Packaging substrate, preparation method of packaging substrate and packaging device

Abstract

The invention provides a packaging substrate, a preparation method of the packaging substrate and a packaging device, the packaging substrate comprises a glass substrate, a micro-etching layer and an organic matter modified layer, the micro-etching layer is formed on the surface of the glass substrate, and the organic matter modified layer is formed on the surface of the micro-etching layer; the organic matter modification layer is obtained by hydrolytic condensation of an organic modifier, and the organic modifier comprises a siloxy organic small molecule substance containing a siloxy hydrolysis group or a siloxy polymer. The glass substrate provided by the invention is provided with the micro-etching layer with roughness, the surface roughness and active sites of the glass substrate are increased, meanwhile, organic matter modifiers in the organic matter modification layer are hydrolyzed to generate silicon hydroxyl, and the silicon hydroxyl and hydroxyl on the surface of the micro-etching layer are subjected to condensation reaction to form stable silicon-oxygen bonds; therefore, firm chemical connection is constructed between the glass substrate and the organic matter modified layer, the surface energy and wettability of the glass substrate are improved, and when the packaging structure is applied to a packaging device, the heterogeneous interface bonding stability during optical device packaging can be enhanced.

Description

Technical Field

[0001] This invention relates to the field of optical device manufacturing technology, and in particular to a packaging substrate, a method for preparing the packaging substrate, and a packaging device. Background Technology

[0002] In the manufacturing of optical device packaging, the excellent wettability and low roughness of the glass substrate surface are the foundation for ensuring the stability of the subsequent device packaging bonding structure and high-precision optical alignment.

[0003] As the process nodes of glass-based optical devices enter the 7-3nm range, glass substrates, with their flatness and thermal stability, are better suited to the packaging and mass transfer requirements of microchips. Glass-based optoelectronic devices are developing towards miniaturization and high integration. Enhanced wettability of the glass substrate surface facilitates the uniform spread of other materials on the glass surface, forming thin and uniform films, avoiding defects such as agglomeration or pinholes, and improving the reliability of device integration. This, in turn, helps improve the stability of the heterogeneous interface bonding between the glass and the various functional layers of the optoelectronic device. High surface energy can further promote chemical bonding or physical adsorption, reducing interface separation or functional layer detachment caused by thermal stress or mechanical stress during device operation, extending the lifespan of glass-based optoelectronic integrated devices, and effectively reducing contact resistance during optical device integration, which is beneficial for efficient charge transport between glass-based optoelectronic devices.

[0004] In existing technologies, commonly used glass-based surface treatment methods include grinding, laser treatment, plasma treatment, chemical etching, and surface coating. Compared with grinding, chemical etching, and surface coating, laser and plasma treatment methods tend to focus on high-precision control of the glass surface structure and function. Laser treatment relies on the laser spot and can achieve sub-micron or even nanometer-level precision control. Lasers can achieve fine linewidths and spacings, reaching several micrometers or even smaller, which is difficult to achieve with traditional grinding and chemical etching methods. However, since laser treatment is mainly used for local high-resolution pattern creation, it is not suitable for treating large-area glass surfaces. Plasma treatment usually requires a vacuum environment. Plasma is formed by ionizing gas through a high-frequency electric field or radio frequency energy. A large number of high-energy particles in the plasma (such as ions, free electrons, and active groups) can react with the glass surface. This includes the physical bombardment of the particles to remove surface contaminants and the reaction of some active groups with glass surface components to generate new surface chemical bonds (such as hydroxyl groups -OH), thereby improving the activity and wettability of the glass surface. Currently, the applicable equipment can reach 1000 mm × 1000 mm. Large sizes under mm are only suitable for continuous manufacturing of glass-based optoelectronic devices due to the short-term effect of the treatment. However, the glass surface is very inert and can only effectively remove surface contaminants without producing a surface activation effect. Summary of the Invention

[0005] To address the problem of low surface wettability and high roughness of glass plates in the packaging and manufacturing of glass-based optical devices in the prior art, which leads to the instability of optical device packaging, a packaging substrate, a method for preparing the packaging substrate, and a packaging device are provided.

[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: On one hand, the present invention provides a packaging substrate, including a glass substrate, a micro-etched layer and an organic modification layer, wherein the micro-etched layer is formed on the surface of the glass substrate and the organic modification layer is formed on the surface of the micro-etched layer; The organic modified layer is obtained by hydrolysis and condensation of organic modifiers, which include small siloxane organic molecules or siloxane polymers containing siloxane hydrolysis groups.

[0007] Optionally, the silicon-oxygen hydrolyzable groups include one or more of siloxymethoxy, siloxyethoxy, and silacetoxy groups; and / or, The siloxy-based organic small molecules include one or more of 3-aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; and / or, The siloxane polymer includes one or more of the following: hydrolyzed polydimethylsiloxane polymer, amino-modified polyether siloxane-terminated polymer, and hydrolyzed siloxane sol-gel.

[0008] Optionally, the micro-etched layer is a micron-sized hole formed on the surface of the glass substrate, and the roughness of the micro-etched layer is 80-200 nm.

[0009] Optionally, the micro-etched layer is a micron-sized hole formed on the surface of the glass substrate, and the roughness of the micro-etched layer is 80-200 nm.

[0010] Optionally, the method for preparing the packaging substrate includes the following operations: An etching solution is used to etch the glass substrate to form a micro-etched layer on the surface of the glass substrate. An organic modifier solution is used to immerse a glass substrate in the organic modifier solution to form an organic modifier layer on the surface of the micro-etched layer.

[0011] Optionally, the etching solution includes a mixture of surfactant, inorganic sodium salt, and sodium hydroxide; The surfactant comprises one or more of sodium poly2-hydroxyacrylate, alkyl dimethyl hydroxypropyl phosphate betaine, and fatty alcohol polyoxyethylene ether; and / or The inorganic sodium salt includes one or more of sodium oleate and sodium carbonate.

[0012] Optionally, in the etching solution, the surfactant has a mass percentage content of 1%-8%, the inorganic sodium salt has a mass percentage content of 5%-20%, and the sodium hydroxide has a mass percentage content of 5%-20%.

[0013] Optionally, the glass substrate is immersed in the organic modifier solution for 10-40 minutes at a temperature of 50-60°C.

[0014] Optionally, before "modifying the glass substrate with an organic modifier", the following steps may be performed: Remove residual etching solution from the surface of the glass substrate and clean and activate the glass substrate; The process of removing residual liquid from the surface of glass substrates includes spraying or ultrasonic washing. The glass substrate is cleaned and activated by plasma treatment.

[0015] On the other hand, the present invention provides a packaging device, comprising a packaging resin and a packaging substrate or a packaging substrate prepared by the method of preparing the packaging substrate, wherein the packaging resin is disposed on the surface of the packaging substrate.

[0016] The beneficial effects of this application are as follows: In the packaging substrate provided in this application, a rough micro-etched layer is formed by etching the surface of the glass substrate, increasing the surface roughness and active sites of the glass substrate. At the same time, the siloxy organic small molecules or siloxy polymers containing siloxy hydrolysis groups in the organic modification layer hydrolyze upon contact with trace amounts of moisture in the environment to generate silanol groups. The silanol groups can undergo a condensation reaction with the hydroxyl groups on the surface of the micro-etched layer to form stable siloxane bonds, thereby constructing a strong chemical connection between the glass substrate and the organic modification layer, increasing the surface energy of the glass substrate, making it easier for polar liquids to spread on the surface of the glass substrate, and improving the wettability of the glass substrate. When the packaging structure is applied to a packaged device, it helps to enhance the heterogeneous interface bonding stability during the packaging of optical devices and avoids the problem of unstable packaging of optical devices due to interface failure of the packaging structure. Attached Figure Description

[0017] Figure 1 These are test images of the wettability of the glass substrate before and after surface treatment provided in Embodiments 1-3 of the present invention; Figure 2 This is a roughness test image of a glass substrate before and after etching, provided in Embodiment 2 of the present invention. Detailed Implementation

[0018] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the invention.

[0019] The present invention provides an encapsulation substrate, comprising a glass substrate, a micro-etched layer, and an organic modification layer, wherein the micro-etched layer is formed on the surface of the glass substrate, and the organic modification layer is formed on the surface of the micro-etched layer; The organic modified layer is obtained by hydrolysis and condensation of organic modifiers, which include small siloxane organic molecules or siloxane polymers containing siloxane hydrolysis groups.

[0020] Specifically, in the packaging substrate provided in this application, a rough micro-etched layer is formed by etching the surface of the glass substrate, increasing the surface roughness and active sites of the glass substrate. At the same time, the siloxy organic small molecules or siloxy polymers containing siloxy hydrolysis groups in the organic modification layer hydrolyze upon contact with trace amounts of moisture in the environment to generate silanol groups. The silanol groups can undergo a condensation reaction with the hydroxyl groups on the surface of the micro-etched layer to form stable siloxane bonds, thereby constructing a strong chemical connection between the glass substrate and the organic modification layer, increasing the surface energy of the glass substrate, making it easier for polar liquids to spread on the surface of the glass substrate, and improving the wettability of the glass substrate. When the packaging structure is applied to a packaged device, it is beneficial to enhance the heterogeneous interface bonding stability during the packaging of optical devices and avoid the problem of unstable packaging of optical devices due to interface failure of the packaging structure.

[0021] In some embodiments, the silicon-oxygen hydrolyzable group includes one or more of siloxy, siloxy, and silacetoxy groups; and / or, The siloxy-based organic small molecules include one or more of 3-aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; and / or, The siloxane polymer includes one or more of the following: hydrolyzed polydimethylsiloxane polymer, amino-modified polyether siloxane-terminated polymer, and hydrolyzed siloxane sol-gel.

[0022] Specifically, the silicon-oxygen hydrolyzable groups (silicon methoxy, silicon ethoxy, silicon acetoxy) form silanol groups after hydrolysis, which efficiently condense with hydroxyl groups on the surface of the micro-etched layer, strengthening the interfacial connection of the encapsulation substrate; the silicon-oxygen organic small molecules can play a role in improving interfacial adhesion and promoting material cross-linking, and the silicon-oxygen polymer can provide excellent weather resistance, flexibility and chemical stability. The combination of different components forms complementary properties, which not only improves the high-strength connection of the encapsulation substrate, but also improves the weather resistance and optical performance of optical devices made using the encapsulation substrate of this application.

[0023] In some embodiments, the micro-etched layer is a micron-sized hole formed on the surface of the glass substrate, and the roughness of the micro-etched layer is 80-200 nm.

[0024] Specifically, the micro-etched layer with a certain roughness on the surface of the glass substrate can increase the specific surface area of ​​the glass substrate through its roughness. When the roughness of the micro-etched layer is in the range of 80-200 nm, it provides more anchoring points and chemically bonded active groups for the organic modification layer. Furthermore, if the roughness of the micro-etched layer is less than 80 nm, the surface roughness of the glass substrate is unsuitable, and the surface of the glass substrate is too smooth, which is not conducive to improving the surface energy of the glass substrate, thereby affecting the interface bonding strength of the subsequent packaging substrate; if the roughness of the micro-etched layer is greater than 200 nm, the holes formed by the micro-etched layer are too deep, which damages the strength of the glass substrate and affects the reliability of the packaging structure.

[0025] In some embodiments, the method for preparing the packaging substrate includes the following operations: An etching solution is used to etch the glass substrate to form a micro-etched layer on the surface of the glass substrate. An organic modifier solution is used to immerse a glass substrate in the organic modifier solution to form an organic modifier layer on the surface of the micro-etched layer.

[0026] Specifically, in the preparation method of this packaging substrate, during the etching operation, the etching solution reacts with the glass substrate to form a micro-etched layer with a micron-sized porous structure on its surface. This not only increases the surface roughness and provides more chemical bonding sites, but also enriches hydroxyl groups and enhances its surface activity. During the immersion operation, the glass substrate is immersed in an organic modifier solution, where the active hydrolyzed groups hydrolyze to generate silanol groups, which condense with the hydroxyl groups in the micro-etched layer to form stable covalent bonds, thus constructing a strong interface. This not only strengthens the bonding strength of the packaging structure, but also improves the optical performance of the optical device through the density and low surface energy of the organic modifier layer.

[0027] Specifically, the etching operation of the glass substrate using an etching solution also includes: Fix the glass substrate in an ultrasonic cleaner, adjust the ultrasonic assisted etching frequency to 35-40MHz, adjust the etching solution temperature to 25-35℃, and adjust the etching solution concentration to 5%-20%; Ultrasonic-assisted etching promotes rapid micro-corrosion of the glass surface.

[0028] In some embodiments, the etching solution comprises a mixture of surfactant, inorganic sodium salt, and sodium hydroxide; The surfactant comprises one or more of sodium poly2-hydroxyacrylate, alkyl dimethyl hydroxypropyl phosphate betaine, and fatty alcohol polyoxyethylene ether; and / or The inorganic sodium salt includes one or more of sodium oleate and sodium carbonate.

[0029] Specifically, the etching solution in this application is prepared by compounding surfactants, inorganic sodium salts, and sodium hydroxide. Among them, sodium poly(2-hydroxyacrylate), alkyl dimethyl hydroxypropyl phosphate betaine, and fatty alcohol polyoxyethylene ether in the surfactant can reduce the surface tension of the solution, promote the wetting and penetration of the etching solution on the glass surface, and make the etching more uniform. At the same time, the dispersion effect of the surfactant reduces the agglomeration of etching products and avoids uneven local etching. The inorganic sodium salt (sodium oleate, sodium carbonate) plays a role in adjusting the pH value and ionic strength of the solution, enhancing the etching activity of sodium hydroxide on the glass substrate, and accelerating the hydrolysis of silicon-oxygen bonds. That is, by using the etching solution prepared in this application to etch the glass substrate, a micro-etched layer with controllable roughness and hydroxyl enrichment can be formed on the surface of the glass substrate, providing a high-quality substrate for the subsequent organic modification layer and improving the stability of heterogeneous interface bonding during the preparation of the packaging substrate.

[0030] In some embodiments, the etching solution contains 1%-8% by mass of the surfactant, 5%-20% by mass of the inorganic sodium salt, and 5%-20% by mass of the sodium hydroxide.

[0031] Specifically, the surfactant content is controlled at 1%-8% by mass. This range can effectively reduce the surface tension of the solution, enhance the wettability and penetration of the etching solution on the glass surface, promote uniform etching, and avoid excessive foaming or residual pollution due to excessive concentration. The inorganic sodium salt content is in the range of 5%-20% by mass, which can stably adjust the pH value and ionic strength of the solution, enhance the etching activity of sodium hydroxide on glass, accelerate the formation of the micro-etched layer, and at the same time help disperse the etching products. When the sodium hydroxide content is 5%-20% by mass, it is conducive to the formation of a micro-etched layer with suitable roughness and hydroxyl enrichment, which can avoid excessive etching caused by excessive concentration and damage to the strength of the glass substrate. Compared to traditional high-concentration hydrofluoric acid or sodium hydroxide etching processes, this application uses an etching solution containing three substances (surfactant, inorganic sodium salt, and sodium hydroxide) within the aforementioned mass percentage range. This method offers significant advantages in terms of precisely controlling the surface morphology of the glass substrate, improving the surface chemical properties of the glass substrate, enhancing the interfacial bonding stability of the glass substrate, and ensuring process safety and low cost.

[0032] In some embodiments, the glass substrate is immersed in a solution of organic modifier for 10-40 minutes at a temperature of 50-60°C.

[0033] Specifically, the glass substrate is treated in an organic modifier solution with an immersion time of 10-40 minutes and a temperature of 50-60°C, which allows the organic modifier layer to uniformly cover the micro-etched layer, thereby effectively improving the sealing performance, weather resistance and optical stability of the encapsulation structure.

[0034] In some embodiments, the following steps are performed before "modifying the glass substrate with an organic modifier": Remove residual etching solution from the surface of the glass substrate and clean and activate the glass substrate; The process of removing residual liquid from the surface of glass substrates includes spraying or ultrasonic washing. The glass substrate is cleaned and activated by plasma treatment.

[0035] Before modifying the glass substrate with organic modifiers, the residual etching solution on the surface of the glass substrate is removed by spraying and ultrasonic water washing. This provides a pure and highly active reaction substrate for the subsequent organic modifiers, ensuring that the organic modification layer and the micro-etched layer are tightly bonded, and significantly improving the stability of the packaging substrate. In the plasma treatment cleaning and activation of glass substrates, plasma treatment is carried out in a selected atmosphere (such as CF4, Ar, N2, H2, O2), with the gas flow rate adjusted to 50-200 sccm and the operating power 300-700 W, for 30s-5min. The plasma treatment further activates the glass surface and improves its cleanliness, resulting in a significantly enhanced interfacial wettability and surface energy. This achieves synergistic optimization of the surface morphology and properties of the glass substrate, providing favorable interfacial conditions for subsequent chemical modification with organic modifiers.

[0036] On the other hand, the present invention provides a packaging device, comprising a packaging resin and a packaging substrate or a packaging substrate prepared by the method of preparing the packaging substrate, wherein the packaging resin is disposed on the surface of the packaging substrate.

[0037] Specifically, the encapsulation device combines the encapsulation resin with the encapsulation substrate provided in this application to form a composite structure of glass substrate-micro-etched layer-organic modified layer-encapsulation resin. A strong chemical bond is formed between the micro-etched layer and the organic modified layer of the encapsulation substrate, which increases the surface energy of the glass substrate and enhances the heterogeneous interface bonding stability between the glass substrate and the encapsulation resin. At the same time, the low surface energy and chemical stability of the organic modified layer can also prevent water vapor from penetrating into the encapsulation resin, which is conducive to further ensuring the efficient transmission of optical signals of the encapsulation device.

[0038] The present invention will be further illustrated by the following examples.

[0039] Example 1 This embodiment illustrates the packaging substrate and its preparation method disclosed in this invention, and includes the following steps: The glass substrate is made of alkali-free glass, model AFB35, manufactured by Sichuan Hongke Innovation Technology Co., Ltd., China. A 10% etching solution was used to etch the smooth surface of the glass substrate under ultrasonic assistance at 40 MHz / 5 min with the etching solution temperature at 30℃. Afterwards, the glass substrate surface was washed again with ultrasonic water at 40 MHz / 30 min to remove the residual etching solution. Plasma treatment was performed in an atmosphere of CF4 and O2 (50%, 50%) for 30 seconds at 500W power to clean and activate the glass substrate, so that the surface of the glass substrate reached a high degree of cleanliness. Vinyltrimethoxysilane and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane were dissolved in water and the temperature was raised to 55°C. The glass substrate was then immersed in the solution for chemical modification for 15 min.

[0040] Example 2 This embodiment illustrates the packaging substrate and its preparation method disclosed in this invention, and includes the following steps: The glass substrate is made of alkali glass, model D263T eco, manufactured by Schott AG, Germany. A 15% etching solution was used to etch the smooth surface of the glass substrate under ultrasonic assistance at 40 MHz / 15 min with the etching solution temperature at 35℃. Afterwards, the residual etching solution on the surface of the glass substrate was removed by ultrasonic water washing at 40 MHz / 30 min and spray water washing. Plasma treatment was performed under N2 (100%) atmosphere for 60 seconds at 700W power to clean and activate the glass substrate, so that the surface of the glass substrate reached a high degree of cleanliness. N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, vinyltris(β-methoxyethoxy)silane, and γ-glycidoxypropyltriethoxysilane were dissolved in water and the temperature was raised to 60°C. The glass substrate was then immersed in the solution for chemical modification for 20 min.

[0041] Example 3 This embodiment illustrates the packaging substrate and its preparation method disclosed in this invention, and includes the following steps: The glass substrate is made of alkali glass, model BF33, manufactured by Schott AG, Germany. A 15% etching solution was used to etch the smooth surface of the glass substrate under ultrasonic assistance at 40 MHz / 10 min with the etching solution temperature at 30℃. Afterwards, the residual etching solution on the surface of the glass substrate was removed by ultrasonic water washing at 40 MHz / 60 min. Plasma treatment was performed in an atmosphere of Ar and H2 (95% and 5%) for 60 seconds at a power of 500W to clean and activate the glass substrate, thereby achieving a high degree of cleanliness on the surface of the glass substrate. γ-glycidoxypropyltriethoxysilane was dissolved in water, and phenyltriethoxysilane was dispersed in the water by mechanical stirring at 100 rad / min. The temperature was raised to 60°C and then to 55°C. The glass substrate was then immersed in the solution for chemical modification for 25 min.

[0042] Example 4 This embodiment is used to compare and illustrate the preparation methods of the substrate and encapsulation substrate disclosed in this invention, including most of the operations in Embodiment 1, the difference being: When processing with organic modifiers, the immersion time of the glass substrate in the organic modifier solution is shortened to 10 minutes.

[0043] Example 5 This embodiment is used to compare and illustrate the preparation methods of the substrate and encapsulation substrate disclosed in this invention, including most of the operations in Embodiment 1, the difference being: When treating with organic modifiers, the glass substrate is immersed in the organic modifier solution for an extended period of 40 minutes.

[0044] Comparative Example 1 This comparative example is used to illustrate the preparation methods of the substrate and encapsulation substrate disclosed in this invention, including most of the operations in Example 1, with the following differences: The glass substrate was not etched with etching solution or subjected to plasma treatment.

[0045] Comparative Example 2 This comparative example is used to illustrate the preparation methods of the substrate and packaging substrate disclosed in this invention: The packaging was performed using a commercially available untreated D263T eco glass substrate, as described in Example 2.

[0046] Comparative Example 3 This comparative example is used to illustrate the preparation methods of the substrate and encapsulation substrate disclosed in this invention, including most of the operations in Example 3, the difference being: The glass substrate was not modified with organic modifiers.

[0047] Performance testing The following performance tests were performed on Examples 1-5 and Comparative Examples 1-3 prepared above: 1. The wetting angle of the glass substrate surface was measured using a surface tension meter, including the water wetting angle and the diiodomethane wetting angle; Further testing of the water wetting angles in Examples 1-3 yielded the following results: Figure 1 The changes in the water wetting angle before and after treatment in Examples 1-3 are shown; Depend on Figure 1It can be seen that the size of the hydrophilic angle of the glass substrate in Examples 1-3 of this application is reduced to varying degrees compared with that before treatment, indicating that the glass substrate of this application can improve its hydrophilicity. The roughness of the glass substrate prepared in Example 2 was further tested, and the results were as follows: Figure 2 The content described; Depend on Figure 2 As can be seen, the roughness of the glass substrate in Embodiment 2 of this application is effectively improved compared to that before etching treatment. That is, the glass substrate of this application has a higher roughness, which can better improve the specific surface area of ​​the glass substrate and provide more anchoring points and chemically bonded active groups for the organic modification layer.

[0048] 2. The surface energy parameters were analyzed using the OWRK surface free energy self-calculation model.

[0049] The test results are entered into Table 1.

[0050] Table 1 As can be seen from the test results in Table 1, the overall test results of Examples 1-5 are better than those of Comparative Examples 1-3. The packaging substrates prepared in Examples 1-5 have all undergone etching and organic modification treatment, which can effectively improve the hydrophilicity of the glass substrate surface and increase its surface energy. This is beneficial to promoting heterogeneous integration on the surface of the glass substrate. Furthermore, when the glass substrate is applied to packaging devices, it is beneficial to enhance the heterogeneous interface bonding of optical device packaging. In Example 2, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, vinyltris(β-methoxyethoxy)silane, and γ-glycidoxypropyltriethoxysilane were combined and the immersion temperature was 60°C. The water wetting angle was 11.85° and the surface free energy was 76.06 mN / m. Because the vinyl groups in the organic modifiers made an important contribution to the dispersion component, while the amino and ether bonds significantly enhanced the polarity, the high temperature further promoted the uniform coverage and reaction of the organic modifiers. Both Example 4 and Example 1 used a combination of vinyltrimethoxysilane and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. In Example 4, the surface modification time was shortened to 10 min. Due to the optimized regulation mechanism of the hydrolysis mechanism, shortening the modification time allows vinylsilane to be grafted more efficiently and uniformly, reducing the encapsulation of nonpolar groups. The full exposure of nonpolar vinyl groups enhances nonpolar interactions, and the nonpolar portion further increases to 42.28 mN / m. At the same time, the effective proportion of vinylsilane on the glass surface is increased, which relatively reduces the surface density of polar epoxycyclohexyl groups, and the polar portion slightly decreases to 34.04 mN / m.

[0051] Example 3 innovatively uses high-temperature resistant phenylsilane small molecules as surface modification components, combined with the highly polar γ-glycidyl etheroxypropyltriethoxysilane compounding mechanism, which can make the glass surface modification layer have excellent temperature resistance and hydrophilic wettability, with the polar part reaching 36.66 mN / m and the total surface free energy being 74.44 mN / m.

[0052] In Example 5, the soaking time was extended to 40 min, the water wetting angle was further reduced to 10.20°, and the surface free energy was 75.68 mN / m. This shows that the soaking time controlled within the scope of this application, and the relatively long soaking time, makes the organic modified layer more complete, thereby improving its wettability. Comparative Example 1 (unetched and plasma-treated, only organically modified) has a water wetting angle of 25.95°, a surface free energy of 72.91 mN / m, and a polar portion of 28.16 mN / m. Due to the lack of a rough surface and active sites provided by the micro-etched layer, its wettability and surface activity are worse than those of the examples. The diiodomethane wetting angle of Comparative Example 1 is smaller, which is presumably because the organic modifier used contains more non-polar groups. Since diiodomethane is a non-polar liquid, the dispersion force interaction between the non-polar groups and diiodomethane is stronger, promoting the spread of diiodomethane. At the same time, Comparative Example 1 has not been etched, and there is no micro-etched layer with micron-sized pores on the surface, making the surface smoother and reducing the physical obstacles during liquid spread, resulting in a smaller diiodomethane wetting angle. However, this improvement relying solely on non-polar interactions is limited, and its water wetting angle is larger, indicating that the polar wettability has not been effectively improved, and the overall surface performance is worse than that of the examples. Comparative Example 2 (untreated glass substrate) has a water wetting angle of 35.65° (maximum), a surface free energy of 64.31 mN / m (lowest), and a polar portion of 28.21 mN / m. The untreated glass substrate has high surface inertness, the worst wettability, and the worst activity. Comparative Example 3 (etching and plasma treatment only, no organic modification) has a water wetting angle of 25.00°, a surface free energy of 70.84 mN / m, and a polar part of 31.58 mN / m. Etching alone cannot fully introduce polar groups to increase roughness, resulting in its surface energy and polarity being lower than those of Example 3. As can be seen from the test data of Comparative Examples 1-3, in the preparation process of the glass substrate, if only a single etching solution etching, plasma treatment, or organic modifier modification is performed, the performance of the glass substrate provided in the embodiments of this application cannot be achieved. This illustrates the necessity of the synergistic treatment of etching, plasma treatment, and organic modifier modification when processing the glass substrate in this application. When using the packaging substrate provided in this application to further prepare packaging devices, the increase in the surface energy of the glass substrate is beneficial to enhancing the bonding stability between the glass substrate and the packaging resin based on the adhesive heterogeneous interface. At the same time, the glass substrate-micro-etched layer-organic modifier layer-packaging resin composite structure formed by combining the packaging resin with the packaging substrate provided in this application has a strong chemical bond. The chemical stability and high heat resistance of the organic modifier layer can effectively block the penetration of hydrothermal factors in the interface region into the packaging resin, ensuring the efficient transmission of optical signals of the packaging device.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging substrate, characterized in that, It includes a glass substrate, a micro-etched layer, and an organic modification layer, wherein the micro-etched layer is formed on the surface of the glass substrate, and the organic modification layer is formed on the surface of the micro-etched layer; The organic modified layer is obtained by hydrolysis and condensation of organic modifiers, which include small siloxane organic molecules or siloxane polymers containing siloxane hydrolysis groups.

2. The packaging substrate according to claim 1, characterized in that, The silicon-containing oxygen hydrolysis group includes one or more of siloxy, siloxy, and silacetoxy groups; and / or, The siloxy-based organic small molecules include one or more of 3-aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; and / or, The siloxane polymer includes one or more of the following: hydrolyzed polydimethylsiloxane polymer, amino-modified polyether siloxane-terminated polymer, and hydrolyzed siloxane sol-gel.

3. The packaging substrate according to claim 1, characterized in that, The micro-etched layer consists of micron-sized pores formed on the surface of the glass substrate, and the roughness of the micro-etched layer is 80-200 nm.

4. The method for preparing the packaging substrate according to any one of claims 1-3, characterized in that, Includes the following operations: An etching solution is used to etch the glass substrate to form a micro-etched layer on the surface of the glass substrate. An organic modifier solution is used to immerse a glass substrate in the organic modifier solution to form an organic modifier layer on the surface of the micro-etched layer.

5. The method for preparing the packaging substrate according to claim 4, characterized in that, The etching solution comprises a mixture of surfactant, inorganic sodium salt, and sodium hydroxide.

6. The method for preparing the packaging substrate according to claim 5, characterized in that, The surfactant comprises one or more of sodium poly2-hydroxyacrylate, alkyl dimethyl hydroxypropyl phosphate betaine, and fatty alcohol polyoxyethylene ether; and / or The inorganic sodium salt includes one or more of sodium oleate and sodium carbonate.

7. The method for preparing the packaging substrate according to claim 5, characterized in that, In the etching solution, the surfactant has a mass percentage of 1%-8%, the inorganic sodium salt has a mass percentage of 5%-20%, and the sodium hydroxide has a mass percentage of 5%-20%.

8. The method for preparing the packaging substrate according to claim 4, characterized in that, The glass substrate is immersed in the organic modifier solution for 10-40 minutes at a temperature of 50-60°C.

9. The method for preparing the packaging substrate according to claim 4, characterized in that, Before modifying the glass substrate with organic modifiers, the following steps should be performed: Remove residual etching solution from the surface of the glass substrate and clean and activate the glass substrate; The process of removing residual liquid from the surface of glass substrates includes spraying or ultrasonic washing. The glass substrate is cleaned and activated by plasma treatment.

10. A packaged device, characterized in that, The encapsulation substrate is prepared by a method comprising an encapsulation resin and an encapsulation substrate as described in any one of claims 1-3 or any one of claims 4-9, wherein the encapsulation resin is disposed on the surface of the encapsulation substrate.

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