Built-in adjustable guide plate liquid cooling case

Abstract

The invention relates to the technical field of liquid cooling cases, and particularly discloses a liquid cooling case with a built-in adjustable guide plate, comprising a liquid cooling element; the monitoring element is arranged on the side wall of the liquid cooling element and is used for monitoring an area with relatively high temperature in the case in real time; the control element is arranged in the liquid cooling element and is responsible for performing corresponding adjustment according to the temperature data provided by the monitoring element; wherein a higher temperature point in the case is obtained through the monitoring element, and the control element is adjusted to a corresponding position for diversion so as to optimize the local cooling liquid flow rate, and the local cooling liquid flow rate can be optimized by monitoring the temperature distribution in the case in real time and correspondingly adjusting the position and form of the diversion plate. The flow path of the cooling liquid can be flexibly optimized for different heating areas. Especially for a hot spot area, the local cooling liquid flow speed can be rapidly increased, it is ensured that key parts are effectively cooled in time, and the overheating phenomenon is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of liquid cooling machine cases, and particularly relates to a liquid cooling machine case with built-in adjustable guide plates. BACKGROUND

[0002] With the rapid development of information technology, the computing power of computer equipment, especially data centers, is continuously improved, leading to a continuous increase in equipment power density and heat density. The traditional air cooling method has been difficult to meet the growing heat dissipation needs of high-performance computing hardware due to its limited heat transfer efficiency. Therefore, liquid cooling technology emerges as a kind of efficient heat dissipation solution and is gradually applied to high-performance computing equipment.

[0003] Among many liquid cooling technologies, the single-phase immersion liquid cooling system has shown great potential in improving the stability of computing equipment due to its excellent heat transfer performance and the ability to avoid local hot spots. However, the traditional immersion liquid cooling system has a major challenge: the matching between the cooling liquid and the heat-generating components is not good, especially when dealing with high heat density areas, it is often difficult to achieve the ideal heat dissipation effect. This is mainly because the flow path of the cooling liquid is fixed and cannot be dynamically adjusted according to the actual heat generation, so that some hot spot areas cannot be effectively cooled. SUMMARY

[0004] Therefore, the technical problem to be solved by the present application is that the flow path of the cooling liquid is fixed and cannot be dynamically adjusted according to the actual heat generation, so that some hot spot areas cannot be effectively cooled.

[0005] The above technical problem is solved by the following technical scheme: the present application provides a liquid cooling machine case with built-in adjustable guide plates, which comprises a liquid cooling element constituting a cooling liquid circulation channel;

[0006] a monitoring element distributedly arranged on the inner wall of the liquid cooling element and the surface of the key heat-generating components of the computer mainboard, for real-time detection of temperature distribution in the case and positioning of hot spot areas;

[0007] a control element connected with the monitoring element, receiving temperature data and generating dynamic adjustment instructions, and the control element comprising a guide plate arranged inside the case.

[0008] Among them, the control element drives the guide plate to longitudinally displace and adjust the curvature according to the temperature gradient data fed back by the monitoring element, so as to change the flow direction and flow rate distribution of the gas.

[0009] In a preferred embodiment of the liquid cooling machine case with built-in adjustable guide plates according to the present application: the liquid cooling element comprises a case body, the inside of the case body is installed with a computer mainboard, and the computer mainboard contains a CPU, a graphics card, a power supply, a memory bar and a hard disk assembly.

[0010] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the liquid cooling element comprises a cooling liquid inlet arranged at the bottom end of the case body, and the top end of the case body is provided with a cooling liquid outlet.

[0011] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the monitoring element comprises a thermocouple arranged on the side wall of the case body, and the internal temperature of the case body is monitored by the thermocouple.

[0012] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the control element comprises a first connecting rod arranged inside the case body, and the first connecting rod drives the rotation of the reciprocating gear.

[0013] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the reciprocating gear drives the movement of the flow guide plate through a second connecting rod, wherein the flow guide plate is one or more plates arranged vertically close to the front wall of the case body and the height is adjustable.

[0014] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the reciprocating gear is connected to the first connecting rod and the second connecting rod through an eccentric wheel.

[0015] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, one end of the first connecting rod away from the reciprocating gear penetrates the case body and is connected to a manual knob.

[0016] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, the reciprocating gear is a double gear structure comprising a first gear and a second gear, and the first gear and the second gear are limited by a gourd cover.

[0017] In a preferred embodiment of the liquid cooling case with built-in adjustable flow guide plate, a limiting plate is installed on the side wall of the gourd cover, and the top end of the second connecting rod penetrates the limiting plate and is connected to a connecting plate.

[0018] The limiting plate and the connecting plate are both arranged in a U shape.

[0019] The beneficial effects of the present application are that by monitoring the temperature distribution inside the case in real time and adjusting the position and shape of the guide plate accordingly, the flow path of the cooling liquid can be flexibly optimized for different heat generating areas. In particular for hot spot areas, the local cooling liquid flow rate can be quickly increased to ensure timely and effective cooling of these critical parts and prevent overheating. The cambered surface design reduces the resistance of the cooling liquid during flow, allowing the cooling liquid to circulate more smoothly throughout the system. At the same time, by precisely controlling the height and curvature of the guide plate, the efficient heat dissipation of key areas can be ensured while maintaining balanced distribution of the overall cooling liquid flow, preventing local cooling unevenness. Compared with the traditional fixed cooling liquid channel design, the solution provided by the present application can be dynamically adjusted according to computer load changes or hardware configuration updates, greatly improving the adaptability and flexibility of the system. Whether facing short-term peak load or long-term stable operation, the optimal cooling solution can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present application, but not limit the present application. Among them:

[0021] Figure 1 The overall structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown;

[0022] Figure 2 The internal structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown;

[0023] Figure 3 The control element structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown;

[0024] Figure 4 The reciprocating gear and gourd sleeve position structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown;

[0025] Figure 5 The reciprocating gear and gourd sleeve cross-sectional structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown.

[0026] Figure 6 The guide plate structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown.

[0027] Figure 7 The guide plate cambered surface structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown.

[0028] Figure 8 The guide plate cambered surface structure schematic diagram of the liquid-cooled case with built-in adjustable guide plate is shown. DETAILED DESCRIPTION

[0029] For those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the specific embodiments and the accompanying drawings.

[0030] The terms used in the present application are those general terms currently widely used in the art in consideration of the functions of the present application, but these terms can vary according to the intention of those of ordinary skill in the art, precedents, or new technology in the art. In addition, specific terms can be selected by the applicant, and in this case, the detailed meaning thereof will be described in the detailed description of the present application. Therefore, the terms used in the specification should not be understood as simple names, but based on the meaning of the terms and the overall description of the present application.

[0031] Referring to Figure 1 The present embodiment provides an internal adjustable deflector liquid cooling case, comprising: obtaining information of a higher temperature point in the case by a monitoring element 2, and adjusting the deflector 34 to the corresponding position by a control element 3 to guide the flow, so as to optimize the local cooling liquid flow rate and achieve the purpose of efficient cooling.

[0032] The liquid cooling element 1 constitutes a cooling liquid circulation channel, which is responsible for cooling the inside of the case by circulating cooling liquid;

[0033] The monitoring element 2 is distributed on the inner wall of the liquid cooling element 1 and the surface of the key heat generating components of the computer mainboard 12, which is used to detect the temperature distribution in the case and locate the hot spot area in real time. Specifically, the monitoring element 2 is composed of a plurality of thermocouples 21, which are distributed at different heights inside the case body 11 to ensure accurate measurement of the temperature of each part in the case; and

[0034] The control element 3 is signal connected with the monitoring element 2, receives temperature data and generates dynamic adjustment instructions, and the control element 3 includes a deflector 34 arranged inside the case.

[0035] Among them, the control element 3 drives the deflector 34 to longitudinally displace and adjust the curvature according to the temperature gradient data fed back by the monitoring element 2, so as to change the flow direction and flow rate distribution of the gas.

[0036] First, the temperature information is transmitted to the control element 3 after the high-temperature sites in the cabinet body 11 are captured by the thermocouples 21 in the monitoring element 2. The control element 3 analyzes these data to determine which areas need to enhance heat dissipation, and generates corresponding control instructions. According to the control instructions, the system can drive the first connecting rod 31 to move through the manual knob 38 or automatic controller, and then drive the reciprocating gear 32 (including the first gear A and the second gear B) to rotate. In this process, the gourd cover 35 and the limiting plate 36 ensure the stability and accuracy of the mechanical structure, so that the second connecting rod 33 only moves in the vertical direction, thereby adjusting the position of the flow guide plate 34. By changing the position of the flow guide plate 34, the cooling liquid passage area of the corresponding area can be reduced, the flow rate of the local cooling liquid can be increased, and the temperature of the hot spot area can be effectively reduced.

[0037] Referring to Figure 2 As an optional embodiment, the liquid cooling element 1 includes a cabinet body 11, and the inside of the cabinet body 11 is installed with a computer mainboard 12 containing CPU, graphics card, power supply, memory bar, and hard disk assembly.

[0038] The liquid cooling element 1 includes a cooling liquid inlet 13 arranged at the bottom end of the cabinet body 11, and a cooling liquid outlet 14 arranged at the top end of the cabinet body 11. The computer mainboard 12 integrates the main hardware devices including CPU, graphics card, power supply, memory bar, and hard disk assembly. These devices will generate a large amount of heat during operation, and need an effective cooling mechanism to maintain performance and prolong service life. Therefore, the cooling liquid inlet 13 is arranged at the bottom end of the cabinet body 11, and the cooling liquid enters the cabinet internal circulation system through the inlet. The cooling liquid outlet 14 arranged at the top end of the cabinet body 11 allows the cooling liquid that has absorbed heat to flow out, thereby completing a complete heat exchange process.

[0039] The monitoring element 2 includes thermocouples 21 arranged on the side wall of the cabinet body 11. The thermocouples 21 can accurately detect the temperature changes at different positions in the cabinet, and pay special attention to the key areas that are prone to overheating, such as the positions near the CPU and the graphics card.

[0040] When the computer starts running, the liquid cooling system starts synchronously, and the cooling liquid flows into the inside of the cabinet body 11 from the cooling liquid inlet 13, and circulates around the computer mainboard 12 and other heat-emitting elements. In this process, the cooling liquid absorbs the heat emitted by these elements. At the same time, the thermocouples 21 continuously monitor the temperature in the cabinet and feed back the data to the control element. Once the temperature of a certain area exceeds the set safety range, the position of the flow guide plate is adjusted to enhance the local cooling effect. Finally, the heated cooling liquid is discharged through the cooling liquid outlet 14 located at the top of the cabinet, and is cooled by the external heat dissipation device before being recycled.

[0041] Reference Figures 2-5 In one embodiment provided in the present application, the control element 3 comprises a first connecting rod 31 arranged inside the cabinet body 11, which drives the reciprocating gear 32 to rotate.

[0042] The reciprocating gear 32 drives the guide plate 34 to move through the second connecting rod 33, wherein the guide plate 34 is one or more layers of plates arranged vertically near the front wall of the cabinet body 11, and the height is adjustable.

[0043] The reciprocating gear 32 is connected to the first connecting rod 31 and the second connecting rod 33 as an eccentric wheel.

[0044] The end of the first connecting rod 31 away from the reciprocating gear 32 penetrates the cabinet body 11 and is connected to the manual knob 38.

[0045] The reciprocating gear 32 is a double gear structure, which is a first gear A and a second gear B, and the first gear A and the second gear B are limited by the gourd cover 35.

[0046] The sidewall of the gourd cover 35 is provided with a limiting plate 36, and the top end of the second connecting rod 33 penetrates the limiting plate 36 and is connected to the connecting plate 37.

[0047] Among them, the limiting plate 36 and the connecting plate 37 are both arranged in a U shape, which can play a guiding and supporting role during the up and down movement of the second connecting rod 33, preventing it from shifting horizontally or shaking, thereby ensuring the stability and accuracy of the movement of the guide plate 34.

[0048] It should be noted that the thermocouple 21 is used to detect the temperature of each area inside the cabinet body 11 in real time. These thermocouples are distributed at different heights to ensure accurate measurement of the temperature of each part of the cabinet. Once the thermocouple 21 captures a high-temperature site inside the cabinet body 11, it will transmit the temperature data to the control element 3. The control element 3 analyzes which areas need to enhance heat dissipation according to the received temperature information and generates corresponding control instructions accordingly.

[0049] After the control instruction is issued, the first connecting rod 31 can drive the reciprocating gear 32 to rotate by rotating the manual knob 38 or by automatic controller. When the first connecting rod 31 drives the first gear A to rotate, it drives the second gear B to rotate around the first connecting rod 31 as the center, wherein the first gear A and the second gear B are rotationally connected to the gourd cover 35, so that the first gear A drives the second gear B to rotate in the process of limiting by the gourd cover 35, so that the gourd cover 35 moves. Since the limiting plate 36 limits the second connecting rod 33, the eccentrically connected first gear A and second gear B will only drive the second connecting rod 33 to move up and down, not left and right. The guide plate 34 is one or more layers of plates arranged vertically near the front wall of the cabinet, and the height can be adjusted according to actual needs.

[0050] As the second connecting rod 33 changes the position of the deflector 34, the cooling liquid passage area of the corresponding area can be reduced, thereby increasing the local cooling liquid flow rate. This increase in local flow rate can significantly improve heat transfer efficiency and effectively reduce the temperature of the hot spot area.

[0051] To ensure the stability and reliability of the entire system, the reciprocating gear 32 is limited by the gourd cover 35. The limiting plate 36 and the connecting plate 37 are both U-shaped, which further enhances the stability of the system.

[0052] Referring to Figures 6-7 In some embodiments, the difference between this embodiment and the previous embodiment is that the edge of the deflector 34 is changed from a right-angle structure to a structure with curved features (such as Figure 7 ). The curved deflector 34 can have different radii of curvature at different positions, allowing it to more flexibly and efficiently guide the cooling liquid to flow along the preset path.

[0053] For example, in the area close to the heat source (such as CPU or graphics card), the deflector 34 adopts a smaller radius of curvature design to locally shrink the cooling liquid passage, increase the flow rate, and enhance the heat exchange efficiency; while in the area away from the heat source, a larger radius of curvature is adopted to expand the flow channel space, maintain the uniformity of the overall flow distribution of the cooling liquid, and avoid problems such as local flow stagnation or excessive pressure loss.

[0054] Compared with the traditional right-angle deflector, the curved structure can reduce the turbulent disturbance and local resistance of the cooling liquid during flow, allowing the fluid to pass through the deflector area more smoothly and reducing system energy consumption. By setting a smaller radius of curvature of the curved surface in the hot spot area, the local flow rate can be effectively improved without increasing the pump power, thereby significantly improving the heat dissipation efficiency. In the non-high-heat area, a larger radius of curvature design is adopted, which helps to maintain the uniform distribution of the cooling liquid in the entire chassis, preventing local overheating or insufficient cooling caused by uneven flow. The curved deflector can be flexibly designed according to the internal structure of the chassis, better adapting to complex layouts and improving the cooling efficiency in limited space.

[0055] Referring to Figure 8 In some embodiments, the main difference between this embodiment and the previous embodiment is that the right-angle edge of the deflector 34 is changed to an arc surface design. Specifically, unlike the curved surface with variable radius of curvature used previously, the arc surface here refers to a surface with a single, smooth curved profile, which aims to simplify the manufacturing process while retaining the ability to optimize the cooling liquid flow path.

[0056] Due to the relatively simple design of the curved surface, the production process requirements are lower, which helps to reduce production costs and speed up the production cycle. Compared with the right-angle structure, the curved surface can provide a smoother channel, reducing the friction loss during the flow of the cooling liquid, thereby improving the overall system energy efficiency ratio. The curved surface design reduces the probability of cooling liquid turbulence, helping to maintain a stable flow state and avoid additional vibration or noise problems caused by turbulence. Although the curved surface does not control the flow rate at each point as precisely as a surface with variable curvature, for most application scenarios, it is already effective enough to guide the cooling liquid flow and can be flexibly arranged inside the case according to actual needs.

[0057] Finally, it should be pointed out that the methods and devices described in detail above are only embodiments, and those skilled in the art can modify these embodiments in different ways without departing from the scope of the present application.

Claims

1. A liquid-cooled chassis with a built-in adjustable baffle, characterized in that: include, Liquid cooling element (1) forms a coolant circulation channel; Monitoring elements (2) are distributed on the inner wall of the liquid cooling element (1) and the surface of key heat-generating components of the computer motherboard (12) to detect the temperature distribution inside the chassis in real time and locate hot spots. The control element (3) is connected to the monitoring element (2) by signal, receives temperature data and generates dynamic adjustment commands, and the control element (3) includes a baffle (34) disposed inside the chassis; The control element (3) drives the guide plate (34) to adjust its longitudinal displacement and curvature based on the temperature gradient data fed back by the monitoring element (2), so as to change the gas flow direction and velocity distribution.

2. The liquid-cooled chassis with built-in adjustable guide plate according to claim 1, characterized in that: The liquid cooling component (1) includes a chassis body (11), and the computer motherboard (12) includes a CPU, graphics card, power supply, memory module, and hard disk assembly.

3. The liquid-cooled chassis with built-in adjustable guide plate according to claim 2, characterized in that: The liquid cooling element (1) includes a coolant inlet (13) at the bottom of the chassis body (11) and a coolant outlet (14) at the top of the chassis body (11).

4. The liquid-cooled chassis with built-in adjustable guide plate according to claim 3, characterized in that: The monitoring element (2) includes a thermocouple (21) disposed on the side wall of the chassis body (11), and the temperature inside the chassis body (11) is monitored by the thermocouple (21).

5. The liquid-cooled chassis with built-in adjustable guide plate according to claim 4, characterized in that: The control element (3) includes a first link (31) disposed inside the chassis body (11), the first link (31) driving the reciprocating gear (32) to rotate.

6. The liquid-cooled chassis with built-in adjustable guide plate according to claim 5, characterized in that: The reciprocating gear (32) drives the guide plate (34) to move via the second connecting rod (33). The guide plate (34) is one or more layers of plates, arranged vertically near the front wall of the chassis body (11), and its height is adjustable.

7. The liquid-cooled chassis with built-in adjustable guide plate according to claim 6, characterized in that: The reciprocating gear (32) is connected to the first connecting rod (31) and the second connecting rod (33) by an eccentric wheel.

8. The liquid-cooled chassis with built-in adjustable guide plate according to claim 7, characterized in that: The end of the first connecting rod (31) away from the reciprocating gear (32) passes through the chassis body (11) and is connected to the manual knob (38).

9. The liquid-cooled chassis with built-in adjustable guide plate according to claim 8, characterized in that: The reciprocating gear (32) is a double gear structure consisting of a first gear (A) and a second gear (B), which are limited by a gourd cover (35).

10. The liquid-cooled chassis with built-in adjustable guide plate according to claim 9, characterized in that: The side wall of the gourd cover (35) is equipped with a limiting plate (36), and the top end of the second connecting rod (33) passes through the limiting plate (36) and connects to the connecting plate (37); The limiting plate (36) and the connecting plate (37) are both U-shaped.

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