Multi-wire cutting method

Abstract

The invention provides a multi-wire cutting method which comprises the following steps: a preparation step: fixing a to-be-cut piece on a swinging mechanism, and driving the to-be-cut piece to a preset cutting starting position by the swinging mechanism; a cutting step: starting a rotating roller to drive the wire net to run to a preset cutting wire speed, driving the to-be-cut piece to enter the wire net at the maximum preset swinging angle of the swinging mechanism by the swinging mechanism, swinging at the maximum preset swinging angle and cutting until the cutting is finished; and in the discharging step, the swinging mechanism drives the cut to-be-cut piece to be separated from the wire net. By means of the technical scheme, the problems that in the prior art, due to the fact that the cutter feeding mode generally adopted in the swing cutting process is direct descending cutter feeding in the vertical direction, the cutter feeding swing line arch difference is likely to be too large, the thickness of a cut wafer is not uniform, and the cutting quality of the wafer is low can be solved.

Description

Technical Field

[0001] This invention relates to the field of multi-wire cutting technology, and more specifically, to a multi-wire cutting method. Background Technology

[0002] Currently, the cutting of large sapphire ceramic optical wafers mainly employs oscillating cutting. Oscillating cutting can improve the liquid flow during the cutting process, transforming line contact into point contact, which greatly improves cutting efficiency and reduces cutting costs. Introducing oscillating cutting into large superhard sapphire ceramic optical wafers, on the one hand, improves cutting efficiency and reduces costs; on the other hand, it increases the complexity of the entry and exit processes due to the increased oscillating cutting.

[0003] In existing sway cutting processes, the common approach is to lower the blade vertically and then gradually increase the sway angle to the maximum cutting angle to achieve cutting. As the sway angle gradually increases, it can easily lead to excessive sway line difference, resulting in uneven thickness of the cut wafer and reducing the overall wafer cutting quality. Summary of the Invention

[0004] This invention provides a multi-wire cutting method to solve the problem that the existing oscillating cutting process usually uses a vertically descending cutting method, which easily leads to excessive sway line camber, resulting in uneven wafer thickness and low wafer cutting quality.

[0005] This invention provides a multi-wire cutting method, which includes: a preparation step: fixing the workpiece to be cut on a swaying mechanism, the swaying mechanism driving the workpiece to be cut to a preset cutting start position; a cutting step: turning on the rotating roller to drive the wire mesh to run to a predetermined cutting speed, the swaying mechanism driving the workpiece to be cut to enter the wire mesh at the maximum preset swaying angle of the swaying mechanism, and swaying and cutting at the maximum preset swaying angle until the cutting is completed; and a unloading step: the swaying mechanism driving the cut workpiece to be cut to detach from the wire mesh.

[0006] Furthermore, the maximum preset swing angle is α1, 4°≤α1≤6°; when the cutting ends, the swing mechanism drives the workpiece to be cut to move to the preset cutting end position with the retraction swing angle, and the retraction swing angle is α2, 50%α1≤α2≤80%α1.

[0007] Furthermore, the oscillating mechanism drives the workpiece to be cut to enter the wire mesh at a first oscillating speed, the first oscillating speed being v1, 5deg / s≤v1≤8deg / s; the oscillating mechanism drives the workpiece to be cut to move to the preset cutting end position at a second oscillating speed, the second oscillating speed being v2, 50%v1≤v2≤80%v1; v2 / v1=α2 / α1.

[0008] Furthermore, the wire netting has a winding and unwinding cycle of 600m-1000m, and the difference between the unwinding length and the winding length in each winding and unwinding cycle is the same.

[0009] Furthermore, the preparation steps also include: bonding the part to be cut to a resin board, fixing the resin board to the swing mechanism, and the thickness of the resin board being a, where 20mm≤a≤25mm.

[0010] Furthermore, the part to be cut includes a crystal rod and two guide strips. The guide strips extend along the length direction of the rotating roller, and the two guide strips are bonded to the bottom edge of the crystal rod and are spaced apart along the width direction of the crystal rod.

[0011] Furthermore, the oscillating mechanism drives the guide bar to enter the wire mesh at a first cutting stage speed and move until the guide bar cutting ends. The first cutting stage speed is v3, 600μm / min≤v3≤1000μm / min. The oscillating mechanism drives the crystal rod to enter the wire mesh at a second cutting stage speed and move. The second cutting stage speed is v4, 140μm / min≤v4≤250μm / min. The oscillating mechanism drives the crystal rod to move to the preset cutting end position at a third cutting stage speed. The third cutting stage speed is v5, 60%v4≤v5≤100%v4.

[0012] Furthermore, the formula for calculating the preset cutting end position is: E=H+A+0.6W*sin(α1)+B; where E is the preset cutting end position in mm; H is the height of the workpiece to be cut; A is the height of the guide strip; W is the width of the workpiece to be cut; and B is the compensation value for the cutter bow, 5mm≤B≤10mm.

[0013] Furthermore, the preparation steps also include determining the preset cutting start position, specifically including: the swing mechanism swings to the maximum preset swing angle and descends until the guide bar contacts the wire mesh, this position is the cutting zero point position; the preset cutting start position is 0.5mm to 1.5mm above the cutting zero point position.

[0014] Furthermore, in the preparation step, before fixing the workpiece to be cut onto the oscillating mechanism, the following steps are also included: detecting the crystal orientation of the end face of the crystal rod in the X-axis and Y-axis directions; and detecting the parallelism and perpendicularity of the end face of the crystal rod.

[0015] By applying the technical solution of this invention, during the cutting process, the maximum preset swing angle of the swing mechanism is used to bring the workpiece to be cut into contact with the wire mesh and maintain the maximum preset swing angle for cutting. Compared with the prior art, which involves vertically descending directly into the wire mesh and then gradually increasing the swing angle, this method results in a large area of ​​the end face of the workpiece entering the wire mesh when it begins to swing. Furthermore, the gradually increasing swing angle leads to significant pressure variations on the wire mesh, resulting in a large wire bow difference and uneven thickness of the cut workpiece. This application, through the above-mentioned setting, uses a large-angle swing cutting method to ensure that the workpiece enters the wire mesh from the bottom edge first, and then gradually increases in depth and end face area as the swinging depth increases, without changing the swing angle. This allows for a more uniform and gradual change in force on the wire mesh, effectively reducing the wire bow difference and making the wire mesh wear more uniform. This improves the problem of uneven thickness of the cut workpiece and enhances the cutting quality. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0017] Figure 1 This diagram illustrates the cutting process of the multi-wire cutting method provided by the present invention during the cutting process.

[0018] Figure 2 This diagram illustrates an assembly of the cutting device and the workpiece to be cut from one perspective, as provided by the present invention.

[0019] Figure 3 This diagram illustrates an assembly of the cutting device and the workpiece to be cut from another perspective provided by the present invention.

[0020] The above figures include the following reference numerals:

[0021] 10. Part to be cut; 11. Crystal rod; 12. Guide strip;

[0022] 20. Swinging mechanism; 21. Swinging head; 22. Workpiece table;

[0023] 31. Rotating roller; 32. Wire mesh;

[0024] 40. Resin board. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figures 1 to 3 As shown, this embodiment of the invention provides a multi-wire cutting method, which includes: a preparation step: fixing the workpiece 10 to be cut on a swing mechanism 20, and driving the workpiece 10 to a preset cutting start position; a cutting step: turning on the rotating roller 31 to drive the wire mesh 32 to a predetermined cutting speed, and driving the workpiece 10 to enter the wire mesh 32 at the maximum preset swing angle of the swing mechanism 20, and swinging and cutting at the maximum preset swing angle until the cutting is completed; a unloading step: driving the cut workpiece 10 to detach from the wire mesh 32 by the swing mechanism 20, and then de-adheding, cleaning and inspecting the cut workpiece 10, mainly detecting wafer warpage and thickness deviation.

[0027] In this embodiment, the part to be cut 10 is a sapphire square brick with a square cross-section. In other embodiments, the cross-section of the part to be cut 10 can be triangular, polygonal, or other crystal rod structures.

[0028] Applying the technical solution of this invention, during the cutting process, the maximum preset swing angle of the swing mechanism 20 is used to make the workpiece 10 to be cut contact with the wire mesh 32 and maintain the maximum preset swing angle for cutting. Compared with the prior art, which directly enters the wire mesh 32 in a vertical direction and then gradually increases the swing angle, this method involves the bottom of the end face entering the wire mesh as a whole. When the swinging begins, the area of ​​the end face of the workpiece to be cut into the wire mesh is already large. In addition, with the gradually increasing swing angle, the pressure on the wire mesh changes significantly, resulting in a large wire bow difference in the wire mesh 32 and uneven thickness of the workpiece after cutting. Through the above-described configuration, the large-angle oscillating feed method allows the workpiece 10 to be cut to enter the mesh 32 from the bottom edge first. Then, as the oscillating cutting depth increases, the end face area of ​​the workpiece 10 gradually increases, and the oscillation angle remains unchanged during this process. This makes the force change of the mesh 32 more uniform and gradual, resulting in a more uniform change in wire bow, thereby reducing wire bow difference. This makes the thickness of the slice after the workpiece 10 is cut more uniform, improving the TTV defect problem, improving the cutting quality, and at the same time making the wear of the mesh 32 more uniform, reducing the occurrence of wire breakage, and extending the service life of the mesh 32.

[0029] Specifically, the maximum preset swing angle is α1, where 4°≤α1≤6°. If the maximum preset swing angle is greater than 6°, α1 is too large, resulting in excessive pressure on the wire mesh 32, leading to greater wear and a larger arc difference, thus resulting in poor cutting quality. If the maximum preset swing angle is less than 4°, α1 is too small, resulting in insufficient cutting force on the workpiece 10 and low cutting efficiency. This application sets α1 within the range of 4°≤α1≤6°, ensuring cutting efficiency while avoiding excessive pressure on the wire mesh 32, reducing the arc difference, and ensuring cutting quality. α1 can be selected from 4°, 4.6°, 5°, or 6°.

[0030] At the end of the cutting process, the oscillating mechanism 20 drives the workpiece 10 to be cut to move to the preset cutting end position by a retraction oscillating angle, which is α2. The retraction oscillating angle is 50%α1≤α2≤80%α1. If α2>80%α1, the oscillating angle at the retraction point is too large, and the wire mesh 32 may easily cut into the oscillating mechanism 20, and the workpiece 10 may easily develop chipping or cracks. If α2<50%α1, the cutting force on the workpiece 10 will be too small, making it difficult to cut through, resulting in low cutting efficiency. This application sets α2 within the range of 50%α1≤α2≤80%α1 to ensure cutting efficiency while ensuring that the workpiece 10 is cut through, avoiding cutting into the oscillating mechanism 20, and guaranteeing cutting quality and stability. α2 can be selected as 50%α1, 65%α1, 70%α1, or 80%α1.

[0031] The oscillating mechanism 20 drives the workpiece 10 to be cut into the wire mesh 32 at a first oscillating speed, v1, where 5 deg / s ≤ v1 ≤ 8 deg / s. The oscillating mechanism 20 then drives the workpiece 10 to move to a preset cutting end position at a second oscillating speed, v2, where 50% v1 ≤ v2 ≤ 80% v1; v2 / v1 = α2 / α1. This matching of oscillating speed and oscillating angle ensures a relatively stable oscillation frequency throughout the cutting process. This not only reduces cutting marks on the workpiece 10 upon cut completion, improving cutting quality, but also helps maintain wire bow stability, reducing wear differences in the wire mesh 32, and thus lowering the TTV (Total Television Value) defect of the slice.

[0032] In this application, the winding and unwinding cycle of the wire mesh 32 is 600m-1000m, and the difference between the unwinding length and the winding length in each winding and unwinding cycle is the same. This makes the overall wear of the wire mesh 32 more uniform and consistent, avoiding wire breakage or cutting quality problems caused by uneven wear of the wire mesh 32, and further improving the stability of the cutting process. The winding and unwinding cycle of the wire mesh 32 can be 600m, 700m, 900m, or 1000m.

[0033] Furthermore, the preparation steps also include: bonding the workpiece 10 to be cut to the resin plate 40, and fixing the resin plate 40 to the oscillating mechanism 20. The thickness of the resin plate 40 is 'a', where 20mm ≤ a ≤ 25mm. If 'a' is greater than 25mm, the resin plate 40 is too thick, which not only wastes material but also increases the weight of the resin plate 40, potentially leading to driving delays or additional power consumption. If 'a' is less than 20mm, the resin plate 40 is too thin, thus failing to provide stable support for the workpiece 10. Additionally, the second oscillating speed and oscillating angle need to be significantly reduced during the cut to prevent the resin plate 40 from being cut through. This application sets the thickness 'a' of the resin plate 40 within the range of 20mm ≤ a ≤ 25mm. This ensures the stability of the workpiece during cutting and eliminates the need to significantly reduce the second oscillating speed and oscillating angle during the cut, guaranteeing that the crystal rod 11 is cut through. It also reduces cutting time and improves cutting efficiency and quality.

[0034] like Figure 2 and Figure 3 As shown, the workpiece 10 to be cut includes a crystal ingot 11 and two guide strips 12. The guide strips 12 extend along the length direction of the rotating roller 31, and the two guide strips 12 are bonded to the bottom edge of the crystal ingot 11 and are spaced apart along the width direction of the crystal ingot 11. The guide strips 12 can guide the crystal ingot 11 to smoothly enter the wire mesh 32, reduce the wire bow difference during the cutting stage, and avoid cutting quality problems caused by the unstable guidance of the crystal ingot 11 cutting directly.

[0035] The length direction of the rotating roller 31 is the same as the length direction of the crystal rod 11.

[0036] In this application, the guide strip 12 is mainly made of alumina powder and resin mixed and pressed. The length of the guide strip 12 is the same as the length of the crystal rod 11, with a length error within ±0.15mm. The width of the guide strip 12 is between 6mm and 12mm, and the height of the guide strip 12 is between 3mm and 8mm. If the size of the guide strip 12 is too large, it will waste material and make it difficult to cut, thus failing to play a guiding role. If the size of the guide strip 12 is too small, the bonding area with the crystal rod 11 will be too small, and the contact area when it contacts the wire mesh 32 will be too small, resulting in poor guiding effect.

[0037] Specifically, the oscillating mechanism 20 drives the guide bar 12 into the wire mesh 32 at a first cutting speed and moves it until the cutting of the guide bar 12 ends. The first cutting speed is v3, 600μm / min≤v3≤1000μm / min. The oscillating mechanism 20 drives the crystal rod 11 into the wire mesh 32 at a second cutting speed, v4, 140μm / min≤v4≤250μm / min. The oscillating mechanism 20 drives the crystal rod 11 to move to the preset cutting end position at a third cutting speed, v5, 60%v4≤v5≤100%v4. Through the above settings, the speed when cutting the guide bar 12 is faster than the speed when cutting the crystal rod 11, thus saving cutting time. Setting v5 within the range of 60%v4≤v5≤100%v4, due to the thickness of the resin plate 40, the cutting speed does not need to be significantly reduced when the blade is retracted, further saving cutting time.

[0038] During the cutting process, the swing mechanism 20 is controlled to adjust the speed of the second cutting table, keeping the bow wire between 2mm and 4mm.

[0039] Specifically, the formula for calculating the preset cutting end position is: E = H + A + 0.6W * sin(α1) + B; where E is the preset cutting end position in mm; H is the vertical height of the workpiece 10 to be cut in mm; A is the vertical height of the guide strip 12 in mm; W is the horizontal width of the workpiece 10 to be cut in mm; and B is the cutter bow compensation value, 5mm ≤ B ≤ 10mm, and the value of B can be selected according to the actual working conditions. Technically, by introducing the formula for calculating the preset cutting end position, a precise control basis for the cutting process is provided, reducing errors in the cutting process and further improving the quality of the slices.

[0040] Furthermore, the preparation steps also include determining the preset cutting start position, specifically: the swing mechanism 20 swings to the maximum preset swing angle and descends until the guide bar 12 contacts the wire mesh 32; this position is the cutting zero point position; the preset cutting start position is 0.5mm to 1.5mm above the cutting zero point position. By determining the preset cutting start position, the starting point of the cutting process is ensured to be accurate, preventing the guide bar 12 from contacting the wire mesh 32 before cutting begins, and also allowing the cutting process to quickly enter the cutting state.

[0041] In this application, before fixing the workpiece 10 to be cut onto the oscillating mechanism 20 in the preparation step, the following steps are also included: using an X-ray orientation instrument to detect the crystal orientation of the end face of the crystal rod 11 in the X-axis and Y-axis directions in the width direction, with a crystal orientation accuracy requirement of ±0.3°, wherein the X-axis direction is the horizontal direction and the Y-axis direction is the vertical direction; and using a digital projector to detect the parallelism and perpendicularity of the end face of the crystal rod 11, with a parallelism and perpendicularity detection accuracy of ≤0.1mm.

[0042] The swing mechanism 20 includes a swing head 21 and a workpiece table 22. The swing head 21 is driven by a drive structure, which can drive the swing head 21 to swing. The workpiece table 22 can be clamped at the bottom of the swing head 21. The arrow on the swing head 21 in the figure indicates the swing direction of the swing head 21. This is prior art and will not be described in detail here.

[0043] In the preparation step, before fixing the workpiece 10 to be cut onto the oscillating mechanism 20, the following steps are included: bonding the crystal rod 11 and the resin plate 40 using a two-component or one-component adhesive, ensuring that the bottom surfaces of the crystal rod 11 and the resin plate 40 are perpendicular, with the perpendicularity error of the resin plate 40 within ±2′, thus guaranteeing the assembly accuracy of the crystal rod 11 and the resin plate 40. Then, the crystal rod 11, together with the resin plate 40, is bonded to the bottom of the workpiece stage 22, ensuring that the end face of the crystal rod 11 is perpendicular to the axis of the workpiece stage 22, with a perpendicularity error within ±2′. Multiple crystal rods 11 can be spliced ​​onto the resin plate 40 along the length of the crystal rod 11, with a splicing gap width ≥1mm, and the curing time after bonding is 2-4 hours.

[0044] In another embodiment of the present invention, a cutting device is provided, which includes components such as the swing mechanism 20, rotating roller 31, wire mesh 32 and resin plate 40 mentioned in the above embodiments, and the above multi-wire cutting method is applied to this cutting device.

[0045] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0046] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0047] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0048] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0049] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0050] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A multi-wire cutting method, characterized in that, The multi-wire cutting method includes: Preparation steps: Fix the workpiece (10) to be cut on the swing mechanism (20), and the swing mechanism (20) drives the workpiece (10) to the preset cutting start position; Cutting steps: Turn on the rotating roller (31) to drive the wire mesh (32) to run to the predetermined cutting speed. The swing mechanism (20) drives the workpiece to be cut (10) to enter the wire mesh (32) at the maximum preset swing angle of the swing mechanism (20), and swings and cuts at the maximum preset swing angle until the cutting is completed. Material feeding step: The swing mechanism (20) drives the cut part (10) to detach from the wire mesh (32).

2. The multi-wire cutting method according to claim 1, characterized in that, The maximum preset swing angle is α1, where 4°≤α1≤6°; When the cutting ends, the swing mechanism (20) drives the workpiece to be cut (10) to move to the preset cutting end position at the retraction swing angle, wherein the retraction swing angle is α2, 50%α1≤α2≤80%α1.

3. The multi-wire cutting method according to claim 2, characterized in that, The swing mechanism (20) drives the workpiece to be cut (10) to enter the wire mesh (32) at a first swing speed, the first swing speed being v1, 5deg / s≤v1≤8deg / s; The swing mechanism (20) drives the workpiece to be cut (10) to move to the preset cutting end position at a second swing speed, where the second swing speed is v2, 50%v1≤v2≤80%v1; v2 / v1 = α2 / α1.

4. The multi-wire cutting method according to claim 1, characterized in that, The winding and unwinding cycle of the wire mesh (32) is 600m-1000m, and the difference between the unwinding length and the winding length in each winding and unwinding cycle is the same.

5. The multi-wire cutting method according to claim 1, characterized in that, The preparation steps also include: The part to be cut (10) is bonded to the resin plate (40), and the resin plate (40) is fixed to the swing mechanism (20). The thickness of the resin plate (40) is a, 20mm≤a≤25mm.

6. The multi-wire cutting method according to claim 2, characterized in that, The workpiece to be cut (10) includes a crystal rod (11) and two guide strips (12). The guide strips (12) extend along the length direction of the rotating roller (31). The two guide strips (12) are bonded to the bottom edge of the crystal rod (11) and are spaced apart along the width direction of the crystal rod (11).

7. The multi-wire cutting method according to claim 6, characterized in that, The swing mechanism (20) drives the guide bar (12) to enter the wire mesh (32) at a first cutting table speed and move until the cutting of the guide bar (12) ends. The first cutting table speed is v3, 600μm / min≤v3≤1000μm / min; The swing mechanism (20) drives the crystal rod (11) to enter the wire mesh (32) and move at a second cutting stage speed, where the second cutting stage speed is v4, 140μm / min≤v4≤250μm / min; The swing mechanism (20) drives the crystal rod (11) to move to the preset cutting end position at a third cutting speed, where the third cutting speed is v5, and 60%v4≤v5≤100%v4.

8. The multi-wire cutting method according to claim 6, characterized in that, The formula for calculating the end position of the cutting is: E = H + A + 0.6W*sin(α1) + B; Wherein, E is the preset cutting end position; H is the height of the crystal rod (11); A is the height of the guide strip (12); W is the width of the crystal rod (11); B is the cutter bow compensation value, 5mm≤B≤10mm.

9. The multi-wire cutting method according to claim 6, characterized in that, The preparation steps also include determining the preset cutting start position, specifically including: The swing mechanism (20) swings to the maximum preset swing angle and descends until the guide bar (12) contacts the wire mesh (32). This position is the zero-point position for cutting. The preset cutting start position is 0.5mm to 1.5mm above the cutting zero point position.

10. The multi-wire cutting method according to claim 6, characterized in that, The preparation step, before fixing the workpiece (10) to be cut onto the oscillating mechanism (20), further includes: The crystal orientation of the end face of the crystal rod (11) is detected in the X-axis and Y-axis directions; The parallelism and perpendicularity of the end face of the crystal rod (11) are tested.

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