Chip liquid cooling system

Abstract

The invention provides a chip liquid cooling system which comprises a local liquid cooling circulation system located in a package or adjacent to the package and a secondary liquid cooling circulation system located outside the package and farther from the package than the local liquid cooling circulation system. The local liquid cooling circulation system comprises one or more chip coolers, one or more local heat exchangers, one or more local microcirculation pumps and a local liquid cooling circulation pipeline, and the second-stage liquid cooling circulation system comprises a second-stage heat exchanger, a second-stage circulation pump, a second-stage liquid cooling circulation pipeline and a liquid cooling fluid interface. By means of the chip cooler, the high internal pressure of the chip cooler can be reduced, and the problems of deformation, leakage and the like caused by pressure are avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a chip liquid cooling system. Background Technology

[0002] The problem of low chip packaging efficiency is becoming increasingly serious, making microfluidic liquid cooling technology integrated within the package a research hotspot. Unlike traditional macroscopic liquid cooling solutions, microfluidic liquid cooling utilizes microfluidic channels directly integrated within the chip, leveraging the high specific heat capacity, high density thermophysical properties of liquids (such as deionized water, Freon, or nanofluids), and forced convection to achieve more direct and efficient cooling of high power density areas. In the future, as IC process nodes approach their physical limits, in-package microfluidic liquid cooling holds promise as a key technology for breaking through the "power consumption wall," driving the development of next-generation high-performance chips.

[0003] However, due to the limited compact packaging size, the hydraulic diameter of the coolers and fluid channels inside the chips in existing advanced packages is very small (on the order of micrometers to hundreds of micrometers), and the tube walls are thin. This means that the flow resistance is high, the pressure is high, and the tubes are prone to deformation under pressure. The flow channels are difficult to seal and are prone to breakage, all of which have a significant impact on product reliability.

[0004] Currently, some researchers have studied and submitted patent applications for a technical solution to achieve liquid cooling of chips by adding a heat spreader to the packaging cover. However, this technology is not liquid cooling in the traditional sense. Moreover, the miniaturized heat spreader solution has a very small heat transfer capacity, which cannot meet the technical requirements of large heat transfer. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of high pressure on chip coolers inside chip packages, easy deformation under pressure, and easy leakage in existing technical solutions.

[0006] The chip liquid cooling system according to the present invention includes a local liquid cooling circulation system located inside or adjacent to the package and a secondary liquid cooling circulation system located outside the package and at a greater distance from the package than the local liquid cooling circulation system. The local liquid cooling circulation system includes one or more chip coolers, one or more local heat exchangers, one or more local micro-circulation pumps, and local liquid cooling circulation pipelines. The secondary liquid cooling circulation system includes a secondary heat exchanger, a secondary circulation pump, a secondary liquid cooling circulation pipeline, and a liquid cooling fluid interface.

[0007] Furthermore, preferably, in the chip liquid cooling system according to the present invention, the components of the local liquid cooling circulation system are close to the chip cooler, the local heat exchanger, and the local micro-circulation pump, and are interconnected through local liquid cooling circulation pipelines to form a short-flow structure liquid cooling circulation system locally.

[0008] Furthermore, preferably, the chip liquid cooling system according to the present invention has a chip cooler corresponding to one or more chips being cooled.

[0009] Furthermore, preferably, the chip liquid cooling system according to the present invention includes a chip cooler disposed in any one of the chip back, packaging substrate, packaging cover plate, adapter plate, and 3D packaging intermediate layer in a manner that enables thermal coupling with the chip.

[0010] Furthermore, preferably, in the chip liquid cooling system according to the present invention, the local micro-circulation pump drives the local coolant to flow in the local liquid cooling cycle, flowing successively through the chip cooler and the local heat exchanger.

[0011] Preferably, in the chip liquid cooling system according to the present invention, the driving method of the local micro-circulation pump is any one or a combination of two or more of piezoelectric driving, electrostatic driving, magnetic driving, and shape memory alloy driving.

[0012] Furthermore, preferably, in the chip liquid cooling system according to the present invention, the local heat exchanger is located at the connection point of the local liquid cooling cycle system and the secondary liquid cooling cycle system, and participates in both the local liquid cooling cycle and the secondary liquid cooling cycle.

[0013] Furthermore, preferably, in the chip liquid cooling system according to the present invention, the secondary circulation pump drives the secondary coolant to flow in the secondary liquid cooling cycle, flowing successively through the local heat exchanger and the secondary heat exchanger.

[0014] Furthermore, preferably, in the chip liquid cooling system according to the present invention, the local coolant and the secondary circulating coolant are the same or different coolants.

[0015] This invention, by including a local liquid cooling cycle within or near the package and a secondary liquid cooling cycle outside the package, enables heat to be transferred from the local liquid cooling cycle to the secondary liquid cooling cycle via a local heat exchanger. Because the components of the local liquid cooling cycle are very close to the chip cooler, local heat exchanger, and local micro-circulation pump, and are connected by liquid cooling circulation piping to form a short-flow liquid cooling cycle locally, it exhibits low internal pressure, high reliability, and high efficiency. Attached Figure Description

[0016] Figure 1 This schematically illustrates a prior art liquid cooling system for chips.

[0017] Figure 2 A chip liquid cooling system according to one embodiment of the present invention is illustrated schematically.

[0018] Figure 3 A chip liquid cooling system according to one embodiment of the present invention is illustrated schematically.

[0019] Figure 4 A chip liquid cooling system according to one embodiment of the present invention is illustrated schematically.

[0020] Figure 5 A chip liquid cooling system according to one embodiment of the present invention is illustrated schematically.

[0021] Figure 6 A chip liquid cooling system according to one embodiment of the present invention is illustrated schematically.

[0022] The reference numerals in the attached figures are explained as follows:

[0023] 100: Local liquid cooling cycle

[0024] 200: Two-stage liquid cooling cycle

[0025] 101: Chip being cooled

[0026] 102: Chip Cooler

[0027] 110: Local heat exchanger

[0028] 210: Secondary heat exchanger

[0029] 120: Local micro-circulation pump

[0030] 220: Secondary circulation pump

[0031] 201: Secondary circulating coolant outlet

[0032] 202: Secondary circulating coolant inlet

[0033] 300: Local liquid cooling cycle

[0034] 301: Chip being cooled

[0035] 302: Chip Cooler

[0036] 310: Local micro-circulation pump

[0037] 320: Secondary circulation pump Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Other embodiments or modifications obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.

[0039] Current chip liquid cooling solutions typically place the chip cooler outside the package, resulting in a generally simple structure: temperature-controlled coolant enters the cooler directly through the inlet, and the coolant absorbing heat from the chip is directly transferred to a heat exchanger for cooling and temperature control. Multiple stages of heat exchange are usually required to transfer heat to the surrounding environment. The problem here is that the distance from the coolant outlet to the nearest heat exchanger is often quite long. For conventional chip coolers located outside the package, this issue is generally not a problem due to the larger hydraulic diameter and thicker walls of the cooler and fluid piping.

[0040] However, the hydraulic diameter of the coolers and fluid lines inside advanced packaged chips is very small, and the pipe walls are thin. The small hydraulic diameter means high flow resistance and high pressure resistance, while the thin pipe walls mean that they are prone to deformation under pressure. Deformation makes it difficult to seal the flow channels and makes them prone to rupture. All of these factors will have a significant impact on product reliability.

[0041] Therefore, the purpose of this invention is to provide a chip system that solves the problems of high pressure on chip coolers in existing technologies, which can easily lead to deformation and leakage due to pressure.

[0042] According to the chip liquid cooling system of the present invention, the system includes a local liquid cooling cycle inside or adjacent to the package and a secondary liquid cooling cycle outside the package. The local liquid cooling cycle includes one or more chip coolers, a local heat exchanger, a local micro-circulation pump, and a local liquid cooling circulation pipeline. The secondary liquid cooling cycle includes a secondary heat exchanger, a secondary circulation pump, a secondary liquid cooling circulation pipeline, and a liquid cooling fluid interface.

[0043] The components of the local liquid cooling cycle are very close to the chip cooler, local heat exchanger, and local micro-circulation pump, and are connected by the local liquid cooling cycle pipeline, forming a short-flow, simple liquid cooling cycle locally.

[0044] The chip cooler can correspond to one or more chips being cooled, or multiple chip coolers can correspond to one chip being cooled.

[0045] The chip cooler and chip thermal coupling can be installed inside components such as the back of the chip, the packaging substrate, the packaging cover, the adapter plate, and the intermediate layer of 3D packaging.

[0046] The local micro-circulation pump drives the local coolant to flow in the local liquid cooling cycle, passing through the chip cooler and the local heat exchanger in succession.

[0047] The driving method of the local micro-circulation pump can be any combination of one or more forms such as piezoelectric drive, electrostatic drive, magnetic drive, and shape memory alloy drive.

[0048] The local heat exchanger is located at the junction of the local liquid cooling cycle and the secondary liquid cooling cycle, and participates in both the local liquid cooling cycle and the secondary liquid cooling cycle.

[0049] The secondary circulation pump drives the secondary coolant to flow in the secondary liquid cooling cycle, passing through the local heat exchanger and the secondary heat exchanger successively.

[0050] The local coolant and the secondary circulation coolant can be the same or different.

[0051] The beneficial effects of the present invention include at least the following points.

[0052] 1. The local liquid cooling cycle is characterized by its short flow path and simple structure. It transfers heat to the secondary cycle through a local heat exchanger. The secondary cycle may generate high flow resistance due to its long flow path, but this has no impact on the local liquid cooling cycle. Since it does not need to overcome high back pressure, the internal pressure of the local liquid cooling cycle is relatively low, which makes it less likely to cause internal stress / deformation / sealing failure for the coolers and pipelines inside the enclosure.

[0053] 2. The local liquid cooling cycle can be part of the chip package. The local liquid cooling cycle is closed within the package. Therefore, during chip installation and fluid connection, it is only necessary to connect at the input and output ports of the local heat exchanger. The chip itself can be better protected, and the local coolant is not easily contaminated.

[0054] In reality, because the added components and additional heat exchangers consume some energy, adding a secondary liquid cooling circulation system may lead to a decrease in overall energy utilization efficiency. However, adding a secondary liquid cooling circulation system can achieve the purpose of this invention, namely, reducing the high internal pressure of the chip cooler and preventing problems such as deformation and leakage caused by pressure.

[0055] The inventors have cited several typical data points to compare and illustrate the implementation effect of the invention relative to existing technologies (all data are relative pressure data).

[0056] 1. Existing technical solutions

[0057] Secondary circulation pump outlet pressure: 1.05 MPa;

[0058] Chip cooler inlet pressure: 0.65 MPa;

[0059] Chip cooler outlet pressure: 0.55 MPa;

[0060] Secondary heat exchanger inlet pressure: 0.15 MPa;

[0061] Secondary heat exchanger outlet pressure: 0.05 MPa;

[0062] Secondary circulation pump inlet pressure: 0.02MPa.

[0063] The above data shows that the pressure loss of the chip cooler at a certain flow rate is 0.65-0.55=0.1MPa, and its own pressure tolerance range is 0.55-0.65MPa (high internal pressure).

[0064] 2. Embodiments of the present invention

[0065] 1) Local circulating pressure parameters:

[0066] Local circulation pump outlet pressure: 0.2 MPa;

[0067] Chip cooler inlet pressure: 0.18 MPa;

[0068] Chip cooler outlet pressure: 0.08 MPa;

[0069] Local heat exchanger (local circulation side) inlet pressure: 0.06 MPa;

[0070] Local heat exchanger (local circulation side) outlet pressure: 0.03 MPa;

[0071] Local circulation pump inlet pressure: 0.02MPa.

[0072] The above data shows that the pressure loss of the chip cooler at a certain flow rate is 0.18-0.08=0.1MPa, and its own pressure tolerance range is 0.08-0.18MPa (low internal pressure). The pressure loss of the local heat exchanger (local circulation side) is 0.06-0.03=0.03MPa, and the pressure tolerance range of the local circulation side is 0.03-0.06MPa.

[0073] 2) Secondary circulation pressure parameters:

[0074] Secondary circulation pump outlet pressure: 1 MPa;

[0075] Local heat exchanger (secondary circulation side) inlet pressure: 0.6 MPa;

[0076] Local heat exchanger (secondary circulation side) outlet pressure: 0.55 MPa;

[0077] Secondary heat exchanger (secondary circulation side) inlet pressure: 0.15 MPa;

[0078] Secondary heat exchanger (secondary circulation side) outlet pressure: 0.05 MPa;

[0079] Secondary circulation pump inlet pressure: 0.02MPa.

[0080] The pressure loss of the local heat exchanger (secondary circulation side) is 0.6-0.55=0.05MPa, and the pressure range that the secondary circulation side itself bears is 0.55-0.6MPa (the internal pressure is relatively high, and the local heat exchanger bears a higher pressure instead of the chip cooler).

[0081] The attached diagram is for ease of understanding; however, all data are idealized and do not take into account many other design details, such as filters.

[0082] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0083] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0084] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

[0085] The above embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the implementation of the present invention. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively describe all possible implementations. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A chip liquid cooling system, characterized in that, The chip liquid cooling system includes a local liquid cooling circulation system located inside or adjacent to the package and a secondary liquid cooling circulation system located outside the package and at a greater distance than the local liquid cooling circulation system. The local liquid cooling circulation system includes: one or more chip coolers, one or more local heat exchangers, one or more local micro-circulation pumps, and local liquid cooling circulation piping. The secondary liquid cooling circulation system includes: a secondary heat exchanger, a secondary circulation pump, a secondary liquid cooling circulation pipeline, and a liquid cooling fluid interface.

2. The chip liquid cooling system according to claim 1, characterized in that, The components of the local liquid cooling circulation system are located close to the chip cooler, local heat exchanger, and local micro-circulation pump, and are interconnected through local liquid cooling circulation pipelines to form a short-flow structure liquid cooling circulation system locally.

3. The chip liquid cooling system according to claim 1, characterized in that, It has a chip cooler corresponding to one or more chips being cooled.

4. The chip liquid cooling system according to claim 1, characterized in that, It has a chip cooler that can be thermally coupled to the chip in any one of the following: the back of the chip, the packaging substrate, the packaging cover, the adapter board, or the 3D packaging intermediate layer.

5. The chip liquid cooling system according to claim 1, characterized in that, The local micro-circulation pump drives the local coolant to flow in the local liquid cooling cycle, passing through the chip cooler and the local heat exchanger in succession.

6. The chip liquid cooling system according to claim 1, characterized in that, The driving method of the local microcirculation pump is any one or a combination of two or more of the following methods: piezoelectric driving, electrostatic driving, magnetic driving, shape memory alloy driving, etc.

7. The chip liquid cooling system according to claim 1, characterized in that, The local heat exchanger is located at the connection point between the local liquid cooling cycle system and the secondary liquid cooling cycle system, and participates in both the local liquid cooling cycle and the secondary liquid cooling cycle.

8. The chip liquid cooling system according to claim 1, characterized in that, The secondary circulation pump drives the secondary coolant to flow in the secondary liquid cooling cycle, passing through the local heat exchanger and the secondary heat exchanger successively.

9. The chip liquid cooling system according to claim 1, characterized in that, The local coolant and the secondary circulating coolant may be the same or different coolants.

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