Synergistic heat treatment device and method for waste circuit board product and copper-containing sludge

Abstract

The invention discloses a waste circuit board product and copper-containing sludge synergistic heat treatment device and method, and relates to the technical field of solid waste treatment. The device comprises a mounting frame, a first motor arranged on the mounting frame, a rotating rod connected with the first motor, a first connecting rod and a second connecting rod which are arranged on the rotating rod, a lower conveying frame connected with the first connecting rod, an upper conveying frame connected with the second connecting rod, a feeding opening formed in the mounting frame and a discharging platform. A material pushing assembly and an adjusting assembly; according to the device, small waste circuit board fragments can be automatically screened and conveyed to a reactor, and meanwhile the discharging speed of the waste circuit board fragments can be adjusted in cooperation with the conveying efficiency of sludge; according to the synergistic heat treatment method, the two kinds of waste are treated in a combined mode, synergistic treatment of the waste circuit board separation product and the copper-containing sludge and efficient recovery of copper are achieved, and high-added-value utilization of the solid waste is achieved while the environmental burden is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solid waste treatment, and particularly relates to a device and method for synergistically thermal treatment of waste printed circuit board products and copper-containing sludge. BACKGROUND

[0002] Currently, the recycling and treatment of electronic waste and sludge faces many challenges. The waste printed circuit board light board sorting product is a typical difficult-to-treat part of electronic waste, which is mainly composed of glass fiber and epoxy resin, and also contains high-value metals such as gold, silver, palladium and copper, with a content of about 10%. Traditional recycling methods such as incineration and chemical treatment can extract part of the metal, but due to incomplete combustion and waste gas pollution, they often cause environmental burden, and the copper recovery rate is low. The heavy metal copper in high-moisture copper-containing sludge has high recycling value. Due to the huge output of sludge, pyroprocessing is the most effective way to achieve harmlessness, reduction and resource utilization of this type of sludge. However, at present, when copper-containing sludge is treated by pyroprocessing, only reduction or harmlessness treatment can be carried out, and high-value metals such as copper cannot be recovered, or the copper content in the slag is too high, resulting in a low copper recovery rate, making it difficult to achieve efficient recycling of copper, and also causing environmental pollution and resource waste.

[0003] In the prior art, there is a lack of a technical method for synergistically treating waste printed circuit board sorting products and high-moisture copper-containing sludge to improve resource recycling efficiency and reduce environmental pollution. For automated production, the prior art can easily complete the conveying of dried sludge, but the waste printed circuit board broken product lacks an effective processing means for screening and processing the fragments, while controlling the transmission efficiency of the fragments. SUMMARY

[0004] In view of the above problems of the prior art waste printed circuit board product and copper-containing sludge synergistically thermal treatment device and method, the present application is proposed.

[0005] Therefore, the present application aims to provide a waste printed circuit board product and copper-containing sludge synergistically thermal treatment device and method, which realizes the synergistic treatment of waste printed circuit board sorting products and copper-containing sludge and the efficient recovery of copper.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a co-processing device for waste circuit board products and copper-containing sludge, comprising: a conveying assembly, including a mounting frame, a first motor mounted on the mounting frame, a rotating rod connected to the first motor, a first connecting rod and a second connecting rod mounted on the rotating rod, a lower conveying frame connected to the first connecting rod, an upper conveying frame connected to the second connecting rod, an inlet and a discharge platform mounted on the mounting frame; a pushing assembly, mounted on the mounting frame, including a fixed frame, a second motor mounted on the fixed frame, a drive rod connected to the second motor, a transmission rod connected to the drive rod, a push rod connected to the transmission rod, and a push block connected to the push rod; and an adjusting assembly, mounted on the fixed frame, including a handle, a first bevel gear mounted on the handle, a second bevel gear meshing with the first bevel gear, a threaded rod fixed to the second bevel gear, a support rod mounted on the threaded rod, an arcuate groove mounted on the fixed frame, a slider mounted in the arcuate groove, a positioning rod rotatably mounted on the slider, and an adjusting rod rotatably connected to the positioning rod.

[0007] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the following features: a first motor is fixedly installed at the bottom of the mounting frame; the output shaft of the first motor is fixedly connected to a rotating rod; two connecting rods are provided on the rotating rod, symmetrically arranged along the central axis of the rotating rod; one end of the first connecting rod is rotatably connected to one connecting rod, and the other end is rotatably connected to the lower conveyor frame; one end of the second connecting rod is rotatably connected to the other connecting rod, and the other end is rotatably connected to the upper conveyor frame.

[0008] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the inner wall of the mounting frame is symmetrically provided with slide rails, the upper conveyor frame is slidably disposed in the slide rails, the upper conveyor frame includes two upper side plates and an upper partition plate disposed between the upper side plates, the upper side plates are slidably disposed in the slide rails, three upper partition plates are provided and fixedly disposed on the upper side plates, the upper partition plates are spaced at a fixed distance apart, and the height of the upper partition plates decreases layer by layer.

[0009] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the lower conveyor frame includes a lower base plate and lower partitions fixedly disposed on the lower base plate. There are three lower partitions, which are spaced at a fixed distance from each other. The distance between the upper partitions is equal to the thickness of the lower partitions, and the distance between the lower partitions is the same as the thickness of the upper partitions. The length of the lower partitions decreases layer by layer, and the lower partitions are embedded between the upper partitions.

[0010] As a preferred embodiment of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the inlet is fixedly located next to the lower partition, the outlet platform is located on the top of the inner wall of the mounting frame, and the outlet platform, upper conveyor frame, lower conveyor frame, and slide are inclined; a baffle is also provided on the outlet platform.

[0011] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the fixing frame is fixed to one side of the top of the mounting frame, the output shaft of the second motor is fixedly connected to the drive rod, the drive rod is a crankshaft, one end of the transmission rod is rotatably connected to the drive rod, and the other end is rotatably connected to the end of the push rod; a sliding cavity is also provided on the fixing frame, the push block is slidably disposed in the sliding cavity, and the end of the push rod away from the transmission rod is rotatably connected to the push block.

[0012] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the handle is rotatably mounted on the fixed frame, the first bevel gear is fixedly mounted on the handle rod, the support rod is right-angled, one end is rotatably connected to the handle, and the other end is rotatably connected to the threaded rod. Limiting rings are provided on both the handle and the threaded rod to prevent the support rod from sliding along the rod.

[0013] As a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the threaded rod passes through the positioning rod and is connected to the positioning rod by threads, the slider can slide along the arc groove, one side of the positioning rod is inserted into the slider and rotatably connected to it, and the other side is rotatably connected to the end of the adjusting rod.

[0014] In a preferred embodiment of the co-thermal treatment device for waste circuit board products and copper-containing sludge described in this invention, the end of the adjusting rod away from the positioning rod is rotatably connected to the transmission rod, and the adjusting rod, transmission rod, and push rod are on the same rotating shaft.

[0015] This invention discloses a method for the synergistic thermal treatment of waste circuit board products and copper-containing sludge, which mainly includes the following steps: S1: Waste circuit boards are coarsely crushed to obtain the processed product; S2: High-moisture copper-containing sludge undergoes drying treatment; S3: Waste circuit board products are added to the reactor through a co-heat treatment device for waste circuit board products and copper-containing sludge, while the sludge is directly poured into the reactor. S4: The reactor is set with pyrolysis temperature and reaction time. During the reaction stage, oxygen is continuously introduced at a stable flow rate until the reaction stops. S5: Collect the metal particles generated after the reaction and measure the weight loss rate of the reactants. The remaining glass fibers continue to participate in the pyrolysis reaction as an inert porous medium.

[0016] The beneficial effects of this invention are: The waste circuit board product and copper-containing sludge co-processing thermal treatment device of the present invention can autonomously screen smaller waste circuit board fragments and feed them into the reactor. At the same time, it can adjust the discharge rate of waste circuit board fragments in accordance with the sludge conveying efficiency. The co-processing thermal method of the present invention achieves the co-processing of waste circuit board sorting products and copper-containing sludge and the efficient recovery of copper by combining the treatment of these two wastes. While reducing the environmental burden, it realizes the high added value utilization of solid waste. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0018] Figure 2 This is a rear view of the overall structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge according to the present invention.

[0019] Figure 3 This is a schematic diagram of the mounting frame structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0020] Figure 4 This is a rear view of the mounting frame structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge according to the present invention.

[0021] Figure 5 This is a schematic diagram of the upper conveyor structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0022] Figure 6 This is a rear view of the upper conveyor structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge according to the present invention.

[0023] Figure 7 This is a schematic diagram of the lower conveyor structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0024] Figure 8 This is a schematic diagram of the rotating rod structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0025] Figure 9 This is a schematic diagram of the conveying component structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0026] Figure 10 This is a cross-sectional view of the conveying component structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0027] Figure 11 This is a schematic diagram of the pushing and adjusting components of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0028] Figure 12 This is a schematic diagram of the pusher block of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0029] Figure 13 This is a schematic diagram of the regulating component structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0030] Figure 14 This is a schematic diagram of the drive rod structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0031] Figure 15 This is a schematic diagram of the adjusting rod structure of the co-thermal treatment device for waste circuit board products and copper-containing sludge according to the present invention.

[0032] Figure 16 This is a schematic diagram of the slider structure of the co-processing thermal treatment device for waste circuit board products and copper-containing sludge of the present invention.

[0033] Figure 17 This is a schematic diagram of the process for the co-thermal treatment of waste circuit board products and copper-containing sludge according to the present invention.

[0034] Reference numerals: 100, Conveying assembly; 101, Mounting frame; 101a, Slide rail; 102, First motor; 103, Rotating rod; 103a, Connecting rod; 104, First connecting rod; 105, Second connecting rod; 106, Lower conveyor frame; 106a, Lower base plate; 106b, Lower partition plate; 107, Upper conveyor frame; 107a, Upper side plate; 107b, Upper partition plate; 108, Feed inlet; 109, Discharge platform; 109a, 200. Baffle; 201. Pushing assembly; 201. Fixing frame; 201a. Sliding cavity; 202. Second motor; 203. Drive rod; 204. Transmission rod; 205. Push rod; 206. Push block; 300. Adjusting assembly; 301. Handle; 302. First bevel gear; 303. Second bevel gear; 304. Threaded rod; 305. Support rod; 306. Arc groove; 307. Slider; 308. Positioning rod; 309. Adjusting rod. Detailed Implementation

[0035] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0037] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0038] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0039] Example 1 Reference Figures 1-16 This invention provides a first embodiment of a device for the co-thermal treatment of waste circuit board products and copper-containing sludge. The device includes a conveying assembly 100, a pushing assembly 200, and an adjusting assembly 300. The conveying assembly 100 includes a mounting frame 101, a first motor 102 mounted on the mounting frame 101, a rotating rod 103 connected to the first motor 102, a first connecting rod 104 and a second connecting rod 105 mounted on the rotating rod 103, a lower conveying frame 106 connected to the first connecting rod 104, an upper conveying frame 107 connected to the second connecting rod 105, an inlet 108 on the mounting frame 101, and an outlet platform 109. The pushing assembly 200 is mounted on the mounting frame 101 and includes a fixed frame 201 and a first connecting rod 104 mounted on the fixed frame 201. The assembly comprises a second motor 202, a drive rod 203 connected to the second motor 202, a transmission rod 204 connected to the drive rod 203, a push rod 205 connected to the transmission rod 204, a push block 206 connected to the push rod 205; and an adjustment assembly 300, mounted on a fixed frame 201, including a handle 301, a first bevel gear 302 mounted on the handle 301, a second bevel gear 303 meshing with the first bevel gear 302, a threaded rod 304 fixed to the second bevel gear 303, a support rod 305 mounted on the threaded rod 304, an arc-shaped groove 306 mounted on the fixed frame 201, a slider 307 mounted in the arc-shaped groove 306, a positioning rod 308 rotatably mounted on the slider 307, and an adjustment rod 309 rotatably connected to the positioning rod 308.

[0040] The mounting frame 101 has a first motor 102 fixedly installed at the bottom. The output shaft of the first motor 102 is fixedly connected to the rotating rod 103. The rotating rod 103 has two connecting rods 103a symmetrically arranged along the central axis of the rotating rod 103. One end of the first connecting rod 104 is rotatably connected to one connecting rod 103a, and the other end is rotatably connected to the lower conveyor frame 106. One end of the second connecting rod 105 is rotatably connected to the other connecting rod 103a, and the other end is rotatably connected to the upper conveyor frame 107. The inner wall of the mounting frame 101 is also symmetrically provided with slide rails 101a. The upper conveyor frame 107 is slidably disposed in the slide rails 101a. The upper conveyor frame 107 includes two upper side plates 107a and an upper partition plate 107b disposed between the upper side plates 107a. The upper side plates 107a are slidably disposed in the slide rails 101a. There are three upper partition plates 107b and they are fixedly disposed on the upper side plates 107a. The upper partition plates 107b are spaced at a fixed distance from each other, and the height of the upper partition plates 107b decreases layer by layer. The lower conveyor frame 106 includes a lower base plate 106a and lower partitions 106b fixedly mounted on the lower base plate 106a. There are three lower partitions 106b, spaced a fixed distance apart. The distance between the upper partitions 107b is equal to the thickness of the lower partitions 106b, and the distance between the lower partitions 106b is the same as the thickness of the upper partitions 107b. The length of the lower partitions 106b decreases progressively. An inlet 108 is fixedly mounted beside the lower partitions 106b. A discharge platform 109 is located on the top of the inner wall of the mounting frame 101. The discharge platform 109, upper conveyor frame 107, lower conveyor frame 106, and slide rail 101a are inclined. A baffle 109a is also mounted on the discharge platform 109.

[0041] During use, refer to Figures 1-10Waste circuit board fragments are poured in through the feed inlet 108. The first motor 102 is started, driving the rotating rod 103 to rotate. Since the rotating rod 103 has two centrally symmetrical connecting rods 103a, the rotation of the connecting rods 103a can move the first connecting rod 104 and the second connecting rod 105. A slide rail 101a is provided on the inner wall of the mounting frame 101, and the upper conveyor frame 107 is positioned within the slide rail 101a, allowing the upper conveyor frame 107 to move only along the slide rail 101a. Meanwhile, the lower partitions 106b in the lower conveyor frame 106 are inserted into the upper... Between the upper partitions 107b in the conveyor frame 107, the lower conveyor frame 106 can only move along the direction of the upper conveyor frame 107. When the first connecting rod 104 and the second connecting rod 105 move, they can drive the upper conveyor frame 107 and the lower conveyor frame 106 to move alternately. This movement process is as follows: when the first connecting rod 104 rotates from the bottom end to the top end of the rotating rod 103, the second connecting rod 105 rotates from the top end to the bottom end of the rotating rod 103. At this time, the first connecting rod 104 lifts the lower conveyor frame 106, while the second connecting rod 105 pulls down the upper conveyor frame 107. At this time, the upper conveyor frame 106... 07 and the lower conveyor frame 106 are deeply embedded, with each lower partition 106b having the same height as its corresponding upper partition 107b. Because the upper conveyor frame 107 and lower conveyor frame 106 are tilted, fragments on the lower partition 106b can roll onto the upper partition 107b at the same height. Each partition undergoes this movement. When the first connecting rod 104 rotates from the top to the bottom of the rotating rod 103, the second connecting rod 105 rotates from the bottom to the top of the rotating rod 103. At this point, the upper conveyor frame 107 and lower conveyor frame 106 are misaligned. When 107 is raised and the lower conveyor 106 is lowered, the lowest layer of the upper partition 107b is level with the second layer of the lower partition 106b, the second layer of the upper partition 107b is level with the highest layer of the lower partition 106b, and the highest layer of the upper partition 107b is level with the discharge platform 109. That is, the fragments on the upper partition 107b have climbed one layer higher than before. By tilting the partition, the fragments slide down to the partitions. At the same time, excessively large fragments cannot climb through the narrow partitions, thus achieving automatic screening. The transport efficiency of the fragments can be controlled by the speed of the first motor 102.

[0042] To adjust the discharge speed of the fragments, a fixed frame 201 is fixed to one side of the top of the mounting frame 101. The output shaft of the second motor 202 is fixedly connected to the drive rod 203, which is a crankshaft. One end of the transmission rod 204 is rotatably connected to the drive rod 203, and the other end is rotatably connected to the end of the push rod 205. A sliding cavity 201a is also provided on the fixed frame 201. The push block 206 is slidably disposed in the sliding cavity 201a, and the end of the push rod 205 away from the transmission rod 204 is rotatably connected to the push block 206. A handle 301 is rotatably disposed on the fixed frame 201. A first bevel gear 302 is fixedly disposed on the rod of the handle 301. The support rod 305 is right-angled, with one end rotatably connected to the handle 301 and the other end rotatably connected to the threaded rod 304. Limit rings are provided on both the handle 301 and the threaded rod 304 to prevent the support rod 305 from sliding along the rod. The threaded rod 304 passes through the positioning rod 308 and is connected to the positioning rod 308 by threads. The slider 307 can slide along the arc-shaped groove 306. One side of the positioning rod 308 is inserted into the slider 307 and rotatably connected to it, while the other side is rotatably connected to the end of the adjusting rod 309. The end of the adjusting rod 309 away from the positioning rod 308 is rotatably connected to the transmission rod 204. The adjusting rod 309, the transmission rod 204, and the push rod 205 share the same axis of rotation.

[0043] refer to Figures 11-16A baffle 109a is installed on the discharge platform 109 to prevent debris from affecting the operation of the push rod 205. The entire discharge platform 109 can be tilted towards the discharge port, allowing the debris to slide down towards the discharge port. The discharge speed of the debris can be controlled by activating the second motor 202, which drives the drive rod 203 to rotate. Since the drive rod 203 is a crankshaft, the rotation of the drive rod 203 will cause the transmission rod 204 to continuously control the push rod 205 to move back and forth within the sliding cavity 201a. It should be noted that, due to the first The self-locking effect of bevel gear 302 and second bevel gear 303 keeps threaded rod 304 stationary, while positioning rod 308 is threadedly connected to threaded rod 304. Therefore, adjusting rod 309 remains unchanged and has no effect on the cyclic movement of push rod 205. Push rod 205 drives push block 206 to cyclically reciprocate in the extension direction of sliding cavity 201a. When push rod 205 retracts, fragments can slide down the inclined slope of discharge platform 109. Push rod 205 extends to push fragments out towards discharge port. The material is discharged. To adjust the discharge speed, the handle 301 is rotated, driving the first bevel gear 302 to rotate. The second bevel gear 303 meshes with it, thus driving the threaded rod 304 to rotate. The threaded rod 304 moves on the threaded adjusting positioning rod 308, causing the slider 307 to slide on the arc groove 306. It should be noted that when the positioning rod 308 moves, the threaded rod 304 will gradually tilt. The support rod 305 ensures that the second bevel gear 303 meshes with the first bevel gear 302. After the positioning rod 308 moves to the end on the threaded rod 304, it changes the tilt angle of the adjusting rod 309. This changes the compression ratio of the push rod 205 in the sliding cavity 201a, changing the distance of the push rod 205's extension and retraction in each cycle. Specifically, the distance of the push rod 205's contraction and extension becomes longer, resulting in more fragmented particles being ejected, thus adjusting the discharge speed. In actual operation, the discharge speed can be matched with the conveying speed of the partition.

[0044] Example 2 Reference Figure 17 This is the second embodiment of the present invention, which differs from the first embodiment in that it provides a method for the synergistic thermal treatment of waste circuit board products and copper-containing sludge.

[0045] S1: Pretreatment of waste circuit board bare board sorting products. The collected waste circuit board bare board sorting products are coarsely crushed by a large shearing device, then crushed by a hammer crusher, and finally screened to obtain pretreated waste circuit board bare board sorting products.

[0046] S2: Pretreatment of high-moisture copper-containing sludge. The collected high-moisture copper-containing sludge is dried using a drum dryer, then crushed, ground, and sieved to obtain pretreated copper-containing sludge.

[0047] S3: Waste circuit board bare board sorting products are mixed with copper-containing sludge. A spiral mixer is used to mix the pretreated waste circuit board bare board sorting products and high-moisture copper-containing sludge in a certain proportion.

[0048] S4: Co-thermal treatment of mixed waste circuit board bare board sorting products and copper-containing sludge. Before starting the experiment, check the airtightness of the entire reaction device. After the materials are mixed evenly, put them into the reactor, set the pyrolysis temperature and reaction time, and continuously introduce oxygen at a stable flow rate during the reaction stage until the reaction stops.

[0049] S5: Collect the metal particles generated after the reaction and measure the weight loss rate of the reactants. The remaining glass fibers can continue to participate in the pyrolysis reaction as an inert porous medium or be used in building structures and decorative materials.

[0050] Compared to Example 1, in S1, the waste circuit board bare board sorting product is the part remaining after the waste circuit board bare board has been preliminarily removed of heavy metals such as copper, with a copper content of 5%-10% and a resin and glass fiber content of 70%-80%.

[0051] In S1, a hammer crusher is used to crush the waste circuit board bare board sorting product to a particle size of 0.8-1.2mm, and then a 20-mesh screen is used to screen the crushed waste circuit board bare board sorting product.

[0052] In S2, the drying process temperature is 160℃ and the time is 12h. After drying, the sludge has a moisture content of 30%-35% and a copper content of 45%-60%.

[0053] In S2, the crushed sludge is screened using a 60-mesh sieve.

[0054] In S3, the ratio of waste circuit board bare board sorting products to sludge can be 1:3, 1:4, or 1:5.

[0055] In S3, the spiral mixer operates at a speed of 100-200 rpm for 2 hours.

[0056] In S4, the reactor is wrapped with a 40mm thick asbestos insulation layer.

[0057] In S4, the reactor is a concave device and heating coils are evenly distributed on both sides of the reactor wall.

[0058] In S4, there is an air distributor at the bottom of the reactor to make the incoming air more uniform and stable.

[0059] In S4, the pyrolysis reaction temperature is 500-900℃, the reactor heating rate is 10℃ / min, and the isothermal reaction time is 60-180min.

[0060] In S4, the oxygen concentration in the reactor is 5-30%, the carrier gas flow rate is 0.5-1 Nm³ / h·m², and the gas velocity is 0.5-0.8 m / s.

[0061] In S5, the metal particles generated after the reaction are collected and the weight loss rate of the reactants and the total recovery rate of high-value metals are measured.

[0062] In S5, the remaining glass fibers, as inert porous media, return to S3 above to continue participating in the pyrolysis reaction, and can be reused or used in building structures and decorative materials.

[0063] Compared with existing technologies, this method has the following advantages: 1. This treatment technology is a synergistic pyrolysis disposal technology. It treats pollutants through pyrolysis in a low-oxygen atmosphere. The temperature required for the pyrolysis reaction is much lower than that of flaming combustion, and the reaction is relatively mild. The reaction process is highly safe and easy to control. No fuel needs to be added throughout the process. The cost and carbon emissions of pyrolysis treatment are far lower than traditional soil thermal remediation technologies such as waste incineration, making it a clean, environmentally friendly, and sustainable treatment technology.

[0064] 2. The waste circuit board bare board sorting product contains a large amount of resin matrix, which has a certain degree of combustibility and a high calorific value. It can be used as fuel in the pyrolysis reaction process. The heat provided by this fuel is sufficient to completely carry out the pyrolysis reaction, making full use of the heat generated by the partial combustion of the resin matrix in the waste circuit board bare board sorting product, while ensuring the complete reaction of the sludge. After processing, the glass fiber in the waste circuit board bare board sorting product will remain. This glass fiber can be directly used as an inert porous medium to continue to participate in the pyrolysis reaction and be reused. It can enhance the air permeability of the reactants, making the pyrolysis of the reactants more complete and accelerating the pyrolysis efficiency. Moreover, the recovered glass fiber is intact in morphology and has good performance, with physical and chemical properties that are basically equivalent to those of newly produced glass fiber. It has the characteristics of high strength, corrosion resistance, and high temperature resistance.

[0065] The following are the specific experimental steps: (1) The copper content of the collected waste circuit board blanks is 8.46% and the resin substrate content is 47.86%. After coarse crushing by large shearing equipment, the particles are crushed to a particle size of 0.8-1.2mm by hammer crusher, and then screened by 20 mesh screen.

[0066] (2) The collected high-moisture copper-containing sludge has a moisture content of 70.66%. It is placed in a drum dryer for drying. The temperature is set at 160℃ and the time is 12h. After drying, the copper content of the sludge is 50.25%. Then it is crushed by a crusher and sieved through a 60-mesh screen to obtain the pre-treated sludge.

[0067] (3) Use a spiral mixer to mix the pretreated waste circuit board bare board sorting product with the pretreated high-moisture copper-containing sludge at a ratio of 1:3. The spiral mixer speed is 200 rpm and the time is 2 hours.

[0068] (4) Before starting the experiment, check the airtightness of the entire reaction apparatus. After the materials are mixed evenly, fill them into the reactor. Set the pyrolysis reaction temperature to 800℃, the reactor heating rate to 10℃ / min, and the isothermal reaction time to 180min. The oxygen concentration in the reactor is 10%, the carrier gas flow rate is 1Nm³ / h·m2, and the gas velocity is 0.7m / s.

[0069] (5) After the reaction, the weight loss rate of the reaction material was 76.68%, the copper oxide content in the pyrolysis solid product was 87.53%, and the total recovery rate of high-value metals such as gold, silver, palladium and copper was >98%. Moreover, the obtained glass fiber has a complete morphology and good performance, and its physical and chemical properties are basically equivalent to those of newly produced glass fiber. It can be used in building structures and decorative materials.

[0070] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0071] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0072] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0073] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A co-thermal treatment device for waste circuit board products and copper-containing sludge, characterized in that, include: The conveying assembly (100) includes a mounting frame (101), a first motor (102) mounted on the mounting frame (101), a rotating rod (103) connected to the first motor (102), a first connecting rod (104) and a second connecting rod (105) mounted on the rotating rod (103), a lower conveying frame (106) connected to the first connecting rod (104), an upper conveying frame (107) connected to the second connecting rod (105), a feed inlet (108) and a discharge platform (109) mounted on the mounting frame (101). The feeding assembly (200) is mounted on the mounting frame (101) and includes a fixed frame (201), a second motor (202) mounted on the fixed frame (201), a drive rod (203) connected to the second motor (202), a transmission rod (204) connected to the drive rod (203), a push rod (205) connected to the transmission rod (204), and a push block (206) connected to the push rod (205). The adjustment assembly (300), mounted on the fixed frame (201), includes a handle (301), a first bevel gear (302) mounted on the handle (301), a second bevel gear (303) meshing with the first bevel gear (302), a threaded rod (304) fixed to the second bevel gear (303), a support rod (305) mounted on the threaded rod (304), an arc groove (306) mounted on the fixed frame (201), a slider (307) mounted in the arc groove (306), a positioning rod (308) rotatably mounted on the slider (307), and an adjustment rod (309) rotatably connected to the positioning rod (308).

2. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 1, characterized in that: The first motor (102) is fixedly installed at the bottom of the mounting frame (101). The output shaft of the first motor (102) is fixedly connected to the rotating rod (103). Two connecting rods (103a) are provided on the rotating rod (103) and are symmetrical about the central axis of the rotating rod (103). One end of the first connecting rod (104) is rotatably connected to one connecting rod (103a), and the other end is rotatably connected to the lower conveyor frame (106). One end of the second connecting rod (105) is rotatably connected to the other connecting rod (103a), and the other end is rotatably connected to the upper conveyor frame (107).

3. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 2, characterized in that: The mounting frame (101) is also symmetrically provided with slide rails (101a) on its inner wall. The upper conveyor frame (107) is slidably disposed in the slide rails (101a). The upper conveyor frame (107) includes two upper side plates (107a) and an upper partition plate (107b) disposed between the upper side plates (107a). The upper side plates (107a) are slidably disposed in the slide rails (101a). There are three upper partition plates (107b) and they are fixedly disposed on the upper side plates (107a). The upper partition plates (107b) are spaced at a fixed distance from each other, and the height of the upper partition plates (107b) decreases layer by layer.

4. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 3, characterized in that: The lower conveyor frame (106) includes a lower base plate (106a) and lower partitions (106b) fixedly mounted on the lower base plate (106a). There are three lower partitions (106b), which are spaced at a fixed distance from each other. The distance between the upper partitions (107b) is equal to the thickness of the lower partitions (106b), and the distance between the lower partitions (106b) is the same as the thickness of the upper partitions (107b). The length of the lower partitions (106b) decreases layer by layer. The lower partitions (106b) are embedded between the upper partitions (107b).

5. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 4, characterized in that: The feed inlet (108) is fixedly installed next to the lower partition (106b), and the discharge platform (109) is installed on the top of the inner wall of the mounting frame (101). The discharge platform (109), the upper conveyor frame (107), the lower conveyor frame (106), and the slide (101a) are inclined. A baffle (109a) is also provided on the discharge platform (109).

6. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 5, characterized in that: The fixed frame (201) is fixed to one side of the top of the mounting frame (101). The output shaft of the second motor (202) is fixedly connected to the drive rod (203). The drive rod (203) is a crankshaft. One end of the transmission rod (204) is rotatably connected to the drive rod (203), and the other end is rotatably connected to the end of the push rod (205). The fixed frame (201) is also provided with a sliding cavity (201a). The push block (206) is slidably disposed in the sliding cavity (201a). The end of the push rod (205) away from the transmission rod (204) is rotatably connected to the push block (206).

7. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 6, characterized in that: The handle (301) is rotatably mounted on the fixed frame (201), the first bevel gear (302) is fixedly mounted on the handle (301) rod, the support rod (305) is right-angled, one end is rotatably connected to the handle (301), and the other end is rotatably connected to the threaded rod (304). Limiting rings are provided on both the handle (301) and the threaded rod (304) to prevent the support rod (305) from sliding along the rod.

8. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 7, characterized in that: The threaded rod (304) passes through the positioning rod (308) and is connected to the positioning rod (308) by threads. The slider (307) can slide along the arc groove (306). One side of the positioning rod (308) is inserted into the slider (307) and rotatably connected to it, and the other side is rotatably connected to the end of the adjusting rod (309).

9. The co-thermal treatment device for waste circuit board products and copper-containing sludge as described in claim 8, characterized in that: The end of the adjusting rod (309) away from the positioning rod (308) is rotatably connected to the transmission rod (204), and the adjusting rod (309), the transmission rod (204), and the push rod (205) are on the same rotating axis.

10. A method for co-thermal treatment of waste circuit board products and copper-containing sludge, applied to the co-thermal treatment apparatus for waste circuit board products and copper-containing sludge as described in any one of claims 1-9, characterized in that, The main steps include the following: S1: Waste circuit boards are coarsely crushed to obtain the processed product; S2: High-moisture copper-containing sludge undergoes drying treatment; S3: Waste circuit board products are added to the reactor through a co-heat treatment device for waste circuit board products and copper-containing sludge, while the sludge is directly poured into the reactor. S4: The reactor is set with pyrolysis temperature and reaction time. During the reaction stage, oxygen is continuously introduced at a stable flow rate until the reaction stops. S5: Collect the metal particles generated after the reaction and measure the weight loss rate of the reactants. The remaining glass fibers continue to participate in the pyrolysis reaction as an inert porous medium.

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