Electrode frame structure of flow battery and forming process of electrode frame structure

Abstract

The present invention relates to an electrode frame structure of a flow battery and a molding process thereof, the electrode frame structure comprises: a frame body, the frame body comprises a placement groove, the frame body is provided with a through hole penetrating along the thickness direction, and the placement groove is arranged around the through hole; the mounting part is mounted in the placement groove, the first surface of the mounting part is in sealed connection with the surface of the groove bottom of the placement groove, and a plurality of fixing holes are formed in the overlapped part of the edge of the mounting part and the surface of the groove bottom of the placement groove at intervals; the rubber coating layer is arranged at the edge position of the second surface of the mounting piece, the peripheral side of the rubber coating layer is bonded with the inner side wall of the placing groove, and a part of the rubber coating layer extends into the fixing hole and fills the fixing hole; wherein the frame body and the rubber coating layer are of a non-integrated structure formed by independent injection molding. In addition, the invention further provides a forming process of the electrode frame structure. According to the electrode frame structure, the sealing performance can be effectively guaranteed, liquid leakage is avoided, the reliability is high, and the production cost can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of flow battery, in particular to an electrode frame structure of flow battery and a forming process thereof. BACKGROUND

[0002] Flow battery is a kind of efficient electrochemical energy storage technology. The working medium of flow battery is electrolyte, generally acidic liquid. The loss of electrolyte will not only cause the decrease of charge and discharge energy, but also cause environmental pollution or safety accidents. In the whole flow battery system, the stack is the core power component, and is also the weakest sealing part of the whole system. The flow battery stack is usually composed of electrodes, ion-conducting membranes, electrode frames, bipolar plates, current collectors and end plates. If the sealing of any link fails, it will cause serious consequences. Therefore, it is very important to ensure the sealing between the internal components of the flow battery.

[0003] In the all-vanadium flow battery system, the bipolar plate and the ion membrane are installed in the electrode frame. During installation, the sealing between the bipolar plate, the ion membrane and the electrode frame needs to be ensured to prevent liquid leakage during use. At present, the assembly method of the bipolar plate (or ion membrane) and the electrode frame mainly adopts laser welding. However, due to the difference in material and thermal expansion and contraction coefficient between the electrode frame and the bipolar plate (or ion membrane), the temperature change during laser welding can easily cause the deformation of the electrode frame, which makes the welded part easy to fall off, and the connection stability is poor. In addition, due to the different shrinkage degrees of the electrode frame and the bipolar plate (or ion membrane) during cooling after welding, the welded part is easy to produce gap, which cannot guarantee the sealing, and liquid leakage is easy to occur during subsequent use, and the reliability is poor. Moreover, laser welding needs to be performed on each electrode frame, which consumes a lot of time and has low efficiency. In addition, laser welding needs special equipment and professional training for the operator, which increases the production cost.

[0004] In addition, at present, some electrode frames are produced by directly injecting plastic around the bipolar plate (or ion membrane) through a mold. After injection molding is completed, the bipolar plate (or ion membrane) is embedded in the center of the electrode frame, that is, the electrode frame is made and assembled by one-time injection molding. However, due to the volume shrinkage of plastic during cooling after injection molding, the bipolar plate (or ion membrane) in the center of the electrode frame will be strongly pulled during shrinkage. However, the bipolar plate (or ion membrane) will resist deformation, so that the final electrode frame product will have a certain bending phenomenon, which affects the quality. SUMMARY

[0005] Therefore, the purpose of the present application is to provide an electrode frame structure of flow battery with good sealing and high reliability, and a forming process thereof. The electrode frame structure can effectively ensure the sealing, avoid liquid leakage, and improve the production quality and reduce the production cost.

[0006] The application achieves the purpose by the following technical scheme.

[0007] An electrode frame structure of a flow battery comprises: a frame body comprising a placing groove, the frame body being provided with a through hole along the thickness direction, and the placing groove being arranged around the through hole; a mounting piece mounted in the placing groove and comprising opposite first and second surfaces, the first surface of the mounting piece being in sealing connection with the groove bottom surface of the placing groove, and a plurality of fixing holes being arranged at the overlapping part of the edge of the mounting piece and the groove bottom surface of the placing groove; and a rubber coating layer arranged at the edge position of the second surface of the mounting piece, the outer circumferential side of the rubber coating layer being bonded to the inner side wall of the placing groove, and a part of the rubber coating layer extending into the fixing hole and filling the fixing hole; wherein the frame body and the rubber coating layer are independently injection molded into a non-integral structure.

[0008] In the above technical scheme, the first surface of the mounting piece faces the groove bottom surface of the placing groove and is in abutment with the groove bottom surface of the placing groove, the rubber coating layer is located at the edge position of the second surface of the mounting piece and is bonded to the inner side wall of the placing groove, so that the mounting piece is sealed with the frame body, and the frame body and the rubber coating layer are obtained by injection molding in sequence.

[0009] It should be noted that, since the frame body and the mounting piece are made of different materials and have different thermal expansion and contraction coefficients, when the mounting piece and the frame body are connected by laser welding, the temperature change during welding will cause the frame body to deform at the welding position, and after cooling, due to the difference in shrinkage between the two, a gap is easily generated at the welding position, and even the mounting piece may fall off, affecting the sealing property and easily causing liquid leakage during use, and the reliability is low. In the present application, the rubber coating layer is used for sealing, since the rubber coating layer and the frame body are both injection molded, deformation caused by temperature change and shrinkage difference can be avoided, the sealing property between the frame body and the mounting piece is effectively ensured, and the overlapping part of the edge position of the mounting piece and the placing groove is provided with a plurality of fixing holes, when the rubber coating layer is injection molded, plastic will enter the fixing holes and fill the fixing holes, thereby forming a plurality of columnar fixing structures, the stability of the rubber coating layer is strengthened, the rubber coating layer is not easy to loosen even under the influence of external force, the sealing effect is ensured, and the reliability is improved. In addition, since the frame body and the rubber coating layer are both injection molded from plastic material, when the rubber coating layer is injection molded, the rubber coating layer can be integrally bonded to the side wall of the placing groove by heat melting, the sealing property is greatly strengthened, the connection is more stable, and the reliability of the sealing is further improved.

[0010] In addition, since laser welding needs to be carried out through a special laser welding device, the laser welding device needs to be additionally purchased, and the staff needs to be specially trained to operate, which is high in cost. The encapsulating layer in the application is obtained by injection molding, and the frame body is also injection molded, so that production can be realized only through an injection molding machine, without additional equipment investment and labor cost, so that the production cost can be effectively reduced. In addition, since the encapsulating layer is injection molded, a unified mold can be arranged to process, so that compared with laser welding, the processing time can be effectively shortened, the production efficiency can be improved, and the consistency of the electrode frame structure can be ensured.

[0011] It is worth mentioning that some electrode frames in the prior art are obtained by directly injection molding the periphery of the mounting piece through a mold, and the mounting piece is left in the center of the electrode frame after injection molding, that is, the electrode frame is manufactured and assembled through one-time injection molding. However, since the volume of plastic will shrink when cooled, the mounting piece in the center will be strongly pulled when the injection-molded electrode frame shrinks, but the mounting piece will resist deformation, so that the electrode frame will be bent to a certain extent, resulting in that the final electrode frame product is bent, which affects the quality. The application realizes sealing by separate injection molding of the encapsulating layer, so that compared with the one-piece molding method in the prior art, the sealing effect can be ensured, and the bending phenomenon of the frame after cooling can be avoided.

[0012] In an example of the application, the mounting piece is a bipolar plate or an ion membrane.

[0013] In the above technical solution, the liquid flow battery energy storage system is composed of a plurality of liquid flow battery monomers stacked together, each liquid flow battery monomer includes a plurality of electrode frames, a part of the electrode frames are mounted with bipolar plates, and the other part of the electrode frames are mounted with ion membranes, which play different roles.

[0014] In an example of the application, the part of the encapsulating layer extending into the fixing hole is bonded to the bottom surface of the placement groove.

[0015] In the above technical solution, since the encapsulating layer and the frame are both obtained by injection molding, the part of the encapsulating layer extending into the fixing hole can be integrally bonded to the bottom surface of the placement groove by hot melting, so that the connection stability is strengthened.

[0016] In an example of the application, the fixing holes are triangularly and staggeredly distributed on the edge of the mounting piece.

[0017] In the above technical solution, the triangular distribution mode is more stable, so that the adhesion of the encapsulating layer is more stable.

[0018] In an example of the application, the area of the fixing hole accounts for 10-25% of the overlapping area of the edge of the mounting piece and the bottom surface of the placement groove.

[0019] In the technical solution, to ensure the stability of the adhesive layer, the area of the fixing hole accounts for 10-25% of the area of the overlapping part of the edge of the mounting piece and the bottom surface of the placement groove.

[0020] In one example of the present application, the thickness of the frame body is 2.0-5.0 mm.

[0021] In the technical solution, to ensure the rationality of the stacked structure, the thickness of the frame body is 2.0-5.0 mm.

[0022] A forming process of an electrode frame structure, comprising the following steps: S1: obtaining a frame body with a through hole and a placement groove by injection molding through a first mold; S2: processing a fixing hole at the edge position of the mounting piece; S3: placing the mounting piece into the placement groove, and making the first surface of the mounting piece face the bottom surface of the placement groove; S4: placing the frame body with the mounting piece into a second mold, and forming an adhesive layer at the second surface edge position of the mounting piece by injection molding.

[0023] In the technical solution, the first mold and the second mold are respectively used for injection molding of the frame body and injection molding of the adhesive layer. In S4, when the adhesive layer is injection molded, the material can automatically enter and fill the fixing hole, and can be bonded with the bottom surface of the placement groove. After cooling, the connection stability of the adhesive layer can be effectively enhanced, and the adhesive layer can be prevented from falling off.

[0024] In one example of the present application, in S4, the temperature of the barrel in injection molding is 180-250 DEG C, and the injection pressure is 60-90 MPa.

[0025] In one example of the present application, in S4, the holding pressure time in injection molding is 20 S, and the holding pressure is 20-40 MPa.

[0026] In one example of the present application, the material of the frame body and the adhesive layer is polypropylene.

[0027] In the technical solution, when the adhesive layer is injection molded, since the material of the adhesive layer is the same as that of the frame body, the adhesive layer and the frame body are favorably hot melt bonded, the sealing property is enhanced, a stable connection is formed, the adhesive layer can be effectively prevented from falling off in the future, and thus the sealing property and the reliability of the electrode frame structure are greatly improved.

[0028] Compared with the prior art, the present application has the following advantages: The present application seals the mounting piece and the frame body through the encapsulation layer. Since the encapsulation layer and the frame body are both formed by injection molding, compared with the traditional laser welding, the deformation caused by temperature change and shrinkage difference can be avoided, the sealing between the frame body and the mounting piece is effectively ensured, meanwhile, a plurality of fixing holes are opened at the edge position of the mounting piece, the fixing holes are filled with the encapsulation layer, the stability of the encapsulation layer is strengthened, the encapsulation layer is not easy to loosen even under the influence of external force, the sealing effect is ensured, and the reliability is improved. The frame body and the encapsulation layer of the present application are both obtained by injection molding, the encapsulation layer can be hot melt bonded with the side wall of the placing groove, the sealing property is greatly improved, the connection is more stable, and the reliability of the sealing is further improved.

[0029] The present application seals through encapsulation, compared with the way of directly injection molding the frame body on the peripheral side of the mounting piece in the prior art, the bending phenomenon of the frame body caused by shrinkage can be avoided while the sealing effect is ensured, and the product quality is improved. The frame body and the encapsulation layer in the present application are both obtained by injection molding, therefore, only the injection molding machine is needed to realize production, no additional equipment investment and labor cost are needed, and thus the production cost is effectively reduced. The encapsulation layer of the present application can be obtained by setting a unified mold, compared with laser welding, the processing time can be effectively shortened, the production efficiency is improved, and the consistency of the electrode frame structure can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor.

[0031] Figure 1 It is a perspective view of the electrode frame structure of the liquid flow battery of embodiment 1 of the present application.

[0032] Figure 2 It is an exploded view of Figure 1 .

[0033] Figure 3 It is a top view of the electrode frame structure of the liquid flow battery of embodiment 1.

[0034] Figure 4 It is a sectional view of the position A-A in Figure 3 .

[0035] Figure 5 It is an exploded view of the electrode frame structure of the liquid flow battery of embodiment 2 of the present application.

[0036] Figure 6 Figure 1 is a top view of a bipolar plate according to an embodiment of the present application.

[0037] Explanation of reference numerals in the drawings: 1 - frame; 11 - through hole; 12 - placement groove; 2 - bipolar plate; 3 - encapsulation layer; 4 - fixing hole; 5 - ion exchange membrane. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Embodiment 1

[0039] Please refer to Figures 1 to 4 An electrode frame structure of a flow battery includes a frame 1, a bipolar plate 2 and an encapsulation layer 3. The frame 1 includes a placement groove 12, and the frame 1 is provided with a through hole 11 along the thickness direction, and the placement groove 12 is arranged around the through hole 11; the bipolar plate 2 includes opposite first and second faces, and the bipolar plate 2 is installed in the placement groove 12, the first face of the bipolar plate 2 is sealingly connected to the groove bottom surface of the placement groove 12, and a plurality of fixing holes 4 are arranged at the overlapping part of the edge of the bipolar plate 2 and the groove bottom surface of the placement groove 12; the encapsulation layer 3 is arranged at the edge position of the second face of the bipolar plate 2, the outer peripheral side of the encapsulation layer 3 is bonded to the inner side wall of the placement groove 12, and a part of the encapsulation layer 3 extends into the fixing hole 4 and fills the fixing hole 4.

[0040] As Figure 2 shown in the direction, one face of the bipolar plate 2 close to the placement groove 12 is the first face, and the face away from the placement groove 12 is the second face. After injection molding of the encapsulation layer 3, the first face of the bipolar plate 2 is tightly combined with the groove bottom surface of the placement groove 12, the encapsulation layer 3 is arranged at the edge position of the second face of the bipolar plate 2 and is bonded to the inner side wall of the placement groove 12, so that the bipolar plate 2 is sealed with the frame 1, the sealing between the bipolar plate 2 and the frame 1 is ensured, and liquid leakage during use is avoided. The frame 1 and the encapsulation layer 3 are obtained by injection molding in sequence.

[0041] Specifically, in the manufacturing of the electrode frame structure of the present application, the frame 1 is obtained by injection molding through a mold first, then the bipolar plate 2 is placed in the placement groove 12, and then the frame 1 is placed in an encapsulation mold to form the encapsulation layer 3 by injection molding, so as to obtain the final product.

[0042] Preferably, the material of the frame 1 is PP (polypropylene), the material of the encapsulation layer is also PP, and the material of the bipolar plate 2 is graphene.

[0043] It should be noted that, since the material of the frame body 1 is PP, its thermal expansion and contraction coefficient is large, and the material of the bipolar plate 2 is graphene, its thermal expansion and contraction coefficient is small, therefore, when connecting the bipolar plate 2 and the frame body 1 by laser welding connection, the temperature change during welding will cause the frame body 1 to deform at the welding position, and after cooling, due to the difference in shrinkage rate between the frame body 1 and the bipolar plate 2, a gap is easily formed at the welding position, and even the phenomenon of falling off may occur, which seriously affects the sealing performance, and in the use process, liquid leakage phenomenon is easily occurred, which affects the normal use of the flow battery, and the reliability is low. The frame body 1 is sealed by the encapsulating layer 3, since the encapsulating layer 3 and the frame body 1 are both formed by injection molding, and the materials of the two are the same, the deformation caused by temperature change and shrinkage difference can be avoided, and the sealing performance between the frame body 1 and the bipolar plate 2 can be effectively ensured. In addition, the part of the bipolar plate 2 edge position overlapping with the placement groove 12 is provided with a plurality of fixing holes 4, and when the encapsulating layer 3 is injection molded, the plastic will enter the fixing holes 4 and fill the fixing holes 4, thereby forming a plurality of columnar fixing structures, which can strengthen the stability of the encapsulating layer 3, so that the encapsulating layer 3 is not easy to loosen or fall off even under the influence of external force, and the sealing effect is ensured, and the reliability is improved. In addition, since the frame body 1 and the encapsulating layer 3 are both made of PP material, when the encapsulating layer 3 is injection molded, the encapsulating layer 3 can be thermally fused and bonded with the side wall of the placement groove 12, which greatly strengthens the sealing performance, and the part of the encapsulating layer 3 extending into the fixing hole can be thermally fused and bonded with the surface of the groove bottom of the placement groove 12, thereby forming a stable connection, and the sealing reliability is further improved.

[0044] In addition, since laser welding needs to be performed by a special laser welding device, it is necessary to additionally purchase a laser welding device, and the staff needs to be specially trained for operation, which is high in cost. The encapsulating layer 3 in the present application is injection molded, and the frame body 1 is also injection molded, so that only an injection molding machine is needed to realize production, and no additional equipment investment is needed, which can effectively reduce the production cost. In addition, since the encapsulating layer 3 is obtained by injection molding, a unified mold can be set to process, which can ensure the consistency of each electrode frame structure compared with laser welding.

[0045] It is worth mentioning that some electrode frames in the prior art are obtained by directly injection molding the periphery of the bipolar plate 2, and after injection molding is completed, the bipolar plate 2 is embedded in the center of the electrode frame, and the electrode frame is made and assembled by one-time injection molding. However, since the volume of plastic will shrink during injection molding and cooling, the bipolar plate 2 in the center of the injection molded electrode frame will be strongly pulled during shrinkage, but the bipolar plate 2 will resist deformation, so that the electrode frame will be bent to a certain extent, resulting in that the final electrode frame product is bent, which affects the quality. The present application realizes sealing by separate injection molding encapsulation, compared with the integrated molding method in the above-mentioned prior art, since the volume of the encapsulating layer 3 is small, and it is only located at the edge position, the influence caused by shrinkage can be ignored, so that the bending phenomenon of the frame body 1 after cooling can be avoided.

[0046] Preferably, since the bipolar plate 2 is square, the placement groove 12 is also square to match the shape of the bipolar plate 2.

[0047] It can be understood that since the current bipolar plate 2 is usually square, the square bipolar plate 2 is taken as an example for description in the embodiment, and the specific shape can be flexibly adjusted according to actual needs.

[0048] In the embodiment, to ensure the stability of the adhesion of the encapsulating layer 3, the area of the fixing hole 4 accounts for 10-25% of the area of the overlapping part of the edge of the bipolar plate 2 and the bottom surface of the placement groove 12.

[0049] In the embodiment, to ensure the rationality of the stacking structure of the flow battery energy storage system, the thickness of the frame 1 is controlled in the range of 2.0-5.0 mm.

[0050] It should be noted that the frame 1 structure in the embodiment is only used for demonstration, and the liquid passing structures such as the flow channel and the liquid passing hole provided thereon are not shown in the figure. Embodiment 2

[0051] Please refer to Figure 5 , the structure and principle of the embodiment are basically the same as those of Embodiment 1, and the difference lies in that the placement groove 12 in the embodiment is used for installing the ion membrane 5, wherein the size of the ion membrane 5 is smaller than the outer diameter size of the placement groove 12, and a part of the encapsulating layer 3 extends into the placement groove 12 and is adhered to the side wall and the bottom surface of the placement groove 12, so as to seal and press the ion membrane 5 in the placement groove 12, thereby ensuring the fixing effect of the ion membrane 5 and ensuring the sealing effect.

[0052] It should be noted that a plurality of fixing holes 4 are also provided at the edge position of the ion membrane 5. Since the ion membrane 5 is relatively thin, and the encapsulating layer 3 is in adhesive contact with the bottom surface and the side wall of the placement groove 12, the stability of the adhesion of the encapsulating layer 3 can be ensured. Therefore, the main role of the fixing hole 4 provided in the embodiment is to strengthen the stability of the installation of the ion membrane 5. The part of the encapsulating layer 3 extending into the fixing hole 4 can be adhered to the bottom surface of the placement groove 12, so as to fix the ion membrane 5, thereby avoiding the ion membrane 5 from being wrinkled or deviated due to the impact force, improving the reliability in use and the stability of the overall structure.

[0053] Preferably, the thickness of the ion membrane 5 is 0.04-0.05 mm.

[0054] It can be understood that the fixing hole 4 can be arranged in one row as shown in the attached Figures 1 to 5 , and in other embodiments, a plurality of fixing holes 4 can also be arranged. When a plurality of fixing holes 4 are arranged, the fixing holes 4 can be distributed in an array or staggered, and the specific arrangement can be flexibly adjusted according to actual needs. Embodiment 3

[0055] Please refer to Figure 6 The structure and principle of this embodiment are basically the same as those of Embodiment 1, except that the fixing holes 4 of this embodiment are triangularly staggered on the edge of the bipolar plate 2, and the triangular distribution is more stable, which can make the adhesion of the encapsulation layer 3 more stable.

[0056] Similarly, the fixing holes 4 on the ion exchange membrane 5 can also be triangularly staggered. Embodiment 4

[0057] This embodiment provides a forming process of an electrode frame structure, which is used to obtain the electrode frame structure in Embodiment 1, Embodiment 2 and Embodiment 3, and includes the following steps: S1: obtaining a frame body 1 with through holes 11 and placing grooves 12 by injection molding through a first mold; S2: processing fixing holes 4 at the edge position of the mounting piece; S3: placing the mounting piece into the placing groove 12, and making the first surface of the mounting piece face the groove bottom surface of the placing groove 12; S4: placing the frame body 1 with the mounting piece into a second mold, and forming an encapsulation layer 3 on the second surface edge position of the mounting piece by injection molding.

[0058] It should be noted that the mounting piece is the bipolar plate 2 or the ion exchange membrane 5.

[0059] Among them, the first mold and the second mold are respectively used for injection molding of the frame body 1 and injection molding of the encapsulation layer 3, and the specific structure is designed according to actual needs. In S4, when the encapsulation layer 3 is injection molded, the material can automatically enter and fill the fixing holes 4, and can be integrally heat-fused and bonded with the groove bottom surface of the placing groove 12, so as to effectively strengthen the connection stability of the encapsulation layer 3 and prevent it from falling off. At the same time, the encapsulation layer 3 is also heat-fused and bonded with the side wall of the placing groove 12, effectively ensuring the sealing property and preventing liquid leakage.

[0060] Preferably, in S4, in order to ensure the forming effect and quality, the temperature of the barrel in injection encapsulation is 180-250℃, and the injection pressure is 60-90MPa.

[0061] Preferably, in S4, in order to ensure the forming quality of the encapsulation layer 3, the holding pressure time in injection encapsulation is 20S, and the holding pressure is 20-40MPa.

[0062] In the embodiment, the frame body 1 and the encapsulation layer 3 are both formed by polypropylene (PP) injection molding. Since the frame body 1 and the encapsulation layer 3 are made of the same material, the encapsulation layer 3 can be bonded with the frame body 1 by heat melting when the encapsulation layer 3 is injection molded, so that the sealing performance is improved, and the connection is stable, thereby preventing the encapsulation layer 3 from falling off in the future, and greatly improving the sealing performance and reliability of the electrode frame structure.

[0063] Finally, it should be noted that the terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitation, the element defined by the statement "including a" does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0064] In addition, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0065] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The various embodiments can be combined as needed, and the same and similar parts refer to each other.

[0066] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electrode frame structure for a flow battery, characterized in that, include: A frame, including a placement groove, wherein the frame has a through hole extending along the thickness direction, and the placement groove is arranged around the through hole; The mounting component is installed in the placement groove and includes a first surface and a second surface facing each other. The first surface of the mounting component is sealed to the bottom surface of the placement groove. The overlapping part of the edge of the mounting component and the bottom surface of the placement groove is provided with a plurality of fixing holes at intervals. An adhesive layer is provided at the edge of the second surface of the mounting component. The outer peripheral side of the adhesive layer is bonded to the inner sidewall of the placement groove. A portion of the adhesive layer extends into the fixing hole and fills the fixing hole. The frame and the overlay layer are independently injection molded, non-integrated structures.

2. The electrode frame structure of the flow battery according to claim 1, characterized in that, The mounting component is a bipolar plate or an ion exchange membrane.

3. The electrode frame structure of the flow battery according to claim 1, characterized in that, The portion of the adhesive layer extending into the fixing hole is bonded to the bottom surface of the placement groove.

4. The electrode frame structure of the flow battery according to claim 1, characterized in that, The fixing holes are arranged in a triangular pattern along the edge of the mounting component.

5. The electrode frame structure of the flow battery according to claim 1, characterized in that, The area of ​​the fixing hole accounts for 10-25% of the area of ​​the overlapping portion between the edge of the mounting component and the bottom surface of the placement groove.

6. The electrode frame structure of the flow battery according to claim 1, characterized in that, The thickness of the frame is 2.0-5.0 mm.

7. A molding process for an electrode frame structure, applied to the electrode frame structure according to any one of claims 1-6, characterized in that, Includes the following steps: S1: A frame with through holes and placement slots is obtained by injection molding using the first mold; S2: Machine fixing holes at the edge of the mounting part; S3: Place the mounting component into the placement slot, with the first surface of the mounting component facing the bottom surface of the placement slot; S4: Place the frame with the mounting parts into the second mold, and form a coating layer at the edge of the second side of the mounting parts by injection molding.

8. The molding process according to claim 7, characterized in that, In S4, the barrel temperature during injection molding is 180-250℃, and the injection pressure is 60-90MPa.

9. The molding process according to claim 7, characterized in that, In S4, the holding time in injection molding is 20 seconds, and the holding pressure is 20-40 MPa.

10. The molding process according to claim 7, characterized in that, Both the frame and the adhesive layer are made of polypropylene.

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