Hybrid core substrate with embedded components

Abstract

The invention discloses a hybrid core substrate with embedded components and a method of manufacturing the same. In one aspect, a hybrid core substrate includes: a rigid core; a first laminate layer structure disposed over and mounted to the top surface of the rigid core, and having a cavity in which a first component is embedded; and a second laminate layer structure disposed over and mounted to a top surface of the first laminate layer structure, and having at least one electrical connection to the first laminate layer structure and at least one electrical connection to the first component; and a first plurality of contacts disposed on a top surface of the second laminate layer structure and electrically connected to the second laminate layer structure. In some aspects, the at least one contact is electrically connected to the embedded component.

Description

Background Technology 1. Technical Field

[0001] This disclosure relates in general to packaging and packaging substrates, and more specifically (but not exclusively) to hybrid core substrates having embedded components.

[0002] 2. Relevant Technical Descriptions

[0003] Figure 1 This is a side cross-sectional view of a conventional device 100, which includes a core 102, with multilayer substrates 104 attached above and below the core 102 and electrically connected to each other via vias 106. Figure 1 The disadvantages of using this design are illustrated—that is, when used with large substrates (such as multilayer substrate 104), the core 102 must be relatively thick (e.g., T = 1.2 mm) in order to maintain flatness.

[0004] Therefore, the distance D between components mounted on the top surface (such as IC 108) and components mounted on the bottom surface (such as bypass capacitor 110) is very large, causing bypass capacitor 110 to fail to function effectively due to the resistance, inductance, or capacitance associated with the long metal path between IC 108 and bypass capacitor 110. The same may be true for other components; a large distance D between top-mounted and bottom-mounted components may impair their functionality.

[0005] Therefore, a better method is needed that does not have the drawbacks described above. Summary of the Invention

[0006] The following is a simplified summary of the invention relating to one or more aspects disclosed herein. Therefore, this summary should not be considered an exhaustive overview relating to all conceptual aspects, nor should it be considered to identify key or decisive elements relating to all conceptual aspects or to depict the scope associated with any particular aspect. Thus, the sole purpose of this summary is to present, in a concise form, certain concepts relating to one or more aspects involving the mechanisms disclosed herein, prior to the detailed description presented below.

[0007] In one aspect, a hybrid core substrate includes: a rigid core having a top surface and a bottom surface; a first laminated structure having a top surface and a bottom surface, the first laminated structure being disposed above and mounted to the top surface of the rigid core, the first laminated structure including a first plurality of vertically stacked laminates, each laminate in the first laminated structure including a metallized structure, and the first laminated structure including a cavity in which a first component is embedded; a second laminated structure being disposed above and mounted to the top surface of the first laminated structure, the second laminated structure including a second plurality of vertically stacked laminates, each laminate in the second laminated structure including a metallized structure, the second laminated structure having at least one electrical connection to the first laminated structure and at least one electrical connection to the first component; and a first plurality of contacts being disposed on the top surface of the second laminated structure and electrically connected to the second laminated structure.

[0008] In one aspect, a method for manufacturing a hybrid core substrate includes: providing a rigid core having a top surface and a bottom surface; forming a first laminated structure disposed above and mounted to the top surface of the rigid core, the first laminated structure including a first plurality of vertically stacked laminates, each laminate in the first laminated structure including a metallization structure, the first laminated structure including a cavity in which a first component is embedded; forming a second laminated structure disposed above and mounted to the top surface of the first laminated structure, the second laminated structure including a second plurality of vertically stacked laminates, each laminate in the second laminated structure including a metallization structure, the second laminated structure having at least one electrical connection to the first laminated structure and at least one electrical connection to the first component; and forming a first plurality of contacts disposed on the top surface of the second laminated structure and electrically connected to the second laminated structure.

[0009] Based on the accompanying drawings and detailed description, other objects and advantages associated with the aspects disclosed herein will be apparent to those skilled in the art. Attached Figure Description

[0010] A more complete understanding of the various aspects of this disclosure and its many accompanying advantages will be readily available when considered in conjunction with the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar parts, and the drawings are given for illustrative purposes only and do not constitute any limitation on this disclosure.

[0011] Figure 1 This is a side cross-sectional view of a conventional device, which includes a core and multilayer substrates attached above and below the core.

[0012] Figure 2 This is a side cross-sectional view of a hybrid core substrate with embedded components according to various aspects of this disclosure.

[0013] Figures 3A to 3M Various parts of a process for manufacturing a hybrid core substrate with embedded components according to aspects of this disclosure are illustrated.

[0014] Figure 4 This is a flowchart illustrating the steps of an exemplary process for manufacturing a hybrid core substrate having components according to various aspects of this disclosure.

[0015] Figure 5 Exemplary mobile devices according to one or more aspects of this disclosure are illustrated; and

[0016] Figure 6 Examples of various electronic devices that can be integrated with any of the aforementioned integrated devices or semiconductor devices according to one or more aspects of this disclosure are illustrated.

[0017] By convention, the features depicted in the accompanying drawings may not be drawn to scale. Accordingly, for clarity, the dimensions of the depicted features may be arbitrarily enlarged or reduced. By convention, some drawings are simplified for clarity. Therefore, the drawings may not depict all components of a particular device or method. Furthermore, similar reference numerals are used throughout the specification and accompanying drawings to indicate similar features. Detailed Implementation

[0018] This invention discloses a hybrid core substrate with an embedded component and a method for manufacturing the same. In one aspect, the hybrid core substrate includes a rigid core. A first laminate structure is disposed above and mounted to the top surface of the rigid core, and has a cavity in which a first component is embedded. A second laminate structure is disposed above and mounted to the top surface of the first laminate structure, and has at least one electrical connection to the first laminate structure and at least one electrical connection to the first component. A first plurality of contacts are disposed on the top surface of the second laminate structure and electrically connected to the second laminate structure. In some aspects, at least one of the first plurality of contacts is electrically connected to the embedded component. In some aspects, a third laminate structure is disposed below and mounted to the bottom surface of the core, a fourth laminate structure is disposed below and mounted to the bottom surface of the third laminate, and a second plurality of contacts are disposed on the bottom surface of the fourth laminate. In some aspects, vias through the core provide electrical connections from a laminate above the core to a laminate below the core.

[0019] Various aspects of this disclosure are provided in the following description and accompanying drawings of various examples provided for illustrative purposes. Alternative aspects may be devised without departing from the scope of this disclosure. Additionally, well-known elements of this disclosure will not be described in detail or will be omitted so as not to obscure the relevant details of this disclosure.

[0020] The terms “exemplary” and / or “example” are used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” and / or “example” is not necessarily to be construed as superior to or better than other aspects. Similarly, the term “aspects of this disclosure” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed.

[0021] Those skilled in the art will understand that any of a variety of different techniques and methods can be used to represent the information and signals described below. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the following description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof, depending in part on the specific application, in part on the desired design, in part on the corresponding technology, and so on.

[0022] Furthermore, many aspects are described according to a sequence of actions to be performed by elements of, for example, a computing device. It will be appreciated that the various actions described herein can be performed by a particular circuit (e.g., an application-specific integrated circuit (ASIC)), by program instructions executed by one or more processors, or by a combination of both. Additionally, the sequence of actions described herein can be considered to be entirely embodied in any form of non-transitory computer-readable storage medium storing a corresponding set of computer instructions that, when executed, will cause or command the associated processor of the device to perform the functionality described herein. Therefore, various aspects of this disclosure can be embodied in a variety of different forms, all of which are contemplated within the scope of the claimed subject matter. Furthermore, for each aspect described herein, the corresponding form of any such aspect can be described herein as, for example, "logic configured to perform the described actions."

[0023] Figure 2 This is a side cross-sectional view of a device 200 including a hybrid core substrate with embedded components, according to various aspects of this disclosure. Figure 2 In the example shown, device 200 includes a rigid core 202 having one or more through-core vias 204. On either side of the rigid core 202 is a multilayer laminate structure 206 (which can be constructed using a "multilayer coreless" process). Each multilayer laminate structure 206 is connected to its own additional multilayer structure 208. Figure 2In the example shown, BGA contact 210 is attached to the bottom of multilayer structure 208. One or two multilayer laminates 206 may include cavities in which one or more components 212 may be embedded. Each component 212 may be electrically connected to one or both multilayer laminates 206 (which may be via one of the vias 204) and / or one or both multilayer structures 208 (e.g., via multilayer laminates 206). Figure 2 In the example shown, IC 214 is mounted to a contact on the top surface of the top multilayer structure 208.

[0024] As in Figure 2 As can be seen in the example shown, the thickness T' of the rigid core 202 can be significantly smaller than the thickness T of the standard core 102, and the distance D' from IC 214 to component 212 can be much smaller. Figure 1 The distance D from IC 108 to capacitor 110.

[0025] Figures 3A to 3M Various parts of a process for manufacturing a hybrid core substrate with embedded components according to aspects of this disclosure are illustrated.

[0026] Figure 3A An example is shown of a core 300 having one or more through-core vias 302. In some aspects, the core 300 may be a copper-clad laminate (CCL) core. In some aspects, the vias 302 are created by drilling and copper plating. Figure 3A In the example shown, the chip 300 has undergone a photolithography process to create electrical traces on the top and bottom surfaces.

[0027] Figure 3B A core 304 having a surface material 306 is shown, on which a first set of laminated layers 308 has been constructed. The core 304 (on which the laminated layers 308 are constructed) may be the same core as core 300 or a different core from core 300. The first set of laminated layers 308 may be collectively referred to herein as the first laminated layer structure 308. In some aspects, the first set of laminated layers 308 may include Ajinomoto deposited film (ABF) and / or prepreg (PPG) and may be manufactured by printed circuit board (PCB) or substrate processes. Although Figure 3B The laminate 308 is shown only on top of the core 304, but in some aspects, an additional laminate 308 may also be constructed on the bottom of the core. A surface material 306 allows the first laminate structure 308 to be mechanically separated from the core 304. The surface material 306 may be one or more sacrificial layers. For example, in some aspects, the surface material 306 comprises two thin copper foil layers attached to each other with a weak adhesive.

[0028] Figure 3CThe result of separating the first laminate structure 308 from the core 304 is shown in preparation for manufacturing one or more cavities in which a deep trench capacitor (DTC) or other component can be embedded.

[0029] Figure 3D The result is shown after cavity 310 has been created within laminate 308. In some aspects, cavity 310 can be created using mechanical processes (e.g., using drills, lasers, high-pressure water, or other cutting tools). Although in Figure 3D It is not visible in the cross-section shown, but Figure 3D The laminate 308 on the left side did not completely separate from Figure 3D The laminate 308 on the right is cut off; conversely, when viewed from a top view instead of... Figure 3D When viewed in a cross-sectional view, cavity 310 is typically a hole or insert. In some respects, the depth of cavity 310 can be controlled by adjusting the number of laminated layers 308.

[0030] Figure 3E The result is shown after the laminate 308 is mounted onto the adhesive tape 312 or another temporary substrate, in preparation for inserting one or more components into the cavity 310.

[0031] Figure 3F The result is shown after the first component 314 has been mounted into the cavity 310 by adhesive tape 312. Examples of component 314 include, but are not limited to, multilayer ceramic capacitors (MLCCs), inductors, chips, dies, bare dies, routing bridges, power management integrated circuits (PMICs), and other bare, packaged, or encapsulated devices. As used herein, the term "die" refers to a block of integrated circuits that has been specifically designed to work with other blocks of integrated circuits to form a larger, more complex chip. A die is a bare die configured to physically interconnect with at least one other bare die to function as a single device. A die may perform a specific function and may be combined with other dies that perform other specific functions to form a larger integrated circuit. In some aspects, the first component 314 is placed by a component placement machine (e.g., for packaged devices, etc.) or a die bonding machine (e.g., for bare dies, dies, etc.).

[0032] Figure 3G The results are shown after the first filler layer 316 (such as ABF, PPG or other suitable material) has been placed.

[0033] Figure 3H It shows in Figure 3GThe structure shown is the result of removing strip 312 and attaching it to the top side of core 300 using adhesive layer 318, and attaching the second set of laminates 320 to the bottom side of core 300 using adhesive layer 322 and being covered by the second filler layer 324. In some aspects, adhesive layers 318 and 322 comprise prepreg. The second set of laminates 320 may be collectively referred to herein as the second laminate structure 320. In some aspects, the second set of laminates 320 may comprise ABF and / or PPG and may be manufactured using PCB or substrate processes.

[0034] Figure 3I This shows the drilling of a through hole 326 for connection. Figure 3I The top and bottom surfaces of the structure shown, along with the photolithography process used to create vias through the first fill layer 316 and through the second fill layer 324, result in this structure. Figure 3I In the example shown, the via through the first filler layer 316 is in electrical contact with the first component 314.

[0035] Figure 3J The result is shown after a third laminate structure 328 is created over a first fill layer 318 and a fourth laminate structure 330 is created under a second fill layer 324. In some aspects, the layers in the third laminate structure 328 and / or the fourth laminate structure 330 may include ABF and / or PPG and may be manufactured using PCB or substrate processes. In some aspects, the layers may be created using lamination, drilling, electroplating, photolithography, any front-end processes, or combinations thereof.

[0036] Figure 3K The diagram shows the result after applying a first solder resist (SR) layer 332 to the top surface of the third laminate structure 328 and a second SR layer 334 to the bottom surface of the fourth laminate structure 330, followed by surface treatment to create solder pads. Figure 3K In the example shown, solder mask defined (SMD) pads 336 and non-SMD (NSMD) pads 338 are created; however, alternative embodiments may use only SMD pads or only NSMD pads. The resulting structure is a finished hybrid core substrate with embedded components.

[0037] Figure 3L An example of an application of a hybrid core substrate with embedded components is illustrated. The hybrid core substrate includes a plurality of surface-mount components (e.g., second component 340 and third component 342) mounted to pads on a top surface and contacts 344 (e.g., ball grid array (BGA) etc.) mounted to pads on a bottom surface. Examples of surface-mount components may include, but are not limited to, chips, dies, packages, packaged devices, or other components. It can be seen that the distance from the third component 342 to the first component 314 is less than the distance from the third component 342 to the component mounted to the bottom contact 344.

[0038] For example, the thickness of a typical thick core can range from 0.15 mm to 2.0 mm, excluding laminates, and a thicker core is required when multiple laminates are supported at the top and bottom. Therefore, the distance from the top-mounted component to the bottom-mounted component on either side of a typical thick core can be greater than 3.0 mm.

[0039] In contrast, embedded components typically have a thickness between 0.05 mm and 0.8 mm. For example, Figure 3M The hybrid core substrate shown has, in some aspects, a core 300 with a thickness of 0.1 mm to 0.8 mm, and each of the first, second, third, and fourth laminated structures has a thickness of 0.1 mm to 0.8 mm. Therefore, the total thickness of the hybrid core substrate, including the laminates, can be from 0.6 mm to 2.0 mm. Consequently, the distance from the top-mounted component to the bottom-mounted component does not exceed 2.0 mm, and the distance from the top-mounted component to the embedded component can be as small as 0.1 mm to 0.6 mm.

[0040] Figure 3M An example hybrid core substrate is shown, in which components are embedded in both a laminate 308 above core 300 and a laminate 320 below core 300. Figure 3M In the example shown, the first component 314 is embedded within the laminate 308, and the fourth component 346 is embedded within the laminate 320. It should be understood that multiple components may be embedded within laminates above or below the core 300.

[0041] It should be understood that the foregoing manufacturing process is provided only as a general illustration of some aspects of this disclosure and is not intended to limit this disclosure or the appended claims. Furthermore, many details of the manufacturing process known to those skilled in the art may be omitted or combined in the various overview process sections to facilitate an understanding of the various aspects disclosed without presenting every detail and / or all possible process variations in detail.

[0042] Hybrid core substrates with embedded components offer several advantages over conventional thick core substrates, including but not limited to the following: Hybrid core substrates enable the embedding of large components into the substrate without sacrificing rigidity. Embedding components on either side of a rigid core increases the versatility of embedded passive substrates (EPS). A “multilayer coreless structure with open cavities” configuration (e.g., first laminate structure 308 and second laminate structure 320) provides wiring flexibility within the hybrid core, which helps reduce the number of additional layers (e.g., third laminate structure 328 and fourth laminate structure 330) that need to be built over the cavity 310 and the embedded component 314. The distance between the embedded component 314 and surface-mounted components (such as the third component 342) can be significantly reduced, resulting in better performance. For example, embedded capacitors can be placed closer to the IC that needs them. Another advantage is that because component 314 is embedded in the first laminate structure 328 rather than in the core 300, the core 300 does not have cavities and therefore has better structural integrity. Furthermore, more internal volume in the Core 300 can be used for top-to-bottom wiring. All these improvements allow for a reduction in package size and cost, and the reduced top-to-bottom surface distance improves power and signal integrity, which in turn improves performance and power consumption.

[0043] Figure 4 This is a flowchart of an example process 400 for manufacturing a hybrid core substrate having components, according to various aspects of this disclosure. Figure 4 As shown, process 400 may include providing a rigid core having a top surface and a bottom surface at frame 410. In some aspects, providing a rigid core includes providing a copper-clad laminate (CCL). In some aspects, providing a rigid core includes providing a core with a thickness between 0.1 mm and 0.8 mm.

[0044] like Figure 4 As further shown, process 400 may include forming a first laminated structure at frame 420, the first laminated structure being disposed above and mounted to the top surface of the rigid core, the first laminated structure comprising a first plurality of vertically stacked laminated layers, each laminated layer comprising a metallized structure, and the first laminated structure including a cavity in which a first component is embedded. In some aspects, the first laminated structure includes a prepreg.

[0045] like Figure 4As further shown, process 400 may include forming a second laminated structure at block 430, the second laminated structure being disposed above and mounted to the top surface of the first laminated structure, the second laminated structure comprising a second plurality of vertically stacked laminated layers, each laminated layer in the second laminated structure comprising a metallization structure, the second laminated structure having at least one electrical connection to the first laminated structure and at least one electrical connection to the first component. In some aspects, the second laminated structure includes a prepreg. In some aspects, the first component includes a capacitor, an inductor, or an integrated circuit. In some aspects, the first component includes a chip, a die, or a packaged device.

[0046] like Figure 4 As further shown, process 400 may include forming a first plurality of contacts at block 440, the first plurality of contacts being disposed on the top surface of the second laminated structure and electrically connected to the second laminated structure. In some aspects, forming the first plurality of contacts includes forming at least one of the first plurality of contacts to be electrically connected to the first component through the second laminated structure.

[0047] In some aspects, process 400 further includes forming a third laminated structure disposed below and mounted to the bottom surface of the rigid core, the third laminated structure comprising a third plurality of vertically stacked laminated layers, each laminated layer in the third laminated structure comprising a metallized structure. In some aspects, the third laminated structure includes a prepreg.

[0048] In some aspects, process 400 further includes: forming a fourth laminated structure disposed below and mounted to the bottom surface of the third laminated structure, the fourth laminated structure comprising a fourth plurality of vertically stacked laminated layers, each laminated layer in the fourth laminated structure comprising a metallized structure, the fourth laminated structure having at least one electrical connection to the third laminated structure; and forming a second plurality of contacts disposed on the bottom surface of the fourth laminated structure and electrically connected to the fourth laminated structure. In some aspects, the fourth laminated structure includes a prepreg.

[0049] In some aspects, forming a third laminated structure includes forming a second cavity in which a second component is embedded, and forming a fourth laminated structure includes forming at least one electrical connection to the second component.

[0050] In some aspects, providing a rigid core includes providing at least one through-core via that provides an electrical path from a first laminated structure to a third laminated structure. In some aspects, the process includes forming at least one electrical connection between the first and third laminated structures. In some aspects, the process includes forming at least one electrical connection between a second and a fourth laminated structure. In some aspects, the process includes forming at least one electrical connection between at least one contact of a first plurality of contacts and at least one contact of a second plurality of contacts.

[0051] In some aspects, the thickness of the finished hybrid core substrate ranges from 0.6 mm to 2.0 mm.

[0052] Process 400 may include additional embodiments, such as any single embodiment or any combination of one or more other processes described below and / or in conjunction with those described elsewhere herein. Although Figure 4 An example block diagram of process 400 is shown, but in some specific implementations, process 400 may include... Figure 4 The boxes depicted in the process 400 may be fewer, different, or arranged differently than additional boxes, fewer, different, or different from other boxes. Alternatively, two or more boxes in the process 400 may be executed in parallel.

[0053] Figure 5 Exemplary mobile devices are illustrated according to some examples of this disclosure. Reference now is made to... Figure 5 A block diagram of a mobile device configured according to exemplary aspects is depicted and generally designated as mobile device 500. In some aspects, mobile device 500 may be configured as a wireless communication device. As shown, mobile device 500 includes a processor 502. Processor 502 is shown as including an instruction pipeline 504, a buffer processing unit (BPU) 506, a branch instruction queue (BIQ) 508, and a choke 510, as well known in the art. For clarity, other well-known details of these blocks (e.g., counters, entries, confidence fields, weighted sums, comparators, etc.) have been omitted from this view of processor 502. Processor 502 is communicatively coupled to memory 512 via a link, which may be a die-to-die or chip-to-chip link. Mobile device 500 also includes a display 514 and a display controller 516, wherein display controller 516 is coupled to processor 502 and display 514.

[0054] In some respects, Figure 5It may include a decoder / decoder (decoder) 518 (e.g., an audio and / or voice decoder) coupled to processor 502; a speaker 520 and a microphone 522 coupled to decoder 518; and a wireless controller circuit 524 (which may include a modem, radio frequency (RF) circuitry, filters, etc., and may be implemented using one or more flip-chip devices as disclosed herein) coupled to wireless antenna 526 and processor 502.

[0055] In certain aspects, where one or more of the boxes above are present, processor 502, display controller 516, memory 512, decoder 518, and wireless controller circuitry 524 may be included in a system-in-package or system-on-a-chip (SoC) that may be implemented wholly or partially using the techniques disclosed herein. Input device 528 (e.g., a physical or virtual keyboard), power source 530 (e.g., a battery), display 514, speaker 520, microphone 522, wireless antenna 526, and power source 530 may be located external to the SoC and may be coupled to components of the SoC, such as interfaces or controllers.

[0056] It should be noted that, although Figure 5 Mobile devices are depicted, but processor 502 and memory 512 can also be integrated into set-top boxes, music players, video players, entertainment units, navigation devices, personal digital assistants (PDAs), fixed location data units, computers, laptop computers, tablet computers, communication devices, mobile phones or other similar devices.

[0057] Figure 6 Various electronic devices that can be integrated with any of the aforementioned integrated devices or semiconductor devices are illustrated according to various examples of this disclosure. For example, mobile phone device 602, laptop computer device 604, and fixed-location terminal device 606 can each be considered as general user equipment (UE) and may include, for example, the device 600 described herein. The device may be, for example, any of the integrated circuit, die, integrated device, integrated device package, integrated circuit device, device package, integrated circuit (IC) package, and multilayer package device described herein. Figure 6The mobile phone device 602, laptop computer device 604, and fixed-location terminal device 606 illustrated herein are merely exemplary. Other electronic devices may also be characterized by their components, including but not limited to a group of devices (e.g., electronic devices) comprising: mobile devices, handheld personal communication system (PCS) units, portable data units (such as personal digital assistants), GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed-location data units (such as instrument reading devices), communication devices, smartphones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), Internet of Things (IoT) devices, or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0058] As can be seen in the detailed description above, different features are grouped together in the examples. This manner of disclosure should not be construed as an intention to include more features in the example clauses than are expressly mentioned in each clause. Rather, the various aspects of this disclosure may include fewer features than those in the individual example clauses disclosed. Therefore, the following clauses should be regarded accordingly as incorporated into the description, where each clause may serve as a separate example. Although each dependent clause may refer in the clause to a specific combination with one of the other clauses, the aspect of that dependent clause is not limited to that specific combination. It should be understood that other example clauses may also include combinations of aspects of a dependent clause with the subject matter of any other dependent or independent clause, or combinations of any feature with other dependent and independent clauses. The various aspects disclosed herein expressly include these combinations unless expressly stated or readily inferred that a particular combination is not intended for use (e.g., contradictory aspects, such as defining an element as both an electrical insulator and an electrical conductor). Furthermore, it is contemplated that aspects of a clause may be included in any other independent clause, even if that clause does not directly depend on the independent clause.

[0059] Specific implementation examples are described in the following numbered clauses:

[0060] Clause 1. A hybrid core substrate, the hybrid core substrate comprising: a rigid core having a top surface and a bottom surface; a first laminated structure having a top surface and a bottom surface, the first laminated structure being disposed above and mounted to the top surface of the rigid core, the first laminated structure comprising a first plurality of vertically stacked laminates, each laminated layer of the first laminated structure comprising a metallization structure, and the first laminated structure comprising a cavity in which a first component is embedded; a second laminated structure being disposed above and mounted to the top surface of the first laminated structure, the second laminated structure comprising a second plurality of vertically stacked laminates, each laminated layer of the second laminated structure comprising a metallization structure, the second laminated structure having at least one electrical connection to the first laminated structure and at least one electrical connection to the first component; and a first plurality of contacts being disposed on the top surface of the second laminated structure and electrically connected to the second laminated structure.

[0061] Clause 2. The hybrid core substrate as described in Clause 1, wherein the rigid core comprises a copper-clad laminate (CCL).

[0062] Clause 3. The hybrid core substrate according to any one of Clauses 1 to 2, wherein at least one of the first laminate structure or the second laminate structure comprises a prepreg.

[0063] Clause 4. The hybrid core substrate according to any one of Clauses 1 to 3, wherein the first component includes a capacitor, an inductor, or an integrated circuit.

[0064] Clause 5. A hybrid core substrate according to any one of Clauses 1 to 4, wherein the first component comprises a chip, a die, or a package device.

[0065] Clause 6. The hybrid core substrate according to any one of Clauses 1 to 5, wherein at least one of the first plurality of contacts is electrically connected to the first component via the second laminate structure.

[0066] Clause 7. The hybrid core substrate according to any one of Clauses 1 to 6, the hybrid core substrate further comprising: a third laminate structure disposed below and mounted to the bottom surface of the rigid core, the third laminate structure comprising a third plurality of vertically stacked laminates, each laminate in the third laminate structure comprising a metallization structure; a fourth laminate structure disposed below and mounted to the bottom surface of the third laminate structure, the fourth laminate structure comprising a fourth plurality of vertically stacked laminates, each laminate in the fourth laminate structure comprising a metallization structure, the fourth laminate structure having at least one electrical connection to the third laminate structure; and a second plurality of contacts disposed on the bottom surface of the fourth laminate structure and electrically connected to the fourth laminate structure.

[0067] Clause 8. The hybrid core substrate according to Clause 7, wherein at least one of the third laminate structure or the fourth laminate structure comprises a prepreg.

[0068] Clause 9. The hybrid core substrate according to any one of Clauses 7 to 8, wherein the third laminate structure includes a second cavity in which the second component is embedded, and wherein the fourth laminate structure includes at least one electrical connection to the second component.

[0069] Clause 10. A hybrid core substrate according to any one of Clauses 7 to 9, wherein the rigid core includes at least one through-core via providing an electrical path from the first laminate structure to the third laminate structure.

[0070] Clause 11. The hybrid core substrate according to Clause 10, wherein the hybrid core substrate includes at least one electrical connection between the first laminate structure and the third laminate structure.

[0071] Clause 12. The hybrid core substrate according to any one of Clauses 10 to 11, wherein the hybrid core substrate includes at least one electrical connection between the second laminate structure and the fourth laminate structure.

[0072] Clause 13. The hybrid core substrate according to any one of Clauses 10 to 12, the hybrid core substrate comprising at least one electrical connection between at least one of the first plurality of contacts and at least one of the second plurality of contacts.

[0073] Clause 14. The hybrid core substrate according to any one of Clauses 1 to 13, wherein the thickness of the core is between 0.1 mm and 0.8 mm.

[0074] Clause 15. The hybrid core substrate according to any one of Clauses 1 to 14, wherein the thickness of the hybrid core substrate is between 0.6 mm and 2.0 mm.

[0075] Clause 16. A method for manufacturing a hybrid core substrate, the method comprising: providing a rigid core having a top surface and a bottom surface; forming a first laminated structure disposed above and mounted to the top surface of the rigid core, the first laminated structure comprising a first plurality of vertically stacked laminated layers, each laminated layer comprising a metallization structure, the first laminated structure including a cavity in which a first component is embedded; forming a second laminated structure disposed above and mounted to the top surface of the first laminated structure, the second laminated structure comprising a second plurality of vertically stacked laminated layers, each laminated layer comprising a metallization structure, the second laminated structure having at least one electrical connection to the first laminated structure and at least one electrical connection to the first component; and forming a first plurality of contacts disposed on the top surface of the second laminated structure and electrically connected to the second laminated structure.

[0076] Clause 17. The method according to Clause 16, wherein providing the rigid core includes providing a copper-clad laminate (CCL).

[0077] Clause 18. The method according to any one of Clauses 16 to 17, wherein at least one of the first laminated structure or the second laminated structure comprises a prepreg.

[0078] Clause 19. The method according to any one of Clauses 16 to 18, wherein the first component comprises a capacitor, an inductor, or an integrated circuit.

[0079] Clause 20. The method according to any one of Clauses 16 to 19, wherein the first component comprises a chip, a die, or a package device.

[0080] Clause 21. The method according to any one of Clauses 16 to 20, wherein forming the first plurality of contacts includes forming at least one of the first plurality of contacts to be electrically connected to the first component via the second laminated layer structure.

[0081] Clause 22. The method according to any one of Clauses 16 to 21, the method further comprising: forming a third laminated structure disposed below and mounted to the bottom surface of the rigid core, the third laminated structure comprising a third plurality of vertically stacked laminated layers, each laminated layer of the third laminated structure comprising a metallized structure; forming a fourth laminated structure disposed below and mounted to the bottom surface of the third laminated structure, the fourth laminated structure comprising a fourth plurality of vertically stacked laminated layers, each laminated layer of the fourth laminated structure comprising a metallized structure, the fourth laminated structure having at least one electrical connection to the third laminated structure; and forming a second plurality of contacts disposed on the bottom surface of the fourth laminated structure and electrically connected to the fourth laminated structure.

[0082] Clause 23. The method according to Clause 22, wherein at least one of the third laminate structure or the fourth laminate structure comprises a prepreg.

[0083] Clause 24. The method according to any one of Clauses 22 to 23, wherein forming the third laminated structure includes forming a second cavity in which the second component is embedded, and wherein forming the fourth laminated structure includes forming at least one electrical connection to the second component.

[0084] Clause 25. The method according to any one of Clauses 22 to 24, wherein providing the rigid core includes providing at least one through-core via, the at least one through-core via providing an electrical path from the first laminated structure to the third laminated structure.

[0085] Clause 26. The method according to Clause 25, the method comprising forming at least one electrical connection between the first laminated structure and the third laminated structure.

[0086] Clause 27. The method according to any one of Clauses 25 to 26, the method comprising forming at least one electrical connection between the second laminated structure and the fourth laminated structure.

[0087] Clause 28. The method according to any one of Clauses 25 to 27, the method comprising forming at least one electrical connection between at least one of the first plurality of contacts and at least one of the second plurality of contacts.

[0088] Clause 29. The method according to any one of Clauses 16 to 28, wherein providing the rigid core comprises providing a core with a thickness between 0.1 mm and 0.8 mm.

[0089] Clause 30. The method according to any one of Clauses 16 to 29, wherein the thickness of the hybrid core substrate is between 0.6 mm and 2.0 mm.

[0090] Those skilled in the art will understand that information and signals can be represented using any of a variety of different techniques and methods. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0091] Furthermore, those skilled in the art will understand that the various exemplary logic blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, various exemplary components, blocks, modules, circuits, and steps have been described above in general terms of their functionality. Whether this functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such specific implementation decisions should not be construed as departing from the scope of this disclosure.

[0092] The various exemplary logic blocks, modules, and circuits described in conjunction with the aspects disclosed herein can be implemented or executed using general-purpose processors, DSPs, ASICs, FPGAs, or other programmable logic devices, discrete gate or transistor logic elements, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor may be a microprocessor, but in alternative embodiments, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors combined with a DSP core, or any other such configuration.

[0093] The methods, sequences, and / or algorithms described in conjunction with the aspects disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or a combination of both. The software module may reside in random access memory (RAM), flash memory, read-only memory (ROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium known in the art. Example storage media are coupled to a processor such that the processor can read information from and write information to the storage medium. Alternatively, the storage medium may be integral with the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal (e.g., a UE). Alternatively, the processor and storage medium may reside as discrete components in the user terminal.

[0094] In one or more examples, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored as one or more instructions or code on or transmitted via a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, which includes any medium that facilitates the transfer of a computer program from one place to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such computer-readable media may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and is accessible to a computer. Additionally, any connection is appropriately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included within the definition of a medium. As used herein, disks and optical discs include: compact optical discs (CDs), laser discs, optical discs, digital versatile discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while optical discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0095] While the foregoing disclosure illustrates exemplary aspects of this disclosure, it should be noted that various changes and modifications may be made herein without departing from the scope of this disclosure as defined by the appended claims. Furthermore, the functions, steps, and / or actions of the method claims according to the aspects of this disclosure described herein need not be performed in any particular order. Moreover, although elements of this disclosure may be described or claimed in the singular, the plural form may also be considered unless expressly stated as limited to the singular.

Claims

1. A hybrid core substrate, the hybrid core substrate comprising: A rigid core having a top surface and a bottom surface; A first laminated structure having a top surface and a bottom surface, the first laminated structure being disposed above and mounted to the top surface of the rigid core, the first laminated structure comprising a first plurality of vertically stacked laminated layers, each laminated layer comprising a metallized structure, and the first laminated structure comprising a cavity in which a first component is embedded. A second laminated structure is disposed above and mounted to the top surface of the first laminated structure. The second laminated structure includes a second plurality of vertically stacked laminated layers. Each laminated layer in the second laminated structure includes a metallized structure. The second laminated structure has at least one electrical connection to the first laminated structure and at least one electrical connection to the first component. and The first plurality of contacts are disposed on the top surface of the second laminate structure and electrically connected to the second laminate structure.

2. The hybrid core substrate according to claim 1, wherein the rigid core comprises a copper-clad laminate (CCL).

3. The hybrid core substrate according to claim 1, wherein at least one of the first laminate structure or the second laminate structure comprises a prepreg.

4. The hybrid core substrate of claim 1, wherein the first component comprises a capacitor, an inductor, or an integrated circuit.

5. The hybrid core substrate of claim 1, wherein the first component comprises a chip, a die, or a packaging device.

6. The hybrid core substrate of claim 1, wherein at least one of the first plurality of contacts is electrically connected to the first component via the second laminate structure.

7. The hybrid core substrate according to claim 1, wherein the hybrid core substrate further comprises: A third laminated structure is disposed below and mounted to the bottom surface of the rigid core, the third laminated structure comprising a third plurality of vertically stacked laminated layers, each laminated layer in the third laminated structure comprising a metallized structure; A fourth laminated structure is disposed below and mounted to the bottom surface of the third laminated structure, the fourth laminated structure comprising a fourth plurality of vertically stacked laminated layers, each laminated layer in the fourth laminated structure comprising a metallization structure, and the fourth laminated structure having at least one electrical connection to the third laminated structure. and The second plurality of contacts are disposed on the bottom surface of the fourth laminate structure and electrically connected to the fourth laminate structure.

8. The hybrid core substrate according to claim 7, wherein at least one of the third laminate structure or the fourth laminate structure comprises a prepreg.

9. The hybrid core substrate of claim 7, wherein the third laminate structure includes a second cavity in which the second component is embedded, and wherein the fourth laminate structure includes at least one electrical connection to the second component.

10. The hybrid core substrate of claim 7, wherein the rigid core includes at least one through-core via, the at least one through-core via providing an electrical path from the first laminate structure to the third laminate structure.

11. The hybrid core substrate of claim 10, wherein the hybrid core substrate includes at least one electrical connection between the first laminate structure and the third laminate structure.

12. The hybrid core substrate of claim 10, wherein the hybrid core substrate includes at least one electrical connection between the second laminate structure and the fourth laminate structure.

13. The hybrid core substrate of claim 10, wherein the hybrid core substrate includes at least one electrical connection between at least one of the first plurality of contacts and at least one of the second plurality of contacts.

14. The hybrid core substrate according to claim 1, wherein the thickness of the rigid core is between 0.1 mm and 0.8 mm.

15. The hybrid core substrate according to claim 1, wherein the thickness of the hybrid core substrate is between 0.6 mm and 2.0 mm.

16. A method for manufacturing a hybrid core substrate, the method comprising: Provides a rigid core with a top surface and a bottom surface; A first laminated structure is formed, the first laminated structure is disposed above and mounted to the top surface of the rigid core, the first laminated structure includes a first plurality of vertically stacked laminated layers, each laminated layer in the first laminated structure includes a metallized structure, and the first laminated structure includes a cavity in which a first component is embedded. A second laminated structure is formed, the second laminated structure is disposed above and mounted to the top surface of the first laminated structure, the second laminated structure includes a second plurality of vertically stacked laminated layers, each laminated layer in the second laminated structure includes a metallized structure, and the second laminated structure has at least one electrical connection to the first laminated structure and at least one electrical connection to the first component; as well as A first plurality of contacts are formed, which are disposed on the top surface of the second laminate structure and electrically connected to the second laminate structure.

17. The method of claim 16, wherein providing the rigid core comprises providing a copper-clad laminate (CCL).

18. The method of claim 16, wherein at least one of the first laminated structure or the second laminated structure comprises a prepreg.

19. The method of claim 16, wherein the first component comprises a capacitor, an inductor, or an integrated circuit.

20. The method of claim 16, wherein the first component comprises a chip, a die, or a package device.

21. The method of claim 16, wherein forming the first plurality of contacts comprises forming at least one of the first plurality of contacts to be electrically connected to the first component via the second laminated layer structure.

22. The method according to claim 16, further comprising: A third laminated structure is formed, the third laminated structure being disposed below and mounted to the bottom surface of the rigid core, the third laminated structure comprising a third plurality of vertically stacked laminated layers, each laminated layer in the third laminated structure comprising a metallized structure; A fourth laminated structure is formed, the fourth laminated structure being disposed below and mounted to the bottom surface of the third laminated structure, the fourth laminated structure comprising a fourth plurality of vertically stacked laminated layers, each laminated layer in the fourth laminated structure comprising a metallized structure, and the fourth laminated structure having at least one electrical connection to the third laminated structure; as well as A second plurality of contacts are formed, which are disposed on the bottom surface of the fourth laminate structure and electrically connected to the fourth laminate structure.

23. The method of claim 22, wherein at least one of the third laminated structure or the fourth laminated structure comprises a prepreg.

24. The method of claim 22, wherein forming the third laminated structure includes forming a second cavity in which the second component is embedded, and wherein forming the fourth laminated structure includes forming at least one electrical connection to the second component.

25. The method of claim 22, wherein providing the rigid core includes providing at least one through-core via, the at least one through-core via providing an electrical path from the first laminated structure to the third laminated structure.

26. The method of claim 25, wherein the method includes forming at least one electrical connection between the first laminated structure and the third laminated structure.

27. The method of claim 25, wherein the method includes forming at least one electrical connection between the second laminated structure and the fourth laminated structure.

28. The method of claim 25, wherein the method comprises forming at least one electrical connection between at least one of the first plurality of contacts and at least one of the second plurality of contacts.

29. The method of claim 16, wherein providing the rigid core comprises providing a core with a thickness between 0.1 mm and 0.8 mm.

30. The method of claim 16, wherein the thickness of the hybrid core substrate is between 0.6 mm and 2.0 mm.

Images