Membrane-coated multi-channel electrochemical chip and membrane set processing method thereof

Abstract

The present application relates to a film-coated multi-channel electrochemical chip and a film set processing method thereof, wherein a chip body surface of the film-coated multi-channel electrochemical chip is covered with a first film set and a second film set; the first film set is provided with a first hole site, the second film set includes a center part and a peripheral part which radially exceeds the center part, the center part is used for embedding the first hole site and is provided with a second hole site, an area of the first hole site is greater than an area of the second hole site; a height difference between the center part and the peripheral part of the second film set is greater than or equal to a height of the first film set, and a viscosity of an adhesive layer of the second film set on the surface of the chip body is lower than viscosities of other adhesive layers of the second film set, so that a second well-type three-dimensional structure can be formed before the second film set is peeled off and a first well-type three-dimensional structure can be formed after the second film set is peeled off. Through the simple operation of peeling off the second film set, the purpose of changing the reaction pool from small to large can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip technology, in particular to a film-coated multi-channel electrochemical chip. The present application also relates to a method for processing a film set for the film-coated multi-channel electrochemical chip. BACKGROUND

[0002] An electrochemical chip generally consists of a substrate and electrodes on the substrate. The substrate is generally made of non-conductive materials such as glass, ceramic, plastic, etc. The electrodes on the substrate are generally made of metal, conductive metal oxides and non-metal plating films. An electrochemical chip generally has three regions, an electrode region, a wire region and a lead region. When in use, the liquid to be tested is dropped on the electrode region, and a connector is used to connect the chip lead region to the contact pad to guide the signal. One electrode region on the chip is generally composed of 2-4 electrodes, which is called a unit cell.

[0003] In order to realize large flux electrochemical analysis, multiple unit cells are often placed on one electrochemical chip, and each unit cell independently performs electrochemical analysis and corresponding electrochemical reactions. Such a chip is called a multi-channel electrochemical chip or a multiplexed detection electrochemical chip.

[0004] In use, electrochemical analysis chips, biological detection chips, modified electrode chips and other chips often require liquid to be added to a specific area on the surface of the chip. After the components in the liquid react with the surface of the chip, the molecules of the components in the liquid will adhere to the surface of the electrode to form a molecular modified electrode. For a multi-channel electrochemical chip, the modifiers and reactants of each independent unit cell will be different, so the reaction liquid between each unit cell needs to be isolated from each other.

[0005] In the preparation and use of open chips, it is often necessary to restrict the reaction liquid to a specific area (reaction area) on the surface of the chip. Whether the components in the added reaction liquid react or the components in the liquid react with the surface materials in the reaction area of the chip, it is necessary to ensure that the reaction only occurs in the specified area and does not interfere with the area outside the specified area (non-reaction area). In addition, different reaction areas may be required at different stages of production and use of the same chip. Different reaction areas may be small to large, large to small, may overlap, or may not overlap.

[0006] For example, in a traditional three-electrode electrochemical biological chip, an enzyme that catalyzes the oxidation-reduction reaction needs to be fixed on the working electrode without interfering with the auxiliary electrode and reference electrode in the area outside the working electrode. After cleaning and drying, the substrate is added to cover the working electrode, reference electrode and auxiliary electrode, and an electrochemical reaction occurs under the action of voltage while detecting the reaction current. This process requires a change in the reaction area.

[0007] Currently, the first type of solution is to paste a plastic film with a pre-cut pattern or a plastic substrate with a certain thickness on the surface of the chip, and then paste the film or substrate with a pattern on the electrode surface through double-sided adhesive. However, once pasted, the size of the reaction area cannot be changed.

[0008] The second type of solution is to etch a groove with a certain depth on the chip substrate through a semiconductor process, and to limit the reaction liquid in the groove through the three-dimensional structure of the groove, thereby limiting the reaction area. However, similar to the above method, once the reaction area is processed and formed, it is fixed to the area of the groove and cannot be changed. Moreover, this method requires etching on the substrate, which is high in cost and has limitations on the substrate material, and poor in flexibility.

[0009] The third type of solution is to deposit a hydrophobic layer around the substrate reaction area, and to use the surface tension of the liquid to keep the liquid in the form of a droplet in the reaction area. This method also has the above problems. Once the hydrophobic layer is processed, it is difficult to remove and the reaction area cannot be changed. Moreover, the hydrophobic layer is generally an organic substance, which is easy to contaminate the metal electrode during the processing process, thereby reducing the modification efficiency. SUMMARY

[0010] The purpose of the present application is to provide a film-coated multi-channel electrochemical chip to at least solve some of the above technical problems.

[0011] Another purpose of the present application is to provide a film group processing method of a film-coated multi-channel electrochemical chip.

[0012] To achieve the above purpose, the film-coated multi-channel electrochemical chip provided by the present application comprises a chip body provided with an electrode, and the surface of the chip body is covered with a first film group and a second film group. The first film group is provided with a first hole site, and the second film group comprises a center part and a peripheral part which radially exceeds the center part. The center part is used for embedding the first hole site and is provided with a second hole site, and the area of the first hole site is greater than the area of the second hole site. The height difference between the center part and the peripheral part of the second film group is greater than or equal to the height of the first film group, and the viscosity of the adhesive layer of the second film group on the surface of the chip body is lower than the viscosity of the remaining adhesive layers thereof, so as to form a second well-type three-dimensional structure before peeling off the second film group and to form a first well-type three-dimensional structure after peeling off the second film group.

[0013] Optionally, the first film group is provided with at least one first isolation layer, and each first isolation layer is provided with a first adhesive layer below. The second film group is provided with at least two second isolation layers, and each second isolation layer is provided with a second adhesive layer below. The second isolation layer located at the topmost layer is the starting layer downward, and the second film group has at least one layer which radially exceeds the center part to form the peripheral part of the second film group.

[0014] Optionally, the first and second isolation layers on the topmost layer are hydrophobic.

[0015] Optionally, the peripheral portion of the second membrane group is above the first membrane group, and has a spaced distance from the upper surface of the first membrane group.

[0016] Optionally, the lower surface of the peripheral portion of the second membrane group is adhered to the upper surface of the first membrane group, and the viscosity of the adhesive layer therebetween is lower than that of the adhesive layer of the first membrane group itself.

[0017] Optionally, a gap is left between the outer peripheral surface of the central portion of the second membrane group and the inner peripheral surface of the first hole site of the first membrane group.

[0018] Optionally, the gap between the outer peripheral surface of the central portion of the second membrane group and the inner peripheral surface of the first hole site of the first membrane group forms an annular space with a bottom capable of accommodating or exposing at least part of the electrode.

[0019] Optionally, the number or area of the electrodes within the first well-shaped three-dimensional structure is greater than that within the second well-shaped three-dimensional structure.

[0020] To achieve the above-mentioned another object, the present application provides a membrane group processing method for processing the second membrane group in any of the above technical solutions, comprising the following steps:

[0021] At least one second isolation layer is stacked between the first and second film transfer layers in an alternating manner of second adhesive layer and second isolation layer;

[0022] According to the shape of the central portion of the second membrane group, the first film transfer layer is cut from top to bottom in a half-cut manner, and the excess portion formed by the cutting is removed;

[0023] The second film transfer layer is removed;

[0024] The second isolation layer on the topmost layer is covered;

[0025] According to the range of the second well-shaped three-dimensional structure of the second membrane group, all the film layers are cut from top to bottom in a full-cut manner to form the second hole site.

[0026] To achieve the above-mentioned another object, the present application provides another membrane group processing method for processing the second membrane group in any of the above technical solutions, comprising the following steps:

[0027] At least one second isolation layer is stacked on the first film transfer layer in an alternating manner of second adhesive layer and second isolation layer;

[0028] According to the shape of the central part of the second membrane module, it is cut from top to bottom to the first membrane transfer layer in a half-cut manner, and the excess material formed by the cutting is removed to form the first semi-finished body;

[0029] A second transfer film layer is provided, and at least one second isolation layer is superimposed on the second transfer film layer in a manner in which the second attachment layer and the second isolation layer are alternately distributed to form a second semi-finished body;

[0030] Remove the second membrane layer of the second half-assembly and adhere it to the first half-assembly, then combine the first half-assembly and the second half-assembly.

[0031] According to the range of the second well-type three-dimensional structure of the second membrane group, all membrane layers are cut from top to bottom in a full-cut manner to form the second pore.

[0032] The multi-channel electrochemical chip provided by this invention comprises a first membrane group and a second membrane group stacked and nested on the surface of the chip body. The first pore of the first membrane group forms a large-diameter first well-shaped three-dimensional structure, while the second pore of the second membrane group forms a smaller-diameter second well-shaped three-dimensional structure. When both the first and second membrane groups are simultaneously applied to the chip body surface, a portion of the second membrane group is embedded in the first pore of the first membrane group, thus forming only a second well-shaped three-dimensional structure, i.e., a small reaction cell, on the chip body surface. Upon peeling off the second membrane group, the first pore of the first membrane group is exposed, forming a first well-shaped three-dimensional structure, i.e., a large reaction cell. This simple operation of peeling off the second membrane group achieves the goal of increasing the size of the reaction cell, offering advantages such as changing the reaction liquid volume, simplifying automation complexity, improving the chip's signal-to-noise ratio, enhancing the repeatability of multi-channel chips, and reducing processing costs.

[0033] Because the viscosity of the adhesion layer between the second membrane assembly and the surface of the chip body is lower than the viscosity of its other adhesion layers, the layers of the second membrane assembly will remain tightly bonded together and will not separate during the peeling process. At the same time, the first membrane assembly will not separate from the chip body during the peeling process. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the film-coated multichannel electrochemical chip provided in the first embodiment of the present invention;

[0035] Figure 2 for Figure 1 A schematic diagram of the structure of the second membrane assembly shown in the figure;

[0036] Figure 3 for Figure 1 The diagram shows the process by which the reaction cell of the membrane-coated multichannel electrochemical chip grows from small to large by peeling off the second membrane module.

[0037] Figure 4 A process diagram for sequentially adhering the first film group and the second film group to the chip body during production and peeling off the second film group during use;

[0038] Figure 5 A process flow chart of a film group processing method provided by the embodiment of the present application (the left side is an axial side view and the right side is a corresponding sectional view) ;

[0039] Figure 6 A process flow chart of another film group processing method provided by the embodiment of the present application (the left side is an axial side view and the right side is a corresponding sectional view) ;

[0040] Figure 7 A process diagram for adhering the second film group produced by the present application to the first film group;

[0041] Figure 8 A structure diagram of a film-coated multi-channel electrochemical chip provided by the second embodiment of the present application;

[0042] Figure 9 A structure diagram of a film-coated multi-channel electrochemical chip provided by the third embodiment of the present application;

[0043] Figure 10 A structure diagram of a film-coated multi-channel electrochemical chip provided by the fourth embodiment of the present application;

[0044] Figure 11 A structure diagram of a film-coated multi-channel electrochemical chip provided by the fifth embodiment of the present application.

[0045] The reference signs are explained as follows:

[0046] 10. chip body; 20. electrode; 21. first electrode; 22. second electrode; 23. third electrode; 30. first film group; 31. first isolation layer; 32. first adhesion layer; 310. first hole site; 40. second film group; 41. second isolation layer; 42. second adhesion layer; 410. second hole site; 51. first film moving layer; 52. second film moving layer; a. central part; b. peripheral part. DETAILED DESCRIPTION

[0047] In order to make the person skilled in the art better understand the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0048] In the present text, the terms such as "upper", "lower", "inner", "outer" and the like are established based on the positional relationship shown in the drawings, and according to different drawings, the corresponding positional relationship can also change accordingly, therefore, it cannot be understood as an absolute limitation on the scope of protection; moreover, the relationship terms such as "first" and "second" are only used to distinguish one from another with the same-named components, and do not necessarily require or imply any such actual relationship or order between the components.

[0049] Please refer to Figure 1 、 Figure 2 , Figure 1 The structural schematic diagram of the film-coated multi-channel electrochemical chip provided by the first embodiment of the present application is shown in the figure. Figure 2 The structural schematic diagram of the second film group shown in Figure 1 .

[0050] As shown in the figure, in a specific embodiment, the film-coated multi-channel electrochemical chip provided by the present application mainly consists of a chip body 10, an electrode 20, a first film group 30 and a second film group 40 covering the surface of the chip body 10.

[0051] The first film group 30 has a first adhesive layer 32 and a first isolation layer 31, the first adhesive layer 32 is located below the first isolation layer 31, and the first isolation layer 31 is adhered to the upper surface of the chip body 10 through the first adhesive layer 32 below it.

[0052] The second film group 40 has two layers of second isolation layers 41, each layer of second isolation layers 41 has a second adhesive layer 42 below it, and the entire second film group 40 is adhered to the upper surface of the chip body 10 through the second adhesive layer 42 of the bottom layer, and the first isolation layer 31 of the first film group 30 and the second isolation layer 41 of the second film group 40 located at the top layer both have hydrophobicity.

[0053] The first film group 30 is provided with a first hole site 310, the second film group 40 has a central part a and a peripheral part b, and can be embedded into the first hole site 310 of the first film group 30 through the central part a, in this embodiment, the second isolation layer 41 of the top layer of the second film group 40 exceeds the central part a in the radial direction, thereby forming the peripheral part b, which can be easily torn to peel off the second film group 40.

[0054] The central part a of the second film group 40 is embedded into the first hole site 310 and provided with a second hole site 410, the area of the first hole site 310 is larger than the area of the second hole site 410, and there is a gap between the outer circumferential surface of the central part a of the second film group 40 and the inner circumferential surface of the first hole site 310 of the first film group 30, which forms an annular space with a bottom capable of accommodating or exposing at least part of the electrode 20.

[0055] The height difference between the central portion a and the peripheral portion b of the second film group 40 is greater than or equal to the height of the first film group 30, and in the present embodiment, the peripheral portion b of the second film group 40 is located above the first film group 30 and has a spacing distance from the upper surface of the first film group 30. The viscosity of the second adhesive layer 42 between the second film group 40 and the surface of the chip body 10 is lower than the viscosity of the rest of the second adhesive layer 42, so as to maintain the integrity of the second film group 40 and prevent delamination during the peeling of the second film group 40. Before the second film group 40 is peeled, the first film group 30 and the second film group 40 together form a second well-shaped three-dimensional structure with a smaller diameter, and after the second film group is peeled, the first film group 30 alone forms a first well-shaped three-dimensional structure with a larger diameter. The number or area of the electrodes in the first well-shaped three-dimensional structure is greater than that in the second well-shaped three-dimensional structure.

[0056] It can be understood that in other embodiments, the lower surface of the peripheral portion b of the second film group 40 can also be adhered to the upper surface of the first film group 30 by a layer of second adhesive layer 42. If the two are bonded, the viscosity of the second adhesive layer 42 between the two is lower than the viscosity of the first adhesive layer 32 of the first film group 30, so as to ensure that the first film group 30 does not delaminate and separate from the chip body 10 during the peeling of the second film group 40.

[0057] It should be noted here that the first hole site 310 and the second hole site 410 are not limited to both being circular holes, but can also be other shapes, for example, both are square holes, or one is a square hole and the other is a circular hole, as long as the second hole site 410 is within the area of the first hole site 310, and the second hole site 410 constitutes a subset of the first hole site 310.

[0058] Taking a three-electrode electrochemical chip as an example, a circular through hole with a certain height is processed in the upper area of the working electrode, which has a size similar to that of the working electrode and forms a circular well-shaped three-dimensional structure in combination with the working electrode to restrict the reaction solution in the well-shaped area.

[0059] When the first well-shaped three-dimensional structure is used, the three electrodes, i.e. the first electrode 21, the second electrode 22 and the third electrode 23, are exposed inside at the same time, and when the second well-shaped three-dimensional structure is used, only the first electrode 21 located in the center is exposed inside.

[0060] The first separation layer 31 and the second separation layer 41 described above can be made of plastic materials such as PET (polyethylene terephthalate), PP (polypropylene), PS (polystyrene) and the like.

[0061] Please refer to Figure 3 、 Figure 4 , Figure 3 ​Figure 1 The process diagram for changing the reaction cell from small to large by peeling off the second film group from the shown film-coated multi-channel electrochemical chip; Figure 4 The process diagram for sequentially adhering the first film group and the second film group to the chip body during production and peeling off the second film group during use.

[0062] The above film-coated multi-channel electrochemical chip has the first film group 30 and the second film group 40 stacked and nested on the surface of the chip body, wherein the first hole site 310 of the first film group 30 can form a first well-shaped three-dimensional structure with a larger diameter, and the second hole site 410 of the second film group 40 can form a second well-shaped three-dimensional structure with a smaller diameter.

[0063] When the first film group 30 and the second film group 40 are simultaneously covered on the surface of the chip body 10, a part of the second film group 40 is nested in the first hole site 310 of the first film group 30, so that only the second well-shaped three-dimensional structure, that is, the small reaction cell, is formed on the surface of the chip body 10. When the second film group 40 is peeled off, the first hole site 310 of the first film group 30 is exposed, thereby forming the first well-shaped three-dimensional structure, that is, the large reaction cell.

[0064] Still taking the traditional three-electrode electrochemical nucleic acid chip as an example, during the modification stage of the electrode 20, all modification molecules need to be kept within the range of the central first electrode 21, and the reaction region of the substrate is expanded to all electrode regions only until the final electrochemical reaction.

[0065] According to the requirement of changing the reaction cell from small to large, the purpose of changing the reaction cell from small to large can be achieved by simply peeling off the second film group 40.

[0066] Since the viscosity of the second adhesive layer 42 of the second film group 40 on the surface of the chip body 10 is lower than that of the rest of the second adhesive layer 42 of the second film group 40, during the peeling process of the second film group 40, the layers of the second film group 40 will still be tightly bonded together and will not separate, and at the same time, the first film group 30 will not be separated from the chip body 10 during the peeling process of the second film group 40.

[0067] Please continue to refer to Figure 5 , Figure 5 The process flow chart of a film group processing method provided for the embodiments of the present application.

[0068] The present application provides a film group processing method for processing the second film group 40 of the film-coated multi-channel electrochemical chip described above, comprising the following steps:

[0069] S1: Stack at least one second isolation layer 41 between the first film transfer layer 51 and the second film transfer layer 52 in a manner that the second adhesive layer 42 and the second isolation layer 41 are alternately distributed;

[0070] S2: According to the shape of the central part a of the second film group 40, cut from top to bottom to the first film removal layer 51 in a half-cut manner, and remove the excess material part formed by cutting;

[0071] S3: Remove the second film removal layer 52;

[0072] S4: Cover the second isolation layer 41 located at the top layer;

[0073] S5: According to the range of the second well-shaped three-dimensional structure of the second film group 40, cut all film layers from top to bottom in a full-cut manner to form the second hole site 410, at this time, the second film group 40 is processed, and at this time, the second film group 40 is in an inverted state relative to Figure 2

[0074] Please continue to refer to Figure 6 , Figure 6 Another film group processing method provided by the embodiment of the application has a process flow chart (the left side is an axial side view, and the right side is a corresponding sectional view).

[0075] Another film group processing method provided by the embodiment of the application has a process flow chart (the left side is an axial side view, and the right side is a corresponding sectional view).

[0076] S1: Above the first film removal layer 51, at least one second isolation layer 41 is stacked in an alternating distribution manner of the second adhesive layer 42 and the second isolation layer 41;

[0077] S2: According to the shape of the central part of the second film group 40, cut from top to bottom to the first film removal layer 51 in a half-cut manner, and remove the excess material part formed by cutting to form a first semi-finished body;

[0078] S3: Another second film removal layer 52 is provided, and at least one second isolation layer 41 is stacked above the second film removal layer 52 in an alternating distribution manner of the second adhesive layer 42 and the second isolation layer 41 to form a second semi-finished body;

[0079] S4: Remove the second film removal layer 52 of the second semi-finished body and adhere it to the first semi-finished body, and combine the first semi-finished body and the second semi-finished body;

[0080] S5: According to the range of the second well-shaped three-dimensional structure of the second film group 40, cut all film layers from top to bottom in a full-cut manner to form the second hole site 410, at this time, the second film group 40 is processed, and at this time, the second film group 40 is in an inverted state relative to Figure 2

[0081] The second film group 40 prepared by the application is adhered to the first film group 30 already covered on the chip body 10, and a film-covered multi-channel electrochemical chip of the application is obtained (see​​Figure 7 ).

[0082] The above embodiments are only preferred schemes of the present application, and are not limited thereto. Based on the above, targeted adjustments can be made according to actual needs to obtain different embodiments.

[0083] For example, the second adhesive layer 42 below the second isolation layer 41 of the topmost layer of the second film group 40 can also extend beyond the central portion a of the second film group 40, so as to form the peripheral portion b of the second film group 40 together with the second isolation layer 41 of the topmost layer (see FIG. 4). Figure 8 ).

[0084] Alternatively, the second film group 40 is provided with three sets of second isolation layers 41 and second adhesive layers 42, so that the second hole site 410 has a greater depth, and the peripheral portion b thereof is also greater in spacing from the first film group 30 (see FIG. 5). Figure 9 ).

[0085] Alternatively, the first film group 30 is provided with two sets of first isolation layers 31 and first adhesive layers 32, and the second film group 40 is provided with three sets of second isolation layers 41 and second adhesive layers 42, so that both the first hole site 310 and the second hole site 410 have a greater depth (see FIG. 6). Figure 10 ).

[0086] Alternatively, the second film group 40 is provided with three sets of second isolation layers 41 and second adhesive layers 42, and, taking the second isolation layer 41 of the topmost layer as the starting layer downward, two sets of second isolation layers 41 and second adhesive layers 42 extend beyond the central portion a of the second film group 40, so as to form the peripheral portion b of the second film group 40 (see FIG. 7). Figure 11 ).

[0087] Since there are many possible ways, they will not be listed one by one here.

[0088] The present application has the following beneficial effects:

[0089] 1) On the same chip, the confined area of the reaction liquid in different reaction steps can be changed.

[0090] 2) The multi-layer film stack group forms a three-dimensional groove structure, expands the non-electrode area of the through hole, thereby increasing the volume of the liquid, and by changing the hydrophobicity of the film surface, the thickness of the film can further increase the volume of the droplet.

[0091] 3) By removing the surface film after each rinse and blow-drying, the method ensures the residual cleaning liquid, and simplifies the complexity of automation.

[0092] 4) The non-target area is completely covered by the isolation layer, which removes the non-specific adhesion caused by the liquid overflow to other electrode areas due to the shaking during operation, and reduces the noise caused by non-specific adsorption.

[0093] 5) The non-target area is completely covered by the isolation layer, which prevents the accidental overflow of the liquid to the non-target area due to the shaking or other factors during operation, corrects the signal error caused by the modification of the non-target area by the modification molecule, and improves the reusability of the chip.

[0094] 6) The height of the structure can be completed by stacking the isolation layers, and each layer of the isolation layer only needs to be planarly processed to form a through hole, and the required three-dimensional structure is completed by stacking the through holes of different layers, which reduces the processing cost and improves the production efficiency.

[0095] The film-coated multi-channel electrochemical chip and the film set processing method thereof provided by the present application are described in detail above. In this paper, specific examples are used to explain the principles and implementation methods of the present application. The above examples are only used to help understand the core idea of the present application. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A coated multichannel electrochemical chip comprising a chip body provided with electrodes, characterized in that The surface of the chip body is covered with a first film group and a second film group; the first film group is provided with a first hole site, and the second film group comprises a central part and a peripheral part radially beyond the central part, the central part is used for embedding the first hole site and is provided with a second hole site, the area of the first hole site is greater than the area of the second hole site; the height difference between the central part and the peripheral part of the second film group is greater than or equal to the height of the first film group, and the viscosity of the adhesive layer of the surface of the second film group is lower than the viscosity of the rest of the adhesive layer, so as to form a second well-type three-dimensional structure before the second film group is peeled off and form a first well-type three-dimensional structure after the second film group is peeled off; the first film group is provided with at least one first isolation layer, and each first isolation layer is provided with a first adhesive layer below; the second film group is provided with at least two second isolation layers, and each second isolation layer is provided with a second adhesive layer below, the second isolation layer located at the topmost layer is the starting layer downward, and the second film group has at least one layer radially beyond the central part to form the peripheral part of the second film group.

2. The membrane-covered multi-channel electrochemical chip according to claim 1, wherein, The first isolation layer and the second isolation layer located at the topmost layer have hydrophobicity.

3. The coated multichannel electrochemical chip of claim 1, wherein, The peripheral part of the second film group is located above the first film group, and has a spacing distance from the upper surface of the first film group.

4. The coated multichannel electrochemical chip of claim 1, wherein, The lower surface of the peripheral part of the second film group is adhered to the upper surface of the first film group, and the viscosity of the adhesive layer therebetween is lower than the viscosity of the adhesive layer of the first film group itself.

5. The coated multichannel electrochemical chip of claim 1, wherein, A gap is left between the outer peripheral surface of the central part of the second film group and the inner peripheral surface of the first hole site of the first film group.

6. The coated multichannel electrochemical chip of claim 5, wherein, The gap between the outer peripheral surface of the central part of the second film group and the inner peripheral surface of the first hole site of the first film forms an annular space with a bottom capable of accommodating or exposing at least part of the electrode.

7. The coated multichannel electrochemical chip of claim 1, wherein, The number or area of the electrodes in the first well-type three-dimensional structure is greater than the number or area of the electrodes in the second well-type three-dimensional structure.

8. A film group processing method for processing the second film group of any one of claims 1 to 7, comprising: stacking at least one second isolation layer between the first film transfer layer and the second film transfer layer in a manner that the second adhesive layer and the second isolation layer are alternately distributed; cutting from top to bottom to the first film transfer layer in a half-cut manner according to the shape of the central part of the second film group, and removing the excess part formed by the cutting; removing the second film transfer layer; covering the second isolation layer located at the topmost layer; cutting all film layers from top to bottom in a full-cut manner according to the range of the second well-type three-dimensional structure of the second film group to form the second hole site.

9. A film group processing method for processing the second film group of any one of claims 1 to 7, comprising: stacking at least one second isolation layer above the first film transfer layer in a manner that the second adhesive layer and the second isolation layer are alternately distributed; cutting from top to bottom to the first film transfer layer in a half-cut manner according to the shape of the central part of the second film group, and removing the excess part formed by the cutting to form a first semi-finished body; A second film transfer layer is additionally provided, and at least one second isolation layer is stacked on the second film transfer layer in a manner that the second attachment layer and the second isolation layer are alternately distributed, so as to form a second semi-product; The second film transfer layer of the second semi-product is removed and adhered to the first semi-product, and the first semi-product and the second semi-product are combined; According to the range of the second well-type three-dimensional structure of the second film group, all the film layers are cut in a full-cut manner from top to bottom to form a second hole site.

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