Manipulator film taking method and electronic equipment

Abstract

The invention relates to the technical field of manipulators, and provides a manipulator film taking method and electronic equipment. The method comprises the steps that a hand fork of a manipulator is controlled to move to the position below a wafer in a wafer carrier box and ascend till the hand fork makes contact with the wafer; when horizontal coordinate deviation exists between the hand fork and the wafer, the hand fork is controlled to descend until the hand fork is out of contact with the wafer; and compensating the horizontal coordinate of the hand fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero, controlling the hand fork to rise and lift the wafer, and moving the wafer out of the wafer carrier box. On one hand, the influence of horizontal coordinate deviation accumulation on the accuracy and efficiency of subsequent pre-alignment can be avoided, and on the other hand, the collision between the wafer and the inner wall of the wafer carrier box when the wafer is taken out can be avoided, so that the damage to the wafer is avoided.

Description

Technical Field

[0001] This application relates to the field of robotic arm technology, specifically to a robotic arm method for picking up a piece and an electronic device. Background Technology

[0002] In the semiconductor manufacturing industry, before each process, wafers need to be transferred from the wafer carrier box to the working chamber. Because the wafers move occasionally within the wafer carrier box, when the robot arm picks up the wafer from the wafer carrier box based on the original position of the wafer, there will be a positional deviation between the robot arm and the wafer, which will affect the transfer accuracy in the subsequent wafer transfer process.

[0003] In routine operations, before wafers arrive at the working chamber for subsequent manufacturing processes, they are pre-calibrated by a pre-aligner to improve the accuracy of wafer transfer. However, since the positional deviation is not addressed during the robotic arm's pick-up, on the one hand, this positional deviation gradually accumulates during multiple wafer transfers, affecting the accuracy and efficiency of subsequent pre-alignment; on the other hand, this positional deviation can cause the wafer to collide with the inner wall of the wafer carrier box when it is picked up by the robotic arm, thus damaging the wafer. Summary of the Invention

[0004] This application provides a robotic arm wafer picking method and electronic device to solve the technical problem that conventional operations do not process positional deviations during wafer picking. On the one hand, during multiple wafer transfers, these positional deviations gradually accumulate, affecting the accuracy and efficiency of subsequent pre-alignment. On the other hand, these positional deviations can cause the wafer to collide with the inner wall of the wafer carrier box when it is picked up by the robotic arm, thereby damaging the wafer.

[0005] In a first aspect, embodiments of this application provide a method for a robotic arm to pick up a piece, including: The robotic arm's fork moves to below the wafer within the wafer carrier box and rises until it contacts the wafer; When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer; The horizontal coordinate of the fork is compensated based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, and the wafer is removed from the wafer carrier box.

[0006] In one embodiment, compensating for the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero includes: When the horizontal coordinate deviation is the first horizontal coordinate deviation between the center of the fork and the center of the wafer, the fork is controlled to move horizontally until the horizontal coordinate of the center of the fork coincides with the horizontal coordinate of the center of the wafer. The horizontal coordinates of the center of the wafer are obtained in advance based on coordinate transformation.

[0007] In one embodiment, the horizontal coordinates of the center of the wafer are obtained based on the following steps: A first coordinate system is established with the center of the fork as the first origin, the left and right axes of symmetry of the fork as the first Y-axis, and the axis perpendicular to the first Y-axis as the first X-axis. Obtain the coordinates of the end offset sensor of the fork in the first coordinate system to obtain the sensor coordinates; Control the fork to rise and move horizontally toward the wafer until the end offset sensor is triggered by the four edge points of the wafer; When the end offset sensor is triggered by each of the four edge points, the transformed coordinates of the center of the fork in the horizontal coordinate system of the robot arm and the horizontal rotation angle of the fork relative to the initial state are obtained. Based on the sensor coordinates, the transformed coordinates, and the horizontal rotation angle, the edge coordinates of the edge point in the horizontal coordinate system of the machine are obtained; Based on the four edge coordinates corresponding to the four edge points, the horizontal coordinates of the center of the wafer are obtained.

[0008] In one embodiment, obtaining the edge coordinates of the edge point in the machine tool's horizontal coordinate system based on the sensor coordinates, the transformed coordinates, and the horizontal rotation angle includes: A second coordinate system is established with the center of the fork as the second origin, the axis parallel to the X-axis of the machine tool's horizontal coordinate system as the second X-axis, and the axis parallel to the Y-axis of the machine tool's horizontal coordinate system as the second Y-axis. Based on the sensor coordinates and the horizontal rotation angle, obtain the coordinates of the edge point in the second coordinate system to be processed; The edge coordinates are obtained by performing coordinate transformation on the coordinates to be processed based on the transformed coordinates.

[0009] In one embodiment, obtaining the horizontal coordinates of the center of the wafer based on the four edge coordinates corresponding to the four edge points includes: Substituting the four edge coordinates into the circle fitting equation, we obtain four circle fitting equations corresponding to the wafer. The horizontal coordinates of the center of the wafer are obtained by jointly solving the four circle fitting equations.

[0010] In one embodiment, compensating for the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero includes: When the horizontal coordinate deviation is the second horizontal coordinate deviation between the center of the fork and the teaching point on the wafer, and the number of horizontal coordinate compensations of the fork is less than a preset number, the fork is controlled to move horizontally until the horizontal coordinate of the center of the fork coincides with the horizontal coordinate of the teaching point on the wafer.

[0011] In one embodiment, after removing the wafer from the wafer carrier cassette, the process includes: The horizontal coordinates of the offset sensor of the fork are acquired in real time; When the offset sensor is triggered, the offset of the wafer relative to the fork is determined based on the horizontal coordinate of the triggered offset sensor, and an offset alarm is generated based on the offset.

[0012] In one embodiment, after controlling the fork to rise and lift the wafer, the following steps are included: The horizontal coordinates of the piece-picking position of the fork are statistically analyzed to obtain statistical coordinates; The statistical coordinates are compared with the pre-stored horizontal coordinates of the image extraction and calibration points to obtain the comparison deviation; When the comparison deviation is greater than the deviation threshold, it is determined that the robot arm is malfunctioning and an alarm is generated.

[0013] Secondly, embodiments of this application provide an electronic device, including a processor and a memory storing a computer program, wherein the processor executes the program to implement the steps of the robotic arm picking up a piece as described in the first aspect.

[0014] Thirdly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the steps of the robotic arm chip-picking method described in the first aspect.

[0015] The robotic arm wafer retrieval method provided in this application involves controlling the robotic arm's fork to move below the wafer within the wafer carrier cassette and rise until it contacts the wafer. If a horizontal coordinate deviation exists between the fork and the wafer, the fork is controlled to descend until it disengages from the wafer. The horizontal coordinate deviation is compensated for by adjusting the fork's horizontal coordinate until it reaches zero. Finally, the fork rises and lifts the wafer, removing it from the wafer carrier cassette. This application compensates for and eliminates the horizontal coordinate deviation between the robotic arm's fork and the wafer during wafer retrieval, and controls the fork to descend before the compensation process. This avoids secondary deflection of the wafer's horizontal coordinate during compensation due to contact between the fork and the wafer, thereby improving compensation accuracy and achieving zero positional deviation of the fork relative to the wafer. This prevents the accumulation of horizontal coordinate deviation from affecting the accuracy and efficiency of subsequent pre-alignment, and also prevents the wafer from colliding with the inner wall of the wafer carrier cassette during removal, thus avoiding damage to the wafer. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is one of the flowcharts illustrating the robotic arm method for retrieving slices provided in this application embodiment; Figure 2 This is a schematic diagram of the robotic arm structure in the robotic arm chip-picking method provided in the embodiments of this application; Figure 3 This is one of the schematic diagrams of the hand fork structure of the robotic arm in the robotic arm plate-picking method provided in the embodiments of this application; Figure 4 This is the second schematic diagram of the hand fork structure of the robotic arm in the robotic arm plate-picking method provided in the embodiments of this application; Figure 5 This is a second schematic flowchart of the robotic arm slice-picking method provided in the embodiments of this application; Figure 6 This is a schematic diagram of the first coordinate system in the robotic arm slice-picking method provided in the embodiments of this application; Figure 7 This is a schematic diagram of the hand fork end offset sensor being triggered by the edge point of the wafer in the robotic arm wafer picking method provided in this application embodiment; Figure 8 This is a schematic diagram of the hand fork end offset sensor being triggered by the edge point of the wafer in the robotic arm wafer picking method provided in this application embodiment; Figure 9This is a schematic diagram of edge point coordinate transformation in the robotic arm chip-picking method provided in this application embodiment; Figure 10 This is the third flowchart illustrating the robotic arm method for retrieving slices provided in this application embodiment; Figure 11 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application.

[0018] Figure label: 1-Rotation axis; 2-Lifting axis; 3-Left arm axis; 4-Right arm axis; 5-Hand fork; 51-Finger; 52-Offset sensor; 53-Wafer support point; 6-Machinery; 7-Wafer. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that in the description of the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terms "upper," "lower," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; and they can be internal connections between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] The terms "first," "second," etc., used in this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, without limiting the number of objects; for example, a first object can be one or more. Furthermore, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects have an "or" relationship.

[0022] Figure 1 This is one of the flowcharts illustrating the robotic arm method for retrieving wafers provided in this application; see reference. Figure 1 This application provides a method for a robotic arm to pick up a piece, which may include: 101. Control the robotic arm's fork to move to below the wafer inside the wafer carrier box and rise until it contacts the wafer; 102. When there is a horizontal coordinate deviation between the fork and the wafer, control the fork to descend until it loses contact with the wafer; 103. Based on the horizontal coordinate deviation, compensate for the horizontal coordinate of the hand fork until the horizontal coordinate deviation is zero. Then, control the hand fork to rise and lift the wafer, and remove the wafer from the wafer carrier box.

[0023] Reference Figures 2 to 4 The robotic arm includes a rotating axis 1, a lifting axis 2, a left arm axis 3, a right arm axis 4, and a hand fork 5, and the robotic arm is mounted on a machine base 6; the hand fork 5 also includes fingers 51, an offset sensor 52, and a wafer support point 53. The fingers 51 are symmetrically arranged, and the offset sensor 52 and the wafer support point 53 are located at the end and root of the side of the fingers 51 that will contact the wafer 7.

[0024] In step 102, when the fork contacts the wafer, if there is a horizontal position deviation between the two, i.e., a horizontal coordinate deviation, the offset sensor on the fork will be triggered to generate an alarm. At this time, the fork needs to be controlled to descend and disengage from the wafer so that horizontal coordinate compensation can be performed subsequently.

[0025] In step 103, after horizontal coordinate compensation, the horizontal coordinate deviation is zero, that is, the horizontal position deviation between the fork and the wafer has been eliminated, and the two are completely aligned in the vertical direction. At this time, the fork can be controlled to rise and pick up the wafer, so as to achieve accurate acquisition of the wafer. At this time, the offset sensor on the fork will not be triggered.

[0026] The robotic arm wafer retrieval method provided in this embodiment controls the robotic arm's fork to move below the wafer in the wafer carrier box and rise until it contacts the wafer. When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer. The horizontal coordinate deviation of the fork is compensated for until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, removing it from the circular carrier box. This embodiment compensates for and eliminates the horizontal coordinate deviation between the robotic arm's fork and the wafer during wafer retrieval. Furthermore, the fork is controlled to descend before the compensation process to avoid secondary deflection of the wafer's horizontal coordinate during the compensation process due to contact between the fork and the wafer. This improves compensation accuracy and achieves zero positional deviation of the fork relative to the wafer. On the one hand, it avoids the accumulation of horizontal coordinate deviation affecting the accuracy and efficiency of subsequent pre-alignment; on the other hand, it avoids collisions between the wafer and the inner wall of the wafer carrier box when it is removed, thus preventing wafer damage.

[0027] Figure 5 This is the second flowchart illustrating the robotic arm method for retrieving a wafer provided in this application; see also... Figure 5 In one embodiment, compensating for the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero may include: When the horizontal coordinate deviation is the first horizontal coordinate deviation between the center of the fork and the center of the wafer, the fork is controlled to move horizontally until the horizontal coordinate of the fork's center coincides with the horizontal coordinate of the wafer's center. The horizontal coordinate of the wafer's center is obtained in advance based on coordinate transformation. Specifically, the horizontal coordinate of the wafer's center can be obtained based on the following steps: 501. Establish a first coordinate system with the center of the fork as the first origin, the left and right axes of symmetry of the fork as the first Y-axis, and the axis perpendicular to the first Y-axis as the first X-axis. 502. Obtain the coordinates of the end offset sensor of the fork in the first coordinate system to obtain the sensor coordinates; 503. Control the fork to rise and move horizontally towards the wafer until the end offset sensor is triggered by the four edge points of the wafer; 504. When the end offset sensor is triggered by each of the four edge points, obtain the transformed coordinates of the center of the fork in the horizontal coordinate system of the robot arm and the horizontal rotation angle of the fork relative to the initial state. 505. Based on sensor coordinates, transformed coordinates, and horizontal rotation angle, obtain the edge coordinates of the edge points in the machine tool's horizontal coordinate system; 506. Based on the four edge coordinates corresponding to the four edge points, obtain the horizontal coordinates of the center of the wafer.

[0028] In steps 501 to 502, refer to Figure 6 The center O of the fork is the first origin, in the first coordinate system. In the middle, the coordinates of the end offset sensors M and N are respectively and .

[0029] In step 503, refer to Figures 7 to 8 When M is triggered by the edge of the wafer, the first edge point A of the wafer is obtained. When N is triggered by the edge of the wafer, the second edge point B of the wafer is obtained. M and N can be triggered by A and B successively, or they can be triggered by A and B simultaneously. This is not limited here. When M is triggered by the edge of the wafer, the third edge point C of the wafer is obtained. When N is triggered by the edge of the wafer, the fourth edge point D of the wafer is obtained. M and N can be triggered by C and D successively, or they can be triggered by C and D simultaneously. This is not limited here.

[0030] In step 504, since the center position of the fork changes and there is an angular deflection during its movement, while the machine tool remains fixed, it is ultimately necessary to transform the coordinates of all edge points to the machine tool's horizontal coordinate system for calculation. At this point, when the end sensor is triggered or terminated by an edge point, the transformed coordinates of the fork's center O in the machine tool's horizontal coordinate system and the horizontal rotation angle of the fork relative to its initial state need to be obtained and locked. Here, the initial state refers to the stationary state of the fork between steps 502 and 503. Therefore: When M is triggered by A, the first transformed coordinate of the center O of the fork is: The first horizontal rotation angle of the fork relative to its initial state is ; When N is triggered by B, the second transformation coordinate of the center O of the fork is: The second horizontal rotation angle of the fork relative to its initial state is ; When M is terminated by C, the third transformation coordinate of the center O of the fork is: The third horizontal rotation angle of the fork relative to the initial state is ; When N is terminated by D, the fourth transformed coordinate of the center O of the fork is: The fourth horizontal rotation angle of the fork relative to the initial state is: .

[0031] Reference Figure 9 Step 505 can be described as follows: 505a. Establish a second coordinate system with the center of the fork as the second origin, the axis parallel to the X-axis of the machine's horizontal coordinate system as the second X-axis, and the axis parallel to the Y-axis of the machine's horizontal coordinate system as the second Y-axis. 505b. Based on the sensor coordinates and the horizontal rotation angle, obtain the coordinates of the edge point in the second coordinate system to be processed; 505c. Based on the transformed coordinates, perform coordinate transformation on the coordinates to be processed to obtain the edge coordinates.

[0032] In step 505a, that is, taking the center O of the moved fork as the second origin, with... Indicates the second X-axis, with If the second Y-axis is represented, then the second coordinate system is... .

[0033] In step 505b, assume that the first coordinate to be processed for A is... The second coordinate to be processed for B is The third coordinate to be processed for C is The fourth coordinate to be processed in D is Then we have: (5-1) (5-2) (5-3) (5-4) (5-5) (5-6) (5-7) (5-8) In step 505c, using the transformed coordinates, we can obtain: The first edge coordinate of A in the machine tool's horizontal coordinate system is: ,by express; The second edge coordinate of B in the machine tool's horizontal coordinate system is: ,by express; The third edge coordinate of C in the machine tool's horizontal coordinate system is: ,by express; The fourth edge coordinate of D in the machine tool's horizontal coordinate system is: ,by express; Substitute formulas (5-1) to (5-8) into the equations respectively. , , and That's all.

[0034] Step 506 can be described as follows: 506a. Substitute the four edge coordinates into the circle fitting equation to obtain the four circle fitting equations corresponding to the wafer. 506b. Solve the four circle fitting equations together to obtain the horizontal coordinates of the center of the wafer.

[0035] In step 506a, the circle fitting equation for the four non-collinear points can be: (5-9) in, To fit the coordinates of the center of the circle, To fit the coordinates of a point on the circle, As a constant, , , and Substituting into formulas (5-9) respectively, we get: ; ; ; ; In step 506b, the above system of equations is written as... In the form of, where: , , ; Its least squares solution for: (5-10) in: ; ; make: ; ; ; ; ; ; ; ; but: (5-11) (5-12) Multiply both sides of formula (5-10) by get Substitute (5-11) and (5-12) into The formula was then solved using Cramer's rule to obtain: ; ; Will and Substituting the expressions for the elements within each matrix into the equations and then simplifying the calculations, we obtain: ; ; Furthermore, the same method can be used to obtain... Then, substitute it into the formula for the radius of the fitted circle. After sorting, we obtained: ; When the horizontal coordinate of the center of the fork is When they overlap, record This is the coordinate of the center O of the fork at this moment.

[0036] In this embodiment, during the movement of the fork, its offset sensor is triggered by four edge points on the wafer edge. The horizontal coordinates of the offset sensor in the first coordinate system and the rotation angle of the offset sensor relative to the initial state when the offset sensor is triggered or terminated by these four edge points are used to calculate the horizontal coordinates of these four edge points in the second coordinate system. Finally, based on the transformation coordinates of the center of the fork in the machine horizontal coordinate system when the offset sensor is triggered or terminated by these four edge points, the horizontal coordinates of these four edge points in the second coordinate system are transformed to the machine horizontal coordinate system. Thus, the four edge points can be circle-fitted in the fixed machine horizontal coordinate system to obtain accurate circle center coordinates. These circle center coordinates are the horizontal coordinates of the wafer center. Finally, the fork can be controlled to move horizontally until the horizontal coordinates of its center coincide with the horizontal coordinates of the circle center.

[0037] It should be noted that the coincidence of the horizontal coordinate of the center of the fork with the horizontal coordinate of the center of the wafer is an ideal situation. In practice, the deviation between the two is less than a set threshold, which can be considered to have eliminated the first horizontal coordinate deviation.

[0038] In one embodiment, compensating for the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero may include: When the horizontal coordinate deviation is the second horizontal coordinate deviation between the center of the fork and the teaching point on the wafer, and the number of horizontal coordinate compensations of the fork is less than the preset number, the fork is controlled to move horizontally until the horizontal coordinate of the center of the fork coincides with the horizontal coordinate of the teaching point on the wafer.

[0039] Reference Figures 2 to 4 The fork has three offset sensors on its fingers, and a teach point is set on the wafer. When the fork's wafer picking position shifts, the center of the fork will deviate from the teach point on the wafer, causing the wafer to shift relative to the fork. This shift will trigger at least one of the three offset sensors on the fork's fingers, causing the offset sensor to generate an offset alarm. At this point, under the constraint of the number of horizontal coordinate compensations, the horizontal coordinate of the fork needs to be compensated before the fork is controlled to contact the wafer. It is then determined whether there is a horizontal coordinate deviation between the center of the fork and the teach point. If there is, the horizontal coordinate of the fork is compensated again. If not, the fork can be controlled to lift the wafer and remove it from the wafer carrier box.

[0040] Furthermore, after removing the wafer from the wafer carrier cassette, the process may include: The horizontal coordinates of the offset sensor of the hand fork are acquired in real time. When the offset sensor is triggered, the offset of the wafer relative to the hand fork is determined based on the horizontal coordinates of the triggered offset sensor, and an offset alarm is generated based on the offset.

[0041] The above specific process can be described as follows: Figure 10 As shown: 1. Control the robotic arm's fork to move to below the wafer inside the wafer carrier box and rise until it just touches the wafer; 2. Determine if there is a horizontal coordinate deviation between the center of the fork and the teaching point on the wafer; 3A. If not, control the fork to continue rising and lift the wafer, removing the wafer from the wafer carrier box; 3B. If yes, then determine whether the number of times the horizontal coordinate of the fork is compensated is greater than or equal to the preset number; the preset number can be 3 times. 4B. If not, then determine again whether there is a horizontal coordinate deviation between the center of the fork and the teaching point on the wafer; 5B. If so, calculate the amount to be compensated for the fork based on the horizontal coordinate deviation; 6B. Control the fork to descend until it loses contact with the wafer; 7B. Compensate for the horizontal coordinate of the fork based on the amount to be compensated; 8B. Control the robotic arm's fork to move to below the wafer in the wafer carrier box and rise until it just touches the wafer. Then return to step 3B. After the number of horizontal coordinate compensations of the fork is greater than or equal to the preset number, return to step 4C. Step 3B is followed by: 4C. If so, control the fork to descend until it loses contact with the wafer; 5C. Based on the compensation amount of the fork calculated in the previous compensation, compensate the horizontal coordinate of the fork. 6C. Control the robotic arm's fork to move to below the wafer in the wafer carrier box and rise until it just touches the wafer, then return to step 3A; Step 4B is followed by: 5D. If not, return to step 4C; Step 3A is followed by: 4E. Real-time determination of whether there is a horizontal coordinate deviation between the center of the hand fork and the teaching point on the wafer; 5E. If so, then trigger the offset sensor alarm; 5F. If not, then confirm that the fork has been used to pick up the slice.

[0042] In this embodiment, when there is a horizontal coordinate deviation between the center of the fork and the teaching point on the wafer, the horizontal coordinate of the fork is continuously compensated to eventually achieve zero horizontal coordinate deviation. It should be noted that zero horizontal coordinate deviation is an ideal situation. In practice, the horizontal coordinate deviation is considered to be eliminated if it is less than a set threshold. The set threshold can be 0.1 mm to 1 mm, thereby ensuring the accuracy of the fork in picking up the wafer. During the wafer transfer process, the horizontal coordinate of the offset sensor on the fork is used to determine and record the offset of the wafer relative to the fork and generate an offset alarm. Based on this, the horizontal placement coordinate of the wafer can be adjusted when placing the wafer after this transfer, or the horizontal coordinate of the fork can be compensated when picking up the wafer again after placement, so as to correct the horizontal coordinate deviation caused by the wafer sliding on the fork during this transfer process and improve the transfer accuracy of the wafer.

[0043] In one embodiment, after controlling the fork to rise and lift the wafer, the following may be included: The horizontal coordinates of the fork's pick-up position are statistically analyzed to obtain statistical coordinates. These statistical coordinates are then compared with the pre-stored horizontal coordinates of the pick-up calibration point to obtain the comparison deviation. If the comparison deviation exceeds the deviation threshold, the robot arm's operation is determined to be abnormal, and a machine abnormality alarm is generated.

[0044] It should be noted that the statistical coordinates can be multiple horizontal coordinates of multiple wafer pick-up positions at a certain wafer carrier cassette, or coordinates obtained after averaging or other operations on these horizontal coordinates. If there are multiple horizontal coordinates, they can be compared one by one with the horizontal coordinates of the wafer pick-up calibration point to obtain multiple comparison deviations. If a preset number of comparison deviations are greater than the deviation threshold, it is determined that the machine is operating abnormally and an abnormal alarm is generated. If it is an averaged horizontal coordinate, it is compared with the horizontal coordinates of the wafer pick-up calibration point to obtain a single comparison deviation. When the comparison deviation is greater than the deviation threshold, it is determined that the machine is operating abnormally and an abnormal alarm is generated.

[0045] This embodiment can perform statistical analysis on the horizontal coordinates of the hand fork's plate-picking position and issue alarms for any abnormal machine conditions detected by the analysis. This allows staff to perform maintenance and repairs on the machine to eliminate abnormalities and prevent downtime caused by inaccurate coordinates.

[0046] Figure 11 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application, such as... Figure 11 As shown, the electronic device may include: a processor 1110, a communication interface 1120, a memory 1130, and a communication bus 1140, wherein the processor 1110, the communication interface 1120, and the memory 1130 communicate with each other via the communication bus 1140. The processor 1110 can call the computer program in the memory 1130 to execute the steps of the robotic arm's chip-picking method, such as: The robotic arm's fork moves to below the wafer within the wafer carrier box and rises until it contacts the wafer; When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer; The horizontal coordinate of the fork is compensated based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, and the wafer is removed from the wafer carrier box.

[0047] Furthermore, the logical instructions in the aforementioned memory 1130 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0048] On the other hand, this application also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can perform the steps of the robotic arm picking method provided in the above embodiments, such as including: The robotic arm's fork moves to below the wafer within the wafer carrier box and rises until it contacts the wafer; When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer; The horizontal coordinate of the fork is compensated based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, and the wafer is removed from the wafer carrier box.

[0049] On the other hand, embodiments of this application also provide a non-transitory computer-readable storage medium storing a computer program thereon, the computer program being used to cause a processor to execute the steps of the robotic arm chip-picking method provided in the above embodiments, for example including: The robotic arm's fork moves to below the wafer within the wafer carrier box and rises until it contacts the wafer; When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer; The horizontal coordinate of the fork is compensated based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, and the wafer is removed from the wafer carrier box.

[0050] The non-transitory computer-readable storage medium can be any available medium or data storage device that the processor can access, including but not limited to magnetic memory (e.g., floppy disk, hard disk, magnetic tape, magneto-optical disk (MO)), optical memory (e.g., CD, DVD, BD, HVD), and semiconductor memory (e.g., ROM, EPROM, EEPROM, non-volatile memory (NAND FLASH), solid-state drive (SSD)).

[0051] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for a robotic arm to pick up a piece, characterized in that, include: The robotic arm's fork moves to below the wafer within the wafer carrier box and rises until it contacts the wafer; When there is a horizontal coordinate deviation between the fork and the wafer, the fork is controlled to descend until it loses contact with the wafer; The horizontal coordinate of the fork is compensated based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero. Then, the fork is controlled to rise and lift the wafer, and the wafer is removed from the wafer carrier box.

2. The robotic arm method for picking up a piece according to claim 1, characterized in that, The step of compensating the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero includes: When the horizontal coordinate deviation is the first horizontal coordinate deviation between the center of the fork and the center of the wafer, the fork is controlled to move horizontally until the horizontal coordinate of the center of the fork coincides with the horizontal coordinate of the center of the wafer. The horizontal coordinates of the center of the wafer are obtained in advance based on coordinate transformation.

3. The robotic arm method for picking up a piece according to claim 2, characterized in that, The horizontal coordinates of the center of the wafer are obtained based on the following steps: A first coordinate system is established with the center of the fork as the first origin, the left and right axes of symmetry of the fork as the first Y-axis, and the axis perpendicular to the first Y-axis as the first X-axis. Obtain the coordinates of the end offset sensor of the fork in the first coordinate system to obtain the sensor coordinates; Control the fork to rise and move horizontally toward the wafer until the end offset sensor is triggered by the four edge points of the wafer; When the end offset sensor is triggered by each of the four edge points, the transformed coordinates of the center of the fork in the horizontal coordinate system of the robot arm and the horizontal rotation angle of the fork relative to the initial state are obtained. Based on the sensor coordinates, the transformed coordinates, and the horizontal rotation angle, the edge coordinates of the edge point in the horizontal coordinate system of the machine are obtained; Based on the four edge coordinates corresponding to the four edge points, the horizontal coordinates of the center of the wafer are obtained.

4. The robotic arm method for picking up a piece according to claim 3, characterized in that, The step of obtaining the edge coordinates of the edge point in the horizontal coordinate system of the machine tool based on the sensor coordinates, the transformed coordinates, and the horizontal rotation angle includes: A second coordinate system is established with the center of the fork as the second origin, the axis parallel to the X-axis of the machine tool's horizontal coordinate system as the second X-axis, and the axis parallel to the Y-axis of the machine tool's horizontal coordinate system as the second Y-axis. Based on the sensor coordinates and the horizontal rotation angle, obtain the coordinates of the edge point in the second coordinate system to be processed; The edge coordinates are obtained by performing coordinate transformation on the coordinates to be processed based on the transformed coordinates.

5. The robotic arm method for picking up a piece according to claim 3, characterized in that, The step of obtaining the horizontal coordinates of the center of the wafer based on the four edge coordinates corresponding to the four edge points includes: Substituting the four edge coordinates into the circle fitting equation, we obtain four circle fitting equations corresponding to the wafer. The horizontal coordinates of the center of the wafer are obtained by jointly solving the four circle fitting equations.

6. The robotic arm method for picking up a piece according to claim 1, characterized in that, The step of compensating the horizontal coordinate of the fork based on the horizontal coordinate deviation until the horizontal coordinate deviation is zero includes: When the horizontal coordinate deviation is the second horizontal coordinate deviation between the center of the fork and the teaching point on the wafer, and the number of horizontal coordinate compensations of the fork is less than a preset number, the fork is controlled to move horizontally until the horizontal coordinate of the center of the fork coincides with the horizontal coordinate of the teaching point on the wafer.

7. The robotic arm method for picking up a piece according to claim 1, characterized in that, After removing the wafer from the wafer carrier cassette, the process includes: The horizontal coordinates of the offset sensor of the fork are acquired in real time; When the offset sensor is triggered, the offset of the wafer relative to the fork is determined based on the horizontal coordinate of the triggered offset sensor, and an offset alarm is generated based on the offset.

8. The robotic arm method for picking up a piece according to claim 1, characterized in that, After controlling the fork to rise and lift the wafer, the following steps are included: The horizontal coordinates of the piece-picking position of the fork are statistically analyzed to obtain statistical coordinates; The statistical coordinates are compared with the pre-stored horizontal coordinates of the image extraction and calibration points to obtain the comparison deviation; When the comparison deviation is greater than the deviation threshold, it is determined that the robot arm is malfunctioning and an alarm is generated.

9. An electronic device comprising a processor and a memory storing a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the robotic arm slice-picking method according to any one of claims 1 to 8.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the robotic arm slice-picking method according to any one of claims 1 to 8.

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