Battery negative electrode substrate welding equipment

Abstract

The invention relates to battery negative electrode substrate welding equipment. Comprising a feeding device for providing a negative electrode substrate, a first track, a first carrier capable of conveying the negative electrode substrate along the first track, a clamping jaw arranged on one side of the first track and used for tearing off a film body on the negative electrode substrate, and turnover devices arranged on the left side and the right side of the feeding device. A feeding station is arranged on the front side of the feeding device, the first rails extend leftwards and rightwards from the feeding station, the turnover device is located on the rear sides of the first rails, and the second carriers can convey batteries along the second rails. The turnover device is used for assembling the negative electrode substrate to the battery and bending the negative electrode substrate, the second rail is located on the rear side of the feeding device and extends left and right, a plurality of machining stations are arranged along the second rail, working heads for welding are arranged above the machining stations, the welding equipment is compact in layout, double-line parallel operation can be achieved, and efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the technical field of battery processing, and specifically to a battery negative electrode substrate welding device. Background Technology

[0002] In battery manufacturing, electrically connecting the negative electrode substrate to the battery via welding is a crucial step. Existing automated welding equipment typically integrates multiple functional modules to achieve continuous production. These modules include a feeding device for providing the negative electrode substrate, a handling device for transporting and assembling the negative electrode substrate, a battery feeding device for providing the battery, and the core welding device. To further enhance automation and functional integration, some equipment also integrates a film-removing device for removing the film from the surface of the negative electrode substrate, and a bending device for bending the negative electrode substrate.

[0003] Although existing technologies aim to improve production efficiency through functional integration, they still have significant shortcomings in practical application and layout, mainly in the following aspects: 1. The equipment layout is cluttered and space utilization is low. Because multiple functional modules need to be accommodated, these modules are often arranged linearly inside the equipment, occupying a large amount of space and making the overall structure less compact and aesthetically pleasing. More importantly, it brings great difficulties to daily maintenance, upkeep, and troubleshooting. 2. Production efficiency is a bottleneck. Currently, most welding equipment adopts single-line operation, resulting in low production efficiency. Therefore, there is an urgent need for a welding equipment with a more rational and compact layout that can significantly improve production efficiency to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a new battery negative electrode substrate welding device to solve the problems in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a battery negative electrode substrate welding device, comprising: A feeding device is used to provide a negative electrode substrate, and a feeding station is provided on the front side of the feeding device; A substrate transport mechanism includes a first track and a first carrier capable of transporting the negative electrode substrate along the first track. The first track includes two sets extending to the left and to the right from the loading station. A film-tearing mechanism is disposed on one side of the first track, and the film-tearing mechanism includes grippers for tearing off the film attached to the negative electrode substrate; A battery handling mechanism includes a second track and a second carrier capable of transporting the battery along the second track. The second track is located behind the loading device and extends in the left-right direction. Multiple processing stations are arranged along the second track, and the battery to be processed is placed at the processing station. The flipping device is provided on both the left and right sides of the feeding device. The flipping device is located between the first track and the second track. The processing station is located behind the flipping device. The flipping device includes a flipping seat for assembling the negative electrode substrate onto the battery and for bending the negative electrode substrate. The flipping seat is rotatably arranged around the rotation center line and reciprocates between the first track and the processing station. The welding apparatus includes a welding head located above the processing station; The welding equipment further includes a first transfer mechanism for transferring the negative electrode substrate from the feeding device to the feeding station and a second transfer mechanism for transferring the negative electrode substrate from the first track to the flipping seat.

[0006] In some embodiments, the negative electrode substrate has a main board and a connecting piece located on one side of the main board and extending along the thickness direction of the main board. The flipping seat is provided with a negative pressure adsorption surface for fixing the main board. When the flipping device is in the loading mode, the negative pressure adsorption surface faces upward and extends horizontally. When the flipping device is in the welding mode, the negative pressure adsorption surface extends vertically, the connecting piece extends horizontally, and the connecting piece is in contact with the welding surface of the battery. When the flipping device is in the bending mode, the negative pressure adsorption surface moves downward toward the welding surface, so that the main board is folded up above the connecting piece. The flipping device, through the flipping seat, uses an adsorption fixing method on the side of the main board away from the connecting piece, so that the flipping seat can adjust the state of the negative electrode substrate for welding and bending operations by flipping only twice. At the same time, the welding and bending of the connecting piece are both performed at the processing station, which can save equipment space and improve the processing efficiency of the flipping device.

[0007] Specifically, a bent edge is formed at the junction of the motherboard and the connecting piece. When the motherboard is supported on the negative pressure adsorption surface, the bent edge extends along the rotation center line. This configuration enables the motherboard to bend relative to the connecting piece and retract with it under the action of the flipping seat in the bending mode.

[0008] In some embodiments, a fixing mechanism is provided at the processing station. The fixing mechanism includes a vertically movable abutment member, the lower part of which has an abutment head. The abutment head has a through groove extending vertically. In the welding mode of the flipping device, the abutment head abuts against the connecting piece, causing the connecting piece to be firmly fixed to the welding surface of the battery. The peripheral wall of the through groove encloses the area to be welded above the connecting piece. The through groove provides positioning guidance for the welding beam and also prevents contamination from welding slag generated during the welding process.

[0009] In some embodiments, the abutment includes a slag-absorbing hole formed on the wall of the through groove and a slag-absorbing assembly connected to the slag-absorbing hole and used to absorb welding slag generated during the welding process. By providing the slag-absorbing hole and the slag-absorbing assembly, the cleanliness of the welding process can be improved.

[0010] In some embodiments, the grippers of the film-tearing mechanism include an upper gripper and a lower gripper, the upper gripper being located above the lower gripper and capable of vertical movement; the film-tearing mechanism includes a holding member slidably connected to the upper gripper in a vertical direction and an elastic member disposed between the upper gripper and the holding member, the elastic member providing the force required to drive the holding member downward; when the film-tearing mechanism is in a non-operating mode, the lower end of the holding member is located below the upper gripper. The device does not require a separate clamping mechanism; during the film-gripping process, the holding member can simultaneously clamp and fix the product.

[0011] Specifically, the upper clamp has a first clamping portion, and the lower clamp has a second clamping portion. In the non-working mode, the first clamping portion and the second clamping portion are spaced apart in the vertical direction, the lower end of the pressing member is located below the first clamping portion, and the first clamping portion and the lower end of the pressing member have a first distance in the vertical direction. In the working mode, the first clamping portion and the second clamping portion are brought together to clamp the membrane between them, the lower end of the pressing member abuts against the negative electrode substrate, and the first clamping portion and the lower end of the pressing member have a second distance in the vertical direction that is smaller than the first distance.

[0012] In some embodiments, the first carrier is provided with a support platform for supporting the negative electrode substrate, and a slot is provided on one side of the support platform. The membrane has an attachment portion covering the surface of the negative electrode substrate and a protruding portion extending outward from one side of the negative electrode substrate. When the negative electrode substrate is located on the support platform, the protruding portion extends out of the slot opening. In the working mode, the lower clamp is inserted into the slot.

[0013] In some embodiments, a scanning element for scanning is further provided above the first track. In some embodiments, the negative electrode substrate has a main board and an upwardly bent connecting piece of the self-board, and a leveling mechanism is provided on one side of the first track. The leveling mechanism includes a first leveling member and a second leveling member that can be brought closer together to clamp the connecting piece; the scanning element, the film-tearing mechanism and the leveling mechanism are arranged sequentially along the transmission direction of the negative electrode substrate on the first track.

[0014] In some embodiments, two flipping devices are provided on either side of the feeding device in the left-right direction, and the two flipping devices are distributed left and right, with a processing station behind each flipping device; a detection station is provided on the movement path of the flipping seat, and a vision detection module is provided at the detection station.

[0015] In some embodiments, the feeding device includes a feeding bin for providing a tray containing the negative electrode substrate and a receiving bin for collecting empty trays. The feeding bin and the receiving bin are distributed left and right. The feeding bin has a discharge port at its upper part and the receiving bin has an inlet at its upper part. The feeding device includes a support platform that reciprocates between the discharge port and the inlet, a first transport member for transporting the tray in the feeding bin to the support platform, and a second transport member for transporting the empty tray on the support platform to the receiving bin. The feeding bin has a feeding track at its lower part and the receiving bin has a discharge track at its lower part. The feeding track and the discharge track are parallel to each other and extend in a front-back direction. The feeding track and the discharge track pass under the first track.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The battery negative electrode substrate welding equipment of the present invention has the following processing flow for the negative electrode substrate: The first transfer mechanism transfers the negative electrode substrate from the loading device to the loading station, and then transmits it to the front of the flipping device by the first track to the left or right. The second transfer mechanism transfers the negative electrode substrate from the first track to the flipping device, and the flipping device assembles the negative electrode substrate onto the battery located at the rear processing station. The welding head welds and fixes the negative electrode substrate and the battery, and then the flipping seat performs bending processing. The processed battery can be directly transmitted away along the second track. The movement trajectory of the negative electrode substrate is U-shaped, the path is clear, and the devices are also arranged along the movement trajectory, resulting in a compact layout that reduces the floor space occupied and shortens the material handling distance.

[0017] Meanwhile, starting from the loading station, the negative electrode substrates begin to be split, with one part of the negative electrode substrates being transported to the left and the other part to the right. The layout of the welding equipment is symmetrical from left to right. Regardless of whether the negative electrode substrates are transported to the left or to the right, they all undergo the above processing flow. That is, starting from the loading device, two symmetrical "U"-shaped negative electrode substrate processing trajectories are formed, enabling the equipment to operate in parallel on two lines and improving efficiency. Attached Figure Description

[0018] Appendix Figure 1 This is a schematic diagram of a battery negative electrode substrate welding device according to a specific embodiment of the present invention; Appendix Figure 2 For the appendix Figure 1 A diagram from another perspective; Appendix Figure 3 For the appendix Figure 1 Top view; Appendix Figure 4 This is a schematic diagram of a negative electrode substrate according to a specific embodiment; Appendix Figure 5 For the appendix Figure 4 A schematic diagram of the negative electrode substrate after the film has been removed; Appendix Figure 6 This is a schematic diagram of a second carrier, a battery, and a negative electrode substrate according to a specific embodiment; Appendix Figure 7 A schematic diagram showing the negative electrode substrate and the battery after welding and bending. Appendix Figure 8 For the appendix Figure 1 A schematic diagram of the tilting device, fixing mechanism, and other mechanisms. Appendix Figure 9 For the appendix Figure 8 Side view; Appendix Figure 10 For the appendix Figure 8 A schematic diagram of the flipping device in its first state; Appendix Figure 11 For the appendix Figure 10 Enlarged view of point A in the middle; Appendix Figure 12 For the appendix Figure 11 A schematic diagram after removing the negative electrode substrate; Appendix Figure 13 For the appendix Figure 10 Side view; Appendix Figure 14 A side view of the flipping device in its second state; Appendix Figure 15 This is a side view of the flipping device in its third state; Appendix Figure 16 This is a schematic diagram of a vision inspection module and a welding head; Appendix Figure 17 A schematic diagram of the fixed mechanism and the second vehicle; Appendix Figure 18 For the appendix Figure 17 Enlarged view of point B in the middle; Appendix Figure 19 For the appendix Figure 1 A schematic diagram of the film-tearing mechanism; Appendix Figure 20 For the appendix Figure 19 Enlarged view of point C in the middle; Appendix Figure 21 This is a schematic diagram of the gripper and holding components in non-working mode; Appendix Figure 22 This is a schematic diagram of the gripper and holding components in the working mode; Appendix Figure 23 For the appendix Figure 1 A schematic diagram of the leveling mechanism; Appendix Figure 24 For the appendix Figure 23 A schematic diagram of the middle section structure; Appendix Figure 25 For the appendix Figure 1 Schematic diagram of the feeding device; Appendix Figure 26 A schematic diagram of a first vehicle according to a specific embodiment; Appendix Figure 27 For the appendix Figure 26 Enlarged view of point D in the middle; Appendix Figure 28 For the appendix Figure 26 Enlarged view of point E in the middle; Wherein: 100, negative electrode substrate; 110, main board; 120, connecting piece; 130, film application area; 140, bent edge; 200, battery; 210, welding surface; 300, film body; 310, attachment part; 320, ejected part; 400, material tray; 101, loading station; 102, processing station; 103, inspection station; 104, temporary storage station; 1, loading device; 11, feeding bin; 12, receiving bin; 13. Supporting platform; 14. First conveying component; 15. Second conveying component; 16. Positioning assembly; 17. Feeding track; 18. Discharge track; 21. First track; 22. First carrier; 221. Support platform; 222. Slot; 223. First limiting structure; 224. Second limiting structure; 225. First positioning component; 226. Second positioning component; 3. Film tearing mechanism; 30. Elastic component; 31. Upper clamp; 311. First clamp 312. Gear; 32. Lower clamp; 321. Second clamping part; 322. Fixed tooth; 33. Pressing member; 331. Pressing part; 332. Connecting rod; 34. Mounting base; 35. Crossbeam; 36. Bracket; 37. Base; 4. Tilting device; 41. Tilting base; 411. Negative pressure adsorption surface; 42. Positioning member; 43. Pressing member; 44. Moving frame; 45. Lifting frame; 46. Fixed frame; 51. Second track; 5 2. Second carrier; 53. Welding head; 54. Return track; 61. First transfer mechanism; 62. Second transfer mechanism; 7. Fixing mechanism; 71. Abutting component; 711. Abutting head; 712. Through slot; 72. Rotating frame; 73. Cleaning module; 81. Scanning component; 82. Leveling mechanism; 821. First leveling component; 822. Second leveling component; 91. Vision inspection module; 92. Recycling hopper; 93. Lower support component. Detailed Implementation

[0019] The technical solutions in the embodiments of this application will now be clearly and completely described with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. Obviously, the embodiments described in this application are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0020] See Figures 1 to 3A battery negative electrode substrate welding device is shown, comprising a loading device 1, a substrate transfer mechanism, a flipping device 4, a battery handling mechanism, and a welding device. The loading device 1 provides a negative electrode substrate 100, and a loading station 101 is provided at the front of the loading device 1. The substrate transfer mechanism includes a first track 21 and a first carrier 22 capable of transferring the negative electrode substrate 100 along the first track 21. The first track 21 extends to the left and right sides from the loading station 101. The battery handling mechanism includes a second track 51 and a second carrier 52 capable of transferring batteries 200 along the second track 51. The second track 51 is located behind the loading device 1 and extends in the left-right direction, with multiple processing stations 102 provided along the second track 51. Flipping devices 4 are provided on both the left and right sides of the loading device 1, and the flipping devices 4 are located between the first track 21 and the second track 51 in the front-back direction. The processing stations 102 are located behind the flipping devices 4. The flipping device 4 includes a flipping seat 41 for assembling the negative electrode substrate 100 onto the battery 200 at the processing station 102 and for bending the negative electrode substrate 100. The flipping seat 41 is rotatably disposed about a rotation center line X1 and reciprocates between the first track 21 and the processing station 102. The welding device includes a welding head 53 located above the processing station 102.

[0021] In this embodiment, the welding equipment further includes a film-removing mechanism 3, which is disposed on one side of the first track 21. The film-removing mechanism 3 includes grippers for removing the film 300 attached to the negative electrode substrate 100. The welding equipment also includes a first transfer mechanism 61 for transferring the negative electrode substrate 100 from the loading device 1 to the loading station 101 and a second transfer mechanism 62 for transferring the negative electrode substrate 100 from the first track 21 to the flipping seat 41.

[0022] See Figure 3As shown, in this embodiment of the battery negative electrode substrate welding equipment, the loading device 1 is arranged in the front-to-back direction between the first track 21 and the second track 51, and in the left-to-right direction between the two sets of flipping devices 4. When the equipment is working, the first transfer mechanism 61 picks up the negative electrode substrate 100 from the loading device 1 and transfers it to the front loading station 101. Then, the negative electrode substrates 100 at the loading station 101 are divided into two groups, one group is transported to the left along the first track 21, and the other group is transported to the right. During the transport of the negative electrode substrate 100, the film-peeling mechanism 3 peels off the film 300 attached to the negative electrode substrate 100. After the negative electrode substrate 100 is transported to the front of the flipping device 4, the second transfer mechanism 62 transfers the negative electrode substrate 100 to the flipping seat 41. The battery 200 is transported to the processing station 102 by the second carrier 52. The flipping seat 41 assembles the negative electrode substrate 100 onto the battery 200 located at the processing station 102. Then, the welding head 53 welds the negative electrode substrate 100 and the battery 200. After welding is completed, the flipping seat 41 drives the negative electrode substrate 100 to bend by rotation, thereby completing the processing.

[0023] In the battery negative electrode substrate welding equipment of this embodiment, the first track 21, the flipping device 4, and the processing station 102 are arranged symmetrically from left to right, making the equipment structure neat. The negative electrode substrate 100 is transferred and processed along two symmetrical "U"-shaped tracks from left to right, starting from the feeding device 1. The equipment layout is compact, and the equipment realizes parallel operation of two lines, which improves work efficiency.

[0024] In this embodiment, the negative electrode substrate 100 has a main board 110 and a connecting piece 120 that is bent and extended from the self-contained board 110. See [reference needed] Figure 4 , Figure 5 As shown, the connecting piece 120 is located on one side of the main board 110 and extends along the thickness direction of the main board 110. A bent edge 140 is formed at the junction of the main board 110 and the connecting piece 120. When the negative electrode substrate 100 is connected to the battery 200, the connecting piece 120 is welded and fixed to the battery 200. The main board 110 bends around the bent edge 140 relative to the connecting piece 120 and retracts into each other with the connecting piece 120.

[0025] In this embodiment, the flipping device 4 has a feeding mode, a welding mode, and a bending mode, and the flipping seat 41 has a first state, a second state, and a third state that can be switched around the rotation center line X1. When the flipping device 4 is in the feeding mode, see... Figure 10 , Figure 13As shown, the flip base 41 is in the first state, with the negative pressure adsorption surface 411 facing upwards to support the negative electrode substrate 100. Specifically, when the flip base 41 is in the first state, the negative pressure adsorption surface 411 faces upwards to support the negative electrode substrate 100, the main board 110 is supported on the negative pressure adsorption surface 411, and the connecting piece 120 is located above the main board 110. Specifically, when the flip base 41 is in the first state, the negative pressure adsorption surface 411 extends horizontally, allowing the main board 110 to be placed horizontally on the flip base 41. After the negative electrode substrate 100 is placed on the flip base 41, the main board 110 is adsorbed and fixed from below by the negative pressure adsorption surface 110.

[0026] In this embodiment, when the flipping device 4 is in welding mode, the flipping seat 41 is in the second state, the negative pressure adsorption surface 411 extends vertically, the connecting piece 120 is converted to extend horizontally and fits against the welding surface 210 of the battery 200, and the main board 110 is located above the connecting piece 120. When the welding and bending integrated device switches from the feeding mode to the welding mode, the flipping seat 41 flips at a first angle. The flipping seat 41 drives the main board 110 to flip, thereby driving the connecting piece 120 to rotate, so that the connecting piece 120 is converted to extend horizontally, thereby being able to be assembled to the welding surface 210 of the battery 200. In welding mode, the welding working head 53 can weld the battery 200 and the negative electrode substrate 100 located at the processing station 102.

[0027] In this embodiment, when the flipping device 4 is in bending mode, the connecting piece 120 is welded and fixed to the welding surface 210. The flipping base 41 rotates around the rotation center line X1 and transitions from the second state to the third state, causing the negative pressure adsorption surface 411 to move downward toward the welding surface 210, so that the main board 110 bends relative to the connecting piece 120. Specifically, in this embodiment, when the integrated device transitions from welding mode to bending mode, the flipping base 41 flips at a second angle. In bending mode, the flipping base 41 causes the main board 110 to fold up above the connecting piece 120. In this embodiment, the sum of the first angle and the second angle is 180°.

[0028] In this embodiment, the flipping device 4 fixes the flipping base 41 to the main board 110 and rotates the main board 110 via the flipping base 41 to adjust the state of the connecting piece 120. Furthermore, the flipping device 4 uses a bottom-adhesive method to fix the main board 110, reducing damage to the main board 110 and avoiding interference during subsequent bending operations. In this embodiment, by driving the flipping base 41 to rotate around the rotation center line X1, the flipping base 41 transitions from a first state to a second state, and after the negative electrode substrate 100 and battery 200 are welded, it continues to transition to a third state. This allows for the sequential completion of multiple operations, including adjusting the state of the negative electrode substrate 100, assembly, and bending of the negative electrode substrate 100. The flipping base 41 integrates multiple functions, eliminating the need for separate assembly and bending mechanisms, thus simplifying the device structure. Simultaneously, after welding the battery 200 and negative electrode substrate 100, the device can directly bend the negative electrode substrate 100 in situ, saving space and improving the device's processing efficiency.

[0029] In this embodiment, the rotation center line X1 extends horizontally. When the flip base 41 is switched to the third state, the main board 110 and the connecting piece 120 fold in the vertical direction. Specifically, see Figure 7 , Figure 15 As shown, in this embodiment, when the flip seat 41 is switched to the third state, the negative pressure adsorption surface 411 faces downward, and the main board 110 is folded over the connecting piece 120. In this embodiment, the negative electrode substrate 100 and the connecting piece 120 are metal sheets, and the main board 110 includes a circuit board. The main board 110 is larger in volume and heavier than the connecting piece 120.

[0030] In this embodiment, when the motherboard 110 is supported on the negative pressure adsorption surface 411, the bent edge 140 extends along the rotation center line X1. Thus, in the bending mode, the flip seat 41 can drive the motherboard 110 to bend relative to the connecting piece 120 around the bent edge 140. Specifically, a positioning member 42 is provided on one side of the negative pressure adsorption surface 411. The motherboard 110 supported on the negative pressure adsorption surface 411 abuts against the positioning member 42, thereby positioning the motherboard 110 and consequently positioning the negative electrode substrate 100. A preset distance exists between the rotation center line X1 and the negative pressure adsorption surface 411, and between the rotation center line X1 and the positioning member 42, allowing the bent edge 140 of the positioned negative electrode substrate 100 to extend along the rotation center line X1. See also... Figure 12 As shown, in the first state, the flip seat 41 has the positioning member 42 protruding upward from one side of the negative pressure adsorption surface 411. Specifically, the positioning member 42 is used to abut against the side of the connecting piece 120 in the motherboard 110 that is bent upward. In other embodiments, the positioning member 42 is provided on other sides, or multiple positioning members 42 are provided for positioning multiple sides of the motherboard 110 respectively.

[0031] In this embodiment, the motherboard 110 and the connecting piece 120 form a right angle, see [reference]. Figure 13 , Figure 14 As shown, when the flip base 41 transitions from the first state to the second state, the flip base 41 rotates 90° around the rotation center line X1, that is, the first angle is 90°. See also Figure 14 , Figure 15 As shown, when the flip seat 41 transitions from the second state to the third state, the flip seat 41 continues to rotate 90° around the rotation center line X1, that is, the second angle is 90°.

[0032] In this embodiment, see Figure 11 , Figure 12 As shown, the flipping device 4 also includes a clamping member 43, which can be positioned relative to the negative pressure adsorption surface 411 in a direction perpendicular to the negative pressure adsorption surface 411 to clamp the motherboard 110. When the negative electrode substrate 100 is placed on the negative pressure adsorption surface 411, the clamping member 43 can clamp and fix the motherboard 110 from top to bottom. With the cooperation of the negative pressure adsorption surface 411 and the clamping member 43, the negative electrode substrate 100 can be firmly fixed on the flipping base 41, thereby preventing the negative electrode substrate 100 from being disturbed during the flipping process.

[0033] In this embodiment, the clamping member 43 can also be movably disposed along the extending direction of the negative pressure adsorption surface 411. Since the main board 110 is folded above the connecting piece 120 when the flip seat 41 is switched to the third state, during the transition of the flip seat 41 from the second state to the third state, the clamping member 43 releases its pressure on the negative electrode substrate 100 and moves away from the negative electrode substrate 100, thereby creating a clearance. In this embodiment, see... Figure 11 , Figure 12 As shown, the thickness of the clamping member 43 gradually decreases along the direction approaching the negative pressure adsorption surface 411, and a slope extending towards the negative pressure adsorption surface 411 is formed on the side of the clamping member 43 away from the negative pressure adsorption surface 411 to form a clearance. In this embodiment, the clamping member 43 only moves away from the negative pressure adsorption surface 411 after the main board 110 bends towards the connecting piece 120 at a preset angle, and the clamping member 43 remains fixed to the main board 110 within the preset angle. In this embodiment, after the flip seat 41 drives the main board 110 to rotate relative to the connecting piece 120 by 30° to 50°, the remaining angle is greater than the angle between the clamping surface of the clamping member 43 and the back slope. At this time, the clamping member 43 releases its clamping on the negative electrode substrate 100 and exits between the main board 110 and the connecting piece 120.

[0034] In this embodiment, the flipping device 4 includes a horizontally movable frame 44 and a vertically movable lifting frame 45 relative to the movable frame 44. The flipping base 41 is rotatably disposed on the lifting frame 45 about a rotation center line X1. After the negative electrode substrate 100 is fixed to the flipping base 41, the movable frame 44 is driven to move, causing the flipping base 41 to move the negative electrode substrate 100 to the processing station 102. During the transfer of the negative electrode substrate 100, or after the transfer of the negative electrode substrate 100 is completed, the flipping base 41 completes the transition to the second state, and the assembly of the negative electrode substrate 100 is completed by the horizontal movement of the movable frame 44 and the vertical movement of the lifting frame 45. In this embodiment, the flipping device 4 also includes a fixed frame 46, which is rotatably connected to the lifting frame 45 about a vertically extending rotation axis, and the flipping base 41 is rotatably connected to the fixed frame 46. By driving the fixed frame 46 to rotate about the rotation axis, the angle of the flipping base 41 can be adjusted, and the angle of the negative electrode substrate 100 can be adjusted, thereby achieving accurate assembly of the negative electrode substrate 100.

[0035] In this embodiment, see Figure 8 , Figure 9 As shown, a fixing mechanism 7 is provided at processing station 102. (See attached image) Figure 17 , Figure 18 As shown, the fixing mechanism 7 includes a vertically movable abutment 71. The lower part of the abutment 71 has an abutment head 711, which has a through groove 712 extending vertically. In welding mode, the abutment head 711 abuts against the connecting piece 120, causing the connecting piece 120 to be firmly fixed against the welding surface 210, thereby fixing the connecting piece 120 relative to the battery 200 and preventing relative displacement between the connecting piece 120 and the battery 200 during welding. During welding, the through groove 712 forms a channel for the welding beam to pass through. The peripheral wall of the through groove 712 encloses a welding area on the connecting piece 120, and the welding beam welds the connecting piece 120 and the battery 200 within this area. The through groove 712 serves both as a guide for the welding beam and as a barrier to prevent welding slag from contaminating the negative electrode substrate 100 or the battery 200. In this embodiment, the fixing mechanism 7 includes a rotating frame 72, which is rotatably arranged around a rotation center line X2 extending in the vertical direction. Multiple abutment members 71 are circumferentially spaced on the rotating frame 72, and the abutment members 71 are movable up and down and connected to the rotating frame 72. During the welding process, the abutment heads 711 may become contaminated; therefore, multiple abutment heads 711 are used to alternately perform the clamping operation.

[0036] In this embodiment, see Figure 17As shown, the fixing mechanism 7 includes a cleaning module 73 for cleaning the abutment head 711. The cleaning module 73 is disposed on one side of the rotating frame 72. The rotating frame 72 can rotate around the rotation center line X2 extending in the vertical direction and can also be moved horizontally. After the abutment head 711 has completed the welding operation, the rotating frame 72 is driven to rotate and translated, so that the abutment head 711 moves away from the processing station 102 and enters the cleaning module 73 for cleaning.

[0037] In this embodiment, the cleaning module 73 includes a housing, brush rollers rotatably disposed within the housing, and a ventilation assembly communicating with the interior of the housing. One side of the housing has an opening for the abutment head 711 to extend into the interior. When the abutment head 711 extends into the housing through the opening, the brush rollers clean the abutment head 711, and the ventilation assembly removes the cleaned impurities. In this embodiment, two brush rollers are rotatably disposed within the housing, rotating in opposite directions. When cleaning the abutment head 711, the abutment head 711 extends between the two brush rollers, and the two brush rollers remove the impurities adhering to the abutment head 711.

[0038] In this embodiment, the abutment 71 includes a slag suction hole (not shown in the figure) opened on the wall of the through groove 712 and a slag suction assembly connected to the slag suction hole and used to absorb the welding slag generated during the welding process, so as to ensure the cleanliness of the working surface during welding.

[0039] In this embodiment, see Figure 19 , Figure 20As shown, the grippers of the film-tearing mechanism 3 include an upper clamp 31 and a lower clamp 32. The upper clamp 31 is positioned above the lower clamp 32 and is movable vertically. The film-tearing mechanism 3 also includes a pressing member 33 slidably connected to the upper clamp 31 in the vertical direction and an elastic member 30 disposed between the upper clamp 31 and the pressing member 33. The elastic member 30 provides the force required to drive the pressing member 33 downward. When the film-tearing mechanism 3 is in a non-operating mode, the lower end of the pressing member 33 is located below the upper clamp 31. When the upper clamp 31 moves downward and engages with the lower clamp 32 to clamp the film 300, the pressing member 33 moves downward until it abuts against the negative electrode substrate 100, causing the pressing member 33 to slide relative to the upper clamp 31, and the elastic member 30 is compressed. During the upward movement of the grippers to tear off the film 300, under the action of the elastic member 30, the holding member 33 can maintain its position against the negative electrode substrate 100 and apply a downward force to the negative electrode substrate 100 to maintain its stability. Specifically, the upper clamp 31 has a first clamping portion 311, and the lower clamp 32 has a second clamping portion 321. In the non-working mode, the first clamping portion 311 and the second clamping portion 321 are spaced apart in the vertical direction, and the lower end of the holding member 33 is located below the first clamping portion 311, and the first clamping portion 311 and the lower end of the holding member 33 have a first distance in the vertical direction. In the non-working mode, see Figure 21 As shown, the grippers open, allowing them to move and insert the film 300 into the gap between the first gripping part 311 and the second gripping part 321. The film-tearing mechanism 3 also has a working mode, as shown in the diagram. Figure 22 As shown, the first clamping part 311 and the second clamping part 321 approach each other to clamp the membrane 300 between them, the lower end of the pressing member 33 abuts against the negative electrode substrate 100, and the first clamping part 311 and the lower end of the pressing member 33 have a second distance in the vertical direction that is smaller than the first distance.

[0040] Specifically, when the film-tearing mechanism 3 switches from the non-working mode to the working mode, the upper clamp 31 drives the holding member 33 to move downward. During this process, the lower end of the holding member 33 contacts the negative electrode substrate 100, and the holding member 33 stops moving after contact. Since there is a first gap between the first clamping part 311 and the lower end of the holding member 33, after the holding member 33 stops moving, there is still a certain distance between the first clamping part 311 and the film body 300 and the second clamping part 321, so the upper clamp 31 needs to be driven to continue moving downward. During the continued movement of the upper clamp 31, the holding member 33 slides relative to the upper clamp 31, causing the elastic member 30 to be compressed. When the first clamping part 311 and the second clamping part 321 come together and clamp the film 300, the film-tearing mechanism 3 switches to the working mode. In this state, under the drive of the elastic member 30, the lower end of the pressing member 33 presses against the negative electrode substrate 100 and applies a downward pressing force to the negative electrode substrate 100, so that the negative electrode substrate 100 is pressed and fixed. At this time, only the up and down movement of the gripper is needed to pull the film 300 and tear it off. During the film-tearing process, under the drive of the elastic member 30, the pressing member 33 slides relative to the upper clamp 31 and maintains the pressing and fixing of the negative electrode substrate 100, thereby maintaining the stability of the negative electrode substrate 100 during the film-tearing process.

[0041] In this embodiment, by providing a holding member 33, during the clamping process of the film 300, the holding member 33 simultaneously forms a pressing and fixing force on the negative electrode substrate 100. During the film removal process, the holding member 33 can maintain the pressing force on the negative electrode substrate 100, thereby maintaining the stability of the negative electrode substrate 100. The device does not require a separate holding mechanism to fix the negative electrode substrate 100, simplifying the device's structural design. In this embodiment, during the film removal process, when the distance between the first clamping part 311 and the lower end of the holding member 33 reaches the first gap, the upper clamp can drive the holding member 33 to move together, thereby causing the holding member 33 to disengage from the negative electrode substrate 100 and releasing the pressing and fixing force on the negative electrode substrate 100. Thus, during the film removal process, the film removal mechanism 3 can also automatically release the pressing and fixing force on the negative electrode substrate 100, simplifying the workflow and improving efficiency.

[0042] In this embodiment, see Figure 20 As shown, a mounting base 34 is fixedly provided on one side of the upper clamp 31. The mounting base 34 has a mounting hole. The clamping member 33 has a connecting rod 332 extending vertically and a clamping part 331 fixedly provided at the lower end of the connecting rod 332. The connecting rod 332 is slidably inserted into the mounting hole. In the working mode, the clamping part 331 abuts against the negative electrode substrate 100. In this embodiment, the elastic member 30 is provided between the clamping part 331 and the mounting base 34. Through the cooperation between the mounting hole and the connecting rod 332, a sliding connection is achieved while providing guidance for the sliding of the clamping member 33.

[0043] In this embodiment, see Figure 19 As shown, the film-tearing mechanism 3 includes a horizontally extending crossbeam 35, a support 36 slidably disposed on the crossbeam 35, and a seat 37 slidably disposed on the support 36. A lower clamp 32 is fixedly connected to the seat 37, and an upper clamp 31 is slidably connected to the seat 37. When the film-tearing mechanism 3 switches to its working mode, it drives the support 36 to move horizontally and the seat 37 to move vertically, causing the film 300 to enter between the first clamping part 311 and the second clamping part 321. During the film-tearing operation, the seat 37 moves upward, causing the upper clamp 31 and the lower clamp 32 to move upward synchronously. In this embodiment, the crossbeam 35 is mounted above the first track 21 and extends in the front-to-back direction.

[0044] In this embodiment, see Figure 21 As shown, in the non-working mode, the pressing part 331 is located between the first clamping part 311 and the second clamping part 321 in the vertical direction, and the membrane body 300 can enter between the first clamping part 311 and the second clamping part 321 from the gap between the pressing part 331 and the second clamping part 321.

[0045] In this embodiment, see Figure 4 As shown, the film 300 has an attachment portion 310 covering the upper surface of the negative electrode substrate 100 and a protruding portion 320 extending outward from one side of the negative electrode substrate 100. The first clamping portion 311 and the second clamping portion 321 clamp the protruding portion 320, and the attachment portion 310 is peeled off from the negative electrode substrate 100 by pulling the protruding portion 320. In this embodiment, there is a boundary line between the attachment portion 310 and the protruding portion 320, and the first distance is greater than the maximum vertical distance from the edge of the attachment portion 310 to the boundary line. This ensures that the pressing member 33 always abuts against the negative electrode substrate 100 before the film 300 is completely peeled off, and maintains the stability of the negative electrode substrate 100.

[0046] In this embodiment, the negative electrode substrate 100 has a film-coated area 130 covered by the film 300 and a blank area not covered by the film. In operation, the holding member 33 abuts against the blank area. See also Figure 4 As shown, except for the film application area 130, all other areas are blank. The holding member 33 rests against the blank area to avoid interfering with the film removal operation.

[0047] In this embodiment, see Figures 26 to 28As shown, the first carrier 22 is provided with a support platform 221 for supporting the negative electrode substrate 100. A slot 222 is provided on one side of the support platform 221. When the negative electrode substrate 100 is located on the support platform 221, the protruding part 320 extends out of the slot 222. In the working mode, the lower clamp 32 is inserted into the slot 222. The slot 222 is provided to avoid interference between the first carrier 22 and the lower clamp 32. At the same time, the slot 222 also guides and positions the lower clamp 32 so that the upper clamp 31 and the lower clamp 32 can accurately clamp the protruding part 320 of the membrane 300.

[0048] In this embodiment, see Figure 27 As shown, the first carrier 22 includes a fixedly disposed first limiting structure 223 and a second limiting structure 224. The first carrier 22 is provided with a first positioning member 225 that can move away from and towards the first limiting structure 223 along a first direction, and a second positioning member 226 that can move away from and towards the second limiting structure 224 along a second direction. The first direction and the second direction intersect. The first carrier 22 has a fixed state. When in the fixed state, the negative electrode substrate 100 is located on the support platform 221. The first positioning member 225 moves closer to the first limiting structure 223 and clamps the negative electrode substrate 100 along the first direction, and the second positioning member 226 moves closer to the second limiting structure 224 and clamps the negative electrode substrate 100 along the second direction. In this embodiment, the first direction and the second direction are in a horizontal plane. Specifically, the first direction is the front-to-back direction, and the second direction is the left-to-right direction. The negative electrode substrate 100 can remain stable in the horizontal plane. During the film peeling process, the pressing member 33 fixes the negative electrode substrate 100 in the vertical direction, thereby fixing the negative electrode substrate 100 in three directions. In this embodiment, the first carrier 22 is provided with a first groove extending along the first direction and a second groove extending along the second direction. The first positioning member 225 is movably disposed in the first groove, and the second positioning member 226 is movably disposed in the second groove. The first groove and the second groove provide guidance for the movement of the first positioning member 225 and the second positioning member 226, respectively. Specifically, the slot 222 constitutes the first groove, and the first positioning member 225 is movably disposed in the slot 222. In the working mode, the first positioning member 225 moves to one side of the slot 222, and the lower clamp 32 is inserted into the slot 222 and located on the side of the first positioning member 225 away from the first limiting structure 223.

[0049] In this embodiment, a buffer pad is provided at the lower end of the pressing member 33, that is, a buffer pad is provided on the pressing part 331, to avoid damage to the negative electrode substrate 100 when the pressing part 331 comes into contact with the negative electrode substrate 100. In this embodiment, see Figure 20As shown, the first clamping part 311 of the upper clamp 31 is provided with a toothed groove 312, and the second clamping part 321 of the lower clamp 32 is provided with a fixed tooth 322 that cooperates with the toothed groove 312. The meshing cooperation between the toothed groove 312 and the fixed tooth 322 improves the stability of the clamping jaws on the membrane 300.

[0050] In this embodiment, see Figure 1 , Figure 3 As shown, a scanning element 81 is also provided above the first track 21. The scanning element 81 is used to scan and identify the transmitted negative electrode substrate 100. A leveling mechanism 82 is provided on one side of the first track 21. See [link to diagram]. Figure 23 , Figure 24 As shown, the leveling mechanism 82 includes a first leveling member 821 and a second leveling member 822 that can be brought together to clamp the connecting piece 120. See also Figure 3 As shown, the scanning element 81, the film-tearing mechanism 3, and the leveling mechanism 82 are arranged sequentially along the transport direction of the negative electrode substrate 100 on the first track 21. After the negative electrode substrate 100 is transferred to the loading station 101, it is transported along the first track 21. During the transport process, it is first scanned by the scanning element 81, and then the film-tearing mechanism 3 tears off the film 300 on the negative electrode substrate 100. Afterwards, the connecting piece 120 is clamped by the first leveling element 821 and the second leveling element 822 to level the connecting piece. In this embodiment, see... Figure 3 As shown, a set of scanning components 81, a film-tearing mechanism 3, and a leveling mechanism 82 are respectively provided on the left and right sides of the loading station 101, and the two sets of scanning components 81, film-tearing mechanism 3, and leveling mechanism 82 are symmetrically distributed in the left-right direction. In this embodiment, the first track 21 includes two sets arranged side by side in the front-back direction to improve the efficiency of providing negative electrode substrates 100 to the flipping device 4. In this embodiment, the first carrier 22 is provided with two support platforms 221, and one first carrier 22 can carry two negative electrode substrates 100. Correspondingly, each film-tearing mechanism 3 is provided with two grippers that can simultaneously perform film-tearing processing on the two negative electrode substrates 100 on the first carrier 22. Each leveling mechanism 82 is also provided with two sets of first leveling components 821 and second leveling components 822, which can simultaneously perform leveling processing on the connecting pieces 120 of the two negative electrode substrates 100.

[0051] In this embodiment, a temporary storage station 104 is provided at the end of the first track 21. The first track 21 connects the loading station 101 and the temporary storage station 104. The negative electrode substrate 100 after scanning, film peeling and leveling can be temporarily stored in the temporary storage station 104 so that the second transfer mechanism 62 can pick up the material later.

[0052] In this embodiment, two flipping devices 4 are provided on either side of the feeding device 1 in the left-right direction, and the two flipping devices 4 are distributed left and right. Each flipping device 4 has a processing station 102 behind it. The equipment is provided with a total of four flipping devices 4, which can effectively improve the production cycle. In this embodiment, the welding working head 53 located on the left and right sides of the feeding device 1 can move left and right, so that the welding working head 53 can reciprocate between the two processing stations 102. The welding working head 53 alternately welds the negative electrode substrate 100 and the battery 200 at the two processing stations 102.

[0053] In this embodiment, see Figure 8 , Figure 9 and Figure 16 As shown, a detection station 103 is provided on the movement path of the flipping seat 41. A vision inspection module 91 is provided above the detection station 103. Before assembling and welding the negative electrode substrate 100, the vision inspection module 91 performs positioning detection on the negative electrode substrate 100. Based on the detection information, the negative electrode substrate 100 can be adjusted by the moving frame 44, the lifting frame 45 and the fixed frame 46 so that subsequent operations can be carried out accurately.

[0054] In this embodiment, see Figure 25 As shown, the feeding device 1 includes a feeding bin 11 for providing a tray 400 containing a negative electrode substrate 100 and a receiving bin 12 for collecting empty trays. The feeding bin 11 and the receiving bin 12 are distributed left and right. The upper part of the feeding bin 11 has a discharge port, and the upper part of the receiving bin 12 has a feed port. The feeding device 1 includes a support platform 13 that reciprocates between the discharge port and the feed port, a first transport member 14 for transporting the tray 400 in the feeding bin 11 to the support platform 13, and a second transport member 15 for transporting the empty tray on the support platform 13 to the receiving bin 12. The first transfer mechanism 61 obtains the negative electrode substrate 100 from the support platform 13. The support platform 13 is provided with a positioning component 16 for positioning the tray 400. The positioning component 16 can clamp the tray 400 along the circumference of the tray 400 so that the tray 400 is accurately positioned and can be maintained stably, thereby ensuring that the first transfer mechanism 61 can successfully obtain the negative electrode substrate 100.

[0055] In this embodiment, the lower part of the feeding hopper 11 is provided with a feeding track 17, and the lower part of the receiving hopper 12 is provided with a discharging track 18. The feeding track 17 and the discharging track 18 are parallel to each other and extend in the front-to-back direction. See [reference needed] Figure 1 As shown, the feeding track 17 and the discharging track 18 pass under the first track 21. The equipment provides the material tray 400 to the feeding hopper 11 from below and transports the empty material tray from below, making reasonable use of the vertical space and reducing the occupation of the planar space.

[0056] In this embodiment, see Figures 1 to 3 As shown, the battery negative electrode substrate welding equipment includes a return track 54 located behind the second track 51 and extending in the left-right direction, for reflowing the second carrier 52.

[0057] In this embodiment, see Figure 6 As shown, the battery 200, fixed to the second carrier 52, has one side extending out from one side of the second carrier 52, with a welding surface located on this side. In this embodiment, see... Figure 9 As shown, a lower support member 93 is provided below the processing station 102. The lower support member 93 is movable up and down. When the second carrier 52 transports the battery 200 to the processing station 102, the lower support member 93 moves upward and abuts against the battery 200 in the suspended state, thereby providing support for the battery 200 in the suspended state so that the battery 200 can remain stable during subsequent negative electrode substrate 100 assembly, abutment member 71 pressing and welding operations. In this embodiment, a recycling bin 92 for recycling defective negative electrode substrates 100 is provided between the first track 21 and the flipping device 4.

[0058] In summary, the battery negative electrode substrate welding equipment of this embodiment has the following processing flow for the negative electrode substrate 100: the first transfer mechanism 61 transfers the negative electrode substrate 100 from the loading device 1 forward to the loading station 101, and then transports it to the front of the flipping device 4 along the first track 21 to the left or right. The second transfer mechanism 62 transfers the negative electrode substrate 100 from the first track 21 to the flipping device 4, and the flipping device 4 assembles the negative electrode substrate 100 onto the battery 200 located at the rear processing station 102. The welding head 53 performs welding connection, and the flipping seat 41 performs bending processing. The movement trajectory of the negative electrode substrate 100 is U-shaped, the path is clear, and the devices are also arranged along the movement trajectory, resulting in a compact layout that reduces the floor space occupied and shortens the material handling distance.

[0059] Simultaneously, starting from the loading station 101, the negative electrode substrate 100 begins to be split, with one part of the negative electrode substrate 100 being transported to the left and the other part being transported to the right. The welding equipment is symmetrically arranged on the left and right sides. Regardless of whether the negative electrode substrate 100 is transported to the left or the negative electrode substrate 100 is transported to the right, it undergoes the above-mentioned processing flow. That is, starting from the loading device 1, two "U"-shaped negative electrode substrate processing trajectories are formed symmetrically in the left and right directions. The equipment realizes parallel operation of two lines, which improves efficiency.

[0060] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A battery negative electrode substrate welding device, characterized in that, include: A feeding device is used to provide a negative electrode substrate, and a feeding station is provided on the front side of the feeding device; A substrate transport mechanism includes a first track and a first carrier capable of transporting the negative electrode substrate along the first track. The first track includes two sets extending to the left and to the right from the loading station. A film-tearing mechanism is disposed on one side of the first track, and the film-tearing mechanism includes grippers for tearing off the film attached to the negative electrode substrate; A battery handling mechanism includes a second track and a second carrier capable of transporting the battery along the second track. The second track is located behind the loading device and extends in the left-right direction. Multiple processing stations are arranged along the second track, and the battery to be processed is placed at the processing station. The flipping device is provided on both the left and right sides of the feeding device. The flipping device is located between the first track and the second track. The processing station is located behind the flipping device. The flipping device includes a flipping seat for assembling the negative electrode substrate onto the battery and for bending the negative electrode substrate. The flipping seat is rotatably arranged around the rotation center line and reciprocates between the first track and the processing station. The welding apparatus includes a welding head located above the processing station; The welding equipment further includes a first transfer mechanism for transferring the negative electrode substrate from the feeding device to the feeding station and a second transfer mechanism for transferring the negative electrode substrate from the first track to the flipping seat.

2. The battery negative electrode substrate welding equipment according to claim 1, characterized in that: The negative electrode substrate has a main board and a connecting piece located on one side of the main board and extending along the thickness direction of the main board. The flip base is provided with a negative pressure adsorption surface for fixing the main board. When the flipping device is in the feeding mode, the negative pressure adsorption surface faces upward and extends horizontally; when the flipping device is in the welding mode, the negative pressure adsorption surface extends vertically, the connecting piece extends horizontally, and the connecting piece is in contact with the welding surface of the battery; when the flipping device is in the bending mode, the negative pressure adsorption surface moves downward toward the welding surface, so that the motherboard is folded up above the connecting piece.

3. The battery negative electrode substrate welding equipment according to claim 2, characterized in that: A bent edge is formed at the junction of the motherboard and the connecting piece. When the motherboard is supported on the negative pressure adsorption surface, the bent edge extends along the rotation center line. In the bending mode, the motherboard bends around the bent edge relative to the connecting piece and retracts into the connecting piece.

4. The battery negative electrode substrate welding equipment according to claim 2, characterized in that: The processing station is provided with a fixing mechanism, which includes a support member that can move up and down. The lower part of the support member is provided with a support head, and the support head has a through groove that runs through the vertical direction. In the welding mode of the flipping device, the abutment head presses the connecting piece against the welding surface of the battery, and the peripheral wall of the through groove encloses the area to be welded above the connecting piece.

5. The battery negative electrode substrate welding equipment according to claim 4, characterized in that: The abutment includes a slag suction hole formed on the wall of the through groove and a slag suction assembly connected to the slag suction hole and used to absorb welding slag.

6. The battery negative electrode substrate welding equipment according to claim 1, characterized in that: The gripper of the film-tearing mechanism includes an upper gripper and a lower gripper, wherein the upper gripper is located above the lower gripper and can move up and down; The film-tearing mechanism includes a pressing member that is slidably connected to the upper clamp in the vertical direction and an elastic member disposed between the upper clamp and the pressing member. The elastic member is used to provide the force required to drive the pressing member to move downward. When the film-tearing mechanism is in a non-working mode, the lower end of the pressing member is located below the upper clamp.

7. The battery negative electrode substrate welding equipment according to claim 6, characterized in that: The upper clamp has a first clamping portion, and the lower clamp has a second clamping portion. In the non-working mode, the first clamping portion and the second clamping portion are spaced apart in the vertical direction, the lower end of the pressing member is located below the first clamping portion, and the first clamping portion and the lower end of the pressing member have a first distance in the vertical direction. In the working mode, the first clamping portion and the second clamping portion are brought together to clamp the membrane between them, the lower end of the pressing member abuts against the negative electrode substrate, and the first clamping portion and the lower end of the pressing member have a second distance in the vertical direction that is smaller than the first distance.

8. The battery negative electrode substrate welding equipment according to claim 7, characterized in that: The first carrier is provided with a support platform for supporting the negative electrode substrate. A slot is provided on one side of the support platform. The membrane has an attachment portion covering the surface of the negative electrode substrate and a protruding portion extending outward from one side of the negative electrode substrate. When the negative electrode substrate is located on the support platform, the protruding portion extends out of the slot opening. In the working mode, the lower clamp is inserted into the slot.

9. The battery negative electrode substrate welding equipment according to claim 1, characterized in that: A scanning component for scanning is also provided above the first track; the negative electrode substrate has a main board and a connecting piece that bends upward from the main board; a leveling mechanism is provided on one side of the first track; the leveling mechanism includes a first leveling component and a second leveling component that can be brought together to clamp the connecting piece; the scanning component, the film-tearing mechanism and the leveling mechanism are arranged sequentially along the transmission direction of the negative electrode substrate on the first track.

10. The battery negative electrode substrate welding equipment according to claim 1, characterized in that: Two flipping devices are provided on either side of the feeding device in the left-right direction, and the two flipping devices are distributed left and right, with a processing station provided behind each flipping device; The movement path of the flipping seat is provided with a detection station, and a vision detection module is provided at the detection station.

11. The battery negative electrode substrate welding equipment according to claim 1, characterized in that: The feeding device includes a feeding bin for providing a tray containing the negative electrode substrate and a receiving bin for collecting empty trays. The feeding bin and the receiving bin are distributed left and right. The feeding bin has a discharge port at its upper part and the receiving bin has an inlet at its upper part. The feeding device includes a support platform that reciprocates between the discharge port and the inlet, a first transport component for transporting the tray in the feeding bin to the support platform, and a second transport component for transporting the empty tray on the support platform to the receiving bin. The lower part of the feeding hopper is provided with a feeding track, and the lower part of the receiving hopper is provided with a discharging track. The feeding track and the discharging track are parallel to each other and extend in the front-back direction; the feeding track and the discharging track pass under the first track.

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