Multifunctional spin coating system, method and device
The multifunctional spin coating system automatically identifies the properties of the substrate material and generates spin coating parameters, realizing the automation and accuracy of various spin coating methods. This solves the problem of low spin coating efficiency in existing spin coating methods and improves the quality and precision of spin coating.
Patent Information
- Application Number
- CN202510945710.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-09
- Publication Date
- 2025-11-18
AI Technical Summary
Existing spin coating methods can only select a single spin coating mode, which leads to reduced spin coating efficiency when changing substrate materials and makes it difficult to achieve multifunctional thin film spin coating.
A multi-functional spin coating system is adopted, including a spin coating parameter setting unit, a spin coating control unit, and a multi-functional spin coating unit. By identifying the characteristics of the substrate material, the system generates target spin coating process parameters, performs command conversion and spin coating processing, and realizes automation and precision of various spin coating methods.
It improves the flexibility and convenience of the spin coating process, ensures the accuracy and stability of the spin coating process, enhances the quality and precision of multifunctional spin coating, and increases the efficiency of changing between different spin coating methods.
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Figure CN120961379A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of automatic spin coating, in particular to a multifunctional spin coating system, method and device. BACKGROUND
[0002] At present, the common spin coating control method is to manually operate the spin coating machine so that the spin coating machine can spin coat the substrate material. However, this method can only select a single spin coating mode for thin film spin coating, which greatly reduces the spin coating efficiency when the substrate material is replaced. Therefore, how to realize thin film spin coating with multiple functions has become a technical problem to be solved. SUMMARY
[0003] The main purpose of the embodiments of the present application is to provide a multifunctional spin coating system, method and device, which aims to realize thin film spin coating with multiple functions.
[0004] To achieve the above-mentioned purpose, the first aspect of the embodiments of the present application provides a multifunctional spin coating system, comprising:
[0005] a spin coating parameter setting unit; wherein the spin coating parameter setting unit is used to set target spin coating process parameters;
[0006] a spin coating control unit; wherein the spin coating control unit is in communication connection with the spin coating parameter setting unit, the spin coating control unit is used to receive the target spin coating process parameters, and generate thin film spin coating instructions according to the target spin coating process parameters.
[0007] a multifunctional spin coating unit; wherein the multifunctional spin coating unit is in communication connection with the spin coating control unit, the multifunctional spin coating unit is used to receive the thin film spin coating instructions, and spin coat the substrate material according to the thin film spin coating instructions.
[0008] In some embodiments, the spin coating parameter setting unit comprises a substrate material analysis component and a material characteristic parameter matching component, the substrate material analysis component is used to analyze the material characteristic data of the substrate material, and the material characteristic parameter matching component is used to generate target spin coating process parameters matched with the material characteristic data.
[0009] In some embodiments, the material characteristic parameter matching component comprises a material characteristic matching item and a spin coating process parameter matching item, and the material characteristic matching item and the spin coating process parameter matching item establish a mapping relationship.
[0010] In some embodiments, the multi-functional spin coating unit comprises a spin coating parameter adjustment component, a spin coating device main body component, and a spin coating data monitoring component, the spin coating parameter adjustment component is configured to receive the thin film spin coating instruction and adjust the component parameter of the spin coating device main body component, the spin coating device main body component is configured to place the substrate material, and the spin coating data monitoring component is configured to monitor the spin coating device main body component in real time.
[0011] In some embodiments, the spin coating device main body component comprises a spin coating table and a sample holder, the sample holder is configured to fix the substrate material on the spin coating table.
[0012] In some embodiments, the spin coating device main body component further comprises a spin coating speed controller, an air flow controller, and a temperature controller, the spin coating speed controller is configured to adjust the spin coating speed of the spin coating device main body component, the air flow controller is configured to adjust the air flow flow rate, air flow pressure, and air flow speed of the spin coating device main body component, and the temperature controller is configured to adjust the environmental temperature of the spin coating device main body component.
[0013] To achieve the above object, a second aspect of the embodiments of the present application proposes a multi-functional spin coating method applied to a multi-functional spin coating system, the method comprises:
[0014] generating target spin coating process parameters based on a spin coating parameter setting unit and a substrate material;
[0015] performing instruction conversion on the spin coating process parameters based on a spin coating control unit to obtain a thin film spin coating instruction;
[0016] performing spin coating treatment on the substrate material based on a multi-functional spin coating unit and the thin film spin coating instruction.
[0017] In some embodiments, the generating target spin coating process parameters based on a spin coating parameter setting unit and a substrate material comprises:
[0018] performing characteristic analysis on the substrate material based on a substrate material analysis component to obtain material characteristic data;
[0019] performing matching item selection on material characteristic matching items and spin coating process parameter matching items based on a material characteristic parameter matching component and the material characteristic data to obtain the spin coating process parameters.
[0020] In some embodiments, the performing spin coating treatment on the substrate material based on a multi-functional spin coating unit and the thin film spin coating instruction comprises:
[0021] performing instruction analysis on the thin film spin coating instruction based on a parameter adjustment component to obtain target spin coating parameters;
[0022] Adjusting component parameters of a spin coating equipment main component based on the parameter adjusting component and the target spin coating parameter to obtain actual spin coating parameters.
[0023] Performing thin film spin coating on the substrate material based on the spin coating equipment main component and the actual spin coating parameters to obtain a target thin film.
[0024] To achieve the above-mentioned purpose, the third aspect of the embodiment of the present application provides a multifunctional spin coating device, which comprises:
[0025] A parameter generating module configured to generate target spin coating process parameters based on a spin coating parameter setting unit and a substrate material;
[0026] An instruction generating module configured to convert the target spin coating process parameters into thin film spin coating instructions based on a spin coating control unit;
[0027] A remote spin coating module configured to perform spin coating treatment on the substrate material based on a multifunctional spin coating unit and the thin film spin coating instructions.
[0028] The multifunctional spin coating system, method and device provided by the present application generate target spin coating process parameters suitable for substrate materials through a spin coating parameter setting unit, which provides accurate basic data for multifunctional spin coating and ensures the controllability of the spin coating process. Further, the target spin coating process parameters are converted into thin film spin coating instructions through a spin coating control unit, which realizes intelligent operation of the spin coating equipment and greatly improves the flexibility and convenience of multifunctional spin coating. Finally, the substrate material is spin coated according to the thin film spin coating instructions using a multifunctional spin coating unit, which realizes the conversion of the thin film spin coating instructions into actual spin coating actions and ensures the accuracy and stability of the multifunctional spin coating process, thereby improving the intelligent level of multifunctional spin coating, the quality and precision of multifunctional spin coating, and the replacement efficiency between different spin coating modes. BRIEF DESCRIPTION OF DRAWINGS
[0029] Figure 1 is a system architecture diagram of the multifunctional spin coating system provided by the embodiment of the present application;
[0030] Figure 2 is a unit architecture diagram of the spin coating parameter setting unit provided by the embodiment of the present application;
[0031] Figure 3 is a unit architecture diagram of the multifunctional spin coating unit provided by the embodiment of the present application;
[0032] Figure 4 is a component architecture diagram of the spin coating equipment main component provided by the embodiment of the present application;
[0033] Figure 5is a flow chart of the multifunctional spin coating method provided by the embodiment of the present application;
[0034] Figure 6 is Figure 5 is a flow chart of step S501 in
[0035] Figure 7 is Figure 5 is a flow chart of step S503 in
[0036] Figure 8 is a structural schematic diagram of the multifunctional spin coating device provided by the embodiment of the present application. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.
[0038] It should be noted that although the functional modules are divided in the device schematic diagram, and the logical order is shown in the flow chart, in some cases, the steps shown or described can be executed in a manner different from the module division in the device or the order in the flow chart. The terms "first", "second", etc. in the specification and claims and the above-described drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.
[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used herein are only for the purpose of describing the embodiments of the present application, and are not intended to limit the present application.
[0040] First, the several terms involved in the present application are analyzed:
[0041] Spin coating parameter setting unit: the spin coating parameter setting unit is a key component of the multifunctional spin coating system, and is responsible for generating accurate spin coating process parameters according to the characteristics of the substrate material and the requirements of the spin coating process. Through the combination of software algorithm and hardware sensor, the unit analyzes the physical and chemical properties of the substrate material, such as surface flatness, temperature, humidity, etc., and calculates the most suitable spin coating speed and time parameters according to these data. The generated spin coating speed and time parameters are then transmitted to the spin coating control unit for instruction conversion, ensuring the accuracy and consistency of the spin coating process, thereby improving the quality and efficiency of thin film preparation.
[0042] The spin coating control unit is a core component of the multifunctional spin coating system, and is responsible for connecting the operator and the spin coating equipment. The spin coating control unit is composed of a wireless communication module, a user interface and an instruction converter, can receive data from the spin coating parameter setting unit, and convert the data into instructions recognizable by the equipment. The operator can remotely monitor and adjust the spin coating process through the spin coating control unit, greatly improving the operation flexibility and convenience.
[0043] The multifunctional spin coating unit is a core component of the multifunctional spin coating system, and is mainly used for spin coating operation on the substrate material. The multifunctional spin coating unit has multifunctional characteristics and can adapt to the requirements of different substrate materials and spin coating processes.
[0044] Before, the common spin coating control method is manual operation of the spin coating machine, so that the spin coating machine can spin coat the substrate material, but this method can only choose a single spin coating method for thin film spin coating, which greatly reduces the efficiency of spin coating when changing the substrate material. Therefore, how to realize the thin film spin coating with multiple functions has become a technical problem to be solved.
[0045] Based on this, the embodiment of the application provides a multifunctional spin coating system, method and device, which aims to realize thin film spin coating with multiple functions.
[0046] The multifunctional spin coating system, method and device provided by the embodiment of the application are specifically described through the following embodiments. First, the multifunctional spin coating system in the embodiment of the application is described.
[0047] The embodiment of the application can acquire and process related data based on artificial intelligence technology. Among them, artificial intelligence (Artificial Intelligence, AI) is to use digital computers or digital computer controlled machines to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results. Theory, method, technology and application system.
[0048] The basic technology of artificial intelligence generally includes technologies such as sensors, special artificial intelligence chips, cloud computing, distributed storage, big data processing technology, operation / interaction system, mechatronics, etc. The software technology of artificial intelligence mainly includes computer vision technology, robot technology, biometric technology, speech processing technology, natural language processing technology, and machine learning / deep learning, etc. Several major directions.
[0049] The multifunctional spin coating method provided in the embodiments of the present application relates to the field of automatic spin coating. The multifunctional spin coating method provided in the embodiments of the present application can be applied to a terminal, can be applied to a server end, and can also be software running in a terminal or a server end. In some embodiments, the terminal can be a smart phone, a tablet computer, a notebook computer, a desktop computer, etc.; the server end can be configured as a stand-alone physical server, can be configured as a server cluster or a distributed system composed of multiple physical servers, can also be configured as a cloud server providing basic cloud computing services such as cloud service, cloud database, cloud computing, cloud function, cloud storage, network service, cloud communication, middleware service, domain name service, security service, CDN, and big data and artificial intelligence platform; and the software can be an application for implementing the multifunctional spin coating method, etc., but is not limited to the above forms.
[0050] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as a program module. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in a distributed computing environment in which tasks are performed by remote processing devices connected by a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media, including storage devices.
[0051] As shown in Figure 1 The multifunctional spin coating system provided in the embodiments of the present application includes a spin coating parameter setting unit 100, a spin coating control unit 200, and a multifunctional spin coating unit 300. The spin coating parameter setting unit 100 is used to set target spin coating process parameters. The spin coating control unit 200 is in communication connection with the spin coating parameter setting unit 100. The spin coating control unit 200 is used to receive the target spin coating process parameters and generate a thin film spin coating instruction according to the target spin coating process parameters. The multifunctional spin coating unit 300 is in communication connection with the spin coating control unit 200. The multifunctional spin coating unit 300 is used to receive the thin film spin coating instruction and spin a substrate material according to the thin film spin coating instruction.
[0052] It should be noted that the target spin coating process parameters can be parameters for controlling the multifunctional spin coating unit 300 to perform spin coating, such as rotation speed, spin coating time, air flow intensity, coating layer number, and spin coating device number, and the like. It should also be noted that by adjusting the spin coating process parameters such as the spin coating device number and the coating layer number, the multifunctional spin coating unit 300 can support multiple LBL (Layer-by-Layer, Layer-by-Layer) methods for spin coating.
[0053] As shown in Figure 2 The spin coating parameter setting unit 100 includes a substrate material analysis component 110 and a material characteristic parameter matching component 120. The substrate material analysis component 110 is used to analyze the material characteristic data of the substrate material, and the material characteristic parameter matching component 120 is used to generate spin coating process parameters matched with the material characteristic data.
[0054] The material characteristic parameter matching component 120 includes a material characteristic matching item and a spin coating process parameter matching item, and the material characteristic matching item and the spin coating process parameter matching item establish a mapping relationship.
[0055] In detail, the substrate material analysis component 110 can determine the material characteristic data of the substrate material by identifying the type and material of the substrate material, and then input the material characteristic data into the material characteristic parameter matching component 120. The material characteristic parameter matching component 120 finds the matching item that is the same as the material characteristic data of the substrate material from the material characteristic matching item, and obtains the target material characteristic matching item. Further, according to the mapping relationship between the material characteristic matching item and the spin coating process parameter matching item, the target spin coating process parameter matching item that has a mapping relationship with the target material characteristic matching item is found from the spin coating process parameter matching item. Finally, the spin coating process parameters in the target spin coating process parameter matching item are taken as the target spin coating process parameters of the substrate material.
[0056] Referring to Figure 3 The multifunctional spin coating unit 300 includes a spin coating parameter adjustment component 310, a spin coating device main component 320, and a spin coating data monitoring component 330. The spin coating parameter adjustment component 310 is used to adjust the component parameters of the spin coating device main component 320. The spin coating device main component 320 is used to place the substrate material. The spin coating data monitoring component 330 is used to monitor the spin coating device main component 320 in real time.
[0057] Further, the spin coating device main component 320 includes a spin coating table and a sample holder, and the sample holder is used to fix the substrate material on the spin coating table.
[0058] In detail, after receiving the thin film spin coating command, the spin coating parameter adjustment component 310 can obtain the parameter information to be adjusted by the main component 320 of the spin coating equipment by parsing the thin film spin coating command. Furthermore, according to the parameter information to be adjusted, the component parameters in the main component 320 of the spin coating equipment are adjusted so that the main component 320 of the spin coating equipment can spin coat the substrate material according to the specified spin coating method.
[0059] Furthermore, referring to Figure 4 As shown, the main component 320 of the spin coating equipment also includes a spin coating speed controller 321, an airflow controller 322, and a temperature controller 323. The spin coating speed controller 321 is used to adjust the spin coating speed of the main component 320 of the spin coating equipment. The airflow controller 322 is used to adjust the airflow rate, airflow pressure, and gas velocity of the main component 320 of the spin coating equipment. The temperature controller 323 is used to adjust the ambient temperature of the main component 320 of the spin coating equipment.
[0060] It should be noted that the specific parameter values of the spin coating speed controller 321, airflow controller 322, and temperature controller 323 need to be determined based on the parameter information to be adjusted obtained by the spin coating parameter adjustment component 310 from parsing the thin film spin coating command.
[0061] Figure 5 This is a flowchart of a multifunctional spin coating method provided in an embodiment of this application. This method can be applied to the aforementioned multifunctional spin coating system. Figure 5 The method may include, but is not limited to, steps S501 to S503.
[0062] Step S501: Based on the spin coating parameter setting unit and the substrate material, generate the target spin coating process parameters;
[0063] Step S502: Based on the spin coating control unit, the spin coating process parameters are converted into instructions to obtain the thin film spin coating instruction;
[0064] Step S503: Based on the multi-functional spin coating unit and thin film spin coating command, spin coating is performed on the substrate material.
[0065] In an application scenario, taking the preparation of a thin film layer of a photoconductive tube device as an example, the spin coating parameter setting unit can set corresponding target spin coating process parameters according to the material properties of the photoconductive tube device, including key parameters such as rotation speed, spin coating time, air flow intensity, number of coating layers, and number of spin coating devices. Further, the target spin coating process parameters are sent to the spin coating control unit. After receiving the target spin coating process parameters, the spin coating control unit converts the target spin coating process parameters into specific thin film spin coating instructions, for example, converts the spin coating speed parameter into a rotation speed signal, converts the spin coating time parameter into a timing control signal, and the like. Further, the spin coating control unit sends the generated thin film spin coating instructions to the multifunctional spin coating unit. After receiving the spin coating, the multifunctional spin coating unit performs spin coating processing on the photoconductive tube device placed in the multifunctional spin coating unit, and a PbS colloidal quantum dot film can be obtained.
[0066] In step S501 of some embodiments, the spin coating parameter setting unit identifies the material properties of the substrate material, and sets corresponding rotation speed, spin coating time, air flow intensity, number of coating layers, and number of spin coating devices, i.e., target spin coating process parameters, according to the identified material properties.
[0067] In detail, please refer to Figure 6 In some embodiments, step S501 can include but is not limited to steps S601 to S602:
[0068] In step S601, the substrate material is analyzed based on the substrate material analysis component to obtain material property data.
[0069] In step S602, the material property matching item and the spin coating process parameter matching item are selected based on the material property parameter matching component and the material property data, to obtain the spin coating process parameter.
[0070] In step S601 of some embodiments, the substrate material analysis component analyzes the physical structure of the substrate material to obtain the material physical structure, analyzes the chemical properties of the substrate material to obtain the material chemical properties, and further combines the material physical structure and the material chemical properties to obtain the material property data.
[0071] In step S602 of some embodiments, after receiving the material characteristic data, the material characteristic parameter matching component can find a matching item from the material characteristic matching items that is the same as the material characteristic data of the base material, can obtain a target material characteristic matching item, further, according to the mapping relationship between the material characteristic matching item and the spin coating process parameter matching item, obtain a target spin coating process parameter matching item that has a mapping relationship with the target material characteristic matching item from the spin coating process parameter matching items, and finally, take the spin coating process parameter in the target spin coating process parameter matching item as the target spin coating process parameter of the base material.
[0072] The steps S601 to S602 shown in the embodiments of the present application, according to the characteristic analysis of the base material by the base material analysis component, obtain the material characteristic data, which provides accurate basis for the selection of the spin coating process parameters, ensures the pertinence and adaptability of the spin coating process, further, based on the material characteristic parameter matching component, the material characteristic matching item and the spin coating process parameter matching item are selected, which can accurately determine the most suitable spin coating process parameter according to the unique characteristics of each base material, and improves the accuracy and stability of the spin coating process.
[0073] In step S502 of some embodiments, after receiving the target spin coating process parameter, the spin coating control unit analyzes and verifies the target spin coating process parameter to ensure the accuracy of the target spin coating process parameter, and further, according to the preset communication protocol and instruction format, converts the target spin coating process parameter into a thin film spin coating instruction that can be recognized and executed by the multifunctional spin coating unit.
[0074] In step S503 of some embodiments, after receiving the thin film spin coating instruction, the multifunctional spin coating unit analyzes the thin film spin coating instruction to extract the rotation speed, spin coating time, air flow intensity, number of coating layers, and number of spin coating devices, and other key parameters from the thin film spin coating instruction, and further, according to the extracted rotation speed, spin coating time, air flow intensity, number of coating layers, and number of spin coating devices, and other key parameters, drives the spin coating device main component to perform spin coating processing on the base material.
[0075] In detail, please refer to Figure 7 In some embodiments, step S503 can include but is not limited to steps S701 to S703:
[0076] Step S701, based on the parameter adjustment component, analyzes the thin film spin coating instruction to obtain a target spin coating parameter;
[0077] Step S702, based on the parameter adjustment component and the target spin coating parameter, adjusts the component parameters of the spin coating device main component to obtain actual spin coating parameters;
[0078] In step S703, the substrate material is subjected to thin film spin coating based on the spin coating device main assembly and the actual spin coating parameters, to obtain a target thin film.
[0079] In step S701 of some embodiments, the parameter adjustment assembly performs syntax analysis and semantic parsing on the thin film spin coating instructions according to the predefined format specification, identifies the spin coating process parameter region in the thin film spin coating instructions, and further extracts specific target spin coating parameters from the spin coating process parameter region, such as a spin coating speed of 500 rpm and a spin coating time of 30 seconds.
[0080] In step S702 of some embodiments, the parameter adjustment assembly sends the target spin coating parameters to the spin coating device main assembly, and each execution module in the spin coating device main assembly can adjust its component parameters according to the target spin coating parameters to obtain actual spin coating parameters. For example, the spin coating speed execution module in the spin coating device main assembly adjusts its rotation speed according to the target spin coating speed parameter, to ensure that the spin coating speed execution module rotates at an accurate speed.
[0081] In step S703 of some embodiments, the spin coating device main assembly can spin coat the substrate material placed in the spin coating device main assembly according to the actual spin coating parameters. Specifically, the spin coating device main assembly can complete the thin film spin coating of the substrate material by spraying spin coating liquid on the substrate material, to obtain a target thin film.
[0082] The steps S701 to S703 shown in the embodiments of the present application can accurately extract target spin coating parameters by performing instruction analysis on the thin film spin coating instructions by the parameter adjustment assembly, provide accurate guidance for parameter adjustment of the spin coating device main assembly, ensure the accuracy of the parameters in the spin coating process, further adjust the component parameters of the spin coating device main assembly using the parameter adjustment assembly and the target spin coating parameters, realize spin coating automation and parameter accuracy configuration of the spin coating device main assembly, improve the operation efficiency and stability of the spin coating device main assembly, reduce errors caused by manual intervention, finally, perform thin film spin coating on the substrate material based on the adjusted spin coating device main assembly and the actual spin coating parameters, to improve the quality and precision of the target thin film, so that the spin coating device main assembly can meet the requirements of different materials and processes, and improve the multifunctionality of the spin coating device main assembly.
[0083] The steps S601 to S603 shown in the embodiment of the present application generate target spin coating process parameters suitable for the substrate material through the spin coating parameter setting unit, provide accurate basic data for multifunctional spin coating, ensure the controllability of the spin coating process, further, the target spin coating process parameters are converted into film spin coating instructions through the spin coating control unit, intelligent operation of the spin coating equipment is realized, the flexibility and convenience of multifunctional spin coating are greatly improved, finally, the multifunctional spin coating unit is used to spin coating treatment on the substrate material according to the film spin coating instructions, the film spin coating instructions are converted into actual spin coating actions, the accuracy and stability of the multifunctional spin coating process are ensured, thereby the intelligent degree of multifunctional spin coating is improved, the quality and precision of multifunctional spin coating are improved, and the replacement efficiency between different spin coating modes is also improved.
[0084] Please refer to Figure 8 The embodiment of the present application also provides a multifunctional spin coating device, which can realize the multifunctional spin coating method described above, and the device comprises:
[0085] The parameter generation module 801 is configured to generate target spin coating process parameters based on the spin coating parameter setting unit and the substrate material;
[0086] The instruction generation module 802 is configured to convert the target spin coating process parameters into spin coating instructions based on the spin coating control unit.
[0087] The remote spin coating module 803 is configured to perform spin coating treatment on the substrate material based on the multifunctional spin coating unit and the spin coating instructions. The specific embodiments of the multifunctional spin coating device are basically the same as those of the multifunctional spin coating method described above, and will not be repeated here.
[0088] The embodiments described in the embodiments of the present application are for more clearly illustrating the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.
[0089] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and can include more or fewer steps than those shown in the figures, or combine certain steps or different steps.
[0090] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separated, i.e., can be located in one place or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiments of the present application.
[0091] Those skilled in the art can understand that all or some of the steps in the method disclosed above, the function modules / units in the system and the device can be implemented as software, firmware, hardware or appropriate combination thereof.
[0092] The terms "first", "second", "third", "fourth" and the like in the description of the application and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the use of these terms herein is to be construed to cover a general order and / or structure unless otherwise indicated. Furthermore, the terms "comprise", "comprising", "has", "having", "includes", "including", "contain", "containing" or any other similar forms are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises, has, includes, contains items or components does not include items or components not explicitly recited. The terms "a" or "an", as used herein in the detailed description and in the claims, mean "one or more" or "at least one", unless otherwise indicated.
[0093] It should be understood that, in the present application, "at least one" means one or more, and "multiple" means two or more. "And / or" is used to describe the relationship between associated objects, which means that there can be three relationships, for example, "A and / or B" can represent three cases: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be singular or plural.
[0094] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the above units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. The coupling or direct coupling or communication connection between the displayed or discussed objects can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.
[0095] The units described as separate components above can or can not be physically separate, and the components shown as units can or can not be physical units, that is, can be located in one place, or can be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.
[0096] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present alone, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.
[0097] If the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, including a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method of each embodiment of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program storage media.
[0098] The preferred embodiments of the embodiments of the present application are described above with reference to the accompanying drawings, and are not limited to the scope of the embodiments of the present application. Any modifications, equivalent replacements and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present application shall be within the scope of the embodiments of the present application.
Claims
1. A multifunctional spin coating system, characterized in that, include: A spin coating parameter setting unit; wherein, the spin coating parameter setting unit is used to set the target spin coating process parameters; A spin coating control unit; wherein the spin coating control unit establishes a communication connection with the spin coating parameter setting unit, and the spin coating control unit is used to receive the target spin coating process parameters and generate a thin film spin coating command according to the target spin coating process parameters. A multifunctional spin coating unit; wherein the multifunctional spin coating unit establishes a communication connection with the spin coating control unit, and the multifunctional spin coating unit is used to receive the thin film spin coating command and spin coat the substrate material according to the thin film spin coating command.
2. The multifunctional spin coating system according to claim 1, characterized in that, The spin coating parameter setting unit includes a substrate material analysis component and a material property parameter matching component. The substrate material analysis component is used to analyze the material property data of the substrate material, and the material property parameter matching component is used to generate target spin coating process parameters that match the material property data.
3. The multifunctional spin coating system according to claim 2, characterized in that, The material property parameter matching component includes material property matching items and spin coating process parameter matching items, and a mapping relationship is established between the material property matching items and the spin coating process parameter matching items.
4. The multifunctional spin coating system according to claim 1, characterized in that, The multifunctional spin coating unit includes a spin coating parameter adjustment component, a spin coating equipment main body component, and a spin coating data monitoring component. The spin coating parameter adjustment component is used to receive the thin film spin coating command and adjust the component parameters of the spin coating equipment main body component. The spin coating equipment main body component is used to place the substrate material. The spin coating data monitoring component is used to monitor the spin coating equipment main body component in real time.
5. The multifunctional spin coating system according to claim 4, characterized in that, The main components of the spin coating equipment include a spin coating stage and a sample holder, wherein the sample holder is used to fix the substrate material on the spin coating stage.
6. The multifunctional spin coating system according to claim 4, characterized in that, The main component of the spin coating equipment also includes a spin coating speed controller, an airflow controller, and a temperature controller. The spin coating speed controller is used to adjust the spin coating speed of the main component of the spin coating equipment. The airflow controller is used to adjust the airflow rate, airflow pressure, and gas velocity of the main component of the spin coating equipment. The temperature controller is used to adjust the ambient temperature of the main component of the spin coating equipment.
7. A multifunctional spin coating method, characterized in that, Applied to the multifunctional spin coating system as described in claims 1 to 6, the method comprises: Based on the spin coating parameter setting unit and the substrate material, the target spin coating process parameters are generated. Based on the spin coating control unit, the spin coating process parameters are converted into instructions to obtain thin film spin coating instructions; The substrate material is spin-coated based on the multifunctional spin-coating unit and the thin film spin-coating command.
8. The multifunctional spin coating method according to claim 7, characterized in that, The generation of target spin coating process parameters based on the spin coating parameter setting unit and the substrate material includes: Based on the substrate material analysis component, the properties of the substrate material are analyzed to obtain material property data; Based on the material property parameter matching component and the material property data, the matching items for material property matching and spin coating process parameter matching are selected to obtain the spin coating process parameters.
9. The multifunctional spin coating method according to claim 7, characterized in that, The spin coating process for the substrate material based on the multifunctional spin coating unit and the thin film spin coating command includes: Based on the parameter adjustment component, the thin film spin coating command is parsed to obtain the target spin coating parameters; Based on the parameter adjustment component and the target spin coating parameters, the component parameters of the main component of the spin coating equipment are adjusted to obtain the actual spin coating parameters. Based on the main components of the spin coating equipment and the actual spin coating parameters, the substrate material is spin-coated to obtain the target film.
10. A multifunctional spin coating device, characterized in that, The device includes: Parameter generation module: used to generate target spin coating process parameters based on the spin coating parameter setting unit and the substrate material; Instruction generation module: used to convert the spin coating process parameters based on the spin coating control unit to obtain thin film spin coating instructions; Remote spin coating module: used to spin coat the substrate material based on the multifunctional spin coating unit and the thin film spin coating command.