; Melamine: Manufactured by Nissan Chemical Co., Ltd. antioxidants IRGANOX 1010: Manufactured by BASF Japan. Photopolymerization initiator Omnirad 819: Manufactured by Ajmont Resins, Inc.; Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide; Irgacure OXE02: Manufactured by BASF Japan; oxime ester; Thermosetting catalyst DICY: Dicyandiamine; manufactured by Mitsubishi Chemical Corporation; 1B2PZ: 2-Phenylacetyl-1H-imidazolium; manufactured by Shikoku Chemical Industry Co., Ltd. Leveling agent BYK-361N: Manufactured by BYK Chemicals Japan Co., Ltd. wetting and dispersing agents Disperbyk-111: Manufactured by BYK Chemicals Japan.

[0132] Preparation Example 1 The materials were measured as the alkali-soluble resin of the synthesis example and the mass parts shown in Table 1, premixed using a mixer, and then kneaded using a three-roll mill to obtain the first photosensitive thermosetting resin composition of Preparation Example 1. In Table 1, the alkali-soluble resin shows the solid content.

[0133] [Table 1]

[0134] Using the first photosensitive thermosetting resin composition of Preparation Example 1, a resin composition layer was formed on a 1.0 mm thick soda-lime glass plate, and the plate was irradiated with light of 300 mJ / cm² with a peak wavelength of 350 nm to 450 nm. 2 After photocuring, the sample was developed with 1% sodium carbonate to remove unexposed areas, and then dried before being heat-treated at 150°C for 60 minutes to obtain a cured sample with a thickness of 10µm. The reflectance of the obtained sample was measured using a spectrophotometer in the wavelength range of 430nm to 750nm, and their arithmetic mean was calculated. The results are shown in Table 1.

[0135] Preparation Example 2 The materials were measured as the alkali-soluble resin of the synthesis example and the mass parts shown in Table 2, premixed using a mixer, and then kneaded using a three-roll mill to obtain the second photosensitive thermosetting resin composition of Preparation Example 2. In Table 2, the alkali-soluble resin shows the solid content.

[0136] [Table 2]

[0137] Using the second photosensitive thermosetting resin composition from Preparation Example 2, a resin composition layer was formed on a 1.0 mm thick soda-lime glass plate, and the plate was irradiated with light of 300 mJ / cm² with a peak wavelength of 350 nm to 450 nm. 2After photocuring, the sample was developed with 1% sodium carbonate to remove unexposed areas, dried, and then heat-treated at 150°C for 60 minutes to obtain a cured sample with a thickness of 3µm. The absorbance of the obtained sample was measured using a UV-Vis spectrophotometer in the range of 430nm to 750nm, and the average absorbance, calculated as the arithmetic mean of the measured absorbance, was determined. The results are shown in Table 2.

[0138] Preparation Example 3: Preparation of Dry Film A 25µm thick PET film (manufactured by Toray Industries, Lumirror T60) was prepared as a support film. The second photosensitive thermosetting resin composition of Preparation Example 2 was coated onto the PET film using a molding process and dried in a hot air circulating drying oven at 80°C to 120°C to form a second photosensitive thermosetting resin layer with a thickness of 3µm. Next, the first photosensitive thermosetting resin composition of Preparation Example 1 was coated onto the second photosensitive thermosetting resin layer using a molding process and dried in a hot air circulating drying oven at 80°C to 120°C to form a first photosensitive thermosetting resin layer with a thickness of 10µm, thereby obtaining the dry film of Preparation Example 3 with a laminated resin layer on the PET film.

[0139] Example 1 Step 1 The first photosensitive thermosetting resin composition of Preparation Example 1 was coated onto a substrate with a circuit formed by spin coating, and dried at 80°C for 30 minutes in a hot air circulating drying oven to form a first photosensitive thermosetting resin layer with a thickness of 10 µm. Next, the second photosensitive thermosetting resin composition of Preparation Example 2 was coated onto the first photosensitive thermosetting resin layer by spin coating, and dried at 80°C for 30 minutes in a hot air circulating drying oven to form a second photosensitive thermosetting resin layer with a thickness of 3 µm, thereby obtaining a substrate having a laminated resin layer.

[0140] Step 2 For the substrate having the obtained laminated resin layer, exposure was performed using a high-pressure mercury lamp (300 mJ / cm). 2 After photocuring to form a 13µm thick layer of partitions, the unexposed areas are removed using an alkaline developer containing 1% sodium carbonate by mass, thereby forming a pattern image with rectangular recesses, the long side of which is 100µm and the short side is 50µm.

[0141] Step 3 After the pattern image is formed, it is thermocured in a hot air circulating drying oven at 150°C for 60 minutes to form a laminated partition, thereby obtaining a substrate with recesses divided by the laminated partition.

[0142] Step 4 A structure for a light-emitting panel is manufactured by mounting light-emitting diodes (LEDs) in recesses of the substrate obtained in step 3 using chip bonding. Red LEDs (R), green LEDs (G), and blue LEDs (B) are used, and they are alternately mounted and connected in series.

[0143] Example 2 In step 1, the dry film obtained in Preparation Example 3 was used with the first photosensitive thermosetting resin layer facing down. It was laminated onto the substrate on which the circuit was formed under lamination conditions of 80°C, 0.5 MPa and 30 seconds. The PET film was then removed to obtain a substrate with a laminated resin layer. Otherwise, the light-emitting panel structure of Example 2 was manufactured in the same manner as in Example 1.

[0144] Example 3 In step 1, the dry film obtained in Preparation Example 3 was used with the first photosensitive thermosetting resin layer facing down, and it was laminated onto the substrate on which the circuit was formed under lamination conditions of 80°C, 0.5 MPa and 30 seconds to obtain a substrate with a stacked resin layer. In step 2, the PET film was removed after photocuring. Otherwise, the light-emitting panel structure of Example 3 was manufactured in the same manner as in Example 1.

[0145] Comparative Example 1 In step 1, the second photosensitive thermosetting resin composition of Preparation Example 2 was coated onto the substrate on which the circuit was formed by spin coating, and dried at 80°C for 30 minutes in a hot air circulating drying oven to form a second photosensitive thermosetting resin layer with a thickness of 3µm. Next, the first photosensitive thermosetting resin composition of Preparation Example 1 was coated onto the second photosensitive thermosetting resin layer by spin coating, and dried at 80°C for 30 minutes in a hot air circulating drying oven to form a first photosensitive thermosetting resin layer with a thickness of 10µm, thereby obtaining a substrate having a laminated resin layer. Otherwise, the light-emitting panel structure of Comparative Example 1 was manufactured in the same manner as in Example 1.

[0146] Comparative Example 2 A substrate with mounted LEDs is obtained by using chip bonding to mount LEDs onto a substrate on which a circuit has been formed. Red LEDs (R), green LEDs (G), and blue LEDs (B) are used, and they are mounted alternately and connected in series.

[0147] The first photosensitive thermosetting resin composition of Preparation Example 1 was coated onto a substrate on which a light-emitting diode was mounted using a spin coating method. The coating was then dried at 80°C for 30 minutes in a hot air circulating drying oven to form a first photosensitive thermosetting resin layer with a thickness of 10 µm. Next, the second photosensitive thermosetting resin composition of Preparation Example 2 was coated onto the first photosensitive thermosetting resin layer using a spin coating method. This second photosensitive thermosetting resin layer was then dried at 80°C for 30 minutes in a hot air circulating drying oven to form a second photosensitive thermosetting resin layer with a thickness of 3 µm, thereby obtaining a substrate having a laminated resin layer.

[0148] The obtained substrate was exposed using a high-pressure mercury lamp (300 mJ / cm²). 2 After photocuring it to form a partition wall thickness of 13µm and allowing the light-emitting diode to be placed in the recess, the unexposed areas are removed using an alkaline developer containing 1% sodium carbonate by mass, thereby forming a pattern image with a rectangular recess having a long side of 100µm and a short side of 50µm.

[0149] After forming the pattern image, the laminated partition is formed by heat curing in a hot air circulating drying oven at 150°C for 60 minutes, thereby manufacturing a light-emitting panel structure of Comparative Example 2 in which light-emitting diodes are installed in the recesses divided by the laminated partition.

[0150] Evaluate The structure for the light-emitting panel obtained above was evaluated as follows. However, for resolution, a resolution evaluation substrate was fabricated as follows for evaluation. The results are shown in Table 3.

[0151] resolution In Examples 1 to 3, and Comparative Examples 1 and 2, a patterned image was formed by photocuring a photomask with a design value of line / interval = 50µm / 50µm in step 3. Otherwise, a resolution evaluation substrate was fabricated in the same manner, and the resolution of the stacked partitions was evaluated according to the following evaluation criteria.

[0152] Evaluation benchmark A: No undercut, can be formed according to design values.

[0153] B: It roughly follows the design values, but produces an undercut.

[0154] C: Unable to generate patterned images with lines / intervals according to design values.

[0155] Brightness (current efficiency) For LEDs (R, G, B) connected in series, a voltage of 10 mA is applied to make these LEDs emit light, and the brightness of the emitted light is evaluated by visual observation according to the following evaluation criteria.

[0156] Evaluation benchmark A: It's lit up very brightly.

[0157] B: It can be lit, but it is very dim.

[0158] Color shift For LEDs (R, G, B) connected in series, a voltage of 10mA is applied to make these LEDs emit light. The structure of the light-emitting panel is observed with the naked eye at a 45-degree angle, and the color shift is evaluated according to the following evaluation criteria.

[0159] Evaluation benchmark A: It looks like pure white.

[0160] B: G, B is very strong.

[0161] Installation alignment accuracy In the manufacture of the light-emitting panel structures of Examples 1 to 3 and Comparative Examples 1 and 2, the ease of alignment when mounting light-emitting diodes (R, G, B) was evaluated according to the following evaluation criteria.

[0162] Evaluation benchmark A: Good.

[0163] B: Difficult to align.

[0164] Precision of the partition height The heights of 50 stacked partitions were measured, and deviations in height were evaluated based on the following evaluation criteria.

[0165] Evaluation benchmark A: The deviation is very small (σ < 1µm).

[0166] B: Large deviation (σ>1µm).

[0167] [Table 3]

[0168] This specification incorporates the entire disclosure of Japanese Patent Application No. 2023-044588 (filed on March 20, 2023). All documents, patent applications and technical specifications described in this specification are incorporated herein by reference to the same extent as where each document, patent application and technical specification is specifically and individually described by reference.

Claims

1. A method for manufacturing a structure for a light-emitting panel, characterized in that, include: A laminated resin layer is disposed on a substrate having a patterned conductor, the laminated resin layer comprising a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer. The laminated resin layer is exposed to active energy rays and then developed to form a patterned image on the substrate. The pattern image is heat-treated to form a laminated partition on a substrate, the laminated partition comprising a first partition and a second partition; as well as A semiconductor light-emitting element is disposed in the recess defined by the stacked partitions, and the semiconductor light-emitting element is connected to the patterned conductor, wherein... The first photosensitive thermosetting resin layer is configured to be in contact with the substrate, and the second photosensitive thermosetting resin layer is configured on the first photosensitive thermosetting resin layer in a manner that isolates it from the substrate. The first partition wall is configured to be in contact with the substrate, and the second partition wall is configured on the first partition wall in a manner that isolates it from the substrate. The first partition has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, and the second partition has an average absorbance of 0.5 or more and 10 or less in the wavelength range of 430 nm to 750 nm.

2. The method for manufacturing a structure for a light-emitting panel according to claim 1, wherein, The first photosensitive thermosetting resin layer comprises a white pigment, an alkali-soluble resin, and a thermosetting resin. The second photosensitive thermosetting resin layer comprises a colorant, an alkali-soluble resin, and a thermosetting resin.

3. The method for manufacturing a structure for a light-emitting panel according to claim 1, wherein, The laminated resin layer is configured using a formation method comprising the following steps: A first photosensitive thermosetting resin layer is formed by applying a first photosensitive thermosetting resin composition to the substrate; and A second photosensitive thermosetting resin layer is formed by applying a second photosensitive thermosetting resin composition onto a first photosensitive thermosetting resin layer.

4. The method for manufacturing a structure for a light-emitting panel according to claim 1, wherein, The laminated resin layer is configured using a formation method comprising the following steps: A dry film is laminated on the substrate, the dry film being composed of a first photosensitive thermosetting resin layer, a second photosensitive thermosetting resin layer, and a support film; and Remove the support membrane.

5. The method for manufacturing a structure for a light-emitting panel according to claim 1, wherein, The thickness of the first partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 50µm or less, and the thickness of the second partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 10µm or less.

6. A structure for a light-emitting panel, characterized in that, have: Substrate with patterned conductors; A stacked partition wall, disposed on the substrate and comprising a first partition wall and a second partition wall; and A semiconductor light-emitting element is disposed in the recess defined by the stacked partitions and connected to the patterned conductor, wherein... The first partition is configured to be in contact with the substrate and has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm. The second partition is disposed on the first partition in a way that isolates it from the substrate, and has an average absorbance of 0.5 or more and 10 or less in a wavelength range of 430 nm or more and 750 nm or less.

7. The structure for a light-emitting panel according to claim 6, wherein, The thickness of the first partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 50µm or less, and the thickness of the second partition wall in the direction orthogonal to the main surface of the substrate is 0.5µm or more and 10µm or less.

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