Non-contact pickup and conveyance apparatus for semiconductor substrates

Abstract

The application discloses a kind of semiconductor substrate non-contact pickup conveying equipment, it is related to suspension conveying technical field, including fixed frame, the shell top is fixedly connected with guide pipe, the guide pipe top is fixedly connected with support plate, the support plate inside is fixedly connected with connecting block, the connecting block both sides are fixedly connected with jet plate, two the jet plate top is fixedly connected with multiple jet nozzles, the support plate inside is fixedly connected with connecting box, the connecting box top is fixedly connected with multiple connecting pipes, multiple The connecting pipe top is fixedly connected with suction cup, the shell inside is slidably connected with sliding pipe, the sliding pipe bottom is fixedly connected with telescopic pipe, the semiconductor substrate non-contact pickup conveying equipment, equipment can automatically complete pickup, conveying and fixed operation, reduce manual intervention, improve production efficiency and stability, effectively avoid substrate flying or breakage, double protection mechanism substantially reduces the breakage risk in production process.

Description

Technical Field

[0001] This invention relates to the field of suspended conveying technology, specifically a non-contact picking and conveying device for semiconductor substrates. Background Technology

[0002] In semiconductor manufacturing, substrate picking and transport are critical steps affecting production efficiency and product quality. Traditional mechanical clamping or vacuum adsorption equipment is prone to scratches, particulate contamination, or electrostatic damage due to direct contact with the substrate surface during operation. This risk is particularly pronounced for ultra-thin and brittle advanced semiconductor substrates (such as silicon wafers and compound semiconductor wafers).

[0003] In the prior art, Chinese Patent No. CN111268428B discloses a non-contact air flotation conveyor line for flat glass. The line includes a high section, a low section, and a lifting section. The conveying mechanism of each of the three sections is equipped with a negative pressure roller assembly to ensure sufficient static friction between the flat glass and the conveying roller during the start-up and stop phases, thus avoiding the problem of slippage of the flat glass during the start-up and stop phases and reducing the conveying efficiency. Furthermore, the lifting section is equipped with lateral straightening mechanisms on both sides.

[0004] The aforementioned equipment lacks an effective buffering and protection mechanism in the event of a sudden shutdown or vibration, which can easily cause the substrate to shift, fall, or even break, increasing production costs and potentially polluting the production line environment. Although some non-contact technologies (such as air flotation conveyors) have been applied, their air curtain stability is insufficient and they lack a quick-switching emergency fixing function, making it difficult to meet the needs of efficient conveying and safety protection. Summary of the Invention

[0005] The purpose of this invention is to provide a non-contact pick-and-carry device for semiconductor substrates to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a non-contact pick-and-carry device for semiconductor substrates, comprising a fixed frame, a slide rail fixedly connected to the bottom of the fixed frame, a support block slidably connected inside the slide rail, a side plate fixedly connected to the top of the support block, a fixed plate fixedly connected to the top of the side plate, vertical plates fixedly connected to both sides of the top of the fixed plate, a base fixedly connected to the top of the two vertical plates, a housing fixedly connected to the top of the base, a guide tube fixedly connected to the top of the housing, a support plate fixedly connected to the top of the guide tube, a connecting block fixedly connected inside the support plate, jet plates fixedly connected to both sides of the connecting block, multiple jet nozzles fixedly connected to the top of the two jet plates, a connecting box fixedly connected inside the support plate, the guide tube penetrating the bottom of the support plate and fixedly connected to the support plate, the top of the guide tube communicating with the connecting box, the connecting box being disposed inside the connecting block, multiple connecting pipes fixedly connected to the top of the connecting box, suction cups fixedly connected to the top of the multiple connecting pipes, a sliding tube slidably connected inside the housing, and a telescopic tube fixedly connected to the bottom of the sliding tube.

[0007] Preferably, the outer casing has two exhaust holes on its side wall, which are arranged opposite to each other. Both sides of the bottom of the connecting block are fixedly connected to air guide pipes, and the bottom ends of the two air guide pipes pass through the two exhaust holes and are fixedly connected to the outer casing. The base has two through holes on its side wall, which correspond to the two exhaust holes respectively. When the through holes correspond to the exhaust holes, the gas passes through the through holes and enters the exhaust holes, and is transmitted through the air guide pipes.

[0008] Preferably, sealing plugs are fixedly connected to both sides of the sliding tube. The two sealing plugs are respectively adapted to the two exhaust holes. The two sealing plugs are respectively set at the top of the two through holes. When the sliding tube descends, it drives the sealing plugs to correspond with the exhaust holes, so that the sealing plugs block the exhaust holes.

[0009] Preferably, a one-way air intake valve is fixedly connected to the top of the sliding tube, and limit plates are fixedly connected to both sides of the sliding tube. Limit grooves are opened on both sides of the inner shell. The two limit plates are slidably connected to the two limit grooves and adapted to the two limit grooves. The limit plates are limited by the limit grooves, so that the sliding tube remains stable when it is raised and lowered and will not deviate during the movement.

[0010] Preferably, a horizontal plate is fixedly connected to the bottom of the sliding tube, and sliding rods are fixedly connected to both ends of the top of the horizontal plate. Sliding sleeves are fixedly connected to both sides of the outer shell. The two sliding rods pass through the two sliding sleeves respectively and are slidably connected to the two sliding sleeves. A moving block is fixedly connected to the top of each of the two sliding rods, and the two moving blocks are slidably connected to the inside of the two sliding sleeves respectively.

[0011] Preferably, springs are fitted on the outer sides of both slide rods, and the two ends of the springs are fixedly connected to the slide sleeve and the cross plate, respectively, so as to support and buffer the cross plate.

[0012] Preferably, the bottom of the support plate is fixedly connected to the front and rear sides of the support plate. The support plate is rotatably connected to the inside of the support plate, and a guide gear is fixedly connected to the outside of the guide gear. The support plate is slidably connected to one side of the support plate, and a second toothed plate is slidably connected to the other side of the support plate. The second toothed plate is fixedly connected to one of the horizontal plates. The first toothed plate and the second toothed plate are respectively meshed with the two sides of the guide gear. When the horizontal plate descends, it drives the second toothed plate to descend, and the second toothed plate drives the guide gear to rotate, thereby driving the first toothed plate to rise.

[0013] Preferably, the support plate has hinged flaps on both the front and rear sides, and a buffer pad is fixedly connected to the top of the flap. The top of the first toothed plate is fixedly connected to a support rod, and the top of the support rod is fixedly connected to a top rod. The top of the top rod is hinged to the bottom of the flap. The side wall of the limiting sleeve has a sliding groove, and the top rod passes through the sliding groove and extends to the outside of the limiting sleeve, so that the first toothed plate drives the support rod to rise, and the support rod drives the top rod to rise, and pushes the flap to flip upward.

[0014] Preferably, a bent pipe is fixedly connected inside the fixing plate, and a bidirectional air pump is fixedly connected to one side of the top of the support block. The bidirectional air pump is fixedly connected to the output end of the bent pipe.

[0015] Preferably, a lead screw is rotatably connected inside the slide rail, a motor is fixedly connected to one end of the slide rail, the output end of the motor is fixedly connected to the lead screw, the lead screw passes through the support block and is threadedly connected to the support block, slide tables are fixedly connected to both sides inside the fixing frame, a guide groove is formed on the top of the slide table, and slide plates are fixedly connected to both sides of the bottom of the support plate. The two slide plates are slidably connected inside the two guide grooves, and the support plate is limited by the guide grooves, thereby improving the stability of the support plate when moving. Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This application creates an air curtain above the support plate, applying an upward thrust to the substrate, suspending the substrate above the support plate, reducing contamination of the substrate, improving product quality, and facilitating substrate transportation and transfer. Combined with a bidirectional air pump and air pressure control system, the equipment can automatically complete the picking, conveying, and fixing operations, reducing manual intervention, improving production efficiency and stability, and is suitable for the needs of continuous production lines. By suspending the semiconductor substrate above the support plate through the air curtain, it avoids surface scratches or contamination that may be caused by traditional mechanical contact picking, significantly improving product quality, and is especially suitable for semiconductor manufacturing environments with high cleanliness requirements.

[0017] 2. This application uses a bidirectional air pump to create a vacuum inside the bend and telescopic tube. At this time, the sliding tube will fall downwards under negative pressure, simultaneously causing the through hole to disengage from the exhaust hole and the sealing plug to block the exhaust hole. This prevents the air guide tube from venting gas and stops the gas flow from the multiple air nozzles. The substrate falls above the support plate without gas support. When the sliding tube falls inside the outer shell, it creates a negative pressure inside the outer shell, which draws the gas inside the connecting tube and the suction cup, creating a negative pressure inside the suction cup. This suction cup first holds the falling substrate in place. At this time, the gas inside the suction cup enters the connecting tube and then enters the guide tube and the outer shell along the connecting tube. The gas passes through the one-way air inlet valve and enters the sliding tube, maintaining a vacuum adsorption state inside the suction cup and fixing the substrate to prevent it from flying forward and breaking.

[0018] 3. This application enables the push rod to push the flip plate upward, which in turn causes the buffer pad to flip upward. This lifts the buffer pads on both the front and rear sides, blocking and intercepting the substrate in the front and rear directions, preventing the substrate from falling out of the support plate and causing damage to the ground. At the same time, it prevents the substrate from breaking on the production line and causing problems in the processing environment. The equipment automatically switches to vacuum adsorption mode, and the suction cup fixes the substrate to prevent it from falling off. At the same time, the flip plate lifts and works with the buffer pads to intercept the substrate, effectively preventing the substrate from flying out or breaking. This dual protection mechanism greatly reduces the risk of breakage during the production process. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the slide table of the present invention;

[0021] Figure 3 This is a schematic diagram of the support plate of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of the skateboard of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the bend in this invention;

[0024] Figure 6 This is a schematic diagram of the suction cup structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the guide tube of the present invention;

[0026] Figure 8 This is a schematic diagram of the sliding tube structure of the present invention;

[0027] Figure 9 This is a schematic diagram of the structure of the sliding sleeve of the present invention;

[0028] Figure 10 This is a schematic diagram of the structure of the movable block of the present invention;

[0029] Figure 11 This is a schematic diagram of the structure of the limiting sleeve of the present invention;

[0030] Figure 12 This is a schematic diagram of the structure of the flip plate of the present invention;

[0031] Figure 13 This is a schematic diagram of the structure of the jet nozzle of the present invention;

[0032] Figure 14 This is a schematic diagram of the slide rail of the present invention.

[0033] The following are the labeling elements in the diagram: 1. Fixing frame; 2. Slide rail; 3. Support block; 4. Side plate; 5. Fixing plate; 6. Vertical plate; 7. Base; 8. Outer shell; 9. Guide tube; 10. Support plate; 11. Connecting block; 12. Jet plate; 13. Jet nozzle; 14. Connecting box; 15. Connecting tube; 16. Suction cup; 17. Sliding tube; 18. Exhaust port; 19. Air guide tube; 20. Through hole; 21. Sealing plug; 22. One-way air intake valve; 23. Limiting plate; 24. Limiting groove; 25. Horizontal plate; 26. Sliding sleeve; 27. Sliding rod; 28. Moving block; 29. ​​Spring; 30. Limiting sleeve; 31. First toothed plate; 32. Second toothed plate; 33. Rotating shaft; 34. Guide gear; 35. Support rod; 36. Top rod; 37. Flip plate; 38. Buffer pad; 39. Telescopic tube; 40. Bend; 41. Two-way air pump; 42. Lead screw; 43. Motor; 44. Slide table; 45. Guide groove; 46. Slide plate. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example: Figures 1-14As shown, this invention provides a technical solution for a non-contact pick-and-carry device for semiconductor substrates, including a fixed frame 1. A slide rail 2 is fixedly connected to the bottom of the fixed frame 1. A support block 3 is slidably connected inside the slide rail 2. A side plate 4 is fixedly connected to the top of the support block 3. A fixed plate 5 is fixedly connected to the top of the side plate 4. Vertical plates 6 are fixedly connected to both sides of the top of the fixed plate 5. A base 7 is fixedly connected to the top of the two vertical plates 6. A housing 8 is fixedly connected to the top of the base 7. A guide tube 9 is fixedly connected to the top of the housing 8. A support plate 10 is fixedly connected to the top of the guide tube 9. A connecting block 11 is fixedly connected inside the support plate 10. Air jet plates 12 are fixedly connected to both sides of the connecting block 11. Multiple air jet nozzles 13 are fixedly connected to the top of each of the two air jet plates 12. The angle of the outer air jet nozzles 13 is tilted towards the center, applying a lateral thrust to the substrate so that the substrate moves with it and does not detach. A connecting box is fixedly connected inside the support plate 10. 14. The guide tube 9 passes through the bottom of the support plate 10 and is fixedly connected to the support plate 10. The top end of the guide tube 9 is connected to the connecting box 14. The connecting box 14 is located inside the connecting block 11. Multiple connecting tubes 15 are fixedly connected to the top of the connecting box 14. Suction cups 16 are fixedly connected to the top of each of the multiple connecting tubes 15. A sliding tube 17 is slidably connected inside the outer shell 8. A telescopic tube 39 is fixedly connected to the bottom of the sliding tube 17. Two exhaust holes 18 are opened on the side wall of the outer shell 8. The two exhaust holes 18 are arranged opposite to each other. Air guide tubes 19 are fixedly connected to both sides of the bottom of the connecting block 11. The bottom ends of the two air guide tubes 19 pass through the two exhaust holes 18 and are fixedly connected to the outer shell 8. Two through holes 20 are opened on the side wall of the base 7. The two through holes 20 correspond to the two exhaust holes 18 respectively. When the through hole 20 corresponds to the exhaust hole 18, the gas passes through the through hole 20 and enters the interior of the exhaust hole 18, and is transmitted through the air guide tube 19.

[0036] A lead screw 42 is rotatably connected inside the slide rail 2. A motor 43 is fixedly connected to one end of the slide rail 2. The output end of the motor 43 is fixedly connected to the lead screw 42. The lead screw 42 passes through the support block 3 and is threadedly connected to the support block 3. Slide tables 44 are fixedly connected to both sides inside the fixed frame 1. A guide groove 45 is opened on the top of the slide table 44. Slide plates 46 are fixedly connected to both sides of the bottom of the support plate 10. The two slide plates 46 are slidably connected to the two guide grooves 45 respectively. The guide grooves 45 limit the support plate 10, thereby improving the stability of the support plate 10 when moving.

[0037] Sealing plugs 21 are fixedly connected to both sides of the sliding tube 17. Each sealing plug 21 is adapted to one of the two exhaust holes 18. The two sealing plugs 21 are respectively located at the top of the two through holes 20. When the sliding tube 17 descends, it causes the sealing plugs 21 to align with the exhaust holes 18, thus sealing the exhaust holes 18. A one-way air intake valve 22 is fixedly connected to the top of the sliding tube 17. Limiting plates 23 are fixedly connected to both sides of the sliding tube 17. Limiting grooves 24 are formed on both sides of the inner side of the outer casing 8. The two limiting plates 23 are slidably connected to and adapted to the two limiting grooves 24, thus limiting the position of the limiting plates 23 through the limiting grooves 24. To ensure the stability of the sliding tube 17 during lifting and lowering, preventing deviation during movement, a horizontal plate 25 is fixedly connected to the bottom of the sliding tube 17. Slide rods 27 are fixedly connected to both ends of the top of the horizontal plate 25. Slide sleeves 26 are fixedly connected to both sides of the outer casing 8. The two slide rods 27 pass through the two slide sleeves 26 respectively and are slidably connected to the two slide sleeves 26. Movable blocks 28 are fixedly connected to the top of the two slide rods 27 respectively. The two movable blocks 28 are slidably connected to the inside of the two slide sleeves 26 respectively. Springs 29 are sleeved on the outside of the two slide rods 27. The two ends of the springs 29 are fixedly connected to the slide sleeves 26 and the horizontal plate 25 respectively, and the horizontal plate 25 is supported and buffered by the springs 29.

[0038] Limiting sleeves 30 are fixedly connected to both the front and rear sides of the bottom of the support plate 10. A rotating shaft 33 is rotatably connected inside the limiting sleeve 30, and a guide gear 34 is fixedly connected to the outside of the rotating shaft 33. A first toothed plate 31 is slidably connected to one side of the limiting sleeve 30, and a second toothed plate 32 is slidably connected to the other side of the limiting sleeve 30. The second toothed plate 32 is fixedly connected to one of the horizontal plates 25. The first toothed plate 31 and the second toothed plate 32 are respectively meshed with the two sides of the guide gear 34. When the horizontal plate 25 descends, it drives the second toothed plate 32 to descend, causing the second toothed plate 32 to drive the guide gear 34 to rotate, thereby driving the first toothed plate 31 to rise. Each side is hinged with a flap 37, and a buffer pad 38 is fixedly connected to the top of the flap 37. A support rod 35 is fixedly connected to the top of the first toothed plate 31, and a top rod 36 is fixedly connected to the top of the support rod 35. The top of the top rod 36 is hinged to the bottom of the flap 37. A sliding groove is opened on the side wall of the limiting sleeve 30. The top rod 36 passes through the sliding groove and extends to the outside of the limiting sleeve 30, so that the first toothed plate 31 drives the support rod 35 to rise, and the support rod 35 drives the top rod 36 to rise, and pushes the flap 37 to flip upward. A bent pipe 40 is fixedly connected inside the fixed plate 5. A bidirectional air pump 41 is fixedly connected to one side of the top of the support block 3. The bidirectional air pump 41 is fixedly connected to the output end of the bent pipe 40.

[0039] In operation, the motor 43 drives the lead screw 42 to rotate, which in turn moves the support block 3. The movement of the support block 3 moves the side plate 4 and the fixed plate 5, which in turn moves the vertical plate 6 and the base 7. The base 7 then moves the outer casing 8 and the guide tube 9, which in turn moves the support plate 10. When the support plate 10 moves, it moves the jet plate 12, which in turn moves multiple jet nozzles 13, moving the support plate 10 to the semiconductor substrate feeding position. The bidirectional air pump 41 is then activated, transmitting air into the bent tube 40 and allowing compressed air to enter the telescopic tube 39. The air is then ejected into the sliding tube 17. Inside the sliding tube 17, the gas cannot pass through the one-way inlet valve 22 from the bottom, and the gas impact stretches the telescopic tube 39, causing it to elongate and rise towards the outer casing 8. As the sliding tube 17 rises, it moves the horizontal plate 25 upwards, causing the horizontal plate to move towards the outer casing 8. Plate 25 drives slide bar 27 and moving block 28 to move upward inside sliding sleeve 26, causing sliding tube 17 to move sealing plug 21 out of exhaust hole 18. At the same time, through hole 20 corresponds to exhaust hole 18, allowing high-pressure gas to pass through through hole 20 and enter the air guide tube 19 for transmission. The gas enters connecting block 11 and jet plate 12 from air guide tube 19, and finally the gas is ejected from multiple jet nozzles 13, forming an air curtain above support plate 10. This applies an upward thrust to the substrate, suspending the substrate above support plate 10, reducing contamination of the substrate, improving product quality, and facilitating substrate transportation and transfer. Combined with bidirectional air pump 41 and air pressure control system, the equipment can automatically complete picking, conveying, and fixing operations, reducing manual intervention, improving production efficiency and stability, and is suitable for continuous production line requirements. By suspending the semiconductor substrate above support plate through the air curtain, it avoids surface scratches or contamination that may be caused by traditional mechanical contact picking, significantly improving product quality, and is especially suitable for semiconductor manufacturing environments with high cleanliness requirements.

[0040] When the substrate is placed on top of the support plate 10 for transfer, if the production line experiences an emergency stop or vibration, the bidirectional air pump 41 will start in reverse. Due to the loss of gas impact, the sliding tube 17 loses support and, under the elastic force of the spring 29, pushes the horizontal plate 25 downwards. The horizontal plate 25 then causes the sliding tube 17 to descend rapidly, causing the bidirectional air pump 41 to draw air and create a vacuum inside the bent tube 40 and the telescopic tube 39. At this time, the sliding tube 17 will fall downwards under negative pressure, simultaneously causing the through hole 20 to disengage from the exhaust hole 18, and the sealing plug 21 to block the exhaust hole 18. This prevents the air guide tube 19 from releasing gas, thus... With no more gas flow from the multiple nozzles 13, the substrate falls above the support plate 10 without gas support. When the sliding tube 17 falls inside the housing 8, it creates a negative pressure inside the housing 8, which draws gas from the connecting tube 15 and the suction cup 16, creating a negative pressure inside the suction cup 16. This suction cup 16 holds the falling substrate in place. At this time, the gas inside the suction cup 16 enters the connecting tube 15 and then enters the guide tube 9 and the housing 8 along the connecting tube 15. The gas passes through the one-way air inlet valve 22 and enters the sliding tube 17, maintaining a vacuum adsorption state inside the suction cup 16, thus fixing the substrate and preventing it from flying forward and breaking.

[0041] As the sliding tube 17 descends, it causes the horizontal plate 25 to descend, which in turn drives the second toothed plate 32 to descend. This causes the second toothed plate 32 to rotate the guide gear 34. When the guide gear 34 rotates, it drives the first toothed plate 31 to rise. In turn, the first toothed plate 31 drives the guide gear 34 to rise. During the rise, the guide gear 34 drives the push rod 36 to rise, which in turn pushes the flip plate 37 to flip upward. This causes the flip plate 37 to flip upward, causing the buffer pad 38 to flip upward. The buffer pads 38 on both the front and rear sides are lifted to block and intercept the substrate in the front and rear directions, preventing the substrate from falling out of the support plate 10 and causing damage. At the same time, it prevents the substrate from breaking on the production line and causing problems in the processing environment. The equipment automatically switches to vacuum adsorption mode, and the suction cup 16 fixes the substrate to prevent it from falling off. At the same time, the flip plate 37 is lifted and works with the buffer pad 38 to intercept the substrate, effectively preventing the substrate from flying out or breaking. This dual protection mechanism greatly reduces the risk of breakage during the production process.

[0042] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A non-contact pick-and-carry device for semiconductor substrates, characterized in that: Includes a fixed frame (1), with a slide rail (2) fixedly connected to the bottom of the fixed frame (1), a support block (3) slidably connected inside the slide rail (2), a side plate (4) fixedly connected to the top of the support block (3), a fixed plate (5) fixedly connected to the top of the side plate (4), vertical plates (6) fixedly connected to both sides of the top of the fixed plate (5), a base (7) fixedly connected to the top of the two vertical plates (6), a shell (8) fixedly connected to the top of the base (7), a guide tube (9) fixedly connected to the top of the shell (8), a support plate (10) fixedly connected to the top of the guide tube (9), a connecting block (11) fixedly connected inside the support plate (10), and a connecting block (11) fixedly connected to both sides of the connecting block (11). Each is fixedly connected to a jet plate (12), and multiple jet nozzles (13) are fixedly connected to the top of each of the two jet plates (12). A connecting box (14) is fixedly connected inside the support plate (10). A guide tube (9) passes through the bottom of the support plate (10) and is fixedly connected to the support plate (10). The top of the guide tube (9) is connected to the connecting box (14). The connecting box (14) is located inside the connecting block (11). Multiple connecting tubes (15) are fixedly connected to the top of the connecting box (14). A suction cup (16) is fixedly connected to the top of each of the multiple connecting tubes (15). A sliding tube (17) is slidably connected inside the outer shell (8). A telescopic tube (39) is fixedly connected to the bottom of the sliding tube (17). The outer shell (8) has two exhaust holes (18) on its side wall, which are arranged opposite to each other. The bottom sides of the connecting block (11) are fixedly connected with air guide pipes (19). The bottom ends of the two air guide pipes (19) pass through the two exhaust holes (18) and are fixedly connected to the outer shell (8). The base (7) has two through holes (20) on its side wall, which correspond to the two exhaust holes (18) respectively. Both sides of the sliding tube (17) are fixedly connected with sealing plugs (21), and the two sealing plugs (21) are respectively adapted to the two exhaust holes (18). The two sealing plugs (21) are respectively set on the top of the two through holes (20); The top of the sliding tube (17) is fixedly connected to a one-way air intake valve (22), and both sides of the sliding tube (17) are fixedly connected to limit plates (23). Both sides of the outer shell (8) are provided with limit grooves (24). The two limit plates (23) are slidably connected to the two limit grooves (24) and are adapted to the two limit grooves (24). The fixed plate (5) is fixedly connected to a bend (40), and the top side of the support block (3) is fixedly connected to a bidirectional air pump (41). The bidirectional air pump (41) is fixedly connected to the output end of the bend (40).

2. The non-contact pick-and-carry device for semiconductor substrates according to claim 1, characterized in that: The bottom of the sliding tube (17) is fixedly connected to a horizontal plate (25), and both ends of the top of the horizontal plate (25) are fixedly connected to sliding rods (27). Both sides of the outer shell (8) are fixedly connected to sliding sleeves (26). The two sliding rods (27) pass through the two sliding sleeves (26) respectively and are slidably connected to the two sliding sleeves (26). The top of the two sliding rods (27) is fixedly connected to a moving block (28), and the two moving blocks (28) are slidably connected inside the two sliding sleeves (26) respectively.

3. The non-contact pick-and-carry device for semiconductor substrates according to claim 2, characterized in that: Springs (29) are fitted on the outer sides of both slide rods (27), and the two ends of the springs (29) are fixedly connected to the slide sleeve (26) and the cross plate (25) respectively.

4. The non-contact pick-and-carry device for semiconductor substrates according to claim 1, characterized in that: The support plate (10) has a limiting sleeve (30) fixedly connected to both the front and rear sides of its bottom. The limiting sleeve (30) has a rotating shaft (33) rotatably connected inside. The rotating shaft (33) has a guide gear (34) fixedly connected to the outside. The limiting sleeve (30) has a first toothed plate (31) slidably connected to one side inside. The limiting sleeve (30) has a second toothed plate (32) slidably connected to the other side. The second toothed plate (32) is fixedly connected to one of the horizontal plates (25). The first toothed plate (31) and the second toothed plate (32) are respectively meshed and connected to both sides of the guide gear (34).

5. A non-contact pick-and-carry device for semiconductor substrates according to claim 4, characterized in that: The support plate (10) is hinged with flaps (37) on both the front and rear sides. A buffer pad (38) is fixedly connected to the top of the flaps (37). A support rod (35) is fixedly connected to the top of the first toothed plate (31). A top rod (36) is fixedly connected to the top of the support rod (35). The top of the top rod (36) is hinged to the bottom of the flaps (37). A sliding groove is opened on the side wall of the limiting sleeve (30). The top rod (36) passes through the sliding groove and extends to the outside of the limiting sleeve (30).

6. The non-contact pick-and-carry device for semiconductor substrates according to claim 1, characterized in that: The slide rail (2) is rotatably connected to a lead screw (42). One end of the slide rail (2) is fixedly connected to a motor (43). The output end of the motor (43) is fixedly connected to the lead screw (42). The lead screw (42) passes through the support block (3) and is threadedly connected to the support block (3). The fixed frame (1) is fixedly connected to two slide tables (44) on both sides. The top of the slide table (44) is provided with a guide groove (45). The bottom sides of the support plate (10) are fixedly connected to two slide plates (46). The two slide plates (46) are slidably connected to the two guide grooves (45) respectively.

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