Double-layer slit valve, disassembly and assembly method thereof and processing equipment of semiconductor device

Abstract

The invention provides a double-layer slit valve, a dismounting and mounting method thereof and processing equipment of a semiconductor device. The double-layer slit valve comprises a valve box, a lower valve and an upper valve. The valve box is arranged between a load latching cavity and a transmission cavity of the thin film deposition equipment, a first opening is formed in the lower surface of the valve box, and a second opening aligned with the first opening is formed in the upper surface of the valve box. The lower valve includes a first driver and a first valve plate. The first driver is mounted in the first opening, a mounting plate is arranged at the tail end, facing the first opening, of the first driver, and a first screw hole is formed in the upper surface of the mounting plate. The upper surface of the first valve plate is provided with a transverse extension part with a through hole, and the transverse extension part is mounted on the mounting plate through the second opening, then is fixed on the mounting plate through a first bolt which sequentially penetrates through the through hole and the first screw hole aligned with the through hole, and extends into or retreats from the first opening under the driving of the first driver. The upper valve comprises a second driver and a second valve plate, the second driver is installed in the second opening, and the second valve plate is driven by the second driver to stretch into or retreat from the second opening.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing, and more particularly to a double-layer slit valve and its disassembly and assembly method, as well as a semiconductor device processing equipment. Background Technology

[0002] With the continuous development of semiconductor equipment, the dual-layer structure design of the load latch cavity in the transfer platform has become more common due to the need to increase wafer transfer capacity and meet the heating or cooling functions in wafer processes. In the existing technology, the transfer platform uses a dual-layer slit valve (SLV) design between the load latch cavity (LL) and the transfer module (TM). This dual-layer slit valve typically consists of two transfer gate valves and a dual-layer valve box.

[0003] However, due to space constraints and other factors, maintenance and valve plate replacement on the lower level are less convenient than on the upper level. This can lead to particulate contaminants (Pa) generated during installation, increasing maintenance time. Furthermore, since the transfer valve consists of a valve plate and a mounting shaft on the driver, relative movement between the valve plate and the mounting shaft during valve opening and closing inevitably generates some metallic particulate contaminants (Pa). Because the upper-level transfer valve is installed upside down, there is a risk of particulate contaminants falling onto the wafer, affecting wafer yield.

[0004] In order to overcome the defects existing in the prior art, this application provides a novel double-layer slit valve structure and its installation method, as well as a semiconductor device processing equipment, to avoid the trouble of disassembling the valve, thereby improving maintenance efficiency and avoiding particulate matter contamination caused by inserting and removing the valve plate from the mounting shaft in situ between the load latching chamber and the transmission chamber. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the shortcomings of the existing technology, this application provides a novel double-layer slit valve structure and its installation method, as well as a semiconductor device processing equipment. The valve plates of the upper and lower valves are disassembled through a second opening, avoiding the inconvenience of disassembling the lower valve and improving maintenance efficiency. Furthermore, this application uses vertically detachable bolts to fix the lateral extension of the first valve plate to the mounting plate, preventing particulate contamination caused by inserting and removing the valve plate from its original position between the load latching chamber and the transmission chamber.

[0007] Specifically, a first aspect of the present invention provides a double-layer slit valve, comprising a valve housing, a lower valve, and an upper valve. The valve housing is disposed between the load latching chamber and the transfer chamber of a thin-film deposition apparatus, having a first opening on its lower surface and a second opening aligned with the first opening on its upper surface. The lower valve comprises a first actuator and a first valve plate. The first actuator is mounted on the first opening, and a mounting plate is provided at its end facing the first opening. The upper surface of the mounting plate has a lateral extension with a through hole, which is mounted to the mounting plate via the second opening and then fixed to the mounting plate by a first bolt passing through the through hole and aligned with the first screw hole, and extends into or retracts from the first opening under the drive of the first actuator. The upper valve comprises a second actuator and a second valve plate, the second actuator being mounted on the second opening, and the second valve plate extending into or retracting from the second opening under the drive of the second actuator.

[0008] Furthermore, in some embodiments of the present invention, the upper surface of the mounting plate is provided with a plurality of the first screw holes. The upper surface of the first valve plate is provided with a corresponding number of the plurality of the lateral extensions, wherein each of the lateral extensions is provided with a through hole, and the plurality of the first bolts pass through the corresponding through holes and their aligned first screw holes in sequence to fix the first valve plate to the mounting plate.

[0009] Furthermore, in some embodiments of the present invention, the mounting plate has at least one longitudinally extending first protrusion on the side facing the first valve plate, and the first valve plate has at least one longitudinally extending second protrusion at a corresponding position facing the side of the mounting plate. The first valve plate first reaches the mounting plate through the second opening, and then slides down under the guidance of the first protrusion and the second protrusion to be installed on the mounting plate, and the through hole is aligned with the corresponding first screw hole.

[0010] Furthermore, in some embodiments of the present invention, the mounting plate includes a heavy mounting plate body and a lightweight adapter plate. The mounting plate body is located at the end of the first driver facing the first opening, and its side has a plurality of laterally arranged threaded through holes. The adapter plate is located on the side of the mounting plate body facing the first valve plate, and its side has a corresponding number of a plurality of second screw holes at corresponding positions, for fixing to the mounting plate body via second bolts that pass sequentially through each of the threaded through holes and the aligned second screw holes.

[0011] Furthermore, in some embodiments of the present invention, the first screw hole is provided on the upper surface of the adapter plate. A corresponding notch for accommodating the nut of the first bolt is also provided on the upper surface of the adapter plate, and / or the first protrusion / contour portion is provided on the side of the adapter plate facing the first valve plate.

[0012] Furthermore, in some embodiments of the present invention, the double-layer slit valve further includes an isolation plate. This isolation plate is detachably mounted between the lower and upper layers of the load latching cavity and the transmission cavity via the second opening to isolate the lower and upper layers of the load latching cavity and the transmission cavity.

[0013] Furthermore, according to a second aspect of the present invention, a method for disassembling and assembling a double-layer slit valve includes the following steps in the disassembly phase: first, removing the upper valve of the double-layer slit valve as provided in the first aspect of the present invention from a second opening on the upper surface of the valve housing of the double-layer slit valve to expose the second opening; then, removing the first bolt from the mounting plate at the first actuator end of the lower valve of the double-layer slit valve through the second opening; and finally, removing the first valve plate of the lower valve from the mounting plate through the second opening.

[0014] Furthermore, in some embodiments of the present invention, the double-layer slit valve includes a lower and upper isolation plate separating the load latching chamber and the transmission chamber. After removing the upper valve and before removing the first bolt, the disassembly method further includes the step of removing the isolation plate via the second opening.

[0015] Furthermore, in some embodiments of the present invention, after removing the first valve plate of the lower valve from the mounting plate, the disassembly method further includes the following steps: cleaning or replacing the first valve plate, and / or cleaning or replacing the second valve plate of the upper valve.

[0016] Furthermore, in some embodiments of the present invention, the installation phase of the disassembly and assembly method includes the following steps: after installing the first actuator of the lower valve to the first opening on the lower surface of the valve box, firstly installing the first valve plate to the mounting plate of the lower valve through the second opening, and then sequentially screwing the first bolt into the through hole of the lateral extension portion on the upper surface of the first valve plate and the first screw hole on the upper surface of the mounting plate through the second opening to fix the first valve plate to the mounting plate. Finally, the upper valve is installed to the second opening of the valve box.

[0017] Furthermore, a semiconductor device processing apparatus according to a third aspect of the present invention includes a front-end module, a load latch cavity, a transfer cavity, and a process cavity. The front-end module acquires a wafer to be processed from an external source and returns a processed wafer to the external source. The load latch cavity acquires the wafer to be processed from the front-end module and returns the processed wafer to the front-end module. The transfer cavity acquires the wafer to be processed from the load latch cavity and returns the processed wafer to the load latch cavity, wherein a double-slit valve as provided in the first aspect of the present invention is provided between the load latch cavity and the transfer cavity. The process cavity acquires the wafer to be processed from the transfer cavity, performs processing on it, and returns the processed wafer to the transfer cavity. Attached Figure Description

[0018] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0019] Figures 1A to 1C A schematic diagram of the structure of a double-slit valve in the prior art is shown.

[0020] Figure 2 A schematic diagram of a semiconductor device processing apparatus provided according to some embodiments of the present invention is shown.

[0021] Figures 3A-3B A schematic diagram of the structure of a double-slit valve provided according to some embodiments of the present invention is shown.

[0022] Figures 4A-4B A schematic diagram of the lower valve structure in a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0023] Figures 5A to 5C A schematic diagram of the split structure of the mounting plate in a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0024] Figures 6A-6BA schematic diagram of the structure of the mounting plate and valve plate in a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0025] Figures 7A-7B A schematic diagram of the structure of a double-layer slit valve box in the prior art is shown.

[0026] Figures 8A-8B A schematic diagram of the structure of a double-layer slit valve box provided according to some embodiments of the present invention is shown.

[0027] Figures 9A-9B A schematic diagram of the disassembly and assembly structure of a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0028] Figure Labels

[0029] 201 Transmission cavity

[0030] 202 Double-layer slit valve

[0031] 203 Load latch cavity

[0032] 31 Valve Box

[0033] 32 Lower valve

[0034] 33 Upper Valve

[0035] 331 Second Driver

[0036] 332 Second Valve Plate

[0037] 41 First Driver

[0038] 42 First valve plate

[0039] 421 First concave-convex part

[0040] 43 Mounting Plate

[0041] 431 Second concave-convex part

[0042] 44 First screw hole

[0043] 441 First Bolt

[0044] 51 Mounting plate body

[0045] 52 Adapter Board

[0046] 53 Second screw hole

[0047] 531 Second Bolt

[0048] 8. Isolation panels

[0049] 81 Fixing screws

[0050] 82 Isolation plate sealing ring Detailed Implementation

[0051] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0052] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0053] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0054] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0055] As mentioned above, in existing technologies, the transfer platform typically employs a double-layer slit valve (SLV) design between the load latch chamber (LL) and the transfer module (TM). This double-layer slit valve usually consists of three parts: upper and lower transfer valves and a double-layer valve box. The upper and lower transfer valves are composed of a valve plate and a valve actuator. In the original slit valve, the upper and lower layers of the double-layer valve box are not connected for sealing purposes. Please refer to... Figures 1A to 1C , Figures 1A to 1C A schematic diagram of the structure of a double-slit valve in the prior art is shown.

[0056] Depend on Figures 1A to 1C It is known that in the prior art, the double-layer slit valve consists of a valve plate, an actuator, and a valve box. The valve plate has a mounting port, and the actuator has a mounting shaft. From Figures 1B-1C As can be seen, to match the valve plate's mounting opening, the mounting shaft is designed as a round shaft with flat front and rear ends. The screw first passes through the mounting shaft from the back and then is screwed onto the valve plate for fixation. Analysis of the theoretical dimensions of the original valve plate and mounting shaft shows that the valve plate's mounting opening is slightly larger than the mounting shaft's mounting dimensions. This is because the valve and mounting shaft are fixed using two vacuum pins, creating a tight-fitting contact between the mounting shaft and the valve. A gap is left on the other side of the mounting shaft and valve to prevent the valve from rubbing against the mounting shaft during installation.

[0057] However, in existing double-layer slit valves, due to space constraints on the equipment, the lower layer is less convenient for maintenance and valve plate replacement than the upper layer. This can lead to particulate contaminants (Pa) generated during installation, increasing maintenance time. Furthermore, since the transfer valve consists of a valve plate and a mounting shaft on the actuator, relative movement between the valve plate and the shaft during opening and closing inevitably generates metal particulate contaminants (Pa). Because the upper transfer valve is installed upside down, the slit valve's movement involves a cylinder driving the shaft, which in turn drives the valve plate's sealing motion. The slit valve itself vibrates, and there are tolerance gaps between the shaft and bore. Additionally, the presence of two metal contact surfaces generates friction. Therefore, during wafer transfer, the opening and closing of the valves and the wafer transfer process pose a risk of metal debris and particulate contaminants falling onto the wafer, affecting wafer yield.

[0058] To overcome the shortcomings of the existing technology, this application provides a novel double-layer slit valve structure and its installation method, as well as a semiconductor device processing device. By disassembling the valve plates of the upper and lower valves through the second opening of the double-layer slit valve, the inconvenience of disassembling the lower valve is avoided, thus improving maintenance efficiency. This application also uses vertically detachable bolts in the double-layer slit valve to fix the lateral extension of the first valve plate to the mounting plate, preventing particulate contamination caused by inserting and removing the valve plate in situ from the mounting shaft between the load latching chamber and the transmission chamber.

[0059] In some non-limiting embodiments, the double-slit valve provided in the first aspect of the present invention can be configured in the processing equipment of the semiconductor device provided in the third aspect of the present invention to implement the disassembly and assembly method of the double-slit valve provided in the second aspect of the present invention.

[0060] Please refer to Figure 2 , Figure 2 A schematic diagram of a semiconductor device processing apparatus provided according to some embodiments of the present invention is shown.

[0061] like Figure 2 As shown, the semiconductor device processing apparatus provided in the third aspect of the present invention includes an Equipment front-end module (EFEM), a Load Lock (LL), a Transfer Module (TM), and a Processing Module (PM). The Equipment front-end module (not shown) acquires a wafer to be processed from an external source and returns a processed wafer to the external source. The Load Lock Module 203 acquires a wafer to be processed from the Equipment front-end module and returns a processed wafer to the Equipment front-end module. The Transfer Module 201 acquires a wafer to be processed from the Load Lock Module 203 and returns a processed wafer to the Load Lock Module 203. A double-layer slit valve 202 is provided between the Load Lock Module 203 and the Transfer Module 201. The double-layer slit valve 202 is fixed between the Transfer Module 201 and the Load Lock Module 203 and is responsible for sealing and facilitating the transfer between the upper and lower chambers of the Load Lock Module 203 and the Transfer Module 201. The process cavity (not shown in the figure) obtains the wafer to be processed from the transfer cavity 201, performs the processing on it, and returns the processed wafer to the transfer cavity 201.

[0062] The double-layer slit valve provided in the first aspect of the present invention will now be described in detail. Please refer to Figures 3 to 6. Figures 3A-3B A schematic diagram of the structure of a double-slit valve provided according to some embodiments of the present invention is shown. Figures 4A-4B A schematic diagram of the lower valve structure in a double-layer slit valve provided according to some embodiments of the present invention is shown. Figures 5A to 5CA schematic diagram of the split structure of the mounting plate in a double-layer slit valve provided according to some embodiments of the present invention is shown. Figures 6A-6B A schematic diagram of the structure of the mounting plate and valve plate in a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0063] like Figures 3A-3B As shown, in some embodiments of the present invention, the double-layer slit valve includes a valve housing 31, a lower valve 32, and an upper valve 33. The valve housing 31 is disposed between the load latching chamber 203 and the transfer chamber 201 of the thin film deposition apparatus. The lower surface of the valve housing 31 has a first opening, and the upper surface has a second opening aligned with the first opening. The upper valve 33 includes a second actuator 331 and a second valve plate 332. The second actuator 331 is mounted in the second opening, and the second valve plate 332 extends into or retracts from the second opening under the drive of the second actuator 331 to close or open the upper layer of the load latching chamber 203 and the upper layer of the transfer chamber 201.

[0064] Further, please refer to Figure 4A In some embodiments of the present invention, the lower valve 32 includes a first actuator 41 and a first valve plate 42. The first actuator 41 is mounted on a first opening. A mounting plate 43 is disposed at the end of the first actuator 41 facing the first opening, and a first screw hole 44 is provided on the upper surface of the mounting plate 43. In the present invention, the original mounting shaft and the shaft-hole fit of the valve plate mounting hole are eliminated, and an integral mounting shaft with a "T"-shaped torsion bar is adopted. This structure can make the valve plate more evenly stressed, and will not cause relative movement between the shaft and hole of the actuator during operation due to the shaft-hole fit, thereby avoiding friction and metal fragmentation, and also avoiding scratches during installation.

[0065] Furthermore, in some embodiments of the present invention, the upper surface of the first valve plate 42 is provided with a lateral extension with a through hole, which is installed to the mounting plate 43 through the second opening, and then fixed to the mounting plate 43 by a first bolt 441 passing through the through hole and aligned with the first screw hole 44. The first valve plate 42 extends into or out of the first opening under the drive of the first driver 41 to close or open the lower layer of the load latching cavity 203 and the lower layer of the transmission cavity 201. In the present invention, the double-layer slit valve is fixed between the transmission cavity 201 and the load latching cavity 203, and is responsible for sealing and transmitting between the upper and lower chambers of the load latching cavity 203 and the transmission cavity 201. Therefore, the first valve plate 42 itself has grooves and rubber rings, which are directly attached to the sealing surface of the cavity for sealing.

[0066] Please continue to refer to Figure 4AIn some embodiments of the present invention, the upper surface of the mounting plate 43 is provided with a plurality of first screw holes 44, and the upper surface of the first valve plate 42 is provided with a corresponding number of lateral extensions, wherein each lateral extension has a through hole, and a plurality of first bolts 441 pass through the corresponding through holes and the aligned first screw holes 44 in sequence to fix the first valve plate 42 to the mounting plate 43. In this embedded mounting configuration, after the first valve plate 42 is installed on the mounting plate 43, the plurality of first bolts 441 are installed from the top through the first valve plate 42 and the mounting plate 43, fixing the first valve plate 42 and the mounting plate 43 together, while ensuring that the first valve plate 42 and the mounting plate 43 are a single unit.

[0067] Further, please refer to Figure 4B In some embodiments of the present invention, the mounting plate 43 has at least one longitudinally extending first protrusion 421 (e.g., a raised strip or a groove) on the side facing the first valve plate 42. The first valve plate 42 has at least one longitudinally extending and complementary second protrusion 431 (e.g., a groove or a raised strip) at a corresponding position on the side facing the mounting plate 43. The first valve plate 42 first reaches the mounting plate 43 through the second opening, and then slides down guided by the first protrusion 421 and the second protrusion 431 to be mounted on the mounting plate 43, and aligns the through hole with the corresponding first screw hole 44.

[0068] Further, please continue to refer to Figure 5A , Figure 5A The image illustrates a split structure for the mounting plate in a double-layer slit valve. In some embodiments of the invention, the mounting plate 43 further includes a heavy-duty (e.g., stainless steel) mounting plate body 51 and a lightweight (e.g., aluminum alloy) adapter plate 52. The mounting plate body 51 is located at the end of the first actuator 41 facing the first opening, and its side has multiple laterally arranged threaded through holes. The adapter plate 52 is located on the side of the mounting plate body 51 facing the first valve plate 42, and its side has a corresponding number of second screw holes 53 for fixing to the mounting plate 43 body via second bolts 531 that pass sequentially through each threaded through hole and aligned with the second screw holes 53. After the mounting plate is installed, its front side is as shown... Figure 5B As shown, its back side is as follows Figure 5C As shown.

[0069] Furthermore, in some embodiments of the present invention, a first screw hole 44 is provided on the upper surface of the adapter plate 52, and a corresponding position on the upper surface of the adapter plate 52 is also provided with a notch for accommodating the nut of the first bolt 441, and / or a first protrusion 421 is provided on the side of the adapter plate 52 facing the first valve plate 42.

[0070] Please continue to refer to Figures 6A-6B .like Figure 6AAs shown, in some embodiments of the present invention, the mounting plate 43 and the first valve plate 42 in the double-layer slit valve of the present invention adopt an interlocking structure. This is because the first valve plate 42 is a consumable part that needs to be replaced frequently. Therefore, the connection structure between the mounting plate 43 and the first valve plate 42 needs to consider the limited internal space of the valve box 31, taking into account both space utilization and economy. It also needs to consider the tightness and firmness of the fixation between the first valve plate 42 and the mounting plate 43, as well as the convenience of disassembly and assembly. Therefore, in the present invention, by eliminating the mounting shaft hole fit between the valve plate and the actuator, a special design form of the adapter plate 52 combined with the concave and convex inset installation of the valve plate 42 is adopted. This ensures that the first valve plate 42 and the adapter plate 52 are installed more closely and will not move relative to each other, thus better avoiding scratches during installation. It also takes into account the existing design size limitations and economy, ensuring that the thickness of the entire mounting structure is thinner and more economical, and allowing the valve plate to be easily replaced from the top without removing the lower actuator. This invention eliminates the need for screws on the back of the valve plate to fix the actuator, and instead uses a top-mounted screw fixation method, taking into full account situations requiring top disassembly. Combined with... Figure 6B As shown, the present invention uses a first screw 441 to fix the first valve plate 42 and the mounting plate 43, and a second bolt 531 to fix the adapter plate 52 and the mounting plate body 51. This fixing method makes the valve plate mounting structure more uniformly stressed, has a better sealing effect, and greatly improves the service life of consumables.

[0071] The valve box 31 will be described in detail below with reference to Figures 7 and 8. Figures 7A-7B A schematic diagram of the structure of a double-layer slit valve box in the prior art is shown. Figures 8A-8B A schematic diagram of the structure of a double-layer slit valve box provided according to some embodiments of the present invention is shown.

[0072] according to Figure 7A As shown, in the prior art, the upper and lower layers of a double-layer valve box are not connected, combined with Figure 7B The top view shows that the upper and lower layers of the valve box are enclosed. Due to space constraints and other factors, maintenance and valve plate replacement are less convenient on the lower layer than on the upper layer. Replacing valve plates on the upper and lower layers (especially the lower layer) requires disassembling the entire device, which increases the machine's maintenance time.

[0073] Please refer to further details. Figures 8A-8BIn some embodiments of the present invention, a fixing screw 81, an isolation plate 8, and an isolation plate sealing ring 82 are also provided. The isolation plate 8 is detachably installed between the lower and upper layers of the load latching cavity and the transmission cavity via a second opening to isolate the lower and upper layers of the load latching cavity and the transmission cavity, ensuring that the upper and lower layers can perform independent backfilling and vacuuming without affecting each other. The fixing screw 81 is used to fix the isolation plate 8 to the valve box 31. The isolation plate sealing ring 82 is installed in the groove of the isolation plate 8 and seals with the sealing surface of the valve box 31. Figure 8B As can be seen, the partition between the upper and lower layers inside the valve box in this invention is opened up, allowing the partition plate 8 to be disassembled to connect the upper and lower layers, thus enabling the replacement of the valve plate in the lower layer from the upper layer. Due to the limited internal space, this invention uses shallow grooves and sloping sealing surfaces for sealing, ensuring that the upper and lower layers of the partition load-locking chamber 203 can be backfilled and vacuumed independently, without affecting each other during process operations.

[0074] The following will combine Figures 9A-9B This document details the assembly and disassembly methods for double-layer slit valves. Figures 9A-9B A schematic diagram of the disassembly and assembly structure of a double-layer slit valve provided according to some embodiments of the present invention is shown.

[0075] Please refer to Figure 9A In some embodiments of the present invention, during the initial installation stage of the double-layer slit valve, the first actuator 41 of the lower valve 32 is first installed at the first opening on the lower surface of the valve box 31. Then, the first valve plate 42 is installed on the mounting plate 43 of the lower valve 32 through the second opening. Then, the first bolt 441 is screwed into the through hole of the transverse extension on the upper surface of the first valve plate 42 and the first screw hole 44 on the upper surface of the mounting plate 43 through the second opening to fix the first valve plate 42 to the mounting plate 43. Finally, the upper valve 33 is installed at the second opening of the valve box 31.

[0076] Furthermore, in some embodiments of the present invention, for a double-layer slit valve provided with an isolation plate 8, the installation stage further includes: installing the isolation plate 8 between the lower and upper layers of the load latching cavity 203 and the transmission cavity 201 of the thin film deposition apparatus via a second opening, so as to isolate the lower and upper layers of the load latching cavity 203 and the transmission cavity 201.

[0077] Furthermore, in some alternative embodiments of the present invention, the first valve plate 42 may be installed and fixed to the mounting plate 43 at the end of the first driver 41 before the first driver 41 is installed, and then the entire lower valve 32 may be installed together at the first opening of the valve box 31.

[0078] Please continue to refer to this. Figure 9AIn some embodiments of the present invention, during the disassembly stage of the double-layer slit valve, the upper valve 33 of the double-layer slit valve is first removed from the second opening on the upper surface of the valve housing 31 to expose the second opening. Then, through the second opening, the first bolt 441 is removed from the mounting plate 43 at the end of the first actuator 41 of the lower valve 32 of the double-layer slit valve. Finally, through the second opening, the first valve plate 42 of the lower valve 32 is removed from the mounting plate 43.

[0079] Furthermore, in some embodiments of the present invention, the double-layer slit valve includes a lower and upper isolation plate 8 that isolates the load latching chamber 203 and the transmission chamber 201. Therefore, after removing the upper valve 33, the isolation plate 8 is first removed through the second opening, and then the first bolt 441 is removed.

[0080] Furthermore, in some embodiments of the present invention, after the first valve plate 42 of the valve 32 is removed from the mounting plate 43, the first valve plate 42 is cleaned or replaced, and / or the second valve plate 332 of the upper valve 33 is cleaned or replaced. After this, the double-layer slit valve is reinstalled, combined with... Figure 9B As shown, the first valve plate 42 is first installed onto the mounting plate 43 of the lower valve 32 through the second opening. Then, the first bolt 441 is screwed into the through hole of the transverse extension on the upper surface of the first valve plate 42 and the first screw hole 44 on the upper surface of the mounting plate 43 through the second opening to fix the first valve plate 42 onto the mounting plate 43. Finally, the upper valve 33 is installed onto the second opening of the valve box 31.

[0081] Furthermore, in some alternative embodiments of the present invention, the reinstallation stage after cleaning or replacing the valve plate can also be carried out by first installing and fixing the first valve plate 42 to the mounting plate 43 at the end of the first driver 41 before installing the first driver 41, and then installing the entire lower valve 32 together to the first opening of the valve box 31.

[0082] Furthermore, in some embodiments of the present invention, for a double-layer slit valve with an isolation plate, the installation step after cleaning or replacing the valve plate further includes: installing the isolation plate through the second opening between the lower and upper layers of the load latching cavity 203 and the transfer cavity 201 of the thin film deposition apparatus to isolate the lower and upper layers of the load latching cavity 203 and the transfer cavity 201.

[0083] In summary, this invention provides a novel double-layer slit valve structure and its installation method, as well as a semiconductor device processing device. By disassembling the valve plates of the upper and lower valves through a second opening, valve plate replacement and maintenance are achieved without disassembling the lower valve, avoiding the inconvenience of disassembling the lower valve and improving maintenance efficiency. Furthermore, this invention uses vertically detachable bolts to fix the lateral extension of the first valve plate to the mounting plate, preventing particulate contamination caused by in-situ insertion and removal of the valve plate from the mounting shaft between the load latching chamber and the transmission chamber.

[0084] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0085] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A double-layer slit valve, characterized in that, include: A valve box is located between the load latching chamber and the transfer chamber of a thin film deposition apparatus. Its lower surface has a first opening, and its upper surface has a second opening aligned with the first opening. A lower valve includes a first actuator and a first valve plate. The first actuator is mounted on a first opening, and its end facing the first opening has a mounting plate. The upper surface of the mounting plate has a first screw hole. The upper surface of the first valve plate has a lateral extension with a through hole. The first valve plate is mounted to the mounting plate through a second opening and then fixed to the mounting plate by first bolts that pass through the through hole and the aligned first screw hole. The first valve plate extends into or retracts from the first opening under the drive of the first actuator. The upper valve includes a second actuator and a second valve plate, wherein the second actuator is mounted on the second opening, and the second valve plate extends into or retracts from the second opening under the drive of the second actuator.

2. The double-layer slit valve as described in claim 1, characterized in that, The upper surface of the mounting plate is provided with a plurality of first screw holes, and the upper surface of the first valve plate is provided with a corresponding number of the plurality of the lateral extensions, wherein each of the lateral extensions is provided with a through hole, and the plurality of first bolts pass through the corresponding through holes and the aligned first screw holes in sequence to fix the first valve plate to the mounting plate.

3. The double-layer slit valve as described in claim 1, characterized in that, The mounting plate has at least one longitudinally extending first protrusion on the side facing the first valve plate, and the first valve plate has at least one longitudinally extending second protrusion with complementary shape at the corresponding position facing the side of the mounting plate. The first valve plate first reaches the mounting plate through the second opening, and then slides down under the guidance of the first protrusion and the second protrusion to be installed on the mounting plate, and the through hole is aligned with the corresponding first screw hole.

4. The double-layer slit valve as described in claim 3, characterized in that, The mounting plate includes a heavy mounting plate body and a lightweight adapter plate. The mounting plate body is located at the end of the first driver facing the first opening, and its side has a plurality of horizontally arranged threaded through holes. The adapter plate is located on the side of the mounting plate body facing the first valve plate, and a corresponding number of second screw holes are provided on the corresponding position of its side, so as to be fixed to the mounting plate body by second bolts passing through each of the threaded through holes and the aligned second screw holes in sequence.

5. The double-layer slit valve as described in claim 4, characterized in that, The first screw hole is located on the upper surface of the adapter plate, and a corresponding notch for accommodating the nut of the first bolt is also provided on the upper surface of the adapter plate, and / or The first concave-convex portion is provided on the side of the adapter plate facing the first valve plate.

6. The double-layer slit valve as described in claim 1, characterized in that, Also includes: An isolation plate, which is detachably installed between the lower and upper layers of the load latch cavity and the transmission cavity via the second opening, to isolate the lower and upper layers of the load latch cavity and the transmission cavity.

7. A method for disassembling and assembling a double-layer slit valve, characterized in that, The disassembly phase of the disassembly method includes the following steps: Remove the upper valve of the double-layer slit valve as described in any one of claims 1 to 6 from the second opening on the upper surface of the valve box of the double-layer slit valve to expose the second opening; The first bolt is removed from the mounting plate at the first actuator end of the lower valve of the double-slit valve via the second opening; and The first valve plate of the lower valve is removed from the mounting plate via the second opening.

8. The disassembly and assembly method as described in claim 7, characterized in that, The double-layer slit valve includes a lower and upper isolation plate that separates the load latching chamber and the transmission chamber. After removing the upper valve and before removing the first bolt, the disassembly and assembly method further includes the following steps: The partition plate is removed through the second opening.

9. The disassembly and assembly method as described in claim 7, characterized in that, After removing the first valve plate of the lower valve from the mounting plate, the disassembly and assembly method further includes the following steps: Clean or replace the first valve plate; and / or Clean or replace the second valve plate of the upper valve.

10. The disassembly and assembly method as described in claim 7, characterized in that, The installation phase of the disassembly and assembly method includes the following steps: After installing the first actuator of the lower valve into the first opening on the lower surface of the valve box, the first valve plate is first installed onto the mounting plate of the lower valve through the second opening. Then, the first bolt is sequentially screwed into the through hole of the lateral extension on the upper surface of the first valve plate and the first screw hole on the upper surface of the mounting plate through the second opening to fix the first valve plate to the mounting plate; and The upper valve is installed into the second opening of the valve box.

11. A semiconductor device processing apparatus, characterized in that, include: The front-end module of the equipment acquires wafers to be processed from the outside and returns processed wafers to the outside. The load latch cavity retrieves the wafer to be processed from the front-end module of the equipment and returns the processed wafer to the front-end module of the equipment. A transfer cavity is provided to acquire the wafer to be processed from the load latch cavity and to return the processed wafer to the load latch cavity, wherein a double-layer slit valve as described in any one of claims 1 to 6 is provided between the load latch cavity and the transfer cavity; as well as The process cavity obtains the wafer to be processed from the transfer cavity, performs the processing on it, and returns the processed wafer to the transfer cavity.

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