Single-phase immersion liquid cooling system, control method, control device and storage medium

Abstract

The present application relates to the technical field of liquid-cooling heat dissipation. Provided are a single-phase immersion liquid cooling system, a control method, a control device and a storage medium. The system comprises: a liquid cooling chassis, a first cooling circuit and a second cooling circuit, wherein the first cooling circuit comprises a flow restrictor; the flow restrictor is configured to divide a region inside the liquid cooling chassis into a first cooling region and a second cooling region, which are isolated from each other; the first cooling region contains a cooling liquid that enters the flow restrictor through the first cooling circuit, and the second cooling region contains a cooling liquid that enters the liquid cooling chassis through the second cooling circuit; there is a difference in heat dissipation demand between the first cooling region and the second cooling region; cooling liquid inlets and outlets of the first cooling circuit and the second cooling circuit on the liquid cooling chassis are different; and there is a difference between the flow rates of the cooling liquid in the first cooling circuit and the cooling liquid in the second cooling circuit.

Description

Single-phase immersion liquid cooling system, control method, control device and storage medium

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202410766058.0, filed on June 14, 2024, and entitled "Single-phase immersion liquid cooling system, control method, control device and storage medium", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] Embodiments of the present application relate to the field of liquid cooling heat dissipation technology, in particular to a single-phase immersion liquid cooling system, a control method, a control device and a storage medium. BACKGROUND

[0004] In the current digital era, a large amount of production and life cannot be supported without computing power. With the increasing demand for computing power, chip power consumption and heat flux continue to increase. In order to ensure the normal operation of the equipment, heat dissipation treatment is needed, which includes single-phase immersion liquid cooling heat dissipation mode.

[0005] Single-phase immersion liquid cooling is to use liquid as a heat conduction medium, and the heat is taken away by the flowability of the cooling medium. Generally, a single-phase immersion liquid cooling system mainly consists of a cooling medium, an immersion tank, a liquid cooling heat exchange unit and an outdoor cooling device. Figure 1 shows a schematic diagram of a conventional single-phase immersion liquid cooling system. As shown in Figure 1, the tank cavity is filled with cooling liquid, and a layout of down-in and up-out is usually adopted. A large amount of heat generated by the electronic equipment in the tank cavity is absorbed by the cooling medium, causing the temperature of the cooling medium to rise. Then the high-temperature cooling medium flows upward and is collected and sent into the CDU (Coolant Distribution Unit) for heat exchange to discharge heat, so that the cooling medium is restored to low temperature and is injected into the immersion cavity again, so that the electronic equipment can operate stably.

[0006] However, although the above structure design realizes effective heat exchange of the electronic equipment to a certain extent, it cannot meet the heat dissipation needs of electronic equipment with high heat flux density due to the large difference in power consumption of different components, and over-temperature of some high-power components is prone to occur, which causes the entire system to be unable to operate stably and normally. Alternatively, the circulation rate of the cooling medium is continuously increased to improve the heat exchange efficiency, but this results in an increase in pump power due to the increase in the circulation rate of the cooling medium, causing resource waste. SUMMARY

[0007] Embodiments of the present application provide a single-phase immersion liquid cooling system, a control method, a control device and a storage medium. The technical solution is as follows:

[0008] In one aspect, a single-phase immersion liquid cooling system is provided, the system comprising a liquid cooling chassis, a first cooling loop and a second cooling loop; the first cooling loop comprising a flow restrictor; the flow restrictor being configured to divide an area within the liquid cooling chassis into a first cooling area and a second cooling area that are isolated from each other; the first cooling liquid area comprising cooling liquid entering the flow restrictor through the first cooling loop, the second cooling area comprising cooling liquid entering the liquid cooling chassis through the second cooling loop; the first cooling area and the second cooling area having different heat dissipation requirements; the first cooling loop having a cooling liquid inlet and outlet on the liquid cooling chassis that are different from a cooling liquid inlet and outlet of the second cooling loop on the liquid cooling chassis, the first cooling loop having a flow rate difference between a cooling liquid flow rate in the first cooling loop and a cooling liquid flow rate in the second cooling loop.

[0009] In another aspect, a control method of a single-phase immersion liquid cooling system is provided, the method being performed by a control device of the single-phase immersion liquid cooling system, the method comprising: monitoring a liquid level of the cooling liquid within the liquid cooling chassis; in a case where the liquid level of the cooling liquid within the liquid cooling chassis satisfies a liquid level adjustment condition, sending a first control signal to the single-phase immersion liquid cooling system, the first control signal being configured to instruct to adjust a working power of a variable frequency cooling liquid circulating pump and / or to adjust an opening degree of an inflow control valve of the second cooling loop to adjust a cooling liquid flow rate of the second cooling loop.

[0010] In another aspect, a control device of a single-phase immersion liquid cooling system is provided, the control device comprising a processor and a memory, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to implement the control method of the single-phase immersion liquid cooling system as described above.

[0011] In another aspect, a computer readable storage medium is provided, the computer readable storage medium storing at least one computer program, the computer program being loaded and executed by a processor to implement the control method of the single-phase immersion liquid cooling system as described above.

[0012] In another aspect, a computer program product is provided, the computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the control method of the single-phase immersion liquid cooling system as provided in various optional implementation manners described above. BRIEF DESCRIPTION OF DRAWINGS

[0013] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments consistent with the present application and, together with the description, further serve to explain the principles of the application.

[0014] FIG. 1 shows a schematic diagram of a conventional single-phase immersion liquid cooling system;

[0015] FIG. 2 shows a schematic diagram of a single-phase immersion liquid cooling system according to an example embodiment of the present application;

[0016] FIG. 3 shows a schematic diagram of a single-phase immersion liquid cooling system according to an example embodiment of the present application;

[0017] FIG. 4 shows a schematic diagram of a single-phase immersion liquid cooling system according to an example embodiment of the present application;

[0018] FIG. 5 shows a schematic diagram of a pipe state when the flow rate of the cooling liquid in the first cooling loop is controlled by the first vacuum cavity;

[0019] FIG. 6 shows a schematic diagram of a pipe state when the flow rate of the cooling liquid in the first cooling loop is controlled by the first vacuum cavity;

[0020] FIG. 7 shows a schematic diagram of the first cooling loop according to an example embodiment of the present application;

[0021] FIG. 8 shows a schematic diagram of the second cooling loop according to an example embodiment of the present application;

[0022] FIG. 9 shows a schematic diagram of a device configuration in the first cooling area;

[0023] FIG. 10 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to an example embodiment of the present application;

[0024] FIG. 11 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application;

[0025] FIG. 12 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application;

[0026] FIG. 13 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application;

[0027] FIG. 14 shows a flowchart of a control method of a single-phase immersion liquid cooling system according to an example embodiment of the present application;

[0028] FIG. 15 shows a structural block diagram of a computer device according to an example embodiment of the present application;

[0029] FIG. 16 shows a structural block diagram of a computer device according to an example embodiment of the present application. DETAILED DESCRIPTION

[0030] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, like reference numerals refer to like elements, unless the context clearly dictates otherwise. The following description of exemplary embodiments is not representative of all possible embodiments consistent with the present application. Instead, it is merely intended to provide an example of apparatus and methods consistent with some aspects of the present application as detailed in the appended claims.

[0031] The single-phase immersion liquid cooling system provided by the embodiments of the present application can realize independent cooling of different areas with different heat dissipation requirements, reduce the influence of slow heat transfer caused by different power consumptions of electronic devices, immersion flow rate and other factors, and improve the heat dissipation effect. FIG. 2 shows a schematic diagram of a single-phase immersion liquid cooling system provided by an exemplary embodiment of the present application. As shown in FIG. 2, the system includes a liquid cooling case 1, a first cooling loop and a second cooling loop. The first cooling loop includes a flow restrictor 2. The flow restrictor 2 is used to separate the area in the liquid cooling case 1 into a first cooling area and a second cooling area which are isolated from each other. The first cooling liquid area includes cooling liquid entering the flow restrictor through the first cooling loop, and the second cooling area includes cooling liquid entering the liquid cooling case through the second cooling loop. The first cooling area and the second cooling area have different heat dissipation requirements. The cooling liquid inlet and outlet of the first cooling loop on the liquid cooling case 1 are different from the cooling liquid inlet and outlet of the second cooling loop on the liquid cooling case 1. The cooling liquid flow rate in the first cooling loop is different from the cooling liquid flow rate in the second cooling loop.

[0032] The cooling liquid in each loop is single-phase cooling liquid, i.e., a cooling medium in a single phase (usually liquid phase) is maintained in the system. The single-phase cooling liquid is selected according to its specific thermophysical properties, such as high specific heat capacity, good thermal conductivity, low viscosity, chemical stability, non-toxicity, environmental protection and other properties, to ensure efficient heat transfer and long-term stable operation of the system. Illustratively, the single-phase cooling liquid can be deionized water, ethylene glycol solution, propylene glycol solution, silicone oil, fluorinated liquid and other types. The type of single-phase cooling liquid can be determined based on application requirements, which is not limited in the present application.

[0033] The single-phase immersion liquid cooling system drives the cooling liquid to flow in a closed loop, flows through the electronic devices in each area that need to be cooled, absorbs heat, and then releases the heat to the external environment.

[0034] The flow restrictor in the embodiment of the present application is configured on the first cooling circuit, which not only realizes physical separation of the internal space of the liquid cooling case, forms the first cooling region and the second cooling region which are independent of each other, and cooperates with the double-circuit flow channel configuration, so that the flow rate / speed of the cooling liquid in different cooling circuits can be regulated to ensure that the two regions can be effectively cooled according to different cooling requirements. The double-circuit flow channel configuration means that the cooling liquid entering the case is divided into multiple parts corresponding to different cooling regions, and the cooling liquid inlet and outlet of different cooling circuits on the liquid cooling case are different, so as to ensure the independent operation of each cooling circuit, manage the cooling liquid circulation of each region, control the cooling liquid flow rate in each circuit, and thus meet the different cooling requirements of each cooling region.

[0035] The cooling region heat dissipation power is positively correlated with the cooling liquid flow rate in the corresponding cooling circuit, that is, the higher the cooling region heat dissipation requirement, the faster the cooling liquid flow rate in the corresponding cooling circuit, and the greater the cooling liquid flow rate. Illustratively, if the heat dissipation requirement of the electronic device corresponding to the first cooling region is higher than that of the electronic device corresponding to the second cooling region, the cooling liquid flow rate in the first cooling circuit is higher than that in the second cooling circuit; if the heat dissipation requirement of the electronic device corresponding to the first cooling region is lower than that of the electronic device corresponding to the second cooling region, the cooling liquid flow rate in the first cooling circuit is lower than that in the second cooling circuit. The electronic device corresponding to each cooling region can be set based on actual requirements.

[0036] In summary, the single-phase immersion liquid cooling system provided in the embodiment of the present application is provided with a liquid cooling case, a first cooling circuit and a second cooling circuit. The regions in the liquid cooling case are separated into cooling regions corresponding to different cooling requirements by the flow restrictor on the first cooling circuit. The cooling liquid inlet and outlet of different cooling circuits on the liquid cooling case are different, and the cooling liquid flow rate in the first cooling circuit and the second cooling circuit is independently controlled to adapt to the cooling requirements of the cooling regions corresponding to each cooling circuit, thereby reducing the influence of slow heat transfer caused by different power consumptions of electronic devices, immersion flow rate and other factors, and ensuring the cooling effect of various electronic devices.

[0037] In a possible implementation, the first cooling circuit and the second cooling circuit can correspond to cooling liquid circulating pumps with different working powers respectively, so that the cooling liquid flow rates of the first cooling liquid circuit and the second cooling liquid circuit are different; or, in order to reduce the system construction cost and improve the practicability of the system, the first cooling circuit and the second cooling circuit can correspond to the same cooling liquid circulating pump, and the cooling liquid flow rate of the corresponding cooling circuit is increased by adding a device for generating negative pressure in one of the cooling circuits, so that the cooling liquid flow rates of the first cooling liquid circuit and the second cooling liquid circuit are different. In the embodiments of the present application, the first cooling circuit and the second cooling circuit correspond to the same cooling liquid circulating pump, and an example of a single-phase immersion liquid cooling system provided by an example embodiment of the present application is shown in FIG. 3. As shown in FIG. 3, the system includes a liquid cooling case 1, a first cooling circuit, and a second cooling circuit.

[0038] The first cooling circuit includes a flow restrictor 2; the flow restrictor 2 is used to separate the first cooling area and the second cooling area in the liquid cooling case 1 into isolated areas; the first cooling liquid area includes cooling liquid entering the flow restrictor through the first cooling circuit, and the second cooling area includes cooling liquid entering the liquid cooling case 1 through the second cooling circuit; the first cooling area and the second cooling area have different heat dissipation requirements; the cooling liquid inlet and outlet of the first cooling circuit on the liquid cooling case 1 are different from the cooling liquid inlet and outlet of the second cooling circuit on the liquid cooling case 1, and the cooling liquid flow rate in the first cooling circuit and the cooling liquid flow rate in the second cooling circuit have a flow rate difference.

[0039] In a possible implementation, as shown in FIG. 3, the cooling liquid inlet and outlet of the first cooling circuit on the liquid cooling case 1 are upper-in and lower-out, and the cooling liquid inlet and outlet of the second cooling circuit on the liquid cooling case 1 are lower-in and upper-out. As shown in FIG. 3, the cooling liquid outlet 18 is the outlet of the first cooling circuit corresponding to the liquid cooling case 1, and the cooling liquid outlet 19 is the outlet of the second cooling circuit corresponding to the liquid cooling case 1; or, in another possible implementation, the cooling liquid inlet and outlet of the first cooling circuit and the second cooling circuit on the liquid cooling case 1 are both lower-in and upper-out. FIG. 4 shows a schematic diagram of a single-phase immersion liquid cooling system provided by an example embodiment of the present application. As shown in FIG. 4, the outlet 18 is the outlet corresponding to the first cooling circuit, and the outlet 19 is the outlet corresponding to the second cooling circuit; or, the cooling liquid inlet and outlet of the first cooling circuit and the second cooling circuit on the liquid cooling case 1 are both upper-in and lower-out; or, the cooling liquid inlet and outlet of the first cooling circuit on the liquid cooling case 1 are lower-in and upper-out, and the cooling liquid inlet and outlet of the second cooling circuit on the liquid cooling case 1 are upper-in and lower-out; the cooling liquid inlet and outlet of each cooling circuit on the liquid cooling case can be set based on actual requirements, and the present application does not limit this.

[0040] The system further comprises a cooling distribution unit CDU and a cooling device 15; the CDU comprises a heat exchanger 13 and a cooling liquid circulating pump 14; the heat exchanger 13 is used to receive the cooling liquid flowing out of the liquid cooling cabinet 1 through the first cooling circuit and the second cooling circuit, and transfer the heat absorbed by the cooling liquid to the cooling device 15 for cooling, so that the cooling device 15 discharges heat to the environment; the cooling liquid circulating pump 14 is used to pump the cooling liquid cooled by the heat exchanger 13 into the cooling circuit; the cooling circuit comprises the first cooling circuit and the second cooling circuit.

[0041] That is, the heat exchanger 13 is used to collect the high-temperature cooling liquid after absorbing heat, and transfer the heat absorbed based on the heat transfer mechanism to the cooling device 15, which can be an external cooling device, for discharging heat to the environment by using a circulating cooling working medium in the cooling device 15; on the other hand, the cooling liquid cooled by the heat exchanger 13 is pumped back into the first cooling circuit and the second cooling circuit by the cooling liquid circulating pump 14 to be delivered back to the liquid cooling cabinet 1, so as to complete the cooling liquid circulation of the first cooling circuit and the second cooling circuit. Wherein, the cooling device 15 can be reasonably selected according to the system scale, construction area and other differences, for example, an open cooling tower and a closed cooling tower can be used in places where water resources are relatively sufficient; a dry cooler can be used in places where water resources are scarce; for places where the cleanliness of the circulating refrigerant is required to be high, a wind-cooled or water-cooled chilled water system can be used, and the setting type of the cooling device is not limited in the application.

[0042] In the case that the flow rate of the cooling liquid in the first cooling circuit is higher than that in the second cooling circuit, the first cooling liquid region is a region corresponding to high-power electronic equipment; the second cooling region is a region corresponding to low-power electronic equipment; the heat dissipation amount of the high-power electronic equipment per unit time is higher than that of the low-power electronic equipment per unit time. As shown in FIG. 3, the first cooling circuit corresponds to the first cooling region corresponding to the high-power electronic equipment 3. Illustratively, the high-power electronic equipment can be a high-power heat dissipation chip such as a CPU or a GPU, or other electronic equipment with high-power heat dissipation requirements. The second cooling circuit corresponds to the second cooling region corresponding to the low-power electronic equipment 20. Illustratively, the low-power electronic equipment can be a power supply, a hard disk, or the like. It should be noted that the type of electronic equipment can be divided based on the relationship between the heat dissipation amount per unit time and a heat dissipation threshold value, wherein the electronic equipment with a heat dissipation amount per unit time higher than the heat dissipation threshold value is a high-power electronic equipment, and the electronic equipment with a heat dissipation amount per unit time lower than the heat dissipation threshold value is a low-power electronic equipment. The heat dissipation threshold value can be set based on the heat dissipation requirements in actual applications, which is not limited in the present application. In addition, the area of the first cooling region and the second cooling region shown in FIG. 3 is only illustrative, and the area range of each region is not limited in the present application.

[0043] Taking the first cooling region corresponding to high-power electronic equipment as an example, in the single-phase immersion liquid cooling system provided in the embodiments of the present application, the flow rate control of the cooling liquid in the first cooling circuit can be realized by configuring a vacuum pump and a vacuum chamber. In order to ensure the timeliness of the cooling liquid flow rate control, the CDU of the system includes a vacuum pump and at least two vacuum chambers, so that the cooling liquid flow rate in the first cooling circuit can be controlled by the at least two vacuum chambers in turn. The vacuum pump is used to pump the at least two vacuum chambers and maintain the vacuum environment of each vacuum chamber. The at least two vacuum chambers are respectively connected with the first cooling circuit, and the at least two vacuum chambers are used to control the cooling liquid flow rate in the first cooling circuit in turn by using the pressure difference formed by the vacuum pump and the cooling liquid circulating pump.

[0044] Each vacuum chamber is configured with a corresponding inflow control valve and an outflow control valve. The inflow control valve is used to control the flow rate of the cooling liquid flowing into the vacuum chamber. The outflow control valve is a three-way valve, which is used to control the on-off of the vacuum chamber and the vacuum pump and the on-off of the heat exchanger.

[0045] The inflow control valve is a two-way valve. The inflow control valve can be a solenoid valve. Further, in order to adapt to the system operation and ensure the stability of the system operation, the inflow control valve can have the characteristics of good compatibility with the cooling liquid, rapid and stable start-stop. For the outflow control valve, it needs to have stable and efficient switching while having good sealing performance.

[0046] Each vacuum cavity is also provided with a corresponding pressure relief valve. The pressure relief valve needs to meet the requirements of rapid switching and sealing.

[0047] In one possible implementation, the system can be configured with a number of vacuum pumps consistent with the number of vacuum cavities, so that each vacuum pump is used to evacuate a corresponding vacuum cavity. In another possible implementation, in order to reduce the system construction cost and improve the practicability of the system, the number of vacuum pumps configured in the system is less than the number of vacuum cavities, and each vacuum pump is used to evacuate several vacuum cavities. For example, one vacuum pump and two vacuum cavities are configured, and the vacuum pump is used to evacuate the two vacuum cavities. Alternatively, two vacuum pumps and three vacuum cavities are configured, and one of the vacuum pumps is used to evacuate two vacuum cavities, and the other vacuum pump is used to evacuate the other vacuum cavity.

[0048] Taking the CDU configured with one vacuum pump 12 and two vacuum cavities as an example, as shown in FIG. 3, for the vacuum cavity 8, there are corresponding inflow control valve 7, outflow control valve 10 and pressure relief valve 31, for the vacuum cavity 9, there are corresponding inflow control valve 6, outflow control valve 11 and pressure relief valve 32, and the two vacuum cavities are connected to the vacuum pump 12 when the corresponding outflow control valves are in the open state. The vacuum pump 12 is connected to the vacuum cavities to be evacuated, so as to reduce the pressure in the vacuum cavities. Through the coordination between the vacuum pump and the cooling circulating pump, the pressure difference in the first cooling circuit is established, so as to accelerate the flow rate of the cooling liquid in the first cooling circuit. The vacuum pump can be a variable frequency vacuum pump, and the cooling circulating pump can be a variable frequency cooling circulating pump, so that the flow rate of the cooling liquid can be dynamically controlled by dynamically adjusting the working power.

[0049] Taking the CDU configured with one vacuum pump 12 and two vacuum cavities as an example, as shown in FIG. 3, for the vacuum cavity 8, there are corresponding inflow control valve 7, outflow control valve 10 and pressure relief valve 31, for the vacuum cavity 9, there are corresponding inflow control valve 6, outflow control valve 11 and pressure relief valve 32, and the two vacuum cavities are connected to the vacuum pump 12 when the corresponding outflow control valves are in the open state. The vacuum pump 12 is connected to the vacuum cavities to be evacuated, so as to reduce the pressure in the vacuum cavities. Through the coordination between the vacuum pump and the cooling circulating pump, the pressure difference in the first cooling circuit is established, so as to accelerate the flow rate of the cooling liquid in the first cooling circuit. The vacuum pump can be a variable frequency vacuum pump, and the cooling circulating pump can be a variable frequency cooling circulating pump, so that the flow rate of the cooling liquid can be dynamically controlled by dynamically adjusting the working power.

[0050] When the flow rate of the cooling liquid in the first cooling circuit is controlled by the first vacuum cavity, the first inflow control valve of the first vacuum cavity is in the open state, the first pressure relief valve of the first vacuum cavity is in the closed state, the first outflow control valve of the first vacuum cavity is connected to the vacuum pump, the second inflow control valve of the second vacuum cavity is in the closed state, the second pressure relief valve of the second vacuum cavity is in the open state, and the second outflow control valve of the second vacuum cavity is connected to the heat exchanger.

[0051] When the flow rate of the cooling liquid in the first cooling circuit is controlled by the second vacuum cavity, the first inflow control valve is in the closed state, the first pressure relief valve is in the open state, the first outflow control valve is connected to the heat exchanger, the second inflow control valve is in the open state, the second pressure relief valve is in the closed state, and the second outflow control valve is connected to the vacuum pump.

[0052] Table 1 shows the working state of each component in the CDU when the flow rate of the cooling liquid in the first cooling circuit is controlled by the first vacuum chamber 9. As shown in Table 1, the inflow control valve 6 of the first vacuum chamber 9 is in an open state, the pressure relief valve 32 is in a closed state, the outflow control valve 11 is connected to the vacuum pump 12, the inflow control valve 7 of the second vacuum chamber 8 is in a closed state, the pressure relief valve 31 is in an open state, and the outflow control valve 10 is connected to the heat exchanger 13. The vacuum pump 12 and the cooling liquid circulating pump 14 are both in a working state. At this time, the first vacuum chamber 9 is in a cooling liquid injection state, and the second vacuum chamber 8 is in a cooling liquid evacuation state.

[0053] Table 1

[0054] Figure 5 shows a schematic diagram of the pipeline state when the flow rate of the cooling liquid in the first cooling circuit is controlled by the first vacuum chamber 9. As shown in Figure 5, the component state control as shown in Table 1 is used to connect the first vacuum chamber 9 to the vacuum pump 12 to perform vacuumization, and to connect the second vacuum chamber 8 to the heat exchanger 13 to perform cooling liquid evacuation.

[0055] Table 2 shows the working state of each component in the CDU when the flow rate of the cooling liquid in the first cooling circuit is controlled by the second vacuum chamber 8. As shown in Table 2, the inflow control valve 6 of the first vacuum chamber 9 is in a closed state, the pressure relief valve 32 is in an open state, the outflow control valve 11 is connected to the heat exchanger 13, the inflow control valve 7 of the second vacuum chamber 8 is in an open state, the pressure relief valve 31 is in a closed state, and the outflow control valve 10 is connected to the vacuum pump 12. The vacuum pump 12 and the cooling liquid circulating pump 14 are both in a working state. At this time, the first vacuum chamber 9 is in a cooling liquid evacuation state, and the second vacuum chamber 8 is in a cooling liquid injection state.

[0056] Table 2

[0057] Figure 6 shows a schematic diagram of the pipeline state when the flow rate of the cooling liquid in the first cooling circuit is controlled by the first vacuum chamber 8. As shown in Figure 6, the component state control as shown in Table 2 is used to connect the first vacuum chamber 9 to the heat exchanger 13 to perform cooling liquid evacuation, and to connect the second vacuum chamber 8 to the vacuum pump 12 to perform vacuumization.

[0058] In one possible implementation, the cooling liquid circulating pump 14 can pump the cooling liquid into the first cooling circuit and the second cooling circuit through different interfaces, respectively, and the pipelines of the two cooling circuits are independent of each other.

[0059] In another possible implementation, as shown in FIG. 3 or FIG. 4, the first cooling circuit and the second cooling circuit have a common pipeline 17; the cooling liquid in the common pipeline 17 is the low-temperature cooling liquid pumped into the liquid cooling machine box 1 by the cooling liquid circulating pump 14 after being cooled by the heat exchanger; one end of the common pipeline 17 is connected with the cooling liquid circulating pump 14. In this case, FIG. 7 shows a schematic diagram of the first cooling circuit according to an example embodiment of the present application, as shown in FIG. 7, after the cooling liquid circulating pump 14 pumps the cooled cooling liquid into the common pipeline 17, the cooling liquid in the common pipeline 17 enters the first cooling circuit through the inflow control valve 4 of the first cooling circuit, flows through the first cooling area and the vacuum cavity, and then enters the heat exchanger 13. FIG. 8 shows a schematic diagram of the second cooling circuit according to an example embodiment of the present application, as shown in FIG. 8, the cooling liquid in the common pipeline 17 enters the second cooling circuit through the inflow control valve 5 of the second cooling circuit, flows through the second cooling area, and then enters the heat exchanger 13.

[0060] In order to reduce the flow resistance of the cooling liquid pipeline of the system as much as possible, the links and pipelines in the system can be made of non-metallic materials such as polypropylene random copolymer (PPR), polyvinylidene fluoride (PVDF), and fluorinated ethylene propylene (FEP).

[0061] In the system shown in the embodiments of the present application, sensors can be configured in each component to monitor the working state of each component in the system, thereby facilitating the control of each component in the system.

[0062] In a possible implementation, the liquid cooling machine case of the single-phase immersion liquid cooling system provided by the embodiment of the present application and each vacuum cavity are respectively configured with a corresponding liquid level sensor; the liquid level sensor is used to monitor the liquid level height in the corresponding space, so as to control the working state of the corresponding vacuum cavity and the flow of the cooling liquid of the second cooling loop through the monitoring of the liquid level height; for example, when the liquid level height in the vacuum cavity exceeds the corresponding highest threshold value, it indicates that the cooling liquid needs to be discharged; when the liquid level height in the vacuum cavity is lower than the corresponding lowest threshold value, it indicates that the cooling liquid in the vacuum cavity has been basically discharged, and the vacuumizing operation can be performed; when the liquid level height in the liquid cooling machine case exceeds the corresponding highest threshold value, it indicates that the cooling liquid in the liquid cooling machine case is too much, and the discharge amount of the cooling liquid needs to be increased to reduce the amount of the cooling liquid in the liquid cooling machine case; and when the liquid level height in the liquid cooling machine case is lower than the corresponding standard threshold value, it indicates that the cooling liquid in the liquid cooling machine case is less, which may affect the heat dissipation effect of the second cooling area, and the injection amount of the cooling liquid needs to be increased to increase the amount of the cooling liquid in the liquid cooling machine case; wherein each threshold value described above can be set based on actual application requirements, and the present application does not limit this.

[0063] Optionally, in order to ensure the accuracy of the monitoring of the liquid level height in the vacuum cavity, different liquid level sensors can be configured at different heights of the vacuum cavity; for example, two liquid level sensors are configured in each vacuum cavity, as shown in FIG. 3, liquid level sensor 27 and liquid level sensor 36 are configured in vacuum cavity 9, liquid level sensor 27 is used to monitor the high liquid level of the cooling liquid in vacuum cavity 9, and liquid level sensor 36 is used to monitor the low liquid level of the cooling liquid in vacuum cavity 9; liquid level sensor 26 and liquid level sensor 37 are configured in vacuum cavity 8, liquid level sensor 26 is used to monitor the high liquid level of the cooling liquid in vacuum cavity 8, and liquid level sensor 37 is used to monitor the low liquid level of the cooling liquid in vacuum cavity 8.

[0064] In a possible implementation, each vacuum cavity is configured with a corresponding pressure sensor; the pressure sensor is used to monitor the vacuum degree in the corresponding vacuum cavity, so as to adjust the power of the vacuum pump through the monitoring of the vacuum degree, so as to control the pressure difference of the first cooling loop. As shown in FIG. 3, pressure sensor 28 is configured in vacuum cavity 9, and 25 is configured in vacuum cavity 8 to monitor the vacuum degree of each vacuum cavity.

[0065] In a possible implementation, a temperature sensor can also be arranged on each cooling circuit to monitor the temperature of the cooling liquid flowing through the corresponding pipeline; illustratively, in the case where the first cooling circuit and the second cooling circuit have a common pipeline, a first temperature sensor is arranged on the common pipeline, and a second temperature sensor is arranged on the pipeline through which the first cooling circuit flows out of the first cooling area, and each temperature sensor is used to monitor the temperature of the cooling liquid flowing through the corresponding pipeline. As shown in FIG. 3, a temperature sensor 22 is arranged on the common pipeline 17 to monitor the temperature of the low-temperature cooling liquid returning to the liquid cooling tank; a temperature sensor 23 is arranged on the pipeline through which the first cooling circuit flows out of the first cooling area to monitor the temperature of the high-temperature cooling liquid flowing out of the first cooling area. Optionally, a pressure sensor 24 can also be arranged on the pipeline to monitor the pressure of the high-temperature cooling liquid flowing out of the first cooling area. Further, a temperature sensor 29 and a temperature sensor 30 can be respectively arranged on the inlet pipeline and the outlet pipeline between the heat exchanger 13 and the cooling device 15, wherein the temperature sensor 29 is used to monitor the working medium temperature at the inlet of the cooling device, and the temperature sensor 30 is used to monitor the working medium temperature at the outlet of the cooling device.

[0066] The temperature sensor and the pressure sensor used in the system should be an electronic transmission sensor with rapid dynamic response, good compatibility and stable work; the liquid level sensor can be a pressure-resistant and sensitive contact electronic liquid level meter. It should be noted that, based on different actual application requirements, the required sensors can be arranged on each component or each pipeline in the system to obtain the parameters at the corresponding positions, so as to monitor the working state of the system. The arrangement position, quantity and type of each sensor in the above embodiment are illustrative, and based on different actual requirements, more or fewer sensors can be arranged, which is not limited in the present application.

[0067] In a possible implementation, the flow restrictor 2 further comprises a flow disturbance radiator; the flow disturbance radiator is arranged in a flow-restricted region in the first cooling region, and is configured to intensify the fluid disturbance of the cooling liquid flowing through the surface of the high-power electronic device; the flow-restricted region is a region defined based on the high-power electronic device. FIG. 9 shows a schematic diagram of the device configuration in the first cooling region. As shown in FIG. 9, the flow restrictor 2 comprises a flow disturbance radiator 40 arranged in a flow-restricted region near the surface of the high-power electronic device 3. After the cooling liquid in the first cooling loop enters the first cooling region through the cooling liquid inlet 38, the cooling liquid passes through the flow disturbance radiator 40, and the fluid disturbance of the cooling liquid flowing through the surface of the high-power electronic device 3 can be intensified. The high-power electronic device 3 can be mounted on a PCB (Printed Circuit Board) board 39, or can be fixed in other ways. By arranging the flow disturbance radiator, the heat dissipation effect can be improved. The flow disturbance radiator can be a device with good thermal conductivity and can intensify heat exchange. Illustratively, the flow disturbance radiator can be a copper radiator or a VC (Vapor Chamber) composite radiator.

[0068] In a possible implementation, the flow restrictor 2 further comprises a flow restrictor flow equalization plate 34; the flow restrictor flow equalization plate 34 is arranged on the side of the cooling liquid inlet in the first cooling region, and is configured to make the cooling liquid entering the first cooling region flow through the surface of the high-power electronic device evenly, thereby improving the heat dissipation effect.

[0069] Based on the configuration of the single-phase immersion liquid cooling system, the flow rates of the cooling liquid in the double cooling loops can be adjusted respectively. When adjusting, for the first cooling loop, on the one hand, the working power of the cooling liquid circulating pump or the vacuum pump can be adjusted to adjust the pressure difference, so as to adjust the flow rate / flow volume; on the other hand, the opening size of each control valve on the first cooling loop can be adjusted to adjust the flow rate / flow volume. For the second cooling loop, on the one hand, the working power of the cooling liquid circulating pump can be adjusted to adjust the flow rate / flow volume; on the other hand, the opening size of each control valve on the second cooling loop can be adjusted to adjust the flow rate / flow volume.

[0070] In summary, the single-phase immersion liquid cooling system provided in the embodiments of the present application has a liquid cooling case, a first cooling loop and a second cooling loop. The liquid cooling case is divided into cooling areas corresponding to different heat dissipation requirements by flow restrictors on the first cooling loop. The cooling liquid inlets and outlets of the different cooling loops are different on the liquid cooling case. The cooling liquid flow rates in the first cooling loop and the second cooling loop are independently controlled to adapt to the heat dissipation requirements of the cooling areas corresponding to the respective cooling loops, thereby reducing the influence of slow heat transfer caused by different power consumptions of electronic devices and immersion flow rates, ensuring the heat dissipation effect of various electronic devices, and avoiding unnecessary resource waste.

[0071] The single-phase immersion liquid cooling system provided in the embodiments of the present application can be applied to a scenario containing multiple high-power electronic devices. In this case, the number of flow restrictors on the first cooling loop is consistent with the number of high-power electronic devices. When the number of high-power electronic devices is multiple, each high-power electronic device has a corresponding first cooling area.

[0072] The single-phase immersion liquid cooling system provided in the present application can be applied to horizontal immersion and rack immersion. Taking the application of the single-phase immersion liquid cooling system in the application scenario of two high-power electronic devices (such as servers) as an example, FIG. 10 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system provided in an example embodiment of the present application. As shown in FIG. 10, the horizontal immersion cooling case 47 contains a first blade server 41 and a second blade server 42. Corresponding to each server, a corresponding flow restrictor is configured on the first cooling loop to quickly dissipate heat from the server. The flow mode of the cooling liquid in the first cooling loop can be an up-in and down-out flow mode, and the flow mode of the cooling liquid in the second cooling loop can be a down-in and up-out flow mode. As shown in FIG. 10, the cooling liquid in the first cooling loop flows into the corresponding first cooling area through the cooling liquid inlets 45 on the flow restrictors and flows out of the corresponding first cooling area through the cooling liquid outlets 46. The configuration position of the cooling liquid inlets 45 is higher than that of the cooling liquid outlets 46. The cooling liquid in the second cooling loop flows into the second cooling area through the cooling liquid inlets 43 on the liquid cooling case and flows out of the second cooling area through the cooling liquid outlets 44. The configuration position of the cooling liquid inlets 43 is lower than that of the cooling liquid outlets 44. Further, in order to enable the cooling liquid to fully fill the corresponding cooling area, the cooling liquid inlets and the cooling liquid outlets can be arranged on two opposite and parallel planes. In addition, the configuration positions of the cooling liquid inlets and the cooling liquid outlets can be diagonally arranged to enable the cooling liquid to fully fill the cooling area.

[0073] Fig. 11 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application. As shown in Fig. 11, the first blade server 41 and the second blade server 42 are contained in the horizontal immersion cooling cabinet 47, and each server is configured with a corresponding flow restrictor on the first cooling loop for fast heat dissipation. The flow direction of the cooling liquid in the first cooling loop is the same as that in the second cooling loop, which is the down-in and up-out flow direction. As shown in Fig. 11, the cooling liquid of the first cooling loop flows into the corresponding first cooling area through the cooling liquid inlet 49 on each flow restrictor, and flows out of the corresponding first cooling area through the cooling liquid outlet 50. The configuration position of the cooling liquid inlet 49 is lower than that of the cooling liquid outlet 50. The cooling liquid of the second cooling loop flows into the second cooling area through the cooling liquid inlet 43 on the liquid cooling cabinet, and flows out of the second cooling area through the cooling liquid outlet 44. The configuration position of the cooling liquid inlet 43 is lower than that of the cooling liquid outlet 44.

[0074] Fig. 12 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application. As shown in Fig. 12, the flow direction of the cooling liquid in the first cooling loop can be the front-in and back-out flow direction, and the flow direction of the cooling liquid in the second cooling loop is the down-in and up-out flow direction. As shown in Fig. 12, the cooling liquid of the first cooling loop flows into the corresponding first cooling area through the cooling liquid inlet 49 on each flow restrictor, and flows out of the corresponding first cooling area through the cooling liquid outlet 52. The cooling liquid of the second cooling loop flows into the second cooling area through the cooling liquid inlet 53 on the liquid cooling cabinet, and flows out of the second cooling area through the cooling liquid outlet 54. The configuration position of the cooling liquid inlet 53 is lower than that of the cooling liquid outlet 54.

[0075] Fig. 13 shows a schematic diagram of a double-loop negative pressure enhanced horizontal single-phase immersion liquid cooling system according to another example embodiment of the present application. As shown in Fig. 13, the flow direction of the cooling liquid in the first cooling loop can be the back-in and front-out flow direction, and the flow direction of the cooling liquid in the second cooling loop is the down-in and up-out flow direction. As shown in Fig. 13, the cooling liquid of the first cooling loop flows into the corresponding first cooling area through the cooling liquid inlet 56 on each flow restrictor, and flows out of the corresponding first cooling area through the cooling liquid outlet 57. The cooling liquid of the second cooling loop flows into the second cooling area through the cooling liquid inlet 53 on the liquid cooling cabinet, and flows out of the second cooling area through the cooling liquid outlet 54. The configuration position of the cooling liquid inlet 53 is lower than that of the cooling liquid outlet 54.

[0076] Optionally, the flow direction of the cooling liquid in the second cooling loop of each single-phase immersion liquid cooling system described above can also be replaced by the up-in and down-out flow direction, and the configuration of the inlet and outlet can be set based on actual requirements.

[0077] Further, after the single-phase immersion liquid cooling system is installed, before starting operation, in order to ensure the safety of the system operation, the system components can be checked before power-on, for example, as shown in Fig. 3, the single-phase immersion liquid cooling system, first, determine whether there is visible physical damage or damage to each component in the system, if there is, repair or replace the component in time, if not, continue to the next step.

[0078] Secondly, fill the cooling liquid in the liquid cooling case 1, the first vacuum cavity 9, the second vacuum cavity 8 and the cooling liquid circulating pump 14; open the inflow control valve 4, the inflow control valve 5, the inflow control valve 6, the inflow control valve 7, the outflow control valve 11, the outflow control valve 10 and the cooling liquid circulating pump 14 so that the entire system pipeline is filled with cooling liquid; check whether the entire system components have liquid leakage, if so, close the cooling liquid circulating pump 14 and repair or replace the component in time, if not, continue to the next step.

[0079] Thirdly, after the system is checked, each component is powered on (each electronic device is not turned on); close the inflow control valve 6, open the pressure relief valve 32, wait until the first vacuum cavity 9 is emptied to the configuration height of the liquid level sensor 36, close the pressure relief valve 32; the outflow control valve 11 is connected to the vacuum pump 12; the vacuum pump 12 is powered on and started, and the working state of the sensor, the pump, the electronic device and the external cooling device is detected, if there is an abnormal element in the working state, repair or replace it in time, if the working state is good, continue to the next step.

[0080] Finally, after the entire system is stably operated, the electronic devices in the liquid cooling case are cooled by the single-phase immersion liquid cooling system.

[0081] In the embodiment of the application, each sensor in the single-phase immersion liquid cooling system can send the monitored parameters to the single-phase immersion liquid cooling system, so that the control device dynamically adjusts each component in the system based on the parameters of each sensor received, so as to realize the heat dissipation adjustment in a wide range, thereby optimizing the PUE operation of the system. Based on the single-phase immersion liquid cooling system shown in the above embodiments, Fig. 14 shows a flowchart of a control method of a single-phase immersion liquid cooling system provided by an exemplary embodiment of the application, which can be executed by a control device of the single-phase immersion liquid cooling system of the above embodiments, and the control device can be realized as a server or a terminal, as shown in Fig. 14, the method includes the following steps:

[0082] Step 1410, monitoring the liquid level height of the cooling liquid in the liquid cooling case.

[0083] Step 1420, in the case that the liquid level height of the cooling liquid in the liquid cooling tank meets the liquid level height adjustment condition, a first control signal is sent to the single-phase immersion liquid cooling system, the first control signal is used to instruct to adjust the working power of the cooling liquid circulating pump, and / or, adjust the opening degree of the inflow control valve of the second cooling loop, so as to adjust the cooling liquid flow of the second cooling loop.

[0084] That is, the computer device can monitor the liquid level height of the cooling liquid in the liquid cooling tank through the liquid level sensor 33 arranged in the liquid cooling tank, and adjust the cooling liquid flow of the cooling loop of the second cooling loop in the case that the liquid level height of the cooling liquid in the liquid cooling tank meets the liquid level height adjustment condition. Wherein, the liquid level height of the cooling liquid in the liquid cooling tank meeting the liquid level height adjustment condition can include: when the liquid level height in the liquid cooling tank exceeds the corresponding highest threshold, it means that the cooling liquid in the liquid cooling tank is too much, and the discharge amount of the cooling liquid needs to be increased to reduce the amount of cooling liquid in the liquid cooling tank, at this time, the first control signal can instruct to reduce the working power of the cooling circulating pump, and / or, reduce the opening degree of the inflow control valve of the second cooling loop, so as to reduce the cooling liquid flow of the second cooling loop; when the liquid level height in the liquid cooling tank is lower than the corresponding standard threshold, it means that the cooling liquid in the liquid cooling tank is less, which may affect the heat dissipation effect of the second cooling area, and the injection amount of the cooling liquid needs to be increased to increase the amount of cooling liquid in the liquid cooling tank, at this time, the first control signal can instruct to increase the working power of the cooling circulating pump, and / or, increase the opening degree of the inflow control valve of the second cooling loop, so as to increase the cooling liquid flow of the second cooling loop; further, when the liquid level height in the liquid cooling tank is lower than the corresponding standard threshold, the computer device can also issue corresponding system alarm information to prompt the current liquid level situation in the liquid cooling tank.

[0085] In a possible implementation, when the computer device controls the cooling liquid flow of the first cooling loop, it can be controlled based on the cooling liquid temperature monitored by the temperature sensor 23, and the method further comprises: monitoring the target temperature of the cooling liquid flowing out of the first cooling area of the first cooling loop; sending a second control signal to the single-phase immersion liquid cooling system based on the target temperature, the second control signal being used to instruct to adjust the working power of the cooling liquid circulating pump, and / or, the working power of the vacuum pump, and / or, the opening degree of each control valve on the first cooling loop; wherein the pressure difference formed by the vacuum pump and the cooling liquid circulating pump is positively correlated with the target temperature, and the opening degree of each control valve on the first cooling loop is positively correlated with the target temperature.

[0086] That is, when the target temperature is higher than the maximum temperature threshold, it indicates that the heat dissipation of the electronic device in the current first cooling area is more, and the heat dissipation capacity needs to be improved. At this time, the second control signal can instruct to increase the working power of the vacuum pump while keeping the working power of the cooling liquid circulating pump unchanged, so as to increase the pressure difference between the vacuum pump and the cooling liquid circulating pump; or the second control signal can instruct to increase the working power of the cooling liquid circulating pump and the working power of the vacuum pump at the same time, and achieve the effect of increasing the pressure difference between the vacuum pump and the cooling liquid circulating pump; and / or the second control signal can also instruct to increase the opening of each control valve on the first cooling circuit, wherein the each control valve on the first cooling circuit includes the inflow control valve of the first cooling circuit, the inflow control valve corresponding to the vacuum pump and the outflow control valve.

[0087] When the target temperature is lower than the minimum temperature threshold, it indicates that the heat dissipation capacity exceeds the heat dissipation of the electronic device in the current first cooling area. At this time, the second control signal can instruct to reduce the working power of the vacuum pump while keeping the working power of the cooling liquid circulating pump unchanged, so as to reduce the pressure difference between the vacuum pump and the cooling liquid circulating pump; or the second control signal can instruct to reduce the working power of the cooling liquid circulating pump and the working power of the vacuum pump at the same time, and achieve the effect of reducing the pressure difference between the vacuum pump and the cooling liquid circulating pump; and / or the second control signal can also instruct to reduce the opening of each control valve on the first cooling circuit.

[0088] In a possible implementation, when the computer device controls the cooling liquid flow rate in the first cooling circuit in the each vacuum cavity in turn, the working state switching of the vacuum cavity can be determined based on the liquid level height of the cooling liquid in the vacuum cavity; the method further comprises:

[0089] When it is monitored that the liquid level height of the cooling liquid in the first vacuum cavity is higher than the first maximum threshold, and the liquid level height of the cooling liquid in the second vacuum cavity is lower than the second minimum threshold, a third control signal is sent, and the third control signal is used to instruct to control each control valve to accelerate the cooling liquid flow rate in the first cooling circuit through the second vacuum cavity.

[0090] The state of each control valve indicated by the third control signal can refer to the state of each control valve in the case of accelerating the flow rate of the coolant in the first cooling loop by the second vacuum chamber in the embodiment shown in FIG. 3, which will not be repeated here. The computer device can monitor the high liquid level of the coolant in the first vacuum chamber 9 through the liquid level sensor 27 and monitor the low liquid level of the coolant in the second vacuum chamber 8 through the liquid level sensor 37. When it is determined that the liquid level in the first vacuum chamber 9 is higher than the first maximum threshold, it indicates that the first vacuum chamber 9 is full of coolant. When it is determined that the liquid level in the second vacuum chamber 8 is lower than the second minimum threshold, it indicates that the second vacuum chamber 8 is empty. At this time, the flow rate of the coolant in the first cooling loop accelerated by the second vacuum chamber is switched to the flow rate of the coolant in the first cooling loop accelerated by the first vacuum chamber by sending the third control signal.

[0091] In the case of monitoring that the liquid level of the coolant in the second vacuum chamber is higher than the second maximum threshold and the volume of the coolant in the first vacuum chamber is lower than the first minimum threshold, the fourth control signal is sent, which is used to indicate the control of each control valve to accelerate the flow rate of the coolant in the first cooling loop by the first vacuum chamber.

[0092] The state of each control valve indicated by the fourth control signal can refer to the state of each control valve in the case of accelerating the flow rate of the coolant in the first cooling loop by the first vacuum chamber in the embodiment shown in FIG. 3, which will not be repeated here. The computer device can monitor the high liquid level of the coolant in the second vacuum chamber 8 through the liquid level sensor 26 and monitor the low liquid level of the coolant in the first vacuum chamber 9 through the liquid level sensor 36. When it is determined that the liquid level in the second vacuum chamber 8 is higher than the second maximum threshold, it indicates that the second vacuum chamber 8 is full of coolant. When it is determined that the liquid level in the first vacuum chamber 9 is lower than the first minimum threshold, it indicates that the first vacuum chamber 9 is empty. At this time, the flow rate of the coolant in the first cooling loop accelerated by the second vacuum chamber is switched to the flow rate of the coolant in the first cooling loop accelerated by the first vacuum chamber by sending the fourth control signal.

[0093] In the case of having more vacuum chambers, the monitoring and switching process is similar to the above process. Repeating the above monitoring and switching control process can achieve the effect of accelerating the flow rate of the coolant in the first cooling loop by at least two vacuum chambers in turn.

[0094] In a possible implementation, the computer device is further provided with a protection mechanism for the vacuum cavity to avoid failure during operation; the method further includes: in a case where the monitored height difference of the cooling liquid in the first vacuum cavity exceeding the first highest threshold value is greater than the first warning height threshold value, a fifth control signal is sent, the fifth control signal being used to indicate that the first pressure relief valve of the first vacuum cavity is in an open state; in a case where the monitored height difference of the cooling liquid in the second vacuum cavity exceeding the second highest threshold value is greater than the second warning height threshold value, a sixth control signal is sent, the sixth control signal being used to indicate that the second pressure relief valve of the second vacuum cavity is in an open state.

[0095] That is, for each vacuum cavity, when the vacuum cavity is full and the warning liquid level is exceeded, in order to prevent the pressure in the vacuum cavity from being too large to cause danger, the computer device opens the pressure relief valve of the vacuum cavity to protect the vacuum pump; further, the computer device can also feedback corresponding alarm information to remind relevant personnel to check the system and timely eliminate the fault; illustratively, when the liquid level sensor 27 monitors that the first vacuum cavity 9 is full and exceeds the warning water level, corresponding alarm information is fed back, and a fifth control signal is issued to indicate that the pressure relief valve 32 is opened to protect the first vacuum cavity 9; when the liquid level sensor 26 monitors that the second vacuum cavity 8 is full and exceeds the warning water level, corresponding alarm information is fed back, and a sixth control signal is issued to indicate that the pressure relief valve 31 is opened to protect the second vacuum cavity 8.

[0096] To sum up, the control method of the single-phase immersion liquid cooling system provided by the embodiment of the application is based on a double-circuit negative pressure enhanced single-phase immersion liquid cooling system, parameters in the single-phase immersion liquid cooling system are monitored through various sensors, and each component in the single-phase immersion liquid cooling system is controlled based on the monitored parameters, to maintain the safe and stable operation of the single-phase immersion liquid cooling system, improve the heat dissipation effect of the single-phase immersion liquid cooling system on various electronic devices, and avoid unnecessary waste of resources.

[0097] FIG. 15 shows a structural block diagram of a computer device 1500 according to an example embodiment of the present application. The computer device can be implemented as a control device of the single-phase immersion liquid cooling system according to the above-mentioned solutions of the present application. The computer device 1500 includes a processor (such as a central processing unit (CPU)) 1501, a system memory 1504 including a random access memory (RAM) 1502 and a read-only memory (ROM) 1503, and a system bus 1505 connecting the system memory 1504 and the processor 1501. The computer device 1500 also includes a mass storage device 1506 for storing an operating system 1509, application programs 1514, and other program modules 1511. Without loss of generality, the computer readable medium can include computer storage media and communication media. The computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. The computer storage media includes RAM, ROM, erasable programmable read-only memory (EPROM), electrically-erasable programmable read-only memory (EEPROM) flash memory or other solid-state memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD), or other optical storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices. Of course, those skilled in the art can know that the computer storage media is not limited to the above-mentioned several kinds. The system memory 1504 and the mass storage device 1506 mentioned above can be collectively referred to as memory. According to various embodiments of the present application, the computer device 1500 can also run on a remote computer connected to a network such as the Internet. That is, the computer device 1500 can be connected to a network through a network interface unit 1507 connected to the system bus 1505, or in other words, the network interface unit 1507 can also be used to connect to other types of network or remote computer system (not shown). The memory also stores at least one computer program, and the processor 1501 implements all or part of the steps of the control method of the single-phase immersion liquid cooling system according to the embodiment of FIG. 14 by executing the at least one computer program.

[0098] FIG. 16 shows a structural block diagram of a computer device 1600 according to an example embodiment of the present application. The computer device 1600 can be implemented as the control device of the single-phase immersion liquid cooling system described above. Generally, the computer device 1600 includes a processor 1601 and a memory 1602. The memory 1602 can include one or more computer-readable storage media storing at least one instruction for execution by the processor 1601 to implement all or part of the data processing result verification method according to the method embodiments of the present application. In some embodiments, the computer device 1600 can also optionally include a peripheral device interface 1603 and at least one peripheral device. The processor 1601, the memory 1602, and the peripheral device interface 1603 can be connected by a bus or a signal line. Each peripheral device can be connected to the peripheral device interface 1603 through a bus, a signal line, or a circuit board. Specifically, the peripheral device includes at least one of a radio frequency circuit 1604, a display screen 1605, a camera assembly 1606, an audio circuit 1607, and a power supply 1608. In some embodiments, the computer device 1600 further includes one or more sensors 1609. The one or more sensors 1609 include, but are not limited to, an acceleration sensor 1610, a gyroscope sensor 1611, a pressure sensor 1612, an optical sensor 1613, and a proximity sensor 1614. Those skilled in the art can understand that the structure shown in FIG. 16 does not constitute a limitation on the computer device 1600, and can include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0099] In an example embodiment, a computer-readable storage medium is also provided, which stores at least one computer program loaded and executed by a processor to implement all or part of the control method of the single-phase immersion liquid cooling system described above. For example, the computer-readable storage medium can be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0100] In an example embodiment, a computer program product is also provided, which includes a computer program stored on a non-transitory computer-readable storage medium, and the computer program includes program instructions that, when executed by a computer, cause the computer to perform all or part of the steps of the example shown in FIG. 14.

[0101] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

[0102] It is to be understood that the application is not limited to the precise construction herein disclosed and shown in the drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is limited only by the claims that follow.

Claims

A single-phase immersion liquid cooling system, wherein, The system comprises a liquid cooling cabinet, a first cooling circuit and a second cooling circuit; The first cooling circuit comprises a flow restrictor; the flow restrictor is used to separate the liquid cooling cabinet into a first cooling area and a second cooling area; the first cooling liquid area comprises cooling liquid entering the flow restrictor through the first cooling circuit, and the second cooling area comprises cooling liquid entering the liquid cooling cabinet through the second cooling circuit; the first cooling area and the second cooling area have different heat dissipation requirements; The cooling liquid inlet and outlet of the first cooling circuit on the liquid cooling cabinet are different from the cooling liquid inlet and outlet of the second cooling circuit on the liquid cooling cabinet, and the flow rate difference exists between the cooling liquid flow rate in the first cooling circuit and the cooling liquid flow rate in the second cooling circuit. The system of claim 1, wherein In the case that the cooling liquid flow rate in the first cooling circuit is higher than the cooling liquid flow rate in the second cooling circuit, the first cooling liquid area is the area corresponding to high-power electronic equipment; the second cooling area is the area corresponding to low-power electronic equipment; the heat dissipation amount of the high-power electronic equipment per unit time is higher than that of the low-power electronic equipment per unit time. The system of claim 1, wherein The system further comprises a cooling distribution unit CDU and a cooling device; the CDU comprises a heat exchanger and a cooling liquid circulating pump; The heat exchanger is used to receive the cooling liquid flowing out of the liquid cooling cabinet through the first cooling circuit and the second cooling circuit, and transfer the heat absorbed by the cooling liquid to the cooling device, so that the cooling device discharges heat to the environment; The cooling liquid circulating pump is used to pump the cooling liquid cooled by the heat exchanger into the cooling circuit; the cooling circuit comprises the first cooling circuit and the second cooling circuit. The system of claim 3, wherein, The CDU further comprises a vacuum pump and at least two vacuum cavities; The vacuum pump is used to pump the at least two vacuum cavities and maintain the vacuum environment of each vacuum cavity; The at least two vacuum cavities are respectively connected with the first cooling circuit, and the at least two vacuum cavities are used to control the cooling liquid flow rate in the first cooling circuit in turn by using the pressure difference formed by the vacuum pump and the cooling liquid circulating pump. The system of claim 4, wherein, Each vacuum cavity is provided with a corresponding inflow control valve and an outflow control valve; The inflow control valve is used to control the flow rate of the cooling liquid flowing into the vacuum cavity; The outflow control valve is a three-way valve, which is used to control the on-off of the vacuum cavity and the vacuum pump and the on-off of the heat exchanger. The system of claim 5, wherein, Each vacuum cavity is further provided with a corresponding pressure relief valve; If the CDU comprises two vacuum cavities, in the case that the cooling liquid flow rate in the first cooling circuit is controlled by the first vacuum cavity, the first inflow control valve of the first vacuum cavity is in an open state, the first pressure relief valve of the first vacuum cavity is in a closed state, the first outflow control valve of the first vacuum cavity is connected to the vacuum pump, the second inflow control valve of the second vacuum cavity is in a closed state, the second pressure relief valve of the second vacuum cavity is in an open state, and the second outflow control valve of the second vacuum cavity is connected to the heat exchanger; In the case that the flow rate of the cooling liquid in the first cooling circuit is controlled by the second vacuum cavity, the first inflow control valve is in a closed state, the first pressure relief valve is in an open state, the first outflow control valve is connected to the heat exchanger, the second inflow control valve is in an open state, the second pressure relief valve is in a closed state, and the second outflow control valve is connected to the vacuum pump. The system of claim 4, wherein, The first cooling circuit and the second cooling circuit have a common pipeline; one end of the common pipeline is connected to the cooling liquid circulating pump; The cooling liquid in the common pipeline enters the first cooling circuit through the inflow control valve of the first cooling circuit, flows through the first cooling area and the vacuum cavity, and then enters the heat exchanger; The cooling liquid in the common pipeline enters the second cooling circuit through the inflow control valve of the second cooling circuit, and then enters the heat exchanger after flowing through the second cooling area. The system of claim 4, wherein, The liquid cooling machine box and each vacuum cavity are respectively provided with a corresponding liquid level sensor; the liquid level sensor is used to monitor the liquid level in the corresponding space. The system of claim 4, wherein, Each vacuum cavity is provided with a corresponding pressure sensor; the pressure sensor is used to monitor the vacuum degree in the corresponding vacuum cavity. The system of claim 7, wherein, A first temperature sensor is arranged on the common pipeline, and a second temperature sensor is arranged on the pipeline on the side of the first cooling circuit flowing out of the first cooling area; each temperature sensor is used to monitor the temperature of the cooling liquid flowing through the corresponding pipeline. The system of claim 2, wherein, The flow restrictor further comprises a turbulence radiator; the turbulence radiator is arranged in a flow-restricted area in the first cooling area, and is used to intensify the fluid turbulence of the cooling liquid flowing through the surface of the high-power electronic device; the flow-restricted area is defined based on the high-power electronic device. The system of claim 2, wherein, The flow restrictor further comprises a flow restrictor flow-distributing plate; the flow restrictor flow-distributing plate is arranged on the inlet side of the cooling liquid in the first cooling area, and is used to make the cooling liquid entering the first cooling area flow through the surface of the high-power electronic device evenly. The system of claim 2, wherein, The number of the flow restrictors on the first cooling circuit is consistent with the number of the high-power electronic devices; when the number of the high-power electronic devices is multiple, each high-power electronic device has a corresponding first cooling area. A control method of a single-phase immersion liquid cooling system, wherein, The method is executed by the control device of the single-phase immersion liquid cooling system according to any one of claims 1 to 13, and the method comprises: monitoring the liquid level of the cooling liquid in the liquid cooling machine box; in the case that the liquid level of the cooling liquid in the liquid cooling machine box satisfies a liquid level adjustment condition, sending a first control signal to the single-phase immersion liquid cooling system, the first control signal being used to instruct to adjust the working power of the variable frequency cooling liquid circulating pump and / or to adjust the opening degree of the inflow control valve of the second cooling circuit, so as to adjust the cooling liquid flow of the second cooling circuit. The method of claim 14, wherein, The method further comprises: monitoring the target temperature of the cooling liquid flowing out of the first cooling area of the first cooling circuit; sending a second control signal to the single-phase immersion liquid cooling system based on the target temperature, the second control signal being used to instruct to adjust the working power of the cooling liquid circulating pump by frequency conversion, and / or to adjust the working power of the vacuum pump by frequency conversion, and / or to adjust the opening degree of each control valve on the first cooling loop; wherein the pressure difference formed by the vacuum pump and the cooling liquid circulating pump is positively correlated with the target temperature, and the opening degree of each control valve on the first cooling loop is positively correlated with the target temperature. The method of claim 14, wherein, The method further comprises: sending a third control signal in a case where it is monitored that the liquid level height of the cooling liquid in the first vacuum cavity is higher than a first highest threshold value, and the liquid level height of the cooling liquid in the second vacuum cavity is lower than a second lowest threshold value, the third control signal being used to instruct to control each control valve to accelerate the flow rate of the cooling liquid in the first cooling loop through the second vacuum cavity; sending a fourth control signal in a case where it is monitored that the liquid level height of the cooling liquid in the second vacuum cavity is higher than a second highest threshold value, and the liquid level of the cooling liquid in the first vacuum cavity is lower than a first lowest threshold value, the fourth control signal being used to instruct to control each control valve to accelerate the flow rate of the cooling liquid in the first cooling loop through the first vacuum cavity. The method of claim 16, wherein, The method further comprises: sending a fifth control signal in a case where it is monitored that the height difference of the cooling liquid in the first vacuum cavity exceeding the first highest threshold value is greater than a first warning height threshold value, the fifth control signal being used to instruct the first pressure relief valve of the first vacuum cavity to be in an open state; sending a sixth control signal in a case where it is monitored that the height difference of the cooling liquid in the second vacuum cavity exceeding the second highest threshold value is greater than a second warning height threshold value, the sixth control signal being used to instruct the second pressure relief valve of the second vacuum cavity to be in an open state. A control device of a single-phase immersion liquid cooling system, wherein The control device comprises a processor and a memory, the memory stores at least one computer program, the at least one computer program is loaded and executed by the processor to realize the control method of the single-phase immersion liquid cooling system as claimed in any one of claims 14 to 17. A computer-readable storage medium, wherein, The computer readable storage medium stores at least one computer program, the computer program is loaded and executed by the processor to realize the control method of the single-phase immersion liquid cooling system as claimed in any one of claims 14 to 17. A computer program product, wherein, The computer program product comprises a computer program stored on a non-transitory computer readable storage medium, the computer program comprises program instructions, when the program instructions are executed by a computer, the computer executes to realize the control method of the single-phase immersion liquid cooling system as claimed in any one of claims 14 to 17.

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