Packaging substrate manufacturing method and packaging substrate

Abstract

The application provides a packaging substrate manufacturing method, and belongs to the technical field of packaging substrates. The method comprises the following steps: providing a substrate, and an insulating film is arranged on the substrate; presetting a plurality of cavity processing areas on the insulating film, wherein each cavity processing area comprises an outer ring area and an inner ring area arranged coaxially; using a first laser ablation process to process the outer ring areas one by one until all the outer ring areas are completed ablation; and using a second laser ablation process to process the inner ring areas one by one until all the inner ring areas are completed ablation. The packaging substrate manufacturing method can inhibit the continuous increase of the temperature of a protective mirror, reduce the risk that volatile substances on the protective mirror absorb a large amount of heat and burn the protective mirror, and improve the problems of cavity position accuracy deviation and insulating film residue.

Description

Technical Field

[0001] This application relates to the field of packaging substrate technology, and in particular to a method for manufacturing a packaging substrate and a packaging substrate. Background Technology

[0002] In the field of semiconductor packaging substrate technology, the processing quality of the cavity plays a crucial role in the reliability of the entire packaging process and product performance. Currently, laser processing technology, with its advantages of high precision, high efficiency, and non-contact processing, has been widely used in cavity processing. This technology uses the interaction between a high-energy laser beam and the material to achieve precise material removal, thereby forming the required cavity structure.

[0003] However, based on current technology for processing the cavity, it was found that ABF (Ajinomoto deposit film) residue exists after laser processing of the cavity, and defects such as dents / voids are found on one side during the cavity encapsulation process. Through investigation and comparison, it was found that the location of the void defect matches the position offset of the cavity, which is strongly related to the laser processing cavity production process.

[0004] In existing technologies, laser-processed cavities are typically fabricated in a single process using a single program. During continuous processing, a large amount of volatile substances, such as foreign matter, splash onto the surface of the laser protective mirror. As the number of laser holes increases while the energy setting remains constant, the volatile substances adhering to the protective mirror absorb a large amount of heat and burn it, resulting in subtle unevenness on the mirror surface. This causes the laser beam to fail to achieve the specified positional accuracy on the board surface after passing through the protective mirror, ultimately causing a deviation in cavity accuracy. This affects the center matching between the die (chip) and the cavity, resulting in packaging risks. Furthermore, the uniformity of the beam energy is altered due to the burnt protective mirror, leading to a large amount of ABF residue in the cavity. Summary of the Invention

[0005] This application provides a method for manufacturing a packaging substrate, which can suppress the continuous rise in temperature of the protective mirror, reduce the risk of the protective mirror being burned by volatile substances absorbing a large amount of heat, and improve the problems of cavity position displacement and ABF residue.

[0006] This application provides a method for manufacturing a packaging substrate, including:

[0007] A substrate is provided, wherein an insulating film is disposed on the substrate;

[0008] Multiple cavity processing areas are pre-set on the insulating film, wherein each cavity processing area includes an outer ring area and an inner ring area arranged coaxially;

[0009] Using a first laser ablation process, the outer ring areas are processed one by one until all the outer ring areas are ablated.

[0010] Using a second laser ablation process, the inner ring regions are processed one by one until all the inner ring regions are ablated.

[0011] In some embodiments, the laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or, the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

[0012] In some embodiments, when ablation is performed on the outer ring region, the laser energy is 2.5-3.5 millijoules, and the laser energy error is less than or equal to 5%; when ablation is performed on the inner ring region, the laser energy is 4.5-5.5 millijoules, and the laser energy error is less than or equal to 5%.

[0013] In some embodiments, when ablation is performed on the outer ring region, the laser beam aperture is 45 micrometers to 60 micrometers, and the laser beam aperture error is less than or equal to 5%; when ablation is performed on the inner ring region, the laser beam aperture is 80 micrometers to 100 micrometers, and the laser beam aperture error is less than or equal to 5%.

[0014] In some embodiments, the outer ring region is processed using a first laser ablation process, including circumferential ablation of the outer ring region along at least one preset first closed geometric trajectory;

[0015] The inner ring region is processed using a second laser ablation process, including circumferential ablation of the inner ring region along a preset surface scanning trajectory.

[0016] In some embodiments, processing the outer ring region using a first laser ablation process further includes performing circumferential ablation of the outer ring region along at least one preset second closed geometric trajectory;

[0017] Wherein, the second closed geometric trajectory corresponds one-to-one with the first closed geometric trajectory, the second closed geometric trajectory coincides with the corresponding first closed geometric trajectory, and the laser action point in the second closed geometric trajectory is staggered with the laser action point in the first closed geometric trajectory;

[0018] After ablation of the outer ring region along the first closed geometric trajectory, circumferential ablation of the outer ring region is performed along the second closed geometric trajectory; or...

[0019] The ablation of the outer ring region along the second closed geometric trajectory is performed simultaneously with the ablation of the outer ring region along the first closed geometric trajectory, and is completed in one go through a composite scanning path.

[0020] In some embodiments, the number of laser action points in the second closed geometric trajectory is 60%-85% of the number of laser action points in the first closed geometric trajectory.

[0021] In some embodiments, the cavity processing area is divided into a longitudinal cavity processing area group and a transverse cavity processing area group. The longitudinal cavity processing area group includes multiple cavity processing areas arranged at intervals along the longitudinal direction, and the transverse cavity processing area group includes multiple cavity processing areas arranged along the transverse direction. The longitudinal cavity processing area group and the transverse cavity processing area group do not overlap.

[0022] In some embodiments, the longitudinal cavity processing area group is symmetrically distributed with the transverse centerline of the transverse cavity processing area group as the axis of symmetry, and the transverse cavity processing area group is symmetrically distributed with the longitudinal centerline of the longitudinal cavity processing area group as the axis of symmetry.

[0023] In some embodiments, the outer ring region has a sloping sidewall structure, and the bottom of the inner ring region is parallel to the surface of the substrate.

[0024] The packaging substrate manufacturing method of this application divides the cavity processing area into an outer ring area and an inner ring area, and processes all the outer ring areas first and then processes the inner ring area. This suppresses the continuous rise in the temperature of the protective mirror, reduces the risk of the protective mirror being burned by volatile substances on the protective mirror absorbing a large amount of heat, improves the problems of cavity position displacement and ABF residue, and ensures the processing efficiency of the cavity. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic flowchart of a packaging substrate fabrication method according to an embodiment of this application.

[0027] Figure 2 This is a schematic diagram of laser ablation of an outer ring region in the packaging substrate fabrication method of this application embodiment.

[0028] Figure 3 This is a schematic diagram of the packaging substrate after laser ablation of the outer ring area according to an embodiment of this application.

[0029] Figure 4 This is a schematic diagram of laser ablation of an inner ring region in the packaging substrate fabrication method of this application embodiment.

[0030] Figure 5 This is a schematic diagram of the packaging substrate after laser ablation of the inner ring area according to an embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the longitudinal cavity processing area group and the transverse cavity processing area group in the packaging substrate manufacturing method of this application embodiment.

[0032] Figure label:

[0033] Substrate 1; Insulating film 2; Cavity processing area 3; Outer ring area 31; Inner ring area 32. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] This application provides a method for manufacturing a packaging substrate, which can suppress the continuous rise in temperature of the protective mirror, reduce the risk of the protective mirror being burned by volatile substances absorbing a large amount of heat, and improve the problems of cavity position displacement and ABF residue.

[0036] Please refer to the above. Figures 1 to 5 , Figure 1 This is a schematic flowchart of the packaging substrate fabrication method according to an embodiment of this application. Figure 2 This is a schematic diagram illustrating the laser ablation of the outer ring region in the packaging substrate fabrication method according to an embodiment of this application. Figure 3 This is a schematic diagram of the packaging substrate after laser ablation of the outer ring area according to an embodiment of this application. Figure 4 This is a schematic diagram illustrating laser ablation of the inner ring region in the packaging substrate fabrication method according to an embodiment of this application. Figure 5 This is a schematic diagram of the packaging substrate after laser ablation of the inner ring region according to an embodiment of this application. The packaging substrate fabrication method includes the following steps:

[0037] 10. A substrate 1 is provided, on which an insulating film 2 is provided.

[0038] 20. Multiple cavity processing areas 3 are pre-set on the insulating film 2, wherein each cavity processing area 3 includes an outer ring area 31 and an inner ring area 32 arranged coaxially.

[0039] 30. Using the first laser ablation process, process each outer ring region 31 one by one until all outer ring regions 31 are ablated.

[0040] 40. Using the second laser ablation process, process the inner ring area 32 one by one until all the inner ring areas 32 are ablated.

[0041] It should be noted that by dividing the cavity processing area 3 into an outer ring area 31 and an inner ring area 32, and processing the outer ring area 31 one by one before processing the inner ring area 32 one by one, the risk of volatile substances such as debris on the protective lens absorbing a large amount of heat in a short time and burning the protective lens is avoided, and the problems of cavity position displacement and insulating film (ABF) residue are improved.

[0042] The packaging substrate 1 manufacturing method of this application divides the cavity processing area 3 into an outer ring area 31 and an inner ring area 32, and processes all the outer ring areas 31 first and then processes the inner ring area 32. This suppresses the continuous rise in the temperature of the protective mirror, reduces the risk of volatile substances such as impurities on the protective mirror absorbing a large amount of heat in a short time and burning the protective mirror, and improves the problems of cavity position displacement and ABF residue.

[0043] In some embodiments, the laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or, the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

[0044] In some specific embodiments, when ablating the outer ring region 31, the laser energy is 2.5 mJ to 3.5 mJ (e.g., 2.5 mJ, 2.75 mJ, 3.0 mJ, 3.25 mJ, 3.5 mJ), with a laser energy error of less than or equal to 5%; when ablating the inner ring region 32, the laser energy is 4.5 mJ to 5.5 mJ (e.g., 4.5 mJ, 4.75 mJ, 5.0 mJ, 5.25 mJ, 5.5 mJ), with a laser energy error of less than or equal to 5%.

[0045] In some specific embodiments, when ablation is performed on the outer ring region 31, the laser beam aperture is 45-60 micrometers (e.g., 45 micrometers, 50 micrometers, 55 micrometers, 60 micrometers), and the laser beam aperture error is less than or equal to 5%; when ablation is performed on the inner ring region 32, the laser beam aperture is 80-100 micrometers (e.g., 80 micrometers, 85 micrometers, 90 micrometers, 95 micrometers, 100 micrometers), and the laser beam aperture error is less than or equal to 5%.

[0046] It should be noted that the machining accuracy of the outer ring region 31 affects the machining accuracy of the entire cavity. By using a smaller laser energy and / or laser beam aperture in the outer ring region 31, the continuous rise in the temperature of the protective mirror can be further suppressed, thus ensuring the machining accuracy of the outer ring region 31. Once the machining accuracy of the outer ring region 31 is guaranteed, even if the temperature of the protective mirror continues to rise during the machining of the inner ring region 32, it will not affect the positional accuracy of the cavity. Therefore, by using a larger laser energy and / or laser beam aperture in the inner ring region 32, the machining efficiency of the inner ring region 32 can be improved, thereby increasing the production efficiency of the substrate 1.

[0047] In some embodiments, reference Figure 2 and Figure 3 The outer ring region 31 is processed using a first laser ablation process, including circumferential ablation of the outer ring region 31 along at least one preset first closed geometric trajectory. For example, in one example, referring to... Figure 2 Multiple rectangular first closed geometric trajectories are preset. These rectangular first closed geometric trajectories have the same geometric center point and are arranged in order from the inside to the outside. The distance between two adjacent first closed geometric trajectories is less than the diameter of the laser beam when ablation is performed on the outer ring region 31.

[0048] Furthermore, in some embodiments, the processing of the outer ring region 31 using the first laser ablation process further includes circumferential ablation of the outer ring region 31 along at least one preset second closed geometric trajectory; wherein the second closed geometric trajectory corresponds one-to-one with the first closed geometric trajectory, the second closed geometric trajectory coincides with the corresponding first closed geometric trajectory, and the laser action points in the second closed geometric trajectory are staggered with the laser action points in the first closed geometric trajectory.

[0049] It should be noted that both the first closed geometric trajectory and the second closed geometric trajectory refer to continuous paths that are connected end to end, including but not limited to circles, ellipses, rectangles, polygons and other arbitrary closed geometric shapes, which can be realized through the galvanometer control of the laser scanning system or the programming of the motion platform.

[0050] It should also be noted that, since there may be some incomplete or uneven ablation of the outer ring region 31 after ablation along the first closed geometric trajectory, the residual parts on the insulating film 2 can be further removed by ablation along the second closed geometric trajectory of the outer ring region 31, and the ablation of the outer ring region 31 can be made more uniform and complete, thereby improving the processing quality.

[0051] Optionally, in some embodiments, after circumferential ablation of the outer ring region 31 along the first closed geometric trajectory, circumferential ablation of the outer ring region 31 is performed along the second closed geometric trajectory.

[0052] It should be noted that by performing circumferential ablation of the outer ring region 31 along the first closed geometric trajectory and circumferential ablation of the outer ring region 31 along the second closed geometric trajectory separately, after circumferential ablation of the outer ring region 31 along the first closed geometric trajectory, the ablated outer ring region 31 can be inspected. Based on the inspection results, the ablation parameters of the second closed geometric trajectory can be adjusted and optimized accordingly to correct any problems that may occur during the ablation process along the first closed geometric trajectory, improve product quality, and avoid over-ablation.

[0053] Optionally, in other embodiments, the circumferential ablation of the outer ring region 31 along the second closed geometric trajectory and the circumferential ablation of the outer ring region 31 along the first closed geometric trajectory are performed simultaneously and completed in one go through a composite scanning path.

[0054] It should be noted that the ablation of the outer ring region 31 along the first closed geometric trajectory and the ablation of the outer ring region 31 along the second closed geometric trajectory are completed in one go through the composite scanning path, without the need for multiple positioning and calibration, which simplifies the process flow, reduces processing time, and thus improves production efficiency. In addition, the composite scanning path can further ensure the uniformity of ablation, which is conducive to improving product quality.

[0055] In some specific embodiments, the number of laser action points in the second closed geometric trajectory is 60%-85% (e.g., 60%, 65%, 70%, 75%, 80%, 85%) of the number of laser action points in the first closed geometric trajectory, ensuring the ablation effect while avoiding excessive ablation.

[0056] In some embodiments, reference Figure 4 and Figure 5 The inner ring region 32 is processed using a second laser ablation process, including circumferential ablation of the inner ring region 32 along a preset surface scanning trajectory. It should be noted that, after ensuring the processing accuracy of the outer ring region 31, processing the inner ring region 32 will not affect the positional accuracy of the cavity. Therefore, circumferential ablation of the inner ring region 32 along the preset surface scanning trajectory uses a conventional surface scanning circumferential ablation method in the art, directly employing a mature and universal trajectory planning mode, without the need for additional scanning trajectory design.

[0057] In some embodiments, the cavity processing area 3 is divided into a longitudinal cavity processing area 3 group and a transverse cavity processing area 3 group. The longitudinal cavity processing area 3 group includes a plurality of cavity processing areas 3 arranged at intervals along the longitudinal direction, and the transverse cavity processing area 3 group includes a plurality of cavity processing areas 3 arranged in the transverse direction. The longitudinal cavity processing area 3 group and the transverse cavity processing area 3 group do not overlap.

[0058] Furthermore, in some embodiments, the three groups of longitudinal cavity processing areas are symmetrically distributed with the transverse centerline of the three groups of transverse cavity processing areas as the axis of symmetry, and the three groups of transverse cavity processing areas are symmetrically distributed with the longitudinal centerline of the three groups of longitudinal cavity processing areas as the axis of symmetry.

[0059] It should be noted that by dividing the cavity processing area 3 into two groups, longitudinal and transverse, with no overlap, it is beneficial to process each cavity sequentially, avoiding confusion and repetitive operations during the processing, reducing the idle travel time of the equipment, and thus improving the overall processing efficiency.

[0060] This application also provides a packaging substrate 1, which is processed by the packaging substrate 1 processing method of any of the above embodiments.

[0061] The packaging substrate 1 of this application divides the cavity processing area 3 into an outer ring area 31 and an inner ring area 32, and processes all the outer ring areas 31 first and then processes the inner ring area 32. This suppresses the continuous rise in the temperature of the protective mirror, reduces the risk of volatile substances such as impurities on the protective mirror absorbing a large amount of heat in a short time and burning the protective mirror, improves the problems of cavity position displacement and ABF residue, and improves the quality of the packaging substrate 1.

[0062] In the description of this application, it should be understood that terms such as “first” and “second” are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0063] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0064] It should be understood that the terms "thickness," "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0065] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. At the same time, those skilled in the art will find that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a packaging substrate, characterized in that, include: A substrate is provided, wherein an insulating film is disposed on the substrate; Multiple cavity processing areas are pre-set on the insulating film, wherein each cavity processing area includes an outer ring area and an inner ring area arranged coaxially; Using a first laser ablation process, the outer ring regions are ablated one by one along at least one preset first closed geometric trajectory until all the outer ring regions are ablated. Using a second laser ablation process, the inner ring areas are ablated one by one along a preset surface scanning trajectory until all the inner ring areas are ablated. Wherein, the bottom of the outer ring region after ablation and the bottom of the inner ring region after ablation are on the same plane, and the ablation depth of the outer ring region is the same as the ablation depth of the inner ring region.

2. The method for manufacturing a packaging substrate according to claim 1, characterized in that, The laser energy in the second laser ablation process is greater than the laser energy in the first laser ablation process, and / or the laser beam aperture in the second laser ablation process is greater than the laser beam aperture in the first laser ablation process.

3. The method for manufacturing a packaging substrate according to claim 2, characterized in that, When ablation is performed on the outer ring region, the laser energy is 2.5 mJ to 3.5 mJ, and the laser energy error is less than or equal to 5%. When ablation is performed on the inner ring region, the laser energy is 4.5 mJ to 5.5 mJ, and the laser energy error is less than or equal to 5%.

4. The method for manufacturing a packaging substrate according to claim 2, characterized in that, When ablation is performed on the outer ring region, the laser beam aperture is 45-60 micrometers, and the laser beam aperture error is less than or equal to 5%. When ablation is performed on the inner ring region, the laser beam aperture is 80-100 micrometers, and the laser beam aperture error is less than or equal to 5%.

5. The method for manufacturing a packaging substrate according to claim 1, characterized in that, After performing circumferential ablation of the outer ring region along at least one preset first closed geometric trajectory using a first laser ablation process, the process further includes performing circumferential ablation of the outer ring region along at least one preset second closed geometric trajectory. Wherein, the second closed geometric trajectory corresponds one-to-one with the first closed geometric trajectory, the second closed geometric trajectory coincides with the corresponding first closed geometric trajectory, and the laser action point in the second closed geometric trajectory is staggered with the laser action point in the first closed geometric trajectory; After performing circumferential ablation of the outer region along the first closed geometric trajectory, perform circumferential ablation of the outer region along the second closed geometric trajectory; or... The ablation of the outer ring region along the second closed geometric trajectory is performed simultaneously with the ablation of the outer ring region along the first closed geometric trajectory, and is completed in one go through a composite scanning path.

6. The method for manufacturing a packaging substrate according to claim 5, characterized in that, The number of laser action points in the second closed geometric trajectory is 60%-85% of the number of laser action points in the first closed geometric trajectory.

7. The method for manufacturing a packaging substrate according to claim 1, characterized in that, The cavity processing area is divided into a longitudinal cavity processing area group and a transverse cavity processing area group. The longitudinal cavity processing area group includes multiple cavity processing areas arranged at intervals along the longitudinal direction, and the transverse cavity processing area group includes multiple cavity processing areas arranged along the transverse direction. The longitudinal cavity processing area group and the transverse cavity processing area group do not overlap.

8. The method for manufacturing a packaging substrate according to claim 7, characterized in that, The longitudinal cavity processing area group is symmetrically distributed with the transverse centerline of the transverse cavity processing area group as the axis of symmetry, and the transverse cavity processing area group is symmetrically distributed with the longitudinal centerline of the longitudinal cavity processing area group as the axis of symmetry.

9. A packaging substrate, characterized in that, The packaging substrate is prepared by the manufacturing method according to any one of claims 1 to 8.

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