BOSA temperature compensation method, device and equipment and storage medium

Abstract

The invention relates to the technical field of BOSA, in particular to a BOSA temperature compensation method and device, equipment and a storage medium. The method comprises the steps of determining a target equipment set and generating a temperature data set; calculating a compensation value of each target device according to the temperature data set; based on the register conversion temperature values and the compensation values of all the target devices, constructing distribution coordinate representation by taking the register conversion temperature values as a horizontal axis and the compensation values as a longitudinal axis; fitting to obtain a sampling straight line represented by the distribution coordinates, and screening a plurality of sample points as target sample points based on the sampling straight line; solving a linear compensation equation through a preset equation set based on the target sample point; according to the register conversion temperature value updated by any target device in real time, a compensation value is dynamically generated in combination with the linear compensation equation, and the reported temperature is determined after temperature compensation is executed based on the generated compensation value. According to the invention, temperature monitoring misalignment caused by a fixed compensation value can be avoided, so that the temperature control precision is improved.

Description

Technical Field

[0001] This application relates to the technical field of BOSA (Bidirectional Optical Sub-Assembly), and more particularly to a BOSA temperature compensation method, apparatus, device, and storage medium. Background Technology

[0002] In temperature monitoring systems for FTTR (Fiber to the Room) products, the temperature accuracy of the BOSA (Bidirectional Optical Sub-Assembly) directly impacts equipment performance and reliability. Current mainstream solutions read the raw temperature data from the driver chip's registers, convert it to obtain a converted temperature value (TValue), and then combine this with a fixed compensation value (Offset) to calculate the reported temperature. The compensation value typically uses a static average value (e.g., -114.62), and temperature compensation is achieved through a specific formula.

[0003] However, actual testing shows that the fixed compensation value cannot adapt to the dynamic changes in the converted temperature value, resulting in a significant deviation between the reported temperature and the physical BOSA temperature. This defect stems from the fact that the fixed compensation value ignores the implicit correlation between the two, ultimately causing inaccurate temperature monitoring and failing to meet the requirements for high-precision temperature control. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, this application provides a BOSA temperature compensation method, apparatus, device and storage medium. By determining the relationship between the register conversion temperature value and the compensation value in multiple devices under the current scenario, the compensation value is dynamically generated, avoiding temperature monitoring inaccuracies caused by fixed compensation values, thereby improving temperature control accuracy.

[0005] The technical solution adopted by this application to solve its technical problem is:

[0006] In a first aspect, this application provides a BOSA temperature compensation method, the method comprising:

[0007] Determine the target device set, collect the BOSA temperature value and register conversion temperature value of each target device in the target device set under a preset state, and generate a temperature dataset;

[0008] Calculate the compensation value for each of the target devices based on the temperature dataset;

[0009] Based on the register conversion temperature value and compensation value of all the target devices, a distribution coordinate representation is constructed with the register conversion temperature value on the horizontal axis and the compensation value on the vertical axis.

[0010] The sampling line represented by the distribution coordinates is obtained by fitting, and several sample points are selected as target sample points based on the sampling line;

[0011] Based on the coordinate data of the target sample points, the linear compensation equation is solved by a set of preset equations.

[0012] Based on the real-time updated register conversion temperature value of any target device, a compensation value is dynamically generated in conjunction with the linear compensation equation. After performing temperature compensation based on the generated compensation value, the reported temperature is determined.

[0013] Optionally, the step of collecting the BOSA temperature value and register-converted temperature value of each target device in the target device set under a preset state to generate a temperature dataset includes:

[0014] Collect the specified register address value of the BOSA driver chip for each of the target devices;

[0015] Each of the aforementioned register address values ​​is converted to decimal, and the quotient of the converted register address value and 256 is used as the register conversion temperature value of the corresponding target device.

[0016] Optionally, the formula used to calculate the compensation value for each target device based on the temperature dataset is:

[0017] Offset = T0 - TValue × Slope;

[0018] Where Offset is the compensation value, T0 is the BOSA temperature value, TValue is the register-converted temperature value, and Slope is the preset temperature coefficient.

[0019] Optionally, the step of fitting the sampling line represented by the distribution coordinates and selecting several sample points as target sample points based on the sampling line includes:

[0020] The sampling line represented by the distribution coordinates is obtained by fitting using the least squares method;

[0021] The residual sum of squares for each sample point is calculated based on the sampling line, and sample points whose residual sum of squares is lower than a preset threshold are selected as the target sample points.

[0022] Optionally, one target sample point corresponds to one target device; the step of solving the linear compensation equation based on the coordinate data of the target sample point using a preset set of equations includes:

[0023] The register conversion temperature value of the target device is used as the horizontal axis value, and the compensation value of the target device is used as the vertical axis value;

[0024] Summate the x-coordinate values, y-coordinate values, the square of the x-coordinate, and the product of the x and y coordinates respectively.

[0025] Substitute all accumulated values ​​into the preset set of equations to solve for the slope and intercept of the linear compensation equation, thereby determining the linear compensation equation.

[0026] Optionally, the preset set of equations is:

[0027]

[0028] Where, x i Let y be the x-coordinate of the i-th target sample point. i Let be the ordinate value of the i-th target sample point, and n be the number of target sample points;

[0029] k is the slope of the linear compensation equation, b is the intercept of the linear compensation equation on the vertical axis, and k and b are the parameters to be solved. The linear compensation equation is determined by k and b.

[0030] Optionally, the formula used to dynamically generate the compensation value based on the real-time updated register conversion temperature value of any target device, combined with the linear compensation equation, is as follows:

[0031] Offset = TValue × kb.

[0032] Secondly, this application provides a BOSA temperature compensation device, comprising:

[0033] The data acquisition module is used to determine the target device set, collect the BOSA temperature value and register-converted temperature value of each target device in the target device set under a preset state, and generate a temperature dataset.

[0034] The compensation calculation module is used to calculate the compensation value for each of the target devices based on the temperature dataset.

[0035] A coordinate construction module is used to construct a distributed coordinate representation based on the register conversion temperature value and the compensation value of all the target devices, with the register conversion temperature value as the horizontal axis and the compensation value as the vertical axis.

[0036] The sample selection module is used to fit the sampling line represented by the distribution coordinates and select several sample points as target sample points based on the sampling line.

[0037] The equation determination module is used to solve the linear compensation equation based on the coordinate data of the target sample points and a preset set of equations.

[0038] The compensation execution module is used to dynamically generate a compensation value based on the real-time updated register conversion temperature value of any target device and the linear compensation equation, and then perform temperature compensation based on the generated compensation value to determine the reported temperature.

[0039] Thirdly, this application provides an electronic device, comprising:

[0040] One or more processors;

[0041] One or more memory units;

[0042] And one or more computer programs, wherein the one or more computer programs are stored in the one or more memories, and the one or more computer programs include instructions that, when executed by the one or more processors, cause the electronic device to perform the methods described above.

[0043] Fourthly, this application provides a computer-readable storage medium storing a program or instructions that, when executed, implement the above-described method.

[0044] The beneficial effects of this application are as follows: By determining the target device set and collecting its BOSA temperature value and register conversion temperature value under preset conditions, a temperature dataset can be generated, and then the compensation value for each target device can be calculated. A distributed coordinate representation is constructed based on the register conversion temperature value and compensation value of all target devices, and a sample straight line is obtained through fitting. Strongly linearly correlated target sample points are then selected, and finally, a linear compensation equation is obtained by solving a preset set of equations. After determining the linear compensation equation, whenever any target device updates its register conversion temperature value in real time or executes a temperature reporting command (at which time the register conversion temperature value will be updated), a compensation value is dynamically generated based on the linear compensation equation, and temperature compensation is performed accordingly to ultimately determine the reported temperature. By adopting the above-mentioned dynamic compensation method, the problem of inaccurate temperature monitoring caused by fixed compensation values ​​is overcome, the temperature control accuracy is improved, and it is ensured that the equipment maintains high-precision temperature control under different operating conditions. Attached Figure Description

[0045] Figure 1 This is a schematic flowchart of the BOSA temperature compensation method provided in the embodiments of this application;

[0046] Figure 2 This is a schematic diagram of the distribution coordinates provided in the embodiments of this application;

[0047] Figure 3 This is a virtual structural diagram of the BOSA temperature compensation device provided in this application;

[0048] Figure 4This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0049] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0050] The following will clearly and completely describe the concept, specific structure, and resulting technical effects of this application in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this application. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this application can be combined interactively without contradicting each other.

[0051] Reference Figure 1 , Figure 1 This is a schematic flowchart of the BOSA temperature compensation method provided in the embodiments of this application. Figure 1 The steps involved in the dynamic compensation method provided in this application are illustrated below, with each step explained in detail:

[0052] In step S1, a set of target devices is determined, and the BOSA temperature value and register conversion temperature value of each target device in the set of target devices under a preset state are collected to generate a temperature dataset.

[0053] The target equipment set refers to a group of similar equipment that need to have their temperature deviation calibrated, such as 10 identical FTTR devices. The preset state refers to the equipment running continuously for the same amount of time under a fixed ambient temperature until it reaches a thermally stable state, such as running for 1 hour under a certain ambient temperature. The BOSA temperature value is the actual temperature measured by a physical sensor, while the register-converted temperature value is the initial temperature value obtained by reading raw data from a specific register of the BOSA driver chip (such as UX3326), performing decimal conversion, and proportional calculation.

[0054] Specifically, firstly, select multiple devices of the same batch or specifications (e.g., 10 FTTR machines) to ensure that their hardware characteristics are consistent, and determine this batch of devices as the target device set. Then, under a preset ambient temperature, allow the devices to run to thermal equilibrium (e.g., for 1 hour), measure the physical temperature of each device as the BOSA temperature, then synchronously read the original register data and perform data conversion to obtain the register conversion temperature values ​​of multiple target devices. Finally, pair the BOSA temperature of each device with the corresponding register conversion temperature value to form a temperature dataset.

[0055] For example, in one embodiment, assuming the target devices are five FTTR devices, after operating for one hour in a 25°C environment, the measured T0 values ​​for each device are 48.50°C, 49.20°C, 47.80°C, 50.10°C, and 48.90°C, respectively. Simultaneously, register values ​​are read and converted to TValues ​​(e.g., 30.20°C, 31.50°C, 29.80°C, 32.00°C, and 30.50°C). The generated temperature dataset contains five pairs of (BOSA temperature values, register-converted temperature values), such as (47.2, 83) and (49.6, 86). This temperature dataset is used for subsequent calculation of dynamic compensation values ​​to reduce the deviation between the reported and actual temperatures.

[0056] More specifically, in this embodiment of the application, the step of collecting the BOSA temperature value and register-converted temperature value of each target device in the target device set under a preset state to generate a temperature dataset includes:

[0057] Collect the specified register address value of the BOSA driver chip for each of the target devices.

[0058] Specifically, for each device in the target device set, the system reads the hexadecimal value stored in a preset register address in its BOSA driver chip (e.g., the UX3326 model BOSA driver chip). In this embodiment, the preset register address ranges from 2Eh to 2Fh. This operation is completed through hardware interface communication with the chip, ensuring that the register data of each device is accurately acquired.

[0059] Furthermore, each of the aforementioned register address values ​​is converted to decimal, and the quotient of the converted register address value and 256 is used as the register conversion temperature value of the corresponding target device.

[0060] Specifically, the read hexadecimal value is converted to decimal form, and the corresponding register-converted temperature value (TValue) is obtained by dividing by 256. Finally, the actual BOSA measured temperature values ​​of all devices (BOSA temperature values ​​measured by 10 machines) are paired with their respective register-converted temperature values ​​(TValue) to form a temperature dataset containing the correspondence between the two.

[0061] In step S2, a compensation value for each of the target devices is calculated based on the temperature dataset.

[0062] Specifically, calculating the compensation value for each target device based on the temperature dataset means deriving a dynamic compensation value for correcting temperature deviations using mathematical formulas based on the correspondence between the actual measured temperature and the register conversion temperature.

[0063] The temperature dataset includes the actual BOSA temperature value (denoted as T0) and register conversion temperature value (denoted as TValue) measured by each device. The formula for calculating the compensation value (denoted as Offset) is as follows:

[0064] Offset = T0 - TValue × Slope;

[0065] Where Offset is the compensation value, T0 is the BOSA temperature value, TValue is the register-converted temperature value, and Slope is the preset temperature coefficient.

[0066] Specifically, for each set of data in the temperature dataset (i.e., the BOSA temperature and TValue of each device), TValue is multiplied by a preset slope (1.92) to obtain the theoretical temperature baseline corresponding to the register-converted temperature value. Then, the theoretical value is subtracted from the actual measured temperature T0 to obtain the compensation value Offset for the current device. (Register-converted temperature value)

[0067] More specifically, in this embodiment of the application, taking 10 FTTR machines as an example, after the 10 machines run simultaneously for one hour at a certain ambient temperature, the BOSA temperature of these 10 machines is measured and recorded. Then, by reading the register address value of the BOSA driver chip UX3326 register of each machine, its hexadecimal number (TEMP_DATA) is read, converted to decimal, and divided by 256 to obtain the compensation value corresponding to each machine. The recorded values ​​are shown in the following table:

[0068]

[0069] It can be seen that the compensation value Offset is not a fixed value. If the conventional method is used to compensate based on the average compensation value (-114.62 in this example), the deviation range of the 10 devices is... Δ The temperature range (T) is between -2.72℃ and 3.48℃, which exceeds the standard range of + / -2℃, indicating a significant deficiency in accuracy requirements.

[0070] In step S3, based on the register conversion temperature value and compensation value of all the target devices, a distribution coordinate representation is constructed with the register conversion temperature value on the horizontal axis and the compensation value on the vertical axis.

[0071] Specifically, the TValue and corresponding Offset value of each device are obtained from the temperature dataset. With TValue as the horizontal axis and Offset as the vertical axis, the (TValue, Offset) data pairs of all devices are mapped to a two-dimensional plane to form a scatter plot. The clustering trend of the scatter points in the coordinate system (such as whether they are approximately linearly distributed) provides a basis for the subsequent dynamic compensation algorithm.

[0072] More specifically, refer to Figure 2 , Figure 2 This is a schematic diagram of the distribution coordinates provided in an embodiment of this application. In the diagram, the five points A, B, C, D, and E of the broken line between the Offset value and the TValue value are approximately linearly aligned on a straight line; of the other five points, two are above the line and the other three are below the line, which conforms to the randomness of the sample. Therefore, it is envisioned that the Offset value is dynamically adjusted based on the TValue value according to the linear equation, serving as the temperature compensation value for BOSA.

[0073] In step S4, a sampling line representing the distribution coordinates is obtained by fitting, and several sample points are selected as target sample points based on the sampling line.

[0074] Among them, the sampling line is a straight line that reflects the overall trend of the data and is obtained by fitting through mathematical methods (such as the least squares method). Its purpose is to approximate the linear relationship of the data points. The target sample points are data points selected from the original data that have a small deviation from the sampling line and are highly representative, and are used for subsequent calculations or analysis.

[0075] Specifically, based on all (TValue, Offset) data points in the distributed coordinate system, a best-fit line is calculated using mathematical methods (such as the least squares method). Several data points from the original data that deviate least from the sampled line are selected as target sample points. For example, [the following is a possible interpretation of the original text, but the full context is missing]. Figure 2 Points A, B, C, D, and E are approximately distributed on the fitted line, while other points deviate significantly. Therefore, these five points are selected as target sample points for subsequent calculations or verification.

[0076] More specifically, in this embodiment of the application, the step of fitting the sampling line represented by the distribution coordinates and selecting several sample points as target sample points based on the sampling line includes:

[0077] The sampling line represented by the distribution coordinates is obtained by fitting using the least squares method;

[0078] The residual sum of squares for each sample point is calculated based on the sampling line, and sample points whose residual sum of squares is lower than a preset threshold are selected as the target sample points.

[0079] Among them, the sampling line is a straight line that reflects the overall trend of the data and is obtained by fitting with the least squares method. Its purpose is to approximate the linear relationship of the data points; the residual sum of squares is the square of the vertical distance from each sample point to the sampling line (i.e., the difference between the actual offset and the calculated value of the straight line equation), which is used to quantify the degree of deviation between the data points and the line; the preset threshold is a pre-set numerical limit used to select sample points with smaller residual sums of squares as target sample points.

[0080] Specifically, based on all (TValue, Offset) data points in the distributed coordinate system, a best-fit line is calculated using the least squares method. For each sample point, the difference between its actual Offset value and the calculated value from the sampled line equation (i.e., the residual) is calculated, and the squared residuals are summed to obtain the sum of squared residuals for that point. Sample points with a sum of squared residuals below a preset threshold are then filtered out. Finally, Figure 2 Points A, B, C, D, and E shown are selected as target sample points for subsequent calculation of dynamic compensation values ​​because their residual sum of squares is low and their distribution is close to the sampling line.

[0081] In step S5, the linear compensation equation is solved by using a preset set of equations based on the coordinate data of the target sample points.

[0082] Among them, the preset equation set refers to the mathematical equation set established based on the principle of least squares, which is used to solve the slope k and intercept b of the best-fit line. The linear compensation equation is the linear relationship obtained by solving the equation set, which is used to dynamically calculate the temperature compensation value.

[0083] Specifically, the TValue and Offset values ​​are obtained from the target sample points. For example, the coordinates of point A are (82.5, -111.9), point B is (84, -113.78), point C is (85.5, -115.66), point D is (85.75, -115.94), and point E is (87.5, -118.1). Then, based on the principle of least squares, the slope and intercept are calculated using the coordinate data of the target sample points. After substituting the coordinate data of the target sample points into the formula, the slope k and intercept b are obtained. Subsequently, k and b in the equation are stored as fixed parameters in the MCU used for temperature compensation for application of the compensation equation.

[0084] More specifically, in this embodiment of the application, one target sample point corresponds to one target device; the step of solving the linear compensation equation based on the coordinate data of the target sample point using a preset set of equations includes:

[0085] The register conversion temperature value of the target device is used as the horizontal axis value, and the compensation value of the target device is used as the vertical axis value;

[0086] Summate the x-coordinate values, y-coordinate values, the square of the x-coordinate, and the product of the x and y coordinates respectively.

[0087] Substitute all accumulated values ​​into the preset set of equations to solve for the slope and intercept of the linear compensation equation, thereby determining the linear compensation equation.

[0088] The cumulative summation refers to summing up the x-coordinate, y-coordinate, squared x-coordinate, and product of x-coordinate for all target sample points.

[0089] Specifically, in this embodiment, the least squares method is used to find the equation of the line closest to the five points A, B, C, D, and E, and then the x-axis of each target sample point is calculated. i y i , x i y i And sum them, where x can be x i The register converts the temperature value for the target sample point, y. i The compensation values ​​for the target sample points can be obtained by recording them in the following table:

[0090]

[0091] Furthermore, in this embodiment of the application, the preset set of equations is:

[0092]

[0093] Where, x i Let y be the x-coordinate of the i-th target sample point. i Let be the ordinate value of the i-th target sample point, and n be the number of target sample points;

[0094] k is the slope of the linear compensation equation, b is the intercept of the linear compensation equation on the vertical axis, and k and b are the parameters to be solved. The linear compensation equation is determined by k and b.

[0095] Specifically, in this embodiment, after substituting the summed data into the above equation, the above system of equations is solved: k = -1.24, b = -9.54. Then, the equation of the line closest to points A, B, C, D, and E is y = -1.24x - 9.54. That is, the formula used to dynamically generate the compensation value based on the real-time updated register conversion temperature value of any target device, combined with the linear compensation equation, is:

[0096] Offset = TValue × kb.

[0097] In step S6, a compensation value is dynamically generated based on the real-time updated register conversion temperature value of any target device and the linear compensation equation. After performing temperature compensation based on the generated compensation value, the reported temperature is determined.

[0098] Specifically, when the target device is running, the MCU continuously reads hexadecimal temperature data from the designated register of the BOSA driver chip, converts it to decimal and divides it by 256 to obtain the real-time updated register conversion temperature value. The real-time updated register conversion temperature value is substituted into the linear compensation equation to calculate the current compensation value. Then, the reported temperature is calculated using the formula T1 = Offset + TValue × Slope, where T1 is the corrected reported temperature.

[0099] Reference Figure 3 , Figure 3 This is a virtual structural diagram of the BOSA temperature compensation device provided in this application. A second aspect of this application provides a BOSA temperature compensation device, comprising:

[0100] The data acquisition module 100 is used to determine the target device set, collect the BOSA temperature value and register conversion temperature value of each target device in the target device set under a preset state, and generate a temperature dataset.

[0101] The compensation calculation module 200 is used to calculate the compensation value for each of the target devices based on the temperature dataset;

[0102] The coordinate construction module 300 is used to construct a distributed coordinate representation based on the register conversion temperature value and the compensation value of all the target devices, with the register conversion temperature value as the horizontal axis and the compensation value as the vertical axis.

[0103] The sample selection module 400 is used to fit the sampling line represented by the distribution coordinates and select a number of sample points as target sample points based on the sampling line.

[0104] The equation determination module 500 is used to solve the linear compensation equation based on the coordinate data of the target sample points and through a preset set of equations.

[0105] The compensation execution module 600 is used to dynamically generate a compensation value based on the real-time updated register conversion temperature value of any target device and the linear compensation equation, and then perform temperature compensation based on the generated compensation value to determine the reported temperature.

[0106] The BOSA temperature compensation device described in this application embodiment can execute the BOSA temperature compensation method provided in the above embodiments. The BOSA temperature compensation device has the corresponding functional steps and beneficial effects of the BOSA temperature compensation method described in the above embodiments. For details, please refer to the embodiments of the above BOSA temperature compensation method. The embodiments of this application will not be repeated here.

[0107] This application also provides an electronic device, please refer to... Figure 4 , Figure 4This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include a processor and a memory, which can be connected via a bus or other means. The processor may be a Central Processing Unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or combinations of the above types of chips. The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, and modules, such as the program instructions / modules corresponding to the BOSA temperature compensation method in the embodiments of this application. The processor executes various functional applications and data processing by running the non-transitory software programs, instructions, and modules stored in the memory, thereby implementing the BOSA temperature compensation method in the above method embodiments.

[0108] The memory may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created by the processor, etc. Furthermore, the memory may include high-speed random access memory and non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. The one or more modules are stored in the memory and, when executed by the processor, perform the BOSA temperature compensation method as described in the above method embodiments. Specific details of the above electronic device can be understood by referring to the corresponding descriptions and effects in the above method embodiments, and will not be repeated here. Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it may include the processes of the embodiments of the above methods. The storage medium may be a read-only memory (ROM), a random access memory (RAM), a flash memory, a hard disk drive (HDD), or a solid-state drive (SSD), etc.; the storage medium may also include a combination of the above types of memory.

[0109] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification. It should be noted that the foregoing embodiments are illustrative and not restrictive of this application, and that alternative embodiments may be devised by those skilled in the art without departing from the scope of the appended claims.

Claims

1. A BOSA temperature compensation method, characterized in that, The method includes: Determine the target device set, collect the BOSA temperature value and register conversion temperature value of each target device in the target device set under a preset state, and generate a temperature dataset; Calculate the compensation value for each of the target devices based on the temperature dataset; Based on the register conversion temperature value and compensation value of all the target devices, a distribution coordinate representation is constructed with the register conversion temperature value on the horizontal axis and the compensation value on the vertical axis. The sampling line represented by the distribution coordinates is obtained by fitting, and several sample points are selected as target sample points based on the sampling line; Based on the coordinate data of the target sample points, the linear compensation equation is solved by a set of preset equations. Based on the real-time updated register conversion temperature value of any target device, a compensation value is dynamically generated in conjunction with the linear compensation equation. After performing temperature compensation based on the generated compensation value, the reported temperature is determined.

2. The BOSA temperature compensation method according to claim 1, characterized in that, The step of collecting the BOSA temperature value and register-converted temperature value of each target device in the target device set under a preset state to generate a temperature dataset includes: Collect the specified register address value of the BOSA driver chip for each of the target devices; Each of the aforementioned register address values ​​is converted to decimal, and the quotient of the converted register address value and 256 is used as the register conversion temperature value of the corresponding target device.

3. The BOSA temperature compensation method according to claim 1, characterized in that, The formula used to calculate the compensation value for each target device based on the temperature dataset is as follows: Offset = T0 - TValue × Slope; Where Offset is the compensation value, T0 is the BOSA temperature value, TValue is the register-converted temperature value, and Slope is the preset temperature coefficient.

4. The BOSA temperature compensation method according to claim 1, characterized in that, The step of fitting the sampling line represented by the distribution coordinates and selecting several sample points as target sample points based on the sampling line includes: The sampling line represented by the distribution coordinates is obtained by fitting using the least squares method; The residual sum of squares for each sample point is calculated based on the sampling line, and sample points whose residual sum of squares is lower than a preset threshold are selected as the target sample points.

5. The BOSA temperature compensation method according to claim 1, characterized in that, One target sample point corresponds to one target device; The step of solving the linear compensation equation based on the coordinate data of the target sample points using a preset set of equations includes: The register conversion temperature value of the target device is used as the horizontal axis value, and the compensation value of the target device is used as the vertical axis value; Summate the x-coordinate values, y-coordinate values, the square of the x-coordinate, and the product of the x and y coordinates respectively. Substitute all accumulated values ​​into the preset set of equations to solve for the slope and intercept of the linear compensation equation, thereby determining the linear compensation equation.

6. The BOSA temperature compensation method according to claim 1, characterized in that, The preset set of equations is as follows: Where, x i Let y be the x-coordinate of the i-th target sample point. i Let be the ordinate value of the i-th target sample point, and n be the number of target sample points; k is the slope of the linear compensation equation, b is the intercept of the linear compensation equation on the vertical axis, and k and b are the parameters to be solved. The linear compensation equation is determined by k and b.

7. The BOSA temperature compensation method according to claim 6, characterized in that, The formula used to dynamically generate the compensation value based on the real-time updated register conversion temperature value of any target device, combined with the linear compensation equation, is as follows: Offset = TValue × kb.

8. A BOSA temperature compensation device, characterized in that, include: The data acquisition module is used to determine the target device set, collect the BOSA temperature value and register-converted temperature value of each target device in the target device set under a preset state, and generate a temperature dataset. The compensation calculation module is used to calculate the compensation value for each of the target devices based on the temperature dataset. A coordinate construction module is used to construct a distributed coordinate representation based on the register conversion temperature value and the compensation value of all the target devices, with the register conversion temperature value as the horizontal axis and the compensation value as the vertical axis. The sample selection module is used to fit the sampling line represented by the distribution coordinates and select several sample points as target sample points based on the sampling line. The equation determination module is used to solve the linear compensation equation based on the coordinate data of the target sample points and a preset set of equations. The compensation execution module is used to dynamically generate a compensation value based on the real-time updated register conversion temperature value of any target device and the linear compensation equation, and then perform temperature compensation based on the generated compensation value to determine the reported temperature.

9. An electronic device, characterized in that, include: One or more processors; One or more memory units; And one or more computer programs, wherein the one or more computer programs are stored in the one or more memories, the one or more computer programs including instructions that, when executed by the one or more processors, cause the electronic device to perform the method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The storage medium stores a program or instructions that, when executed, implement the method as described in any one of claims 1 to 7.

Images