Control method for adjusting film tearing strength and speed

Abstract

The invention provides a control method for adjusting film tearing strength and speed, which belongs to the technical field of film tearing and comprises the following steps: acquiring initial film tearing angle data and tension set value data on the basis of a preset film material characteristic database, and acquiring a film tearing path and an expected position sequence on the basis of wafer size and de-bonding process parameters; real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data and real-time position data are obtained based on an encoder and a position sensor; based on the real-time film tearing tension data and the real-time film tearing angle data, acquiring a film tearing abnormal flag bit, and based on the real-time position data and the expected position sequence, acquiring a position deviation identifier; acquiring a position control quantity based on the position deviation mark, and acquiring a tension control quantity based on the film tearing abnormal mark position and an initial tension set value; a total control acting force instruction is obtained and executed based on the position control quantity and the tension control quantity, and the risks of wafer position deviation and film tearing path deviation caused by the fact that the angle deviation is not perceived are reduced.

Description

Technical Field

[0001] This invention belongs to the field of film-tearing technology, and more specifically, relates to a method for controlling the film-tearing force and speed. Background Technology

[0002] In the semiconductor wafer manufacturing process, the debonding and film removal process is the step to separate the wafer from the substrate. As semiconductor technology develops towards larger wafers and ultra-thin films, and as debonding process parameters become more diverse and adaptable, the requirements for controlling the force and speed during the film removal process are becoming increasingly stringent.

[0003] Existing film-tearing control methods mostly rely on fixed parameters or human experience, making it difficult to dynamically adjust the operation strategy according to changes in film material characteristics and wafer specifications. They only collect tension data through a single force sensor and lack synchronous monitoring of the film-tearing angle and real-time position, making it difficult to fully reflect the dynamic state during the film-tearing process. This can lead to excessive angle deviation, causing wafer position shift and resulting in deviation of the film-tearing path. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a control method for adjusting the film-tearing force and speed. This method solves the technical problem that in the prior art, traditional film-tearing control methods rely solely on a single force sensor to collect tension data, making it difficult to fully reflect the dynamic state during the film-tearing process. Furthermore, angular deviations can easily cause wafer position shifts, leading to deviations in the film-tearing path.

[0005] The purpose and effect of the method for adjusting the film-tearing force and speed of the present invention are achieved by the following specific technical means: A method for controlling the film-tearing force and speed includes the following steps: S1: Based on a preset film material characteristic database, obtain initial film tearing angle data and tension setting data; based on wafer size and debonding process parameters, obtain the film tearing path and desired position sequence; S2: Real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data and real-time position data are obtained based on an encoder and a position sensor; S3: Perform peeling status assessment based on real-time film tearing tension data and real-time film tearing angle data to obtain film tearing abnormality flags; obtain position deviation flags based on real-time position data and expected position sequences; S4: Based on the position deviation indicator, perform position compensation calculation to obtain the position control value; based on the tear film abnormality flag and the initial tension setting value, perform tension compensation calculation to obtain the tension control value. S5: Based on position control and tension control, perform multi-target control fusion operation to obtain the total control force command; S6: Perform servo system control operations based on the total control force command, and verify the control effect.

[0006] According to a preferred embodiment, the step of obtaining initial film-tearing angle data and tension setpoint data based on a preset film material characteristic database, and obtaining the film-tearing path and desired position sequence based on wafer size and debonding process parameters, includes: Obtain membrane type, thickness and adhesion parameters from the membrane property database, and query the standard tear angle range corresponding to the membrane type as the initial tear angle data; The initial tearing speed data is matched according to the film thickness value. When the film thickness value is 50 μm or above, the first tearing speed is used. When the film thickness value is 20 μm or below, the second tearing speed is used. The first tearing speed is less than the second tearing speed. When the film thickness value is in the range of (20, 50) μm, the linear transition speed is used. The linear transition speed means that the higher the film thickness value, the closer the tearing speed is to the first tearing speed. The lower the film thickness value, the closer the tearing speed is to the second tearing speed. The tension safety threshold is set according to the adhesion force parameters. The tension safety threshold includes an upper limit to prevent breakage and a lower limit to prevent residue. The wafer dimensions and debonding process parameters are obtained, and a spiral trajectory starting from the edge of the wafer is generated as the moving path of the film-peeling module. Path points are set every 1 mm along the movement path, and a desired position sequence is formed based on the desired three-dimensional coordinates and desired speed of multiple path points.

[0007] According to a preferred embodiment, the step of acquiring real-time film tearing tension data based on a force sensor and acquiring real-time film tearing angle data and real-time position data based on an encoder and a position sensor includes: Based on the force sensors installed on the film-tearing module and the film-pressing roller, the vertical peeling force and the horizontal shearing force are collected simultaneously. The resultant force of peeling force and shear force is calculated as real-time film tearing tension data; The Z-axis height of the film-tearing module is measured by an encoder and position sensor integrated into the servo lifting module to obtain real-time film-tearing angle data. The current actual three-dimensional coordinates and actual movement speed of the film-tearing module are recorded as real-time position data.

[0008] According to a preferred embodiment, the peeling status assessment operation based on real-time film tearing tension data and real-time film tearing angle data is performed to obtain a film tearing abnormality flag; the position deviation flag is obtained based on real-time position data and a desired position sequence, including: By comparing real-time film tearing tension data with the set tension safety threshold, and by comparing real-time film tearing angle data with the initial film tearing angle data, the abnormal film tearing flag can be obtained. Among them, when the real-time film tearing tension data exceeds the upper limit threshold to prevent breakage, the film tearing abnormality flag is indicated as "over-tension" abnormality; When the real-time film tearing tension data is lower than the lower limit threshold for preventing residue, the film tearing abnormality flag indicates "low tension" abnormality. When the angle deviation between the real-time film tearing angle data and the initial film tearing angle data exceeds ±5°, the film tearing abnormality flag indicates an "angle deviation" abnormality. Based on real-time location data and the expected location sequence, a progress compliance check is performed to obtain a location deviation identifier.

[0009] According to a preferred embodiment, the step of performing a progress compliance check based on real-time location data and a desired location sequence to obtain a location deviation identifier includes: Path points at the same time are extracted from the desired location sequence based on real-time location data, and the location deviation is obtained based on the Euclidean distance deviation between the real-time location data and the path points. The actual speed is obtained based on real-time location data, and the speed deviation is obtained based on the difference between the actual speed and the expected speed. The position deviation and the rate deviation are combined into a single position deviation indicator.

[0010] According to a preferred embodiment, the step of calculating the position compensation amount based on the position deviation identifier to obtain the position control amount, and calculating the tension compensation amount based on the tear film abnormality flag and the initial tension setting value to obtain the tension control amount, includes: Based on the position deviation identifier, the position compensation amount is calculated using a PID control algorithm, including proportional, integral and derivative terms, to obtain the position control amount; Based on the abnormal tearing marker, tension compensation is performed to obtain the tension control amount; When the abnormal tearing flag indicates "over-tension" abnormality, reduce the tearing speed and tearing angle. When the tearing abnormality flag indicates "low tension" abnormality, increase the tearing speed and increase the tearing angle. When the tear film abnormality flag indicates an "angle deviation" abnormality, the tear film angle is adjusted based on the angle deviation between the real-time tear film angle data and the initial tear film angle data.

[0011] According to a preferred embodiment, the step of performing servo system control operations based on the total control force command and verifying the control effect includes: Based on the total control force command, the lifting height of the film-tearing module is adjusted to regulate the real-time film-tearing angle data; Adjust the knurling spindle winding speed to regulate the real-time film tearing tension data; Steps S2 to S6 are repeated, and the adjusted real-time film tearing force data and real-time position data are obtained through force sensor and position sensor. Continue the film removal operation if no abnormal film removal indicator or positional deviation indicator appears. If the abnormal film tearing indicator or position deviation indicator still appears after three consecutive adjustments, the emergency stop mechanism will be triggered and an alarm will be sounded.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. By synchronously acquiring the vertical peeling force and horizontal shearing force through the film-tearing module and force sensor, and calculating the resultant force of the two as real-time film-tearing tension data, this method can more accurately reflect the stress state of the film material compared to single tension data. At the same time, by using the encoder and position sensor integrated into the servo lifting module, the real-time film-tearing angle data is obtained by measuring the Z-axis height of the film-tearing module, and the actual three-dimensional coordinates and movement speed of the film-tearing module are recorded as real-time position data. This multi-dimensional data acquisition method can simultaneously cover tension, angle, and position data, avoiding the omission of angle deviation and position offset due to only monitoring tension, and reducing the risk of wafer position offset and film-tearing path deviation caused by undetected angle deviation.

[0013] 2. By employing anomaly assessment criteria and compensation logic, issues such as angle deviation during the film-tearing process can be identified, and targeted compensation amounts can be calculated to correct these deviations and prevent path deviation. First, based on a comparison between real-time and initial film-tearing angle data, if the angle deviation reaches the anomaly standard, an angle deviation anomaly flag is generated. Simultaneously, by combining real-time position data and the desired position sequence, a position deviation flag is formed by calculating Euclidean distance deviation and rate deviation, clearly defining the anomaly type and severity. Subsequently, for angle deviation anomalies, the film-tearing angle is directly corrected by adjusting the lifting height of the film-tearing module. For position deviation flags, a PID control algorithm is used to calculate position compensation amounts including proportional, integral, and derivative terms, adjusting the position of the film-tearing module. For tension-related anomalies, the film-tearing speed and angle are also adjusted synchronously to optimize the stress state. By identifying anomalies first and then providing targeted compensation, the film-tearing angle deviation can be proactively corrected, preventing wafer position shifts due to angle deviation, thereby ensuring that the film-tearing module always moves along the preset spiral trajectory and avoiding path deviation.

[0014] 3. By constructing a closed-loop control process of monitoring, evaluation, compensation, and verification, the effect of parameter adjustment can be verified in real time, and anomalies can be continuously corrected to maintain the stability of the film-tearing path and avoid the accumulation of deviations that lead to path deviation. After the servo system is adjusted based on the total control force command, a new round of real-time tension, angle, and position data will be collected immediately to re-evaluate the peeling status and check the position deviation to determine whether the anomaly still exists after adjustment. If the anomaly is not eliminated, the data acquisition, anomaly evaluation, compensation calculation, and servo control steps will continue to be executed in a loop until the anomaly disappears. If the anomaly is still not resolved after multiple adjustments, an emergency stop mechanism will be triggered to prevent the problem from escalating. Attached Figure Description

[0015] Figure 1 This is a flowchart of the steps of the present invention; Figure 2 This is a flowchart of the steps for obtaining the film tearing abnormality marker and the position deviation identifier in this invention; Figure 3 This is a flowchart of the steps involved in the servo system control operation in this invention. Detailed Implementation

[0016] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0017] Example:

[0018] As attached Figures 1 to 3 As shown: This invention provides a method for controlling the tearing force and speed of film, comprising the following steps: S1: Based on a preset film material characteristic database, obtain initial film tearing angle data and tension setting data; based on wafer size and debonding process parameters, obtain the film tearing path and desired position sequence; Specifically, the membrane material property database needs to pre-enter basic information about membrane materials under different application scenarios, covering membrane material type, full-specification thickness parameters, and adhesion test results under different ambient temperatures. When using the system, the operator inputs the model of the membrane material to be processed, and the system extracts the corresponding membrane material type, thickness, and adhesion parameters from the membrane material property database. Then, it queries the standard tear angle range corresponding to the membrane material type as the initial tear angle data. The initial tearing speed is matched based on the film thickness value. When the film thickness is 50μm or more, the first tearing speed is used because the tensile strength is weaker at this thickness. The first tearing speed can reduce local stress concentration caused by excessive stretching speed during the tearing process, preventing tearing gaps in the film. When the film thickness is 20μm or less, the second tearing speed is used because the film has better flexibility at this thickness. The second tearing speed can shorten the tearing time of a single wafer and improve the overall efficiency of the semiconductor production line. The first tearing speed is lower than the second tearing speed. When the film thickness is between 20μm and 50μm, a linear transition speed is used. That is, the speed is adjusted proportionally according to the thickness value. The closer the thickness is to 50μm, the closer the speed is to the first tearing speed. The closer the thickness is to 20μm, the closer the speed is to the second tearing speed. This avoids drastic changes in the stress state of the film due to sudden speed changes, which could cause local damage to the film. Based on the adhesion parameters, a tension safety threshold is set. If the film material has a high adhesion parameter (≥5N / 25mm), the upper limit for preventing breakage is set slightly lower than the tensile strength of the film material to prevent the tension from exceeding the limit and causing the film material to break during subsequent film removal. At the same time, the lower limit for preventing residue is set 1.2 times higher than the adhesion parameter to ensure that the tension is sufficient to completely remove the film material from the wafer surface without leaving any residue that may affect subsequent processes. If the film material has a low adhesion parameter (≤2N / 25mm), the upper limit for preventing breakage is appropriately reduced to avoid excessive tension damaging the circuit structure at the edge of the wafer. At the same time, the lower limit for preventing residue is set 1.1 times higher than the adhesion parameter to reduce the force on the wafer while avoiding residue.

[0019] The system obtains the wafer size and debonding process parameters. Based on the wafer size, the system calculates the radius range of the spiral trajectory. The spiral trajectory starts 2mm from the edge of the wafer, close to the wafer positioning notch, and extends towards the center of the wafer with a uniform pitch. The pitch is adjusted according to the debonding process parameters. If the debonding temperature is greater than or equal to 80℃, the film adhesion will decrease slightly, so the pitch is set to 5mm. If the temperature is less than 80℃, the film adhesion will remain at a high level, so the pitch is set to 3mm. This spiral trajectory ensures that the peeling force on the film is evenly distributed on the wafer surface during the movement of the film peeling module, avoiding wafer edge damage or film tearing caused by concentrated force in local areas. A path point is set every 1 mm along the moving path. Each path point contains the desired three-dimensional coordinates and desired speed. For path points near the wafer edge, the desired speed is set to a slightly higher value because the adhesion between the film and the wafer edge is relatively weak. For path points near the wafer center, the desired speed is set to a slightly lower value because the film covers a larger area and is more tightly bonded to the wafer. Based on the desired three-dimensional coordinates and desired speed of these path points, a complete desired position sequence is formed. This sequence can be used as a reference for comparing real-time position data in subsequent steps to ensure that the film-peeling module always moves along the preset trajectory without significant deviation.

[0020] For example, when processing a 12-inch wafer using a 50μm thick high-adhesion UV film, the control unit first retrieves the parameters of the UV film from the film material characteristic database: film type: high-adhesion UV film, thickness: 50μm, adhesion force: 6N / 25mm. The corresponding initial tear angle range is found to be 30°-45°, and 35° is selected as the initial tear angle. Since the film thickness is 50μm, the initial tear speed is set to a low speed of 5mm / s. Based on the adhesion force of 6N / 25mm, the upper limit for preventing breakage is set to 8N, and the lower limit for preventing residue is set to 7.2N. Combined with the 12... Using an inch wafer size and a debonding temperature of 60°C, a spiral trajectory with a pitch of 4mm is generated, starting from the edge coordinates X:150mm, Y:0mm near the wafer positioning notch. A path point is set every 1mm along the trajectory. The Z-axis coordinate of the edge path point X:150mm, Y:0mm is set to 10mm with a desired speed of 5mm / s, and the Z-axis coordinate of the center path point X:0mm, Y:0mm is set to 25mm with a desired speed of 3mm / s. Based on these path point information, a desired position sequence is formed. The above data is only for illustrating the process, and the specific data should be determined according to the actual situation.

[0021] S2: Real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data and real-time position data are obtained based on an encoder and a position sensor; Specifically, force sensors need to be installed on the inner side of the clamping end of the film-tearing module and the shaft end of the pressure roller, respectively. The force sensor of the film-tearing module is used to collect the vertical peeling force when the film is torn off, and the force sensor of the pressure roller is used to collect the horizontal shearing force when the film-tearing module moves laterally. The two sets of force sensors are connected to the control unit through wires to ensure that the data of the two forces are collected synchronously during the film-tearing process, so as to avoid the deviation of force analysis due to asynchronous collection. After collecting the vertical peeling force and the horizontal shearing force, the control unit will calculate the resultant force of the two according to the vector synthesis principle. Specifically, it will calculate the square root of the sum of the square of the peeling force and the square of the shearing force through the Pythagorean theorem, and use the resultant force as the real-time film-tearing tension data. This method can completely reflect the actual stress state of the film in three-dimensional space. Compared with collecting tension data in only one direction, it can avoid missing the local stress concentration in the lateral or longitudinal direction. Real-time film-tearing angle data is obtained by integrating an encoder and a position sensor into the servo lifting module. The encoder needs to be installed on the motor output shaft of the servo lifting module to record the number of motor rotations and convert them into the Z-axis lifting displacement of the film-tearing module. The position sensor is installed next to the guide rail of the servo lifting module to assist in confirming the actual Z-axis height of the film-tearing module through laser or infrared methods. The combination of the two data can accurately determine the real-time Z-axis height of the film-tearing module. The film-tearing angle is the angle between the film-tearing module and the wafer surface. Its value can be calculated by the ratio of the Z-axis height of the film-tearing module to the horizontal projection distance. The control unit will automatically calculate the real-time film-tearing angle data based on the real-time Z-axis height. When the Z-axis height of the film-tearing module increases, the real-time film-tearing angle will increase, and when the Z-axis height decreases, the angle will decrease. By monitoring this angle in real time, abnormal angles caused by servo lifting module failures can be detected in time, avoiding incomplete separation of film and wafer due to too small an angle, resulting in residual adhesive layer, or the film being subjected to instantaneous force exceeding its tolerance limit due to too large an angle.

[0022] To record the current actual three-dimensional coordinates and actual moving speed of the film-tearing module as real-time position data, additional X-axis and Y-axis position sensors need to be installed on the horizontal moving guide rail of the film-tearing module. The data from these sensors are combined with the data from the Z-axis position sensor to form the actual three-dimensional coordinates of the film-tearing module. At the same time, the rotation speed of the horizontal moving motor of the film-tearing module is recorded by an encoder and converted into the actual moving speed. This real-time position data is transmitted to the control unit in real time and compared with the expected position sequence generated in S1.

[0023] For example, when processing 12-inch wafers, if the actual X-axis coordinate of the film-peeling module deviates from the corresponding path point in the expected position sequence, real-time position data will immediately report this deviation. This prevents the film-peeling module from continuously deviating from the spiral trajectory due to mechanical vibration, thereby preventing the circuit structure at the wafer edge from being scratched and damaged by the film-peeling module. This multi-dimensional data acquisition method can simultaneously cover the three core parameters of tension, angle, and position, avoiding the omission of issues such as angle deviation and positional offset due to monitoring only tension, and reducing the risk of wafer positional offset and film-peeling path deviation caused by undetected angle deviation.

[0024] S3: Based on real-time film tearing tension data and real-time film tearing angle data, perform peeling status assessment operation and obtain film tearing abnormality flag; based on real-time position data and expected position sequence, obtain position deviation flag; the control unit will first receive the real-time film tearing tension data, real-time film tearing angle data and real-time position data transmitted by the force sensor, encoder and position sensor in S2, and then process them step by step according to the preset assessment logic to determine whether the film tearing process is stable and whether there is a deviation.

[0025] Specifically, obtaining the abnormal film tearing marker and positional deviation indicator includes: S300: The control unit first calls the tension safety threshold set in S1 based on the preset membrane material characteristic database, and compares it with the initial tearing angle data. Then, it compares the real-time tearing tension data with the tension safety threshold in real time, and compares the real-time tearing angle data with the initial tearing angle data. Based on the comparison results, it generates a tearing abnormality flag. When the real-time tearing tension data exceeds the upper limit threshold to prevent breakage, the tearing abnormality flag indicates an "over-tension" abnormality. This abnormality flag can indicate that subsequent steps need to adjust parameters to reduce tension, prevent the high-viscosity UV film from tearing laterally due to excessive force, and avoid the torn film fragments from adhering to the wafer surface and affecting subsequent processes. When the real-time film tearing tension data is lower than the lower limit threshold to prevent residue, the film tearing abnormality flag indicates "low tension" abnormality. This abnormality flag can indicate that the tension needs to be increased to prevent the high-viscosity UV film from not completely separating from the wafer surface due to insufficient tension, leaving residual adhesive that affects the performance of the wafer circuit. When the real-time film tearing angle data deviates from the initial film tearing angle data by more than ±5°, the film tearing abnormality flag indicates an "angle deviation" abnormality. This abnormality flag can indicate that the film tearing angle needs to be corrected to avoid unreasonable film peeling direction due to an excessively small angle, or damage caused by instantaneous force concentration on the film due to an excessively large angle.

[0026] S301: The control unit extracts the path points corresponding to the same moment from the expected position sequence generated by S1 based on the timestamp of the real-time position data. Then, according to the Euclidean distance calculation formula, it obtains the Euclidean distance deviation between the real-time position and the expected path point and uses this deviation as the position deviation amount. This position deviation amount can intuitively reflect the degree of deviation between the actual position of the film-peeling module and the preset trajectory, preventing the circuit structure of the film-peeling module from scratching the edge of the wafer due to the continuous expansion of the offset.

[0027] S302: The control unit extracts the actual moving speed of the film-tearing module from the real-time position data, then calls the expected speed corresponding to the expected path point at the same time, calculates the difference between the actual speed and the expected speed, and uses this difference as the speed deviation; then the position deviation and speed deviation are packaged and merged into a position deviation identifier. This identifier can reflect the deviation of the film-tearing module in both position and speed, avoiding the film-tearing rhythm disorder caused by only focusing on the position deviation and ignoring the speed deviation.

[0028] For example, if only the position deviation is corrected but the rate deviation is not adjusted, the film-tearing module may return to the trajectory but the rate may be too slow, causing subsequent path points to lag behind and affecting the overall film-tearing efficiency. The merged position deviation marker can provide a complete basis for the subsequent position compensation calculation, ensuring that the film-tearing module returns to the preset trajectory and maintains a movement rhythm consistent with the expected rate, ensuring that the peeling process of the 50μm thick high-viscosity UV film on the 12-inch wafer is always stable and orderly.

[0029] S4: Based on the position deviation indicator, perform position compensation calculation to obtain the position control quantity; based on the film tearing abnormality flag and the initial tension setting value, perform tension compensation calculation to obtain the tension control quantity; after receiving the position deviation indicator and film tearing abnormality flag output by S3, the control unit will calculate the position compensation quantity and tension compensation quantity respectively according to the preset logic, providing specific parameter basis for subsequent servo control.

[0030] Specifically, step S4 includes: Based on the position deviation identifier, the control unit calls the built-in PID control algorithm. First, it extracts the position deviation and rate deviation from the position deviation identifier, and then calculates the proportional, integral, and derivative terms of the PID. The proportional term is obtained by multiplying the position deviation by a preset proportional coefficient and is used to quickly respond to the current position deviation and prevent the deviation from continuing to increase. The integral term is obtained by multiplying the sum of the position deviation over a period of time by an integral coefficient and is used to eliminate long-term small deviations. The derivative term is obtained by multiplying the rate of change of the position deviation between two adjacent times by a derivative coefficient and is used to predict the trend of deviation changes and prevent over-adjustment. Then, the calculation results of the proportional, integral, and derivative terms are added together to obtain the position compensation amount.

[0031] For example, if the positional deviations of three consecutive samples are 0.8mm, 0.7mm, and 0.6mm respectively, the total deviation is 2.1mm. The integral term output is 2.1mm × 0.5 = 1.05mm, which can compensate for the continuous offset caused by mechanical backlash. If the previous deviation is 0.8mm and the next is 0.7mm, the rate of change is -0.1mm. The differential term output is -0.1mm × 0.3 = -0.03mm, which can slow down the adjustment speed of the film-tearing module, preventing it from rapidly moving past the desired path point. The proportional term will then... The calculation results of the integral and differential terms are added together: 1.6mm + 1.05mm - 0.03mm = 2.62mm. This position compensation amount is the position control amount, which can be directly used to adjust the X-axis, Y-axis, and Z-axis coordinates of the film-tearing module to ensure that the film-tearing module returns to the spiral trajectory set by S1. For example, according to the position control amount, the control unit drives the horizontal movement motor of the film-tearing module to move 1.2mm in the negative X-axis direction and 1.42mm in the negative Y-axis direction, so that the actual position is towards the desired path point. The above data are all assumptions, and the specific data depends on the actual situation.

[0032] Based on the tear film abnormality flag, the control unit combines the initial tension setting value set by S1 to perform tension compensation calculation to obtain the tension control amount; When the tearing abnormality flag indicates an "over-tension" abnormality, the control unit generates tension control quantities to reduce the tearing speed and tearing angle. Reducing the tearing speed is achieved by adjusting the output frequency of the horizontal movement motor of the tearing module, decreasing the actual speed from 4 mm / s to 3.2 mm / s, reducing the friction time between the film and the wafer surface, thereby reducing the horizontal shearing force. Reducing the tearing angle is achieved by controlling the servo lifting module to lower the Z-axis height of the tearing module, adjusting the real-time tearing angle from 35° to 32°, reducing the vertical peeling force. The combined effect of these two measures brings the real-time tearing tension data back to a safe range, preventing the high-viscosity UV film from tearing laterally due to over-tension. When the tearing abnormality flag indicates "low tension", the control unit will generate tension control values ​​to increase the tearing speed and tearing angle: increase the horizontal movement speed of the tearing module from 4mm / s to 4.5mm / s, increase the lateral tension when peeling the film, and at the same time increase the Z-axis height of the tearing module, so that the real-time tearing angle is adjusted from 35° to 38°, increase the vertical peeling force, and ensure that the tension recovers to about 7.6N, so as to avoid the high-adhesion UV film residue layer due to low tension; When the tearing abnormality flag indicates an "angle deviation" anomaly, the control unit calculates the adjustment amount based on the angle deviation and generates a tension control amount to adjust the tearing angle: by raising the Z-axis height of the tearing module via the servo lifting module, adjusting the Z-axis coordinate from 14mm to 16mm, the real-time tearing angle returns from 29° to 35°, correcting the angle deviation and avoiding problems such as unreasonable film peeling direction due to an excessively small angle, leading to localized stress concentration or incomplete separation. Through this targeted compensation logic, it is ensured that the tension and angle of the 50μm thick high-viscosity UV film remain within a reasonable range during the tearing process on a 12-inch wafer, and the tearing module moves stably along the preset trajectory, guaranteeing tearing quality.

[0033] S5: Based on position control and tension control, perform multi-target control fusion operation to obtain the total control force command; Specifically, after receiving the position control and tension control quantities output by S4, the control unit first determines the priority of their corresponding control requirements. The priority is determined based on the severity of the tearing anomaly flag and position deviation flag generated by S3. If there are anomalies such as "over-tension" or "under-tension" that directly affect the integrity of the membrane or the cleanliness of the wafer, the tension control quantity has a higher priority than the position control quantity. If only position deviation exists, the position control quantity has a higher priority to avoid tension exceeding the safety threshold due to prioritizing position adjustment. Subsequently, the multi-objective control fusion logic is activated. This logic assigns weight coefficients to the two types of control quantities according to their priorities, and then multiplies the position control quantity and tension control quantity by their corresponding weights. At the same time, it checks the compatibility between adjustment quantities in different dimensions to prevent conflicts such as tension fluctuations caused by position adjustment or position deviations caused by tension adjustment. Finally, all compatible adjustment quantities are integrated into a unified total control force command to ensure that the command can simultaneously meet the needs of position correction and tension optimization without omitting any control objective.

[0034] For example, in the scenario of tearing a 50μm thick high-viscosity UV film on a 12-inch wafer, the position control quantities of 1.2mm negative X-axis and 1.42mm negative Y-axis have been obtained in S4. These are used to correct the 0.8mm Euclidean distance deviation, so that the tearing module returns to the expected path point X: 120mm and Y: 30mm. The tension control quantities also reduce the tearing speed from 4mm / s to 3.2mm / s and the tearing angle from 35° to 32°. This is used to solve the "over-tension" anomaly where the real-time tearing tension of 8.5N exceeds the upper limit of 8N to prevent breakage. Since the "over-tension" anomaly directly threatens the integrity of the film, the control unit sets the weight coefficient of the tension control quantity to 0.6 and the weight coefficient of the position control quantity to 0.4. During the integration process, the film-tearing speed is first adjusted to 3.2 mm / s according to the tension control quantity. At the same time, the movement rates of the X and Y axes in the position control quantity are matched with this speed. The negative movement rate of the X axis is set to 0.8 mm / s and the negative movement rate of the Y axis is set to 0.95 mm / s to ensure that the film-tearing module does not cause an increase in horizontal shear force due to excessive movement when moving to the desired path point, thus avoiding the aggravation of the over-tension problem. Then, the film-tearing angle is reduced to 32° according to the tension control quantity. Simultaneously, the adjustment amount of the Z axis in the position control quantity is corrected from the originally planned 15 mm to a reduction to 14.2 mm, so that the angle adjustment and the Z axis position adjustment are consistent and no new position deviation is generated. The final integrated control force command includes: negative X-axis movement of 1.2mm, negative Y-axis movement of 1.42mm, Z-axis height reduction to 14.2mm, and film tearing speed reduction to 3.2mm / s. This command can simultaneously achieve two objectives: correcting positional deviation and reducing tension to a safe range. It avoids further tension exceeding the limit due to adjusting the position alone, or positional deviation increasing due to adjusting the tension alone. This ensures that the 50μm thick high-viscosity UV film will not break due to excessive tension or deviate from the spiral trajectory due to positional offset during the film tearing process on a 12-inch wafer, thus ensuring a stable and orderly film tearing operation. The above data is for logical reference only, and the specific data needs to be determined according to the specific situation.

[0035] S6: Perform servo system control operations based on the total control force command, and verify the control effect.

[0036] Specifically, step S6 includes: S600: Based on the total control force command, adjust the lifting height of the film-tearing module to adjust the real-time film-tearing angle data; S601: Adjust the knurling spindle winding speed to adjust the real-time film tearing tension data; S602: After completing the adjustments in S600 and S601, the control unit immediately triggers the loop mechanism and re-executes steps S2 to S6: First, it collects new vertical peeling force and horizontal shear force through the force sensor to calculate the adjusted real-time film tearing tension data; then, it acquires new real-time film tearing angle data and real-time position data through the encoder and position sensor, and then proceeds to S3 to compare the new data with the safety threshold, initial angle, and desired position sequence to assess whether there are still any film tearing abnormality flags or position deviation indicators; if the comparison result shows no abnormality, the control unit controls the film tearing mechanism to continue performing subsequent film tearing operations; if there are still any abnormalities... If an anomaly is detected, the process repeats steps S4 to recalculate the position compensation and tension control values, S5 to fuse the new control values ​​to generate the total control force command, and S6 to execute new servo adjustments until the anomaly is eliminated. If the data collected after three consecutive adjustments still shows an anomaly, the control unit immediately triggers an emergency stop mechanism, cutting off the power supply circuits to the servo lifting module and the knurling spindle drive motor. This stops the film-tearing module from lifting and moving, stops the knurling spindle from winding, and simultaneously causes the alarm light on the control equipment to flash continuously and emit an intermittent alarm sound via a buzzer, prompting the operator to check the cause of the anomaly in a timely manner to prevent the anomaly from continuing and causing damage to the film material or wafer.

[0037] For example, when processing 12-inch wafers using 50μm thick high-viscosity UV film, the total control force command includes: the Z-axis height of the film-tearing module needs to be reduced from 15mm to 14.2mm, and the knurling spindle winding speed needs to be reduced from 4mm / s to 3.2mm / s. In the S600, the control unit sends a drive signal of "Z-axis reduction to 14.2mm" to the servo lifting module. The motor of the servo lifting module reverses, driving the film-tearing module to descend along the Z-axis via a lead screw drive. The encoder records the number of motor rotations in real time, calculating that every 0.1mm descent of the film-tearing module corresponds to 2 motor rotations. When the motor has rotated 16 times, the encoder reports that the film-tearing module has descended by 0.8mm. At the same time, the position sensor confirms through laser monitoring that the actual height of the film-tearing module is 14.2mm. The control unit immediately stops the motor. At this time, the real-time film-tearing angle is adjusted to 32° as the Z-axis height decreases, completing the angle control. In S601, the control unit sends a speed adjustment signal to the knurling spindle drive motor, indicating that the speed has been reduced to 3.2 mm / s. The drive motor then reduces its output frequency, causing the knurling spindle to gradually decrease in speed from 4 mm / s. The encoder installed on the knurling spindle monitors the speed in real time. When the actual speed stabilizes at 3.2 mm / s, the control unit maintains the current motor output frequency, and the knurling spindle winds up the film at a speed of 3.2 mm / s. The real-time tearing tension begins to decrease as the winding speed decreases. In S602, S2 is executed first: the force sensor collects a new vertical peeling force of 5.2N and a horizontal shearing force of 4.8N, calculating a combined force of 7.8N; the encoder and position sensor obtain a real-time tearing angle of 32° and real-time position data of X: 118.9mm and Y: 28.6mm; then S3 is executed: comparison shows that the real-time tearing tension of 7.8N is between the upper limit of the breakage prevention threshold of 8N and the lower limit of the residue prevention threshold of 7.2N, the angle deviation of -3° does not exceed ±5°, the position deviation of 0.2mm is within the preset allowable range of ≤0.5mm, and there are no tearing abnormality flags or position deviation indicators, so the tearing operation continues. If, after the first adjustment, the force sensor reports that the real-time tearing tension is still 8.2N, exceeding the upper limit, then S4 is repeated: the knurling spindle speed is further reduced to 3.0mm / s, the Z-axis height of the tearing module is reduced to 14.0mm, and a new tension control quantity is calculated; S5: the new position control quantity and tension control quantity are merged to generate a new total control force command; S6: the new adjustment is executed. If, after three consecutive adjustments, the real-time film-tearing tension remains above the upper limit at 8.2N, 8.1N, and 8.3N respectively, the control unit will immediately trigger an emergency stop to cut off the power to the servo lifting module and the knurling spindle motor. The film-tearing module and the knurling spindle will stop operating, the alarm light will flash, and the buzzer will sound an alarm, prompting the operator to check whether the tension cannot be reduced due to abnormal local adhesion of the film material or jamming of the knurling spindle. This is to prevent continuous over-tension from causing the 50μm thick high-adhesion UV film to break or the edge of the 12-inch wafer to be damaged. The above data are hypothetical, and the specific data will depend on the actual situation.

[0038] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for controlling the film-tearing force and speed, characterized in that: It includes the following steps: S1: Based on a preset film material characteristic database, obtain initial film tearing angle data and tension setting data; based on wafer size and debonding process parameters, obtain the film tearing path and desired position sequence; S2: Real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data and real-time position data are obtained based on an encoder and a position sensor; S3: Based on real-time film tearing tension data and real-time film tearing angle data, perform peeling status assessment operation to obtain film tearing abnormality flags; Position deviation identifiers are obtained based on real-time location data and the expected location sequence; S4: Based on the position deviation identifier, perform position compensation calculation to obtain the position control quantity; Based on the tear film abnormality flag and the initial tension setting, the tension compensation amount is calculated to obtain the tension control amount; S5: Based on position control and tension control, perform multi-target control fusion operation to obtain the total control force command; S6: Perform servo system control operations based on the total control force command, and verify the control effect.

2. The method for controlling the film-tearing force and speed according to claim 1, characterized in that: The process involves obtaining initial tearing angle data and tension setpoint data based on a preset film material characteristic database, and obtaining the tearing path and desired position sequence based on wafer size and debonding process parameters, including: Obtain membrane type, thickness and adhesion parameters from the membrane property database, and query the standard tear angle range corresponding to the membrane type as the initial tear angle data; The initial tearing speed data is matched according to the film thickness value. When the film thickness value is 50 μm or above, the first tearing speed is used. When the film thickness value is 20 μm or below, the second tearing speed is used. The first tearing speed is less than the second tearing speed. When the film thickness value is in the range of (20, 50) μm, the linear transition speed is used. The linear transition speed means that the higher the film thickness value, the closer the tearing speed is to the first tearing speed. The lower the film thickness value, the closer the tearing speed is to the second tearing speed. The tension safety threshold is set according to the adhesion force parameters. The tension safety threshold includes an upper limit to prevent breakage and a lower limit to prevent residue. The wafer dimensions and debonding process parameters are obtained, and a spiral trajectory starting from the edge of the wafer is generated as the moving path of the film-peeling module. Path points are set every 1 mm along the movement path, and a desired position sequence is formed based on the desired three-dimensional coordinates and desired speed of multiple path points.

3. The method for controlling the film-tearing force and speed according to claim 1, characterized in that: The process of acquiring real-time film tearing tension data based on a force sensor, and acquiring real-time film tearing angle data and real-time position data based on an encoder and a position sensor, includes: Based on the force sensors installed on the film-tearing module and the film-pressing roller, the vertical peeling force and the horizontal shearing force are collected simultaneously. The resultant force of peeling force and shear force is calculated as real-time film tearing tension data; The Z-axis height of the film-tearing module is measured by an encoder and position sensor integrated into the servo lifting module to obtain real-time film-tearing angle data. The current actual three-dimensional coordinates and actual movement speed of the film-tearing module are recorded as real-time position data.

4. The method for controlling the film-tearing force and speed according to claim 2, characterized in that: The peeling status assessment operation based on real-time film tearing tension data and real-time film tearing angle data is performed to obtain the film tearing abnormality flag. The location deviation identifier is obtained based on real-time location data and the expected location sequence, including: By comparing real-time film tearing tension data with the set tension safety threshold, and by comparing real-time film tearing angle data with the initial film tearing angle data, the abnormal film tearing flag can be obtained. Among them, when the real-time film tearing tension data exceeds the upper limit threshold to prevent breakage, the film tearing abnormality flag is indicated as "over-tension" abnormality; When the real-time film tearing tension data is lower than the lower limit threshold for preventing residue, the film tearing abnormality flag indicates "low tension" abnormality. When the angle deviation between the real-time film tearing angle data and the initial film tearing angle data exceeds ±5°, the film tearing abnormality flag indicates an "angle deviation" abnormality. Based on real-time location data and the expected location sequence, a progress compliance check is performed to obtain a location deviation identifier.

5. The method for controlling the film-tearing force and speed according to claim 4, characterized in that: The process of performing progress compliance checks based on real-time location data and the desired location sequence to obtain location deviation identifiers includes: Path points at the same time are extracted from the desired location sequence based on real-time location data, and the location deviation is obtained based on the Euclidean distance deviation between the real-time location data and the path points. The actual speed is obtained based on real-time location data, and the speed deviation is obtained based on the difference between the actual speed and the expected speed. The position deviation and the rate deviation are combined into a single position deviation indicator.

6. The method for controlling the film-tearing force and speed according to claim 4, characterized in that: The position compensation amount is calculated based on the position deviation identifier to obtain the position control amount; Based on the tear film abnormality flag and the initial tension setting, the tension compensation amount is calculated to obtain the tension control amount, including: Based on the position deviation identifier, the position compensation amount is calculated using a PID control algorithm, including proportional, integral and derivative terms, to obtain the position control amount; Based on the abnormal tearing marker, tension compensation is performed to obtain the tension control amount; When the abnormal tearing flag indicates "over-tension" abnormality, reduce the tearing speed and tearing angle. When the tearing abnormality flag indicates "low tension" abnormality, increase the tearing speed and increase the tearing angle. When the tear film abnormality flag indicates an "angle deviation" abnormality, the tear film angle is adjusted based on the angle deviation between the real-time tear film angle data and the initial tear film angle data.

7. The method for controlling the film-tearing force and speed according to claim 1, characterized in that, The process of adjusting the servo system based on the total control force command and verifying the control effect includes: Based on the total control force command, the lifting height of the film-tearing module is adjusted to regulate the real-time film-tearing angle data; Adjust the knurling spindle winding speed to regulate the real-time film tearing tension data; The process of steps S2 to S6 is repeated, and the adjusted real-time film-tearing force data and real-time position data are obtained through the force sensor and position sensor. Continue the film removal operation if no abnormal film removal indicator or positional deviation indicator appears. If the abnormal film tearing indicator or position deviation indicator still appears after three consecutive adjustments, the emergency stop mechanism will be triggered and an alarm will be sounded.

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