Laser monitoring module and laser processing equipment

Abstract

The invention provides a laser monitoring module. The laser monitoring module comprises a heat conduction module and a temperature detection module, the heat conduction module comprises a heat conduction piece, and the heat conduction piece is used for receiving laser emitted by the laser processing module; the temperature detection module is arranged on the side, away from the laser processing module, of the heat conduction piece and used for collecting temperature data of the heat conduction piece, and the temperature data is used for obtaining the actual power of the laser emitted by the laser processing module; wherein a containing cavity is formed in the side, away from the laser processing module, of the heat conduction piece, and the temperature detection module is contained in the containing cavity. The invention further provides laser processing equipment comprising the laser monitoring module.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser monitoring module and a laser processing equipment. Background Technology

[0002] With the development of technology, laser processing technology is becoming increasingly widespread, including laser engraving, laser cutting, laser rust removal, laser marking, and laser welding. Current laser processing equipment operates at a preset output power. However, due to the high power of laser processing equipment, some power measurement devices used to measure high-power lasers are expensive, and others are too bulky (requiring multiple sensors to form a sensor array). Therefore, existing laser processing equipment typically lacks laser output power monitoring capabilities, making it impossible to monitor the actual output power. The relationship between the actual output power and the nominal set value is unknown. If output power attenuation occurs during processing, resulting in a significant difference between the actual and preset output power, it can easily affect the processing effect (e.g., insufficient processing depth or reduced processing efficiency). Summary of the Invention

[0003] In a first aspect, embodiments of this application provide a laser monitoring module, including: A heat-conducting module includes a heat-conducting component for receiving laser light emitted from a laser processing module; and A temperature detection module is located on the side of the heat-conducting component away from the laser processing module, and is used to collect temperature data of the heat-conducting component. The temperature data is used to obtain the actual power of the laser emitted by the laser processing module. The heat-conducting component has a cavity on the side away from the laser processing module, and the temperature detection module is housed in the cavity.

[0004] The laser monitoring module provided in this application embodiment includes a heat-conducting module and a temperature detection module. The heat-conducting component in the heat-conducting module receives the laser emitted from the laser processing module, converting the laser's optical signal into a thermal signal. The temperature detection module collects the temperature data of the heat-conducting component, which is used to obtain the actual power of the laser emitted from the laser processing module. This allows for monitoring of the actual output power of the laser processing module, facilitating timely detection of power attenuation during operation and improving the stability of the laser processing module. Furthermore, by creating a cavity on the side of the heat-conducting component away from the laser processing module, and housing the temperature detection module within this cavity, the laser monitoring module of this application embodiment reduces its size compared to laser processing equipment that uses a sensor array composed of multiple sensors to measure the actual laser power. This reduces the size of the laser processing equipment using the laser monitoring module and improves its convenience.

[0005] In some embodiments, the heat-conducting component includes a housing and a protrusion. The housing surrounds a light-receiving cavity for receiving the laser beam, and the housing is used to receive and convert the light energy of the laser beam into heat energy. The protrusion is disposed in the light-receiving cavity and protrudes from the housing toward the side closer to the laser processing module.

[0006] In some embodiments, the temperature detection module includes a temperature measuring unit for collecting temperature data, and the temperature measuring unit is disposed on the central axis of the protrusion.

[0007] In some embodiments, the protrusion includes a reflective surface for receiving and reflecting a portion of the laser light to the housing, so that the housing converts the light energy of the laser light into heat energy.

[0008] In some embodiments, the protrusion is conical in shape, and the cone angle of the protrusion ranges from 30° to 60°.

[0009] In some embodiments, the inner wall of the housing is provided with a scattering structure, which is used to absorb a portion of the laser light.

[0010] In some embodiments, the heat-conducting module further includes a light-absorbing coating applied to the inner wall of the heat-conducting component. The light-absorbing coating is used to absorb the laser and increase the thermal conductivity of the heat-conducting component.

[0011] In some embodiments, the shape of the heat-conducting element is any one of a cone, cylinder, hexahedron, sphere, and quasi-sphere.

[0012] Secondly, embodiments of this application provide a laser processing apparatus, comprising: Laser processing modules are used to emit lasers to process workpieces; and As described in any of the above embodiments, the laser monitoring module is used to receive the laser and collect the temperature data of the heat-conducting component. The temperature data is used to obtain the actual power of the laser emitted by the laser processing module.

[0013] The laser processing equipment provided in this application embodiment includes a laser monitoring module as described in any of the above embodiments. A heat-conducting component in the laser monitoring module receives the laser emitted from the laser processing module, converting the laser's optical signal into a thermal signal. A temperature detection module collects the temperature data of the heat-conducting component to obtain the actual power of the laser emitted from the laser processing module. This allows for monitoring of the actual output power of the laser processing module, facilitating timely detection of power attenuation during operation and improving the stability of the laser processing module. Furthermore, compared to laser processing equipment that uses a sensor array composed of multiple sensors to measure the actual laser power, the laser processing equipment in this application embodiment is smaller and more convenient to monitor.

[0014] In some embodiments, the laser processing equipment further includes a control module electrically connected to the laser monitoring module and the laser processing module, for receiving and obtaining the actual power of the laser emitted by the laser processing module based on the temperature data, and the control module is also used to adjust the output power of the laser processing module based on the actual power of the laser. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a laser processing apparatus according to an embodiment of this application.

[0016] Figure 2 This is a schematic diagram of the structure of a laser processing module and a laser monitoring module according to an embodiment of this application.

[0017] Figure 3 For along Figure 2 A cross-sectional view of line AA in the diagram.

[0018] Figure 4 The laser monitoring module according to another embodiment of this application Figure 2 A cross-sectional view at the same location as line AA in the middle.

[0019] Figure 5 This is a schematic diagram of the structure of a laser processing module and a laser monitoring module according to another embodiment of this application.

[0020] Figure 6 For along Figure 5 A cross-sectional view of the BB line in the diagram.

[0021] Figure 7 This is a temperature change curve obtained by the temperature detection module of an embodiment of this application under different laser powers.

[0022] Explanation of key component symbols: Laser processing equipment 100 Laser processing module 1 Laser L0 Focus X Workpiece W Laser monitoring module 3 Thermal Module 31 Thermal conductive component 311 Casing 3111 Optical input port 3111a Scattering structure 31110 311a light receiving cavity Protrusion 3113 Cone angle β Reflective surface 3113a Central axis M Light-absorbing coating 315 Temperature detection module 33 Temperature Measurement Unit 331 35 Container Control Module 5 The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0024] It should be noted that when a component is considered to be "set on" another component, it can be directly set on the other component or may have an intervening component present. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0025] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0026] Please refer to the following: Figure 1 and Figure 2The laser processing equipment 100 of this application embodiment includes a laser processing module 1 and a laser monitoring module 3. The laser processing module 1 is used to emit a laser L0 to process the workpiece W. The laser L0 processing method can be laser engraving, laser cutting, laser rust removal, laser marking or laser welding.

[0027] The laser monitoring module 3 is used to receive the laser L0 and to obtain the actual power of the laser L0 emitted from the laser processing module 1. The laser monitoring module 3 is movably disposed on the light-emitting side of the laser processing module 1. When the user needs to monitor the actual power of the laser L0 emitted from the laser processing module 1, the laser monitoring module 3 is moved into the optical path of the laser L0 so that the laser L0 is incident on the laser monitoring module 3; when the user needs to process the workpiece W, the laser monitoring module 3 is moved out of the optical path of the laser L0 so that the laser L0 is incident on the workpiece W. Specifically, the laser monitoring module 3 can be manually moved into or out of the optical path of the laser L0, or a motor can be used to drive the laser monitoring module 3 to move; this application does not impose any limitations. By movably setting the laser monitoring module 3 on the light-emitting side of the laser processing module 1, the actual power of the laser L0 emitted by the laser processing module 1 can be flexibly monitored according to user needs. This helps to meet different user needs, avoids the laser L0 passing through the laser monitoring module 3 for a long time, and extends the service life of the laser monitoring module 3.

[0028] In some embodiments, the laser processing module 1 can be any one of a gas laser, a solid-state laser, a semiconductor laser, a liquid laser, and a fiber laser, and this application does not impose any restrictions.

[0029] In some embodiments, the wavelength range of laser L0 is 400nm-495nm, that is, laser L0 is blue light. Specifically, the wavelength of laser L0 can be 450nm, 460nm, 470nm, 480nm, 490nm, or 495nm. When the wavelength of laser L0 is within the above wavelength range, since the power required for blue light is less than that required for infrared light, it is beneficial to reduce power consumption under the condition of laser L0 cutting to the same depth. Moreover, when laser L0 is blue light, a wider variety of materials for the workpiece W can be selected.

[0030] Please refer to the following: Figure 2 and Figure 3The laser monitoring module 3 of this application embodiment includes a heat conduction module 31 and a temperature detection module 33. The heat conduction module 31 includes a heat conduction element 311, which is used to receive the laser L0 emitted from the laser processing module 1. The temperature detection module 33 is disposed on the side of the heat conduction element 311 away from the laser processing module 1, and is used to collect the temperature data of the heat conduction element 311. The temperature data is used to obtain the actual power of the laser L0 emitted from the laser processing module 1. A receiving cavity 35 is formed on the side of the heat conduction element 311 away from the laser processing module 1, and the temperature detection module 33 is housed in the receiving cavity 35. Specifically, the laser monitoring module 3 is disposed on the light-emitting side of the laser processing module 1, and the focal point XX of the laser L0 emitted from the laser processing module 1 is located between the laser monitoring module 3 and the laser processing module 1, that is, the laser L0 is first focused and then diverged to the laser monitoring module 3. By setting the focal point X of the laser L0 emitted from the laser processing module 1 between the laser monitoring module 3 and the laser processing module 1, the laser L0 can be prevented from being directly focused on the heat-conducting component, thus preventing the high temperature generated during the focusing process from burning the temperature detection module 33 and extending the service life of the temperature detection module 33.

[0031] The laser monitoring module 3 provided in this application embodiment, by setting a heat conduction module 31 and a temperature detection module 33, wherein the heat conduction element 311 in the heat conduction module 31 is used to receive the laser L0 emitted by the laser processing module 1 to convert the light signal of the laser L0 into a heat signal, and the temperature detection module 33 is used to collect the temperature data of the heat conduction element 311, and the temperature data is used to obtain the actual power of the laser L0 emitted by the laser processing module 1; the actual output power of the laser processing module 1 can be monitored, which is beneficial to timely detection of the phenomenon of output power attenuation during the operation of the laser processing module 1, and is beneficial to improving the stability of the laser processing module 1; in addition, by opening a cavity 35 on the side of the heat conduction element 311 away from the laser processing module 1, and housing the temperature detection module 33 in the cavity 35, compared with the laser processing equipment 100 which uses multiple sensors to form a sensor array to measure the actual power of the laser L0, the laser monitoring module 3 of this application embodiment is beneficial to reduce the size, thereby reducing the size of the laser processing equipment 100 using the laser L0 detection module, and improving the convenience of the laser monitoring module 3.

[0032] In some embodiments, please refer to the following: Figure 2 and Figure 3The heat-conducting component 311 is roughly cylindrical in shape. The heat-conducting component 311 includes a housing 3111, a light inlet 3111a, and a protrusion 3113. The light inlet is located on the side of the housing 3111 near the laser processing module. Laser L0 enters the housing 3111 through the light inlet 3111a. The housing 3111 surrounds and forms a light-receiving cavity 311a, which receives laser L0. The housing 3111 receives and converts the light energy of laser L0 into heat energy. The housing 3111 is made of a material with high thermal conductivity. The material of the housing 3111 can be any one of aluminum, copper, silicon carbide, gold, and silver. For example, when the material of the housing 3111 is aluminum, the thermal conductivity of aluminum is about 237 W / (m·K). Under the condition of the same incident laser L0 power, aluminum can quickly absorb the heat generated by the laser L0 emitted from the laser processing module 1 and transfer it to the temperature detection module 33. The heat transfer efficiency of aluminum is higher than that of common metals such as iron, which can reduce the error of the temperature data of the heat-conducting component 311 collected by the temperature detection module 33, thereby improving the accuracy of the actual power of the laser L0 emitted from the laser processing module 1. Furthermore, by setting the material of the housing 3111 to aluminum, it is beneficial to improve the lightweight level of the laser monitoring module 3 and reduce the overall weight of the laser monitoring module 3.

[0033] The inner wall of the housing 3111 is provided with a scattering structure 31110, which is used to absorb part of the laser L0. In some embodiments, the scattering structure 31110 includes a plurality of conical strip-shaped protrusions, which are arranged around the inner wall of the housing 3111. When the laser L0 is incident on the scattering structure 31110 composed of the plurality of conical strip-shaped protrusions, the laser L0 is absorbed after multiple reflections between two conical strip-shaped protrusions, thereby enabling the housing 3111 to convert the incident laser L0 light energy into heat energy as much as possible. Please refer to the following: Figure 2 and Figure 4 In some other embodiments, the scattering structure 31110 includes a plurality of island-shaped protrusions (e.g., conical island-shaped protrusions) that are distributed on the inner wall of the housing 3111.

[0034] By setting up the scattering structure 31110, when a portion of the laser L0 in the light receiving cavity 311a is incident on the scattering structure 31110, the aforementioned portion of the laser L0 is scattered in the scattering structure 31110 and thus absorbed by the scattering structure 31110. This allows the housing 3111 to convert the incident laser L0 light energy into heat energy as much as possible, which helps to reduce the error of the temperature data of the heat-conducting component 311 collected by the temperature detection module 33. This, in turn, helps to further improve the accuracy of the actual power of the laser L0 emitted by the laser processing module 1.

[0035] In some embodiments, the protrusion 3113 is disposed in the light-receiving cavity 311a, and the protrusion 3113 is located at the center of the inner wall of the bottom side of the housing 3111, and protrudes from the inner wall of the housing 3111 toward the side close to the laser processing module 1. The protrusion 3113 can be integrally formed with the housing 3111, for example, by injection molding, or the protrusion 3113 and the housing 3111 can be formed separately and then connected by welding. This application does not impose any limitations. The shape of the protrusion 3113 is conical. In other embodiments, the shape of the protrusion 3113 can also be hemispherical, spherical, or quasi-spherical. This application does not impose any limitations. The protrusion 3113 includes a reflective surface 3113a, which is used to receive and reflect part of the laser L0 to the housing 3111, so that the housing 3111 can convert the light energy of the laser L0 into heat energy.

[0036] By setting the protrusion 3113, the reflective surface 3113a of the protrusion 3113 is used to receive and reflect part of the laser L0 to the housing 3111, which can improve the utilization rate of the laser L0, reduce the probability of the laser L0 being emitted from the receiving cavity 311a to the external environment, improve the accuracy of the temperature data collected by the temperature detection module 33, further reduce the error of the temperature data of the heat-conducting component 311 collected by the temperature detection module 33, and further improve the accuracy of the actual power of the laser L0 emitted by the laser processing module 1.

[0037] In some embodiments, the cone angle β of the protrusion 3113 ranges from 30° to 60°. The cone angle β of the protrusion 3113 can be 30°, 35°, 40°, 45°, 50°, 55° or 60°; for example, when the cone angle β of the protrusion 3113 is 60°, part of the laser L0 incident on the protrusion 3113 is reflected by the protrusion 3113 to the housing 3111, and is thus absorbed by the housing 3111. This can improve the conversion rate of laser L0 light energy to heat energy, which is beneficial to further improve the accuracy of temperature data collected by the temperature detection module 33, and to further reduce the error of the temperature data of the heat-conducting component 311 collected by the temperature detection module 33.

[0038] In some embodiments, please refer to the following: Figure 5 and Figure 6 The heat-conducting element 311 is spherical in shape. In other embodiments, the heat-conducting element 311 can also be any one of a cone, a hexahedron, or a quasi-sphere. When the heat-conducting element 311 is spherical, under the same volume condition, compared to a cone shape, it is beneficial to increase the area of ​​the inner surface of the shell 3111, which is beneficial to improve the absorption rate of the laser L0 by the heat-conducting element 311, and further improve the conversion rate of laser L0 light energy to heat energy.

[0039] In some embodiments, please refer to the following: Figure 2 and Figure 3 The heat-conducting module 31 also includes a light-absorbing coating 315, which is coated on the inner wall of the heat-conducting component 311. Specifically, when the inner wall of the heat-conducting component 311 is provided with a scattering structure 31110, the light-absorbing coating 315 is coated on the surface of multiple conical strip-shaped protrusions of the scattering structure 31110, that is, coated at the position between multiple protrusions and two adjacent protrusions of the scattering structure 31110. The light-absorbing coating 315 is used to absorb laser L0 and increase the thermal conductivity of the heat-conducting component 311. The material of the light-absorbing coating 315 is a black light-absorbing material, such as carbon black, graphene, graphene derivatives, or carbon nanotubes, which is not limited in this application.

[0040] By setting the light-absorbing coating 315, the thermal conductivity of the heat-conducting component 311 can be increased, which means that the laser L0 can be absorbed to a greater extent, thereby improving the conversion rate of laser L0 light energy into heat energy, which is beneficial to further improving the accuracy of temperature data collected by the temperature detection module 33.

[0041] The temperature detection module 33 can be a thermistor or a thermocouple. The temperature detection module 33 includes a temperature measuring part 331, which is used to collect temperature data. In some embodiments, the temperature measuring part 331 is disposed on the central axis M of the protrusion 3113, that is, the accommodating cavity 35 is also disposed on the central axis M of the protrusion 3113. The temperature measuring part 331 and the protrusion 3113 can be mechanically pressed together on the side away from the laser processing module 1 by a mechanical device, that is, the temperature measuring part 331 and the heat-conducting component 311 can be mechanically pressed together by a mechanical device, or the temperature measuring part 331 and the protrusion 3113 can be bonded together on the side away from the laser processing module 1 by epoxy adhesive.

[0042] By positioning the temperature measuring unit 331 on the central axis M of the protrusion 3113, when the laser L0 is incident on the receiving cavity 311a, the protrusion 3113 receives most of the laser L0. This means that most of the heat generated by the laser L0 is transferred through the protrusion 3113 to the temperature measuring unit 331 positioned on the central axis M of the protrusion 3113. This improves the absorption rate of the heat generated by the laser L0, which is beneficial for further improving the accuracy of the temperature data collected by the temperature detection module 33. In other embodiments, the temperature measuring unit 331, housed in the receiving cavity 35, can also be positioned outside the central axis M of the protrusion 3113, for example, on the outer surface of the housing 3111 on the side away from the laser processing module 1. This application does not impose any limitations on this.

[0043] In some embodiments, please refer to Figure 1 and Figure 3The laser processing equipment 100 also includes a control module 5, which is electrically connected to the laser monitoring module 3 and the laser processing module 1. The control module 5 receives and obtains the actual power of the laser L0 emitted by the laser processing module 1 based on temperature data. The control module 5 also adjusts the output power of the laser processing module 1 according to the actual power of the laser L0. The control module 5 includes a memory (not shown) and a processor (not shown). The memory stores a computer program, the thermal conductivity of the heat-conducting component 311, and preset parameters (e.g., the standard temperature change curve of the laser processing module 1 under normal operating conditions). The processor executes the computer program. The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0044] When the user needs to monitor the actual power of the laser L0 emitted by the laser processing equipment 100, the laser monitoring module 3 is moved into the optical path of the laser L0 so that the laser L0 is incident on the light inlet 3111a of the laser monitoring module 3. The heat-conducting component 311 in the laser monitoring module 3 is used to receive the laser L0 emitted by the laser processing module 1. The incident laser L0 is absorbed by the heat-conducting component 311, and the light energy of the laser L0 is converted into heat energy. The temperature detection module 33 is used to collect the temperature data of the heat-conducting component 311. The temperature data is used to obtain the actual power of the laser L0 emitted by the laser processing module 1. The control module 5 is electrically connected to the laser monitoring module 3 and the laser processing module 1. The control module 5 stores the standard temperature change curves of different powers under the normal working state of the laser processing module 1. The control module 5 is used to receive the temperature data and calculate the actual output power of the laser L0 emitted by the laser processing module 1 based on the temperature data and the standard temperature change curves of different powers under the normal working state of the laser processing module 1.

[0045] As an example, Figure 7This is a schematic diagram of the temperature data curves of the laser processing module 1 under normal operating conditions, detected by the laser monitoring module 3, at preset output powers of 20W, 30W, and 40W. Assuming that the temperature data curves of the laser processing module 1 detected by the laser monitoring module 3 in real time are compared with the temperature data curves of the laser processing module 1 under normal operating conditions with output powers of 20W, 30W, and 40W, for example, if the slopes of the temperature data curves detected in real time and the temperature data curves of the laser processing module 1 under normal operating conditions at 30W are the same or similar, it can be considered that the actual output power of the laser processing module 1 detected by the laser monitoring module 3 in real time is 30W.

[0046] The laser processing equipment 100 provided in this application embodiment, by setting up a laser monitoring module 3 as in any of the above embodiments, wherein the heat-conducting component 311 in the laser monitoring module 3 is used to receive the laser L0 emitted by the laser processing module 1, so as to convert the light signal of the laser L0 into a heat signal, and the temperature detection module 33 is used to collect the temperature data of the heat-conducting component 311 to obtain the actual power of the laser L0 emitted by the laser processing module 1; the actual output power of the laser processing module 1 can be monitored, which is beneficial to timely detection of the phenomenon of output power attenuation during the operation of the laser processing module 1, and is beneficial to improving the stability of the laser processing module 1; in addition, compared with using multiple sensors to form a sensor array to measure the actual power of the laser L0, the laser processing equipment 100 in this application embodiment is beneficial to reduce the size and improve the convenience of monitoring.

[0047] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A laser monitoring module, characterized in that, include: A heat-conducting module, including a heat-conducting component, wherein the heat-conducting component is used to receive laser emitted from the laser processing module; as well as A temperature detection module is located on the side of the heat-conducting component away from the laser processing module, and is used to collect temperature data of the heat-conducting component. The temperature data is used to obtain the actual power of the laser emitted by the laser processing module. The heat-conducting component has a cavity on the side away from the laser processing module, and the temperature detection module is housed in the cavity.

2. The laser monitoring module as described in claim 1, characterized in that, The heat-conducting component includes a housing and a protrusion. The housing surrounds and forms a light-receiving cavity, which is used to receive the laser. The housing is used to receive the light energy of the laser and convert it into heat energy. The protrusion is disposed in the light-receiving cavity and protrudes from the housing toward the side closer to the laser processing module.

3. The laser monitoring module as described in claim 2, characterized in that, The temperature detection module includes a temperature measuring unit, which is used to collect the temperature data. The temperature measuring unit is located on the central axis of the protrusion.

4. The laser monitoring module as described in claim 2, characterized in that, The protrusion includes a reflective surface for receiving and reflecting a portion of the laser light back to the housing, so that the housing converts the light energy of the laser light into heat energy.

5. The laser monitoring module as described in claim 2, characterized in that, The protrusion is conical in shape, and the cone angle of the protrusion ranges from 30° to 60°.

6. The laser monitoring module as described in claim 2, characterized in that, The inner wall of the housing is provided with a scattering structure, which is used to absorb part of the laser light.

7. The laser monitoring module as described in claim 1, characterized in that, The heat-conducting module also includes a light-absorbing coating, which is applied to the inner wall of the heat-conducting component. The light-absorbing coating is used to absorb the laser and increase the thermal conductivity of the heat-conducting component.

8. The laser monitoring module as described in claim 1, characterized in that, The shape of the heat-conducting component can be any one of a cone, cylinder, hexahedron, sphere, or quasi-sphere.

9. A laser processing device, characterized in that, include: Laser processing module, used to emit laser light to process workpieces; as well as The laser monitoring module as described in any one of claims 1-8 is used to receive the laser and collect temperature data of the heat-conducting component, wherein the temperature data is used to obtain the actual power of the laser emitted by the laser processing module.

10. The laser processing equipment as described in claim 9, characterized in that, The laser processing equipment also includes a control module, which is electrically connected to the laser monitoring module and the laser processing module. The control module is used to receive and obtain the actual power of the laser emitted by the laser processing module based on the temperature data. The control module is also used to adjust the output power of the laser processing module based on the actual power of the laser.

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