Coating device and coating method

Abstract

The invention discloses coating equipment and a coating method, the coating equipment is used for coating glue on a semiconductor substrate, the coating equipment comprises a glue coating system, a glue uniformizing system and a clear glue providing system, the glue coating system comprises a coating knife translating relative to the semiconductor substrate, and the coating knife is provided with a glue coating part and a slit type glue outlet which is arranged on the glue coating part and is used for coating the glue on the semiconductor substrate; the glue uniformizing system is provided with a glue uniformizing part rotating relative to the glue outlet, and the glue uniformizing part is configured to start rotating when the glue outlet moves to a glue uniformizing position above the glue uniformizing part before the glue is coated on the glue outlet so as to remove redundant glue liquid adhered to the glue outlet, so that the quantity of the glue liquid coated on the semiconductor substrate is uniform and consistent; and the glue cleaning system translates along the length direction of the coating knife after the glue is coated at the glue outlet, and is used for spraying the cleaning liquid for diluting the glue liquid at the periphery of the glue coating part and scraping the diluted glue liquid outside the glue outlet, so that the phenomenon that the glue outlet is blocked or the glue is not uniformly discharged in the prior art is avoided, and the glue coating precision of the glue coating part is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a coating device and a coating method applied in the coating device. BACKGROUND

[0002] The coating device is a coating technology that coats glue on a semiconductor substrate under pressure.

[0003] Before coating, the glue outlet adheres to excess glue, and the excess glue coated on the semiconductor substrate causes uneven glue.

[0004] Due to the high viscosity and corrosive characteristics of the glue, the glue will remain on the glue coating part after each coating, which can easily cause the glue outlet to be blocked or the glue to be uneven, thereby affecting the glue coating accuracy of the glue coating part.

[0005] Based on the above reasons, there is an urgent need for a coating device to solve the above problems. SUMMARY

[0006] The purpose of the present application is to overcome the shortcomings of the prior art, and to provide a coating device with high glue coating accuracy and uniform glue coating amount, and a coating method applied in the coating device.

[0007] The present application is implemented as follows: a coating device for coating glue on a semiconductor substrate, comprising:

[0008] A glue coating system comprising a coating knife that translates relative to the semiconductor substrate, the coating knife having a glue coating part and a slit glue outlet provided on the glue coating part and used for coating glue on the semiconductor substrate;

[0009] A glue uniformizing system having a glue uniformizing part that rotates relative to the glue outlet, before the glue outlet is coated, the glue uniformizing part is configured to start rotating at a set speed, number of turns and direction when the glue outlet moves to a glue uniformizing position above the glue uniformizing part, to remove excess glue adhered to the glue outlet;

[0010] A glue cleaning system that translates along the length direction of the coating knife after the glue outlet is coated, for spraying cleaning liquid of diluted glue on the outer periphery of the glue coating part and scraping off the diluted glue.

[0011] The present application also provides a coating method applied in the above-mentioned coating device, comprising the following steps:

[0012] Before coating, the glue uniformizing part rotates relative to the glue outlet to remove excess glue adhered to the glue outlet of the coating knife;

[0013] When coating, the glue outlet of the coating knife moves parallelly relative to the semiconductor substrate to coat glue;

[0014] After the glue is applied, the glue outlet of the coating knife is cleaned to remove the glue adhered to the glue outlet.

[0015] The present application provides a coating device and a coating method for applying glue on a semiconductor substrate, which comprises a glue applying system, a glue leveling system and a glue cleaning system. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 is a structural diagram of the coating device provided by the embodiment of the present application, which comprises a glue applying system, a glue leveling system and a glue cleaning system.

[0018] Figure 2 is a structural diagram of the glue applying system provided by the embodiment of the present application, in which the lifting device drives the coating knife to move up and down.

[0019] Figure 3 is a structural diagram of the glue applying system provided by the embodiment of the present application. Figure 2 is an enlarged view of A in

[0020] Figure 4 is a structural diagram of the platform in the glue applying system and the vacuum adsorption device installed on the back of the platform provided by the embodiment of the present application.

[0021] Figure 5 is a structural diagram of the front of the platform in the glue applying system provided by the embodiment of the present application.

[0022] Figure 6 is a structural diagram of the glue applying system provided by the embodiment of the present application. Figure 5 is an enlarged view of B in

[0023] Figure 7 is a structural diagram of the vacuum pressure adjusting assembly in the glue applying system provided by the embodiment of the present application.

[0024] Figure 8 is a structural diagram of a jacking device in a gluing system provided by an embodiment of the present application.

[0025] Figure 9 is a structural diagram of a needle structure in the jacking device provided by an embodiment of the present application.

[0026] Figure 10 is a structural diagram of a guiding and aligning device in the gluing system provided by an embodiment of the present application.

[0027] Figure 11 is a structural diagram of a first guiding and installing structure or a second guiding and installing structure in the guiding and aligning device provided by an embodiment of the present application.

[0028] Figure 12 is a structural diagram of a needle assembly in the gluing system provided by an embodiment of the present application, which is raised from a first height position to a second height position.

[0029] Figure 13 is a structural diagram of the needle assembly in the gluing system provided by an embodiment of the present application, which is lowered from the second height position to the first height position.

[0030] Figure 14 is a structural diagram of a glue spreading system and a coating knife of a coating device provided by an embodiment of the present application.

[0031] Figure 15 is a structural diagram of a glue spreading distance between a glue spreading part of the glue spreading system and a glue outlet of the coating knife provided by an embodiment of the present application.

[0032] Figure 16 is a structural diagram of a glue cleaning system in the coating device provided by an embodiment of the present application.

[0033] Figure 17 is a structural diagram of a guiding seat in the glue cleaning system provided by an embodiment of the present application.

[0034] Figure 18 is a structural diagram of a coating knife soaking assembly in the glue cleaning system provided by an embodiment of the present application.

[0035] Figure 19 is a sectional view along Figure 18 direction A-A.

[0036] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

[0037] In the drawings, the reference signs are explained as follows:

[0038] a semiconductor substrate 10;

[0039] The system includes: a glue application system 100, a glue applicator 110, a glue application section 111, a glue outlet 112, a platform 120, an adsorption area 121, a transverse groove 1211, a longitudinal groove 1212, a guide port 122, a vacuum adsorption port 123, a guide hole 124, a vacuum adsorption device 130, a vacuum pipeline 131, a vacuum pump 132, an air intake regulating valve 133, a first power component 134, a vacuum pressure sensor 135, a first drive controller 136, a lifting device 140, an ejector pin assembly 141, a connecting plate 1410, a sleeve 1411, a connecting position 1411a, an arc-shaped part 1411b, a positioning component 1412, a horizontal end 1412a, a vertical end 1412b, a clearance position 1412c, an ejector pin 1413, a channel 1414, a second power component 142, a height position detector 143, a sliding guide 150, and a linear... Slide rail 151, slider 152, gate structure 160, first support position 161, second support position 161', guide entrance 162, slider 163, rollers (164, 164'), guide alignment device 170, first guide alignment part 171, second guide alignment part 172, guide surface 173, guide support assembly 174, bracket 1741, slide rod 1742, vertical sliding part 175 Linear guide rail 1751, guide block 1752, third power component 176, position monitor 177, two first slide rails (181, 181'), two fourth power components (182, 182'), two bases (191, 191'), two sets of second slide rails (192, 192'), two fifth power components (193, 193'), support beam 194, connecting seat (195, 195');

[0040] Spreading system 200, spreading section 210, scraping section 220, sixth power component 211, spreading sensor 212;

[0041] The system includes: a glue removal system 300, a rinsing assembly 310, a liquid outlet 311, a cleaning fluid tank 312, an injection pump 313, an injection pipeline 314, a glue scraping assembly 320, a scraper 321, an air blowing assembly 330, an air blowing port 331, a nitrogen compression bottle 332, a nitrogen pipeline 333, a control valve 334, a guide rail 340, a guide seat 350, a V-groove 351, two inclined surfaces (3511, 3511'), a liquid guide port 352, a guide section 353, two through holes (354, 354'), and two bolts. (355, 355'), screw 3551, nut 3552, power component 360, rotary motor 361, driven wheel 362, belt 363, support plate 364, fifth drive controller 366, first position sensor 367, second position sensor 368, coating knife position sensor 365, coating knife soaking assembly 370, solution tank 371, inclined surface 3711, drain port 372, guide groove 373, guide inlet 374, two connecting plates (375, 375'). Detailed Implementation

[0042] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or state relationship based on the orientation or state relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0043] In addition, in addition to indicating the orientation or state relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0044] In addition, the terms "mount", "set", "provided with", "connected", "connected" should be broadly understood. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] In addition, the terms "first", "second", and the like are mainly used to distinguish different devices, elements or components, and the specific type and structure can be the same or different, and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0046] In order to clearly indicate the direction relationship in the drawing, a coordinate system is appropriately marked with the vertical direction as the Z direction and the horizontal plane as the XY plane.

[0047] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0048] As an example, the coating device is summarized

[0049] As shown in Figures 1 to 3 The coating device provided by the embodiments of the present application is used for coating glue on a semiconductor substrate 10, which comprises:

[0050] The glue coating system 100 comprises a coating knife 110 which is translated relative to the semiconductor substrate 10, the coating knife 110 has a glue coating part 111 and a slit glue outlet 112 which is arranged on the glue coating part 111 and is used for coating glue on the semiconductor substrate 10;

[0051] The glue uniform system 200 has a glue uniform part 210 rotating relative to the glue outlet 112, and before the glue outlet 112 is coated with glue, the glue uniform part 210 is configured to start rotating at a set rotating speed, number of turns and direction when the glue outlet 112 moves to a glue uniform position above the glue uniform part 210, so as to remove the excess glue adhered to the glue outlet 112, and the excess glue will adhere to the outer circumferential surface of the glue uniform part 210;

[0052] The glue cleaning system 300 reciprocally translates along the length direction of the coating knife 110 after the glue outlet 112 is coated with glue, and is used for spraying the cleaning liquid of the diluted glue on the outer circumferential surface of the glue coating part 111 and scraping off the diluted glue.

[0053] Summary of the glue coating system 100 as an example

[0054] As shown in Figure 1 and Figure 4 , further, the glue coating system 100 comprises:

[0055] The platform 120 is used for placing the semiconductor substrate 10 and has an adsorption area 121 corresponding to the semiconductor substrate 10;

[0056] The vacuum adsorption device 130 is used for communicating with the adsorption area 121 and can generate a vacuum negative pressure force for adsorbing and fixing the semiconductor substrate 10 on the platform 120.

[0057] As shown in Figure 5 , the platform 120 has a plurality of guide ports 122 and a plurality of uniformly arranged vacuum adsorption ports 123 arranged at intervals with the adsorption area, and the upper end of each vacuum adsorption port 123 communicates with the adsorption area 121; in the embodiment, the platform 120 is preferably a marble platform 120 with high parallelism (such as ∥1 μm), so as to further ensure the parallelism of the semiconductor substrate 10; the semiconductor substrate 10 can include but is not limited to: a glass substrate for liquid crystal display device, a glass substrate for PDP, a glass substrate for photomask, a substrate for color filter, a substrate for recording disc, a substrate for solar cell, a substrate for electronic paper, various substrates for precision electronic devices, rectangular glass substrate, flexible substrate for thin film liquid crystal, substrate for organic EL, etc. In the embodiment, the glass substrate is preferred.

[0058] The adsorption area 121 is arranged on the front surface of the platform 120, and includes a plurality of transverse grooves 1211 and a plurality of longitudinal grooves 1212 communicating with the transverse grooves 1211. The plurality of transverse grooves 1211 and the plurality of longitudinal grooves 1212 communicate with each other to form a plurality of grid-shaped adsorption ports for uniformly adsorbing the semiconductor substrate 10. The plurality of grid-shaped adsorption ports constitute the adsorption area 121. In the case that the adsorption area 121 has a vacuum adsorption force, the grid-shaped adsorption ports can uniformly adsorb and fix the semiconductor substrate 10 on the front surface of the platform 120, thereby ensuring the parallelism of the semiconductor substrate 10 and facilitating the knife 110 in the glue coating system 100 to uniformly coat glue on the semiconductor substrate 10. In this embodiment, the width of the transverse groove 1211 and the longitudinal groove 1212 is preferably 1 mm, and the depth is 1 mm. With this structure, the phenomenon that the ultra-thin semiconductor substrate 10 (such as a semiconductor substrate with a thickness of 0.2 mm) is deformed under the action of the vacuum adsorption force can be avoided due to the large opening size of the transverse groove 1211 and the longitudinal groove 1212.

[0059] The plurality of vacuum adsorption ports 123 are arranged opposite to the adsorption area 121 and communicate with the adsorption area 121 at one end, and extend to the side surface opposite to the adsorption area 121 at the other end. The plurality of vacuum adsorption ports 123 are uniformly arranged on the platform 120, so that the vacuum negative pressure in the adsorption area 121 is uniform. In this embodiment, the vacuum adsorption ports 123 are uniformly arranged on the longitudinal grooves 1212 and have substantially the same size as the longitudinal grooves 1212.

[0060] As shown in FIG. 1, Figure 6 In this embodiment, the vacuum adsorption port 123 is a hole structure, and the inner diameter of the hole is substantially the same as the width of the longitudinal groove 1212. In another embodiment, the vacuum adsorption port 123 can also be uniformly arranged on the transverse groove 1211. Alternatively, the vacuum adsorption port can also be uniformly arranged on the transverse groove 1211 and the longitudinal groove 1212, which can achieve the function of vacuum adsorption.

[0061] As shown in FIG. 1, Figure 4 Preferably, the vacuum adsorption device 130 is arranged on the back surface of the platform 120. The vacuum adsorption device 130 includes a vacuum pipeline 131 and a vacuum pump 132. One end of the vacuum pipeline 131 communicates with the vacuum pump 132, and the other end of the vacuum pipeline 131 respectively communicates with the vacuum adsorption port 123.

[0062] As shown in FIG. 1, Figure 7 Further, the vacuum adsorption device 130 further includes a vacuum pressure adjusting assembly for adjusting the size of the vacuum adsorption force in the vacuum pipeline 131. The vacuum pressure adjusting assembly includes:

[0063] An air intake adjusting valve 133, an outlet of which is communicated with the vacuum pipeline 131, and an air inlet 1331 of which is communicated with the outside atmosphere;

[0064] A first power member 134, which drives the air intake adjusting valve 133 to rotate, and is used to control the air intake of the air intake adjusting valve 133. In the embodiment, the first power member 134 is preferably a screw motor.

[0065] A vacuum pressure sensor 135, which is used to detect the vacuum negative pressure value in the vacuum pipeline 131, and output a data signal containing the vacuum negative pressure value to the outside.

[0066] A first driving controller 136, which stores a standard vacuum negative pressure value. The first driving controller 136 controls the first power member 134 to rotate at a set number of turns and in a set direction according to the difference between the vacuum negative pressure value fed by the vacuum pressure sensor 135 and the standard vacuum negative pressure value, and the first power member 134 drives the air intake adjusting valve 133 to rotate at a set number of turns and in a set direction, so as to adjust the air intake of the air intake adjusting valve 133, and further adjust the vacuum negative pressure value at the outlet of the air intake adjusting valve 133 to a preset vacuum negative pressure value, so as to make the current vacuum pressure value suitable for adsorbing the ultra-thin semiconductor substrate 10. When adsorbing a semiconductor substrate 10 with a large thickness, the first power member 134 drives the screw 1332 of the air intake adjusting valve 133 to rotate at a set number of turns, and the screw 1332 drives the valve core 1333 of the air intake adjusting valve 133 to rotate, so as to gradually expand the air intake of the air inlet 1331, and the size of the vacuum adsorption force can be adjusted according to the thickness of the semiconductor substrate 10, so as to avoid the phenomenon of deformation of the semiconductor substrate 10.

[0067] As shown in Figure 8 , further, the glue applying system 100 further comprises:

[0068] A jacking device 140, which has a jack assembly 141 slidingly arranged in the platform 120. The jack assembly 141 moves up from a first height position to a second height position, and is used to receive the semiconductor substrate 10 transferred by the robot. The jack assembly 141 moves down from the second height position to the first height position, and is used to place the received semiconductor substrate 10 on the platform 120.

[0069] After the glue outlet 112 completes the glue applying work on the semiconductor substrate 10, the jacking device 140 moves up from the first height position to the second height position, so as to facilitate the robot to transfer the semiconductor substrate 10 with the applied glue to the next process.

[0070] Preferably, the jacking device 140 comprises:

[0071] The second power member 142 is used to drive the up-and-down movement of the needle assembly 141. The second power member 142 includes but is not limited to a telescopic cylinder, a rotary motor or a screw motor. In the embodiment, the second power member 142 is preferably a screw motor.

[0072] As shown in Figure 12 , the second power member 142 rotates at a first number of turns, a first rotation speed and a first direction. The needle assembly 141 is moved up from the first height position to the second height position to receive the semiconductor substrate 10 which is not coated with the glue solution.

[0073] As shown in Figure 13 , the second power member 142 rotates at a second number of turns, a second rotation speed and a second direction. The needle assembly 141 is moved down from the second height position to the first height position to place the semiconductor substrate 10 which is not coated with the glue solution on the platform 120.

[0074] In the embodiment, the second power member 142 is preferably two. The first direction is opposite to the second direction. The first number of turns is the same as the second number of turns. The first rotation speed is the same as the second rotation speed. The second power member 142 can output rotation power at a uniform speed.

[0075] Preferably, the second power member 142 is two and is symmetrically arranged at the lower ends of the needle assembly 141 to evenly bear the weight of the needle assembly 141, which is beneficial to the stability of the needle assembly 141.

[0076] As shown in Figure 8 , further, the jacking device 140 further includes:

[0077] The two height position detectors 143 are used to respectively detect the first height position or the second height position of the needle assembly 141. When the height position detector 143 detects that the needle assembly 141 moves to the first height position or the second height position, the height position detector 143 outputs a first height position signal or a second height position signal.

[0078] The second driving controller drives the second power member 142 to start or stop working according to the received first height position signal or second height position signal. The second driving controller stores the number of turns, direction and speed of the second power member 142.

[0079] The second power member 142 rotates at a first number of turns, a first rotating speed and a first direction, and the linkage pin assembly 141 moves the semiconductor substrate 10 coated with glue solution from the first height position to the second height position, so as to facilitate the transfer of the semiconductor substrate 10 coated with glue solution to the next process by the manipulator; the second driving controller controls the second power member 142 to drive the pin assembly 141 to move up and down according to the first height position signal or the second height position signal fed back by the height position detector 143, so as to transfer the semiconductor substrate 10. With the above structure, the operation is simple, the transfer is convenient, the intelligent degree is high, and the efficiency of transferring the semiconductor substrate 10 is improved.

[0080] As shown in Figure 8 Further, the jacking device 140 further comprises two vertically and spaced sliding guides 150, and the two ends of the pin assembly 141 are respectively slidably arranged on the two sliding guides 150. Preferably, each sliding guide 150 comprises two symmetrically arranged linear sliding rails 151 and a sliding block 152 respectively slidably arranged on the two linear sliding rails 151, and the two ends of the pin assembly 141 are directly or indirectly fixed on the two sliding blocks 152. The second power member 142 drives the pin assembly 141 to uniformly ascend or descend along the linear sliding rail 151 at a set rotating speed, number of turns and direction.

[0081] As shown in Figure 8 and Figure 9 Preferably, the pin assembly 141 comprises a plurality of rows of spaced pin modules and a connecting plate 1410 for supporting the pin modules. Each row of pin modules comprises a plurality of spaced pin structures, each pin structure comprises a sleeve 1411 and a positioning member 1412 limiting the sleeve 1411, and each sleeve 1411 is embedded with a pin 1413. The channel 1414 for the manipulator to pass through is formed between two adjacent pin modules, so as to facilitate the transfer of the semiconductor substrate 10.

[0082] Preferably, the plurality of pins 1413 are located at the same height to form a flat placement site 1415 for placing the semiconductor substrate 10 on the top of the pin 1413, so as to stably support the semiconductor substrate 10.

[0083] As shown in Figure 9As shown, preferably, the positioning member 1412 and the sleeve 1411 are axially limited and radially slidingly fitted. The structure of the axially limited and radially sliding fit is as follows: a connecting position 1411a is radially provided on the outer peripheral surface of the lower end of the sleeve 1411. The positioning member 1412 has a horizontal end 1412a that slides and fits against the upper surface of the connecting position 1411a and a vertical end 1412b that is fixedly connected to the connecting position 1411a. Preferably, the connecting position 1411a is arranged in a ring on the outer peripheral surface of the sleeve 1411. When the ejector pin 1413 rotates 360° along its axis, the horizontal end 1412a can axially limit the ejector pin 1413.

[0084] Furthermore, the horizontal end 1412a is provided with a clearance opening 1412c through which the ejector pin 1413 can pass. The clearance opening 1412c can increase the contact area between the connecting position 1411a and the horizontal end 1412a, and expand the range of translation of the connecting position 1411a, which is suitable for adjusting the ejector pin 1413 with a large degree of curvature to the position corresponding to the guide opening 122.

[0085] Furthermore, the bottom of the ejector pin 1413 is an arc-shaped portion 1411b that can reduce the contact area between it and the connecting plate 1410, and the connecting position 1411a is located near the arc-shaped portion.

[0086] In this embodiment, the ejector pin 1413 and the guide port 122 are in a sliding fit with a gap.

[0087] The connecting position 1411a of sleeve 1411 can be translated (e.g., moved forward or backward or left or right, see below) relative to the horizontal end 1412a. Figure 9 The sleeve 1411 can be adjusted to a position corresponding to the guide port 122 of the platform 120 (in the X and Y directions). At this time, the center of the ejector pin 1413 is located at the same position as the center of the guide port 122, which facilitates the smooth sliding of the ejector pin 1413 in the guide port 122. The verticality of the ejector pin 1413 can be adjusted before or after the positioning member 1412 is fixedly connected to the connecting plate 1410. The operation is simple and convenient.

[0088] In addition, during the upward movement of the ejector assembly 141, the inner circumferential surface of the vertically arranged guide port 122 applies a radial thrust to the outer circumferential surface of the bent ejector 1413, causing the ejector 1413 to move to the position corresponding to the guide port 122, thereby automatically correcting the bending of the ejector 1413.

[0089] like Figure 8 As shown, the lifting device 140 includes a gate-shaped structure 160 for adjusting the parallelism of the pin assembly 141. The gate-shaped structure 160 includes two vertically spaced first support positions 161 and second support positions 161', and a connecting plate 1410 is horizontally disposed between the first support positions 161 and the second support positions 161'.

[0090] The first support position 161 and the second support position 161' are respectively detachably fixedly connected with two sliding blocks 152, the two sliding blocks 152 are respectively slidably arranged on the two groups of linear sliding rails 151, and the two sliding blocks 152 are respectively driven by the two second power members 142 to move up and down;

[0091] One end of the connecting plate 1410 is rotationally connected with the first support position 161, and the other end of the connecting plate 1410 is fixed in a vertical direction and slidably connected in a horizontal direction with the second support position 161'. The structure of the vertical direction fixation and the horizontal direction sliding cooperation is as follows:

[0092] A guide inlet 162 is transversely arranged on the second support position 161', and an L-shaped sliding member 163 is arranged with one end penetrating into the guide inlet 162 and the other end being vertically arranged and fixedly connected with the connecting plate 1410. Preferably, the guide inlet 162 is formed between two vertically and horizontally spaced rollers (164, 164'), and the rotation shafts of the two rollers (164, 164') are directly or indirectly fixedly connected with the second support position 161'. In this embodiment, the two rollers (164, 164') are located at the empty space of the second support position 161', so as to simplify the product structure and save the internal space of the product.

[0093] The vertical section 1631 of the sliding member 163 is fixedly connected with the connecting plate 1410, and the horizontal section 1632 is transversely slidably arranged in the guide inlet 162. With the above structure, when the parallelism of the needle assembly 141 is adjusted, the second support position 161' and the connecting plate 1410 have a movable gap, so that the connecting plate 1410 can be rotated relative to the first support position 161. In the rotating process, the two rollers (164, 164') also have a guiding effect, so that the horizontal section 1632 of the sliding member 163 can be quickly arranged in the guide inlet 162, and the installation efficiency is improved.

[0094] The first support position 161 or the second support position 161' is driven to move up or down by one of the second power members 142, so as to adjust the parallelism of the needle assembly 141, and facilitate the smooth sliding of the needle 1413 in the guide inlet 122.

[0095] As an example, the guiding and positioning device is summarized

[0096] As shown in Figure 10 and Figure 11 , further, the glue coating system 100 further comprises:

[0097] The guiding and positioning device 170 is used for guiding and positioning the semiconductor substrate 10 loaded on the needle assembly 141 at the glue coating position on the platform 120.

[0098] Preferably, the guiding and positioning device 170 comprises:

[0099] The first guide mounting structure includes at least two spaced first guide alignment portions 171 for guiding and aligning the semiconductor substrate 10 along its length direction.

[0100] The second guide mounting structure includes at least two second guide alignment portions 172 spaced apart for guiding and aligning the semiconductor substrate 10 in the width direction.

[0101] In this embodiment, the first guide mounting structure is the same as the second guide mounting structure, except that the orientation of the first guide alignment part 171 of the first guide mounting structure and the second guide alignment part 172 of the second guide mounting structure are different.

[0102] like Figure 11 As shown, preferably, the first guide alignment part 171 and the second guide alignment part 172 are both displaced at the same height. The first guide alignment part 171 and the second guide alignment part 172 include rolling wheels that rotate along their axes. The rolling wheels are respectively located around the semiconductor substrate 10. A guide surface 173 for guiding and aligning the semiconductor substrate 10 is formed between the vertical diameter D1 and the horizontal diameter D2 of the rolling wheels. Since the resistance of rolling friction is less than the resistance of sliding friction, the rotating rolling wheels can quickly guide the semiconductor substrate 10 to the adhesive application position of the platform 120, thereby improving the efficiency of guidance and alignment.

[0103] Preferably, the position corresponding to the horizontal diameter D2 of the rolling wheel arranged opposite to each other in the X and Y directions is used to align the semiconductor substrate 10 in the length and width directions. In this embodiment, the position corresponding to the horizontal diameter D2 of the rolling wheel is at the same height as the upper surface of the platform 120. With this structural design, the semiconductor substrate 10 can be guided and positioned at the adhesive application position of the platform 120 at the third height position, which is beneficial for the applicator 110 to accurately apply adhesive to the semiconductor substrate 10.

[0104] like Figure 10 As shown, the guide alignment device 170 further includes a guide support assembly 174 supporting the first guide alignment part 171 and the second guide alignment part 172. The guide support assembly 174 includes a hollow bracket 1741 and a plurality of slide rods 1742 disposed on the bracket 1741 for respectively mounting the first guide alignment part 171 and the second guide alignment part 172. The slide rods 1742 pass through the guide holes 124 of the platform 120. The bracket 1741 is located below the platform 120, and the slide rods 1742 are located on the outer periphery of the semiconductor substrate 10. Rollers in the X and Y directions guide and align the semiconductor substrate 10 around its periphery.

[0105] In this embodiment, the slide rod 1742 and the guide hole 124 are in a sliding fit with clearance.

[0106] likeFigure 10 As shown, both the first and second guide mounting structures include an axially limiting and radially sliding fit structure 179, which is located between the slide rod 1742 and the bracket 1741. This structure 179 and... Figure 9 The axial limiting and radial sliding fit structure is the same as that in the guide support assembly 174, and will not be described in detail here. During the upward movement of the guide support assembly 174, the inner circumferential surface of the guide hole 124 applies radial thrust to the outer circumferential surface of the bent slide rod 1742, so that each slide rod 1742 moves to the position corresponding to the guide hole 124, which plays the role of automatically correcting the bent slide rod 1742. Of course, the slide rod 1742 can also be manually corrected before and after installation, which is the same as the manual correction method of the ejector pin 1413, and will not be described in detail here.

[0107] like Figure 10 As shown, the guiding alignment device 170 further includes two sets of symmetrically arranged vertical sliding members 175 for guiding the bracket 1741. Each set of vertical sliding members 175 includes two linear guide rails 1751 symmetrically arranged along the Y direction and guide blocks 1752 respectively slidably on the two linear guide rails 1751. The two ends of the bracket 1741 are directly or indirectly fixed on the two guide blocks 1752 to achieve the function of vertically guiding the bracket 1741.

[0108] Furthermore, the guide alignment device 170 also includes a third power component 176 to drive the guide support assembly 174 to move up and down along the Z direction;

[0109] like Figure 12 and Figure 13 As shown, the third power component 176 rotates according to the set first number of revolutions, first speed and first direction. The first guide alignment part 171 and the second guide alignment part 172 on the linkage guide support assembly 174 rise and move from the third height position to the fourth height position. At the fourth height position, the first guide alignment part 171 and the second guide alignment part 172 accurately guide the semiconductor substrate 10, which has descended from the second height position to the first height position, to the adhesive application position of the platform 120. In this embodiment, the upper surface of the platform 120 is at the same height as the position corresponding to the horizontal diameter D2 of the first guide alignment part 171 and the second guide alignment part 172 at the fourth height position.

[0110] The third power unit 176 rotates according to the set second number of revolutions, second speed and second direction, and the first guide alignment part 171 and the second guide alignment part 172 move down from the fourth height position to the third height position. The third height position is lower than the height of the coating knife 110 when applying adhesive in the horizontal direction, so that the coating knife 110 can accurately apply adhesive on the fixed semiconductor substrate 10.

[0111] like Figure 10The first position monitor 177 is used to detect the third height position of the first guide alignment part 171 and the second guide alignment part 172.

[0112] The second position monitor 178 is used to detect the fourth height position of the first guide alignment part 171 and the second guide alignment part 172. When the position monitor 177 or the second position monitor 178 detects that the first guide alignment part 171 and the second guide alignment part 172 are located at the third height position or the fourth height position, a third height position signal or a fourth height position signal is outputted.

[0113] The third drive controller drives the third power member 176 to start or stop working according to the received third height position signal or fourth height position signal. The drive controller stores the parameters of the third power member 176, such as the rotating speed, direction and number of turns.

[0114] With the above structure, the semiconductor substrate 10 can be guided and aligned intelligently, and the efficiency of guiding and aligning the semiconductor substrate 10 is improved. The operation is simple and convenient.

[0115] Translation device as an example

[0116] As shown in Figure 1 Further, the glue coating system 100 further comprises a translation device used to drive the coating knife 110 to move horizontally along the Y direction. The translation device comprises:

[0117] Two first sliding rails (181, 181') are installed on the platform 120 in parallel and at intervals and located at two sides of the semiconductor substrate 10, and are used to guide the coating knife 110 in the horizontal direction.

[0118] Two fourth power members (182, 182') are used to drive the coating knife 110 to translate along the two first sliding rails (181, 181'). The two fourth power members (182, 182') drive the coating knife 110 to translate by a set distance at a set height, so that the glue outlet 112 can be moved to the top of the glue uniformizing part 210. In the embodiment, the two fourth power members (182, 182') are magnetic linear motors or screw motors, which can both drive the coating knife 110 to translate. Preferably, the magnetic linear motor has high precision and long moving distance.

[0119] A displacement sensor 183 is used to detect the current displacement speed of the coating knife 110 and output a displacement speed signal.

[0120] The fourth driving controller stores preset standard displacement speed information of the two fourth power members (182, 182'), and when the displacement sensor 183 detects that the current displacement speed of the two fourth power members (182, 182') deviates from the standard displacement speed, the fourth driving controller changes the size of the current supplied to the two fourth power members (182, 182') to make the coating knife 110 move horizontally at the standard displacement speed.

[0121] Lift device as an example

[0122] As shown in Figure 1 and Figure 2 Further, the glue coating system 100 further comprises a lift device for driving the coating knife 110 to move up and down to different heights, and the lift device comprises:

[0123] Two bases (191, 191') are respectively slidably arranged on the corresponding two first slide rails (181, 181');

[0124] Two groups of second slide rails (192, 192') are respectively arranged vertically on the two bases (191, 191') for vertically guiding the coating knife 110 (see Z direction in Figure 2

[0125] Two fifth power members (193, 193') are respectively arranged on the two bases (191, 191') for driving the coating knife 110 between the two bases (191, 191') to move up and down along the two groups of second slide rails (192, 192'), and the two fifth power members (193, 193') include but are not limited to telescopic air cylinders, telescopic motors or screw motors, and the two fifth power members (193, 193') are all rotated at a set speed, number of turns and direction to accurately adjust the height position of the coating knife 110; in the embodiment, the two fifth power members (193, 193') are preferably screw motors, and the moving distance of the coating knife 110 can be obtained by the product of the pitch of the screw and the number of turns.

[0126] One of the fifth power members 193 or the fifth power member 193' drives one end of the coating knife 110 to move on one of the second slide rails 192 or the second slide rail 192' at a set number of turns and direction, for adjusting the parallelism of the glue outlet 112, which is beneficial to uniformly coating the glue on the semiconductor substrate 10 by the coating knife 110;

[0127] As shown in Figure 2 ​As shown, further, the coating knife 110 is horizontally mounted on the support beam 194, and the support beam 194 is rotatably connected at two ends with connecting seats (195, 195') that slide on the two sets of second slide rails (192, 192'), and the two connecting seats (195, 195') are rotatably connected with the two ends of the support beam 194 through two rotating shafts 196, one of the connecting seats 195 is provided with an elongated waist-shaped hole 197 through which the rotating shaft 196 can translate, and the elongated waist-shaped hole 197 and the rotating shaft 196 are in clearance sliding fit, when one of the fifth power members 193 drives one end of the support beam 194 to move up and down to adjust the parallelism of the coating knife 110, the rotating shaft 196 can rotate and translate in the elongated waist-shaped hole 197, avoiding the phenomenon that the one end of the support beam 194 is stuck between the two connecting seats (195, 195') during the up and down movement.

[0128] The two fifth power members (193, 193') rotate at a set speed, number of turns and direction, simultaneously driving the two connecting seats (195, 195') to move up and down on the two sets of second slide rails (192, 192') by a set distance, and then driving the coating knife 110 to move up and down in linkage, so as to adjust the coating knife 110 to a preset height position.

[0129] Overview of the example glue uniformizing system 200

[0130] As shown in Figure 1 , Figure 14 and Figure 15 , further, the glue uniformizing part 210 of the glue uniformizing system 200 is arranged within the stroke range of the glue outlet 112, when the glue outlet 112 moves to a predetermined glue uniformizing position, the glue uniformizing part 210 rotates at the original position along its axis, for adhering the excess glue liquid at the glue outlet 112 to the outer circumferential surface of the glue uniformizing part 210, in the present embodiment, the glue uniformizing part 210 is preferably a glue uniformizing wheel, and the glue uniformizing wheel is driven to rotate by a sixth power member 211, and the sixth power member 211 is electrically connected with the fourth drive controller, when the glue outlet 112 of the coating knife moves to the glue uniformizing position, the center line in the length direction of the glue outlet 112 is configured to be coplanar with the vertical diameter of the glue uniformizing wheel.

[0131] Preferably, the fourth drive controller outputs a control instruction to control the sixth power member 211 to rotate only when the glue outlet 112 moves to directly above the glue uniformizing part 210, in the present embodiment, the glue uniformizing system 200 further includes a glue uniformizing inductor 212 for detecting the position of the glue uniformizing part 210, when the glue outlet 112 moves to directly above the glue uniformizing part 210, the glue uniformizing inductor 212 feeds a current glue outlet position signal to the fourth drive controller, and the fourth drive controller controls the sixth power member 211 to rotate at a set speed, number of turns and direction within a set time according to the received current glue outlet position signal.

[0132] As shown in Figure 14 andFigure 15 As shown, further, the glue uniformizing system 200 further comprises:

[0133] A glue scraping part 220 is arranged to slide against the outer circumferential surface of the glue uniformizing part 210, and when the glue uniformizing part 210 rotates, the glue scraping part 220 scrapes the glue liquid adhered to the outer circumferential surface of the glue uniformizing part 210, so that the glue uniformizing distance L between the glue uniformizing part 210 and the glue outlet 112 is always kept within the set threshold, ensuring that the glue liquid coated on the semiconductor substrate 10 by the glue outlet 112 is uniform.

[0134] The glue cleaning system 300 is outlined as an example

[0135] As shown, further, the glue cleaning system 300 further comprises: Figures 16 to 19

[0136] A flushing assembly 310 has a liquid outlet 311 for spraying the diluted glue liquid to the glue coating part 111 of the coating knife 110, and the liquid outlet 311 is capable of translating relative to the length direction of the glue coating part 111;

[0137] A glue scraping assembly 320 is capable of reciprocating translation relative to the length direction of the glue coating part 111, and has a scraper 321 matched with the glue coating part 111, the scraper 321 slides against the glue coating part 111, and the scraper 321 is used to scrape the diluted glue liquid during the translation.

[0138] As shown, further, the glue cleaning system 300 further comprises: Figure 17

[0139] A gas blowing assembly 330 has a gas blowing port 331 for blowing gas to the diluted glue liquid on the glue coating part 111, the gas blown by the gas blowing port 331 is used to diffuse the diluted glue liquid on the glue coating part 111, and the gas blowing port 331 moves synchronously with the liquid outlet 311, preferably, the gas blown by the gas blowing port 331 is nitrogen.

[0140] As shown, the glue coating part 111 of the coating knife 110 is a V-shaped boss arranged along the length direction of the coating knife 110, and a slit type glue outlet 112 is arranged at the tip of the V-shaped boss, after the glue coating knife 110 coats glue, the glue cleaning system 300 is used to clean the glue liquid adhered to the surface of the glue coating part 111 and the glue outlet 112, avoiding the phenomenon of blockage or uneven glue coating of the glue outlet 112 in the prior art, and improving the glue coating precision of the glue outlet 112, in the embodiment, the scraper 321 is preferably a V-shaped groove matched with the V-shaped boss. Figure 16

[0141] ​​​The gas blown out by the blowing port 331 is also used to evaporate the liquid remaining on the glue coating part 111. Since the glue liquid and the dilution liquid are harmful to human body, the glue cleaning system 300 and the coating knife 110 are separated from the outside world. In this case, it is necessary to make the liquid remaining on the glue coating part 111 evaporate quickly by blowing.

[0142] As shown in Figure 16 , the flushing assembly 310 comprises a liquid injection pump 313 for pumping the cleaning liquid in the cleaning liquid tank 312 and a liquid injection pipeline 314 in communication with the liquid injection pump 313. The liquid injection pipeline 314 is in communication with the liquid outlet 311. In the embodiment, the liquid outlet 311 is preferably two. The two liquid outlets 311 are respectively arranged opposite to the two glue coating inclined surfaces (113, 113') of the glue coating part 111. The cleaning liquid sprayed out of the liquid outlet 311 flows along the two glue coating inclined surfaces (113, 113') to the glue outlet 112, so as to achieve the purpose of diluting the glue liquid adhered to the outer surface of the glue coating part 111 and the glue outlet 112.

[0143] In the embodiment, the blowing assembly 330 comprises a nitrogen gas compression bottle 332, a nitrogen gas pipeline 333 in communication with the nitrogen gas compression bottle 332 and a control valve 334 for controlling the size of the nitrogen gas pipeline 333. The nitrogen gas pipeline 333 is in communication with the blowing port 331. In the embodiment, the blowing port 331 is preferably two. The two blowing ports 331 are respectively arranged opposite to the two glue coating inclined surfaces (113, 113') of the glue coating part 111. The two blowing ports 331 can make the dilution liquid on the glue coating inclined surfaces (113, 113') of the two glue coating parts 111 diffuse to the surrounding when blowing, so as to increase the dilution area and flow rate of the dilution liquid. After the mixed liquid of the dilution liquid and the glue liquid is scraped off by the scraper 321, the nitrogen gas blown out by the two blowing ports 331 is also used to quickly evaporate the liquid remaining on the glue coating part 111.

[0144] As shown in Figure 17 , in the embodiment, the glue scraping assembly 320 comprises a glue scraping plate 322. The scraper 321 is formed on the glue scraping plate 322 and is integrally formed with the glue scraping plate 322. The material of the glue scraping plate 322 and the scraper 321 is Teflon. Teflon has heat resistance, chemical inertness and low friction coefficient. It also has excellent high and low temperature resistance, corrosion resistance, weather resistance, high insulation, high lubricity, non-stick and non-toxicity and other excellent properties.

[0145] As shown in Figure 16 and Figure 17 , further, the glue cleaning system 300 further comprises:

[0146] a guide rail 340, configured to be arranged in parallel with the coating knife 110;

[0147] The guide seat 350 is slidably mounted on the guide rail 340. The guide seat 350 has a V-shaped groove 351 in the length direction that corresponds to and communicates with the scraper 321. The two scrapers 321 are detachably installed at both ends in the length direction of the guide seat 350. The two inclined surfaces (3511, 3511') of the V-shaped groove 351 are respectively provided with a liquid outlet 311 and an air blowing port 331.

[0148] The bottom of the guide seat 350 has a liquid guide port 352 that communicates with the V-groove 351;

[0149] After the scraper 321 is engaged with the coating part 111, a flow channel is formed between the two inclined surfaces (3511, 3511') of the V-groove 351 and the coating part 111, which is connected to the liquid guide port 352. The flow channel guides the diluent and adhesive into the liquid guide port 352 and then discharges them through the liquid guide port 352.

[0150] Preferably, the position of the V-groove 351 of the guide seat 350 is lower than the position of the scraper 321, so that a flow channel with an increased liquid outlet area and air outlet area is formed between the V-groove 351 and the coating blade 110.

[0151] The power unit 360 is used to drive the guide seat 350 to reciprocate on the guide rail 340. It includes a rotary motor 361 with a drive shaft, a driven wheel 362 arranged parallel to and spaced apart from the drive shaft, and a belt 363 sleeved on the drive shaft and the driven wheel 362. The guide seat 350 is directly or indirectly fixed on the belt 363. The rotary motor 361 rotates according to a set speed, number of revolutions and direction, which drives the belt 363 to rotate, thereby driving the guide seat 350 to slide at a uniform speed on the guide rail 340.

[0152] In this embodiment, the guide rail 340, the rotary motor 361, and the driven wheel 362 are all mounted on the side of the vertically arranged support plate 364, and the coating blade soaking assembly 370 is mounted on the other side of the support plate 364. The support plate 364 adopts a vertical structural design to save installation space and facilitate product miniaturization. By placing the power component 360 and the coating blade soaking assembly 370 on the two sides of the support plate 364 respectively, it is beneficial to distribute the force evenly on both sides of the support plate 364 and avoid the phenomenon of mutual interference between the power component 360 and the coating blade soaking assembly 370, resulting in a reasonable layout.

[0153] like Figure 16 As shown, the adhesive removal system 300 further includes:

[0154] The knife position sensor 365 is used to detect the cleaning position of the knife 110. When the knife 110 moves to the cleaning position, the knife position sensor 365 outputs the current cleaning position signal of the knife 110.

[0155] The fifth drive controller 366 controls the rotary motor 361 to drive the guide seat 350 to reciprocate along the guide rail 340 according to the current cleaning position signal of the coating blade 110 fed by the coating blade position sensor 365, so as to achieve the purpose of cleaning the coating part 111. In this embodiment, the fifth drive controller 366 stores the rotation number, speed and direction information of the rotary motor 361.

[0156] Furthermore, both the rinsing assembly 310 and the air blowing assembly 330 are electrically connected to the fifth drive controller 366. When the fifth drive controller 366 controls the power component 360 to drive the guide seat 350 to move back and forth, the fifth drive controller 366 starts the injection pump 312 and the control valve, thereby controlling the outlet 311 to spray diluent and the air blowing port 331 to blow nitrogen. The nitrogen blown by the air blowing port 331 is used to diffuse the diluent and also to evaporate the liquid remaining on the coating part 111 after the scraper 321 scrapes the glue. The system is highly intelligent.

[0157] like Figure 18 and Figure 19 As shown, the adhesive removal system 300 further includes a blade soaking assembly 370, which includes:

[0158] The solution tank 371 contains diluent and is located below the cleaning position of the applicator 110, preferably directly below it. In this embodiment, the bottom of the solution tank 371 is an inclined surface 3711 with one end higher than the other. A drain port 372 and a valve (not shown) for controlling the opening or closing of the drain port 372 are provided at the lower end of the inclined surface 3711. By setting the drain port 372 at the lowest end of the solution tank 371, the diluent and / or adhesive in the solution tank 371 can be completely drained.

[0159] The applicator 110 is moved vertically downward from the cleaning position to the soaking position so that the dispensing nozzle 112 is immersed in the solution in the solution tank 371, thus preventing the adhesive in the dispensing nozzle 112 from solidifying due to prolonged disuse of the applicator 110.

[0160] like Figure 16 As shown, the coating blade soaking assembly 370 further includes an overflow port 380 communicating with the solution tank 371. The overflow port 380 is used to maintain the liquid level of the diluent in the solution tank 371 at a set level. In this embodiment, an overflow pipe (not shown) is connected to the overflow port 380, and the overflow pipe discharges the diluent flowing out of the overflow port 380 to a set position (such as a waste liquid collector).

[0161] like Figure 18As shown, further, a guide portion 353 is provided in the length direction of the bottom of the guide seat 350, and guide grooves 373 for guiding the guide portion 353 are formed at both ends of the upper end of the solution tank 371 in the length direction. In this embodiment, the guide groove 373 is preferably a V-shaped guide groove. A guide inlet 374 is also formed at the upper end of the solution tank 371, located between the two guide grooves 373, for guiding the guide portion 353 horizontally and allowing the adhesive application portion 111 to pass vertically. The guide inlet 374 is correspondingly provided and connected to the guide groove 373.

[0162] Furthermore, connecting plates (375, 375') are respectively provided at both ends of the upper width direction of the solution tank 371. The two connecting plates (375, 375') are arranged in parallel, and a guide inlet 374 is formed at the interval between the two connecting plates (375, 375'). The two connecting plates (375, 375') are detachably connected to the upper end of the solution tank 371. In this embodiment, a threaded connection is preferred, which facilitates the disassembly and assembly of the two connecting plates (375, 375'). When the guide inlet 374 is worn and the guiding accuracy is not high, it is easy to replace the connecting plates (375, 375') in time, thereby improving the fitting accuracy between the guide part 353 and the guide inlet 374 and facilitating the smooth sliding of the guide part 353 in the guide inlet 374.

[0163] The adhesive application section 111 is inserted into the guide inlet 374 during immersion, and the adhesive outlet 112 is located in the cleaning solution in the solution tank 371.

[0164] In this embodiment, the adhesive removal system 300 also includes a slide rail seat 390 that is vertically slidably mounted on the guide rail 340, and the guide seat 350 is detachably fixed on the slide rail seat 390.

[0165] like Figure 17 As shown, preferably, the guide seat 350 is provided with two through holes (354, 354') parallel to the guide rail 340. Bolts (355, 355') that are directly or indirectly screwed into the two through holes (354, 354') are respectively threaded through them. The thread stalk 3551 of the two bolts (355, 355') is smaller than the inner diameter of the two through holes (354, 354'). The nuts 3552 of the two bolts (355 and 355') press and limit the guide seat 350 respectively. Since the screws 3551 of the two bolts (355 and 355') are smaller than the inner diameter of the two through holes (354 and 354'), the parallelism and fit between the scraper 321 installed on both sides of the guide seat 350 and the glue application part 111 can be finely adjusted before the two bolts (355 and 355') are tightened. At the same time, the installation difficulty is reduced and the installation efficiency is improved.

[0166] like Figure 16As shown, the power unit 360 further includes a first position sensor 367 for detecting the starting position of the slide rail 390 and a second position sensor 368 for detecting the ending position of the slide rail 390. Both the first position sensor 367 and the second position sensor 368 are electrically connected to the fifth drive controller 366. Since both scrapers (321, 321') are mounted on the slide rail 390 via guide seats 350, the starting position of the slide rail 390 is detected by the first position sensor 367 and the second position sensor 368. The starting and ending positions are determined by the first position sensor 367 or the second position sensor 368, which in turn determines the starting and ending positions of the two scrapers (321, 321'). When the fifth drive controller 366 receives a signal from the first position sensor 367 or the second position sensor 368 indicating that the slide rail 390 is currently at the starting or ending position, it controls the rotation direction of the rotary motor 361 to make the two scrapers (321, 321') mounted on the slide rail 390 reciprocate to scrape off the glue from the two glue-applying inclined surfaces (113, 113') of the glue-applying section 111 and the glue outlet 112.

[0167] In this embodiment, both the first position sensor 367 and the second position sensor 368 are mounted on the support plate 364.

[0168] like Figure 1 As shown, the coating blade 110 is positioned at the coating position and moves along the Y direction to coat the semiconductor substrate 10 with adhesive. When the coating blade 110 moves to the cleaning position, cleaning fluid and air can be sprayed onto the coating part 111 of the coating blade 110 and the diluted adhesive can be scraped off by two scrapers (321, 321'). The coating blade 110 moves down from the cleaning position to the immersion position to immerse the adhesive outlet 112 in the solution tank 371. The two fifth power units (193, 193') drive the coating blade 110 to move up and down along the Z direction to the cleaning position or the immersion position.

[0169] Preferably, the first drive controller, second drive controller, third drive controller, fourth drive controller and fifth drive controller in the coating equipment are a single drive controller.

[0170] Furthermore, the coating equipment consisting of the adhesive application system 100, the even application system 200, and the adhesive removal system 300 comprises two units, located along the length of the platform 120 (see [reference]). Figure 1 At both ends of the Y direction, adhesive of different thicknesses is applied to the platform 120.

[0171] Overview of coating methods as an example

[0172] The present invention also provides a coating method, applied to the coating equipment described above, comprising the following steps:

[0173] S1. Before applying the adhesive, the glue-spreading part rotates relative to the glue outlet to remove excess adhesive adhering to the glue outlet 112 of the applicator 110.

[0174] S2. During the application of adhesive, the adhesive outlet 112 of the applicator 110 moves parallel to the semiconductor substrate 10 to apply adhesive.

[0175] S3. After applying the adhesive, clean the adhesive residue adhering to the adhesive outlet 112 of the applicator 110.

[0176] Furthermore, prior to the step of the adhesive outlet 112 of the coating blade 110 moving parallel to the semiconductor substrate 10 to apply adhesive, the method further includes: moving upward from a first height position to a second height position to receive the semiconductor substrate 10 transferred by the robotic arm, and moving downward from the second height position to the first height position to place the received semiconductor substrate 10 on the platform 120.

[0177] Furthermore, the coating method further includes: adsorbing and fixing the semiconductor substrate 10 onto the platform 120 by vacuum negative pressure.

[0178] Preferably, the step of removing excess adhesive adhering to the dispensing port 112 includes: when the dispensing port 112 moves to the uniform adhesive position, the uniform adhesive part 210 rotates along its axis in its original position to adhere excess adhesive at the dispensing port 112 to the outer peripheral surface of the uniform adhesive part 210.

[0179] Furthermore, the coating method includes: when the uniform coating section 210 rotates, the scraper section 220 scrapes off the adhesive liquid adhering to the outer peripheral surface of the uniform coating section 210.

[0180] Furthermore, the step of cleaning the adhesive outside the dispensing port includes: the dispensing port 311 is moved horizontally relative to the length of the coating part 111 to spray diluent onto the coating part 111, and the scraper 321 is moved horizontally back and forth relative to the length of the coating part 111 to scrape off the diluted adhesive.

[0181] Furthermore, the step of cleaning the adhesive at the dispensing nozzle 112 also includes blowing air onto the adhesive coating section 111 during the process of spraying the thinner and scraping off the diluted adhesive.

[0182] The detailed coating method is already described in the coating equipment and will not be repeated here.

[0183] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A coating apparatus for applying adhesive to a semiconductor substrate, characterized in that, include: A coating system includes a coating blade that translates relative to a semiconductor substrate, the coating blade having a coating section and a slit-type adhesive outlet disposed on the coating section for coating adhesive onto the semiconductor substrate; A glue-spreading system has a glue-spreading section that rotates relative to the glue outlet. Before applying glue to the glue outlet, the glue-spreading section is configured to start rotating at a set speed, number of revolutions and direction when the glue outlet moves to a glue-spreading position above the glue-spreading section, so as to remove excess glue adhering to the glue outlet. The adhesive removal system, after applying adhesive at the dispensing port, moves along the length of the applicator to spray a cleaning solution containing diluted adhesive onto the outer peripheral surface of the adhesive application area and scrape off the diluted adhesive.

2. The coating equipment according to claim 1, characterized in that, The adhesive application system includes: The platform is used to mount a semiconductor substrate and has an adsorption region corresponding to the semiconductor substrate; A vacuum adsorption device is used to communicate with the adsorption area and is capable of generating a vacuum negative pressure to adsorb and fix the semiconductor substrate onto the platform.

3. The coating equipment according to claim 2, characterized in that, The adhesive application system also includes: The lifting device has a pin assembly that slides through the platform. The pin assembly rises from a first height position to a second height position to receive a semiconductor substrate transferred by a robotic arm. The lifting assembly descends from the second height position to the first height position to place the received semiconductor substrate onto the platform.

4. The coating equipment according to claim 1, characterized in that, The spin coating system also includes: The scraper is configured to slide against the outer peripheral surface of the glue-spreading part. When the glue-spreading part rotates, the scraper removes the glue adhering to the outer peripheral surface of the glue-spreading part, so that the glue-spreading distance between the glue-spreading part and the glue outlet is always kept within a set threshold.

5. The coating equipment according to claim 1, characterized in that, The adhesive removal system includes: The rinsing assembly has an outlet for spraying a diluent onto the coating section, the outlet being capable of translational relative to the length direction of the coating section; The adhesive scraper assembly is configured to reciprocate relative to the length direction of the adhesive application section and has a scraper that cooperates with the adhesive application section. The scraper slides against the adhesive application section and is used to scrape off the diluted adhesive during the translation process.

6. The coating equipment according to claim 5, characterized in that, The adhesive removal system also includes: The blowing assembly has an air inlet for blowing air toward the coating section. The air blown out of the air inlet is used both to diffuse the diluent and to evaporate the liquid remaining on the coating section after the adhesive is scraped off by the scraper. The air inlet moves synchronously with the liquid outlet.

7. A coating method, applied in the coating apparatus according to any one of claims 1 to 6, characterized in that, Includes the following steps: Before applying the adhesive, the glue-spreading section rotates relative to the glue outlet to remove excess adhesive adhering to the glue outlet of the applicator. During the coating process, the nozzle of the coating blade moves parallel to the semiconductor substrate to apply the adhesive. After applying the adhesive, clean the adhesive residue adhering to the nozzle of the applicator.

8. The coating method according to claim 7, characterized in that, Before the adhesive outlet of the coating blade moves parallel to the semiconductor substrate to apply adhesive, it further includes: moving upward from a first height position to a second height position to receive the semiconductor substrate transferred by the robotic arm, and moving downward from the second height position to the first height position to place the received semiconductor substrate on the platform.

9. The coating method according to claim 8, characterized in that, The semiconductor substrate is adsorbed and fixed onto the platform by vacuum negative pressure.

10. The coating method according to claim 7, characterized in that, The step of rotating the glue-spreading section relative to the glue outlet to remove excess glue adhering to the glue outlet includes: when the glue outlet moves to the glue-spreading position, the glue-spreading section rotates along its axis at its original position according to a set rotation speed, number of revolutions and direction, in order to adhere excess glue at the glue outlet to the outer peripheral surface of the glue-spreading section.

11. The coating method according to claim 10, characterized in that, When the glue-spreading section rotates along its axis, the glue-scraping section is used to scrape off the glue adhering to the outer peripheral surface of the glue-spreading section.

12. The coating method according to claim 7, characterized in that, The step of cleaning the adhesive at the outlet includes: the outlet is moved horizontally relative to the length of the coating part to spray a thinner onto the coating part; The scraper moves back and forth along the length of the adhesive application area to scrape off the diluted adhesive.

13. The coating method according to claim 12, characterized in that, The step of cleaning the adhesive at the dispensing nozzle further includes blowing air onto the diluent on the coating part during the process of spraying the diluent and scraping off the diluted adhesive.

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