Computer power supply overheating protection device and use method

Abstract

The invention discloses a computer power supply overheat protection device and a use method, and relates to the technical field of overheat protection, the computer power supply overheat protection device comprises a mounting frame, a power box is fixedly mounted in the mounting frame, an air outlet is formed in the rear side of the power box, and a condensation air supply mechanism is mounted in the mounting frame; the condensation air supply mechanism is located on the front side of the power box and extends into the power box, and the condensation air supply mechanism is used for supplying dry and low-temperature air into the power box to cool a computer power supply; an air-cooling heat dissipation function can be provided through the fan, a water-cooling heat dissipation function can be provided through cooperation of the circulating pump and the coil pipe, and active refrigeration treatment can be performed on air-cooled air and water-cooled water through cooperation of the semiconductor refrigeration sheet and the second fins during air-cooling and water-cooling heat dissipation, so that the overheating protection performance of a computer power supply is greatly improved, and the service life of the computer power supply is prolonged. And meanwhile, the problem that the water cooling effect is reduced due to gradual temperature rise of condensate during water cooling heat dissipation is also avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of overheat protection, in particular to a computer power supply overheat protection device and a use method thereof. BACKGROUND

[0002] Computer hardware refers to various physical devices composed of electronic, mechanical and optoelectronic elements in a computer system, and the computer power supply is one of the computer hardware. When the computer power supply is used, a certain amount of heat is generated. When the heat cannot be dissipated and cooled in time, the computer power supply is prone to damage. Therefore, an overheat protection device or a component with similar functions is usually installed on the computer power supply.

[0003] According to the search, a computer hardware overheat protection device is disclosed in Chinese Patent No. CN113589908B. The device comprises a shell, a hardware body fixed in the shell and an air-cooled box fixed on the side wall of the shell. An opening is formed in the air-cooled box, the opening is in communication with the shell, a fan is fixed on the opening, a dust screen is fixed on the opening, a heat-conducting sheet is fixed on the side of the hardware body away from the fan, a condenser pipe is fixed on the heat-conducting sheet, a circulating pump is fixed at one end of the condenser pipe, the output port of the circulating pump is fixedly connected with the other end of the condenser pipe, a filter screen is arranged on the condenser pipe, a take-out plate is rotatably arranged on the condenser pipe, a sealing ring is fixed on the end of the take-out plate close to the inner side of the condenser pipe, a switch assembly for closing the opening is arranged on the opening, and a cleaning assembly for injecting liquid into the opening is arranged on the opening.

[0004] When the above-mentioned document protects the computer hardware from overheating, the fan provides air cooling function, and the circulating pump cooperates with the condenser pipe to circulate the cooling liquid to realize water cooling function. Although the water cooling function has better overheat protection capacity than the single air cooling, in actual use, the air cooling still mainly relies on natural temperature air, and the water cooling function for heat replacement also relies on natural temperature cooling liquid. After long-time use, the cooling liquid cannot absorb too much heat in time and cannot be cooled in time, which gradually reduces the water cooling capacity and leads to poor overheat protection performance.

[0005] Therefore, to solve the above-mentioned problems, the application provides a computer power supply overheat protection device and a use method thereof. SUMMARY

[0006] The application provides a computer power supply overheat protection device and a use method thereof to solve the above-mentioned technical problems.

[0007] To solve the above-mentioned technical problems, the application provides a computer power supply overheat protection device, which comprises a mounting frame, a power supply box is fixedly installed in the mounting frame, a computer power supply is placed in the power supply box, and an air outlet is formed in the rear side of the power supply box.

[0008] The mounting frame is equipped with a condensing air supply mechanism located at the front of the power supply box and extending into the power supply box. The condensing air supply mechanism is used to supply dry and low-temperature air into the power supply box to cool the computer power supply.

[0009] Preferably, the condensing air supply mechanism includes a housing, which is fixedly connected inside the mounting frame and located in front of the power supply box. A refrigeration mechanism is installed inside the housing, and a connecting pipe is fixedly connected between the power supply box and the housing. A condensing pipe is provided in front of the housing, and a funnel box is fixedly connected to the air inlet at the top of the condensing pipe. A fan is embedded in the top of the funnel box, and the funnel box is fixedly connected to the top of the mounting frame by bolts. A first air duct is fixedly connected to the air outlet at the bottom of the condensing pipe, and two second air ducts are fixedly connected to the end of the first air duct via a tee. The ends of the second air ducts are fixedly connected to the front side of the housing.

[0010] Preferably, a first partition and a second partition are fixedly connected inside the box body. The second partition is located on one side of the first partition. The first partition and the second partition divide the inside of the box body into a hot end chamber, a cold end chamber, and a water chamber distributed from right to left. Two second air ducts are respectively connected to the inside of the hot end chamber and the cold end chamber. The connecting pipe is connected to the inside of the cold end chamber. A regulating valve is installed on the second air duct connected to the hot end chamber.

[0011] Preferably, the refrigeration mechanism includes a semiconductor refrigeration chip, which is embedded in the first partition plate. The cold end and hot end of the semiconductor refrigeration chip correspond to the cold end chamber and the hot end chamber, respectively. The hot end chamber and the cold end chamber are respectively fixedly connected with a first fin and a second fin, and the first fin and the second fin are in contact with the hot end and the cold end of the semiconductor refrigeration chip, respectively. The second fin is located inside the cold end chamber and extends into the water cavity.

[0012] Preferably, the condensing air supply mechanism further includes a coil, which is fixedly connected to the inner wall of the power supply box. An outlet pipe and an inlet pipe are fixedly connected to both ends of the coil, respectively. A circulation pump is fixedly connected to the end of the inlet pipe, and the outlet of the circulation pump is fixedly connected to the inlet pipe. The circulation pump is fixedly connected to the top of the box body. A first water pipe is fixedly connected to the inlet of the circulation pump, and the end of the first water pipe is fixedly connected to the outlet of the condensing pipe. A second water pipe is fixedly connected to the inlet of the condensing pipe. The ends of the second water pipe and the outlet pipe are fixedly connected to the front and rear sides of the box body, respectively, and both the second water pipe and the outlet pipe are connected to the interior of the water chamber.

[0013] Preferably, a condensate pipe is fixedly connected to the bottom of the first duct, a condensate box is fixedly connected to the end of the condensate pipe, a drain pipe is fixedly connected to the bottom of one side of the condensate box, and a solenoid valve is installed on the drain pipe.

[0014] Preferably, an exhaust pipe is fixedly connected to the rear side of the box, and the exhaust pipe is connected to the interior of the hot end chamber.

[0015] Preferably, a water inlet pipe is fixedly connected to one side of the top of the box, and a drain pipe is fixedly connected to the bottom of one side of the box. Both the water inlet pipe and the drain pipe are connected to the inside of the water cavity, and both the water inlet pipe and the drain pipe are fitted with plugs.

[0016] Preferably, a controller is fixedly connected inside the mounting frame, and the condensing air supply mechanism is electrically connected to the controller.

[0017] The present invention also provides a method of using a computer power supply overheat protection device, comprising the following steps:

[0018] S1. When the computer power supply inside the power supply box overheats, the controller will simultaneously start the circulating pump, semiconductor cooling chip and fan in the condenser air supply mechanism.

[0019] S2. When the fan is running, it can draw in outside natural air into the funnel box and blow it towards the condenser tube. Then it is discharged through the first air duct and enters the hot end chamber and cold end chamber through two second air ducts respectively. When the semiconductor cooling chip is running, the first fin heats up and the second fin cools down. At this time, the air entering the cold end chamber is cooled by the second fin and becomes cold air. Then it enters the power supply box through the connecting pipe and blows it towards the computer power supply for heat dissipation and cooling. The air entering the hot end chamber can dissipate heat on the first fin, that is, dissipate heat on the hot end of the semiconductor cooling chip. Finally, the hot air is discharged through the exhaust pipe.

[0020] S3. When the computer power supply in the power supply box is cooled by low-temperature air cooling, the circulation pump can run to form a passage through the coil, outlet pipe, inlet pipe, first water pipe, condenser pipe, second water pipe and the inside of the water cavity, and the coolant can circulate. When the coolant is inside the water cavity, it is continuously cooled by the second fins to maintain a low temperature. Then, when it flows through the coil, it can perform heat exchange on the heat inside the power supply box, thereby cooling the computer power supply. When the coolant flows through the condenser pipe, it can condense the air passing through it, so that the moisture in the air condenses into liquid. Finally, the relatively dry air will enter the cold end cavity for cooling and heat dissipation of the computer power supply.

[0021] S4. The condensate formed by the air passing through the condenser tube will enter the condensate box through the condensate pipe when it flows into the first air duct, and the condensate inside the condensate box can be discharged through the drain pipe.

[0022] Compared with related technologies, the computer power supply overheat protection device and its usage method provided by the present invention have the following beneficial effects:

[0023] 1. The fan provides air cooling, and the circulating pump with coils provides water cooling. While providing air and water cooling, the semiconductor cooling chip with the second fin actively cools the air and water, which greatly improves the overheat protection performance of the computer power supply and avoids the problem of the condensate gradually heating up and reducing the water cooling effect during water cooling.

[0024] 2. By installing a condenser tube between the fan and the power supply box, the condensate from the water cooling function enters the condenser tube to condense the air blown out by the fan, thereby condensing the moisture in the air. The air is then blown into the power supply box for air cooling. This process not only cools the air in advance but also removes most of the moisture in the air, thus preventing excessively humid air from blowing onto the computer power supply and causing damage. It has a good moisture-proof function and extends the service life of the computer power supply. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention from a first-view perspective;

[0026] Figure 2 This is a schematic diagram of the overall structure of the present invention from a second perspective;

[0027] Figure 3 This is a schematic diagram of the internal structure of the power supply box of the present invention;

[0028] Figure 4 This is a partial structural diagram of the condenser air supply mechanism of the present invention. Figure 1 ;

[0029] Figure 5 This is a schematic cross-sectional view of the box structure of the present invention;

[0030] Figure 6 This is a partial structural diagram of the condenser air supply mechanism of the present invention. Figure 2 .

[0031] The diagram is labeled as follows: 1. Mounting frame, 2. Power supply box, 3. Air outlet, 4. Coil, 5. Liquid outlet pipe, 6. Liquid inlet pipe, 7. Box body, 8. Connecting pipe, 9. First partition, 10. Second partition, 11. Hot end chamber, 12. Cold end chamber, 13. Water chamber, 14. Semiconductor cooling chip, 15. First fin, 16. Second fin, 17. Condensate tube, 18. Funnel box, 19. Fan, 20. First air duct, 21. Second air duct, 22. Regulating valve, 23. Condensate pipe, 24. Condensate box, 25. Drain pipe, 26. Circulation pump, 27. First water pipe, 28. Second water pipe, 29. Water inlet pipe, 30. Drain pipe, 31. Exhaust pipe, 32. Controller. Detailed Implementation

[0032] Please see Figures 1-6 The technical solution provided by the present invention specifically includes the following embodiments:

[0033] A computer power supply overheat protection device includes a mounting frame 1, a power supply box 2 is fixedly installed inside the mounting frame 1, the power supply box 2 is used to house the computer power supply, and an air outlet 3 is provided on the rear side of the power supply box 2.

[0034] The mounting frame 1 is equipped with a condensing air supply mechanism, which is located on the front side of the power supply box 2 and extends into the power supply box 2. The condensing air supply mechanism is used to supply dry and low-temperature air into the power supply box 2 to cool the computer power supply.

[0035] The condensing air supply mechanism includes a housing 7, which is fixedly connected inside the mounting frame 1 and located in front of the power supply box 2. A refrigeration mechanism is installed inside the housing 7. A connecting pipe 8 is fixedly connected between the power supply box 2 and the housing 7. A condensing pipe 17 is provided in front of the housing 7. A funnel box 18 is fixedly connected to the air inlet at the top of the condensing pipe 17. A fan 19 is embedded in the top of the funnel box 18. The funnel box 18 is fixedly connected to the top of the mounting frame 1 by bolts. A first air duct 20 is fixedly connected to the air outlet at the bottom of the condensing pipe 17. Two second air ducts 21 are fixedly connected to the end of the first air duct 20 through a tee. The ends of the second air ducts 21 are fixedly connected to the front side of the housing 7.

[0036] The housing 7 is used to install the refrigeration mechanism to actively cool the air during air cooling and water cooling to improve the heat dissipation effect. When the fan 19 provides air power for air cooling, the refrigeration mechanism in the housing 7 can cool the air, thereby improving the air cooling effect. The funnel box 18 allows the air power of the fan 19 to be concentrated into the condenser tube 17 when the fan 19 is running.

[0037] The box body 7 is fixedly connected to a first partition 9 and a second partition 10. The second partition 10 is located on one side of the first partition 9. The first partition 9 and the second partition 10 divide the interior of the box body 7 into a hot end chamber 11, a cold end chamber 12 and a water chamber 13 distributed from right to left. Two second air ducts 21 are respectively connected to the interior of the hot end chamber 11 and the cold end chamber 12. The connecting pipe 8 is connected to the interior of the cold end chamber 12. A regulating valve 22 is installed on the second air duct 21 that is connected to the hot end chamber 11.

[0038] The housing 7 contains a hot-end chamber 11, a cold-end chamber 12, and a water chamber 13. The hot-end chamber 11 is mainly used to install the first fin 15 for heat dissipation of the thermoelectric cooler 14. The cold-end chamber 12 is mainly used to install the second fin 16 to actively cool the airflow of the thermoelectric cooler 14 and to cool the condensate in the water chamber 13. When the airflow provided by the fan 19 is directed into the hot-end chamber 11, the airflow can be adjusted by the regulating valve 22. Only a portion of the airflow needs to be directed to the first fin 15 for heat dissipation of the hot end of the thermoelectric cooler 14. Most of the airflow needs to be directed into the cold-end chamber 11 for cooling, and finally directed into the power supply box 2 to cool the computer power supply and provide overheat protection. The power supply box 2 has a built-in temperature sensor, which, in conjunction with the controller 32, can activate the condenser air supply mechanism in a timely manner for overheat protection of the computer power supply.

[0039] The refrigeration mechanism includes a semiconductor refrigeration chip 14, which is embedded in the first partition plate 9. The cold end and the hot end of the semiconductor refrigeration chip 14 correspond to the cold end chamber 12 and the hot end chamber 11, respectively. A first fin 15 and a second fin 16 are fixedly connected inside the hot end chamber 11 and the cold end chamber 12, respectively. The first fin 15 and the second fin 16 are in contact with the hot end and the cold end of the semiconductor refrigeration chip 14, respectively. The second fin 16 is located inside the cold end chamber 12 and extends into the water chamber 13.

[0040] When the semiconductor cooling chip 14 is running, its two sides are the cold end and the hot end, respectively. The first fin 15 is used to dissipate heat from the hot end of the semiconductor cooling chip 14, while the second fin 16 is used to cooperate with the cold end of the semiconductor cooling chip 14 so that the air-cooled air entering the cold end chamber 12 is actively cooled, and the water-cooled water in the water chamber 13 is also actively cooled by the coolant.

[0041] The condensing air supply mechanism also includes a coil 4, which is fixedly connected to the inner wall of the power supply box 2. A liquid outlet pipe 5 and a liquid inlet pipe 6 are fixedly connected to both ends of the coil 4, respectively. A circulation pump 26 is fixedly connected to the end of the liquid inlet pipe 6. The liquid inlet pipe 6 is fixedly connected to the outlet of the circulation pump 26. The circulation pump 26 is fixedly connected to the top of the box body 7. A first water pipe 27 is fixedly connected to the inlet of the circulation pump 26. The end of the first water pipe 27 is fixedly connected to the outlet of the condenser pipe 17. A second water pipe 28 is fixedly connected to the inlet of the condenser pipe 17. The end of the second water pipe 28 and the end of the liquid outlet pipe 5 are fixedly connected to the front and rear sides of the box body 7, respectively. Both the second water pipe 28 and the liquid outlet pipe 5 are connected to the inside of the water cavity 13.

[0042] Coil 4, in conjunction with circulation pump 26, enables the circulation of coolant for water cooling of the computer power supply. Simultaneously, it enters condenser coil 17 to condense the air blown by fan 19. The air blown in by fan 19, upon encountering the coolant inside condenser coil 17, condenses the moisture in the air into water droplets that slide down. The relatively dry and initially cooled air then enters hot-end chamber 11 to dissipate heat from the hot end of thermoelectric cooler 14, and then enters cold-end chamber 12 for further cooling by the cold end of thermoelectric cooler 14, before finally being blown into the power supply box 2 for use. For power supply cooling, the coolant remains at a low temperature after being discharged from the condenser tube 17. It then enters the coil 4 for internal water cooling of the power supply box 2. After the coolant absorbs a large amount of heat in the coil 4 and is discharged, it immediately enters the water chamber 13 for active cooling to ensure that the coolant always remains at a low temperature. This avoids the problem of the coolant gradually increasing in temperature over a long period of use, which would reduce the water cooling effect. The coolant entering the condenser tube 17 is at its lowest temperature, so the condensation effect on moisture in the air is always at its best.

[0043] A condensate pipe 23 is fixedly connected to the bottom of the first air duct 20. A condensate box 24 is fixedly connected to the end of the condensate pipe 23. A drain pipe 25 is fixedly connected to the bottom of one side of the condensate box 24. A solenoid valve is installed on the drain pipe 25. Water droplets condensed by the condenser pipe 17 fall downwards and are eventually discharged into the condensate box 24 through the condensate pipe 23 for unified collection. When discharge is required, it can be discharged through the drain pipe 25. The specific discharge timing can be controlled by the controller 32 to open or close the solenoid valve.

[0044] An exhaust pipe 31 is fixedly connected to the rear side of the box body 7. The exhaust pipe 31 is connected to the interior of the hot end chamber 11. The exhaust pipe 31 can be used to exhaust hot air when the hot end of the semiconductor cooling chip 14 in the hot end chamber 11 dissipates heat.

[0045] A water inlet pipe 29 is fixedly connected to one side of the top of the box body 7, and a drain pipe 30 is fixedly connected to the bottom of one side of the box body 7. Both the water inlet pipe 29 and the drain pipe 30 are connected to the inside of the water cavity 13, and both the water inlet pipe 29 and the drain pipe 30 are fitted with plugs. Coolant can be added to the water cavity 13 through the water inlet pipe 29, and the coolant in the water cavity 13 can be discharged through the drain pipe 30, so that the coolant can be replaced regularly. The coolant can be made directly from clean water.

[0046] The mounting frame 1 is fixedly connected to a controller 32. The condensing air supply mechanism is electrically connected to the controller 32. The controller 32 is electrically connected to the semiconductor cooling chip 14, the fan 19, the circulating pump 26, the solenoid valve, and the temperature sensor built into the power supply box 2.

[0047] This invention also provides a method of using a computer power supply overheat protection device, comprising the following steps:

[0048] S1. When the computer power supply inside the power supply box 2 overheats, the controller 32 will simultaneously start the circulating pump 26, the semiconductor cooling chip 14 and the fan 19 in the condenser air supply mechanism.

[0049] S2. When the fan 19 is running, it can draw in the outside natural air into the funnel box 18 and blow it towards the condenser tube 17. Then it is discharged through the first air duct 20 and enters the hot end chamber 11 and the cold end chamber 12 through the two second air ducts 21 respectively. When the semiconductor cooling chip 14 is running, the first fin 15 heats up and the second fin 16 cools down. At this time, the air entering the cold end chamber 12 is cooled by the second fin 16 and becomes cold air. Then it enters the power supply box 2 through the connecting pipe 8 and blows it towards the computer power supply for heat dissipation and cooling. The air entering the hot end chamber 11 can dissipate heat on the first fin 15, that is, dissipate heat on the hot end of the semiconductor cooling chip 14. Finally, the hot air is discharged through the exhaust pipe 31.

[0050] S3. When the computer power supply in the power supply box 2 is cooled by low-temperature air cooling, the circulation pump 26 can run to form a passage in the coil 4, the outlet pipe 5, the inlet pipe 6, the first water pipe 27, the condenser pipe 17, the second water pipe 28 and the water cavity 13, and the coolant can circulate. When the coolant is in the water cavity 13, it will be continuously cooled by the second fin 16 to keep it at a low temperature. Then, when it flows through the coil 4, it can perform heat exchange on the heat inside the power supply box 2, thereby cooling the computer power supply. When the coolant flows through the condenser pipe 17, it can condense the air passing through it, so that the moisture in the air condenses into liquid. Finally, the relatively dry air will enter the cold end chamber 12 for cooling and heat dissipation of the computer power supply.

[0051] S4. The condensate that is condensed from the air passing through the condenser tube 17 will enter the condensate box 24 through the condensate tube 23 when it flows into the first air duct 20, and be collected in a unified manner. The condensate inside the condensate box 24 can be discharged through the discharge tube 25.

Claims

1. A computer power supply overheat protection device, comprising a mounting frame (1), characterized in that: The power supply box (2) is fixedly installed inside the mounting frame (1). The power supply box (2) is used to house the computer power supply, and an air outlet (3) is opened on the rear side of the power supply box (2). The mounting frame (1) is equipped with a condensing air supply mechanism. The condensing air supply mechanism is located on the front side of the power supply box (2) and extends into the power supply box (2). The condensing air supply mechanism is used to supply dry and low-temperature air into the power supply box (2) to cool the computer power supply.

2. The computer power supply overheat protection device according to claim 1, characterized in that, The condensing air supply mechanism includes a box (7), which is fixedly connected inside the mounting frame (1) and located in front of the power supply box (2). A refrigeration mechanism is installed inside the box (7). A connecting pipe (8) is fixedly connected between the power supply box (2) and the box (7). A condensing pipe (17) is provided in front of the box (7). A funnel box (18) is fixedly connected to the air inlet at the top of the condensing pipe (17). A fan (19) is embedded in the top of the funnel box (18). The funnel box (18) is fixedly connected to the top of the mounting frame (1) by bolts. A first air duct (20) is fixedly connected to the air outlet at the bottom of the condensing pipe (17). Two second air ducts (21) are fixedly connected to the end of the first air duct (20) through a tee. The end of the second air duct (21) is fixedly connected to the front side of the box (7).

3. A computer power supply overheat protection device according to claim 2, characterized in that, The box body (7) is fixedly connected to a first partition (9) and a second partition (10). The second partition (10) is located on one side of the first partition (9). The first partition (9) and the second partition (10) divide the inside of the box body (7) into a hot end chamber (11), a cold end chamber (12) and a water chamber (13) distributed from right to left. Two second air ducts (21) are respectively connected to the inside of the hot end chamber (11) and the cold end chamber (12). The connecting pipe (8) is connected to the inside of the cold end chamber (12). A regulating valve (22) is installed on the second air duct (21) that is connected to the hot end chamber (11).

4. A computer power supply overheat protection device according to claim 3, characterized in that, The refrigeration mechanism includes a semiconductor refrigeration chip (14), which is embedded in the first partition (9). The cold end and the hot end of the semiconductor refrigeration chip (14) correspond to the cold end chamber (12) and the hot end chamber (11) respectively. The hot end chamber (11) and the cold end chamber (12) are respectively fixedly connected with a first fin (15) and a second fin (16). The first fin (15) and the second fin (16) are in contact with the hot end and the cold end of the semiconductor refrigeration chip (14) respectively. The second fin (16) is located inside the cold end chamber (12) and extends into the water chamber (13).

5. A computer power supply overheat protection device according to claim 3, characterized in that, The condensing air supply mechanism also includes a coil (4), which is fixedly connected to the inner wall of the power supply box (2). The two ends of the coil (4) are respectively fixedly connected to an outlet pipe (5) and an inlet pipe (6). The end of the inlet pipe (6) is fixedly connected to a circulation pump (26). The inlet pipe (6) is fixedly connected to the outlet of the circulation pump (26). The circulation pump (26) is fixedly connected to the top of the box body (7). The inlet of the circulation pump (26) is fixedly connected to a first water pipe (27). The end of the first water pipe (27) is fixedly connected to the outlet of the condenser pipe (17). The inlet of the condenser pipe (17) is fixedly connected to a second water pipe (28). The end of the second water pipe (28) and the end of the outlet pipe (5) are respectively fixedly connected to the front and rear sides of the box body (7). The second water pipe (28) and the outlet pipe (5) are both connected to the inside of the water cavity (13).

6. A computer power supply overheat protection device according to claim 2, characterized in that, The bottom of the first duct (20) is fixedly connected to a condensate pipe (23), the end of the condensate pipe (23) is fixedly connected to a condensate box (24), the bottom of one side of the condensate box (24) is fixedly connected to a discharge pipe (25), and a solenoid valve is installed on the discharge pipe (25).

7. A computer power supply overheat protection device according to claim 3, characterized in that, The rear side of the box (7) is fixedly connected to an exhaust pipe (31), which is connected to the interior of the hot end chamber (11).

8. A computer power supply overheat protection device according to claim 3, characterized in that, A water inlet pipe (29) is fixedly connected to one side of the top of the box (7), and a drain pipe (30) is fixedly connected to the bottom of one side of the box (7). Both the water inlet pipe (29) and the drain pipe (30) are connected to the inside of the water cavity (13), and both the water inlet pipe (29) and the drain pipe (30) are fitted with plugs.

9. A computer power supply overheat protection device according to claim 1, characterized in that, The mounting frame (1) is internally fixedly connected to a controller (32), and the condensing air supply mechanism is electrically connected to the controller (32).

10. A method of using a computer power supply overheat protection device according to any one of claims 1-9, characterized in that, Includes the following steps: S1. When the computer power supply inside the power supply box (2) overheats, the controller (32) will simultaneously start the circulating pump (26), the semiconductor cooling chip (14) and the fan (19) in the condenser air supply mechanism. S2. When the fan (19) is running, it can draw in the outside natural air into the funnel box (18) and blow it towards the condenser tube (17), and then exhaust it through the first air duct (20) and enter the hot end chamber (11) and cold end chamber (12) through the two second air ducts (21) respectively. When the semiconductor cooling chip (14) is running, the first fin (15) heats up and the second fin (16) cools down. At this time, the air entering the cold end chamber (12) is cooled down by the second fin (16) and becomes cold air. Then it enters the power supply box (2) through the connecting pipe (8) and blows it towards the computer power supply for heat dissipation and cooling. The air entering the hot end chamber (11) can dissipate heat on the first fin (15), that is, dissipate heat on the hot end of the semiconductor cooling chip (14). Finally, the hot air is exhausted through the exhaust pipe (31). S3. When the computer power supply in the power supply box (2) is cooled by low temperature air, the circulation pump (26) can run to form a passage in the coil (4), the outlet pipe (5), the inlet pipe (6), the first water pipe (27), the condenser pipe (17), the second water pipe (28) and the water cavity (13) and the coolant circulates. When the coolant is in the water cavity (13), it will be continuously cooled by the second fin (16) to keep it at a low temperature. Then, when it flows through the coil (4), it can perform heat exchange on the heat inside the power supply box (2) and thus cool the computer power supply. When the coolant flows through the condenser pipe (17), it can condense the air passing through it, so that the moisture in the air condenses into liquid. Finally, the relatively dry air will enter the cold end chamber (12) for cooling and heat dissipation of the computer power supply. S4. The condensate condensed from the air passing through the condenser tube (17) will enter the condensate box (24) through the condensate tube (23) when it flows into the first air duct (20), and be collected in a unified manner. The condensate inside the condensate box (24) can be discharged through the drain pipe (25).

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