Colored chemical-plating-resistant packaging slurry and preparation method and application thereof

Abstract

The invention discloses colored chemical plating resistant packaging slurry and a preparation method and application thereof, and belongs to the technical field of electronic packaging, the colored chemical plating resistant packaging slurry comprises glass powder and an organic carrier; the glass powder comprises the following components: bismuth oxide, silicon oxide, zinc oxide, an additive, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate; the organic carrier comprises resin, and the resin comprises ethyl cellulose, acrylic resin and polyvinyl butyral resin in a mass ratio of 1: (0.4-1.6): (0.4-1.6); the additive comprises boric acid and sodium carbonate in a mass ratio of (7-10): (0.5-3). The influence of the packaging slurry on the resistivity of the silver wire is lt; the influence of the resistance value of the thick film resistor with the square resistance of 100 ohm / m and 1 k ohm / m is 1m; and after chemical nickel-palladium-gold plating, the glaze gloss of the glass is not lost, the thickness is not lost, and the method has a wide application prospect.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging technology, specifically a colored chemical-resistant coating slurry, its preparation method, and its application. Background Technology

[0002] Traditional encapsulation pastes are divided into medium-temperature encapsulation pastes (600~650℃) and high-temperature encapsulation pastes (750~850℃). Due to the sintering characteristics of multilayer structures in the manufacturing process of thick-film hybrid integrated circuits, the surface encapsulation glass glaze is required to have a low sintering temperature, requiring sintering within the temperature range of 600~650℃ (i.e., medium-temperature sintering).

[0003] Medium-temperature sintering (600-650℃) requires a low softening point for the glass paste. For encapsulation on the surface of thick-film resistors, the effect of the sintered glass glaze on the resistance of the thick-film resistor and silver lines must be less than 2%. For high-density thick-film hybrid integrated circuits, the resistance of the silver lines in ultra-fine circuits is not negligible, and the resistance variation and accuracy of the thick-film resistors have a significant impact on product performance. Therefore, the influence of the encapsulating glass glaze on the resistance of the silver lines and the resistance of the thick-film resistors needs to be controlled as small as possible.

[0004] In thick-film hybrid integrated circuits, some products require chip packaging, and the connection between the chip and the circuit is usually achieved through gold wire bonding. The silver pads on the packaging substrate have a low yield during gold wire bonding; therefore, nickel-gold or nickel-palladium-gold plating is typically used to improve the bonding yield. Consequently, the encapsulating glass enamel must also be resistant to dissolution or corrosion in the strong acid and reducing environment of the plating process.

[0005] Therefore, this application is submitted. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a colored chemical-resistant encapsulation paste, its preparation method and application, which has little impact on the resistance value of thick film resistors.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A colored chemical-resistant encapsulation paste, comprising glass powder and an organic carrier; The glass powder comprises the following components in parts by weight: 50-56 parts bismuth oxide, 25-29 parts silicon oxide, 7-10 parts zinc oxide, 7.5-13 parts additives, 0.5-5 parts zirconium oxide, 0.5-5 parts titanium oxide, 0.5-3 parts aluminum oxide, and 0.5-1 part calcium carbonate. The organic carrier includes a resin comprising ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:(0.1~0.4):(0.1~0.4). The additives include boric acid and sodium carbonate in a mass ratio of (7~10):(0.5~3).

[0008] The glass powder described in this invention possesses acid resistance, reduction resistance, and a coefficient of thermal expansion of less than 7.5*10. -6 The colored chemical-resistant encapsulation paste described above has a suitable viscosity, making it suitable for screen printing application onto product surfaces. After sintering at 600℃ (medium temperature), a dense and uniform glass glaze layer is formed. Due to the high viscosity of the glass powder after melting, its wettability to silver and resistors is low, thus allowing less penetration into the silver wires and thick-film resistors, minimizing impact on their resistivity and sheet resistance. Because this glass contains low levels of acid-sensitive components and a high Si-B-Bi content forming a network structure, the acid-sensitive elements are completely encapsulated within the network structure and are not corroded by acid. Furthermore, since this glass powder contains no variable valence elements, it will not be reduced in reducing systems, resulting in excellent chemical resistance. The encapsulation paste has an impact of <1% on the resistivity of silver wires and <1.5% on the resistance of thick-film resistors. After electroless nickel-palladium-gold plating, the glass glaze exhibits no loss of gloss or thickness, demonstrating broad application prospects.

[0009] The glass powder of this invention has bismuth oxide as the main component, which, together with silicon oxide, forms a framework structure, providing a basic coefficient of thermal expansion and softening point. Zinc oxide, calcium carbonate, and aluminum oxide can significantly improve the chemical stability of the glass powder, enhance its resistance to chemical plating, and improve its mechanical strength. The addition of sodium carbonate and boric acid significantly improves the softening point and coefficient of thermal expansion of the system, promotes glass crystallization, and enables the glass powder to be sintered at medium temperatures. The addition of titanium oxide and zirconium oxide improves its acid resistance and corrosion resistance. The interaction and mutual influence among the components of the glass powder enable the encapsulation paste to achieve a medium-temperature sintering effect and improve its influence on the resistivity of thick film pastes.

[0010] The resin is adapted to the glass powder, giving the glass powder excellent thixotropic properties, effectively improving the flowability and stability of the glass powder, improving the resolution of the encapsulation paste, preventing it from penetrating into the silver wires and the interior of the thick film resistor, and reducing its impact on the resistance value of the thick film resistor paste.

[0011] In a preferred embodiment of the present invention, the resin comprises ethyl cellulose, acrylic resin and polyvinyl butyral resin in a mass ratio of 1:(0.1~0.2):(0.1~0.2).

[0012] In a preferred embodiment of the present invention, the organic carrier comprises a resin, a solvent, a leveling agent, a defoamer, and a dispersant in a mass ratio of (8~12):(78~85):(1~3):(1~3):(4~10).

[0013] In a preferred embodiment of the present invention, the solvent includes at least one of terpineol, diethylene glycol dibenzoate, diethylene glycol butyl ether, diethylene glycol butyl ether acetate, dipropylene glycol butyl ether acetate, dipropylene glycol butyl ether, petroleum ether, isophorone, and N,N-dimethylformamide.

[0014] In a preferred embodiment of the present invention, the solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:(0.2~0.3).

[0015] In a preferred embodiment of the present invention, the mass ratio of the glass powder to the organic carrier is (6.5~7.2):(2.8~3.5).

[0016] In a preferred embodiment of the present invention, the leveling agent is an acrylate leveling agent.

[0017] In a preferred embodiment of the present invention, the defoamer is a solvent-free defoamer; The dispersant is a polyphosphate dispersant.

[0018] This invention also provides a method for preparing a colored chemical-resistant coating paste, comprising the following steps: Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate are mixed evenly and melted. The molten slurry is then quenched with water, dried, and ball-milled to obtain glass powder. The organic carrier and glass powder are mixed evenly and ground to obtain a colored chemical-resistant coating slurry.

[0019] In a preferred embodiment of the present invention, the melting temperature is 1180~1250℃.

[0020] This invention also provides an application of a colored chemical-resistant plating encapsulation paste in the preparation of electronic components.

[0021] The beneficial effects of this invention are as follows: the glass powder described in this invention has acid resistance, reduction resistance, and an expansion coefficient of less than 7.5*10. -6The colored chemical-resistant encapsulation paste described above has a suitable viscosity, making it suitable for screen printing application onto product surfaces. After sintering at 600℃ (medium temperature), a dense and uniform glass glaze layer is formed. Due to the high viscosity of the molten glass powder, its wettability to silver and resistors is low, thus allowing less penetration into the silver wires and thick-film resistors, minimizing impact on their resistivity and sheet resistance. Because this glass contains fewer acid-sensitive components and has a high Si-B-Bi content forming a network structure, the acid-sensitive elements are completely encapsulated within the network structure and are not corroded by acid. Furthermore, since this glass powder contains no variable-valence elements, it will not be reduced in reducing systems, resulting in excellent chemical resistance. The encapsulation paste has a <1% impact on the resistivity of silver wires and a <1.5% impact on the resistance of thick-film resistors with sheet resistances of 100Ω / m and 1kΩ / m. After electroless nickel-palladium-gold plating, the glass glaze exhibits no loss of gloss or thickness, demonstrating broad application prospects. Attached Figure Description

[0022] Figure 1 Printed image for resolution testing.

[0023] Figure 2 This is a graph showing the resistivity of silver. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In this application, the technical features described in an open-ended manner include both closed technical solutions consisting of the listed features and open technical solutions that include the listed features.

[0026] In this application, numerical ranges are referred to as continuous unless otherwise specified, and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0027] In this application, there are no particular restrictions on the specific dispersion and mixing methods.

[0028] Unless otherwise specified, all components, raw materials, or instruments used in the embodiments and comparative examples of this invention are commercially available, and the same type of components and raw materials are used in each parallel experiment.

[0029] The acrylic resin is derived from Nanben Chemical, and its grade is ER2600.

[0030] Polyvinyl butyral resin is derived from Sekisui Chemicals, brand name BM-2.

[0031] The following embodiments are provided to facilitate understanding of the invention. These embodiments are not intended to limit the scope of the claims.

[0032] Example 1 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0033] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0034] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0035] The leveling agent is an acrylate leveling agent, BYK3500.

[0036] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0037] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0038] Example 2 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0039] The glass powder comprises the following components in parts by weight: 56 parts bismuth oxide, 25 parts silicon oxide, 10 parts zinc oxide, 7 parts boric acid, 0.5 parts sodium carbonate, 5 parts zirconium oxide, 0.5 parts titanium oxide, 3 parts aluminum oxide, and 0.5 parts calcium carbonate.

[0040] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0041] The leveling agent is an acrylate leveling agent, BYK3500.

[0042] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0043] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0044] Example 3 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0045] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0046] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.1:0.2. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0047] The leveling agent is an acrylate leveling agent, BYK3500.

[0048] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0049] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0050] Example 4 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0051] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0052] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.4:0.2. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0053] The leveling agent is an acrylate leveling agent, BYK3500.

[0054] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0055] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0056] Example 5 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0057] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0058] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.4. The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:0.25.

[0059] The leveling agent is an acrylate leveling agent, BYK3500.

[0060] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0061] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0062] Example 6 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0063] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0064] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent is terpineol.

[0065] The leveling agent is an acrylate leveling agent, BYK3500.

[0066] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0067] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0068] Example 7 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0069] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0070] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent is diethylene glycol dibenzoate.

[0071] The leveling agent is an acrylate leveling agent, BYK3500.

[0072] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0073] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0074] Example 8 A colored chemical-resistant coating slurry comprises glass powder and an organic carrier in a mass ratio of 7:3.

[0075] The glass powder comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts boric acid, 3 parts sodium carbonate, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0076] The organic carrier comprises resin, solvent, leveling agent, defoamer, and dispersant in a mass ratio of 10:80:2:2:6. The resin comprises ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:0.2:0.1. The solvent comprises terpineol and diethylene glycol butyl ether in a mass ratio of 1:0.25.

[0077] The leveling agent is an acrylate leveling agent, BYK3500.

[0078] The defoamer is a solvent-free defoamer, BYK1794. The dispersant is a polyphosphate dispersant, BYK110.

[0079] The preparation method of the aforementioned colored chemical-resistant coating slurry includes the following steps: (1) Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide and calcium carbonate are mixed evenly and melted at 1200℃. The molten slurry is quenched with water, dried and ball-milled until D50 is 1.5μm to obtain glass powder. (2) Add solvent, leveling agent, defoamer and dispersant to a mixing tank in proportion and stir evenly. Then heat to 60°C, stir evenly, add resin, stir evenly, and obtain organic carrier. (3) Mix the organic carrier and glass powder evenly, and then grind them with three rollers to obtain a colored chemical-resistant coating slurry.

[0080] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the ratio of glass powder is different, but everything else is the same.

[0081] The glass powder described in this comparative example comprises the following components in parts by weight: 40 parts bismuth oxide, 40 parts silicon oxide, 5 parts zinc oxide, 12 parts boric acid, 5 parts sodium carbonate, 0.2 parts zirconium oxide, 6 parts titanium oxide, 0.2 parts aluminum oxide, and 2 parts calcium carbonate.

[0082] Comparative Example 2 The difference between Comparative Example 2 and Example 1 is that the ratio of glass powder is different, but everything else is the same.

[0083] The glass powder described in this comparative example comprises the following components in parts by weight: 65 parts bismuth oxide, 20 parts silicon oxide, 12 parts zinc oxide, 4 parts boric acid, 2 parts sodium carbonate, 6 parts zirconium oxide, 0.2 parts titanium oxide, 4 parts aluminum oxide, and 0.4 parts calcium carbonate.

[0084] Comparative Example 3 The difference between Comparative Example 3 and Example 1 is that Comparative Example 3 does not contain boric acid and sodium carbonate, but they are otherwise the same.

[0085] The glass powder described in this comparative example comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0086] Comparative Example 4 The difference between Comparative Example 4 and Example 1 is that Comparative Example 4 uses boron oxide to replace boric acid and sodium carbonate in equal amounts, while everything else is the same.

[0087] The glass powder described in this comparative example comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 13 parts boron oxide, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0088] Comparative Example 5 The difference between Comparative Example 5 and Example 1 is that the glass powder was selected differently (other components were used to replace boric acid and sodium carbonate), but everything else was the same.

[0089] The glass powder described in this comparative example comprises the following components in parts by weight: 50 parts bismuth oxide, 29 parts silicon oxide, 7 parts zinc oxide, 10 parts magnesium oxide, 3 parts tungsten oxide, 0.5 parts zirconium oxide, 5 parts titanium oxide, 0.5 parts aluminum oxide, and 1 part calcium carbonate.

[0090] Comparative Example 6 The difference between Comparative Example 6 and Example 1 is that the resin is different (the total amount of resin remains the same), but everything else is the same.

[0091] The resins described in this comparative example comprise acrylic resin and polyvinyl butyral resin in a mass ratio of 0.65:0.65.

[0092] Comparative Example 7 The difference between Comparative Example 7 and Example 1 is that the resin is different (the total amount of resin remains the same), but everything else is the same.

[0093] The resin described in this comparative example comprises ethyl cellulose and polyvinyl butyral resin in a mass ratio of 1:0.2.

[0094] Comparative Example 8 The difference between Comparative Example 8 and Example 1 is that the resin is different (the total amount of resin remains the same), but everything else is the same.

[0095] The resin described in this comparative example comprises ethyl cellulose and acrylic resin in a mass ratio of 1:0.1.

[0096] Test case Resolution Test: This invention employs screen printing with a 420-mesh polyester screen, a 10-micron adhesive thickness, and a screen tension of 25N. The printed lines are designed with line widths and spacings of 80μm / 80μm, 100μm / 100μm, 120μm / 120μm, 150μm / 150μm, 180μm / 180μm, and 250μm / 250μm. The test pattern is shown below. Figure 1 As shown. The test is based on the premise that the lines have neat edges and are not connected. The minimum line width and line spacing with neat edges and not connected lines is the resolution of the slurry.

[0097] Resistivity effect test: such as Figure 2 As shown, a layer of glass paste as shown above is printed on the silver line for silver resistivity testing. After sintering, the silver resistance value is measured before and after sintering (600℃, 10min) to calculate the effect of glass paste sintering on silver resistivity. The resistance change rate is calculated as follows: resistance change rate = 100 * (resistance after sintering - resistance before sintering) / resistance before sintering.

[0098] Sheet resistance influence test: A layer of glass paste as shown above is printed on the sheet resistance test piece of thick film resistive paste. After sintering (600℃, 1h), the thick film resistance value before and after sintering of the glass paste is tested, so as to calculate the influence of glass paste sintering on the sheet resistance of resistive paste. Resistance change rate = 100 * (resistance after sintering - resistance before sintering) / resistance before sintering.

[0099] Chemical plating resistance test: After the sintered sample sheet is cleaned in a degreasing tank, activated in an activation tank, and chemically plated in a chemical plating tank according to a standardized plating process, observe whether the color and gloss of the glass layer on the sample sheet surface change, and whether the 3M tape is pulled off. No change in any of these indicates good chemical plating resistance; otherwise, it indicates poor chemical plating resistance.

[0100] Table 1 As can be seen from Table 1, the encapsulation paste described in this invention has an effect of <1% on the resistivity of silver wires, and an effect of <1.5% on the resistance of thick film resistors with a square resistance of 100Ω / m and 1kΩ / m. After electroless nickel-palladium-gold plating, the glass glaze has no loss of gloss and thickness, and has broad application prospects and high resolution.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A colored chemical-resistant coating paste, characterized in that, Includes glass powder and organic carrier; The glass powder comprises the following components in parts by weight: 50-56 parts bismuth oxide, 25-29 parts silicon oxide, 7-10 parts zinc oxide, 7.5-13 parts additives, 0.5-5 parts zirconium oxide, 0.5-5 parts titanium oxide, 0.5-3 parts aluminum oxide, and 0.5-1 part calcium carbonate. The organic carrier includes a resin comprising ethyl cellulose, acrylic resin, and polyvinyl butyral resin in a mass ratio of 1:(0.1~0.4):(0.1~0.4). The additives include boric acid and sodium carbonate in a mass ratio of (7~10):(0.5~3).

2. The colored chemical-resistant coating slurry according to claim 1, characterized in that, The resin comprises ethyl cellulose, acrylic resin and polyvinyl butyral resin in a mass ratio of 1:(0.1~0.2):(0.1~0.2).

3. The colored chemical-resistant coating slurry according to claim 1, characterized in that, The organic carrier comprises resin, solvent, leveling agent, defoamer and dispersant in a mass ratio of (8~12):(78~85):(1~3):(1~3):(4~10).

4. The colored chemical-resistant coating slurry according to claim 3, characterized in that, The solvent includes at least one of terpineol, diethylene glycol dibenzoate, diethylene glycol butyl ether, diethylene glycol butyl ether acetate, dipropylene glycol butyl ether acetate, dipropylene glycol butyl ether, petroleum ether, isophorone, and N,N-dimethylformamide.

5. The colored chemical-resistant coating slurry according to claim 3, characterized in that, The solvent comprises terpineol and diethylene glycol dibenzoate in a mass ratio of 1:(0.2~0.3).

6. The colored chemical-resistant coating slurry according to claim 1, characterized in that, The mass ratio of the glass powder to the organic carrier is (6.5~7.2):(2.8~3.5).

7. The colored chemical-resistant coating paste according to claim 3, characterized in that, The leveling agent is an acrylate leveling agent; The defoamer is a solvent-free defoamer; The dispersant is a polyphosphate dispersant.

8. The method for preparing the colored chemical-resistant encapsulation paste according to any one of claims 1 to 7, characterized in that, Includes the following steps: Bismuth oxide, silicon oxide, zinc oxide, additives, zirconium oxide, titanium oxide, aluminum oxide, and calcium carbonate are mixed evenly and melted. The molten slurry is then quenched with water, dried, and ball-milled to obtain glass powder. The organic carrier and glass powder are mixed evenly and ground to obtain a colored chemical-resistant coating slurry.

9. The method for preparing the colored chemical-resistant encapsulation paste according to claim 8, characterized in that, The melting temperature is 1180~1250℃.

10. The application of the colored chemical-resistant encapsulation paste according to any one of claims 1 to 8 in the preparation of electronic components.

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