High-temperature carrier plate film-covering and surface-mounting equipment
By integrating carrier substrate handling components, coating components, and patching equipment, automated coating and patching of carrier substrates is achieved, solving the problems of manual flipping and tape compatibility in existing technologies, and improving production efficiency and product quality.
Patent Information
- Application Number
- CN202510996785.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-18
- Publication Date
- 2025-11-14
AI Technical Summary
Existing substrate lamination equipment suffers from problems such as the need for manual flipping after lamination and a limited range of lamination methods, making it incompatible with tapes of different widths and resulting in low production efficiency.
A high-temperature carrier plate lamination and patching device was designed. By integrating a carrier plate substrate handling component, a lamination component, an adhesive tape folding component, and a patching device, the lamination and patching process is automated. It is compatible with adhesive tapes of different widths and eliminates the need for manual flipping and equipment replacement.
It improved production efficiency, reduced manual operation, shortened downtime, and enabled simultaneous lamination of wide and narrow tapes, thereby improving overall production speed and product quality.
Smart Images
Figure CN120941713A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of carrier substrate technology, and in particular to a high-temperature carrier substrate coating and bonding device. Background Technology
[0002] While lamination and bonding equipment have a high market share, lamination equipment based on carrier substrates has a very small market share. Furthermore, the lamination process is generally performed from above the carrier substrate, which has the following drawbacks: A) After lamination, the substrate is directly recycled to the receiving clip; for subsequent bonding processes, manual flipping of the carrier substrate is required. B) Currently, this type of equipment can only perform lamination on wide-width adhesive tapes, resulting in a limited lamination method.
[0003] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention
[0004] This application provides a high-temperature carrier plate coating and patching device to solve the above-mentioned problems.
[0005] In a first aspect, this application provides a high-temperature carrier substrate lamination and bonding equipment, including a lamination device. The lamination device includes a machine frame and a carrier substrate feeding track. A carrier substrate handling assembly is provided on one side of the machine frame and the carrier substrate feeding track. One end of the carrier substrate handling assembly is provided with a bonding and loading carrier substrate feeding bin for use therewith. A lamination assembly track is provided on one side of the carrier substrate handling assembly. A high-temperature adhesive tape feeding device is provided at the bottom of the lamination assembly track. A roller is connected between the two sides of the lamination assembly track. An adhesive tape cutting assembly is provided in the middle of the lamination assembly track. A lamination assembly and carrier substrate handling transfer assembly is provided on one side of the lamination assembly track. A high-temperature adhesive tape folding assembly is connected to one end of the lamination assembly and carrier substrate handling transfer assembly. A bonding device is connected to one side of the high-temperature adhesive tape folding assembly.
[0006] Optionally, the placement equipment includes a placement track connected to a high-temperature tape folding assembly. A placement transport assembly is mounted on the placement track. A tray transfer track is located below one end of the placement transport assembly. A tray material feeding area is located on one side of the tray transfer track. A tray transfer assembly is connected below the tray transfer track. A tray clamping assembly is located on one side of the tray transfer assembly. The placement transport assembly and the tray clamping assembly work together. A placement bottom PR camera assembly is located below the placement transport assembly.
[0007] Optionally, a substrate conveying track is provided on one side of the patch handling assembly, a substrate transfer track is provided inside the substrate conveying track, and a material unloading and lifting assembly is provided on one side of the substrate conveying track and the substrate transfer track.
[0008] Optionally, the PR camera assembly at the bottom of the patch combines high resolution with a wide field of view and is equipped with an adaptive optics system.
[0009] Optionally, the substrate transport assembly includes a robotic arm, and one end of the robotic arm is provided with a suction cup made of soft materials such as rubber or silicone.
[0010] Optionally, a substrate loading bin is provided on one side of the substrate loading bin, and support blocks are provided symmetrically and at equal intervals inside the substrate loading bin, with a limit block installed at one end of each support block.
[0011] Optionally, the patch handling assembly is equipped with a vision component, and the vision component has a dynamic real-time positioning function.
[0012] Optionally, one end of the Tray transfer track is provided with a Tray empty disk stacking area, and a blocking and lifting mechanism is provided on the Tray empty disk stacking area.
[0013] Optionally, the high-temperature tape folding assembly is equipped with a high-precision sensor and control system.
[0014] Optionally, the feeding basket assembly of the device is made of lightweight materials and is equipped with a material buffer area.
[0015] The technical solutions provided in this application have the following advantages compared with the prior art:
[0016] In this embodiment, a substrate carrier for lamination is retrieved from the substrate loading hopper by a substrate carrier transport assembly and placed onto the lamination assembly track. High-temperature adhesive tape is discharged from the bottom, and the substrate carrier is placed onto the tape. After entering the track, it is conveyed by upper and lower rollers. An adhesive tape cutting assembly is located in the middle of the lamination assembly track to cut the high-temperature adhesive tape after lamination, thus achieving substrate lamination. (After lamination, to accommodate tapes of different widths, for wide tapes, no allowance is needed at the long sides of the substrate carrier; it can be directly cut and transferred. However, for narrow tapes, multiple tapes need to be applied simultaneously. Considering the adhesion effect after application, allowances are made on the long sides of the substrate carrier. The tape is then reversed...) (Fold to the other side for application) When applying multiple narrow-sided tapes simultaneously, the long side needs to be folded back due to the reserved space. After lamination, the substrate transfer assembly transports the laminated substrate to the high-temperature tape folding assembly for tape folding and application. After folding, the substrate flows along the application track, realizing automatic lamination and application, reducing manual operation, improving overall production speed, and enabling the processing of a large number of substrates in a short time. It can also simultaneously accommodate both wide and narrow tape lamination, adapting to different tape specifications without changing equipment or making complex adjustments, reducing downtime caused by specification switching and improving production efficiency. Attached Figure Description
[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0020] Figure 1 This is a schematic diagram of the planar structure of the high-temperature carrier plate coating and patching equipment of the present invention.
[0021] Figure 2 This is a three-dimensional structural diagram of the Tray feeding component of the present invention.
[0022] Figure 3 This is a three-dimensional structural diagram of the substrate transfer track of the present invention.
[0023] Figure 4 This is a three-dimensional structural diagram of the substrate loading assembly of the present invention.
[0024] Figure 5 This is a planar schematic diagram of the substrate attachment assembly of the present invention.
[0025] Figure 6 This is a schematic diagram of the track planar structure of the coating component of the present invention.
[0026] Explanation of reference numerals in the attached figures:
[0027] 1. Equipment frame and substrate loading track; 2. Substrate handling assembly; 3. Lamination assembly and substrate handling transfer assembly; 4. High-temperature tape folding assembly; 5. Patch bottom PR camera assembly; 6. Patch handling assembly; 7. Post-patch substrate conveying track; 8. Equipment unloading basket assembly; 9. Patch incoming material tray feeding area; 10. Tray transfer track; 11. Tray transfer assembly; 12. Tray clamping tray assembly; 13. Tray empty tray stacking area; 14. Patch loading substrate loading bin; 15. Substrate unloading bin; 16. Lamination assembly track; 17. Patch track; 18. Substrate transfer track. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.
[0030] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.
[0031] Figure 1-6A high-temperature carrier substrate laminating and bonding equipment provided in this application includes a laminating device. The laminating device includes a frame and a carrier substrate feeding track 1. A carrier substrate transport assembly 2 is provided on one side of the frame and carrier substrate feeding track 1. A bonding and loading carrier substrate feeding bin 14 is provided at one end of the carrier substrate transport assembly 2. A laminating assembly track 16 is provided on one side of the carrier substrate transport assembly 2. A high-temperature tape feeding device is provided at the bottom of the laminating assembly track 16. A roller is connected between the two sides of the laminating assembly track 16. A tape cutting component is installed in the middle of the component track 16. A coating component and substrate transfer assembly 3 is installed on one side of the coating component track 16. A high-temperature tape folding assembly 4 is connected to one end of the coating component and substrate transfer assembly 3. A patch attaching device is connected to one side of the high-temperature tape folding assembly 4. The substrate transfer assembly 2 takes the substrate to be coated from the substrate loading hopper 14 and places it onto the coating component track 16. High-temperature tape exits from the bottom, and the substrate is placed onto the tape. After entering the track, it is transferred by upper and lower rollers. The component track 16 has a tape cutting section in the middle. After the carrier board is laminated, the high-temperature tape is cut to achieve carrier board substrate lamination. (After the carrier board substrate is laminated, because it is compatible with tapes of different widths, for wide tapes, no allowance is needed at the two ends of the long side of the carrier board substrate; it can be directly cut and transferred. However, for narrow tapes, multiple strips need to be applied simultaneously. Considering the adhesion effect after application, allowances are made on both sides of the long side of the carrier board substrate, and then the tape is folded back to the other side for application.) When multiple narrow tapes are applied simultaneously, folding back is necessary because of the allowance on the long side. After lamination, the carrier substrate transfer assembly 3 transports the laminated carrier substrate to the high-temperature tape folding assembly 4 for tape folding and attachment. After folding, the carrier substrate flows along the patching track 17, realizing automatic lamination and patching, reducing manual operation, improving overall production speed, and enabling the processing of a large number of carrier substrates in a short time. At the same time, it can simultaneously accommodate wide and narrow tape lamination, adapting to different tape specifications without changing equipment or making complex adjustments, reducing downtime caused by specification switching and improving production efficiency.
[0032] Please see Figure 1-5The placement equipment includes a placement track 17, which is connected to a high-temperature tape folding assembly 4. A placement transport assembly 6 is mounted on the placement track 17. A tray transfer track 10 is located below one end of the placement transport assembly 6. A tray feeding area 9 is located on one side of the tray transfer track 10. A tray transfer assembly 11 is connected below the tray transfer track 10. A tray clamp assembly 12 is located on one side of the tray transfer assembly 11. The placement transport assembly 6 and the tray clamp assembly 12 work together. A placement bottom PR camera assembly 5 is located below the placement transport assembly 6. The tray feeding area 9 feeds the surface mount components (SMTs) and the components are transferred along the tray transfer track 10 to the pick-up position. The tray transfer assembly 11 transfers the components at equal distances using the tray clamp assembly 12. The surface mount handling assembly 6 picks up the components from the tray and moves them to the bottom PR camera assembly 5 for bottom visual positioning. Then, it moves them to the substrate placement position on the carrier board and performs precise surface mount placement under the guidance of the visual component on the surface mount handling assembly 6. The automated surface mount process reduces reliance on manual labor, lowers labor costs and intensity, and the precise placement control avoids the uncertainty and errors caused by manual operation, thus improving product quality.
[0033] Please see Figure 1-3 The surface mount transfer assembly 6 has a substrate conveying track 7 on one side, and a substrate transfer track 18 is provided inside the substrate conveying track 7. A material unloading and lifting assembly 8 is provided on one side of the substrate conveying track 7 and the substrate transfer track 18. After the substrates are attached sequentially according to the arrangement requirements, the substrates are transferred to the material unloading and lifting assembly 8 via the substrate conveying track 7 for attachment and unloading. This realizes a continuous automated process from surface mount to unloading, without much manual intervention, which greatly saves time and labor costs and improves overall production efficiency.
[0034] In this invention, the PR camera assembly 5 at the bottom of the patch adopts a combination of high resolution and a large field of view, and is equipped with an adaptive optics system. The PR camera assembly 5 at the bottom of the patch can accurately calculate data such as positional deviation and angular deviation relative to the carrier substrate, providing a basis for positional correction for subsequent precise patching. The adaptive optics system can monitor and correct optical aberrations in real time and automatically adjust lens parameters to ensure that clear and stable images can be obtained under different working distances, ambient light, and object movement conditions, thereby improving the camera's adaptability to complex working conditions.
[0035] Specifically, the substrate carrier assembly 2 includes a robotic arm, and one end of the robotic arm is equipped with a suction cup. The suction cup is made of soft materials such as rubber and silicone. When the suction cup comes into contact with the surface of the substrate carrier during the gripping process, it can play a buffering role and effectively protect the integrity of the substrate carrier surface.
[0036] Please see Figure 4 A substrate loading bin 14 is provided on one side of a substrate NG unloading bin 15. Support blocks are symmetrically and evenly spaced inside the substrate NG unloading bin 15, and a limit block is installed at one end of each support block. The substrate NG unloading bin is a specific container or area for storing substrates that are deemed unqualified (NG) or Not Good by inspection or production process. The support blocks are used to support the substrates so that they can be stacked neatly. The limit blocks can position the substrates to prevent them from shifting during placement or transportation.
[0037] It is understood that the patch handling assembly 6 of the present invention is equipped with a vision component, and the vision component has a dynamic real-time positioning function. The vision component will monitor and fine-tune the position of the patch and the carrier substrate in real time. Through this dual positioning mechanism, the patch accuracy is further improved, precise patching is achieved, and the quality and performance of the product are guaranteed.
[0038] Please continue reading. Figure 1 One end of the Tray transfer track 10 is provided with a Tray empty tray stacking area 13, and a blocking and lifting mechanism is provided on the Tray empty tray stacking area 13. The setting of the blocking and lifting mechanism helps to reduce equipment failure caused by empty tray stacking, reduce the frequency of equipment downtime maintenance, enable the production equipment to operate continuously and stably, and improve production efficiency.
[0039] Preferably, the high-temperature tape folding assembly 4 is equipped with a high-precision sensor and control system. Through the high-precision sensor and control system, information such as the position and tension of the tape can be monitored and fed back in real time. Through precise algorithms and control logic, the folding action can be precisely controlled, thereby improving the accuracy and quality of the folding.
[0040] The equipment feeding basket assembly 8 of the present invention is made of lightweight materials and is equipped with a material buffer area. By using lightweight materials, the overall weight is reduced while ensuring the strength and stability of the basket assembly. This not only facilitates the operation of the equipment but also reduces energy consumption. By setting up a material buffer area, when the equipment experiences a brief mismatch in production rhythm or malfunction, the equipment feeding basket assembly 8 can temporarily store a certain number of carrier substrates, which plays a role in buffering and adjustment, avoiding production interruption and improving the stability and reliability of the production system.
[0041] In use, the carrier substrate transport assembly 2 retrieves the carrier substrate to be coated from the substrate loading hopper 14 and places it onto the coating assembly track 16. High-temperature adhesive tape exits from the bottom, and the carrier substrate is placed onto the tape. After entering the track, it is conveyed by upper and lower rollers. An adhesive tape cutting assembly is located in the middle of the coating assembly track 16. After coating the carrier substrate, the high-temperature adhesive tape is cut, thus achieving the coating of the carrier substrate. (After coating, because it is compatible with adhesive tapes of different widths, for large adhesive tapes, the long sides of the carrier substrate do not need to be reserved; it can be directly cut.) For small, narrow-edged tapes, multiple tapes need to be applied simultaneously. To ensure adhesion after application, a margin is made on both sides of the long edge of the substrate. The tape is then folded back to the other side for application. When applying multiple narrow-edged tapes simultaneously, the margin on the long edge necessitates folding. After lamination, the substrate transfer assembly 3 transports the laminated substrate to the high-temperature tape folding assembly 4 for tape folding and application. After folding, the substrate flows along the application track 17. The application material tray feeding area 9... The chip feeding process involves transferring the chip along the Tray transfer track 10 to the pick-up position. The Tray transfer and handling assembly 11 performs equidistant transfer via the Tray clamp assembly 12. The chip handling assembly 6 picks up the chip from the Tray and moves it to the bottom PR camera assembly 5 for bottom vision positioning. Then, it moves the chip to the substrate placement position on the carrier board. Precise chip placement is performed under the guidance of the vision assembly on the chip handling assembly 6. This achieves automated lamination and chip placement, reduces manual operation, lowers labor costs, and increases overall production speed. Simultaneously, it can... The system is compatible with both wide and narrow tape lamination, adapting to different tape specifications without requiring equipment changes or complex adjustments. This reduces downtime caused by specification switching and improves production efficiency. After the carrier substrate is sequentially attached according to the arrangement requirements, it is transferred to the equipment unloading basket assembly 8 via the substrate conveyor track 7 for attachment and unloading. This achieves a continuous automated process for the carrier substrate from lamination to post-attachment collection, requiring minimal manual intervention, greatly saving time and labor costs, and improving overall production efficiency.
[0042] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0043] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0046] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0048] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.
[0049] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A high-temperature carrier plate coating and patching equipment, comprising a coating device, characterized in that: The laminating equipment includes a frame and a substrate loading track (1). A substrate handling assembly (2) is provided on one side of the frame and substrate loading track (1). A substrate loading bin (14) for bonding is provided at one end of the substrate handling assembly (2). A laminating assembly track (16) is provided on one side of the substrate handling assembly (2). A high-temperature tape feeding device is provided at the bottom of the laminating assembly track (16). Rollers are connected between the two sides of the laminating assembly track (16). A tape cutting assembly is provided in the middle of the laminating assembly track (16). A laminating assembly and substrate handling transfer assembly (3) is provided on one side of the laminating assembly track (16). A high-temperature tape folding assembly (4) is connected to one end of the laminating assembly and substrate handling transfer assembly (3). A bonding device is connected to one side of the high-temperature tape folding assembly (4).
2. The high-temperature carrier plate coating and patching equipment according to claim 1, characterized in that: The patch assembly includes a patch track (17), which is connected to a high-temperature tape folding assembly (4). A patch handling assembly (6) is provided on the patch track (17). A Tray transfer track (10) is provided below one end of the patch handling assembly (6). A patch material tray feeding area (9) is provided on one side of the Tray transfer track (10). A Tray transfer assembly (11) is connected below the Tray transfer track (10). A Tray clamp assembly (12) is provided on one side of the Tray transfer assembly (11). The patch handling assembly (6) and the Tray clamp assembly (12) are used in conjunction. A patch bottom PR camera assembly (5) is provided below the patch handling assembly (6).
3. The high-temperature carrier plate coating and patching equipment according to claim 2, characterized in that: The patch handling assembly (6) is provided with a patch post-patch substrate conveying track (7) on one side, and a substrate transfer track (18) is provided inside the patch post-patch substrate conveying track (7). A material unloading and lifting assembly (8) is provided on one side of the patch post-patch substrate conveying track (7) and the substrate transfer track (18).
4. The high-temperature carrier plate coating and patching equipment according to claim 2, characterized in that: The patch bottom PR camera assembly (5) combines high resolution with a large field of view and is equipped with an adaptive optics system.
5. The high-temperature carrier plate coating and patching equipment according to claim 1, characterized in that: The substrate transport assembly (2) includes a robotic arm, and one end of the robotic arm is provided with a suction cup, which is made of soft materials such as rubber and silicone.
6. The high-temperature carrier plate coating and patching equipment according to claim 1, characterized in that: A substrate loading bin (14) is provided on one side of the substrate loading bin (15). Support blocks are provided symmetrically and at equal intervals inside the substrate loading bin (15), and a limit block is installed at one end of the support block.
7. The high-temperature carrier plate coating and patching equipment according to claim 2, characterized in that: The patch handling component (6) is equipped with a vision component, and the vision component has a dynamic real-time positioning function.
8. The high-temperature carrier plate coating and patching equipment according to claim 2, characterized in that: One end of the Tray transfer track (10) is provided with a Tray empty disk stacking area (13), and a blocking and lifting mechanism is provided on the Tray empty disk stacking area (13).
9. The high-temperature carrier plate coating and patching equipment according to claim 1, characterized in that: The high-temperature tape folding assembly (4) is equipped with a high-precision sensor and control system.
10. The high-temperature carrier plate coating and patching equipment according to claim 3, characterized in that: The equipment feeding basket assembly (8) is made of lightweight materials and is equipped with a material buffer area.