Sheet stamping method, apparatus, electronic device, and medium

Abstract

The application discloses a plate stamping method and device, electronic equipment and medium, and relates to the technical field of stamping processing. The method comprises the following steps: obtaining a design file of a plate; transmitting the plate to a processing track through a conveying device; dividing the plate into multiple processing areas according to the design file, dividing a punching die set into multiple punching areas, and determining a punch group of each punching area; pre-punching each processing area of the plate along the extension direction of a separation gap through a first stamping machine; punching the corresponding processing area through each punch group of the punching die set; stamping the connecting section between a plurality of separation holes of each processing area through a cutting die set in sequence, so that the plurality of separation holes are connected to form a separation groove; and when the plate reaches the outlet of the processing track, the plate is separated into two plate pieces of equal size along the separation groove through a separation piece. The method can utilize one stamping die to stamp multiple assembly holes of different sizes at the same time.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of stamping processing, in particular to a plate stamping method and device, electronic equipment and medium. BACKGROUND

[0002] The frame is usually applied in the assembly structure of the television, computer and other devices, and the frame is obtained by bending the long strip-shaped plate member. Before the plate member is bent, a numerical control machine tool is usually used to process assembly holes on the plate member to provide a structural basis for subsequent assembly processes. For some devices with complex structures, multiple assembly holes of different sizes are required. Therefore, multiple different stamping dies are usually used to punch out assembly holes of different sizes. The required stamping dies are more, and the replacement of the stamping dies is more cumbersome. Moreover, when the plate member is stamped, stress is easily generated to cause deformation of the plate member. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a plate stamping method and device, electronic equipment and medium, which can use one stamping die to stamp multiple assembly holes of different sizes at the same time.

[0004] In a first aspect, a plate stamping method according to an embodiment of the present application comprises the following steps:

[0005] Obtaining a design file of a plate, wherein the design file records size information and processing information of the plate, and the plate is provided with a separation gap;

[0006] Transmitting the plate to a processing track by a conveying device, wherein the processing track sequentially passes through a first stamping machine and a second stamping machine, the second stamping machine is provided with a punching die set and a breaking die set, the punching die set comprises a plurality of punches with adjustable diameter and extension, and an isolation member is arranged at an outlet of the processing track;

[0007] According to the design file, the plate is divided into a plurality of processing areas, the punching die set is divided into a plurality of punching areas, and a punch group of each punching area is determined, wherein the processing areas and the punching areas are one-to-one corresponding, and each punch group comprises a plurality of punches;

[0008] When the plate moves along the processing direction on the processing track, the first stamping machine sequentially performs pre-punching on each processing area of the plate along the extension direction of the separation gap, and a plurality of separation holes are formed in each processing area;

[0009] Each punch group of the punching die set punches the corresponding processing area to form a through hole with a corresponding size;

[0010] The connecting sections between the plurality of separation holes in each processing area are sequentially punched by the punching die set, so that the plurality of separation holes are communicated to form a separation groove.

[0011] When the plate reaches the outlet of the processing track, the plate is separated into two equal-sized plate pieces along the separation groove by the spacer.

[0012] According to some embodiments of the present application, the surface of the processing track is provided with limiting holes with adjustable opening;

[0013] The punch set of each punching area is determined, including:

[0014] According to the processing information, all the through holes in the processing area are classified to obtain a plurality of through hole sets, and the processing sequence of the through hole sets is sorted; each through hole set corresponds to a punching area, and each through hole set includes a plurality of through holes;

[0015] According to the through hole arrangement mode of the through hole set and the processing sequence, the punch set of each punching area is sequentially set;

[0016] The punch belonging to the punch set in the punching area is extended downward out of the bottom surface of the punching die set, and the punch not belonging to the punch set is in a retracted state and located inside the punching die set;

[0017] According to the size of the through hole in each through hole set, the diameter of the punch in the punch set of each punching area is adjusted; wherein each punch is formed by a plurality of telescopic sleeves, and the diameter of the punch can be adjusted by controlling the extension and retraction state of each telescopic sleeve;

[0018] According to the size of the through hole in each through hole set, the opening of each limiting hole of the processing track is determined so that the punch matches the corresponding limiting hole.

[0019] According to some embodiments of the present application, according to the processing information, all the through holes in the processing area are classified to obtain a plurality of through hole sets, and the processing sequence of the through hole sets is sorted, including:

[0020] A plurality of through holes with the same size are divided into the same through hole set, and a plurality of through hole sets corresponding to different sizes are obtained;

[0021] One of the through hole sets located at the center of all the through hole sets is obtained as a center through hole set;

[0022] The machining sequence of the center hole group is arranged first, and the machining sequence of the remaining hole groups is arranged according to the size or spacing of the holes in the hole groups.

[0023] According to some embodiments of the present application, the machining sequence of the remaining hole groups is arranged according to the size or spacing of the holes in the hole groups, including:

[0024] For each hole group other than the center hole group, the machining sequence of the hole group is arranged in order of the size of the holes in the hole group from large to small, or in order of the spacing between the holes in the hole group from large to small.

[0025] Each of the arranged hole groups is divided into a first hole group and a second hole group, and the machining sequence of the second hole group is arranged after the first hole group; wherein the plurality of holes in the first hole group are distributed in a staggered manner with the plurality of holes in the second hole group, and the first hole group and the second hole group correspond to different punching areas.

[0026] According to some embodiments of the present application, the first punching machine has a pre-punching die set;

[0027] The pre-punching of each machining area of the plate material by the first punching machine along the extension direction of the separation gap includes:

[0028] According to the design file, the position of the separation gap is determined;

[0029] According to the position of the separation gap, the pre-punching position of the pre-punching die set is adjusted;

[0030] The pre-punching of each machining area of the plate material by the pre-punching die set in sequence forms a plurality of interval distributed separation holes in each machining area, so that the center of the separation hole is located on the same straight line with the separation gap.

[0031] According to some embodiments of the present application, the conveying device includes a turntable, a driving mechanism and a stepping transmission mechanism, the turntable is provided with a containing groove for winding the plate material, the driving mechanism is in transmission connection with the turntable, the stepping transmission mechanism is provided with a pressing member and a rotating rod, the pressing member is in transmission connection with the rotating rod, the rotating rod is provided with a sensing element, the sensing element is in electrical connection with the driving mechanism, and the first punching machine is provided with a pressing rod near one side of the stepping transmission mechanism.

[0032] The plate material is conveyed to the machining track by the conveying device, including:

[0033] drive the rotating disc to rotate through the driving mechanism;

[0034] feed the plate according to a preset step through the step transmission mechanism, and press the plate through the pressing member;

[0035] when the lower pressing rod presses the rotating rod 150, the pressing member is lifted through the rotating rod 150 to release the plate;

[0036] send an induction signal to the driving mechanism through the induction element, so that the driving mechanism drives the rotating disc to rotate by a preset angle, and when the rotating rod 150 is reset, the pressing member is reset to press the plate.

[0037] According to some embodiments of the present application, the upper part of the outlet of the processing track is further provided with a cutting device, and the outlet of the processing track is provided with a distance measuring element; the method further comprises:

[0038] According to the processing information, the first length of each plate is determined;

[0039] The second length of the plate passing through the outlet of the processing track is obtained through the distance measuring element;

[0040] When the first length is equal to the second length, the plate is cut downward through the cutting device, so that the plate is equally divided into two plates.

[0041] In a second aspect, the plate stamping device according to the embodiments of the present application comprises at least one control processor and a memory connected in communication with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to execute the plate stamping method according to the first aspect.

[0042] In a third aspect, the electronic device according to the embodiments of the present application comprises the plate stamping device according to the second aspect.

[0043] In a fourth aspect, the storage medium according to the embodiments of the present application stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the plate stamping method according to the first aspect.

[0044] According to the plate stamping method, device, electronic equipment and medium provided in the embodiments of the present application, the plate is divided into multiple processing areas, the punching die set is divided into multiple punching areas, the multiple punching areas punch the multiple processing areas at the same time, the punches of the punch group of each punching area are different, each punching area can punch a through hole of different size, a punching die set is used to form multiple through holes of different sizes, multiple punching die sets are not needed, the first stamping machine is used to pre-punch the plate, on one hand, the stress during stamping is reduced, on the other hand, a separation hole is formed, so that the plate can be evenly divided into two plate pieces in the future, the punching of the two plate pieces is completed at the same time through one stamping cycle, and the punching efficiency is improved.

[0045] Additional aspects and advantages of the present application will be described in the following description and further will appear upon examination of the description. It will be understood that changes in the details of the embodiments of the present application are possible in light of the description contained herein and can be made without departing from the scope of the application and the present application includes and protects such changes and similar realizations. BRIEF DESCRIPTION OF DRAWINGS

[0046] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, taken in conjunction with the accompanying drawings, in which:

[0047] Figure 1 A step flow chart of the plate stamping method according to the embodiments of the present application;

[0048] Figure 2 Structural schematic diagrams of the conveying device, the first stamping machine and the second stamping machine according to the embodiments of the present application;

[0049] Figure 3 Structural schematic diagrams of the conveying device, the first stamping machine and the second stamping machine according to the embodiments of the present application from another perspective;

[0050] Figure 4 A structural schematic diagram of the plate stamping device according to the embodiments of the present application. DETAILED DESCRIPTION

[0051] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar notations represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and cannot be understood as a limitation of the present application. The step numbers in the following embodiments are only set for the convenience of description and explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0052] In the description of the application, it needs to be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0053] The terms "first", "second", "third", and "fourth" and the like in the description and claims of the application and the accompanying drawings, are used for distinguishing between similar objects, and are not necessarily used to describe a particular sequential or chronological order. Also, the terms "comprises", "comprising", "includes", "including", and the like, are meant to encompass non-exclusive inclusions, such that a process, method, system, product, or apparatus that comprises a list of steps or elements does not necessarily comprise only those steps or elements but can include other steps or elements not expressly listed or inherent to such process, method, system, product, or apparatus.

[0054] Reference to "an embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily referring to a common or identical embodiment, or an embodiment that is every other embodiment combination. It will be explicitly understood that the embodiments described herein can be combined with each other in their respective individual features, or in any combination.

[0055] The frame is usually applied in the assembling structure of the television, computer and the like, and the frame is obtained by bending the long strip-shaped raw material. Before the raw material is bent, the numerical control machine tool is usually used to process the assembling hole on the raw material, so as to provide a structural basis for the subsequent assembling process. For some devices with complex structure, a plurality of assembling holes with different sizes are required, and therefore, a plurality of different stamping dies are usually required to stamp the assembling holes with different sizes, so that more dies are required and the stamping time is longer. Moreover, when the raw material is stamped, if the number of holes stamped at one time is large, a large stress will be generated, which will cause the deformation of the raw material.

[0056] To this end, an embodiment of the present application provides a plate stamping method, device, electronic equipment and medium, by dividing the plate into multiple processing areas, and dividing the punching die set into multiple punching areas, so that multiple punching areas punch multiple processing areas at the same time, and the punches of the punch head group of each punching area are different, and each punching area can punch different size through holes, so that one punching die set is used to form multiple different size through holes, without using multiple punching die sets; at the same time, the first punching machine is used to pre-punch the plate, which can reduce the stress during stamping on the one hand, and can form a partition hole on the other hand, so that the plate can be evenly divided into two plate pieces in the subsequent process, and the punching of the two plate pieces is completed at the same time through one stamping cycle, thereby improving the punching efficiency.

[0057] The plate stamping method, device, electronic equipment and medium of the embodiment of the present application will be described in detail below with reference to the drawings.

[0058] On the one hand, an embodiment of the present application provides a plate stamping method, as shown in the figure, the method comprises but is not limited to steps S100 to S600: Figure 1

[0059] Step S100: Obtain the design file of the plate 400, the design file records the size information and processing information of the plate 400, and the plate 400 is provided with a partition gap;

[0060] It should be noted that, since different size through holes need to be formed on the plate 400, the size information and processing information of the plate 400 need to be determined in advance, the size information represents the length, width and thickness of the plate 400, and the processing information represents the specific position where the through hole needs to be formed on the plate 400, and which size through hole corresponds to different positions; according to the actual product demand, the plate 400 of corresponding size is selected, and then the processing information of the plate 400 is determined to form a design file, which is input to the controller, so that the controller can control the entire stamping process according to the design file. At the same time, in the present application, the plate 400 is provided with a partition gap in advance, which plays an indicating role, and the plate 400 can be evenly divided into left and right two plate pieces 420 according to the partition gap, and the structure and stamping process of each plate piece 420 are completely the same, so that two plate pieces 420 can be formed at the same time by using one stamping cycle, and each plate piece 420 can flow into the subsequent process for bending and other operations, thereby forming a frame, which can further improve the stamping efficiency of the plate 400.

[0061] Step S200: transmit the plate 400 to the processing track 500 through the conveying device 100, the processing track 500 passes through the first punching machine 200 and the second punching machine 300 in turn, the second punching machine 300 is provided with a punching die set and a punching-off die set, the punching die set includes multiple punches with telescopic and adjustable diameter, and the outlet of the processing track 500 is provided with a partition piece 510;​

[0062] Specifically, such as Figure 2 As shown, the processing track 500 serves to limit the movement of the sheet metal 400. During the stamping process, the conveying device 100 moves the sheet metal 400 along the processing track 500 by a preset step each time. Each time the sheet metal 400 moves, the first stamping machine 200 and the second stamping machine 300 stamp the sheet metal 400 once, achieving continuous stamping of different positions on the sheet metal 400. The first stamping machine 200 is used to pre-stamp the sheet metal 400 to form a separating hole 430. The separating hole 430 and the separating notch are on the same straight line. Subsequently, any two adjacent separating holes 430 need to be connected to form a separating groove 410, thereby dividing the sheet metal 400 into two plates 420. The punching module is mainly used to simultaneously punch the required through holes on the two plates 420. The cutting module is used to cut off the connecting section between any two adjacent separating holes 430, connecting the adjacent separating holes 430. When the sheet 400 moves to the exit of the processing track 500, the separator 510 can divide the sheet 400 into two pieces 420 along the dividing groove 410.

[0063] Step S300: According to the design documents, the sheet metal 400 is divided into multiple processing areas, the punching module is divided into multiple punching areas, and the punch group corresponding to each punching area is determined. The processing area and the punching area correspond one-to-one. Each punch group includes multiple punches with corresponding extension length and diameter.

[0064] Specifically, after obtaining the design documents, areas with identical through-hole distribution are divided into processing zones based on the distribution of through-holes. This divides the sheet metal 400 into multiple identical processing zones. During processing, the preset step size of the sheet metal 400 movement is equal to the length of the processing zone. Simultaneously, to punch holes in each processing zone at the same time, the punching module is divided into multiple punching areas, each corresponding to one processing zone. Thus, when the last punching area in the processing direction punches the first processing zone, the second-to-last punching area punches the second processing zone, and the first punching area punches the Nth processing zone, where N equals the number of punching areas. In this way, as each processing zone advances along the processing track 500, it sequentially passes through the first punching area, the second punching area, ..., the Nth punching area, being punched once by each area. After N punching operations, all the required through-holes are formed. During the punching process, a corresponding set of punches is selected for punching. Each punching zone has a different set of punches, thus punching through holes of different sizes at different locations on the 400mm sheet metal. Each set of punches includes multiple punches. Since the extension length and diameter of the punches are adjustable, the arrangement of the punches in the set, as well as the extension length and diameter of each punch, can be determined according to the required size and layout of the through holes.

[0065] Step S400: When the plate 400 moves along the processing direction on the processing track 500, the first punching machine 200 sequentially pre-punches each processing area of the plate 400 along the extension direction of the separation gap to form a plurality of spaced-apart separation holes 430 in each processing area.

[0066] Since the moving step of the plate 400 is the length of one processing area, the first punching machine 200 pre-punches the plate 400 once and forms a plurality of spaced-apart separation holes 430 in the corresponding processing area each time the plate 400 moves along the processing direction once. The center of the separation hole 430 is in the same straight line as the separation gap, which facilitates the subsequent connection of a plurality of separation holes 430 to form a separation groove 410, thereby dividing the plate 400 into two plate pieces 420.

[0067] Step S500: Punching each processing area by each punch group of the punching die set to form a through hole of a corresponding size;

[0068] Specifically, after the plate 400 passes through the first punching machine 200, it continues to move along the processing track 500 and enters the second punching machine 300. After passing through the second punching machine 300, the punching die set starts to punch the plate 400, and a plurality of punching areas act simultaneously, each punching area punches a different processing area to form a through hole of a corresponding size in each processing area.

[0069] Step S600: sequentially punching the connection sections between a plurality of separation holes 430 in each processing area by the cutting-off die set to make the plurality of separation holes 430 communicate with each other to form a separation groove 410;

[0070] When the processing area of the plate 400 passes through all the punching areas and reaches the cutting-off die set, the cutting-off die set punches the connection sections between a plurality of separation holes 430 in the processing area to make the plurality of separation holes 430 communicate with each other to form a separation groove 410.

[0071] Step S700: When the plate 400 reaches the outlet of the processing track, the isolation piece 510 separates the plate 400 into two plate pieces 420 of the same size along the separation groove 410.

[0072] When the plate 400 reaches the outlet of the processing track, the isolation piece 510 is inserted into the separation groove 410, thereby separating the plate 400 into two plate pieces 420 of the same size. In this way, the punching of two plate pieces 420 can be completed simultaneously in one punching cycle, thereby improving the punching efficiency.

[0073] According to the plate stamping method, the plate 400 is divided into multiple processing areas, the punching die set is divided into multiple punching areas, the multiple punching areas punch the multiple processing areas at the same time, the punches of the punch set of each punching area are different, each punching area can punch out through holes of different sizes, and thus multiple through holes of different sizes are formed by using one punching die set, and multiple punching die sets are not needed. Meanwhile, the first stamping machine 200 is used to pre-punch the plate 400, which can reduce stress during stamping and form the separation hole 430, so that the plate 400 can be evenly divided into two plate pieces 420, the punching of the two plate pieces 420 is completed at the same time through one stamping cycle, and the punching efficiency is improved.

[0074] Further, in some embodiments of the present application, the surface of the processing track 500 passing through the second stamping machine 300 is provided with multiple adjustable limiting holes, each punch is sleeved by multiple telescopic sleeves, the diameter of the punch can be adjusted by controlling the telescopic state of each telescopic sleeve, and each punch corresponds to one limiting hole. In the step S300, the punch set corresponding to each punching area is determined, including the following five sub-steps:

[0075] Step S310: According to the processing information, all through holes of the processing area are classified to obtain multiple through hole groups, and the processing sequence of the through hole groups is sorted; each through hole group corresponds to one punching area, and each through hole group includes multiple through holes;

[0076] Step S320: According to the through hole arrangement mode and the processing sequence of the through hole group, the punch set of each punching area is sequentially set;

[0077] Step S330: The punch belonging to the punch set in the punching area is extended downward out of the bottom surface of the punching die set, the punch not belonging to the punch set is in a retracted state and located inside the punching die set;

[0078] Step S340: According to the size of the through hole in each through hole group, the diameter of the punch of the punch set of each punching area is adjusted;

[0079] Step S350: According to the size of the through hole in each through hole group, the opening of each limiting hole of the processing track 500 is determined, so that the punch matches the corresponding limiting hole.

[0080] It should be noted that since the through holes have various types and various sizes, in order to optimize the punching process, the processing sequence of each type of through hole needs to be determined so as to reduce the stress on the processing area as much as possible during punching. For this purpose, in the present example, all the through holes in the processing area are classified into a plurality of through hole groups, each of which has a plurality of through holes, and each of which corresponds to a punching area; then, according to the arrangement of the through holes in the through hole group and the processing sequence of the through hole group, the punch group of each punching area is determined, for example, the first punching area is responsible for punching the through holes of the through hole group arranged in the first place, the second punching area is responsible for punching the through holes of the through hole group arranged in the second place, and so on. For this purpose, the punch group of the first punching area needs to have the size and arrangement of the punches inside it corresponding to the size and arrangement of the through holes in the through hole group arranged in the first place, and the punch groups of the other punching areas also need to be adapted to the corresponding through hole groups. In order to enable the punch group of the punching area to punch the required through holes, the diameter of the punch in the punch group can be adjusted, each punch is formed by a plurality of telescopic sleeves, and the diameter of the punch can be adjusted by controlling the extension state of each telescopic sleeve; at the same time, the opening of each limiting hole needs to be adjusted so that the size of the limiting hole matches the corresponding punch. In addition, the extension state of each punch in the punch group needs to be controlled according to the arrangement of the through holes, for the punches that need to punch the through holes, the extension state needs to be maintained, and for the punches that do not need to punch the through holes, the retracted state needs to be maintained, so that when the punching die set is lowered, the punches in the extended state will punch the plate 400, and the punches in the retracted state will not punch, thereby forming the required through hole group.

[0081] Further, in some embodiments of the present application, the step S310 of classifying all the through holes in the processing area according to the processing information to obtain a plurality of through hole groups and sorting the processing sequence of the through hole groups comprises the following three sub-steps:

[0082] Step S311: dividing a plurality of through holes with the same size into the same through hole group to obtain a plurality of through hole groups corresponding to different sizes;

[0083] Step S312: obtaining the through hole group corresponding to the through hole located at the center of all the through holes as the center through hole group;

[0084] Step S313: arranging the processing sequence of the center through hole group in the first place, and sorting the processing sequence of the remaining through hole groups according to the size or interval of the through holes in the through hole group.

[0085] Specifically, in the present example, when classifying the through holes, the through holes are classified according to their sizes, and through holes of the same size are classified into the same through hole group, so that a plurality of through hole groups corresponding to through holes of different sizes are obtained, and each punch in the stamping group maintains the same size. Then, the through hole group corresponding to the through hole at the center of all the through holes is taken as the center through hole group, and the first to be punched during stamping. By punching the center through hole group first, the stress distribution is optimized, so that the stress distribution of the processing area is more uniform, and the risk of deformation during subsequent punching is reduced. Then, the remaining through hole groups are sorted according to the size or spacing of the through holes. The specific sorting method can adopt the following two steps:

[0086] For each of the remaining through hole groups, the processing order of the through hole group is arranged in descending order of the size of the through holes in the through hole group; or, the processing order of the through hole group is arranged in descending order of the spacing of the through holes in the through hole group;

[0087] Each of the arranged through hole groups is divided into a first through hole group and a second through hole group, and the processing order of the second through hole group is arranged behind the first through hole group; wherein the plurality of through holes of the first through hole group are distributed in a staggered manner with the plurality of through holes of the second through hole group, and the first through hole group and the second through hole group correspond to different punching areas.

[0088] Specifically, when arranging the processing order of the through hole group in descending order of the size, large holes can be punched first, and small holes can be punched later; when arranging the processing order of the through hole group in descending order of the spacing of the through holes, holes with a relatively sparse distribution can be punched first, and holes with a relatively dense distribution can be punched later, so as to further optimize the stress distribution and reduce the risk of deformation during punching. Further, each through hole group is divided into a first through hole group and a second through hole group, and the plurality of through holes of the first through hole group are distributed in a staggered manner with the plurality of through holes of the second through hole group, which can reduce the number of single punching in the processing area and increase the spacing between adjacent through holes during single punching, thereby further reducing the stress.

[0089] Further, as shown in Figure 2 some embodiments of the present application, the first stamping machine 200 has a pre-punching die set 600; the step S400 described above: the first stamping machine 200 sequentially pre-punches each processing area of the plate 400 along the extension direction of the separation gap, and forms a plurality of interval distributed separation holes 430 in each processing area, which includes the following three sub-steps:

[0090] Step S410: determining the position of the separation gap according to the design file;

[0091] Step S420: adjusting the pre-punching position of the pre-punching die set 600 according to the position of the separation gap;

[0092] Step S430: The pre-punching module 600 pre-punches each processing area of ​​the sheet 400 in turn, forming several spaced-apart partition holes 430 in each processing area, so that the center of the partition hole 430 and the partition notch are on the same straight line.

[0093] Specifically, since the center of the dividing hole needs to be aligned with the dividing notch, the position of the dividing notch needs to be determined first, and then the pre-punching position of the pre-punching module 600 is adjusted so that when the pre-punching module 600 pre-punches the plate 400, the center of the dividing hole 430 formed is aligned with the dividing notch, which facilitates the subsequent stroke of the dividing groove 410 to divide the plate 400 into two plates 420.

[0094] Furthermore, such as Figure 2 As shown, in some embodiments of this application, the conveying device 100 includes a turntable 110, a drive mechanism 120 and a stepping transmission mechanism 130. The turntable 110 is provided with a receiving groove 111 for winding the sheet 400. The stepping transmission mechanism 130 is provided with a clamping member 140 and a rotating rod 150. The clamping member 140 is connected to the rotating rod 150 in a transmission connection. The rotating rod 150 is provided with a sensing element. The sensing element is electrically connected to the drive mechanism 120. The first stamping machine 200 is provided with a lower pressing bar 610 on the side near the stepping transmission mechanism 130.

[0095] Step S200 above: The plate 400 is transferred to the processing track 500 by the conveying device 100, which includes the following four sub-steps:

[0096] Step S210: Drive the turntable 110 to rotate via the drive mechanism 120;

[0097] Step S220: The plate 400 is fed by the stepping transmission mechanism 130 according to the preset step, and the plate 400 is pressed by the clamping member 140;

[0098] Step S230: When the pressure bar 610 presses down the rotating rod 150, the rotating rod 150 drives the clamping member 140 to rise, releasing the plate 400;

[0099] Step S240: A sensing signal is sent to the drive mechanism 120 through the sensing element, so that the drive mechanism 120 drives the turntable 110 to rotate at a preset angle. At the same time, when the rotating rod 150 is reset, it drives the clamping member 140 to reset and clamp the plate 400.

[0100] Specifically, first, the rotating disc 110 is driven to rotate by the driving mechanism 120, so that the plate 400 in the accommodating groove 111 moves to the step transmission mechanism 130, the step transmission mechanism 130 is used to control the conveying tension of the plate 400, and the conveying step of the plate 400 is controlled, so that the plate 400 moves along the processing track 500 according to the preset step. The step transmission mechanism 130 is provided with a pressing piece 140 for pressing the plate 400, so that the plate 400 advances with the required tension. It should be noted that when the first punch 200 and the second punch 300 punch the plate 400, the lower rod 610 will press down the rotating rod 150, so that the pressing piece 140 rises and releases the plate 400, avoiding that additional resistance is generated in the punching process, causing the material to be pulled in the punching process, causing the mold to be damaged or the material to be deformed, thereby causing the punching precision to be reduced or the material to be deformed, and ensuring that the punching mold can freely complete the punching action .

[0101] As Figure 3 shown, in some embodiments of the present application, a cutting device 310 is further arranged above the outlet of the processing track 500, and a distance measuring element is arranged at the outlet of the processing track 500; the plate punching method further comprises the following three steps:

[0102] According to the processing information, the first length of each plate piece 420 is determined;

[0103] The second length of the plate 400 passing through the outlet of the processing track 500 is obtained through the distance measuring element;

[0104] When the first length is equal to the second length, the plate 400 is cut downward by the cutting device 310, so that the plate 400 is equally divided into two plate pieces 420.

[0105] It should be noted that in actual application, different sizes of frames are needed for producing different products, and different lengths of plate pieces 420 are also needed, therefore, when the punching length of the plate 400 reaches the required length of the plate piece 420, the plate 400 can be cut by the cutting device 310 to form the plate piece 420 with the required length, and the remaining part of the plate 400 is used to punch the subsequent plate piece 420. It should be noted that the cutting device 310 can be arranged on a separate lifting device, or the cutting knife of the cutting device 310 can be arranged to be telescopic, and the cutting knife is arranged on the cutting die assembly and lifts together with the cutting die assembly. In the normal state, the cutting knife remains in the retracted state, and only when the plate 400 needs to be cut, the cutting knife remains in the extended state.

[0106] According to the plate stamping method provided in the embodiment of the present application, the plate 400 is divided into multiple processing areas, the punching die set is divided into multiple punching areas, and punching is performed on the multiple processing areas simultaneously through the multiple punching areas, the punches of the punch set of each punching area are different, each punching area can punch out through holes of different sizes, and thus multiple through holes of different sizes can be formed by using one punching die set without using multiple punching die sets. Meanwhile, the first stamping machine 200 is used to pre-punch the plate 400, which can reduce the stress during stamping and form the separation hole 430, so that the plate 400 can be evenly divided into two plate pieces 420 in the subsequent process, the punching of the two plate pieces 420 is completed simultaneously through one stamping cycle, and thus the punching efficiency is improved.

[0107] In another aspect, the embodiment of the present application further provides a plate stamping device, as shown in the accompanying drawings, the device comprises: Figure 4

[0108] The processor 101 can be implemented in the form of a general central processing unit (CPU), a microprocessor, an application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute related programs to implement the technical solutions provided by the plate stamping method of the embodiment of the present application;

[0109] The memory 102 can be implemented in the form of a read only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 102 can store an operating system and other application programs, and when the technical solutions provided by the embodiment of the present application are implemented by software or firmware, the related program codes are stored in the memory 102 and are called and executed by the processor 101 to implement the plate stamping method of the embodiment of the present application;

[0110] The input / output interface 103 is used to realize information input and output;

[0111] The communication interface 104 is used to realize the communication interaction between the device and other devices, and can realize communication through a wired manner (for example, a USB, a network cable, etc.) or a wireless manner (for example, a mobile network, WIFI, Bluetooth, etc.);

[0112] The bus 105 transmits information between various components (for example, the processor 101, the memory 102, the input / output interface 103, and the communication interface 104) of the device;

[0113] ​The processor 101, the memory 102, the input / output interface 103 and the communication interface 104 are communicatively connected with each other inside the device through the bus 105.

[0114] In another aspect, the embodiment of the present application also provides an electronic device comprising the plate stamping device.

[0115] In another aspect, the embodiment of the present application also provides a storage medium, which is a computer readable storage medium, and stores a computer program, which is executed by a processor to implement the plate stamping method.

[0116] The memory, as a non-transitory computer readable storage medium, can be used to store non-transitory software programs and non-transitory computer executable programs. In addition, the memory can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory can optionally include a memory remotely arranged relative to the processor, and these remote memories can be connected to the processor through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The above-described device embodiments are only schematic, and units described as separate components can or can not be physically separate, and can be implemented in one location, or can be distributed over multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment.

[0117] Although specific embodiments are described herein, one of ordinary skill in the art will appreciate that many other modifications or alternative embodiments are within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Additionally, while various example implementations and architectures have been described in accordance with embodiments of the present disclosure, one of ordinary skill in the art will appreciate that many other modifications to the example implementations and architectures described herein are within the scope of the present disclosure.

[0118] Certain aspects of the present disclosure are described above with reference to block and flow diagrams of systems, methods, apparatuses and / or computer program products according to example embodiments. It will be understood that one or more blocks of the block diagrams and flow diagrams, and combinations of blocks in the block diagrams and flow diagrams, can be implemented by computer-executable program instructions. Also, some blocks in the block diagrams and flow diagrams can not be required, and / or additional blocks can be added, in accordance with some embodiments. Additionally, the order in which blocks are presented in the block diagrams and flow diagrams can be altered in some embodiments.

[0119] Accordingly, blocks in the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, support combinations of the means for performing the specified functions, combinations of elements or steps for performing the specified functions, and combinations of the program instruction means for performing the specified functions. It will also be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, can be implemented by special purpose hardware-based computer systems which perform the specified functions either alone or in combination with other

[0120] The program modules, applications, and the like described herein can include one or more software components, including, for example, software objects, methods, data structures, and the like. Each such software component can include computer-executable instructions that, in response to execution by a computer, cause at least a portion of the functionality described herein (e.g., one or more operations of the example methods described herein) to be performed.

[0121] Software components can be coded in any of a variety of programming languages. One illustrative programming language can be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. Software components that include assembly language instructions can need to be translated via an assembler before execution by the hardware architecture and / or platform. Another illustrative programming language can be a higher-level programming language that can be portable across multiple architectures. Software components that include higher-level programming language instructions can need to be translated via an interpreter or compiler before execution. Other examples of programming languages include, but are not limited to, macro languages, shell or command languages, job control languages, script languages, database query or search languages, or report writing languages. In one or more example embodiments, software components containing instructions in one of the above-described examples of programming languages can be executed directly by an operating system or other software components without first being converted into another form.

[0122] Software components can be stored as files or other data storage constructs. Software components of a similar type or related function can be stored together in a particular directory, folder, or library, for example. Software components can be static (e.g., pre-set or fixed) or dynamic (e.g., created or modified at execution time).

[0123] The embodiments of the present application described above with reference to the accompanying drawings are merely exemplary and are not intended to limit the present application. Various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application.

Claims

1. A method of stamping a sheet material, characterized by, The method comprises the following steps: Obtain the design file of the plate, which records the size information and processing information of the plate, and the plate is provided with a separation gap; Transport the plate to a processing track through a conveying device, and the processing track sequentially passes through a first punching machine and a second punching machine, the second punching machine is provided with a punching die set and a cutting die set, the punching die set comprises a plurality of punches with adjustable diameter and extension, the outlet of the processing track is provided with a separator, and the upper portion of the outlet of the processing track is further provided with a cutting device; According to the design file, divide the plate into a plurality of processing areas along the moving direction, divide the punching die set into a plurality of punching areas, and determine the punch group of each punching area, the processing area and the punching area are one-to-one corresponding, each punch group comprises a plurality of punches, and the region with the same distribution of through holes is one processing area; When the plate moves along the processing track in the moving direction, the first punching machine sequentially performs pre-punching on each processing area of the plate along the extension direction of the separation gap, and a plurality of interval distributed separation holes are formed in each processing area; the center of the separation hole is located on the same straight line as the separation gap, and the moving step of the plate is the length of one processing area; Each punch group of the punching die set of the second punching machine respectively punches the corresponding processing area to form a through hole with a corresponding size; The cutting die set sequentially punches the connecting section between a plurality of separation holes of each processing area to make the plurality of separation holes communicate with each other to form a separation groove; When the plate reaches the outlet of the processing track, the plate is separated into two plate pieces with the same size along the separation groove through the separator, and the plate is cut downward by the cutting device, so that the plate is equally divided into two plate pieces; The surface of the processing track is provided with a limiting hole with adjustable opening, and the determination of the punch group of each punching area comprises: According to the processing information, classify all the through holes in the processing area to obtain a plurality of through hole groups, and sort the processing sequence of the through hole groups; each through hole group corresponds to a punching area, and each through hole group comprises a plurality of through holes; According to the through hole arrangement mode of the through hole group and the processing sequence, the punch group of each punching area is sequentially set; The punches belonging to the punch group in the punching area are extended downward beyond the bottom surface of the punching die set, and the punches not belonging to the punch group are in a retracted state and located in the interior of the punching die set; According to the size of the through hole in each through hole group, the diameter of the punch of the punch group of each punching area is adjusted; wherein each punch is formed by a plurality of telescopic sleeves, and the diameter of the punch can be adjusted by controlling the extension state of each telescopic sleeve; According to the size of the through hole in each through hole group, the opening of each limiting hole of the processing track is determined, so that the punch matches the corresponding limiting hole. The processing information is used to classify all the through holes in the processing area, to obtain a plurality of through hole groups, and to sort the processing sequence of the through hole groups, comprising: a plurality of through holes with the same size are divided into the same through hole group, and a plurality of through hole groups corresponding to different sizes are obtained; one of the through hole groups located at the center of all the through hole groups is obtained as a center through hole group; the processing sequence of the center through hole group is arranged first, and the processing sequence of the remaining through hole groups is sorted according to the size or spacing of the through holes in the through hole groups.

2. The sheet material stamping method according to claim 1, wherein The processing sequence of the remaining through hole groups is sorted according to the size or spacing of the through holes in the through hole groups, comprising: for each through hole group except the center through hole group, the processing sequence of the through hole group is arranged in descending order of the size of the through holes in the through hole group, or in descending order of the spacing between the through holes in the through hole group; each arranged through hole group is divided into a first through hole group and a second through hole group, and the processing sequence of the second through hole group is arranged after the first through hole group; wherein the plurality of through holes of the first through hole group are distributed in a staggered manner with the plurality of through holes of the second through hole group, and the first through hole group and the second through hole group correspond to different punching areas.

3. The sheet material stamping method of claim 1 wherein, The first punching machine has a pre-punching die set; The first punching machine sequentially pre-punches each processing area of the plate along the extension direction of the separation gap to form a plurality of spaced-apart separation holes in each processing area, comprising: determining the position of the separation gap according to the design file; adjusting the pre-punching position of the pre-punching die set according to the position of the separation gap; sequentially pre-punching each processing area of the plate by the pre-punching die set to form a plurality of spaced-apart separation holes in each processing area, so that the center of the separation hole is located on the same straight line as the separation gap.

4. The sheet material stamping method of claim 1 wherein, The conveying device comprises a turntable, a driving mechanism and a step transmission mechanism, the turntable is provided with a containing groove for winding the plate, the driving mechanism is in transmission connection with the turntable, the step transmission mechanism is provided with a pressing member and a rotating rod, the pressing member is in transmission connection with the rotating rod, the rotating rod is provided with a sensing element, the sensing element is in electrical connection with the driving mechanism, and the first punching machine is provided with a pressing rod on one side close to the step transmission mechanism; The plate is conveyed to the processing track by the conveying device, comprising: the driving mechanism drives the rotation of the turntable; the step transmission mechanism feeds the plate according to a preset step, and the pressing member presses the plate; when the pressing rod presses the rotating rod, the rotating rod drives the pressing member to rise and release the plate; The inductive element sends an inductive signal to the driving mechanism, so that the driving mechanism drives the rotating disc to rotate by a preset angle, and when the rotating rod resets, the pressing piece is reset to press the plate.

5. The sheet material stamping method according to claim 4, wherein The outlet of the processing track is provided with a distance measuring element; the cutting device cuts the plate downward, so that the plate is equally divided into two plate pieces, comprising: According to the processing information, the first length of each plate piece is determined; Through the distance measuring element, the second length of the plate passing through the outlet of the processing track is obtained; When the first length is equal to the second length, the cutting device cuts the plate downward, so that the plate is equally divided into two plate pieces.

6. A plate punching device characterized by comprising: The memory is connected in communication with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to perform the plate stamping method according to any one of claims 1 to 5.

7. An electronic device, comprising: The plate stamping device according to claim 6.

8. A storage medium, characterized by The storage medium stores computer executable instructions for enabling a computer to execute the plate stamping method according to any one of claims 1 to 5.

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