A method and system for sputtering a copper-nickel resistive oxidation layer

Abstract

The present application relates to sputtering film coating technical field, propose a kind of copper nickel resistance oxidation layer sputtering film coating pressure stabilizing method and system, comprising: in the sputtering film coating process of oxidation layer, vacuum degree and temperature are collected;Vacuum degree standard range is preset, the characteristic value of vacuum degree at collection time, abnormal change trend difference, adjustment necessity are determined, according to adjustment necessity to determine adjustment collection time;Determine the regulation amplitude of adjustment collection time, establish temperature-regulation amplitude model, according to temperature-regulation amplitude model and the regulation amplitude of adjustment collection time, adjust the temperature of adjustment collection time, realize the pressure stabilization in the sputtering film coating process of copper nickel resistance oxidation layer.This application can realize the real-time stability of pressure in the sputtering film coating process of copper nickel resistance oxidation layer.

Description

Technical Field

[0001] This invention relates to the field of sputtering coating technology, specifically to a method and system for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer. Background Technology

[0002] Sputtered anti-oxidation coating of copper-nickel resistors refers to the deposition of an extremely thin, uniform, and dense anti-oxidation metal or alloy layer on the surface of a copper-nickel alloy resistor or a copper-nickel composite resistor using a vacuum physical vapor deposition process. The function of sputtered anti-oxidation coating of copper-nickel resistors is to prevent oxidation and sulfidation of copper at high temperatures or during long-term service, while maintaining long-term stability of the resistance value and providing a solderable or bondable metal surface.

[0003] To ensure the uniformity, density, and adhesion of the coating, it is necessary to maintain stable pressure during the sputtering process of the copper-nickel resistive oxide layer. Generally, during the sputtering process of the copper-nickel resistive oxide layer, the pressure is adjusted only when it exceeds the preset range; however, real-time pressure stability cannot be achieved. Summary of the Invention

[0004] This invention provides a method and system for stabilizing pressure during sputtering of a copper-nickel resistive oxide layer, to solve the problem of real-time pressure stabilization during the sputtering process of a copper-nickel resistive oxide layer. The specific technical solution adopted is as follows:

[0005] In a first aspect, one embodiment of the present invention provides a method for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer, the method comprising the following steps:

[0006] Vacuum levels and temperatures were collected at different times during the sputtering process of the anti-oxidation layer.

[0007] Based on the differences between the vacuum degree at the acquisition time and the lower and upper limits of the preset vacuum degree standard range, the vacuum degree characteristic value at the acquisition time is determined. Based on the adjacent acquisition times before the acquisition time, the previous adjacent time is determined. Based on the difference between the vacuum degree characteristic values ​​at the acquisition time and the previous adjacent time, the abnormal change trend difference at the acquisition time is determined. Based on the difference between the abnormal change trend at the acquisition time and the vacuum degree, as well as the difference between the abnormal change trend at the acquisition time and the previous adjacent time, the necessity of adjusting the acquisition time is determined. Based on the necessity of adjustment, the acquisition time is adjusted, and the adjusted acquisition time is the acquisition time for adjusting the vacuum degree.

[0008] Based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference in vacuum between the adjusted acquisition time and adjacent acquisition times, and the necessity of adjusting the acquisition time, the adjustment range of the acquisition time is determined. The corresponding adjustment range is calculated according to different preset vacuum levels and temperatures, and a temperature-adjustment range model is established. Based on the temperature-adjustment range model and the adjustment range of the acquisition time, the temperature of the acquisition time is adjusted to achieve pressure stability during the sputtering coating process of the copper-nickel resistor anti-oxidation layer.

[0009] Furthermore, the formula for calculating the vacuum degree characteristic value is:

[0010]

[0011] Among them, PR t P represents the vacuum characteristic value at the t-th acquisition time; t A1 represents the vacuum level at the t-th acquisition time; A2 represents the lower limit of the preset vacuum level standard range; A3 represents the upper limit of the preset vacuum level standard range.

[0012] Furthermore, the method for determining the differences in abnormal change trends at the acquisition time is as follows:

[0013] Record any acquisition time as the target acquisition time, and record the first preset number of acquisition times that are adjacent to the target acquisition time as the previous adjacent times of the target acquisition time.

[0014] The time interval with the largest time interval from the target acquisition time is recorded as the first time interval before the target acquisition time. The difference between the vacuum degree characteristic value of the target acquisition time and the first time interval before the target acquisition time is recorded as the first difference of the target acquisition time. The range between all the time intervals before the target acquisition time and the vacuum degree characteristic value of the target acquisition time is recorded as the first range of the target acquisition time. The ratio of the first difference of the target acquisition time to the first range is recorded as the abnormal change trend of the target acquisition time.

[0015] The difference between the abnormal change trend of the target acquisition time and the previous adjacent acquisition time is denoted as the abnormal change trend difference of the target acquisition time.

[0016] Furthermore, the specific method for obtaining the necessity of adjusting the acquisition time is as follows:

[0017] The number of abnormal change trends in the time preceding the target acquisition time that has the opposite sign to the abnormal change trend difference in the target acquisition time is recorded as the first quantity of the target acquisition time. The ratio of the quantity of the time preceding the target acquisition time to the first quantity of the target acquisition time is recorded as the first ratio of the target acquisition time.

[0018] The ratio of the difference in the abnormal change trend at the target acquisition time to the absolute value of the abnormal change trend is denoted as the second ratio at the target acquisition time.

[0019] When the abnormal change trend of the target acquisition time is greater than or equal to 0, the first characteristic value of the target acquisition time is assigned as the upper limit of the vacuum degree standard range. When the abnormal change trend of the target acquisition time is less than 0, the first characteristic value of the target acquisition time is assigned as the lower limit of the vacuum degree standard range. The reciprocal of the absolute value of the difference between the vacuum degree of the target acquisition time and the first characteristic value is recorded as the first reciprocal of the target acquisition time.

[0020] The positive correlation results of the first ratio, the second ratio, and the first reciprocal at the target acquisition time are denoted as the necessity of adjusting the target acquisition time.

[0021] Furthermore, the specific method for determining the adjustment acquisition time based on the necessity of adjustment includes:

[0022] When the necessity of adjusting the acquisition time exceeds the adjustment threshold, the acquisition time is recorded as the adjusted acquisition time.

[0023] Furthermore, the method for determining the adjustment range of the acquisition time based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference in vacuum between the adjusted acquisition time and adjacent acquisition times, and the necessity of adjusting the acquisition time, includes the following specific methods:

[0024] Based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum degree standard range, the second characteristic value of the adjusted acquisition time is determined.

[0025] The average vacuum difference at the adjusted acquisition time is determined based on the difference in vacuum degree between the adjusted acquisition time and the adjacent acquisition time.

[0026] The adjustment range for the data acquisition time is determined by the following formula:

[0027]

[0028] Where, ω u This indicates the adjustment range of the acquisition time u; This indicates adjusting the second characteristic value of the acquisition time u; P1 u This indicates adjusting the vacuum level of u at the acquisition time; norm() represents the normalization function; PS u This indicates the necessity of adjusting the acquisition time u; exp() represents an exponential function with the natural constant as the base. This indicates the difference in vacuum level at the time of data acquisition (u).

[0029] Furthermore, the method for determining the difference between the second characteristic value and the vacuum degree is as follows:

[0030] For adjusting the acquisition time, when the abnormal change trend of the adjusted acquisition time is greater than or equal to 0, the second characteristic value of the adjusted acquisition time is assigned to the lower limit of the vacuum degree standard range; when the abnormal change trend of the adjusted acquisition time is less than 0, the second characteristic value of the adjusted acquisition time is assigned to the upper limit of the vacuum degree standard range.

[0031] The difference in vacuum degree between the target acquisition time and the previous adjacent acquisition time is denoted as the vacuum degree difference at the target acquisition time; the average of the vacuum degree differences between all previous adjacent acquisition times and the acquisition time at the adjustment time is denoted as the average vacuum degree difference at the adjustment acquisition time.

[0032] Furthermore, the specific method for calculating the corresponding control amplitude based on different preset vacuum levels and temperatures, and establishing a temperature-control amplitude model, includes:

[0033] Different vacuum levels and temperatures are preset, and the control amplitude corresponding to the preset vacuum level is calculated. The preset temperature corresponding to the preset vacuum level is used as the dependent variable, and the control amplitude corresponding to the preset vacuum level is used as the independent variable. Curve fitting is performed to obtain the temperature-control amplitude model.

[0034] Furthermore, the specific method for adjusting the temperature at the acquisition time based on the temperature-control amplitude model and the control amplitude of the acquisition time includes:

[0035] The adjustment range at the acquisition time is used as the independent variable input into the temperature-adjustment range model to obtain the temperature fitting value corresponding to the acquisition time. The temperature value at the acquisition time is then adjusted to the temperature fitting value.

[0036] Secondly, embodiments of the present invention also provide a pressure stabilization system for sputtering a copper-nickel resistive oxide layer, including a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor executes the computer program to implement the steps of any of the methods described above.

[0037] The beneficial effects of this invention are:

[0038] This application collects the vacuum level within the sputtering chamber of a copper-nickel resistive oxide layer sputtering process to reflect the pressure state within the sputtering chamber. Based on the differences between the vacuum level at the time of collection and the lower and upper limits of a preset vacuum level standard range, the degree to which the vacuum level deviates from the standard range is evaluated. Furthermore, based on the differences between the vacuum level characteristic values ​​at the time of collection and the previous adjacent time, the application analyzes the changing trends of the vacuum level at each adjacent time before the collection time and at the collection time itself, identifies abnormal changing trends at the collection time, and further determines the necessity of adjusting the collection time, including the necessity of adjusting the target collection time. The larger the vacuum level, the more necessary it is to adjust the pressure inside the sputtering chamber during the sputtering process at the target acquisition time. The acquisition time for adjusting the vacuum level is determined based on the necessity of the adjustment. The degree to which the vacuum level at the acquisition time is adjusted towards the standard vacuum level range is evaluated, the control amplitude of the acquisition time is obtained, and the temperature at the acquisition time is adjusted in conjunction with the temperature-control amplitude model. The change in temperature will cause the vacuum level at the acquisition time to shift to the preset standard vacuum level range, thereby achieving pressure stability during the sputtering process of copper-nickel resistor anti-oxidation layer and solving the problem of not being able to achieve real-time pressure stability during the sputtering process of copper-nickel resistor anti-oxidation layer. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic flowchart of a method for stabilizing the pressure of sputtering a copper-nickel resistive oxide layer according to an embodiment of the present invention.

[0041] Figure 2 This is a flowchart illustrating the process of obtaining vacuum degree characteristic values ​​according to an embodiment of the present invention. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Please see Figure 1 The diagram illustrates a method for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer according to an embodiment of the present invention. The method includes the following steps:

[0044] Step S001: Collect vacuum level and temperature at different collection times during the anti-oxidation layer sputtering coating process.

[0045] A vacuum gauge and a temperature sensor are installed in the sputtering area of ​​the target material in the sputtering chamber of the copper-nickel resistive oxide layer sputtering coating process. During the copper-nickel resistive oxide layer sputtering coating process, the vacuum gauge is used to collect the vacuum level and the temperature is used to collect the temperature until the anti-oxidation layer sputtering coating is completed and the data collection stops.

[0046] In this embodiment, the time interval for collecting vacuum level and temperature data is set to 0.5 seconds. In practical applications, as other implementation methods, the implementer can determine the value of the time interval for collecting vacuum level and temperature data according to the actual situation; this application does not impose any special restrictions.

[0047] Vacuum level is a physical quantity that indicates the degree of rarefaction of the gas inside a sputtering chamber, reflecting the pressure state within the chamber. The higher the vacuum level, the lower the pressure inside the sputtering chamber.

[0048] Thus, the vacuum level and temperature at different sampling times during the anti-oxidation layer sputtering coating process were obtained.

[0049] Step S002: Based on the differences between the vacuum degree at the acquisition time and the lower and upper limits of the preset vacuum degree standard range, determine the vacuum degree characteristic value at the acquisition time; based on the adjacent acquisition times before the acquisition time, determine the previous adjacent time; based on the difference between the vacuum degree characteristic values ​​at the acquisition time and the previous adjacent time, determine the abnormal change trend difference at the acquisition time; based on the difference between the abnormal change trend at the acquisition time and the vacuum degree, and the difference between the abnormal change trend at the acquisition time and the previous adjacent time, determine the necessity of adjusting the acquisition time; based on the necessity of adjustment, determine the adjustment acquisition time, which is the acquisition time for adjusting the vacuum degree.

[0050] As the copper-nickel resistive oxide layer is sputtered, the pressure inside the sputtering chamber may gradually change, altering the vacuum level. The vacuum level may even exceed the preset normal range, leading to pressure imbalance and affecting the uniformity, density, and adhesion of the sputtered oxide layer. Specifically, when the pressure inside the sputtering chamber is too high, the density and adhesion of the oxide film decrease, affecting its performance and uniformity. When the pressure inside the sputtering chamber is too low, pinhole defects may appear on the film surface, and it may even be difficult to form a uniform film. Therefore, it is necessary to analyze the necessity of pressure regulation inside the sputtering chamber based on the vacuum level variation trend and actual values ​​at each sampling time, and adjust the pressure when necessary to ensure pressure stability during the oxide layer sputtering process.

[0051] In this embodiment, the vacuum standard range is set as (A1, A2), where A1 and A2 are the lower limit and upper limit of the preset vacuum standard range, respectively. (A1, A2) indicates that the vacuum level is within the vacuum standard range if it is greater than the lower limit and less than the upper limit. In this embodiment, the lower limit of the vacuum standard range is 0.3 Pa and the upper limit is 0.5 Pa.

[0052] The vacuum characteristic value at the time of data acquisition is determined based on the difference between the vacuum degree at the time of data acquisition and the lower and upper limits of the preset vacuum degree standard range.

[0053]

[0054] Among them, PR t P represents the vacuum characteristic value at the t-th acquisition time; t A1 represents the vacuum level at the t-th acquisition time; A2 represents the lower limit of the preset vacuum level standard range; A3 represents the upper limit of the preset vacuum level standard range.

[0055] When P t When -A1<0, the vacuum level at the t-th acquisition time is less than the lower limit of the standard vacuum level range, meaning the vacuum level at the t-th acquisition time is not within the standard vacuum level range, and the vacuum level characteristic value at the t-th acquisition time is less than 0. When A2-P t When the vacuum level is less than 0, the vacuum level at the t-th acquisition time is greater than the upper limit of the standard vacuum level range, the vacuum level at the t-th acquisition time is not within the standard vacuum level range, and the vacuum level characteristic value at the t-th acquisition time is less than 0. Conversely, when the vacuum level at the t-th acquisition time is within the standard vacuum level range, the vacuum level characteristic value at the t-th acquisition time is greater than 0.

[0056] The flowchart for obtaining vacuum degree characteristic values ​​is as follows: Figure 2 As shown.

[0057] When a pressure imbalance occurs in the sputtering chamber, the vacuum level will be abnormal at consecutive sampling times. Therefore, the necessity of adjusting the pressure in the sputtering chamber is analyzed based on the vacuum level at adjacent sampling times.

[0058] The abnormal change trend of the acquisition time is determined by the difference between the vacuum degree characteristic values ​​at the acquisition time and the adjacent acquisition time before the acquisition time.

[0059] Record any acquisition time as the target acquisition time, and record the α acquisition times that are adjacent to the target acquisition time as the previous adjacent times of the target acquisition time.

[0060] Wherein, α represents the first preset quantity, and in this embodiment, the first preset quantity is set to 15. It should be noted that when there are fewer than α adjacent acquisition times before the target acquisition time, the mean fill method is used to supplement the insufficient acquisition times. The mean fill method for supplementing data is a well-known technique and will not be described in detail here.

[0061] The time interval with the largest time interval between the target acquisition time and the previous adjacent time is recorded as the first previous adjacent time of the target acquisition time. The difference between the vacuum degree characteristic value of the target acquisition time and the first previous adjacent time is recorded as the first difference of the target acquisition time. The range between all the previous adjacent times of the target acquisition time and the vacuum degree characteristic value of the target acquisition time is recorded as the first range of the target acquisition time. The ratio of the first difference of the target acquisition time to the first range is recorded as the abnormal change trend of the target acquisition time.

[0062] When the abnormal change trend of the target acquisition time is closer to 1, the vacuum degree of each adjacent time before the target acquisition time and the target acquisition time shows a more obvious increasing trend; when the abnormal change trend of the target acquisition time is closer to -1, the vacuum degree of each adjacent time before the target acquisition time and the target acquisition time shows a more obvious decreasing trend; when the abnormal change trend of the target acquisition time is closer to 0, the vacuum degree of each adjacent time before the target acquisition time and the target acquisition time is more stable.

[0063] The same method can be used to obtain the abnormal change trend at any collection time.

[0064] The difference between the abnormal change trend of the target acquisition time and the previous adjacent acquisition time is denoted as the abnormal change trend difference of the target acquisition time.

[0065] The same method can be used to obtain the difference in abnormal change trends at any acquisition time.

[0066] It should be noted that when there is no preceding adjacent acquisition time for the target acquisition time, the mean imputation method is used to supplement the abnormal trend of the missing acquisition time. The mean imputation method is a well-known technique and will not be elaborated further.

[0067] The necessity of adjusting the target acquisition time is determined based on the abnormal change trend and vacuum level of the target acquisition time, as well as the difference between the abnormal change trends of the target acquisition time and the previous adjacent time.

[0068] The number of abnormal trend differences between the previous two adjacent time points of the target acquisition time that have opposite signs to the abnormal trend difference of the target acquisition time is recorded as the first quantity of the target acquisition time. The ratio of the quantity of the previous two adjacent time points of the target acquisition time to the first quantity of the target acquisition time is recorded as the first ratio of the target acquisition time. The ratio of the abnormal trend difference of the target acquisition time to the absolute value of the abnormal trend is recorded as the second ratio of the target acquisition time. When the abnormal trend of the target acquisition time is greater than or equal to 0, the first characteristic value of the target acquisition time is assigned as the upper limit of the vacuum degree standard range. When the abnormal trend of the target acquisition time is less than 0, the first characteristic value of the target acquisition time is assigned as the lower limit of the vacuum degree standard range. The reciprocal of the absolute value of the difference between the vacuum degree of the target acquisition time and the first characteristic value is recorded as the first reciprocal of the target acquisition time. The positive correlation result of the first ratio, the second ratio and the first reciprocal of the target acquisition time is recorded as the necessity of adjusting the target acquisition time.

[0069] It is understood that a positive correlation is applied to the first ratio, second ratio, and first reciprocal of the target acquisition time, ensuring that these ratios are positively correlated with the necessity of adjusting the target acquisition time. It is also understood that the positive correlation in this application refers to the relationship between the independent and dependent variables, where the independent variables are the first ratio, second ratio, and first reciprocal of the target acquisition time, and the dependent variable is the necessity of adjusting the target acquisition time. A positive correlation means that the dependent variable increases (decreases) as the independent variable increases (decreases), and can be an additive or multiplicative relationship.

[0070] Preferably, as an embodiment of this application, the normalized value of the product of the first ratio, the second ratio, and the first reciprocal of the target acquisition time is denoted as the necessity of adjusting the target acquisition time.

[0071] When the first quantity of the target acquisition time is smaller, and the first ratio, the second ratio and the first reciprocal are larger, the trend of abnormal change within the target acquisition time and the time immediately preceding the target acquisition time is more uniform, and the trend of abnormal fluctuation of vacuum degree within the target acquisition time and the time immediately preceding the target acquisition time is more uniform. That is, the possibility of abnormal fluctuation of vacuum degree within the target acquisition time and the time immediately preceding the target acquisition time is greater. At this time, the necessity of adjusting the target acquisition time is greater, and the pressure in the sputtering chamber during the sputtering coating process needs to be adjusted more at the target acquisition time.

[0072] It should be understood that the pressure stabilization in the sputtering chamber during the sputtering coating process in this application is carried out under the premise that the equipment for sputtering coating is operating normally and without malfunction. Therefore, the issue of equipment malfunction during the pressure stabilization process is not considered.

[0073] The necessity of adjustment at any given acquisition time can be obtained using the same method.

[0074] When the necessity of adjusting the target acquisition time is greater than the adjustment threshold, the vacuum level of the target acquisition time is adjusted; when the necessity of adjusting the target acquisition time is less than or equal to the adjustment threshold, the vacuum level of the target acquisition time is not adjusted.

[0075] The adjustment threshold is a preset parameter value, and in this embodiment, the adjustment threshold is set to 0.75.

[0076] The same method can be used to identify each acquisition moment when the vacuum level is adjusted.

[0077] The time of vacuum adjustment is recorded as the adjustment acquisition time.

[0078] At this point, the data acquisition moment when the vacuum level was adjusted was identified.

[0079] Step S003: Based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference in vacuum between the adjusted acquisition time and adjacent acquisition times, and the necessity of adjusting the acquisition time, determine the adjustment range of the acquisition time. Calculate the corresponding adjustment range based on different preset vacuum levels and temperatures, and establish a temperature-adjustment range model. Adjust the temperature of the acquisition time according to the temperature-adjustment range model and the adjustment range of the acquisition time to achieve pressure stability during the sputtering coating process of the copper-nickel resistor anti-oxidation layer.

[0080] The adjustment range of the acquisition time is determined based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference in vacuum between the adjusted acquisition time and adjacent acquisition times, and the necessity of adjusting the acquisition time.

[0081] When adjusting the acquisition time, if the abnormal change trend of the adjusted acquisition time is greater than or equal to 0, the second characteristic value of the adjusted acquisition time is assigned to the lower limit of the vacuum degree standard range; if the abnormal change trend of the adjusted acquisition time is less than 0, the second characteristic value of the adjusted acquisition time is assigned to the upper limit of the vacuum degree standard range.

[0082] The difference in vacuum level between the target acquisition time and the previous adjacent acquisition time is denoted as the vacuum level difference at the target acquisition time. The vacuum level difference for each acquisition time can be obtained using the same method. For adjusting the acquisition time, the average of the vacuum level differences between all previous adjacent times and the adjusted acquisition time is denoted as the average vacuum level difference at the adjusted acquisition time.

[0083] Based on the second characteristic value of the data acquisition time, the average vacuum difference, the vacuum level, and the necessity of adjustment, the adjustment range of the data acquisition time is determined, and the calculation formula is as follows:

[0084]

[0085] Where, ω u This indicates the adjustment range of the acquisition time u; This indicates adjusting the second characteristic value of the acquisition time u; P1 u This indicates adjusting the vacuum level of u at the acquisition time; norm() represents the normalization function; PS u This indicates the necessity of adjusting the acquisition time u; exp() represents an exponential function with the natural constant as the base. This indicates the difference in vacuum level at the time of data acquisition (u).

[0086] Understandably, when the vacuum level at the time of data acquisition is adjusted to be closer to the lower limit of the standard vacuum level range, the vacuum level at the time of data acquisition should be adjusted towards the upper limit of the standard vacuum level range; conversely, when the vacuum level at the time of data acquisition is adjusted to be closer to the upper limit of the standard vacuum level range, the vacuum level at the time of data acquisition should be adjusted towards the lower limit of the standard vacuum level range.

[0087] Different vacuum levels and temperatures are set by experts in the field. Under different vacuum levels and temperatures, the control amplitude corresponding to different set vacuum levels is calculated according to the method of obtaining the control amplitude at the time of adjustment. The set temperature corresponding to the set vacuum level is used as the dependent variable, and the control amplitude corresponding to the set vacuum level is used as the independent variable. Curve fitting is performed to obtain the temperature-control amplitude model.

[0088] In this embodiment, the least squares method is used for curve fitting. Curve fitting using the least squares method is a well-known technique and will not be elaborated further. In practical applications, as other implementation methods, while achieving the purpose of curve fitting, implementers may employ other existing methods such as polynomial fitting techniques; this application does not impose any special limitations.

[0089] The adjustment range at the acquisition time is used as the independent variable input to the temperature-adjustment range model to obtain the temperature fitting value corresponding to the adjustment acquisition time. Adjusting the temperature value at the acquisition time to the temperature fitting value will cause the vacuum degree at the acquisition time to change to the preset vacuum degree standard range, thereby achieving pressure stability during the sputtering coating process of the copper-nickel resistor anti-oxidation layer.

[0090] This achieves pressure stabilization of the sputtered copper-nickel resistive oxide layer.

[0091] Based on the same inventive concept as the above method, this embodiment of the invention also provides a pressure stabilization system for sputtering copper-nickel resistive oxide layer, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any one of the above-described methods for stabilizing the pressure of sputtering copper-nickel resistive oxide layer.

[0092] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer, characterized in that, The method includes the following steps: Vacuum levels and temperatures were collected at different times during the sputtering process of the anti-oxidation layer. Based on the differences between the vacuum degree at the acquisition time and the lower and upper limits of the preset vacuum degree standard range, the vacuum degree characteristic value at the acquisition time is determined. Based on the adjacent acquisition times before the acquisition time, the previous adjacent time is determined. Based on the difference between the vacuum degree characteristic values ​​at the acquisition time and the previous adjacent time, the abnormal change trend difference at the acquisition time is determined. Based on the difference between the abnormal change trend at the acquisition time and the vacuum degree, as well as the difference between the abnormal change trend at the acquisition time and the previous adjacent time, the necessity of adjusting the acquisition time is determined. Based on the necessity of adjustment, the acquisition time is adjusted, and the adjusted acquisition time is the acquisition time for adjusting the vacuum degree. Based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference of vacuum degree between the adjusted acquisition time and adjacent acquisition time, and the necessity of adjusting the acquisition time, the adjustment range of the acquisition time is determined. The corresponding adjustment range is calculated according to the preset different vacuum degrees and temperatures, and a temperature-adjustment range model is established. Based on the temperature-adjustment range model and the adjustment range of the acquisition time, the temperature of the acquisition time is adjusted to achieve pressure stability during the sputtering coating process of copper-nickel resistor anti-oxidation layer. The formula for calculating the vacuum degree characteristic value is: in, Indicates the first Vacuum degree characteristic value at each acquisition time; Indicates the first Vacuum level at each acquisition moment; This indicates the lower limit of the preset vacuum level standard range; This indicates the upper limit of the preset vacuum level standard range; The method for determining the abnormal change trend difference of the acquisition time is as follows: any acquisition time is recorded as the target acquisition time, and the first preset number of acquisition times adjacent to the target acquisition time are recorded as the previous adjacent times of the target acquisition time. The time interval with the largest time interval from the target acquisition time is recorded as the first time interval before the target acquisition time. The difference between the vacuum degree characteristic value of the target acquisition time and the first time interval before the target acquisition time is recorded as the first difference of the target acquisition time. The range between all the time intervals before the target acquisition time and the vacuum degree characteristic value of the target acquisition time is recorded as the first range of the target acquisition time. The ratio of the first difference of the target acquisition time to the first range is recorded as the abnormal change trend of the target acquisition time. The difference between the abnormal change trend of the target acquisition time and the acquisition time immediately preceding the target acquisition time is denoted as the abnormal change trend difference of the target acquisition time. The specific method for obtaining the necessity of adjusting the acquisition time is as follows: The number of abnormal change trends in the time preceding the target acquisition time that has the opposite sign to the abnormal change trend difference in the target acquisition time is recorded as the first quantity of the target acquisition time. The ratio of the quantity of the time preceding the target acquisition time to the first quantity of the target acquisition time is recorded as the first ratio of the target acquisition time. The ratio of the difference in the abnormal change trend at the target acquisition time to the absolute value of the abnormal change trend is denoted as the second ratio at the target acquisition time. When the abnormal change trend of the target acquisition time is greater than or equal to 0, the first characteristic value of the target acquisition time is assigned as the upper limit of the vacuum degree standard range. When the abnormal change trend of the target acquisition time is less than 0, the first characteristic value of the target acquisition time is assigned as the lower limit of the vacuum degree standard range. The reciprocal of the absolute value of the difference between the vacuum degree of the target acquisition time and the first characteristic value is recorded as the first reciprocal of the target acquisition time. The positive correlation results of the first ratio, the second ratio, and the first reciprocal at the target acquisition time are recorded as the necessity of adjusting the target acquisition time. The specific methods for determining the adjustment time based on the necessity of adjustment include: When the necessity of adjusting the acquisition time exceeds the adjustment threshold, the acquisition time is recorded as the acquisition time to be adjusted. The method for determining the adjustment range of the acquisition time based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum standard range, the difference in vacuum between the adjusted acquisition time and adjacent acquisition times, and the necessity of adjusting the acquisition time, includes the following specific methods: Based on the difference between the abnormal change trend of the adjusted acquisition time and the upper and lower limits of the preset vacuum degree standard range, the second characteristic value of the adjusted acquisition time is determined. The average vacuum difference at the adjusted acquisition time is determined based on the difference in vacuum degree between the adjusted acquisition time and the adjacent acquisition time. The adjustment range for the data acquisition time is determined by the following formula: in, Indicates adjustment of data acquisition time The extent of regulation; Indicates adjustment of data acquisition time The second eigenvalue; Indicates adjustment of data acquisition time Vacuum degree; Represents the normalization function; Indicates adjustment of data acquisition time The necessity of adjustment; Represents an exponential function with the natural constant as its base; Indicates adjustment of data acquisition time The vacuum levels are all poor; The specific method for calculating the corresponding control amplitude based on different preset vacuum levels and temperatures, and establishing a temperature-control amplitude model, includes: Different vacuum levels and temperatures are preset, and the control amplitude corresponding to the preset vacuum level is calculated. The preset temperature corresponding to the preset vacuum level is used as the dependent variable, and the control amplitude corresponding to the preset vacuum level is used as the independent variable. Curve fitting is performed to obtain the temperature-control amplitude model.

2. The method for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer according to claim 1, characterized in that, The method for determining the difference between the second characteristic value and the vacuum degree is as follows: For adjusting the acquisition time, when the abnormal change trend of the adjusted acquisition time is greater than or equal to 0, the second characteristic value of the adjusted acquisition time is assigned to the lower limit of the vacuum degree standard range; when the abnormal change trend of the adjusted acquisition time is less than 0, the second characteristic value of the adjusted acquisition time is assigned to the upper limit of the vacuum degree standard range. The difference in vacuum degree between the target acquisition time and the previous adjacent acquisition time is denoted as the vacuum degree difference at the target acquisition time; the average of the vacuum degree differences between all previous adjacent acquisition times and the acquisition time at the adjustment time is denoted as the average vacuum degree difference at the adjustment acquisition time.

3. The method for stabilizing the pressure during sputtering of a copper-nickel resistive oxide layer according to claim 1, characterized in that, The specific method for adjusting the temperature at the time of data acquisition based on the temperature-control amplitude model and the control amplitude at the time of data acquisition includes: The adjustment range at the acquisition time is used as the independent variable input into the temperature-adjustment range model to obtain the temperature fitting value corresponding to the acquisition time. The temperature value at the acquisition time is then adjusted to the temperature fitting value.

4. A pressure stabilization system for sputtering a copper-nickel resistive oxide layer, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method as claimed in any one of claims 1-3.

Images