Intelligent processing device for electronic product elements

Abstract

The invention relates to the technical field of electronic product processing, and discloses an intelligent processing device for electronic product elements, the intelligent processing device comprises an electroplating device, the top of the electroplating device is fixedly connected with a mounting frame, the mounting frame is used for electroplating processing of electronic products, and a moving mechanism is arranged in the mounting frame; the bottom of the moving mechanism is provided with a dynamic placing mechanism, the moving mechanism drives the dynamic placing mechanism to move, the dynamic placing mechanism can be used for placing electronic products, and the outside of the dynamic placing mechanism is provided with an object placing mechanism which is used for placing the electronic products into the dynamic placing mechanism. Through the deformation of the dynamic placing mechanism, the electroplating of two electronic elements can be carried out by utilizing one device for placing the electronic products, so that a plurality of devices for placing the electronic products do not need to be purchased, the processing cost of the electronic products is reduced, and the practicability of the electroplating device is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic product processing technology, specifically to an intelligent processing device for electronic product components. Background Technology

[0002] Intelligent processing equipment for electronic product components encompasses multiple stages. The processing stage includes precision CNC machine tools and laser cutting equipment for precise handling of component structures; electroplating equipment; and automated robotic arms for high-precision assembly. The inspection stage utilizes optical inspection equipment and sensors to monitor dimensions and performance in real time. All devices work together to improve production efficiency and component quality stability.

[0003] Electroplating equipment in existing intelligent processing devices for electronic product components can be divided into electroplating equipment using racks, electroplating equipment using drums, and electroplating equipment using baskets. Currently, the device for placing electronic products in each type of electroplating equipment can only be used independently and cannot be integrated. This results in different devices being required for different electronic products, which means that different devices need to be used for electroplating depending on the size and shape of the electronic components. This not only increases costs but also reduces the practicality of the electroplating equipment. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an intelligent processing device for electronic product components. It solves the problem that in existing electroplating devices, the devices for placing electronic products can only be used independently and cannot be integrated, leading to the need for different devices for placing electronic components, which increases costs and reduces the practicality of the electroplating device.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an intelligent processing device for electronic product components, comprising an electroplating device, a mounting frame fixedly connected to the top of the electroplating device, the mounting frame being used for electroplating processing of electronic products, a moving mechanism being provided inside the mounting frame, a dynamic placement mechanism being provided at the bottom of the moving mechanism, the moving mechanism driving the dynamic placement mechanism to move, the dynamic placement mechanism being able to place electronic products, a placing mechanism being provided outside the dynamic placement mechanism, the placing mechanism being used to place electronic products into the interior of the dynamic placement mechanism, and a drying mechanism being provided at the top of the mounting frame, the drying mechanism being used for drying electronic products.

[0006] Preferably, the moving mechanism includes two fixed rails, the outer sides of which are respectively fixedly connected to the inner sides of the mounting frame, a sliding frame is slidably connected between the outer sides of the two fixed rails, a hydraulic cylinder is fixedly connected to the top of the sliding frame, a motor is fixedly connected to the outer side of the mounting frame, a threaded rod is fixedly connected to the output end of the motor, and a mounting frame is fixedly connected to the output end of the hydraulic cylinder.

[0007] Preferably, the dynamic placement mechanism includes two rotating plates, the outer sides of which are rotatably connected to the bottom sides of the mounting frame. A mounting box is fixedly connected to one side of the mounting frame, and an impeller is rotatably connected inside the mounting box. The middle of one rotating plate is fixedly connected to the middle of the impeller. Multiple stirring blades are fixedly connected to the outside of the rotating plate. A fixed mounting plate is fixedly connected to the side of one rotating plate away from the mounting box. The other rotating plate has a mounting groove inside, and a sliding plate is slidably connected inside the mounting groove. The mounting groove also contains... Multiple return springs are provided. A dynamic mounting plate is fixedly connected to the side of the sliding plate away from the return springs. A driving rod is fixedly connected to the middle of the sliding plate. A roller is provided between the fixed mounting plate and the outside of the dynamic mounting plate. An air pump is fixedly connected to the outside of the electroplating device. An air hose is fixedly connected to the output end of the air pump. The end of the air hose away from the air pump is fixedly connected to the outside of the mounting box. Two fixed rods are fixedly connected between the two rotating plates. Multiple rotating shafts are rotatably connected to the outside of the fixed rods. A locking ring is provided on the outside of the rotating shaft. A hook is fixedly connected to the outside of the locking ring.

[0008] Preferably, the loading mechanism includes a rotating plate, one side of which is rotatably connected to the outside of the roller, a rotating hollow shaft is fixedly connected to the bottom end of the rotating plate, and two clamping plates are rotatably connected to both sides of the rotating hollow shaft. A fixing post is fixedly connected between the two clamping plates, and a torsion spring is sleeved on the outside of the fixing post. One end of the torsion spring is fixedly connected to the inside of the rotating hollow shaft, and the other end of the torsion spring is fixedly connected to the outside of the fixing post.

[0009] Preferably, the drying mechanism includes a fixed box, the bottom of which is fixedly connected to the top of the mounting frame, a partition fixedly connected to the middle of the fixed box, a plurality of air guide plates fixedly connected to the top of the partition, an inner plate slidably connected to the bottom of the fixed box, a heating wire fixedly connected inside the inner plate, a baffle fixedly connected to the outside of the heating wire, a fixed tube fixedly connected to the top of the fixed box, a connecting hose fixedly connected to the bottom of the fixed tube, and the end of the connecting hose away from the fixed tube fixedly connected to the outside of the mounting box.

[0010] Preferably, one of the fixed rails is externally fixedly connected to a stabilizing block, and the end of the threaded rod away from the motor is rotatably connected to the inner side of the stabilizing block near the motor.

[0011] Preferably, a pull handle is fixedly connected to the side of the driving rod away from the sliding plate, and the driving rod is slidably connected to the middle of one of the rotating circular plates.

[0012] Preferably, one end of the reset spring is fixedly connected to the inside of the rotating plate, and the other end of the reset spring is fixedly connected to the inside of the sliding plate.

[0013] Preferably, a pretreatment tank is provided inside one side of the electroplating device, a pure water tank is provided in the middle of the electroplating device, and an electroplating tank is provided inside the electroplating device on the side away from the pretreatment tank.

[0014] Preferably, the baffle is disposed outside the fixing box, and ventilation holes are provided on the top of both the fixing box and the top of the mounting frame.

[0015] This invention provides an intelligent processing device for electronic product components. It has the following beneficial effects:

[0016] 1. This invention, through the deformation of the dynamic placement mechanism, enables the electroplating apparatus to be transformed into an electroplating apparatus with a hanging rack and an electroplating apparatus using a roller. Thus, it is possible to electroplat two types of electronic components using a single device for placing electronic products, thereby eliminating the need to purchase multiple devices for placing electronic products, reducing the cost of electronic product processing, and improving the practicality of the electroplating apparatus.

[0017] 2. The present invention can drive the stirring blade to rotate through the dynamic placement mechanism, thereby stirring the liquid and eliminating local concentration differences in the electroplating solution. At the same time, the flowing liquid can forcibly bring in metal ions, reducing the problem of missed plating or excessively thin plating layer, and improving the uniformity of the plating layer.

[0018] 3. The present invention, through a drying mechanism, can utilize the high-pressure gas that drives the impeller to rotate, and after heating, dry the electronic products after electroplating. It makes full use of the gas that provides power, avoids setting up a separate drying mechanism, and saves the cost of electronic product processing. Attached Figure Description

[0019] Figure 1 The three-dimensional representation of the present invention Figure 1 ;

[0020] Figure 2 The three-dimensional representation of the present invention Figure 2 ;

[0021] Figure 3 This is a schematic diagram of the moving mechanism in this invention;

[0022] Figure 4 This is a schematic diagram of the internal structure of the mounting box in this invention;

[0023] Figure 5 This is a schematic diagram of the structure of the fixed mounting plate in this invention;

[0024] Figure 6 This is a schematic diagram of the structure of the fixing rod in this invention;

[0025] Figure 7 This is a schematic diagram of the locking ring structure in this invention;

[0026] Figure 8 This is a schematic diagram of the sliding plate in this invention;

[0027] Figure 9 This is a schematic diagram of the structure of the roller in this invention;

[0028] Figure 10 This is a schematic diagram of the rotating hollow shaft in this invention;

[0029] Figure 11 This is a schematic diagram of the structure of the fixing box in this invention;

[0030] Figure 12 This is a schematic diagram of the air guide plate in this invention;

[0031] Figure 13 This is a schematic diagram of the structure of the built-in plate in this invention;

[0032] Figure 14 This is a schematic diagram of the electroplating apparatus in this invention.

[0033] The components include: 1. Electroplating device; 101. Pretreatment tank; 102. Pure water tank; 103. Electroplating tank; 2. Mounting frame; 3. Moving mechanism; 301. Fixed rail; 302. Sliding frame; 303. Hydraulic cylinder; 304. Motor; 305. Threaded rod; 306. Mounting bracket; 307. Stabilizing block; 4. Dynamic placement mechanism; 401. Rotating plate; 402. Stirring blade; 403. Mounting box; 404. Impeller; 405. Fixed mounting plate; 406. Mounting groove; 407. Sliding plate; 408. Dynamic mounting plate; 409. Return spring. 410. Drive rod; 411. Pull handle; 412. Drum; 413. Air pump; 414. Air hose; 415. Fixing rod; 416. Rotating shaft; 417. Engaging ring; 418. Hanging hook; 5. Placing mechanism; 501. Rotating plate; 502. Rotating hollow shaft; 503. Clamping plate; 504. Fixing column; 505. Torsion spring; 6. Drying mechanism; 601. Fixing box; 602. Partition; 603. Air guide plate; 604. Internal plate; 605. Heating wire; 606. Baffle; 607. Fixing tube; 608. Connecting hose. Detailed Implementation

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see the appendix Figure 1 -Appendix Figure 14 This invention provides an intelligent processing device for electronic product components, including an electroplating device 1. A mounting frame 2 is fixedly connected to the top of the electroplating device 1. The mounting frame 2 provides a mounting position and prevents liquid splashing. The mounting frame 2 is used for electroplating electronic products. A moving mechanism 3 is provided inside the mounting frame 2, and a dynamic placement mechanism 4 is provided at the bottom of the moving mechanism 3. The moving mechanism 3 drives the dynamic placement mechanism 4 to move, and the dynamic placement mechanism 4 can place electronic products. A placement mechanism 5 is provided outside the dynamic placement mechanism 4. 5 is used to place electronic products into the interior of the dynamic placement mechanism 4. A drying mechanism 6 is provided on the top of the mounting frame 2. The drying mechanism 6 is used to dry the electronic products. A pretreatment tank 101 is provided inside one side of the electroplating device 1. The pretreatment tank 101 is used for pretreatment of electronic products before electroplating. A pure water tank 102 is provided in the middle of the electroplating device 1. The pure water tank 102 can clean the pretreatment solution and the electroplating solution after electroplating. An electroplating tank 103 is provided inside the electroplating device 1 on the side away from the pretreatment tank 101. The electroplating tank 103 can perform electroplating.

[0036] The moving mechanism 3 includes two fixed rails 301, which provide sliding tracks. The two fixed rails 301 are respectively fixedly connected to the inner sides of the mounting frame 2. A sliding frame 302 is slidably connected between the two fixed rails 301. The sliding frame 302 provides the mounting position and can slide outside the fixed rails 301. A hydraulic cylinder 303 is fixedly connected to the top of the sliding frame 302, providing the power for vertical movement. A motor 304 is fixedly connected to the outside of the mounting frame 2, providing the power for rotation. A threaded rod 305 is fixedly connected to the output end of the motor 304. Rotation of the threaded rod 305 drives the sliding frame 302 to move. A mounting bracket 306 is fixedly connected to the output end of the hydraulic cylinder 303, providing the mounting position. A stabilizing block 307 is fixedly connected to the outside of one of the fixed rails 301, providing stability for the rotation of the threaded rod 305. Qualitatively, it can also limit the movement trajectory of the sliding frame 302, preventing the sliding frame 302 from moving out of the outside of the fixed rail 301. The end of the threaded rod 305 away from the motor 304 is rotatably connected to the inner side of the stabilizing block 307 near the motor 304. After the motor 304 is started, the output end of the motor 304 drives the threaded rod 305 to rotate. When the threaded rod 305 rotates, it can drive the sliding frame 302 to move laterally along the outside of the fixed rail 301. After moving to the top of the pretreatment tank 101, the pure water tank 102 and the electroplating tank 103, the hydraulic cylinder 303 is started. After the output end of the hydraulic cylinder 303 extends, it can drive the mounting frame 306 to move downward, thereby moving the dynamic placement mechanism 4 downward, so that the dynamic placement mechanism 4 can be submerged in one of the pretreatment tank 101, the pure water tank 102 and the electroplating tank 103, thereby completing the automatic placement of electronic products into the electroplating device 1 for electroplating.

[0037] The dynamic placement mechanism 4 includes two rotating plates 401, which provide the mounting position. The outer sides of the two rotating plates 401 are rotatably connected to the bottom sides of the mounting bracket 306. A mounting box 403 is fixedly connected to one side of the mounting bracket 306, providing the mounting position. An impeller 404 is rotatably connected inside the mounting box 403. The impeller 404 can rotate under the drive of high-pressure gas, and the rotation speed of the impeller 404 can be controlled according to the gas flow speed. The middle of one of the rotating plates 401 is fixedly connected to the middle of the impeller 404. Multiple stirring blades 402 are fixedly connected to the outside of the rotating plates 401. The stirring blades 402 can agitate the liquid inside the electroplating device 1. One of the rotating plates 401 is located away from the middle of the impeller 404. A fixed mounting plate 405 is fixedly connected to one side of the mounting box 403. An mounting groove 406 is provided inside the other rotating original plate 401, providing an installation position. A sliding plate 407 is slidably connected inside the mounting groove 406, serving as a limit and providing the installation position. Multiple return springs 409 are installed inside the mounting groove 406, using their elasticity to reset the sliding plate 407. A dynamic mounting plate 408 is fixedly connected to the side of the sliding plate 407 away from the return springs 409. The dynamic mounting plate 408, in conjunction with the fixed mounting plate 405, allows the roller 412 to be installed. A driving rod 410 is fixedly connected to the middle of the sliding plate 407, driving the sliding plate. 407 moves outward. A roller 412 is provided between the fixed mounting plate 405 and the dynamic mounting plate 408. The inside of the roller 412 can hold electronic products. An air pump 413 is fixedly connected to the outside of the electroplating device 1. The air pump 413 provides high-pressure gas. The output end of the air pump 413 is fixedly connected to a ventilation hose 414, which provides a path for gas flow. By opening the placement mechanism 5, the electronic products are placed inside the roller 412. The rotating plate 401, stirring blade 402, fixed mounting plate 405, and roller 412 are then placed inside the electroplating device 1. At this time, the air pump 413 is started, generating high-pressure gas, which enters the mounting box 403 through the ventilation hose 414, thereby enabling... The impeller 404 rotates, which in turn drives one of the rotating plates 401 to rotate. This rotation, in turn, drives the drum 412 to rotate via the fixed mounting plate 405 and the dynamic mounting plate 408. This, in turn, causes the electronic products inside the drum 412 to rotate, allowing each surface of the electronic products to be electroplated. Simultaneously, the rotation of the rotating plate 401 drives the stirring blades 402 to rotate. The stirring blades 402 agitate the liquids inside the pretreatment tank 101, the pure water tank 102, or the electroplating tank 103, thereby eliminating local concentration differences in the electroplating solution. Furthermore, the flowing liquid can forcibly introduce metal ions.To reduce plating defects or excessively thin plating layers and improve plating uniformity, the end of the ventilation hose 414 furthest from the air pump 413 is fixedly connected to the outside of the mounting box 403. Two fixing rods 415 are fixedly connected between the two rotating circular plates 401, providing installation positions. Multiple rotating shafts 416 are rotatably connected to the outside of the fixing rods 415, providing installation positions. A locking ring 417 is provided on the outside of the rotating shaft 416, which can easily rotate after locking onto the outside of the rotating shaft 416. A hook 418 is fixedly connected to the outside of the locking ring 417, which can hang electronic products. A pull handle 411 is fixedly connected to the side of the driving rod 410 furthest from the sliding plate 407. The driving rod 410 is slidably connected to the middle of one of the rotating plates 401. One end of the return spring 409 is fixedly connected to the inside of the rotating plate 401. The other end is fixedly connected to the inside of the sliding plate 407. When the electronic product needs to be suspended for electroplating, the pulling handle 411 can be pulled outward, thereby moving the sliding plate 407 in the direction of the pulling handle 411. This causes the dynamic mounting plate 408 to retract into the mounting groove 406, and the sliding plate 407 can compress the return spring 409, allowing the roller 412 to slide off the fixed mounting plate 405. The roller 412 can then be removed from the fixed mounting plate 405 and the dynamic mounting plate 408, at which point the electronic product can be hung on the hook 418. If the electronic product to be hung is small, the retaining ring 417 can be pulled off the rotating shaft 416. If there are many electronic products to be hung, the notch of the retaining ring 417 can be aligned with the groove of the rotating shaft 416 and pressed in, thus adding the retaining ring 417 and the hook 418.

[0038] The placement mechanism 5 includes a rotating plate 501, which opens to facilitate the placement of electronic products. One side of the rotating plate 501 is rotatably connected to the outside of the roller 412. A rotating hollow shaft 502 is fixedly connected to the bottom end of the rotating plate 501, providing an installation position. Two locking plates 503 are rotatably connected to both sides of the rotating hollow shaft 502, which can lock onto the roller 412 to prevent the rotating plate 501 from opening. A fixing post 504 is fixedly connected between the two locking plates 503. A torsion spring 505 is sleeved on the outside of the fixing post 504. The torsion spring 505 uses its own reaction force to reset the locking plates 503. One end of the torsion spring 505 is fixedly connected to the inside of the rotating hollow shaft 502, and the other end is fixedly connected to... When electronic products need to be placed inside the roller 412, the clamping plate 503 needs to be rotated. The clamping plate 503 drives the fixed column 504 to rotate, thereby compressing the torsion spring 505. After the clamping plate 503 rotates upward out of the middle of the roller 412, the two clamping plates 503 can be released from the roller 412. At this time, the rotating plate 501 can be rotated upward to open it, and the electronic products can be placed inside the roller 412. Then, the rotating plate 501 is rotated downward to release the clamping plate 503. At this time, under the reaction force of the torsion spring 505, the fixed column 504 can be rotated in reverse, which in turn can rotate the clamping plate 503 in reverse, so that the two clamping plates 503 can rotate and engage on the roller 412, thereby completing the closing of the rotating plate 501.

[0039] The drying mechanism 6 includes a fixed box 601, which provides an installation position. The bottom of the fixed box 601 is fixedly connected to the top of the mounting frame 2. A partition 602 is fixedly connected to the middle of the fixed box 601, providing the installation position. Multiple air guide plates 603 are fixedly connected to the top of the partition 602, guiding the flow of gas and diffusing it into the interior of the fixed box 601. An inner plate 604 is slidably connected to the bottom of the interior of the fixed box 601, providing the installation position. An electric heating wire 605 is fixedly connected inside the inner plate 604, providing heating conditions. A baffle 606 is fixedly connected to the outside of the electric heating wire 605, and the baffle 606 is interlocked with the inner wall of the fixed box 601 to engage inside the fixed box 601. A fixing tube 607 is fixedly connected to the top of the fixed box 601, and the bottom of the fixing tube 607 is fixed... The connecting hose 608 and the fixed pipe 607 are connected to allow gas to pass through. The end of the connecting hose 608 away from the fixed pipe 607 is fixedly connected to the outside of the mounting box 403. The baffle 606 is set on the outside of the fixed box 601. Ventilation holes are opened on the top of the fixed box 601 and the top of the mounting frame 2. When high-pressure gas enters the fixed box 601 through the mounting box 403, it enters the interior of the fixed box 601 through the connecting hose 608 and the fixed pipe 607. The air guide plate 603 can guide the gas into the interior of the fixed box 601. The gas is heated by the heating wire 605 to a certain temperature. The high-temperature gas is used to dry the cleaned electronic products. At the same time, since the baffle 606 and the outer wall of the fixed box 601 are interference fit, the heating wire 605 can be pulled out of the fixed box 601 by pulling the baffle 606 outward, so as to facilitate the replacement of the heating wire 605.

[0040] Working principle: After the motor 304 is started, the output end of the motor 304 drives the threaded rod 305 to rotate. When the threaded rod 305 rotates, it can drive the sliding frame 302 to move laterally along the outside of the fixed rail 301. After moving to the top of the pretreatment tank 101, the pure water tank 102 and the electroplating tank 103, the hydraulic cylinder 303 is started. After the output end of the hydraulic cylinder 303 extends, it can drive the mounting frame 306 to move downward, thereby moving the dynamic placement mechanism 4 downward. Then, the dynamic placement mechanism 4 can be submerged in one of the pretreatment tank 101, the pure water tank 102 and the electroplating tank 103, thereby completing the automatic placement of electronic products into the electroplating device 1 for electroplating.

[0041] By opening the placement mechanism 5, electronic products are placed inside the drum 412. The rotating plate 401, stirring blade 402, fixed mounting plate 405, and drum 412 are then placed inside the electroplating apparatus 1. At this time, the air pump 413 is activated, generating high-pressure gas which enters the mounting box 403 through the ventilation hose 414. This drives the impeller 404 to rotate, which in turn drives one of the rotating plates 401 to rotate. The rotating plate 401 then passes through the fixed mounting plate 405 and the dynamic mounting plate 402. 8 drives the drum 412 to rotate, thereby driving the electronic products inside the drum 412 to rotate, so that each side of the electronic products can be electroplated. At the same time, when the original plate 401 rotates, it drives the stirring blade 402 to rotate. When the stirring blade 402 rotates, it can stir the liquid inside the pretreatment tank 101, the pure water tank 102 or the electroplating tank 103, thereby eliminating local concentration differences in the electroplating solution. At the same time, the flowing liquid can forcibly bring in metal ions, reduce the problem of missed plating or the plating layer being too thin, and improve the uniformity of the plating layer.

[0042] When electronic products need to be suspended for electroplating, the pull handle 411 can be pulled outward, thereby moving the sliding plate 407 in the direction of the pull handle 411. This causes the dynamic mounting plate 408 to retract into the mounting groove 406, and the sliding plate 407 can compress the return spring 409. Then, the roller 412 slides out from the fixed mounting plate 405 and can be removed from the fixed mounting plate 405 and the dynamic mounting plate 408. At this time, the electronic products can be hung on the hook 418. If the electronic products to be hung are small, the locking ring 417 can be pulled down from the rotating shaft 416. If there are many electronic products to be hung, the notch of the locking ring 417 can be aligned with the groove of the rotating shaft 416 and pressed in. Then, the locking ring 417 can be added and the hook 418 can be added.

[0043] When electronic products need to be placed inside the roller 412, the clamping plate 503 needs to be rotated. The clamping plate 503 drives the fixed column 504 to rotate, thereby compressing the torsion spring 505. After the clamping plate 503 rotates upward out of the middle of the roller 412, the two clamping plates 503 can be released from the roller 412. At this time, the rotating plate 501 can be rotated upward to open it, and the electronic products can be placed inside the roller 412. Then, the rotating plate 501 is rotated downward and the clamping plate 503 is released. At this time, under the reaction force of the torsion spring 505, the fixed column 504 can be rotated in reverse, which in turn can rotate the clamping plate 503 in reverse, so that the two clamping plates 503 can rotate and engage on the roller 412, thereby completing the closing of the rotating plate 501.

[0044] When high-pressure gas enters the mounting box 403, the connecting hose 608 and the fixing pipe 607, and then enters the interior of the fixing box 601, the air guide plate 603 can guide the gas into the interior of the fixing box 601. The gas is heated by the heating wire 605 to a certain temperature, and the high-temperature gas is used to dry the cleaned electronic products. At the same time, since the baffle 606 and the outer wall of the fixing box 601 are interference fit, the heating wire 605 can be pulled out of the fixing box 601 by pulling the baffle 606 outward, thus facilitating the replacement of the heating wire 605.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intelligent processing apparatus for electronic product components, comprising an electroplating apparatus (1), characterized in that, The electroplating device (1) is fixedly connected to the top of a mounting frame (2), which is used for electroplating of electronic products. The mounting frame (2) is equipped with a moving mechanism (3), and the bottom of the moving mechanism (3) is equipped with a dynamic placement mechanism (4). The moving mechanism (3) drives the dynamic placement mechanism (4) to move. The dynamic placement mechanism (4) can place electronic products. The outside of the dynamic placement mechanism (4) is equipped with a placement mechanism (5), which is used to put electronic products into the inside of the dynamic placement mechanism (4). The top of the mounting frame (2) is equipped with a drying mechanism (6), which is used to dry electronic products.

2. The intelligent processing device for electronic product components according to claim 1, characterized in that, The moving mechanism (3) includes two fixed rails (301), the two fixed rails (301) are respectively fixedly connected to the inside sides of the mounting frame (2), a sliding frame (302) is slidably connected between the two fixed rails (301), a hydraulic cylinder (303) is fixedly connected to the top of the sliding frame (302), a motor (304) is fixedly connected to the outside of the mounting frame (2), a threaded rod (305) is fixedly connected to the output end of the motor (304), and a mounting frame (306) is fixedly connected to the output end of the hydraulic cylinder (303).

3. The intelligent processing device for electronic product components according to claim 2, characterized in that, The dynamic placement mechanism (4) includes two rotating plates (401). The outer sides of the two rotating plates (401) are rotatably connected to the bottom sides of the mounting frame (306). A mounting box (403) is fixedly connected to one side of the mounting frame (306). An impeller (404) is rotatably connected inside the mounting box (403). The middle part of one of the rotating plates (401) is fixedly connected to the middle part of the impeller (404). Multiple stirring blades (402) are fixedly connected to the outside of the rotating plate (401). A fixed mounting plate (405) is fixedly connected to the side of one of the rotating plates (401) away from the mounting box (403). An installation groove (406) is opened inside the other rotating plate (401). A sliding plate (407) is slidably connected inside the installation groove (406). Multiple return springs (409) are provided inside the installation groove (406). A dynamic mounting plate (408) is fixedly connected to the side of the sliding plate (407) away from the return spring (409). A driving rod (410) is fixedly connected to the middle of the sliding plate (407). A roller (412) is provided between the fixed mounting plate (405) and the outside of the dynamic mounting plate (408). An air pump (413) is fixedly connected to the outside of the electroplating device (1). An air hose (414) is fixedly connected to the output end of the air pump (413). One end of the air hose (414) away from the air pump (413) is fixedly connected to the outside of the mounting box (403). Two fixed rods (415) are fixedly connected between the two rotating plates (401). Multiple rotating shafts (416) are rotatably connected to the outside of the fixed rods (415). A locking ring (417) is provided on the outside of the rotating shafts (416). A hook (418) is fixedly connected to the outside of the locking ring (417).

4. The intelligent processing device for electronic product components according to claim 3, characterized in that, The loading mechanism (5) includes a rotating plate (501), one side of which is rotatably connected to the outside of the roller (412). A rotating hollow shaft (502) is fixedly connected to the bottom end of the rotating plate (501). A clamping plate (503) is rotatably connected to both sides of the rotating hollow shaft (502). A fixing post (504) is fixedly connected between the two clamping plates (503). A torsion spring (505) is sleeved on the outside of the fixing post (504). One end of the torsion spring (505) is fixedly connected to the inside of the rotating hollow shaft (502), and the other end of the torsion spring (505) is fixedly connected to the outside of the fixing post (504).

5. The intelligent processing device for electronic product components according to claim 3, characterized in that, The drying mechanism (6) includes a fixed box (601), the bottom of which is fixedly connected to the top of the mounting frame (2). A partition (602) is fixedly connected to the middle of the fixed box (601), and a plurality of air guide plates (603) are fixedly connected to the top of the partition (602). An internal plate (604) is slidably connected to the bottom of the fixed box (601). An electric heating wire (605) is fixedly connected inside the internal plate (604), and a baffle (606) is fixedly connected to the outside of the electric heating wire (605). A fixed tube (607) is fixedly connected to the top of the fixed box (601), and a connecting hose (608) is fixedly connected to the bottom of the fixed tube (607). One end of the connecting hose (608) away from the fixed tube (607) is fixedly connected to the outside of the mounting box (403).

6. The intelligent processing device for electronic product components according to claim 2, characterized in that, One of the fixed rails (301) is externally fixedly connected to a stabilizing block (307), and the end of the threaded rod (305) away from the motor (304) is rotatably connected to the inner side of the stabilizing block (307) near the motor (304).

7. The intelligent processing device for electronic product components according to claim 3, characterized in that, The driving rod (410) is fixedly connected to a pull handle (411) on the side away from the sliding plate (407), and the driving rod (410) is slidably connected to the middle of one of the rotating original plates (401).

8. The intelligent processing device for electronic product components according to claim 3, characterized in that, One end of the return spring (409) is fixedly connected to the inside of the rotating original plate (401), and the other end of the return spring (409) is fixedly connected to the inside of the sliding plate (407).

9. The intelligent processing device for electronic product components according to claim 1, characterized in that, A pretreatment tank (101) is provided inside one side of the electroplating device (1), a pure water tank (102) is provided in the middle of the electroplating device (1), and an electroplating tank (103) is provided inside the electroplating device (1) on the side away from the pretreatment tank (101).

10. The intelligent processing device for electronic product components according to claim 5, characterized in that, The baffle (606) is disposed outside the fixing box (601), and ventilation holes are provided on the top of the fixing box (601) and the top of the mounting frame (2).

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