Environment-friendly wafer gold stripping device and process for VCSEL chip

Abstract

The invention discloses an environment-friendly wafer gold stripping device and process for a VCSEL chip, and relates to the technical field of wafer gold stripping, the environment-friendly wafer gold stripping device comprises a machine body, a gold stripping assembly is arranged in the machine body, the gold stripping assembly is composed of a fixing groove, an outer ring and a gold stripping body, the fixing groove is located in the bottom surface of the machine body, the outer ring is located above the fixing groove, and the gold stripping body is located above the outer ring. A gold stripping body is arranged on the side, away from the fixing groove, of the outer ring. The gold stripping body is composed of a fixing body and a fixing ring. A rotating groove is formed in the fixing body, and a plurality of gold stripping rings are arranged in the fixing ring; a rotating shaft is arranged in the rotating groove, and a plurality of shifting rod wheels are arranged on the shaft wall of the rotating shaft; through the wavy reciprocating motion of the plurality of gold stripping rings, the washing liquid continuously flows from the center of the wafer to the edge of the wafer, and in the process that the distance between the gold stripping rings and the surface of the wafer is continuously reduced, the flow speed is increased step by step, so that the effect that the metal film is separated from the surface of the wafer is further enhanced.

Description

Technical Field

[0001] This invention relates to the field of wafer gold stripping technology, specifically an environmentally friendly wafer gold stripping device and process for VCSEL chips. Background Technology

[0002] A wafer gold stripping device is a piece of equipment used in semiconductor manufacturing and related processes to process the surface of wafers. It is mainly used to peel off or clean the metal film on the wafer surface. Existing wafer gold stripping devices usually adopt a process of rinsing from one edge of the wafer to the other edge, so that the rinsing water flow rate is constant. This makes the rinsing force when the water is in contact with the wafer greater than the rinsing force at the point away from the water contact with the wafer. As a result, the rinsing effect gradually decreases, and the metal film peeling effect on the wafer surface is not good, and the time consumed is long. Summary of the Invention

[0003] The purpose of this invention is to provide an environmentally friendly wafer gold stripping device and process for VCSEL chips, so as to solve the problems mentioned in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: An environmentally friendly wafer gold stripping device and process for VCSEL chips includes a body, and a gold stripping component is disposed inside the body. The gold stripping component consists of a fixing groove, an outer ring and a gold stripping body. The fixing groove is located on the bottom surface of the body, the outer ring is located above the fixing groove, and the gold stripping body is disposed on the side of the outer ring away from the fixing groove.

[0005] Preferably, the machine body is provided with movable arms on both sides, the movable arms are connected to the outer wall of the outer ring, the movable arms are provided with a movable motor, the drive shaft of the movable motor is provided with a transmission wheel, the transmission wheel is in frictional contact with the outer wall of the machine body, and the outer ring is slidably connected to the fixed groove.

[0006] The wafer is placed in front of the fixing slot, and the moving arm is located at the end of the machine body away from the fixing slot. At this time, the outer ring and the gold stripping body are located above the fixing slot, and the outer ring is detached from the fixing slot. After the wafer is placed in the fixing slot, the controller starts the moving motor. The drive shaft of the moving motor drives the transmission wheel to rotate. The transmission wheel makes frictional contact with the machine body, causing the transmission wheel to drive the moving arm to move. The moving arm moves towards the side closer to the fixing slot. At the same time, the moving arm drives the outer ring to move, causing the outer ring to move towards the fixing slot, and then the bottom of the outer ring contacts the bottom of the fixing slot.

[0007] Preferably, a rotating motor is provided on the top of the machine body, and a telescopic rod is provided on the drive shaft of the rotating motor. The side of the telescopic rod near the fixed groove is connected to the gold stripping body, and the gold stripping body is in contact with the outer ring surface.

[0008] As the moving arm drives the outer ring to move closer to the fixed groove, the gold stripping body moves with the outer ring under the action of gravity due to the contact between the gold stripping body and the outer ring. Consequently, the gold stripping body also moves closer to the fixed groove. When the outer ring is fixed in contact with the fixed groove, the fixed groove, the outer ring and the gold stripping body combine to form a closed gold stripping space, which is isolated from the inside of the machine body. As the gold stripping body moves, it causes the telescopic rod to extend. When the gold stripping of the wafer begins, the controller controls the rotary motor to drive the telescopic rod to rotate. During the rotation of the telescopic rod, the gold stripping body rotates, thereby realizing the gold stripping process of the wafer.

[0009] Preferably, the gold stripping body is composed of a fixed body and a fixed ring. The fixed body has a fixed ring at its bottom. The outer wall of the fixed ring is slidably connected to the inside of the outer ring. The fixed body has a rotating groove. The fixed ring has a plurality of gold stripping rings inside it. The plurality of gold stripping rings are combined to form a concentric ring structure.

[0010] After the rotating motor is started, the fixed body rotates through the rotation of the telescopic rod. During the rotation of the fixed body, the fixed ring rotates, and at the same time the fixed ring rotates, the fixed body drives the rotating groove to rotate.

[0011] Preferably, the fixing ring is further provided with a plurality of fixing rods, and the plurality of gold-peeling rings are provided with a plurality of moving grooves. The fixing rods extend into the moving grooves and are slidably connected to the moving grooves. Springs are provided on both the upper and lower sides of the fixing rods. One end of the spring is connected to the moving groove, and the other end of the spring is connected to the fixing rod.

[0012] During the rotation of the fixed ring, the fixed rod is driven to rotate. Since the fixed rod extends into the moving groove, the fixed rod drives several gold-peeling rings to rotate. As the lever wheel rotates around the axis of the rotating shaft under the action of the helical gear, the lever wheel contacts the top of the gold stripping ring during the rotation process. As the lever wheel continues to rotate, it pushes the gold stripping ring to move, causing the gold stripping ring to move closer to the fixed groove. At this time, the spring between the top of the moving groove and the top of the fixed rod is compressed, and the spring between the bottom of the moving groove and the bottom of the fixed rod is stretched. When the lever wheel compresses the gold stripping ring to its maximum stroke, the squeezing force of the lever wheel on the gold stripping ring decreases as the lever wheel rotates. Consequently, the gold stripping ring returns to its original position under the action of the spring force, so that the gold stripping ring is always in a state of reciprocating up and down along the axis of the gold stripping ring.

[0013] Preferably, a rotating shaft is provided in the rotating groove, and a plurality of lever wheels are provided on the shaft wall of the rotating shaft. Each lever wheel corresponds to a gold stripping ring, and the lever wheels are rotatably connected to the gold stripping ring.

[0014] After the rotating groove rotates due to the influence of the fixed body, the rotating groove drives the rotating shaft to rotate, and at the same time the rotating shaft rotates, it drives several lever wheels to rotate. At this time, the lever wheels rotate around the axis of the fixed body.

[0015] Preferably, helical gears are provided at both ends of the rotating shaft, and a toothed ring is provided at the top of the outer ring, wherein the helical gears mesh with the toothed ring for transmission.

[0016] Because the helical gear and the gear ring are in a meshing state, when the rotating groove rotates, it drives the rotating shaft to rotate around the axis of the gold-peeling body. This causes the rotating shaft to drive the helical gear to rotate. During the rotation, the helical gear meshes with the gear ring, causing the helical gear to rotate on its own axis while rotating around the axis of the gold-peeling body. This rotation of the helical gear drives the rotating shaft to rotate, and the rotation of the rotating shaft drives several lever wheels to rotate.

[0017] Preferably, the arrangement angles of two adjacent lever wheels are different.

[0018] Because the arrangement angles of two adjacent lever wheels are different, and the lever wheels correspond one-to-one with the gold-peeling rings, the lever wheels contact the top of the gold-peeling rings when they rotate, and push the gold-peeling rings to move up and down repeatedly, so that several gold-peeling rings present a wave-like motion trajectory.

[0019] Preferably, the gold stripping ring has a conveying groove inside, and two adjacent conveying grooves are interconnected. The side of the gold stripping ring near the outer ring has an inclined surface, and the side of the gold stripping ring away from the outer ring has an arc surface. Several water spray nozzles are provided on the side of the gold stripping ring located on the inclined surface. The water spray nozzles are connected to the conveying groove. A water inlet pipe is provided at the top of the outermost gold stripping ring. The water inlet pipe is connected to the conveying groove through a pipe. A water pump is provided inside the machine body. The water pump is connected to the water inlet pipe through a telescopic pipe.

[0020] During the gold stripping process, the controller starts the water pump, which delivers the rinsing solution to the inlet pipe through the telescopic pipe. The rinsing solution then flows through the inlet pipe and into the conveying tank. Since two adjacent conveying tanks are connected, the rinsing solution is delivered from the outermost gold stripping ring to the gold stripping ring in the center. Finally, the rinsing solution is delivered to several spray nozzles through the conveying tank and sprayed outwards from the spray nozzles onto the wafer, thereby washing away the metal film on the wafer surface and achieving the gold stripping effect. During the rinsing process, several gold stripping rings are affected by the lever wheels and move up and down in the axial direction. Due to the different arrangement angles of the lever wheels, the gold stripping rings move in a wave-like manner in the radial direction, causing the distance between the bottom of the gold stripping ring and the wafer to change continuously. As the distance between the bottom of the outermost gold stripping ring and the wafer continuously decreases, the flushing fluid sprayed from the adjacent gold stripping ring will first encounter the arc surface set at the bottom of the gold stripping ring. Then, under the influence of the arc surface, the flushing fluid will flow towards the bottom of the outermost gold stripping ring. As the distance between the bottom of the outermost gold stripping ring and the wafer continuously decreases, the cross-section of the flow channel through which the flushing fluid can flow becomes smaller, resulting in a larger flow rate of the flushing fluid at this time. Consequently, the impact on the metal film on the wafer surface becomes greater, making the gold stripping process more effective. This improves the separation effect of the metal film from the wafer surface, shortens the separation time of the metal film, and improves the efficiency of wafer gold stripping. By using several gold stripping rings in a wave-like reciprocating motion, the flushing fluid continuously flows from the center of the wafer to the edge of the wafer. As the distance between the gold stripping rings and the wafer surface continuously decreases, the flow rate increases step by step, further enhancing the effect of the metal film detaching from the wafer surface. The rinsing fluid flowing over the wafer surface is conveyed outward through the conveying port set at the edge of the fixed tank, thereby forming a circulating rinsing effect.

[0021] A gold stripping process for an environmentally friendly wafer gold stripping device used in VCSEL chips. The gold stripping process includes the following specific steps: S1. Place the chip wafer in the fixing slot; S2. The outer ring moves towards the side closer to the fixed groove, and the gold-peeling body moves with the movement of the outer ring. S3, the fixing groove, the outer ring, and the gold stripping body form a closed gold stripping space; S4. The water pump delivers the rinsing fluid to the gold stripping body through the pipeline; S5. The gold stripping body performs gold stripping on the wafer in a wave-like reciprocating motion. S6. After the gold stripping process is completed, the outer ring drives the gold stripping body to reset. S7. Remove the wafer from the fixing slot.

[0022] Compared with the prior art, the beneficial effects of the present invention are: During the rinsing process, several gold stripping rings reciprocate up and down in the axial direction due to the influence of the lever wheels. Furthermore, due to the different arrangement angles of the lever wheels, the gold stripping rings exhibit a wave-like motion in the radial direction, causing the distance between the bottom of the gold stripping rings and the wafer to continuously change. Through the wave-like reciprocating motion of several gold stripping rings, the rinsing fluid continuously flows from the center of the wafer to the edge of the wafer. As the distance between the gold stripping rings and the wafer surface continuously decreases, a gradual increase in flow velocity is generated, further enhancing the effect of the metal film detaching from the wafer surface. Attached Figure Description

[0023] Figure 1 This is a perspective view of the present invention; Figure 2 This is a front view of the present invention; Figure 3 This is a schematic diagram of the gold stripping component. Figure 4 An exploded view of the gold-stripping component; Figure 5 This is a schematic diagram of the internal structure of the gold stripping component; Figure 6 This is an internal front view of the gold-peeling component; Figure 7 This is a schematic diagram of the structure of a helical gear and a ring gear; Figure 8 for Figure 5 Enlarged view of point A in the middle; In the diagram: 1. Body; 11. Moving arm; 12. Telescopic rod; 2. Gold stripping assembly; 21. Fixing groove; 22. Outer ring; 221. Toothed ring; 23. Gold stripping body; 24. Fixing body; 25. Fixing ring; 251. Fixing rod; 26. Rotating groove; 27. Gold stripping ring; 271. Moving groove; 28. Rotating shaft; 281. Helical gear; 29. ​​Pulley wheel; 30. Conveying groove; 31. Water nozzle; 32. Water inlet pipe. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example: Figures 1-8 As shown, the present invention provides an environmentally friendly wafer gold stripping device for VCSEL chips, including a body 1. The body 1 has a gold stripping component 2 inside. The gold stripping component 2 consists of a fixing groove 21, an outer ring 22 and a gold stripping body 23. The fixing groove 21 is located on the bottom surface of the body 1, the outer ring 22 is located above the fixing groove 21, and the gold stripping body 23 is disposed on the side of the outer ring 22 away from the fixing groove 21.

[0026] In one specific embodiment of the present invention, movable arms 11 are provided on both sides of the body 1. The movable arms 11 are connected to the outer wall of the outer ring 22. A movable motor is provided inside the movable arm 11. The drive shaft of the movable motor is provided with a transmission wheel. The transmission wheel is in frictional contact with the outer wall of the body 1. The outer ring 22 is slidably connected to the fixing groove 21.

[0027] In one specific embodiment of the present invention, a rotating motor is provided on the top of the machine body 1, and a telescopic rod 12 is provided on the drive shaft of the rotating motor. The side of the telescopic rod 12 near the fixed groove 21 is connected to the gold stripping body 23, and the gold stripping body 23 is in contact with the surface of the outer ring 22.

[0028] In one specific embodiment of the present invention, the gold stripping body 23 is composed of a fixing body 24 and a fixing ring 25. The fixing body 24 is provided with a fixing ring 25 at its bottom. The outer wall of the fixing ring 25 is slidably connected to the inside of the outer ring 22. The fixing body 24 is provided with a rotating groove 26. The fixing ring 25 is provided with a plurality of gold stripping rings 27. The plurality of gold stripping rings 27 are combined to form a concentric ring structure.

[0029] In one specific embodiment of the present invention, a plurality of fixing rods 251 are provided inside the fixing ring 25, and a plurality of moving grooves 271 are provided inside the plurality of gold stripping rings 27. The fixing rods 251 extend into the moving grooves 271 and are slidably connected to the moving grooves 271. Springs are provided on both the upper and lower sides of the fixing rods 251. One end of the spring is connected to the moving groove 271, and the other end of the spring is connected to the fixing rods 251.

[0030] In one specific embodiment of the present invention, a rotating shaft 28 is provided in the rotating groove 26, and a plurality of lever wheels 29 are provided on the shaft wall of the rotating shaft 28. Each lever wheel 29 corresponds to a gold stripping ring 27, and the lever wheels 29 are rotatably connected to the gold stripping ring 27.

[0031] In one specific embodiment of the present invention, the arrangement angles of two adjacent lever wheels 29 are different.

[0032] In one specific embodiment of the present invention, helical gears 281 are provided at both ends of the rotating shaft 28, and a toothed ring 221 is provided at the top of the outer ring 22, wherein the helical gears 281 and the toothed ring 221 mesh and transmit power.

[0033] In one specific embodiment of the present invention, the gold stripping ring 27 is provided with a conveying groove 30 inside, and two adjacent conveying grooves 30 are interconnected. The gold stripping ring 27 is provided with an inclined surface on the side near the outer ring 22, and an arc surface on the side away from the outer ring 22. A plurality of water spray nozzles 31 are provided on the side of the gold stripping ring 27 located on the inclined surface. The water spray nozzles 31 are connected to the conveying grooves 30. A water inlet pipe 32 is provided at the top of the outermost gold stripping ring 27. The water inlet pipe 32 is connected to the conveying grooves 30 through a pipe. A water pump is provided inside the machine body 1. The water pump is connected to the water inlet pipe 32 through a telescopic pipe.

[0034] A gold stripping process for an environmentally friendly wafer gold stripping device used in VCSEL chips. The gold stripping process includes the following specific steps: S1. Place the chip wafer in the fixing slot 21; S2, the outer ring 22 moves toward the side closer to the fixed groove 21, and the gold stripping body 23 moves with the movement of the outer ring; S3, the fixing groove 21, the outer ring 22 and the gold stripping body 23 form a closed gold stripping space; S4. The water pump delivers the rinsing fluid to the gold stripping body 23 through the pipeline; S5, the gold stripping body 23 performs gold stripping on the wafer in a wave-like reciprocating motion; S6. After the gold stripping process is completed, the outer ring 22 drives the gold stripping body 23 to reset. S7. Remove the wafer from the fixing slot 21.

[0035] Working principle of the invention: The wafer is placed in front of the fixing slot 21, and the moving arm 11 is located at the end of the machine body 1 away from the fixing slot 21. At this time, the outer ring 22 and the gold stripping body 23 are located above the fixing slot 21, and the outer ring 22 is detached from the fixing slot 21. After the wafer is placed in the fixing slot 21, the controller starts the moving motor. The drive shaft of the moving motor drives the transmission wheel to rotate. The transmission wheel makes frictional contact with the machine body 1, causing the transmission wheel to drive the moving arm 11 to move. The moving arm 11 moves to the side closer to the fixing slot 21. At the same time as the moving arm 11 moves, the moving arm 11 drives the outer ring 22 to move, causing the outer ring 22 to move towards the fixing slot 21, and then the bottom of the outer ring 22 contacts the bottom of the fixing slot 21. As the moving arm 11 moves the outer ring 22 closer to the fixed groove 21, the gold stripping body 23 comes into contact with the outer ring 22, causing the gold stripping body 23 to move with the outer ring 22 under the action of gravity. Consequently, the gold stripping body 23 also moves towards the side closer to the fixed groove 21. When the outer ring 22 comes into contact with and is fixed to the fixed groove 21, the fixed groove 21, the outer ring 22 and the gold stripping body 23 combine to form a closed gold stripping space, which is isolated from the inside of the machine body 1. As the gold stripping body 23 moves, it will cause the telescopic rod 12 to extend. When the gold stripping of the wafer begins, the controller controls the drive of the rotating motor. The drive shaft of the rotating motor drives the telescopic rod 12 to rotate. During the rotation of the telescopic rod 12, the gold stripping body 23 rotates, thereby realizing the gold stripping process of the wafer. During the gold stripping process, the controller starts the water pump, which delivers the rinsing solution to the inlet pipe 32 through the telescopic pipe. The rinsing solution then flows through the inlet pipe 32 and into the conveying tank 30. Since two adjacent conveying tanks 30 are connected, the rinsing solution is delivered from the outermost gold stripping ring 27 to the gold stripping ring 27 in the center. Finally, the rinsing solution is delivered through the conveying tank 30 to several spray nozzles 31 and sprayed outward from the spray nozzles 31 onto the outer wafer, thereby rinsing the metal film on the wafer surface and achieving the gold stripping effect. During the rinsing process, several gold stripping rings 27 are affected by the lever wheel 29 and move up and down in the axial direction. Due to the different arrangement angles of the lever wheel 29, the gold stripping rings 27 move in a wave-like manner in the radial direction, causing the distance between the bottom of the gold stripping rings 27 and the wafer to change continuously. As the distance between the bottom of the outermost gold stripping ring 27 and the wafer continuously decreases, the flushing fluid sprayed from the adjacent gold stripping ring 27 will first encounter the arc surface set at the bottom of the gold stripping ring 27. Then, under the influence of the arc surface, the flushing fluid will flow towards the bottom of the outermost gold stripping ring 27. As the distance between the bottom of the outermost gold stripping ring 27 and the wafer continuously decreases, the cross-section of the flow channel through which the flushing fluid can flow is reduced, which increases the flow rate of the flushing fluid at this time. Consequently, the impact on the metal film on the wafer surface is also greater, and the effect of gold stripping is more obvious. After the rotating motor is started, the fixed body 24 rotates due to the rotation of the telescopic rod 12. During the rotation of the fixed body 24, the fixed ring 25 rotates. At the same time as the fixed ring 25 rotates, the fixed body 24 drives the rotating groove 26 to rotate. During the rotation of the fixed ring 25, the fixed rod 251 is driven to rotate. Since the fixed rod 251 extends into the moving groove 271, the fixed rod 251 drives several gold stripping rings 27 to rotate. After the rotating groove 26 is rotated by the fixed body 24, the rotating groove 26 drives the rotating shaft 28 to rotate. At the same time, the rotating shaft 28 drives several lever wheels 29 to rotate. At this time, the lever wheels 29 rotate around the axis of the fixed body 24. As the lever wheel 29 rotates around the axis of the rotating shaft 28 under the action of the helical gear 281, the lever wheel 29 contacts the top of the gold stripping ring 27 during the rotation process. As the lever wheel 29 continues to rotate, it will push the gold stripping ring 27 to move, causing the gold stripping ring 27 to move closer to the fixed groove 21. At this time, the spring between the top of the moving groove 271 and the top of the fixed rod 251 is compressed, and the spring between the bottom of the moving groove 271 and the bottom of the fixed rod 251 is stretched. When the lever wheel 29 compresses the gold stripping ring 27 to its maximum stroke, as the lever wheel 29 rotates, the squeezing force of the lever wheel 29 on the gold stripping ring 27 decreases, and then the gold stripping ring 27 returns to its original position under the action of the spring force, so that the gold stripping ring 27 is always in a state of reciprocating up and down along the axis of the gold stripping ring 27. Since the helical gear 281 and the gear ring 221 are in a meshing state, when the rotating groove 26 rotates, it drives the rotating shaft 28 to rotate around the axis of the gold-peeling body 23. This causes the rotating shaft 28 to drive the helical gear 281 to rotate. During the rotation, the helical gear 281 meshes with the gear ring 221. As the helical gear 281 rotates around the axis of the gold-peeling body 23, it also rotates due to the influence of the gear ring 221. This causes the helical gear 281 to drive the rotating shaft 28 to rotate. During the rotation of the rotating shaft 28, several lever wheels 29 rotate. Since the arrangement angles of two adjacent lever wheels 29 are different, and the lever wheels 29 correspond one-to-one with the gold stripping rings 27, the lever wheels 29 contact the top of the gold stripping rings 27 when rotating, and push the gold stripping rings 27 to move up and down reciprocally, so that several gold stripping rings 27 present a wave-like motion trajectory. The wave-like reciprocating motion of several gold stripping rings 27 causes the flushing fluid to flow continuously from the center of the wafer to the edge of the wafer. As the distance between the gold stripping rings 27 and the wafer surface decreases, the flow rate increases step by step, further enhancing the effect of the metal film detaching from the wafer surface.

[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An environmentally friendly wafer gold stripping device for VCSEL chips, characterized in that: Includes a body (1), and a gold stripping component (2) is provided inside the body (1). The gold stripping component (2) consists of a fixing groove (21), an outer ring (22) and a gold stripping body (23). The fixing groove (21) is located on the bottom surface of the body (1), and the outer ring (22) is located above the fixing groove (21). The gold stripping body (23) is provided on the side of the outer ring (22) away from the fixing groove (21).

2. The environmentally friendly wafer stripping device for VCSEL chips according to claim 1, characterized in that: The body (1) is provided with movable arms (11) on both sides. The movable arms (11) are connected to the outer wall of the outer ring (22). A movable motor is provided inside the movable arm (11). The drive shaft of the movable motor is provided with a transmission wheel. The transmission wheel is in frictional contact with the outer wall of the body (1). The outer ring (22) is slidably connected to the fixed groove (21).

3. The environmentally friendly wafer stripping device for VCSEL chips according to claim 1, characterized in that: A rotating motor is provided on the top of the machine body (1), and a telescopic rod (12) is provided on the drive shaft of the rotating motor. The side of the telescopic rod (12) near the fixed groove (21) is connected to the gold stripping body (23), and the gold stripping body (23) is in contact with the surface of the outer ring (22).

4. The environmentally friendly wafer stripping device for VCSEL chips according to claim 1, characterized in that: The gold stripping body (23) is composed of a fixed body (24) and a fixed ring (25). The fixed body (24) has a fixed ring (25) at its bottom. The outer wall of the fixed ring (25) is slidably connected to the inside of the outer ring (22). The fixed body (24) has a rotating groove (26). The fixed ring (25) has a plurality of gold stripping rings (27). The plurality of gold stripping rings (27) are combined to form a concentric ring structure.

5. The environmentally friendly wafer stripping device for VCSEL chips according to claim 4, characterized in that: The fixing ring (25) is also provided with a number of fixing rods (251), and the gold stripping rings (27) are provided with a number of moving grooves (271). The fixing rods (251) extend into the moving grooves (271), and the fixing rods (251) are slidably connected to the moving grooves (271). Springs are provided on both the upper and lower sides of the fixing rods (251). One end of the spring is connected to the moving groove (271), and the other end of the spring is connected to the fixing rods (251).

6. The environmentally friendly wafer stripping device for VCSEL chips according to claim 4, characterized in that: A rotating shaft (28) is provided in the rotating groove (26). Several lever wheels (29) are provided on the shaft wall of the rotating shaft (28). Each lever wheel (29) corresponds to a gold stripping ring (27), and the lever wheel (29) and the gold stripping ring (27) are rotatably connected.

7. The environmentally friendly wafer stripping device for VCSEL chips according to claim 6, characterized in that: The rotating shaft (28) is provided with helical gears (281) at both ends, and the outer ring (22) is provided with a toothed ring (221) at the top. The helical gears (281) mesh with the toothed ring (221) for transmission.

8. The environmentally friendly wafer stripping device for VCSEL chips according to claim 6, characterized in that: The arrangement angles of two adjacent lever wheels (29) are different.

9. The environmentally friendly wafer stripping device for VCSEL chips according to claim 4, characterized in that: The gold stripping ring (27) is provided with a conveying groove (30) inside, and two adjacent conveying grooves (30) are connected to each other. The gold stripping ring (27) is provided with an inclined surface on the side close to the outer ring (22), and an arc surface on the side away from the outer ring (22). The gold stripping ring (27) is provided with several water spray nozzles (31) on the side of the inclined surface. The water spray nozzles (31) are connected to the conveying groove (30). The top of the outermost gold stripping ring (27) is provided with a water inlet pipe (32). The water inlet pipe (32) is connected to the conveying groove (30) through a pipe. A water pump is provided inside the machine body (1). The water pump is connected to the water inlet pipe (32) through a telescopic pipe.

10. A gold stripping process applied to an environmentally friendly wafer stripping device for VCSEL chips as described in any one of claims 1-9, characterized in that: The gold stripping process includes the following specific steps: S1. Place the chip wafer in the fixing slot (21); S2, the outer ring (22) moves toward the side closer to the fixed groove (21), and the gold stripping body (23) moves with the movement of the outer ring; S(3), the fixing groove (21), the outer ring (22) and the gold stripping body (23) form a closed gold stripping space; S4. The water pump delivers the rinsing fluid through the pipeline to the gold stripping body (23); S5, Gold stripping body (23) performs gold stripping on the wafer in a wave-like reciprocating motion; S6. After the gold stripping process is completed, the outer ring (22) drives the gold stripping body (23) to reset. S7. Remove the wafer from the fixing slot (21).

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