High and low temperature resistant drag chain cable

Abstract

The invention belongs to the technical field of polyethylene cables, and particularly relates to a high and low temperature resistant drag chain cable. The drag chain cable resistant to high and low temperature sequentially comprises a conductor core layer and a modified sheath layer from inside to outside. The modified sheath layer comprises the following components in parts by weight: 80-90 parts of polyethylene, 50-60 parts of polyvinyl chloride, 20-30 parts of a shape memory polymer, 20-30 parts of a filler, 4-6 parts of a compatilizer and 4-6 parts of a plasticizer; the cable has good high and low temperature resistance, and meanwhile, the abrasion volume can be effectively reduced.

Description

Technical Field

[0001] This invention belongs to the field of polyethylene cable technology, and specifically relates to a high and low temperature resistant drag chain cable. Background Technology

[0002] With the development of industrial modernization and the increasing intelligence of industrial production, the cable industry, as an important sector supporting industrial automation equipment, plays a crucial role in transmitting kinetic energy and control signals. Compared to other civilian cables, drag chain cables, as the most common cables in moving parts of equipment, have always suffered from high losses, especially under extreme operating conditions. Drag chain cables are mainly laid in drag chain troughs, frequently moving, bending, and reciprocating along with the drag chain, and are used as a medium for signal transmission or low-voltage power transmission. The performance requirements of conventional drag chain cables mainly include: DC resistance, withstand voltage (AC voltage test), high flexibility (resistance to bending, stretching, and dragging), low temperature resistance, and aging resistance.

[0003] In extreme working conditions such as ultra-low temperature and high temperature environments, and applications requiring frequent and significant bending, traditional drag chain cables exhibit insufficient flexibility, limiting their application range and causing undue compression or stretching of the internal structure when moving in the drag chain. In certain high-speed and high-frequency working environments, traditional cable sheath materials cannot withstand high-intensity friction and wear for extended periods. The outer sheath of the drag chain cable is its most important protective layer, preventing external environmental corrosion of the cable's internal structure and withstanding various mechanical stresses generated during movement and bending. During the use of drag chain cables, prolonged bending and straightening cause micro-cracks to form in the metal parts of the cable material. Under repeated stress, these cracks gradually expand, eventually leading to material fracture.

[0004] Chinese patent (publication number CN118685025A) discloses a high-performance, bend-resistant drag chain cable, comprising a conductor, a modified insulation layer, and a modified outer sheath layer arranged sequentially from the inside out. The modified outer sheath layer is prepared from a modified outer sheath layer material, which includes dried silicone-modified waterborne polyurethane, dried polytetrafluoroethylene, antioxidants, stabilizers, and plasticizers. The modified outer sheath layer material is prepared from silicone-modified waterborne polyurethane and polytetrafluoroethylene, and the modified insulation layer material is prepared from ethylene-vinyl acetate copolymer and inorganic fillers. However, this patent lacks research on the high and low temperature resistance of the drag chain cable, and cannot meet the performance requirements in extreme environments.

[0005] Therefore, designing the outer layer components of drag chain cables and introducing functional materials to effectively improve the cables' resistance to high and low temperatures while achieving good wear resistance has become a key area that needs to be addressed. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a high and low temperature resistant drag chain cable. The high and low temperature resistant drag chain cable of the present invention comprises a conductor core layer and a modified sheath layer. The modified sheath layer is composed of cross-linked polyethylene, polyvinyl chloride, and glass-organosilicon composite materials, and incorporates a shape memory polymer prepared using bisphenol A dianhydride and 4,4'-diaminodiphenyl ether as raw materials in combination with tris(4-aminophenyl)amine. Through the synergistic effect of multiple components, the cable achieves excellent high and low temperature resistance while effectively reducing wear volume.

[0007] In a first aspect, the present invention provides a high and low temperature resistant drag chain cable, wherein the high and low temperature resistant drag chain cable comprises, from the inside out, a conductor core layer and a modified sheath layer.

[0008] The modified sheath layer comprises the following components in parts by weight: 80-90 parts polyethylene, 50-60 parts polyvinyl chloride, 20-30 parts shape memory polymer, 20-30 parts filler, 4-6 parts compatibilizer, and 4-6 parts plasticizer.

[0009] As a preferred embodiment of the present invention, the polyethylene may be in the following weight proportions: 80 parts, 82 parts, 84 parts, 86 parts, 88 parts, or 90 parts, etc.

[0010] As a preferred embodiment of the present invention, the polyvinyl chloride may be in the following weight proportions: 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, or 60 parts, etc.

[0011] As a preferred embodiment of the present invention, the weight parts of the shape memory polymer may be 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, or 30 parts, etc.

[0012] As a preferred embodiment of the present invention, the weight fraction of the filler may be 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, or 30 parts, etc.

[0013] As a preferred embodiment of the present invention, the compatibilizer may be expressed in parts by weight of 4, 4.5, 5, 5.5, or 6 parts, etc.

[0014] As a preferred embodiment of the present invention, the plasticizer may be present in parts by weight of 4, 4.5, 5, 5.5, or 6 parts, etc.

[0015] As a preferred technical solution of the present invention, the method for preparing the shape memory polymer is as follows: polyamic acid is prepared by using bisphenol A dianhydride and 4,4'-diaminodiphenyl ether as raw materials, and the polyamic acid is crosslinked and cured with tris(4-aminophenyl)amine to obtain the shape memory polymer.

[0016] This invention obtains polyamic acid through the polycondensation reaction of bisphenol A dianhydride and 4,4'-diaminodiphenyl ether, and then crosslinks and cures it with tris(4-aminophenyl)amine to obtain a shape memory polymer. In this polymer, a large number of benzene rings provide a highly aromatic rigid chain and act as a stationary phase, while isopropylidene and ether bonds in the backbone provide flexibility and act as a reversible phase.

[0017] As a preferred technical solution of the present invention, the preparation steps of the polyamic acid are as follows: by weight, 8-12 parts of 4,4'-diaminodiphenyl ether are added to 50-60 parts of N,N-dimethylacetamide, stirred for 20-30 min under a nitrogen atmosphere, and then 20-24 parts of bisphenol A dianhydride are added, and stirred at room temperature for 20-24 h to obtain polyamic acid.

[0018] As a preferred technical solution of the present invention, the cross-linking curing process is as follows: by weight, 4 to 8 parts of tris(4-aminophenyl)amine are added to 50 to 60 parts of the polyamic acid and stirred for 4 to 6 hours, vacuum degassing is performed, and the mixture is heated to cure, thereby obtaining a shape memory polymer.

[0019] As a preferred technical solution of the present invention, the heating curing conditions are as follows: first heating at 70-80°C for 1-2 hours, then heating at 140-150°C for 60-80 minutes, and finally heating at 190-200°C for 50-60 minutes.

[0020] The stationary phase in the shape memory polymer of this invention can resist the thermal motion and decomposition of molecular chains at high temperatures, preventing the material from melting, softening or structural collapse at high temperatures. At low temperatures, the reversible phase molecular chains still retain a certain degree of flexibility, which can prevent the material from becoming brittle and breaking due to excessive rigidity, thus obtaining good high and low temperature resistance. In addition, the hardness of the stationary phase and the elasticity of the reversible phase in the shape memory polymer work synergistically to reduce the wear volume of the material.

[0021] As a preferred embodiment of the present invention, the polyethylene is cross-linked polyethylene;

[0022] The density of the cross-linked polyethylene is 1.15–1.20 g / cm³. 3 The embrittlement temperature is -45 to -35℃, and the retention rate of thermal aging tensile strength is 85% to 95%.

[0023] The cross-linked polyethylene of this invention forms a robust three-dimensional network structure between the linear molecular chains of polyethylene through a cross-linking process. This network structure enhances the interaction forces between the molecular chains, making it less prone to decomposition or carbonization at high temperatures, achieving a thermal aging tensile strength retention rate of over 85%. Simultaneously, the embrittlement temperature of cross-linked polyethylene is below -35°C, maintaining good flexibility and impact resistance even at extremely low temperatures, thus effectively improving the high and low temperature resistance of the cable. Furthermore, the tighter bonding between cross-linked polyethylene molecules restricts molecular chain movement, thereby reducing molecular chain breakage and material wear during friction, and lowering the wear volume.

[0024] As a preferred embodiment of the present invention, the filler is a glass-organosilicon composite material;

[0025] The preparation method of the glass-organosilicon composite material includes: mixing trimethyloxyphenylsilane and γ-(methacryloyloxy)propyltrimethoxysilane to react and obtain methacrylate-functionalized POSS; using methacrylate-functionalized POSS, butyl acrylate, glycidyl methacrylate, styrene and γ-(methacryloyloxy)propyltrimethoxysilane as raw materials to obtain an organosilicon intermediate product through a synthesis reaction; and using the organosilicon intermediate product to graft and modify glass microspheres to obtain the glass-organosilicon composite material.

[0026] This invention first uses trimethyloxyphenylsilane and γ-(methacryloyloxy)propyltrimethoxysilane as raw materials, which undergo hydrolysis under acidic conditions and 30-40°C to form hydroxyl groups, and then hydrolyzes to synthesize methacrylate-functionalized POSS. Multiple hydroxyl-containing silanes condense to form a POSS skeleton, thereby obtaining methacrylate-functionalized POSS. Then, using methacrylate-functionalized POSS, butyl acrylate, glycidyl methacrylate, styrene, and γ-(methacryloyloxy)propyltrimethoxysilane as raw materials, the organosilicon structure of POSS is introduced into the acrylic resin molecular chain segment through the initiator tert-butyl peroxide, thereby preparing an organosilicon intermediate product containing functional groups such as epoxy groups and silanol groups. Finally, the hydroxyl groups on the surface of glass microspheres are dehydrated by solvent method to achieve the dehydration reaction of the organosilicon intermediate product with the silanol groups of the organosilicon intermediate product, and the organosilicon intermediate product is grafted onto the surface of glass microspheres to obtain a glass-organosilicon composite material.

[0027] As a preferred embodiment of the present invention, the preparation steps of the methacrylate-functionalized POSS are as follows: by weight, 20-30 parts of deionized water and 70-80 parts of anhydrous ethanol are mixed, the pH is adjusted to 1.4-1.8, 4-8 parts of trimethyloxyphenylsilane and 5-10 parts of γ-(methacryloyloxy)propyltrimethoxysilane are added, and the mixture is reacted at 30-40°C for 70-80 h. After the reaction is completed, the pH is adjusted to 6.8-7.2, and the solvent is removed by rotary evaporation to obtain the methacrylate-functionalized POSS.

[0028] As a preferred embodiment of the present invention, the preparation steps of the organosilicon intermediate are as follows: by weight, 20-30 parts of methacrylate-functionalized POSS, 16-20 parts of butyl acrylate, 16-20 parts of glycidyl methacrylate, 10-14 parts of styrene and 10-20 parts of γ-(methacryloyloxy)propyltrimethoxysilane are mixed, and then 1.2-1.6 parts of tert-butyl peroxide are added to obtain a mixture. The mixture is then added to a mixed solvent of 100-120 parts of xylene and 100-120 parts of isopropanol, and reacted at 100-120°C for 120-140 min. The solvent is removed by rotary evaporation to obtain the organosilicon intermediate.

[0029] As a preferred technical solution of the present invention, the grafting modification step is as follows: by weight, 10-20 parts of organosilicon intermediate are added to 300-340 parts of xylene, stirred at 70-80°C for 40-60 minutes, then 80-100 parts of glass microspheres are added and heated under reflux for 6-8 hours, centrifuged, washed, and dried to obtain glass-organosilicon composite material.

[0030] The glass microspheres of this invention, made of glass-organosilicon composite material, possess extremely high heat resistance. When uniformly dispersed as a reinforcing phase, they can suppress the disordered movement and thermal expansion of molecular chains at high temperatures, significantly improving the heat deformation temperature of the material. The organosilicon molecular chains contain Si-O backbones with large bond angles and flexible rotation, giving the molecular chains great flexibility and freedom. Therefore, they are not prone to embrittlement due to molecular chain freezing at low temperatures. Thus, glass-organosilicon composites improve the high and low temperature resistance of cables. In addition, the synergistic effect of the rigid reinforcement of glass and the flexible buffering of organosilicon reduces material loss during friction and lowers the wear volume.

[0031] As a preferred embodiment of the present invention, the compatibilizer is maleic anhydride-grafted polyethylene or maleic anhydride-grafted polypropylene.

[0032] As a preferred embodiment of the present invention, the plasticizer is selected from one or more of dicyclohexyl phthalate, diisobutyl phthalate, and butyl benzyl phthalate.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] (1) The present invention uses bisphenol A dianhydride and 4,4'-diaminodiphenyl ether as raw materials, and prepares a shape memory polymer in combination with tris(4-aminophenyl)amine, and together with cross-linked polyethylene, polyvinyl chloride and glass-organosilicon composite materials, etc., to form a modified sheath layer of the cable, thereby giving the drag chain cable good high and low temperature resistance and wear resistance.

[0035] (2) The cross-linked polyethylene of the present invention forms a strong three-dimensional network structure between the linear molecular chains of polyethylene through the cross-linking process. This network structure enhances the interaction force between molecular chains, making it less prone to decomposition or carbonization at high temperatures, achieving a thermal aging tensile strength retention rate of more than 85%. At the same time, the embrittlement temperature of cross-linked polyethylene is lower than -35°C, and it can still maintain good flexibility and impact resistance at extremely low temperatures, thereby effectively improving the high and low temperature resistance of the cable. In addition, the bonding between cross-linked polyethylene molecules is tighter, and the movement of molecular chains is restricted, thereby reducing the breakage of molecular chains and material wear during friction, and reducing the wear volume.

[0036] (3) The tri(4-aminophenyl)amine of the present invention contains three amino groups. One part of the raw material acts as a crosslinking agent, and crosslinking of shape memory polymer is achieved by reacting all the amino groups. The other part of the raw material acts as a chain extender, and chain extension effect is achieved by combining two amino groups respectively, while leaving one reactive amino group. The glass-organosilicon composite material grafts polymer resin onto the glass surface. The resin chain segments contain active groups such as epoxy groups, which can react with the amino groups left by the chain extender in the shape memory polymer to form an interconnection network, thereby improving the overall performance of the cable. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0038] Figure 1 This is a schematic diagram of the shape memory polymer in Example 1.

[0039] Figure 2 This is the mass spectrum of the methacrylate-functionalized POSS in Example 1. Detailed Implementation

[0040] To facilitate understanding of the present invention, the following embodiments are provided. Those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention.

[0041] The sources of some components in the examples and comparative examples are as follows:

[0042] Cross-linked polyethylene, model LE0520, density 1.17 g / cm³ 3 The embrittlement temperature is -40℃, and the heat aging tensile strength retention rate is 90%. It was purchased from BOROUGE.

[0043] Commercially available polyethylene, product number WD3394, purchased from Hubei Wande Chemical Co., Ltd.

[0044] Polyvinyl chloride, item number P434341, purchased from Shanghai Aladdin Biochemical Technology Co., Ltd.

[0045] Commercially available glass microspheres, model S4630, purchased from 3M.

[0046] Maleic anhydride-grafted polyethylene, product number M87824, was purchased from Shanghai Mairui Biochemical Technology Co., Ltd.

[0047] Maleic anhydride-grafted polypropylene, model PC-5, purchased from Ningbo Yunhe New Materials Co., Ltd.

[0048] Dicyclohexyl phthalate, CAS 84-61-7, purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0049] Diisobutyl phthalate, CAS No. 84-69-5, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0050] Butyl benzyl phthalate, CAS No. 85-68-7, purchased from Sinopharm Chemical Reagent Co., Ltd.

[0051] Bisphenol A dianhydride, CAS No. 38103-06-9, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0052] 4,4'-Diaminodiphenyl ether, CAS No. 3101-80-4, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0053] Tris(4-aminophenyl)amine, CAS No. 5981-09-9, was purchased from Sinopharm Chemical Reagent Co., Ltd.

[0054] Trimethyloxyphenylsilane, CAS No. 2996-92-1, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0055] γ-(methacryloyloxy)propyltrimethoxysilane, CAS No. 2530-85-0, was purchased from Sinopharm Chemical Reagent Co., Ltd.

[0056] Butyl acrylate, CAS No. 141-32-2, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0057] Glycidyl methacrylate, CAS No. 106-91-2, purchased from Sinopharm Chemical Reagent Co., Ltd.

[0058] Styrene, CAS No. 100-42-5, purchased from Sinopharm Chemical Reagent Co., Ltd.

[0059] tert-butyl peroxide, CAS No. 614-45-9, was purchased from Shanghai Maclean Biochemical Technology Co., Ltd.

[0060] Example 1

[0061] This embodiment provides a high and low temperature resistant drag chain cable, which includes a conductor core layer and a modified sheath layer from the inside out; the modified sheath layer includes the following components in parts by weight: 90 parts cross-linked polyethylene (model LE0520), 60 parts polyvinyl chloride, 30 parts shape memory polymer, 30 parts glass-organosilicon composite material, 6 parts compatibilizer maleic anhydride grafted polyethylene and 6 parts plasticizer dicyclohexyl phthalate.

[0062] Preparation of the shape memory polymer: By weight, 12 parts of 4,4'-diaminodiphenyl ether were added to 60 parts of N,N-dimethylacetamide and stirred for 30 min under a nitrogen atmosphere. Then, 24 parts of bisphenol A dianhydride were added and stirred at room temperature for 24 h to obtain polyamic acid. By weight, 8 parts of tris(4-aminophenyl)amine were added to 60 parts of the polyamic acid and stirred for 6 h. The mixture was then degassed under vacuum and cured by heating. The curing process was carried out at 80°C for 1 h, then at 150°C for 60 min, and finally at 200°C for 50 min to obtain the shape memory polymer.

[0063] Preparation of the glass-organosilicon composite material: 30 parts by weight of deionized water and 70 parts by weight of anhydrous ethanol were mixed, and the pH was adjusted to 1.8. 8 parts by weight of trimethyloxyphenylsilane and 10 parts by weight of γ-(methacryloyloxy)propyltrimethoxysilane were added, and the mixture was reacted at 40°C for 70 h. After the reaction was complete, the pH was adjusted to 7.2, and the solvent was removed by rotary evaporation to obtain methacrylate-functionalized POSS. 30 parts by weight of methacrylate-functionalized POSS, 20 parts by weight of butyl acrylate, 20 parts by weight of glycidyl methacrylate, 14 parts by weight of styrene, and 20 parts by weight of γ-... (Methacryloxy)propyltrimethoxysilane was mixed, and then 1.6 parts of tert-butyl peroxide were added to obtain a mixture. The mixture was added to a mixed solvent of 120 parts xylene and 120 parts isopropanol, and reacted at 120°C for 140 min. The solvent was removed by rotary evaporation to obtain an organosilicon intermediate. 20 parts of the organosilicon intermediate were added to 340 parts of xylene, and stirred at 80°C for 40 min. Then 100 parts of glass microspheres were added and the mixture was heated under reflux for 8 h. After centrifugation, washing, and drying, a glass-organosilicon composite material was obtained.

[0064] Example 2

[0065] This embodiment provides a high and low temperature resistant drag chain cable, which includes a conductor core layer and a modified sheath layer from the inside out; the modified sheath layer includes the following components in parts by weight: 80 parts cross-linked polyethylene (model LE0520), 50 parts polyvinyl chloride, 20 parts shape memory polymer, 20 parts glass-organosilicon composite material, 4 parts compatibilizer maleic anhydride grafted polypropylene and 4 parts plasticizer diisobutyl phthalate.

[0066] Preparation of the shape memory polymer: By weight, 8 parts of 4,4'-diaminodiphenyl ether were added to 50 parts of N,N-dimethylacetamide and stirred for 20 min under a nitrogen atmosphere. Then, 20 parts of bisphenol A dianhydride were added and stirred for 20 h at room temperature to obtain polyamic acid. By weight, 4 parts of tris(4-aminophenyl)amine were added to 50 parts of the polyamic acid and stirred for 4 h. The mixture was then degassed under vacuum and cured by heating. The curing process was carried out at 70°C for 2 h, then at 140°C for 80 min, and finally at 190°C for 60 min to obtain the shape memory polymer.

[0067] Preparation of the glass-organosilicon composite material: 20 parts by weight of deionized water and 80 parts by weight of anhydrous ethanol were mixed, and the pH was adjusted to 1.4. 4 parts by weight of trimethyloxyphenylsilane and 5 parts by weight of γ-(methacryloyloxy)propyltrimethoxysilane were added, and the mixture was reacted at 30°C for 80 h. After the reaction was complete, the pH was adjusted to 6.8, and the solvent was removed by rotary evaporation to obtain methacrylate-functionalized POSS. 20 parts by weight of methacrylate-functionalized POSS, 16 parts by weight of butyl acrylate, 16 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene, and 10 parts by weight of γ-... (Methacryloxy)propyltrimethoxysilane was mixed, and then 1.2 parts of tert-butyl peroxide were added to obtain a mixture. The mixture was added to a mixed solvent of 100 parts xylene and 100 parts isopropanol, and reacted at 100°C for 140 min. The solvent was removed by rotary evaporation to obtain an organosilicon intermediate. 10 parts of the organosilicon intermediate were added to 300 parts of xylene, and stirred at 70°C for 60 min. Then 80 parts of glass microspheres were added and the mixture was heated under reflux for 6 h. After centrifugation, washing, and drying, a glass-organosilicon composite material was obtained.

[0068] Example 3

[0069] This embodiment provides a high and low temperature resistant drag chain cable, which includes a conductor core layer and a modified sheath layer from the inside out; the modified sheath layer includes the following components in parts by weight: 85 parts cross-linked polyethylene (model LE0520), 55 parts polyvinyl chloride, 25 parts shape memory polymer, 25 parts glass-organosilicon composite material, 5 parts compatibilizer maleic anhydride grafted polyethylene and 5 parts plasticizer butyl benzyl phthalate.

[0070] Preparation of the shape memory polymer: By weight, 10 parts of 4,4'-diaminodiphenyl ether were added to 55 parts of N,N-dimethylacetamide and stirred for 25 min under a nitrogen atmosphere. Then, 22 parts of bisphenol A dianhydride were added and stirred at room temperature for 22 h to obtain polyamic acid. By weight, 6 parts of tris(4-aminophenyl)amine were added to 55 parts of the polyamic acid and stirred for 5 h. The mixture was then degassed under vacuum and cured by heating. The curing process was carried out at 75°C for 1.5 h, then at 145°C for 70 min, and finally at 195°C for 55 min to obtain the shape memory polymer.

[0071] Preparation of the glass-organosilicon composite material: 25 parts by weight of deionized water and 75 parts by weight of anhydrous ethanol were mixed, and the pH was adjusted to 1.6. 6 parts by weight of trimethyloxyphenylsilane and 8 parts by weight of γ-(methacryloyloxy)propyltrimethoxysilane were added, and the mixture was reacted at 35°C for 75 h. After the reaction was complete, the pH was adjusted to 7.1, and the solvent was removed by rotary evaporation to obtain methacrylate-functionalized POSS. 25 parts by weight of methacrylate-functionalized POSS, 18 parts by weight of butyl acrylate, 18 parts by weight of glycidyl methacrylate, 12 parts by weight of styrene, and 15 parts by weight of γ-... (Methacryloxy)propyltrimethoxysilane was mixed, and then 1.4 parts of tert-butyl peroxide were added to obtain a mixture. The mixture was added to a mixed solvent of 110 parts xylene and 110 parts isopropanol, and reacted at 110°C for 130 min. The solvent was removed by rotary evaporation to obtain an organosilicon intermediate. 15 parts of the organosilicon intermediate were added to 320 parts xylene, and stirred at 75°C for 50 min. Then 90 parts of glass microspheres were added and the mixture was heated under reflux for 7 h. After centrifugation, washing, and drying, a glass-organosilicon composite material was obtained.

[0072] Comparative Example 1

[0073] The difference between this comparative example and Example 1 is that commercially available polyethylene (part number WD3394) was used instead of cross-linked polyethylene (model LE0520).

[0074] Comparative Example 2

[0075] The difference between this comparative example and Example 1 is that the modified sheath layer does not contain shape memory polymer.

[0076] Comparative Example 3

[0077] The difference between this comparative example and Example 1 is that commercially available glass microspheres (model S4630) were used instead of the glass-silicone composite material.

[0078] The performance of the drag chain cable materials provided in the above embodiments and comparative examples was tested using the following methods:

[0079] (1) High temperature resistance test

[0080] Referring to GB / T 19216.21-2003 "Integrity Burning Test of Cables and Optical Fibers", the test cable is tested to maintain the integrity of the fire for the duration and temperature when the line is exposed to fire at a rated voltage of 0.6 / 1KV.

[0081] (2) Low temperature resistance test

[0082] Referring to GB / T 2951.14-2008 General Test Methods for Insulation and Sheath Materials of Cables and Optical Fibers Part 14: General Test Methods for Low Temperature Tests, the test temperature is -30℃. After the test, observe whether there are any cracks on the cable surface.

[0083] (3) Wear resistance test

[0084] The test was conducted in accordance with the requirements of ISO 4649-2017-09 Vulcanized rubber or thermoplastic rubber - Determination of abrasion resistance.

[0085] The performance test data above are shown in Table 1.

[0086] Table 1 Performance Test Results

[0087] Fire exposure time (min) Fire temperature (°C) Low temperature test to check for cracking <![CDATA[Wear volume (mm 3 )]]> Example 1 146 986 no 39.84 Example 2 141 979 no 42.17 Example 3 144 983 no 42.03 Comparative Example 1 117 956 yes 69.48 Comparative Example 2 103 932 yes 76.95 Comparative Example 3 112 948 yes 71.39

[0088] As can be seen from the above, the present invention uses bisphenol A dianhydride and 4,4'-diaminodiphenyl ether as raw materials, combined with tris(4-aminophenyl)amine to prepare a shape memory polymer, which together with cross-linked polyethylene, polyvinyl chloride and glass-organosilicon composite materials constitutes the modified sheath layer of the cable, thereby obtaining a high and low temperature resistant drag chain cable (Examples 1 to 3), which has better comprehensive performance.

[0089] Compared to Example 1, the use of commercially available polyethylene (item number WD3394) instead of cross-linked polyethylene (model LE0520) resulted in decreased high and low temperature resistance and increased wear volume due to the lack of the cross-linked polyethylene network structure (Comparative Example 1); compared to Example 1, the modified sheath layer did not contain shape memory polymer, and lacked the synergistic effect of its fixed and reversible phases, resulting in decreased high and low temperature resistance and increased wear volume (Comparative Example 2); compared to Example 1, the use of commercially available glass microspheres (model S4630) instead of glass-silicone composite material resulted in decreased high and low temperature resistance and increased wear volume due to the lack of the synergistic effect of glass rigidity reinforcement and silicone flexible buffer (Comparative Example 3).

Claims

1. A high and low temperature resistant drag chain cable, characterized in that, The high and low temperature resistant drag chain cable comprises, from the inside out, a conductor core layer and a modified sheath layer; The modified sheath layer comprises the following components in parts by weight: 80-90 parts polyethylene, 50-60 parts polyvinyl chloride, 20-30 parts shape memory polymer, 20-30 parts filler, 4-6 parts compatibilizer and 4-6 parts plasticizer; The method for preparing the shape memory polymer is as follows: polyamic acid is prepared using bisphenol A dianhydride and 4,4'-diaminodiphenyl ether as raw materials, and the polyamic acid is cross-linked and cured with tris(4-aminophenyl)amine to obtain the shape memory polymer.

2. The high and low temperature resistant drag chain cable according to claim 1, characterized in that, The preparation steps of the polyamic acid are as follows: by weight, 8-12 parts of 4,4'-diaminodiphenyl ether are added to 50-60 parts of N,N-dimethylacetamide, stirred for 20-30 min under a nitrogen atmosphere, and then 20-24 parts of bisphenol A dianhydride are added and stirred at room temperature for 20-24 h to obtain polyamic acid.

3. The high and low temperature resistant drag chain cable according to claim 1, characterized in that, The cross-linking and curing process is as follows: by weight, 4-8 parts of tris(4-aminophenyl)amine are added to 50-60 parts of the polyamic acid and stirred for 4-6 hours, then vacuum degassed and heated to cure, to obtain the shape memory polymer.

4. The high and low temperature resistant drag chain cable according to claim 1, characterized in that, The polyethylene is cross-linked polyethylene; The density of the cross-linked polyethylene is 1.15–1.20 g / cm³. 3 The embrittlement temperature is -45 to -35℃, and the retention rate of thermal aging tensile strength is 85% to 95%.

5. A high and low temperature resistant drag chain cable according to claim 1, characterized in that, The filler is a glass-organosilicon composite material; The preparation method of the glass-organosilicon composite material includes: mixing trimethyloxyphenylsilane and γ-(methacryloyloxy)propyltrimethoxysilane to react and obtain methacrylate-functionalized POSS; using methacrylate-functionalized POSS, butyl acrylate, glycidyl methacrylate, styrene and γ-(methacryloyloxy)propyltrimethoxysilane as raw materials to obtain an organosilicon intermediate product through a synthesis reaction; and using the organosilicon intermediate product to graft and modify glass microspheres to obtain the glass-organosilicon composite material.

6. A high and low temperature resistant drag chain cable according to claim 5, characterized in that, The preparation steps of the methacrylate-functionalized POSS are as follows: by weight, 20-30 parts of deionized water and 70-80 parts of anhydrous ethanol are mixed, the pH is adjusted to 1.4-1.8, 4-8 parts of trimethyloxyphenylsilane and 5-10 parts of γ-(methacryloyloxy)propyltrimethoxysilane are added, and the mixture is reacted at 30-40°C for 70-80 h. After the reaction is completed, the pH is adjusted to 6.8-7.2, and the solvent is removed by rotary evaporation to obtain the methacrylate-functionalized POSS.

7. A high and low temperature resistant drag chain cable according to claim 5, characterized in that, The preparation steps of the organosilicon intermediate are as follows: by weight, 20-30 parts of methacrylate-functionalized POSS, 16-20 parts of butyl acrylate, 16-20 parts of glycidyl methacrylate, 10-14 parts of styrene and 10-20 parts of γ-(methacryloyloxy)propyltrimethoxysilane are mixed, and then 1.2-1.6 parts of tert-butyl peroxide are added to obtain a mixture. The mixture is added to a mixed solvent of 100-120 parts of xylene and 100-120 parts of isopropanol, and reacted at 100-120°C for 120-140 min. The solvent is removed by rotary evaporation to obtain the organosilicon intermediate.

8. A high and low temperature resistant drag chain cable according to claim 5, characterized in that, The grafting modification steps are as follows: by weight, 10-20 parts of organosilicon intermediate are added to 300-340 parts of xylene, stirred at 70-80°C for 40-60 minutes, then 80-100 parts of glass microspheres are added and heated under reflux for 6-8 hours, centrifuged, washed, and dried to obtain glass-organosilicon composite material.

9. A high and low temperature resistant drag chain cable according to claim 1, characterized in that, The compatibilizer is maleic anhydride-grafted polyethylene or maleic anhydride-grafted polypropylene.

10. A high and low temperature resistant drag chain cable according to claim 1, characterized in that, The plasticizer is selected from one or more of dicyclohexyl phthalate, diisobutyl phthalate, and butyl benzyl phthalate.

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