Self-adaptive pin fin micro-channel radiator structure

Abstract

The invention discloses a self-adaptive pin fin micro-channel radiator structure which comprises a middle conductor, a liquid cooling cavity is formed in the middle conductor and comprises a liquid inlet area, a micro-channel area and a liquid outlet area which are sequentially arranged in the liquid inlet direction, and the liquid inlet area and the liquid outlet area communicate with a liquid inlet and a liquid outlet correspondingly; a plurality of pin fins are arranged on the micro-channel area, gaps among the pin fins are matched to form micro-channels allowing cooling liquid to pass through, and at least part of the structure of each pin fin is made of a thermosensitive hydrogel material which enables the size of each pin fin to be reduced when the heated temperature reaches the critical temperature. The size of the pin fins can be reduced at high temperature, so that hot spot areas can be intelligently detected and responded, when the heat flux of the hot spots is high, the local fluid flow corresponding to the hot spots with high heat flux can be adaptively adjusted, heat dissipation is accurately enhanced, and the temperature difference of the areas of the chip is reduced.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to an adaptive pin-fin microchannel heat sink structure. Background Technology

[0002] Chips are among the most critical components in modern computers, robots, electronic devices, and other industrial equipment. With the rapid development of technology, chip power output and assembly density are increasing, and they are becoming increasingly integrated into packaging designs. This leads to smaller chip sizes but larger heat dissipation per unit area, resulting in a dramatic increase in heat flux density and ultimately, higher chip temperatures. Excessively high operating temperatures can severely or even irreversibly affect the normal operation of chips and the reliable operation of equipment. The well-known 10°C rule states that the reliability of electronic components is closely related to temperature. When the temperature is between 70°C and 80°C, the reliability of electronic components decreases by 50% for every 10°C increase. The quality of heat dissipation directly affects the stability of the chip.

[0003] Conventional natural and forced air cooling methods are no longer sufficient to meet the heat dissipation requirements of chips. Therefore, researchers have proposed emerging technologies such as micro heat pipes, vacuum vapor chambers, carbon nanotubes, and microchannels. Among these, microchannel technology, which utilizes fluid cooling, has received the most extensive research. Microchannel heat sinks were first proposed by Tucherman and Pease in 1981. Compared to conventional heat sinks, microchannel heat sinks have advantages such as large heat exchange area, strong heat exchange capacity, and small size. However, current research mostly focuses on heat sinks with uniform heat sources, while heat dissipation for non-uniform heat sources is less studied.

[0004] In a chip, the core region generates significantly higher heat flux than other regions. These areas with higher heat flux are called hot spots. Typically, heat transfer from within the chip to the heatsink is uneven, with the heat flux in hot spots being several times the average heat flux in the background region. The temperature difference caused by this difference in heat flux between hot and background regions can lead to chip deformation and reduce its lifespan. Currently, most thermal management solutions for chips rely on heatsinks with fixed microchannel structures. These heatsinks are designed with pre-defined fluid channels and cooling parameters, but they have the following shortcomings: Lack of adaptability: The fixed structure of the microchannel cannot be adjusted in real time according to the dynamic changes of hot spots on the chip, and cannot quickly increase the coolant flow rate in the hot spot area of ​​the chip, thus making it difficult to meet the heat dissipation requirements of local hot spots on the chip.

[0005] Insufficient local heat dissipation: Due to the inability to adjust flexibly, microchannels with fixed structures may experience insufficient cooling in hot spots, leading to excessively high local temperatures, which can accelerate device aging or cause system failures.

[0006] High energy consumption: In order to compensate for insufficient local heat dissipation of the chip, traditional heat sink structures often need to increase the overall flow rate of the coolant, which increases energy consumption.

[0007] Therefore, it is necessary to design a heat sink that can intelligently detect and respond to hot spots, and adaptively adjust the local fluid flow rate corresponding to the hot spots with high heat flux when the heat flux is high, so as to achieve precise heat dissipation and reduce the temperature difference between different areas of the chip. This has become an urgent problem to be solved. Summary of the Invention

[0008] This invention provides an adaptive pin-fin microchannel heat sink structure, the purpose of which is to intelligently detect and respond to hot spots. When the heat flux of a hot spot is high, it can adaptively adjust the local fluid flow corresponding to the hot spot with high heat flux, thereby achieving precise heat dissipation enhancement, reducing temperature differences in different areas of the chip, and ensuring chip reliability.

[0009] To achieve the above objectives, the present invention provides an adaptive needle-fin microchannel heat sink structure, including an intermediate conductor, a liquid cooling cavity provided within the intermediate conductor, the liquid cooling cavity including an inlet region, a microchannel region and an outlet region arranged sequentially along the liquid inlet direction, the inlet region and the outlet region being respectively connected to the inlet port and the outlet port; a plurality of needles are provided on the microchannel region, the gaps between the needles are fitted to form microchannels that allow coolant to pass through, at least a portion of the structure of the needles is made of a thermosensitive hydrogel material that causes the needles themselves to shrink in volume when the heated temperature reaches a critical temperature.

[0010] In one embodiment, the intermediate conductor includes a substrate and a cover plate connected together, the cover plate being located on one side of the substrate, and the liquid cooling cavity being formed on the side of the substrate facing the cover plate.

[0011] In one embodiment, the cover plate and the substrate are made of LTCC, Cu or Al material.

[0012] In one embodiment, the cover plate and the substrate are connected by adhesive bonding, welding or high-temperature bonding.

[0013] In one embodiment, the needle fins are all made of thermosensitive hydrogel material; or, the needle fins are partially made of thermosensitive hydrogel material, and the needle fins include a thermosensitive hydrogel segment made of thermosensitive hydrogel material and a heat transfer metal segment made of metal material.

[0014] In one embodiment, the thermosensitive hydrogel material is formed by copolymerization of two monomers: diethylene glycol methyl methacrylate and oligoethylene glycol methacrylate.

[0015] In one embodiment, the hydrogel material contains graphene nanomaterials and / or boron nitride nanomaterials.

[0016] In one embodiment, a plurality of metal wires are provided within the needle fin structure made of thermosensitive hydrogel material. The cross-sectional size of the metal wires is set to the micrometer or nanometer level. Each metal wire is straight, and the central axis of each metal wire is perpendicular to the central axis of the needle fin.

[0017] In one embodiment, the ends of each of the metal wires near the outer sidewall of the needle fin protrude outside the needle fin.

[0018] In one embodiment, the metal wire is made of Cu, Al, nickel-titanium alloy or shape memory metal.

[0019] The above-described solution of the present invention has the following beneficial effects: This invention utilizes a series of fins arranged within the microchannel region of the liquid cooling cavity. These fins are made of a thermosensitive hydrogel material that shrinks in volume when heated to a critical temperature. Therefore, when high heat flux hotspots are generated in certain areas of the chip, the corresponding fins shrink in volume under the high temperature of these hotspots. This increases the flow rate in the microchannel region corresponding to these hotspots. The increased flow rate of the coolant allows for rapid absorption and removal of the heat generated by these hotspots, significantly enhancing the heat dissipation effect on the chip. Thus, by using a thermosensitive hydrogel material that shrinks in volume when heated to a critical temperature, this invention enables intelligent and efficient response to high heat flux hotspots on the chip. Combined with the large surface area of ​​the fins arranged within the microchannel region, this heat sink provides excellent heat dissipation for the entire chip, ensuring temperature uniformity and high flexibility. It eliminates the need to increase the coolant flow rate to enhance heat dissipation at hotspot locations, resulting in low energy consumption.

[0020] Other beneficial effects of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural schematic diagram of an adaptive needle-fin microchannel heat sink structure shown in some embodiments of the present invention; Figure 2 This is an exploded view of an adaptive pin-fin microchannel heat sink structure shown in some embodiments of this application; Figure 3 This is a schematic side view of the needle fin structure shown in some embodiments of this application. Figure 1 ; Figure 4 This is a schematic diagram of the cross-sectional structure of the needle fin shown in some embodiments of this application; Figure 5 This is a schematic diagram of the front view structure of the needle fin shown in some embodiments of this application. Figure 2 ; Figure 6 This is a schematic diagram of the front view structure of the needle fin shown in some embodiments of this application. Figure 3 ; Figure 7 This is a top view of the substrate structure shown in some embodiments of this application.

[0022] [Explanation of Labels in the Attached Image] 10-Intermediate conductor; 20-Substrate; 21-Liquid cooling cavity; 211-Liquid inlet area; 212-Liquid outlet area; 213-Microchannel area; 214-Groove structure; 2131-Hot spot concentration area; 22-Fin; 221-Thermosensitive hydrogel segment; 222-Metal heat transfer segment; 223-Metal wire; 224-Bump; 225-Fin; 30-Cover plate; 31-Liquid inlet; 32-Liquid outlet. Detailed Implementation

[0023] To make the technical problems, solutions, and advantages of this invention clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0024] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] Please refer to the following: Figures 1 to 7 The adaptive needle-fin microchannel radiator structure described in this embodiment of the invention includes an intermediate conductor 10, within which a liquid cooling cavity 21 is provided. The liquid cooling cavity 21 includes an inlet region 211, a microchannel region 213, and an outlet region 212 arranged sequentially along the liquid inlet direction. The inlet region 211 and the outlet region 212 are respectively connected to an inlet port 31 and an outlet port 32. A plurality of needle fins 22 are provided on the microchannel region 213, and the gaps between the needle fins 22 are matched to form microchannels that allow coolant to pass through. At least part of the structure of the needle fins 22 adopts a design that allows the needle fins 22 themselves to withstand temperatures exceeding a critical temperature T. 临 It is made of a thermosensitive hydrogel material that undergoes a volume shrinkage change over time. The critical temperature T... 临 The value range is selected as 80℃-150℃. Thermosensitive hydrogel material is a polymer material that can undergo volume phase change in response to temperature change. When the temperature is close to the temperature, the thermosensitive hydrogel material will cause the volume of needle fin 22 to shrink as the temperature rises.

[0027] When the heat sink is working, the coolant first flows from the inlet 31 into the inlet area 211, and then from the inlet area 211 into the microchannel area 213 connected to the inlet area 211. During the flow of the coolant through the microchannel area 213, the coolant quickly absorbs the heat generated by the chip through the fins 22, and after absorbing the heat, it flows into the outlet area 212. The coolant in the outlet area 212 then flows out through the outlet 32 ​​to the outside of the intermediate conductor 10. When the temperature of the fins 22 reaches the critical value, the volume of the fins 22 will shrink. Therefore, when high heat flux hotspots are generated in certain parts of the chip, the corresponding fins 22 will undergo significant volume shrinkage under the high temperature of the high heat flux hotspots. This increases the flow rate of the coolant in the microchannel area 213 corresponding to these high heat flux hotspots. The increased flow rate of the coolant can quickly absorb and carry away the heat generated by these high heat flux hotspots, greatly enhancing the heat dissipation effect on the chip. Therefore, the present invention sets at least a portion of the structure of all needle fins 22 within the microchannel region 213 to a temperature reaching the critical temperature T. 临Made of a thermosensitive hydrogel material that causes the needle fins 22 to shrink in volume, this device can intelligently and efficiently respond to local hot spots on the chip for heat dissipation. Combined with the fact that the needle fins 22 arranged in the microchannel area 213 also have a large surface area for heat dissipation, the heat sink of this invention can achieve a good heat dissipation effect on the entire chip, ensuring the uniformity of the chip temperature. It is highly flexible and does not require increasing the flow rate of the coolant to enhance the heat dissipation of the hot spots on the chip, resulting in low energy consumption.

[0028] Please see Figure 2 In one embodiment of this application, the intermediate conductor 10 includes a substrate 20 and a cover plate 30 connected to each other. The cover plate 30 is located on one side of the substrate 20, and the liquid cooling cavity 21 is formed on the side of the substrate 20 facing the cover plate 30.

[0029] Optionally, the cover plate 30 and the substrate 20 are made of LTCC, Cu, or Al. LTCC, Cu, or Al are all materials with good heat dissipation properties. Using these materials to make the cover plate 30 and the substrate 20 allows the heat generated by the chip to be quickly transferred to the coolant through the intermediate conductor 10. Of course, the materials used to make the cover plate 30 and the substrate 20 are not limited to these; other materials that can achieve rapid heat transfer can also be used to make the cover plate 30 and the substrate 20.

[0030] Optionally, the intermediate conductor 10 may be square or other shapes. The shape of the intermediate conductor 10 may be modified according to the shape of the chip so that the heat sink of the present invention can achieve the beneficial effect of maximizing heat dissipation over the chip area.

[0031] In one embodiment of this application, the inlet 31 and the outlet 32 ​​are located on the same side of the intermediate conductor 10. For example, as Figure 2 As shown, both the inlet 31 and the outlet 32 ​​are disposed on the cover plate 30. Alternatively, the inlet 31 and the outlet 32 ​​may be disposed on the side of the substrate 20 facing away from the cover plate 30. In other alternative embodiments, the outlet 32 ​​and the inlet 31 may be disposed on different sides of the intermediate conductor 10. For example, the inlet 31 may be disposed on the cover plate 30, and the outlet 32 ​​on the side of the substrate 20 facing away from the cover plate 30. Another example is that the inlet 31 may be disposed on the side of the substrate 20 facing away from the cover plate 30, and the outlet 32 ​​on the cover plate 30.

[0032] Please see Figure 2In one embodiment of this application, the connection between the cover plate 30 and the substrate 20 is non-removable. For example, the cover plate 30 and the substrate 20 are connected by adhesive, welding, or high-temperature bonding. These connection methods not only ensure the sealing between the cover plate 30 and the substrate 20, but also make the overall volume of the intermediate conductor 10 small, suitable for heat dissipation of chips that are moving towards miniaturization. In other optional embodiments, the connection between the cover plate 30 and the substrate 20 can be made detachable. For example, the cover plate 30 and the substrate 20 are connected by screws or snap-fit ​​structures, and a sealing ring is provided between the cover plate 30 and the substrate 20 to ensure that the coolant in the liquid cooling cavity 21 does not flow out from between the cover plate 30 and the substrate 20, thereby ensuring the sealing between the cover plate 30 and the substrate 20.

[0033] In one embodiment of this application, the needle fin 22 and the substrate 20 are separately processed and formed, and the needle fin 22 is connected to the substrate 20 by means of bonding, welding or high temperature bonding.

[0034] Optionally, the cross-section of the needle fin 22 may be circular, square, triangular, rhomboid, or elliptical.

[0035] In one embodiment of this application, the needle fin 22 is entirely made of a thermosensitive hydrogel material. Further, the needle fin 22 is entirely made of a thermosensitive hydrogel material that can reduce the volume of the entire needle fin 22 by 40%-80% when heated to a temperature of 300K-400K. In other feasible embodiments, the needle fin 22 may not be entirely made of a thermosensitive hydrogel material, but may be partially made of a thermosensitive hydrogel material, for example, as... Figure 3 The needle fin 22 includes a thermosensitive hydrogel segment 221 made of thermosensitive hydrogel material and a metal heat transfer segment 222 made of a metal with good heat transfer properties (copper, Al, etc.). Regarding the connection between the thermosensitive hydrogel segment 221 and the metal heat transfer segment 222, specifically, as follows... Figure 1 The thermosensitive hydrogel segment 221 shown is connected to the substrate 20 via the metal heat transfer segment 222, or the metal heat transfer segment 222 can be connected to the substrate 20 via the thermosensitive hydrogel segment 221. Because the thermal conductivity of thermosensitive hydrogel is not as good as that of metal, by setting the thermosensitive hydrogel needle as both the thermosensitive hydrogel segment 221 and the metal heat transfer segment 222, it is possible not only to ensure that the needle fin 22 undergoes a volume change when exposed to high temperatures, increasing the flow rate in the cooling area corresponding to the high heat flux hotspot of the chip, achieving the beneficial effect of intelligent cooling chip high heat flux hotspots, but also to ensure the overall heat transfer performance of the needle fin 22. Furthermore, the thermosensitive hydrogel segment 221 is made of a thermosensitive hydrogel material that can reduce its volume by 40%-80% when heated to 300K-400K.

[0036] Preferably, the thermosensitive hydrogel material is formed by copolymerizing two monomers: diethylene glycol methyl methacrylate (DGME) and polyethylene glycol methacrylate (PEG). When the entire fin 22 is made of the thermosensitive hydrogel material, the thermosensitive hydrogel material formed by copolymerizing DGME and PEG reduces the volume of the entire fin 22 by 50%-80% when the chip hotspot temperature reaches 300K-400K. When only a portion of the fin 22 is made of the thermosensitive hydrogel material, the thermosensitive hydrogel material formed by copolymerizing DGME and PEG reduces the volume of the portion of the fin 22 made of the thermosensitive hydrogel material by 50%-80% when heated to 300K-400K.

[0037] Optionally, graphene nanomaterials and / or boron nitride nanomaterials are added to the hydrogel material to increase its heat transfer performance and improve the overall heat dissipation effect of the radiator.

[0038] In one embodiment of this application, to further increase the thermal conductivity of the fins 22 and improve the overall heat dissipation effect of the heat sink on the chip, several layers of metal wires 223 are disposed within the fin structure made of thermosensitive hydrogel material. The cross-sectional dimensions of the metal wires 223 are set to the micrometer or nanometer level. The several layers of metal wires 223 are sequentially arranged along the axial direction of the fin structure, such as... Figure 4 As shown, the metal wires 223 in each layer are arranged in a straight line, and the central axis of each metal wire 223 is perpendicular to the central axis of the fin 22. This ensures good heat dissipation while minimizing the obstruction of the metal wires 223 to the reduction in the size of the fin 22. In this embodiment, the metal wires 223 in each layer are arranged sequentially at intervals along a direction perpendicular to the central axis of the fin 22. In other optional embodiments, the metal wires 223 in each layer may also be arranged radially around the central axis of the fin 22.

[0039] Preferably, the end of the metal wire 223 near the outer wall of the needle fin 22 is exposed outside the needle fin 22, so that the end of the metal wire 223 exposed outside the needle fin 22 can directly contact the coolant and achieve a better heat transfer effect.

[0040] Optionally, the metal wire 223 can be made of metal materials with good thermal conductivity such as copper, aluminum, and nickel-titanium alloy, or it can be made of shape memory metal. During the process of shrinking the volume of the needle fin 22, the metal wire 223 will be compressed and deformed by shrinking its cross-section. By setting the metal wire 223 to be made of shape memory metal, the compressed metal wire 223 can also recover accordingly after the volume of the needle fin 22 recovers, thus ensuring the subsequent heat exchange area of ​​the metal wire 223.

[0041] In other alternative embodiments, the outer surface of the needle fin 22 is provided with, for example, Figure 5 The convex point 224 shown or as Figure 6 The fins 225 shown are used to increase the heat transfer area of ​​the needle fins 22 and enhance the heat dissipation effect. The protrusions 224 and fins 225 can be 3D printed onto the needle fins 22.

[0042] In one embodiment of this application, the needle fins 22 are evenly distributed on the microchannel region 213 and arranged in an N-row, M-column matrix. In other feasible embodiments, the needle fins 22 may not be evenly distributed on the microchannel region 213, for example, as... Figure 7 As shown, the microchannel region 213 has a hotspot concentration area 2131 and a non-hotspot concentration area 2131. Fins 22 are evenly distributed on both the hotspot concentration area 2131 and the non-hotspot concentration area 2131. The density of the fins 22 on the hotspot concentration area 2131 is greater than that on the non-hotspot concentration area 2131, increasing the overall heat transfer area of ​​the fins 22 on the hotspot concentration area 2131. This achieves the beneficial effect of rapidly dissipating heat from the high heat flux hotspot area of ​​the chip. The location of the hotspot concentration area 2131 is set according to areas prone to generating high-power hotspots identified during chip usage research. Optionally, a trench structure 214 is provided on the hotspot concentration area 2131 to increase the liquid flow rate, achieving the beneficial effect of rapidly absorbing the heat generated by the high heat flux hotspot area of ​​the chip.

[0043] Optionally, the gap between adjacent needle fins 22, the distance between the outermost needle fin 22 and the side wall of the cooling section, and the side length or diameter of the cross-section of the needle fin 22 are all set at the millimeter or micrometer level.

[0044] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An adaptive needle-fin microchannel heat sink structure, characterized in that, The device includes an intermediate conductor, within which a liquid cooling cavity is provided. The liquid cooling cavity includes an inlet region, a microchannel region, and an outlet region arranged sequentially along the liquid inlet direction. The inlet region and the outlet region are respectively connected to the inlet port and the outlet port. The microchannel region is provided with a plurality of needle fins, the gaps between the needle fins cooperating to form microchannels that allow coolant to pass through. At least a portion of the structure of the needle fins is made of a thermosensitive hydrogel material that causes the needle fins themselves to shrink in volume when the temperature reaches a critical temperature.

2. The adaptive needle-fin microchannel heat sink structure according to claim 1, characterized in that, The intermediate conductor includes a substrate and a cover plate connected together, the cover plate being located on one side of the substrate, and the liquid cooling cavity being formed on the side of the substrate facing the cover plate.

3. The adaptive needle-fin microchannel heat sink structure according to claim 2, characterized in that, The cover plate and the substrate are made of LTCC, Cu or Al materials.

4. The adaptive needle-fin microchannel heat sink structure according to claim 2, characterized in that, The cover plate and the substrate are connected by adhesive bonding, welding or high-temperature bonding.

5. The adaptive pin-fin microchannel heat sink structure according to claim 1, characterized in that, The needle fins are all made of thermosensitive hydrogel material; or, the needle fins are partially made of thermosensitive hydrogel material, and the needle fins include a thermosensitive hydrogel segment made of thermosensitive hydrogel material and a heat transfer metal segment made of metal material.

6. The adaptive pin-fin microchannel heat sink structure according to claim 1, characterized in that, The thermosensitive hydrogel material is formed by copolymerization of two monomers: diethylene glycol methyl methacrylate and oligoethylene glycol methacrylate.

7. The adaptive pin-fin microchannel heat sink structure according to claim 1, characterized in that, The hydrogel material contains graphene nanomaterials and / or boron nitride nanomaterials.

8. An adaptive pin-fin microchannel heat sink structure according to any one of claims 1-7, characterized in that, The needle fin structure, made of thermosensitive hydrogel material, contains several layers of metal wires. The cross-sectional size of the metal wires is set to the micrometer or nanometer level. Each metal wire is straight, and the central axis of each metal wire is perpendicular to the central axis of the needle fin.

9. The adaptive pin-fin microchannel heat sink structure according to claim 8, characterized in that, The ends of each metal wire near the outer sidewall of the needle fin protrude outside the needle fin.

10. The adaptive pin-fin microchannel heat sink structure according to claim 8, characterized in that, The metal wire is made of Cu, Al, nickel-titanium alloy or shape memory metal.

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