A semi-flexible bonding plate and a manufacturing method thereof

Abstract

The application discloses a kind of semi-flexible combination board and its manufacturing method, it is related to circuit board processing technical field, including substrate, the substrate is by semi-flexible board, first prepreg and laminated copper foil compression, and etching removal copper foil after composition one compression structure;The substrate both sides are symmetrically provided with superimposed board group;The application is when manufacturing semi-flexible combination board, first copper foil, first prepreg and semi-flexible board are etched to form one compression structure after compression, then in the surface of second rigid plate multiple blind lacing groove, and in the surface of third prepreg corresponding blind lacing groove position processing open multiple windows with blind lacing groove same shape, window size is greater than blind lacing groove for leaving overflow glue area, avoid third prepreg compression in the process will flow to semi-flexible area, cause overflow glue excessive, influence semi-flexible combination board appearance and bending performance, improve the manufacturing precision of semi-flexible combination board and overall quality.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to a semi-flexible bonding board and its manufacturing method. Background Technology

[0002] Semi-flexible composite plates are typically made by laminating two rigid plates with a flexible material, and then using a milling cutter to perform controlled-depth milling on the semi-flexible area (e.g., ...). Figure 1 This process continues until the thickness of the semi-flexible region reaches a bendable level. However, after prolonged processing, the wear of the milling cutter can easily lead to uneven thickness of the semi-flexible region, affecting its bending performance. Furthermore, the processing of rigid plates generates a significant amount of powder. The metal layer on the surface of the rigid plate will cause the generated powder to contain metal powder. If the metal powder cannot be cleaned in time, it will be dispersed into the air with the airflow during processing, potentially causing harm to human health. Additionally, metal powder falling onto the surface of the circuit board during processing can cause short circuits and damage to the circuit board. Summary of the Invention

[0003] The purpose of this invention is to provide a semi-flexible bonding plate and its manufacturing method to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semi-flexible bonding board, comprising a substrate, wherein the substrate is a one-time bonding structure consisting of a semi-flexible board, a first prepreg, and copper foil laminated thereon, and the copper foil is removed by etching; symmetrically arranged laminated board assemblies are provided on both sides of the substrate; each laminated board assembly is composed of a first rigid board, a second prepreg, a second rigid board, and a third prepreg, which are sequentially laminated from top to bottom and then subjected to a second bonding; the substrate portion between the two laminated board assemblies is a semi-flexible region.

[0005] A method for manufacturing a semi-flexible bonding plate, the specific steps of which are as follows:

[0006] Step 1: First, the semi-flexible board, copper foil and the first semi-cured sheet need to be stacked and pressed together in sequence, and the copper foil needs to be etched away to form a one-time pressing structure;

[0007] Step 2: Then, a blind groove is machined into the surface of the second rigid plate, and a window with the same shape as the blind groove is machined into the surface of the third prepreg. The size of the window in the plane is larger than that of the blind groove to allow space for excess adhesive.

[0008] Step 3: Then, stack the first rigid plate, the second semi-cured sheet, the second rigid plate, the third semi-cured sheet, and the first pressing structure in a top-down order, and then perform a second pressing to form a bonded plate;

[0009] Step 4: The bonding plate then needs to be moved to the surface of the processing equipment to create a semi-flexible area;

[0010] Step 5: Finally, clean and cut the processed bonding plate;

[0011] The processing equipment in step four includes a processing table, a movable arm fixedly mounted on the surface of the processing table, a milling cutter mounted at the end of the movable arm, a positioning mechanism on the surface of the processing table for positioning the bonding plate, a limiting mechanism on the surface of the positioning mechanism for limiting the bonding plate when it is completely moved into the positioning mechanism, a recycling mechanism on the surface of the processing table for recycling the powder generated during processing by airflow suction, and a protective mechanism on the surface of the recycling mechanism for protecting the processing position.

[0012] As a further embodiment of the present invention, the positioning mechanism includes two L-shaped positioning plates, both of which are fixedly connected to the surface of the processing table. The connecting plate is located inside the two positioning plates, and the sidewall of the connecting plate is in contact with the positioning plates. The inner edge of the positioning plate is a bevel.

[0013] As a further embodiment of the present invention, the limiting mechanism includes four positioning posts, which are respectively disposed at the four corners of the surface of the connecting plate. The positioning posts penetrate the connecting plate, and the surface of the positioning plate has a slot through which the positioning posts are located. An L-shaped limiting rod is elastically slidably connected to the surface of the positioning plate. One end of the limiting rod is above one end of the slot, and the other end of the limiting rod extends to one side of the other end of the slot, with the end of the limiting rod being inclined. A blocking rod is elastically slidably connected to the surface of the positioning plate. The blocking rod is above the slot and is located near the inclined end of the limiting rod, with the end of the blocking rod also being inclined. A limiting groove is formed on the surface of the blocking rod, and the limiting rod is used to move into the limiting groove to limit the blocking rod. A pulling rod is fixedly connected to the surface of the blocking rod, and the pulling rod extends to the outside of the positioning plate.

[0014] As a further embodiment of the present invention, the recycling mechanism includes an L-shaped elastically extendable recycling tube, which is installed on the surface of the processing table. A recycling port is provided on the surface of the processing table corresponding to the position of the recycling tube. The recycling port is connected to an external fan. The bottom of the recycling tube is located on one side of the positioning plate, and the upper end of the recycling tube extends above the positioning plate. Multiple processing ports are provided on the surface of the recycling tube, which penetrate the recycling tube. The inside of the recycling tube communicates with the processing ports. A negative pressure is formed inside the processing ports under the action of the external fan. A baffle plate is fixedly connected to the inside of the processing port. The baffle plate is used to block the upper part of the inside of the recycling tube at the processing port position.

[0015] As a further embodiment of the present invention, the protective mechanism includes a fixing plate, which is fixedly connected to the inner wall surface of the processing port and blocks half of the processing port. Two retractable protective plates are fixedly connected to the inner wall side of the processing port, and the two protective plates and the fixing plate cover the processing port. The corners of the two protective plates that are close to each other and away from the fixing plate are cut off to form a V-shaped inlet. A U-shaped enclosure is fixedly connected to the bottom of the recycling pipe. Two swing plates are elastically hinged to the inner surface of the enclosure, and the two swing plates block one side of the opening of the enclosure. The enclosure and the two swing plates surround the position of the recycling pipe corresponding to the processing port.

[0016] As a further embodiment of the present invention, a first sliding plate is elastically slidably connected to the surface of the enclosure, and a first cleaning brush is fixedly connected to the bottom of the first sliding plate.

[0017] As a further embodiment of the present invention, a grinding plate is elastically slidably connected to the inner surface of the enclosure plate. The grinding plate is located above the semi-flexible region. During the processing, the grinding plate is used to grind the sidewall of the semi-flexible region using its side edge. The two sides of the bottom of the grinding plate are inclined surfaces. The upper end of the grinding plate extends to both sides, and there is an inclined surface between the extended part of the grinding plate and the grinding plate. A rolling column is rotatably connected to the bottom of the grinding plate, and the rolling column is in contact with the surface of the first rigid plate.

[0018] As a further embodiment of the present invention, a second sliding plate is elastically slidably connected to the surface of the enclosure panel. The second sliding plate and the first sliding plate cover the side of the enclosure panel. The second sliding plate is positioned above the semi-flexible area. A second cleaning brush is fixedly connected to the bottom of the second sliding plate. A storage box is fixedly connected to the surface of the enclosure panel. The storage box stores a chemical agent for removing metal powder. A retractable connecting pipe is connected to the bottom of the storage box. The bottom of the connecting pipe is connected to the second sliding plate. The second sliding plate seals the connecting pipe. Multiple drainage grooves are formed on the surface of the second sliding plate. A fixed end of the connecting pipe is internally connected to... A throttling plate has a first outlet on its surface. A sealing plate is slidably connected inside the fixed end of the connecting pipe. Two second outlets are provided on the surface of the sealing plate, which are staggered from the first outlet. An extension plate is fixedly connected to the side of the sealing plate. The extension plate passes through the connecting pipe and the surrounding plate and then bends downward to the position of the grinding plate. An opening is provided on the surface of the connecting pipe and the surrounding plate corresponding to the position of the extension plate. The extension plate is elastically connected to the inner wall of the opening. A retractable sealing plate is fixedly connected inside the opening. A toggle block is fixedly connected to the surface of the grinding plate. The toggle block is used to move the extension plate.

[0019] As a further embodiment of the present invention, a swing rod is hinged to the inner surface of the enclosure, the middle position of the swing rod is hinged to the enclosure, the side of the swing rod near the extension plate is below the extension plate, an L-shaped sliding rod is elastically slidably connected to the inner side of the enclosure, the upper end of the sliding rod is above the end of the swing rod away from the extension plate, and a rolling wheel is rotatably connected to the bottom of the sliding rod, the rolling wheel is outside the semi-flexible area.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. In the manufacturing of the semi-flexible bonded plate, the present invention first presses copper foil, a first prepreg, and a semi-flexible plate together and then etches them to form a one-time pressing structure. Then, multiple blind grooves are made on the surface of the second rigid plate, and multiple windows of the same shape as the blind grooves are machined on the surface of the third prepreg corresponding to the blind grooves. The window size is larger than the blind grooves to leave an overflow area, preventing the third prepreg from flowing into the semi-flexible area during the pressing process, causing excessive overflow, affecting the appearance and bending performance of the semi-flexible bonded plate, improving the manufacturing precision and overall quality of the semi-flexible bonded plate. Furthermore, the invention uses a surrounding plate, a swing plate, a fixing plate, and a protective plate to block the debris and metal powder generated during processing, reducing the range of metal powder flying and preventing the powder from being scattered into the air and causing harm to the human body. Moreover, the debris and metal powder blocked in the processing port are extracted and removed through a recovery pipe to ensure the cleanliness of the processing position on the bonded plate surface.

[0022] 2. In the process of processing the bonding plate, the first sliding plate and the first cleaning brush on the outer side of the enclosure can seal the gap between the bottom of the enclosure and the bonding plate, preventing the powder from being scattered out of the enclosure through the bottom of the enclosure during processing, thereby affecting the circuit of the subsequent circuit board. When the recovery tube retracts and moves the enclosure, the first cleaning brush will move together, and the first cleaning brush can sweep away the powder attached to the surface of the bonding plate.

[0023] 3. In the process of processing the bonding plate, the grinding plate moves together with the recovery pipe, the rolling column moves along the surface of the bonding plate, and then the milling cutter gradually processes the semi-flexible area on the surface of the bonding plate. As the processing depth of the semi-flexible area gradually increases, the grinding plate moves into the semi-flexible area. The side of the grinding plate grinds and cleans both sides of the semi-flexible area, thereby cleaning the powder adhering to the side wall surface of the semi-flexible area after processing, which facilitates the recovery pipe to collect the powder and ensures the cleanliness of the processing position. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the semi-flexible composite plate.

[0025] Figure 2This is a schematic diagram of the exploded structure of a semi-flexible bonded plate when the semi-flexible area is not processed.

[0026] Figure 3 This is a schematic diagram of the structure of a semi-flexible bonded plate after it has been cut open without the semi-flexible area being processed (the dotted line in the figure represents the processing range of the semi-flexible area).

[0027] Figure 4 for Figure 3 Schematic diagram of the structure at point A in the middle;

[0028] Figure 5 This is a flowchart of the method of the present invention;

[0029] Figure 6 This is a schematic diagram of the overall structure of the present invention;

[0030] Figure 7 for Figure 6 Schematic diagram of the structure at point B;

[0031] Figure 8 This is a schematic diagram of the overall cross-section of the present invention;

[0032] Figure 9 for Figure 8 Schematic diagram of the structure at point C;

[0033] Figure 10 This is a schematic diagram showing the connection relationship between the processing table, the positioning plate, and the connecting plate in this invention;

[0034] Figure 11 for Figure 10 Schematic diagram of the structure at point D;

[0035] Figure 12 for Figure 10 Schematic diagram of the structure at point E in the middle;

[0036] Figure 13 This is a schematic diagram of the positioning plate in this invention;

[0037] Figure 14 This is an exploded structural diagram of the bonding plate in this invention;

[0038] Figure 15 This is a schematic diagram showing the positional relationship between the recycling pipe and the surrounding plate in this invention;

[0039] Figure 16 for Figure 15 Schematic diagram of the structure at point F;

[0040] Figure 17 This is a schematic diagram of the structure of the enclosure and storage box after being cut open in this invention;

[0041] Figure 18 for Figure 17 Schematic diagram of the structure at point G.

[0042] In the attached diagram: 1-First rigid plate, 2-Second rigid plate, 3-First prepreg, 4-Second prepreg, 5-Third prepreg, 6-Copper foil, 7-Semi-flexible plate, 8-One-time pressing structure, 9-Blind router slot, 10-Window, 11-Binding plate, 12-Semi-flexible area, 13-Processing table, 14-Moving arm, 15-Router, 16-Positioning plate, 17-Positioning post, 18-Slot, 19-Limiting rod, 20-Blocking rod, 21-Limiting slot, 22-Pull rod, 23-Recovery tube, 24-Recovery port, 25-Processing port, 26- 27-Blocking plate, 28-Fixed plate, 29-Protective plate, 30-Inlet, 31-Enclosure plate, 32-Swing plate, 33-First sliding plate, 34-First cleaning brush, 35-Grinding plate, 36-Rolling column, 37-Second sliding plate, 38-Second cleaning brush, 39-Storage box, 40-Connecting pipe, 41-Drainage channel, 42-Throttling plate, 43-Sealing plate, 44-Second outlet, 45-Extension plate, 46-Passway, 47-Sealing plate, 48-Toggle block, 49-Swing rod, 50-Sliding rod, 51-Rolling wheel. Detailed Implementation

[0043] Please see Figures 1-18 The present invention provides a technical solution: a semi-flexible bonding board, including a substrate, the substrate being a one-time pressing structure 8 formed by pressing a semi-flexible board 7, a first prepreg 3 and a copper foil 6 stacked thereon, and etching away the copper foil 6; symmetrically arranged on both sides of the substrate are stacked board groups; the stacked board groups are formed by stacking a first rigid board 1, a second prepreg 4, a second rigid board 2 and a third prepreg 5 from top to bottom and then performing a second pressing; the substrate portion between the two stacked board groups is a semi-flexible region 12;

[0044] A method for manufacturing a semi-flexible bonding plate, the specific steps of which are as follows:

[0045] Step 1: First, the semi-flexible board 7, copper foil 6 and the first semi-cured sheet 3 need to be stacked and pressed together in sequence, and the copper foil 6 needs to be etched away to form a one-time pressing structure 8;

[0046] Step 2: Then, a blind groove 9 is machined on the surface of the second rigid plate 2, and a window 10 with the same shape as the blind groove 9 is machined on the surface of the third semi-cured sheet 5. The size of the window 10 on the plane is larger than that of the blind groove 9 to reserve space for excess glue.

[0047] Step 3: Then, the first rigid plate 1, the second semi-cured sheet 4, the second rigid plate 2, the third semi-cured sheet 5 and the first pressing structure 8 are stacked in the order from top to bottom, and then a second pressing is performed to form the bonding plate 11.

[0048] Step 4: Next, the bonding plate 11 needs to be moved to the surface of the processing equipment to process the semi-flexible area 12;

[0049] Step 5: Finally, clean and cut the processed bonding plate 11;

[0050] In step four, the processing equipment includes a processing table 13, a movable arm 14 fixedly mounted on the surface of the processing table 13, a screed 15 mounted at the end of the movable arm 14, a positioning mechanism on the surface of the processing table 13 for positioning the connecting plate 11, a limiting mechanism on the surface of the positioning mechanism for limiting the connecting plate 11 when it is completely moved into the positioning mechanism, a recycling mechanism on the surface of the processing table 13 for recycling the powder generated during processing using airflow, and a protective mechanism on the surface of the recycling mechanism for protecting the processing position.

[0051] The positioning mechanism includes two L-shaped positioning plates 16, both of which are fixedly connected to the surface of the processing table 13. A connecting plate 11 is located inside the two positioning plates 16, and the side wall of the connecting plate 11 is in contact with the positioning plates 16. The inner edge of the positioning plate 16 is a bevel.

[0052] The limiting mechanism includes four positioning posts 17, which are respectively set at the four corners of the surface of the connecting plate 11. The positioning posts 17 penetrate the connecting plate 11. The surface of the positioning plate 16 has a slot 18, which penetrates the positioning plate 16. The positioning posts 17 are located in the slot 18. An L-shaped limiting rod 19 is elastically slidably connected to the surface of the positioning plate 16. One end of the limiting rod 19 is above one end of the slot 18, and the other end of the limiting rod 19 extends to one side of the other end of the slot 18. The end of the limiting rod 19 is inclined. A blocking rod 20 is elastically slidably connected to the surface of the positioning plate 16. The blocking rod 20 is above the slot 18 and is located near the end of the limiting rod 19, which is inclined. The end of the blocking rod 20 is inclined. A limiting groove 21 is opened on the surface of the blocking rod 20. The limiting rod 19 is used to move into the limiting groove 21 to limit the blocking rod 20. A pulling rod 22 is fixedly connected to the surface of the blocking rod 20. The pulling rod 22 extends to the outside of the positioning plate 16.

[0053] The recycling mechanism includes an L-shaped elastically extendable recycling tube 23, which is installed on the surface of the processing table 13. A recycling port 24 is opened on the surface of the processing table 13 corresponding to the position of the recycling tube 23. The recycling port 24 is connected to an external fan. The bottom of the recycling tube 23 is located on one side of the positioning plate 16, and the upper end of the recycling tube 23 extends above the positioning plate 16. Multiple processing ports 25 are opened on the surface of the recycling tube 23. The processing ports 25 penetrate the recycling tube 23 and are connected to the inside of the recycling tube 23. A negative pressure is formed inside the processing port 25 under the action of the external fan. A baffle plate 26 is fixedly connected to the inside of the processing port 25. The baffle plate 26 is used to block the upper part of the inside of the recycling tube 23 at the processing port 25.

[0054] The protective mechanism includes a fixed plate 27, which is fixedly connected to the inner wall surface of the processing port 25. The fixed plate 27 blocks half of the processing port 25. Two retractable protective plates 28 are fixedly connected to the inner wall side of the processing port 25. The two protective plates 28 and the fixed plate 27 cover the processing port 25. The corners of the two protective plates 28 that are close to each other and away from the fixed plate 27 are cut off to form a V-shaped inlet 29. A U-shaped enclosure 30 is fixedly connected to the bottom of the recovery pipe 23. Two swing plates 31 are elastically hinged to the inner surface of the enclosure 30. The two swing plates 31 block one side of the opening of the enclosure 30. The enclosure 30 and the two swing plates 31 surround the position of the recovery pipe 23 corresponding to the processing port 25.

[0055] In manufacturing the semi-flexible bonded board, copper foil 6, the first prepreg 3, and the semi-flexible board 7 are first stacked and pressed together. Then, copper foil 6 is etched away to form a single-layer pressing structure 8. Next, multiple blind grooves 9 are formed on the surface of the second rigid board 2 at the processing locations. Multiple windows 10 with the same shape as the blind grooves 9 are machined on the surface of the third prepreg 5 at the corresponding positions. The windows 10 are larger than the blind grooves 9 to allow for excess adhesive, preventing the resin from flowing into the semi-flexible area 12 during pressing and causing excessive adhesive overflow, which would affect the appearance and bending performance of the semi-flexible bonded board. Furthermore, the third prepreg is a low-flow prepreg to reduce the resin flowability of the third prepreg 5 during pressing. Then, the third... A rigid plate 1, a second semi-cured sheet 4, a second rigid plate 2, a third semi-cured sheet 5, and a primary pressing structure 8 are stacked sequentially from top to bottom and then pressed a second time to obtain a bonding plate 11. Holes are then drilled at the four corners of the bonding plate 11, and positioning posts 17 are installed. The bonding plate 11 is then moved to the surface of the processing table 13 and pushed in from the bottom of the positioning plate 16. Guided by the inclined inner surfaces of the positioning plates 16, the two sides of the bonding plate 11 move between the two positioning plates 16. Before the bonding plate 11 is fully in place, the blocking rod 20 is held in the limiting groove 21 by the limiting rod 19. The positioning posts 17 move into the groove 18. Then, when the bonding plate 11 is fully moved into the positioning plate 16, the positioning posts 17 move to the position of the limiting rod 19 and push against it. As the limiting rod 19 moves a certain distance, its end moves out of the limiting groove 21, releasing the limiting of the blocking rod 20. The blocking rod 20 then moves above the groove 18 to block the positioning post 17, thus ensuring that the positioning post 17 and the connecting plate 11 are blocked and stabilized during processing. Subsequently, the milling cutter 15 moves to the side of the recovery pipe 23 under the action of the moving arm 14. Then, the milling cutter 15 moves into the processing port 25, pushing the swing plate 31 to rotate and moving past the swing plate 31 to the inside of the processing port 25. The two protective plates 28 are pushed to the sides by the milling cutter 15 as it passes through the inlet 29. The milling cutter 15 moves into the processing port 25. During the processing of the connecting plate 11 by the milling cutter 15, the generated debris and... Metal powder is blocked by the enclosure plate 30, the swing plate 31, the fixed plate 27, and the protective plate 28, reducing the range of metal powder flight and preventing powder from being scattered into the air and causing injury to people during processing. An external fan will draw air from the processing port 25 through the recovery pipe 23 and the recovery port 24, thereby extracting the debris and metal powder generated during processing inside the processing port 25, ensuring the cleanliness of the processing position of the bonding plate 11, and preventing metal powder from falling onto the surface of the bonding plate 11 during processing and not being removed in time, which would affect the conductivity of the metal circuits on the surface of the subsequent circuit board and reduce product quality. The blocking plate 26 can block the upper part of the recovery pipe 23 at the processing port 25, so that the powder scattered into other processing ports 25 can be blocked.To prevent powder entering the recovery tube 23 from flying out from other processing ports 25, the fixing plate 27 moves together with the recovery tube 23 when the milling cutter 15 moves. The recovery tube 23 retracts, and the fixing plate 27 ensures that the milling cutter 15 is always positioned in the middle of the processing port 25, guaranteeing the milling effect and preventing the milling cutter 15 from moving too close to the surrounding plate 30, which would affect its processing. Furthermore, through pre-processing the blind milling groove 9 and precise control of the opening size of the third semi-cured sheet 5, the problem of excess glue or missing glue voids in the semi-flexible area 12 is effectively avoided, further improving the manufacturing precision and overall quality of the semi-flexible bonding plate. After processing, the pulling rod 22 is pulled outwards, and the blocking rod 20 moves outwards to release the obstruction of the positioning post 17. The limiting rod 19 then moves back into the limiting groove 21 to limit the blocking rod 20. Finally, the processed bonding plate 11 needs to be cleaned and cut to obtain individual semi-flexible bonding plates.

[0056] During the processing of the connecting plate 11, a gap is left between the bottom of the surrounding plate 30 and the connecting plate 11. The powder generated during processing will drift out of the surrounding plate 30 from the bottom of the surrounding plate 30. As a further embodiment of the present invention, a first sliding plate 32 is elastically slidably connected to the surface of the surrounding plate 30, and a first cleaning brush 33 is fixedly connected to the bottom of the first sliding plate 32.

[0057] During the processing of the bonding plate 11, the first sliding plate 32 and the first cleaning brush 33 on the outer side of the enclosure 30 can seal the gap between the bottom of the enclosure 30 and the bonding plate 11, preventing the powder from being scattered out of the enclosure 30 through the bottom of the enclosure 30 and affecting the circuit of the subsequent circuit board. When the recovery tube 23 retracts and moves the enclosure 30, the first cleaning brush 33 will move together, and the first cleaning brush 33 can sweep away the powder attached to the surface of the bonding plate 11.

[0058] During the processing of the connecting plate 11, a lot of powder will be attached to the two sides of the semi-flexible area 12 after processing and cannot be recovered by the recycling pipe 23. As a further solution of the present invention, a grinding plate 34 is elastically slidably connected to the inner side surface of the surrounding plate 30. The grinding plate 34 is located above the semi-flexible area 12. During the processing, the grinding plate 34 is used to grind the side wall of the semi-flexible area 12 using its side edge. The two sides of the bottom of the grinding plate 34 are inclined surfaces. The upper end of the grinding plate 34 extends to both sides and the extension part of the grinding plate 34 is inclined with the grinding plate 34. A rolling column 35 is rotatably connected to the bottom of the grinding plate 34. The rolling column 35 is in contact with the surface of the first rigid plate 1.

[0059] During the processing of the bonding plate 11, the grinding plate 34 moves together with the recovery pipe 23, and the rolling column 35 moves along the surface of the bonding plate 11. Then, as the milling cutter 15 gradually processes the semi-flexible area 12 on the surface of the bonding plate 11, the grinding plate 34 moves into the semi-flexible area 12 as the processing depth of the semi-flexible area 12 gradually increases. The side of the grinding plate 34 grinds and cleans both sides of the semi-flexible area 12, thereby cleaning the powder adhering to the side wall surface of the semi-flexible area 12 after processing, so as to facilitate the recovery pipe 23 to recover the powder and ensure the cleanliness of the processing position.

[0060] During the processing of the connecting plate 11, the metal powder remaining in the gaps of the semi-flexible area 12 after processing is difficult to be completely removed by the first cleaning brush 33. As a further solution of the present invention, a second sliding plate 36 is elastically slidably connected to the surface of the surrounding plate 30. The second sliding plate 36 and the first sliding plate 32 cover the side of the surrounding plate 30. The second sliding plate 36 is located above the semi-flexible area 12. A second cleaning brush 37 is fixedly connected to the bottom of the second sliding plate 36. A storage box 38 is fixedly connected to the surface of the surrounding plate 30. The storage box 38 stores a chemical agent for removing metal powder. A retractable connecting pipe 39 is connected to the bottom of the storage box 38. The bottom of the connecting pipe 39 is connected to the second sliding plate 36. The second sliding plate 36 seals the connecting pipe 39. Multiple openings are formed on the surface of the second sliding plate 36. The diversion channel 40 has a throttling plate 41 fixedly connected inside the fixed end of the connecting pipe 39. The throttling plate 41 has a first outlet 42 on its surface. The fixed end of the connecting pipe 39 has a slidably connected sealing plate 43. The sealing plate 43 has two second outlets 44 on its surface. The two second outlets 44 are staggered with the first outlet 42. The sealing plate 43 has an extension plate 45 fixedly connected to its side. The extension plate 45 passes through the connecting pipe 39 and the surrounding plate 30 and then bends downward to the position of the grinding plate 34. The connecting pipe 39 and the surrounding plate 30 have a through-hole 46 corresponding to the position of the extension plate 45. The extension plate 45 is elastically connected to the inner wall of the through-hole 46. The through-hole 46 has a retractable sealing plate 47 fixedly connected inside. The grinding plate 34 has a toggle block 48 fixedly connected to its surface. The toggle block 48 is used to move the extension plate 45.

[0061] During the processing of the connecting plate 11, the rolling column 35 moves on the surface of the connecting plate 11, and the bottoms of the first cleaning brush 33 and the second cleaning brush 37 come into contact with the surface of the connecting plate 11. Then, as the milling cutter 15 gradually processes the semi-flexible area 12 on the surface of the connecting plate 11, the rolling column 35 and the grinding plate 34 gradually move downwards. The second sliding plate 36 and the cleaning brush also gradually move downwards as the semi-flexible area 12 is processed. Then, when the semi-flexible area 12 is completely processed, the grinding plate 34 drives the actuating block 48 to move to the position of the extension plate 45 and drives the extension plate 45 to move downwards a certain distance. The extension plate 45 drives the sealing plate 43 to move downwards together, and the sealing plate 43 separates from the throttling plate 41. The first outlet 42 and the second outlet 44 are exposed, and the medicine stored inside the storage tank 38 flows through the first outlet 42, the second outlet 44 and the connecting pipe 39 to the first outlet 42. On the surface of the second sliding plate 36, the sealing plate 47 can seal the opening 46 to prevent the agent from flowing out from the side of the connecting pipe 39. Then, the agent will flow along the drainage groove 40 on the surface of the second sliding plate 36 to the surface of the second cleaning brush 37. Then, the agent will be coated in the semi-flexible area 12 when the second cleaning brush 37 cleans the semi-flexible area 12. The agent will react and eliminate the residual metal powder in the semi-flexible area 12, which is conducive to the thorough removal of the residual metal powder in the semi-flexible area 12, ensuring the cleanliness of the semi-flexible area 12, and avoiding the presence of metal powder residue after the semi-flexible processing, which will affect the normal conductivity of the circuit on the circuit board surface during subsequent use. Moreover, the content of the agent can be adjusted as needed without affecting the circuit on the circuit board surface. After the semi-flexible area 12 is processed, the processed circuit board needs to be cleaned, and the agent will be removed during the cleaning process.

[0062] Before processing the connecting plate 11, if the connecting plate 11 is not placed at the work station, the grinding plate 34 will contact the processing table 13. The first water outlet 42 and the second water outlet 44 cannot be blocked, and the medicine inside the storage box 38 will flow out. As a further embodiment of the present invention, a swing rod 49 is hinged to the inner surface of the surrounding plate 30. The middle position of the swing rod 49 is hinged to the surrounding plate 30. The side of the swing rod 49 near the extension plate 45 is below the extension plate 45. An L-shaped sliding rod 50 is elastically slidably connected to the inner side of the surrounding plate 30. The upper end of the sliding rod 50 is above the end of the swing rod 49 away from the extension plate 45. A rolling wheel 51 is rotatably connected to the bottom of the sliding rod 50. The rolling wheel 51 is outside the semi-flexible area 12.

[0063] Before the connecting plate 11 is processed, when the connecting plate 11 has not moved to the work station, the rolling wheel 51 at the bottom of the sliding rod 50 will be in contact with the processing table 13 under the action of the spring force. The sliding rod 50 will cause the swing rod 49 to tilt up on the side near the extension plate 45. The extension plate 45 will be in contact with the upper end of the opening 46 under the action of the swing rod 49. The sealing plate 43 will be in contact with the throttling plate 41. The first outlet 42 and the second outlet 44 are staggered and will be blocked by the sealing plate 43 and the throttling plate 41 respectively. The medicine inside the storage tank 38 will not flow out. To reduce the waste of chemicals and prevent the spilled chemicals from corroding the processing table 13, the grinding plate 34 is lifted by the extension plate 45 and the actuating block 48. Then, when the connecting plate 11 is pushed to the inside of the positioning plate 16, the connecting plate 11 will move upward by the sliding rod 50. The upward movement of the sliding rod 50 will relieve the pressure on the end of the swing plate 31 away from the extension plate 45. The swing plate 31 will no longer support the extension plate 45. Then, when processing in the semi-flexible area 12, the grinding plate 34 and the extension plate 45 can move downward.

Claims

1. A method for manufacturing a semi-flexible bonding plate, the semi-flexible bonding plate comprising a substrate, the substrate being a one-time pressing structure (8) formed by pressing a semi-flexible plate (7), a first prepreg (3) and copper foil (6) stacked thereon together, and etching away the copper foil (6); symmetrically arranged on both sides of the substrate are stacked plate groups; the stacked plate groups are formed by stacking a first rigid plate (1), a second prepreg (4), a second rigid plate (2), and a third prepreg (5) sequentially from top to bottom and then performing a second pressing; the substrate portion between the two stacked plate groups is a semi-flexible region (12); characterized in that: The specific steps of this method are as follows: Step 1: First, the semi-flexible board (7), copper foil (6) and the first semi-cured sheet (3) need to be stacked and pressed together in sequence, and the copper foil (6) is etched away to form a one-time pressing structure (8). Step 2: Then, a blind groove (9) is machined on the surface of the second rigid plate (2), and a window (10) with the same shape as the blind groove (9) is machined on the surface of the third semi-cured sheet (5). The window (10) is larger than the blind groove (9) in the plane to reserve space for excess glue. Step 3: Then, stack the first rigid plate (1), the second semi-cured sheet (4), the second rigid plate (2), the third semi-cured sheet (5) and the first pressing structure (8) in the order from top to bottom, and then perform a second pressing to form a bonding plate (11). Step 4: Then the bonding plate (11) needs to be moved to the surface of the processing equipment to process a semi-flexible area (12). Step 5: Finally, clean the processed bonding plate (11) and cut it along both sides of the blind groove (9) so that the middle part of the bonding plate (11) located on the upper side of the pressing structure (8) is cut off, forming the semi-flexible area (12) and two stacked plate groups. The processing equipment in step four includes a processing table (13), on which a movable arm (14) is fixedly installed, and a ker (15) is installed at the end of the movable arm (14). The processing table (13) is provided with a positioning mechanism, which is used to position the connecting plate (11). The positioning mechanism is provided with a limiting mechanism, which is used to limit the connecting plate (11) when it is completely moved into the positioning mechanism. The processing table (13) is provided with a recycling mechanism, which is used to use airflow to recycle the powder generated during processing. The recycling mechanism is provided with a protective mechanism, which is used to protect the processing position. The recycling mechanism includes an L-shaped elastically extendable recycling tube (23), with a U-shaped enclosure (30) fixedly connected to the bottom of the recycling tube (23). A grinding plate (34) is elastically slidably connected to the inner surface of the enclosure (30). The grinding plate (34) is located above the semi-flexible area (12). During processing, the grinding plate (34) is used to grind the sidewall of the semi-flexible area (12) using its side edge. The bottom sides of the grinding plate (34) are inclined surfaces. The upper end of the grinding plate (34) extends to both sides, and the extension part of the grinding plate (34) and the grinding plate (34) are inclined surfaces. A rolling column (35) is rotatably connected to the bottom of the grinding plate (34), and the rolling column (35) is in contact with the surface of the first rigid plate (1).

2. The method for manufacturing a semi-flexible bonding plate according to claim 1, characterized in that: The positioning mechanism includes two L-shaped positioning plates (16), both of which are fixedly connected to the surface of the processing table (13). The connecting plate (11) is located inside the two positioning plates (16), and the side wall of the connecting plate (11) is in contact with the positioning plate (16). The inner edge of the positioning plate (16) is a bevel.

3. The method for manufacturing a semi-flexible bonding plate according to claim 2, characterized in that: The limiting mechanism includes four positioning posts (17), which are respectively located at the four corners of the surface of the connecting plate (11). The positioning posts (17) penetrate the connecting plate (11). A slot (18) is opened on the surface of the positioning plate (16), and the slot (18) penetrates the positioning plate (16). The positioning posts (17) are located inside the slot (18). An L-shaped limiting rod (19) is elastically slidably connected to the surface of the positioning plate (16). One end of the limiting rod (19) is above one end of the slot (18), and the other end of the limiting rod (19) extends into the slot (18). One side of the positioning plate (16) and the end of the limiting rod (19) is inclined. A blocking rod (20) is elastically slidably connected to the surface of the positioning plate (16). The blocking rod (20) is located above the slot (18) and close to the end of the limiting rod (19) which is inclined. The end of the blocking rod (20) is inclined. A limiting groove (21) is opened on the surface of the blocking rod (20). The limiting rod (19) is used to move into the limiting groove (21) to limit the blocking rod (20). A pulling rod (22) is fixedly connected to the surface of the blocking rod (20). The pulling rod (22) extends to the outside of the positioning plate (16).

4. The method for manufacturing a semi-flexible bonding plate according to claim 3, characterized in that: The recycling pipe (23) is installed on the surface of the processing table (13). The surface of the processing table (13) has a recycling port (24) corresponding to the position of the recycling pipe (23). The recycling port (24) is connected to an external fan. The bottom of the recycling pipe (23) is located on one side of the positioning plate (16). The upper end of the recycling pipe (23) extends to the top of the positioning plate (16). The surface of the recycling pipe (23) has multiple processing ports (25). The processing ports (25) penetrate the recycling pipe (23). The inside of the recycling pipe (23) is connected to the processing ports (25). The inside of the processing ports (25) will form a negative pressure under the action of the external fan. A baffle plate (26) is fixedly connected to the inside of the processing port (25). The baffle plate (26) is used to block the upper part of the inside of the recycling pipe (23) at the processing port (25).

5. The method for manufacturing a semi-flexible bonding plate according to claim 4, characterized in that: The protective mechanism includes a fixed plate (27), which is fixedly connected to the inner wall surface of the processing port (25). The fixed plate (27) blocks half of the processing port (25). Two retractable protective plates (28) are fixedly connected to the inner wall side of the processing port (25). The two protective plates (28) and the fixed plate (27) cover the processing port (25). The corners of the two protective plates (28) that are close to each other and away from the fixed plate (27) are cut off to form a V-shaped inlet (29). Two swing plates (31) are elastically hinged to the inner surface of the enclosure (30). The two swing plates (31) block one side of the opening of the enclosure (30). The enclosure (30) and the two swing plates (31) surround the position of the recycling pipe (23) corresponding to the processing port (25).

6. The method for manufacturing a semi-flexible composite plate according to claim 5, characterized in that: The surface of the enclosure (30) is elastically slidably connected to a first sliding plate (32), and a first cleaning brush (33) is fixedly connected to the bottom of the first sliding plate (32).

7. The method for manufacturing a semi-flexible bonding plate according to claim 6, characterized in that: The enclosure (30) is elastically slidably connected to a second sliding plate (36). The second sliding plate (36) and the first sliding plate (32) cover the side of the enclosure (30). The second sliding plate (36) is located above the semi-flexible area (12). A second cleaning brush (37) is fixedly connected to the bottom of the second sliding plate (36). A storage box (38) is fixedly connected to the surface of the enclosure (30). The storage box (38) stores a chemical agent for removing metal powder. A retractable connecting pipe (39) is connected to the bottom of the storage box (38). The bottom of the connecting pipe (39) is connected to the second sliding plate (36). The second sliding plate (36) seals the connecting pipe (39). Multiple drainage grooves (40) are opened on the surface of the second sliding plate (36). A throttling plate (41) is fixedly connected inside the fixed end of the connecting pipe (39). The throttling plate (41) has a surface... The first water outlet (42) is provided on the surface of the connecting pipe (39). A sealing plate (43) is slidably connected inside the fixed end of the connecting pipe (39). Two second water outlets (44) are provided on the surface of the sealing plate (43). The two second water outlets (44) are staggered with the first water outlet (42). An extension plate (45) is fixedly connected to the side of the sealing plate (43). The extension plate (45) passes through the connecting pipe (39) and the surrounding plate (30) and then bends downward to the position of the grinding plate (34). A through-hole (46) is provided on the surface of the connecting pipe (39) and the surrounding plate (30) corresponding to the position of the extension plate (45). The inner wall of the extension plate (45) is elastically connected to the through-hole (46). A retractable sealing plate (47) is fixedly connected inside the through-hole (46). A toggle block (48) is fixedly connected to the surface of the grinding plate (34). The toggle block (48) is used to move the extension plate (45).

8. The method for manufacturing a semi-flexible bonding plate according to claim 7, characterized in that: A swing rod (49) is hinged to the inner surface of the enclosure (30). The middle position of the swing rod (49) is hinged to the enclosure (30). The side of the swing rod (49) near the extension plate (45) is below the extension plate (45). An L-shaped sliding rod (50) is elastically slidably connected to the inner side of the enclosure (30). The upper end of the sliding rod (50) is above the end of the swing rod (49) away from the extension plate (45). A rolling wheel (51) is rotatably connected to the bottom of the sliding rod (50). The rolling wheel (51) is outside the semi-flexible area (12).

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