Light emitting module, vehicle lamp and motor vehicle

Abstract

The invention provides a light emitting module, and the light emitting module comprises a conductive frame which comprises a main body and a plurality of pins; a substrate (103, 203, 303, 403, 503), the substrate being disposed on the main body of the conductive frame (103, 203, 303, 403, 503); a light source (109, 209, 309, 409, 509), the light source being disposed on the substrate or on the conductive frame; an auxiliary device (111, 211, 311, 411, 511), the auxiliary device electrically connecting the light source and the pin; and an encapsulation body (107, 207, 307, 407, 507), the encapsulation body encapsulating at least a portion of the conductive frame. The invention further provides a vehicle lamp comprising the light emitting module and a motor vehicle adopting the vehicle lamp. The vehicle lamp is used as an atmosphere lamp or a signal lamp.

Description

Technical Field

[0001] The present invention relates to a light-emitting module, a vehicle headlight including such a light-emitting module, and a motor vehicle using such a headlight. Background Technology

[0002] Currently, injection-molded light-emitting modules have been proposed. These modules include a substrate and a housing, with the housing formed from injection-molded material and integrally injection-molded with the substrate to watertightly encapsulate the main body of the substrate. However, these light-emitting modules suffer from risks of injection shrinkage and solidification, have insufficient heat dissipation performance, and the manufacturing process is not yet mature. Summary of the Invention

[0003] This invention was made to solve the above-mentioned technical problems and other potential technical problems.

[0004] According to one aspect of the present invention, a light-emitting module is provided. The light-emitting module includes: a conductive frame, comprising a main body and a plurality of pins; a substrate disposed on the main body of the conductive frame; a light source disposed on the substrate or the conductive frame; an auxiliary device electrically connected to the light source and the pins; and a package encapsulating at least a portion of the conductive frame. By adopting this technical solution of the present invention, the following beneficial effects are obtained:

[0005] The heat generated by the circuit, light source and other auxiliary devices can be directly dissipated into the surrounding environment through the conductive frame, and the thermal resistance is small, thereby improving the heat dissipation performance of the light output module.

[0006] - The light-emitting module is smaller in size, making it suitable for modular applications;

[0007] - The technology is highly mature and easy to manufacture.

[0008] Optionally, the light source and the auxiliary device are disposed on the substrate, and the package is disposed around the substrate and encapsulates at least a portion of the substrate.

[0009] Optionally, the package is formed from plastic or resin material using a transistor outline (TO) packaging process and is integrally formed with at least a portion of the substrate; the material forming the conductive frame is metal.

[0010] Optionally, the auxiliary device includes at least one of a driver IC, a capacitor, a resistor, a diode, and a TVS.

[0011] Optionally, the substrate is a component formed independently of the conductive frame, and the substrate is bonded to the body of the conductive frame by means of an adhesive; or, the substrate is soldered to the body of the conductive frame by SMT technology.

[0012] Optionally, the substrate is a ceramic PCB, FR4 PCB, or IMS board, and / or the adhesive is silver paste. By employing this technical solution of the present invention, the substrate can be formed independently. In the manufacturing process of the optical module, TO packaging technology can replace injection molding, thereby avoiding the risks of injection shrinkage and solidification.

[0013] Preferably, the light source comprises an LED chip or a packaged LED, and / or the LED is an RGB LED or a monochrome LED, wherein the monochrome LED is capable of emitting red, white, or yellow light. By employing this technical solution of the present invention, the light-emitting module can achieve the desired optical performance.

[0014] Optionally, a light-emitting aperture is provided in the package opposite to the light source, and a lens is installed in the light-emitting aperture to converge and shape the light emitted by the light source. Transparent adhesive is applied to the light-emitting aperture between the light source and the lens. By adopting this technical solution of the present invention, the light-emitting module can have the desired optical performance.

[0015] Optionally, the light-emitting module further includes a housing for accommodating at least a portion of both the encapsulation body and the lens. The lens and the housing are formed as an integral assembly using a two-color injection molding process. Alternatively, the lens is first mounted (e.g., glued, snap-fitted) to the housing, and then the lens-housing assembly is mounted to the encapsulation body; or, the lens is first mounted to the encapsulation body, and then the housing is mounted to the lens-housing assembly. By employing this technical solution of the present invention, the encapsulation body and the housing can be formed separately, thereby avoiding the risks of injection molding shrinkage and solidification.

[0016] Optionally, a first snap-fit ​​structure capable of cooperating with each other is provided on at least one of the conductive frame body and the encapsulation body and on the housing. The first snap-fit ​​structure is used to engage at least one of the conductive frame body and the encapsulation body with the housing. By adopting this technical solution of the present invention, the housing can be securely and conveniently engaged with at least one of the conductive frame body and the encapsulation body.

[0017] Optionally, the light-emitting module further includes a heat sink, and the conductive frame is attached to the heat sink using thermally conductive adhesive or thermally conductive silicone grease. A second snap-fit ​​structure is provided on the heat sink and the housing, which can cooperate with each other. The second snap-fit ​​structure is used to engage the heat sink and the housing together. By adopting this technical solution of the present invention, the heat dissipation performance of the light-emitting module can be further improved, and assembly is facilitated.

[0018] According to another aspect of the present invention, a vehicle lamp is provided. The vehicle lamp includes: a light-emitting module as described in the preceding aspect; and a light guide connected to the light-emitting module to guide the light emitted by the light-emitting module. By employing this technical solution of the present invention, the light-emitting module is applied to a vehicle lamp, thereby enabling the vehicle lamp to obtain all the beneficial effects of the light-emitting module of the present invention.

[0019] According to another aspect of the present invention, a motor vehicle is provided. The motor vehicle includes a headlight as described in the preceding aspect, the headlight being used as an ambient light or a signal light. By employing this technical solution of the present invention, a light-emitting module is applied to a motor vehicle, thereby enabling the motor vehicle to obtain all the beneficial effects of the light-emitting module of the present invention. Attached Figure Description

[0020] To facilitate understanding of the invention, it is described in more detail below based on exemplary embodiments and in conjunction with the accompanying drawings. The same or similar reference numerals are used in the drawings to denote the same or similar components. It should be understood that the drawings are merely schematic, and the dimensions and scale of the components in the drawings are not necessarily precise.

[0021] Figure 1A and Figure 1B These are, respectively, a perspective view and a front view of the light-emitting module according to the first embodiment of the present invention.

[0022] Figure 1C It is along Figure 1B The cross-sectional view taken from section C1-C1 in the image.

[0023] Figure 1D yes Figures 1A to 1C The diagram shown is a schematic circuit diagram of the light-emitting module.

[0024] Figure 2 As shown Figures 1A to 1C The manufacturing steps of the light-emitting module are shown.

[0025] Figure 3A and Figure 3B These are, respectively, a perspective view and a front view of the light-emitting module according to the second embodiment of the present invention.

[0026] Figure 3C It is along Figure 3BThe cross-sectional view taken from section C2-C2 in the image.

[0027] Figure 4 As shown Figures 3A to 3C The manufacturing steps of the light-emitting module are shown.

[0028] Figure 5A and Figure 5B These are, respectively, a perspective view and a front view of the light-emitting module according to the third embodiment of the present invention.

[0029] Figure 5C It is along Figure 5B The cross-sectional view taken from section C3-C3.

[0030] Figure 6 As shown Figures 5A to 5C The manufacturing steps of the light-emitting module are shown.

[0031] Figure 7A and Figure 7B These are, respectively, a perspective view and a front view of the light-emitting module according to the fourth embodiment of the present invention.

[0032] Figure 7C It is along Figure 7B The cross-sectional view taken from section C4-C4.

[0033] Figure 8 As shown Figures 7A to 7C The manufacturing steps of the light-emitting module are shown.

[0034] Figure 9A and Figure 9B These are, respectively, a perspective view and a front view of the light-emitting module according to the fifth embodiment of the present invention.

[0035] Figure 9C It is along Figure 9B The cross-sectional view taken from section C5-C5.

[0036] Figure 10 As shown Figures 9A to 9C The manufacturing steps of the light-emitting module are shown.

[0037] Figure 11A and Figure 11B They are optical guides and such Figures 7A to 7C The diagram shows a perspective view and a front view of the light-emitting module assembly.

[0038] Figure 11C It is along Figure 11B The cross-sectional view taken from section C6-C6 in the image. Detailed Implementation

[0039] Figure 1A and Figure 1BThese are, respectively, a perspective view and a front view of the light-emitting module according to the first embodiment of the present invention. Figure 1C It is along Figure 1B The cross-sectional view taken from section C1-C1 in the image. Figure 1D yes Figures 1A to 1C The diagram shown is a schematic circuit diagram of the light-emitting module. Figure 2 As shown Figures 1A to 1C The manufacturing steps of the light-emitting module are shown.

[0040] like Figures 1A to 2 As shown, the light-emitting module 100 according to the first embodiment of the present invention includes: a conductive frame 101, a substrate 103, a light source 109, an auxiliary device 111, and a package 107. The conductive frame 101 includes a main body and a plurality of pins 102a, 102b, 102c, and 102d. The plurality of pins 102a, 102b, 102c, and 102d are disposed on one side of the conductive frame 101. One pin 102a extends from the main body of the conductive frame 101, and the other three pins 102b, 102c, and 102d are electrically connected to the main body of the conductive frame 101 via gold wire. The substrate 103 is disposed on the main body of the conductive frame 101, and circuitry is disposed on the substrate 103, for example, see [reference needed]. Figure 1D The circuit shown includes a light source 109 and an auxiliary device 111, both of which are disposed on a substrate 103. The auxiliary device 111 is electrically connected to the light source 109 and pins 102a, 102b, 102c, and 102d. A package 107 is disposed around the substrate 103 and encapsulates at least a portion of the conductive frame 101 and at least a portion of the substrate 103. The package 107 can be formed from plastic or resin material using a TO (Transistor Outline) packaging process and is integrally formed with at least a portion of the substrate 103. The substrate 103 is disposed on the front side of the main body of the conductive frame 101, while the back side is exposed from the package 107, which can further improve heat dissipation performance.

[0041] exist Figure 1DIn this embodiment, the light source 14 may consist only of LEDs capable of emitting white light, LEDs capable of emitting amber (i.e., yellow) light, or LEDs capable of emitting red light. In this case, the auxiliary device 111 includes: filter capacitors C1, C2, and C3, which are electrically connected between the ground pin GND and other pins, such as the first signal pin PTC, the second signal pin BIN, and the power supply pin POWER, respectively, and are used to filter out interference signals; a thermistor RT1, which is electrically connected between the first signal pin PTC and the ground pin GND, and is used to detect the temperature of the light source 109; and a category detection resistor R1, which is electrically connected between the second signal pin BIN and the ground pin GND, and is used to detect the category of the light source 109. It is worth noting that the circuit structure can be adapted to various applications; for example, the LED can be an RGB LED, with a built-in or external driver IC, etc. This application does not specifically limit the specific circuit configuration in the light-emitting module.

[0042] In this embodiment, the substrate 103 is a component formed independently of the conductive frame 101 and is bonded to the body of the conductive frame 101 by means of an adhesive. Optionally, the substrate 103 is a PCB (especially a ceramic PCB), and / or the adhesive is a locally adhesive and additionally thermally conductive silver paste. The conductive frame 101 can be a generally sheet-like component made of a suitable metal (e.g., copper or aluminum) or alloy. The circuitry on the substrate 103 can be connected to corresponding pins 102a, 102b, 102c, 102d via wiring (e.g., gold wire) 113. In this way, the heat generated by the substrate 103 and the auxiliary devices mounted on the substrate 103 (described later) can be easily transferred to the conductive frame 101 and then directly dissipated into the surrounding environment with low thermal resistance, thereby improving the heat dissipation performance of the light-emitting module 100.

[0043] Preferably, the light source 109 is an unpackaged LED chip, which ensures higher efficiency and lower cost; however, packaged LEDs can also be used. And / or the LED is selected from RGB LEDs or monochrome LEDs. RGB LEDs include LEDs capable of emitting red light, LEDs capable of emitting green light, and LEDs capable of emitting blue light; monochrome LEDs can emit white, red, or yellow light. The pins of the light source 109 can be connected to the circuitry on the substrate 103 via wiring (e.g., gold wire).

[0044] Depending on the needs of the actual circuit, one or more of the following can be disposed on the substrate 103: a driver IC, a capacitor, a resistor, a diode, and a TVS diode. The driver IC can control the light output of the LED in the light source 109, and the capacitor can be used for filtering. These devices work together with the light source 109 to control the light output of the light source 109, and are therefore collectively referred to as auxiliary devices 111. However, in some embodiments, the driver IC is integrated with the LED chip, called a smart LED. Some of these auxiliary devices generate heat during use, and it is understood that the light source 109 will also generate some heat.

[0045] A light-emitting aperture 115 is provided in the package 107 at a position opposite to the light source 109. A lens 105 is installed in the light-emitting aperture 115, which is used to converge and shape the light emitted by the light source 109. The lens 105 can be a bicolor lens. Preferably, before installing the lens 105 into the light-emitting aperture 115, a transparent adhesive (e.g., protective silicone) 117 is applied to the light-emitting aperture 115 to protect the light source 109. This is especially important when the light source 109 includes an unpackaged LED chip, as the transparent adhesive 117 can effectively prevent the light source 109 from being contaminated by subsequent processes. If the light source 109 uses a pre-packaged LED, the transparent adhesive 117 may not be applied.

[0046] Next, refer to Figure 2 The manufacturing steps of the optical module 100 are described.

[0047] First, such as Figure 2 As shown in step (A), a generally sheet-like conductive frame 101 is provided, with multiple pins 102a, 102b, 102c, and 102d extending from the body of the conductive frame 101, and an area reserved on the body of the conductive frame 101 for mounting a substrate 103. In this embodiment, the substrate 103 is formed independently of the conductive frame 101.

[0048] Then, as Figure 2 As shown in step (B), the substrate 103 is mounted onto the main body of the conductive frame 101. Silver paste can be applied between the mating surfaces of the substrate 103 and the main body of the conductive frame 101, and the substrate 103 is bonded to the front side of the main body of the conductive frame 101 using the silver paste. Alternatively, SMT (Surface Mount Technology) can be used to solder the substrate 103 to the front side of the main body of the conductive frame 101.

[0049] Then, as Figure 2As shown in step (C), a light source 109, such as an LED, and auxiliary devices 111, such as a driver IC, capacitors, resistors, diodes, TVS, etc., are mounted onto the substrate 103. Wiring (e.g., aluminum wire) 113 is used to connect the circuitry on the substrate 103 to corresponding pins 102a, 102b, 102c, 102d, and wiring (e.g., gold wire) is used to connect the pins of the light source 109 to the circuitry on the substrate 103. Aluminum wire is cheaper, while gold wire is thinner.

[0050] Then, as Figure 2 As shown in step (D), a package 107 is formed using a plastic or resin material through a TO encapsulation process, such that the package 107 encapsulates at least a portion of the substrate 103 and is integrally formed with at least a portion of the substrate 103. In this embodiment, the package 107 also encapsulates a portion of the main body of the conductive frame 101. As mentioned above, a light-emitting hole 115 is provided in the package 107 at a position opposite to the light source 109.

[0051] Then, as Figure 2 As shown in step (E), transparent adhesive (e.g., protective silicone) 117 is applied to the light-emitting aperture 115 to protect the light source 109. If the light source 109 is a pre-encapsulated LED, the transparent adhesive 117 may not be applied, and this step can be omitted.

[0052] Finally, as Figure 2 As shown in step (F), the lens 105 is mounted (e.g., glued) into the light exit aperture 115. This produces a light exit module 100 with a TO package.

[0053] Figure 3A and Figure 3B These are, respectively, a perspective view and a front view of the light-emitting module according to the second embodiment of the present invention. Figure 3C It is along Figure 3B The cross-sectional view taken from section C2-C2 in the image. Figure 4 As shown Figures 3A to 3C The manufacturing steps of the light-emitting module are shown.

[0054] like Figures 3A to 4 As shown, the light-emitting module 200 according to the second embodiment of the present invention has the same basic structure as the light-emitting module 100 described above, and the main differences between the two are as follows:

[0055] 1) The shape and size of the conductive frame 201 of the light-emitting module 200 are slightly different from those of the conductive frame 101 of the light-emitting module 100;

[0056] 2) The light output module 200 also includes a housing 219 for accommodating at least a portion of both the package 207 and the lens 205.

[0057] Specifically, a portion of the main body of the conductive frame 201 of the light-emitting module 200 protrudes outside the package 207, for example... Figure 3C The upper portion of the conductive frame 201 protrudes upwards from the upper side of the package 207, which helps to increase the exposed heat dissipation area of ​​the conductive frame 101 and improve heat dissipation performance. Additionally, the lens 205 can be first mounted onto the housing 219, and then the assembly of the lens 205 and housing 219 is mounted onto the package 207; or, the lens 205 can be first mounted onto the package 207, and then the housing 219 can be mounted onto the assembly of the lens 205 and package 207. This allows the package 207 and housing 219 to be formed separately before assembly, thus avoiding the risks of injection molding shrinkage and solidification.

[0058] Next, refer to Figure 4 The manufacturing steps of the optical module 200 are described.

[0059] first, Figure 4 Steps (A) to (E) in Figure 2 The corresponding steps shown are basically the same. Figure 4 The components indicated by reference numerals 201, 202a, 202b, 202c, 202d, 203, 205, 207, 209, 211, 213, 215, and 217 in the accompanying drawings are respectively related to... Figure 2 The components indicated by reference numerals 101, 102a, 102b, 102c, 102d, 103, 105, 107, 109, 111, 113, 115, and 117 in the accompanying drawings are similar, so they will not be described again here.

[0060] Then, as Figure 4 As shown in step (F), an assembly of lens 205 and housing 219 is prepared, wherein lens 205 is mounted (e.g., glued) to housing 219. Then, the assembly of lens 205 and housing 219 is mounted onto encapsulation 207, thereby forming light-emitting module 200.

[0061] Figure 5A and Figure 5B These are, respectively, a perspective view and a front view of the light-emitting module according to the third embodiment of the present invention. Figure 5C It is along Figure 5B The cross-sectional view taken from section C3-C3. Figure 6 As shown Figures 5A to 5C The manufacturing steps of the light-emitting module are shown.

[0062] like Figures 5A to 6As shown, the light-emitting module 300 of the third embodiment of the present invention has the same basic structure as the light-emitting module 200 described above. The main difference between the two is the mounting method between the lens, the package and the housing.

[0063] Specifically, in the light-emitting module 300, the lens 305 is first mounted (e.g., glued) to the package 307, and then the housing 319 is snapped onto the assembly of the lens 305 and the package 307. To allow the lens 305 to snap into the housing 319, a notch 320 is pre-set in the housing 319.

[0064] In addition, to ensure that the housing 319 is securely engaged with the main body of the package 307 and / or the conductive frame 301, a latch 322 is provided on the housing 319, and a latch (not shown) suitable for engaging the latch 322 is provided on the package 307, thereby forming a first latch structure that cooperates with each other. The first latch structure shown in the figure is only schematic. It should be understood that the first latch structure is not limited to the structure shown in the figure, but can be provided on at least one of the main body of the conductive frame 301 and the package 307 and the housing 319, as long as the first latch structure can be used to securely and conveniently engage the main body of the conductive frame 301 and the package 307 with the housing 319.

[0065] Next, refer to Figure 6 The manufacturing steps of the optical module 300 are described.

[0066] first, Figure 6 Steps (A) to (E) in Figure 4 The corresponding steps shown are basically the same. Figure 6 The components indicated by reference numerals 301, 302a, 302b, 302c, 302d, 303, 305, 307, 309, 311, 313, 315, and 317 in the accompanying drawings are respectively related to... Figure 4 The components indicated by reference numerals 201, 202a, 202b, 202c, 202d, 203, 205, 207, 209, 211, 213, 215, and 217 in the accompanying drawings are similar, so they will not be described again here.

[0067] Then, as Figure 6 As shown in step (F), the lens 305 is mounted (e.g., glued) onto the package 307.

[0068] Finally, as Figure 6 As shown in step (G), the housing 319 is mounted (engaged) onto the assembly of the lens 305 and the package 307, thereby forming the light output module 300.

[0069] Figure 7A and Figure 7BThese are, respectively, a perspective view and a front view of the light-emitting module according to the fourth embodiment of the present invention. Figure 7C It is along Figure 7B The cross-sectional view taken from section C4-C4. Figure 8 As shown Figures 7A to 7C The manufacturing steps of the light-emitting module are shown.

[0070] like Figures 7A to 8 As shown, the light-emitting module 400 of the fourth embodiment of the present invention has the same basic structure as the light-emitting module 300 described above. The main difference between the two is that the light-emitting module 400 also includes a heat sink 421.

[0071] Specifically, second snap-fit ​​structures 425 and 423 that can cooperate with each other are provided on the heat sink 421 and the housing 419. The second snap-fit ​​structures are used to snap the heat sink 421 and the housing 419 together, so that the conductive frame 401 fits against the heat sink 421, thereby improving the heat dissipation performance of the light output module 400.

[0072] In some embodiments, thermally conductive adhesive can be used to bond the heat sink 421 to the conductive frame 401. In some embodiments, thermally conductive adhesive and a second snap-fit ​​structure can be used simultaneously, allowing the conductive frame 401 to adhere to the heat sink 421 via the thermally conductive adhesive. The thermally conductive adhesive typically requires 12 hours to fully cure; the second snap-fit ​​structure is provided to assist in fixation before the thermally conductive adhesive cures, as the adhesive force of the thermally conductive adhesive is usually much greater than the snap-fit ​​force of the second snap-fit ​​structure. Alternatively, in some embodiments, thermally conductive grease and a second snap-fit ​​structure can be used simultaneously. A thin layer of thermally conductive grease is provided between the conductive frame 401 and the heat sink 421, allowing the conductive frame 401 to adhere to the heat sink 421. However, the thermally conductive grease only conducts heat and does not provide fixation; in this case, a second snap-fit ​​structure is needed to fix the heat sink 421 to the housing 419. Of course, a threaded connection can also be used instead of the snap-fit ​​structure, for example, using screws to fix the heat sink 421 to the housing 419.

[0073] Next, refer to Figure 8 The manufacturing steps of optical module 400 are described.

[0074] first, Figure 8 Steps (A) to (G) in Figure 6 The corresponding steps shown are basically the same. Figure 8 The components indicated by reference numerals 401, 402a, 402b, 402c, 402d, 403, 405, 407, 409, 411, 413, 415, and 417 in the accompanying drawings are respectively related to... Figure 6The components indicated by reference numerals 301, 302a, 302b, 302c, 302d, 303, 305, 307, 309, 311, 313, 315, and 317 in the accompanying drawings are similar, so they will not be described again here.

[0075] Then, as Figure 8 As shown in step (H), the latch 423 on the housing 419 is engaged with the buckle 425 on the heat sink 421, so that the heat sink 421 and the housing 419 are engaged together, and the conductive frame 401 is attached to the heat sink 421, thereby forming the light-emitting module 400.

[0076] The heat sink 421 of the light-emitting module 400 shown in the figure is generally U-shaped. It should be understood that the shape of the heat sink 421 can be appropriately changed as needed.

[0077] Figure 9A and Figure 9B These are, respectively, a perspective view and a front view of the light-emitting module according to the fifth embodiment of the present invention. Figure 9C It is along Figure 9B The cross-sectional view taken from section C5-C5. Figure 10 As shown Figures 9A to 9C The manufacturing steps of the light-emitting module are shown.

[0078] like Figures 9A to 10 As shown, the light-emitting module 500 according to the fifth embodiment of the present invention has the same basic structure as the light-emitting module 200 described above. However, in this embodiment, only the driver IC is provided on the substrate 503, while the light source 509 is directly disposed on the conductive frame 501. Specifically, the substrate 503 is disposed on the main body of the conductive frame 501, located below the driver IC, and the pins of the driver IC are led out for easy soldering of gold wires.

[0079] Next, refer to Figure 10 The manufacturing steps of optical module 500 are described.

[0080] First, such as Figure 10 As shown in step (A), a generally sheet-like conductive frame 501 is provided. The conductive frame 501 includes a body and a plurality of pins 502a, 502b, 502c, 502d, and 502e, which are disposed on one side of the body of the conductive frame 501. The body of the conductive frame 501 has a positioning groove 504 for mounting the substrate 503.

[0081] Then, as Figure 10 As shown in step (B), auxiliary devices 511 such as capacitors, resistors, diodes, and TVS are mounted onto the conductive frame 501.

[0082] Then, as Figure 10 As shown in step (C), a package 507 is formed using a plastic or resin material through a TO encapsulation process, such that the package 507 encapsulates at least a portion of the conductive frame 501 and the auxiliary device 511. In this embodiment, a light-emitting hole 515 is provided in the package 507 at a position opposite to the light source 509 (to be installed later).

[0083] Then, as Figure 10 As shown in step (D), a light source 509, such as an LED, is mounted onto a conductive frame 501 via a light exit hole 515. A driver IC can be disposed on a substrate 503, which can extend the pins at the lower end of the driver IC for easy soldering wiring. The substrate 503, with the driver IC and part of the auxiliary device 511, is mounted into a positioning slot 504. The auxiliary device 511 (e.g., the driver IC) on the substrate 503 is connected to corresponding pins 502a, 502b, 502c, 502d, and 502e using wiring (e.g., gold wire), and the pins of the light source 509 are connected to the auxiliary device 511 on the substrate 503 using wiring (e.g., gold wire).

[0084] Then, as Figure 10 As shown in step (E), transparent adhesive (e.g., protective silicone) 517 is applied into the light-emitting aperture 515. If the light source 509 uses a pre-encapsulated LED, the transparent adhesive 517 may not be applied, and this step can be omitted.

[0085] Finally, as Figure 10 As shown in step (F), the assembly of lens 505 and housing 519 is mounted onto package 507, thereby forming light-emitting module 500.

[0086] Figure 11A and Figure 11B They are optical guides and such Figures 7A to 7C The diagram shows a perspective view and a front view of the assembly of the light-emitting module 400. Figure 11C It is along Figure 11B The cross-sectional view taken from section C6-C6 in the image.

[0087] like Figures 11A to 11C As shown, one end of the optical guide GD is connected to the light-emitting surface of the lens 405 of the light-emitting module 400, and the other end of the optical guide GD extends to an appropriate length according to actual needs. The optical guide GD can be a single-layer PMMA light guide strip, a double-layer flexible optical fiber, or a four-layer flexible optical fiber.

[0088] Preferably, UV adhesive is applied between the end faces of the opposing light guides GD and the light-emitting surface of the lens 405. The UV adhesive serves two purposes here: 1) to fix the light guides GD; 2) to fill the air gap between the end faces of the light guides GD and the light-emitting surface of the lens 405, thereby reducing light loss and improving light guiding efficiency.

[0089] The present invention also provides a vehicle lamp, which includes: a light-emitting module 100, 200, 300, 400 or 500 as described above; and a light guide GD connected to the light-emitting module to guide the light emitted by the light-emitting module.

[0090] The present invention also provides a motor vehicle including the vehicle lights according to the present invention described above, which can be used as ambient lights or signal lights, such as taillights, turn signals, position lights, grille lights, etc.

[0091] Although the technical objectives, solutions, and effects of the present invention have been described in detail above with reference to specific embodiments, it should be understood that the above embodiments are merely exemplary and not restrictive. Any modifications, equivalent substitutions, or improvements made by those skilled in the art within the essential spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A light-emitting module (100, 200, 300, 400, 500), characterized in that, include: Conductive frames (101, 201, 301, 401, 501) include a body and multiple pins; A substrate (103, 203, 303, 403, 503), said substrate being disposed on the main body of the conductive frame; Light source (109, 209, 309, 409, 509), wherein the light source is disposed on the substrate or the conductive frame; Auxiliary devices (111, 211, 311, 411, 511), said auxiliary devices being electrically connected to the light source and the pins; and Encapsulation body (107, 207, 307, 407, 507), said encapsulation body encapsulating at least a portion of the conductive frame.

2. The light-emitting module according to claim 1, wherein, The light source and the auxiliary device are disposed on the substrate, and the package is disposed around the substrate and encapsulates at least a portion of the substrate.

3. The light-emitting module according to claim 1, wherein, The package is formed from plastic or resin material using a transistor outline (TO) packaging process and is integrally formed with at least a portion of the substrate; The material forming the conductive framework is a metal.

4. The light-emitting module according to claim 1, wherein, The auxiliary device includes at least one of a driver IC, a capacitor, a resistor, a diode, and a TVS.

5. The light-emitting module according to claim 1, wherein, The substrate is a component formed independently of the conductive frame; Furthermore, the substrate is adhered to the body of the conductive frame by means of an adhesive, or... The substrate is soldered to the main body of the conductive frame using SMT technology.

6. The light-emitting module according to claim 5, wherein, The substrate is a ceramic PCB, FR4 PCB, or IMS board, and / or The adhesive is silver paste.

7. The light-emitting module according to claim 1, wherein, The light source includes LED chips or packaged LEDs, and / or The LED is an RGB LED or a monochrome LED, and the monochrome LED can emit red light, white light or yellow light.

8. The light-emitting module according to any one of claims 1 to 7, wherein, A light-emitting aperture (115, 215, 315, 415, 515) is provided in the package body at a position opposite to the light source. A lens (105, 205, 305, 405, 505) is installed in the light-emitting aperture. The lens is used to converge and shape the light emitted by the light source. Transparent adhesive is applied to the light-emitting hole between the light source and the lens.

9. The light-emitting module according to claim 8, wherein, The light-emitting module further includes a housing (219, 319, 419, 519), the housing being used to accommodate at least a portion of both the package and the lens. The lens and the housing are formed as a single assembly using a two-color injection molding process, or... The lens is first mounted onto the housing, and then the assembly of the lens and the housing is mounted onto the package; or, The lens is first mounted onto the package, and then the housing is mounted onto the assembly of the lens and the package.

10. The light-emitting module according to claim 9, wherein, At least one of the conductive frame body and the package body and the housing are provided with a first snap-fit ​​structure (322) that can cooperate with each other, and the first snap-fit ​​structure is used to snap the conductive frame body and the package body and the housing together.

11. The light-emitting module according to claim 9, wherein, The light-emitting module also includes a heat sink (421), and the conductive frame is attached to the heat sink by thermally conductive adhesive or thermally conductive grease; A second snap-fit ​​structure (425, 423) is provided on the radiator and the housing to engage with each other, thereby locking the radiator and the housing together.

12. A type of vehicle light, wherein, The vehicle lights include: The light-emitting module according to any one of the preceding claims; and A light guide is connected to the light-emitting module to guide the light emitted by the light-emitting module.

13. A motor vehicle, wherein, The motor vehicle includes the vehicle lights according to claim 12, wherein the vehicle lights are used as ambient lights or signal lights.

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