Liquid cooling module and applicable heat dissipation assembly structure thereof

Abstract

The invention discloses a liquid cooling module and an applicable heat dissipation assembly structure thereof. The liquid cooling module comprises a bottom cover and a base shell, and the base shell is in a long and narrow rectangular shape and comprises an inflow cavity, an outflow cavity, a flow dividing cavity, a partition wall, a first through opening, a second through opening and a flow dividing structure. The inflow cavity and the outflow cavity are arranged between the bottom face of the base and the bottom cover and are divided into opposite cavities through a partition wall. The multiple flow dividing cavities are formed in the top face. The plurality of first ports and the plurality of second ports are adjacently arranged on the two opposite long edge sides respectively and are arranged in the first direction. The flow dividing cavity communicates with the inflow cavity corresponding to the first through opening and communicates with the outflow cavity corresponding to the second through opening. The flow dividing structure is arranged on the bottom cover or the first face and protrudes towards the inflow cavity or the outflow cavity, or the flow dividing structure is formed by irregularly bending the partition wall, and the flow dividing function is provided so that the flow of the even parallel flow channels can be achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation assembly structure, in particular to a liquid cooling module with a flow distribution structure and a heat dissipation assembly structure using the same, which can provide uniform flow channels for multiple heat-generating electronic devices arranged in a long and narrow manner, thereby effectively improving heat dissipation efficiency. BACKGROUND

[0002] Generally, electronic devices are combined with heat dissipation assembly structures to dissipate internal heat. High-power modules used in inverters are often accompanied by high heat generation, and water-cooled heat dissipation assembly structures must be combined to achieve effective heat dissipation.

[0003] For traction inverters for vehicle motors, three high-power modules are usually arranged in a long and narrow structure, and water-cooled heat dissipation modules are usually designed with a series flow channel. After the cooling fluid enters the heat exchange cavity from the inlet flow channel, it continuously flows through multiple fins for heat dissipation, and finally exits through the outlet flow channel. Although this architecture is easy to design, it causes the temperature of the downstream fins to be higher, resulting in poor reliability of the downstream power modules. In addition, the continuous fin design also causes the impedance of the system working fluid to increase significantly, resulting in a decrease in flow. How to design the flow channel of the liquid cooling module and the heat dissipation assembly structure suitable for multiple electronic devices arranged in a long and narrow manner has always been a major concern in the field.

[0004] Therefore, it is necessary to provide a liquid cooling module and a heat dissipation assembly structure using the same, which introduces a flow distribution structure into multiple parallel flow channels to effectively reduce the temperature difference of multiple electronic devices in the heat dissipation assembly structure and the impedance of the cooling fluid, and to solve the shortcomings of the prior art. SUMMARY

[0005] The purpose of the present application is to provide a liquid cooling module and a heat dissipation assembly structure using the same, which introduces a flow distribution structure into multiple parallel flow channels to effectively reduce the temperature difference of multiple electronic devices in the heat dissipation assembly structure and the impedance of the cooling fluid.

[0006] Another objective of this invention is to provide a liquid cooling module and its applicable heat dissipation assembly structure. Addressing the heat dissipation needs of multiple electronic devices arranged in a single direction, the liquid cooling module features a parallel flow channel design within a long, narrow base housing. The top side of the base housing is divided into multiple flow-dividing chambers connected to the heat dissipation fins of the multiple electronic devices. The bottom side of the base housing is divided into inlet and outlet chambers by partition walls. The cooling fluid in the inlet chamber is evenly distributed through the flow-dividing structure and enters the multiple flow-dividing chambers through multiple openings on adjacent long sides. The fluid then converges into the outlet chamber through an opening on another long side, where it is discharged. The multiple flow-dividing chambers form multiple transverse flow channels corresponding to the openings on the two long sides. These transverse flow channels are connected in parallel between the inlet and outlet chambers and carry equal flow rates of cooling fluid to dissipate heat from the multiple electronic devices. Because the flow direction of the multiple transverse channels is perpendicular to the extension direction of the long side, and is not designed to extend along the long side, but rather adopts a short-path design, the transverse channels of the multiple distribution chambers are located between the two opposite long sides of the narrow base shell, which helps to reduce the channel length and improve the uniform heat dissipation efficiency. Thus, the cooling channel inlet and outlet can be supplied with cooling fluid from different ends of the long side. Furthermore, the openings extending along the two opposite long sides and the distribution chambers connecting them have the same width. The multiple channels formed are uniformly distributed by at least one distribution structure, ensuring that the electronic devices in the corresponding distribution chambers of the heat dissipation assembly structure have similar heat dissipation conditions. This allows for the rapid and even removal of heat generated by multiple electronic devices, effectively improving the overall heat dissipation efficiency.

[0007] To achieve the aforementioned objectives, this invention provides a liquid cooling module comprising a base housing, a top cover, and a bottom cover. The base housing is elongated rectangular, having a first side, a second side, a third side, a fourth side, a first surface, and a second surface. The first side and the second side are disposed opposite to each other and extend along a first direction. The base housing includes an inlet cavity, an outlet cavity, multiple branch cavities, a partition wall, multiple first openings, multiple second openings, and at least one branch structure. The bottom cover is spatially opposite to the first surface and connects the first side, the second side, the third side, and the fourth side. The inlet cavity is disposed between the first surface and the bottom cover. The outlet cavity is disposed between the first surface and the bottom cover. The multiple branch cavities are disposed on the second surface and are thermally coupled to multiple fins. The partition wall is disposed between the inlet cavity and the outlet cavity and connects the first surface and the bottom cover. The multiple first openings are adjacent to the first side, arranged along the first direction, and respectively connect the inlet cavity and the multiple branch cavities. Multiple second ports are adjacent to the second side, arranged along the first direction, and respectively connect the outlet cavity and multiple branch cavities. The multiple branch cavities correspond to multiple first ports near the first side and multiple second ports near the second side. At least one branching structure is disposed on the bottom cover and protrudes towards the inlet or outlet cavity, providing a branching function. Cooling fluid enters the multiple branch cavities through the inlet cavity and the multiple first ports, and after heat exchange with the multiple fins, the cooling fluid enters the outlet cavity through the multiple branch cavities and the multiple second ports before being discharged.

[0008] In one embodiment, the liquid cooling module further includes a cooling channel inlet that is disposed through the bottom cover and communicates with the inlet cavity; and a cooling channel outlet that is disposed through the bottom cover and communicates with the outlet cavity.

[0009] In one embodiment, at least one diversion structure is circular and located on the midline of any two adjacent first openings or any two adjacent second openings to provide diversion functionality.

[0010] In one embodiment, at least one diversion structure is elongated, separated from the partition wall, and extends along a second direction perpendicular to the first direction.

[0011] In one embodiment, at least one shunt structure is formed by irregularly bent partition walls.

[0012] In one embodiment, the plurality of first openings and the plurality of second openings are all slotted holes extending along a first direction.

[0013] In one embodiment, the liquid cooling module further includes a top cover having a top side and a bottom side opposite to each other, wherein a heat dissipation surface is disposed on the top side, and the bottom side is connected to a first side, a second side, a third side, a fourth side and a second surface of the base housing to form a plurality of flow distribution cavities, and a plurality of fins are accommodated in the plurality of flow distribution cavities and extend from the bottom side toward the second surface.

[0014] In one embodiment, the number of each of the plurality of diversion cavities, the plurality of first ports, and the plurality of second ports is equal, which is M, where M is an integer and M≧2.

[0015] In one embodiment, multiple flow dividers, multiple first ports, and multiple second ports correspond to form M flow channels, and the flow direction of the M flow channels is perpendicular to the first direction.

[0016] To achieve the aforementioned objectives, this application further provides a liquid cooling module including a base housing. The base housing is elongated rectangular, having a first side, a second side, a third side, a fourth side, a first surface, and a second surface. The first side and the second side are disposed opposite to each other and extend along a first direction. The base housing includes an inlet cavity, an outlet cavity, multiple branch cavities, a partition wall, multiple first ports, multiple second ports, and at least one branch structure. The inlet cavity is disposed on the first surface. The outlet cavity is disposed on the first surface. The multiple branch cavities are disposed on the second surface and are thermally coupled to multiple fins. The partition wall is disposed between the inlet cavity and the outlet cavity. The multiple first ports are adjacent to the first side, arranged along the first direction, and respectively connect the inlet cavity and the multiple branch cavities. The multiple second ports are adjacent to the second side, arranged along the first direction, and respectively connect the outlet cavity and the multiple branch cavities, wherein the multiple branch cavities correspond to the multiple first ports near the first side and to the multiple second ports near the second side. At least one flow-diverting structure is disposed on the first surface, located in the inlet cavity or outlet cavity, or connected to the partition wall, to provide flow-diverting function. The cooling fluid enters multiple flow-diverting cavities through the inlet cavity and multiple first ports respectively. After heat exchange with multiple fins, the cooling fluid enters the outlet cavity through multiple flow-diverting cavities and multiple second ports respectively and is then discharged.

[0017] In one embodiment, the liquid cooling module further includes a cooling channel inlet adjacent to the third side and connected to the inlet cavity; and a cooling channel outlet adjacent to the fourth side and connected to the outlet cavity.

[0018] In one embodiment, the liquid cooling module further includes a bottom cover, which is assembled with the first side, second side, third side, fourth side and first surface of the base housing, connecting the partition wall and forming an inlet cavity and an outlet cavity, with the cooling channel inlet and cooling channel outlet penetrating through the bottom cover.

[0019] In one embodiment, at least one shunt structure has one end connected to a partition wall and the other end extending along a second direction, which is perpendicular to the first direction.

[0020] In one embodiment, at least one diversion structure is circular and located on the midline of any two adjacent first openings or any two adjacent second openings to provide diversion functionality.

[0021] In one embodiment, at least one diversion structure is elongated, separated from the partition wall, and extends along a second direction perpendicular to the first direction.

[0022] In one embodiment, at least one shunt structure is formed by irregularly bent partition walls.

[0023] In one embodiment, the plurality of first ports and the plurality of second ports are all elongated holes extending along a first direction.

[0024] In one embodiment, the liquid cooling module further includes a top cover having a top side and a bottom side opposite to each other, wherein the bottom side is connected to a first side, a second side, a third side, a fourth side and a second surface of the base housing to form a plurality of flow distribution cavities, a plurality of fins are housed in the plurality of flow distribution cavities and extend from the bottom side toward the second surface, and a heat dissipation surface is disposed on the top side and thermally coupled to the plurality of fins.

[0025] In one embodiment, the number of each of the plurality of diversion cavities, the plurality of first ports, and the plurality of second ports is equal, which is M, where M is an integer and M≧2.

[0026] To achieve the aforementioned objectives, this application further provides a heat dissipation assembly structure including a liquid cooling module and multiple electronic components. The liquid cooling module includes a base housing and a bottom cover. The base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface. The first side and the second side are disposed opposite to each other and extend along a first direction. The base housing includes an inlet cavity, an outlet cavity, multiple branch cavities, a partition wall, multiple first openings, multiple second openings, and at least one branch structure. The bottom cover is spatially opposite to the first surface and connects the first side, the second side, the third side, and the fourth side. The inlet cavity is disposed between the first surface and the bottom cover. The outlet cavity is disposed between the first surface and the bottom cover. The multiple branch cavities are disposed on the second surface and are thermally coupled to multiple fins. The multiple fins are connected to a heat dissipation surface. The partition wall is disposed between the inlet cavity and the outlet cavity, with one end of the partition wall connected to the third side near the second side, and the other end of the partition wall connected to the fourth side near the first side. Multiple first ports are adjacent to a first side, arranged along a first direction, and respectively connected between an inlet cavity and multiple branch cavities. Multiple second ports are adjacent to a second side, arranged along the first direction, and respectively connected between an outlet cavity and multiple branch cavities, wherein the multiple branch cavities correspond to the multiple first ports near the first side and to the multiple second ports near the second side. At least one branching structure is disposed on the bottom cover or the first surface and protrudes towards the inlet cavity or outlet cavity to provide a branching function. Multiple electronic devices are disposed on a heat dissipation surface, arranged along the first direction, and thermally coupled to multiple fins, wherein cooling fluid enters the multiple branch cavities through the inlet cavity and the multiple first ports, respectively, and exchanges heat with the multiple fins to dissipate heat from the multiple electronic devices. The cooling fluid then flows from the multiple branch cavities to the outlet cavity through the multiple second ports. Attached Figure Description

[0027] The following detailed description of the case and the schematic diagrams of the embodiments are intended to enable those skilled in the art to better understand the above content, and are not intended to limit the case.

[0028] Figure 1 and Figure 2 This is a three-dimensional structural diagram illustrating the heat dissipation assembly structure of the first embodiment of this case;

[0029] Figure 3 and Figure 4 This is an exploded view of the heat dissipation assembly structure of the first embodiment of this case;

[0030] Figure 5 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the first embodiment of this case;

[0031] Figure 6 This is a schematic diagram illustrating the flow direction of the cooling fluid on the second surface of the liquid cooling module in the first embodiment of this case;

[0032] Figure 7 and Figure 8 This is an exploded view showing the heat dissipation assembly structure of the second embodiment of this case;

[0033] Figure 9 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the second embodiment of this case;

[0034] Figure 10 This is an exploded view of the heat dissipation assembly structure of the third embodiment of this case;

[0035] Figure 11 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the third embodiment of this case;

[0036] Figure 12 This is an exploded view of the heat dissipation assembly structure of the fourth embodiment of this case;

[0037] Figure 13 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the fourth embodiment of this case;

[0038] Figures 14 to 16 To illustrate other examples of different flow distribution structures in the liquid cooling module of this case;

[0039] Figure 17 and Figure 18 This is a three-dimensional structural diagram illustrating the heat dissipation assembly structure of the fifth embodiment of this case;

[0040] Figure 19 and Figure 20 This is an exploded view showing the heat dissipation assembly structure of the fifth embodiment of this case;

[0041] Figure 21 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the fifth embodiment of this case;

[0042] Figure 22 This is a schematic diagram illustrating the flow direction of the cooling fluid on the second side of the liquid cooling module in the fifth embodiment of this case.

[0043] Explanation of reference numerals in the attached figures

[0044] 1, 1a, 1b, 1c, 1d: Heat dissipation assembly structure

[0045] 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g: Base shell

[0046] 3, 3a, 3b, 3c, 3d: Liquid cooling modules

[0047] 101: First Page

[0048] 102: Second Page

[0049] 11: First side

[0050] 12: Second side

[0051] 13: Third side

[0052] 14: Fourth side

[0053] 20, 20a: Spacer

[0054] 21: Inlet cavity

[0055] 22: Outflow cavity

[0056] 23a, 23b, 23c: First port

[0057] 24a, 24b, 24c: Second port

[0058] 25, 25a, 25b, 25c, 25d, 25e, 25f, 25g, 25h: shunt structure

[0059] 30: Bottom cover

[0060] 31: Cooling channel inlet

[0061] 32: Cooling channel outlet

[0062] 33a, 33b: Diversion structure

[0063] 40: Top Cover

[0064] 41a, 41b, 41c: Flow splitter cavities

[0065] 42: Fins

[0066] 43: Heat dissipation surface

[0067] 9a, 9b, 9c: Electronic components

[0068] F1, F2, F3: Flow channels

[0069] W: Width

[0070] X, Y, Z: Axes Detailed Implementation

[0071] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different implementations, all of which do not depart from the scope of this invention, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the invention. For example, if the following description of a first feature disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features can be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another component(s) or feature(s) in the drawings, spatially related terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," etc., may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items.

[0072] Figure 1 and Figure 2This is a three-dimensional structural diagram illustrating the heat dissipation assembly structure of the first embodiment of this case. Figure 3 and Figure 4 This is an exploded view of the heat dissipation assembly structure of the first embodiment of this case. Figure 5 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the first embodiment of this case. Figure 6 This is a schematic diagram illustrating the flow direction of the cooling fluid on the second surface of the liquid-cooled module in the first embodiment of this case. (Reference) Figures 1 to 6In this embodiment, a heat dissipation assembly 1 is provided, comprising an elongated liquid cooling module 3 and multiple electronic devices 9a, 9b, and 9c. The liquid cooling module 3 mainly includes a base housing 2 in the shape of an elongated rectangle, a top cover 40, and a bottom cover 30. In this embodiment, the base housing 2 has a first side 11, a second side 12, a third side 13, a fourth side 14, a first surface 101, and a second surface 102. The first side 11 and the second side 12 are the long sides, arranged opposite each other and extending along a first direction, such as the Y-axis. The third side 13 and the fourth side 14 are the short sides, arranged opposite each other, and are respectively connected between the first side 11 and the second side 12. In addition, the first surface 101 and the second surface 102 are the bottom surface and the top surface of the base housing 2, respectively, and are two surfaces opposite each other. In this embodiment, the distance between the first side 11 and the second side 12 is less than the distance between the third side 13 and the fourth side 14, that is, the length of the longer side of the first side 11 and the second side 12 is greater than the length of the shorter side of the third side 13 and the fourth side 14, thereby forming a long and narrow rectangular base housing 2. In this embodiment, the base housing 2 includes an inlet cavity 21, an outlet cavity 22, a plurality of branching cavities 41a, 41b, 41c, a partition wall 20, a plurality of first openings 23a, 23b, 23c, a plurality of second openings 24a, 24b, 24c, at least one branching structure 33a, 33b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the bottom cover 30 is spatially opposite to the first surface 101 and connects the first side 11, the second side 12, the third side 13, and the fourth side 14. The inlet cavity 21 is disposed between the first surface 101 and the bottom cover 30. The outlet cavity 22 is disposed between the first surface 101 and the bottom cover 30. The partition wall 20 is disposed between the inlet cavity 21 and the outlet cavity 22, connecting the first surface 101 and the bottom cover 30. It should be noted that, in this embodiment, one side of the bottom cover 30 is assembled with the first side 11, the second side 12, the third side 13, the fourth side 14 of the base housing 2 and the first surface 101, connecting the partition wall 20 and forming the inlet cavity 21 and the outlet cavity 22. The cooling channel inlet 31 and the cooling channel outlet 32 ​​are disposed through the bottom cover 30. Furthermore, in this embodiment, the cooling channel inlet 31 is adjacent to the third side 13 and communicates with the inlet cavity 21. The cooling channel outlet 32 ​​is adjacent to the fourth side 14 and communicates with the outlet cavity 22. Of course, this embodiment is not limited to the assembly method of the bottom cover 30 and the base housing 2. It is worth noting that after the bottom cover 30 is assembled with the elongated rectangular base housing 2, the partition wall 20 divides the space at the first surface 101 into an inlet cavity 21 and an outlet cavity 22, wherein the inlet cavity 21 and the outlet cavity 22 are symmetrical to each other. Of course, this embodiment is not limited to this. In this embodiment, the liquid cooling module 3, for example, forms multiple flow distribution cavities 41a, 41b, and 41c by assembling the top cover 40 with the base housing 2.The top cover 40 has a top side and a bottom side that are opposite to each other. The heat dissipation surface 43 corresponding to the electronic devices 9a, 9b, and 9c is provided on the top side of the top cover 40. The bottom side of the top cover 40 is connected to the first side 11, the second side 12, the third side 13, the fourth side 14, and the second surface 102 of the base housing 2 to form multiple flow distribution cavities 41a, 41b, and 41c. This invention is not limited to the connection method between the top cover 40 and the base housing 2.

[0073] In this embodiment, multiple fins 42 are disposed on the bottom side of the top cover 40 and housed in multiple distribution cavities 41a, 41b, and 41c, extending from the bottom side of the top cover 40 toward the second surface 102. In other embodiments, multiple fins 42 are disposed on the second surface 102 and connected to the top cover 40, and thermally coupled to the heat dissipation surface 43 on the top side. Of course, this embodiment is not limited to these. Through the assembly of the top cover 40 and the base housing 2, multiple distribution cavities 41a, 41b, and 41c are disposed on the second surface 102 and thermally coupled to multiple fins 42. Furthermore, the multiple fins 42 are connected to the heat dissipation surface 43, which can dissipate heat from multiple electronic devices 9a, 9b, and 9c thereon.

[0074] In this embodiment, a plurality of first ports 23a, 23b, and 23c are adjacent to the first side 11, arranged along the first direction (i.e., the Y-axis direction), and respectively connect the inlet cavity 21 and the plurality of branch cavities 41a, 41b, and 41c. A plurality of second ports 24a, 24b, and 24c are adjacent to the second side 12, arranged along the first direction (i.e., the Y-axis direction), and respectively connect the outlet cavity 22 and the plurality of branch cavities 41a, 41b, and 41c. The plurality of branch cavities 41a, 41b, and 41c correspond to the plurality of first ports 23a, 23b, and 23c near the first side 11, and correspond to the plurality of second ports 24a, 24b, and 24c near the second side 12. It should be noted that the number of each of the multiple flow-dividing chambers 41a, 41b, 41c, the multiple first ports 23a, 23b, 23c, and the multiple second ports 24a, 24b, 24c is equal, consisting of three. Flow-dividing chamber 41a, first port 23a, and second port 24a form flow channel F1. Flow-dividing chamber 41b, first port 23b, and second port 24b form flow channel F2. Flow-dividing chamber 41c, first port 23c, and second port 24c form flow channel F3. The three flow channels F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, and the flow directions of the three flow channels F1, F2, and F3 are perpendicular to the first direction (Y-axis direction) and parallel to the X-axis direction.

[0075] In this embodiment, the diversion structures 33a and 33b are disposed on one side of the bottom cover 30 and protrude towards the inlet cavity 21, for example, close to the first surface 101 but not in contact with it. The diversion structures 33a and 33b are, for example, elongated rectangles, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to actual application requirements. One end of the diversion structures 33a and 33b contacts the partition wall 20, and the other end of the diversion structures 33a and 33b extends along the second direction parallel to the X-axis, which is perpendicular to the first direction. Thus, the diversion structure 33a provides diversion function for adjacent first ports 23a and 23b. The diversion structure 33b provides diversion function for adjacent first ports 23b and 23c. In this case, by setting the diversion structures 33a and 33b, the parallel flow channels F1, F2, and F3 are more in line with the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. In other embodiments, omitting either of the shunt structures 33a and 33b can still form a uniform shunt, so that the parallel flow channels F1, F2, and F3 meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0076] In this embodiment, electronic devices 9a, 9b, and 9c are used, for example, as three power devices in a multiphase inverter to generate the drive current for the output motor. Since each power device requires separate input and output electrical connections, they must be arranged in a single direction and electrically connected to the outside via the two long sides of the heat dissipation assembly structure 1. To meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the heat dissipation assembly structure 1 has multiple electronic devices 9a, 9b, and 9c disposed on the heat dissipation surface 43, arranged along the first direction (i.e., the Y-axis direction), and thermally coupled to multiple fins 42. When the multiple electronic devices 9a, 9b, and 9c are power devices of the aforementioned multiphase inverter, they can be electrically connected to the outside via the first side 11 or the second side 12. Of course, this embodiment is not limited to this. In this embodiment, after the cooling fluid enters the inlet chamber 21 through the cooling channel inlet 31, it is evenly distributed through multiple first ports 23a, 23b, and 23c by the diversion structures 33a and 33b within the inlet chamber 21, and enters multiple diversion chambers 41a, 41b, and 41c respectively. The cooling fluid in the multiple diversion chambers 41a, 41b, and 41c exchanges heat with multiple fins 42 to dissipate heat from multiple electronic devices 9a, 9b, and 9c. Subsequently, the cooling fluid in the multiple diversion chambers 41a, 41b, and 41c converges through multiple second ports 24a, 24b, and 24c to the outlet chamber 22. Finally, it is discharged from the cooling channel outlet 32.

[0077] In this embodiment, multiple flow-dividing cavities 41a, 41b, and 41c correspond to the first openings 23a, 23b, and 23c on the first side 11 and the second openings 24a, 24b, and 24c on the second side 12, forming multiple transverse flow channels F1, F2, and F3. Through the flow-dividing effect of the flow-dividing structures 33a and 33b, the multiple transverse flow channels F1, F2, and F3 are connected in parallel between the inlet cavity 21 and the outlet cavity 22, thus providing cooling fluid with equal flow rates, thereby dissipating heat from multiple electronic devices 9a, 9b, and 9c respectively. Because the flow directions of the multiple transverse flow channels F1, F2, and F3 are perpendicular to the long side, i.e., the extension directions of the first side 11 and the second side 12, and are not designed to extend along the long side, but rather adopt a short path design, the transverse flow channels F1, F2, and F3 of the multiple flow distribution chambers 41a, 41b, and 41c flow through the elongated base housing 2 along the shortest path, which helps to reduce the flow channel length and improve the uniform heat dissipation efficiency. Therefore, the cooling flow channel inlet 31 and the cooling flow channel outlet 32 ​​can be provided with cooling fluid from different ends of the long side, such as adjacent to the third side 13 and the fourth side 14. In this embodiment, the multiple first ports 23a, 23b, 23c and the multiple second ports 24a, 24b, 24c are all slotted holes extending along the first direction (i.e., the Y-axis direction). The multiple first ports 23a, 23b, 23c and the multiple second ports 24a, 24b, 24c and the multiple flow-dividing cavities 41a, 41b, 41c have the same width W in the first direction. The multiple flow channels F1, F2, F3 formed, together with the uniform flow-dividing structure 33a, 33b, can make the electronic devices 9a, 9b, 9c in the corresponding multiple flow-dividing cavities 41a, 41b, 41c in the heat dissipation assembly structure 1 have similar heat dissipation conditions, and can quickly and evenly remove the heat generated by the multiple electronic devices 9a, 9b, 9c, effectively improving the overall heat dissipation efficiency.

[0078] Figure 7 and Figure 8 This is an exploded view of the heat dissipation assembly structure of the second embodiment of this case. Figure 9 This diagram illustrates the flow direction of the cooling fluid on the first surface of the liquid-cooled module in the second embodiment of this case. In this embodiment, the heat dissipation assembly structure 1a and the liquid-cooled module 3a are substantially similar in structure. Figures 1 to 6 The heat dissipation assembly structure 1 and the liquid cooling module 3 shown herein use the same component designations to represent the same components, structures, and functions, and will not be described further here. (Reference) Figures 6 to 9In this embodiment, the diversion structures 25a and 25b are disposed on the first surface 101 of the base housing 2a, located in the outlet cavity 22. The diversion structures 25a and 25b protrude from the first surface 101 and are, for example, not limited to, contacting the bottom cover 30. The diversion structures 25a and 25b are, for example, elongated rectangles, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to actual application requirements. One end of the diversion structures 25a and 25b is connected to the partition wall 20, and the other end of the diversion structures 25a and 25b extends along the second direction parallel to the X-axis, which is perpendicular to the first direction. Thus, the diversion structure 25a provides a diversion function for the adjacent second ports 24a and 24b. The diversion structure 25b provides a diversion function for the adjacent second ports 24b and 24c. By setting the diversion structures 25a and 25b, this invention makes the parallel flow channels F1, F2, and F3 more suitable for the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. In other embodiments, the flow splitting structures 25a and 25b are moved to the inlet cavity 21 or either of the flow splitting structures 25a and 25b is omitted, and uniform flow splitting can still be formed so that the parallel flow channels F1, F2, and F3 meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0079] Figure 10 This is an exploded view of the heat dissipation assembly structure of the third embodiment of this case. Figure 11 This diagram illustrates the flow direction of the cooling fluid on the first surface of the liquid-cooled module in the third embodiment of this case. In this embodiment, the heat dissipation assembly structure 1b and the liquid-cooled module 3b are substantially similar in structure. Figures 1 to 6 The heat dissipation assembly structure 1 and the liquid cooling module 3 shown herein use the same component designations to represent the same components, structures, and functions, and will not be described further here. (Reference) Figure 6 , Figure 10 and Figure 11In this embodiment, the partition wall 20a of the base housing 2b is irregularly curved to separate the inlet cavity 21 and the outlet cavity 22. The irregular curvature of the partition wall 20a can also provide a flow-diverting function corresponding to multiple first ports 23a, 23b, 23c or multiple second ports 24a, 24b, 24c, so that the parallel flow channels F1, F2, F3 meet the heat dissipation requirements of multiple electronic devices 9a, 9b, 9c arranged in a single direction. In other words, at least one flow-diverting structure 25c can be, for example, formed by the irregular curvature of the partition wall 20a. In this embodiment, after the cooling fluid enters the inlet cavity 21 through the cooling flow channel inlet 31, the cooling fluid can be evenly diverted through multiple first ports 23a, 23b, 23c and enter multiple flow-diverting cavities 41a, 41b, 41c through the diversion effect of at least one flow-diverting structure 25c within the inlet cavity 21. The cooling fluid in multiple distribution chambers 41a, 41b, and 41c exchanges heat with multiple fins 42 to dissipate heat from multiple electronic devices 9a, 9b, and 9c. Then, the cooling fluid in the distribution chambers 41a, 41b, and 41c converges into the outlet chamber 22 through multiple second ports 24a, 24b, and 24c. Finally, it is discharged from the cooling channel outlet 32. Of course, this invention is not limited to this.

[0080] Figure 12 This is an exploded view of the heat dissipation assembly structure of the fourth embodiment of this case. Figure 13 This diagram illustrates the flow direction of the cooling fluid on the first surface of the liquid-cooled module in the fourth embodiment of this case. In this embodiment, the heat dissipation assembly structure 1c and the liquid-cooled module 3c are substantially similar in structure. Figures 1 to 9 The heat dissipation assembly structures 1 and 1a and liquid cooling modules 3 and 3a shown herein use the same component designations to represent the same components, structures, and functions, and will not be described further here. Reference Figure 6 , Figure 7 , Figure 12 and Figure 13In this embodiment, a heat dissipation assembly 1c is provided, comprising an elongated liquid cooling module 3c and multiple electronic devices 9a, 9b, and 9c. The liquid cooling module 3c mainly includes a base housing 2c in the shape of an elongated rectangle, a top cover 40, and a bottom cover 30. In this embodiment, the base housing 2c has a first side 11, a second side 12, a third side 13, a fourth side 14, a first surface 101, and a second surface 102. The first side 11 and the second side 12 are the long sides, arranged opposite each other and extending along a first direction, such as the Y-axis. The third side 13 and the fourth side 14 are the short sides, arranged opposite each other, and connected between the first side 11 and the second side 12, respectively. In addition, the first surface 101 and the second surface 102 are the bottom surface and the top surface of the base housing 2c, respectively, and are two surfaces opposite each other. In this embodiment, the distance between the first side 11 and the second side 12 is less than the distance between the third side 13 and the fourth side 14, that is, the length of the longer side of the first side 11 and the second side 12 is greater than the length of the shorter side of the third side 13 and the fourth side 14, thereby forming a long and narrow rectangular base shell 2c. In this embodiment, the integral base shell 2c includes an inlet cavity 21, an outlet cavity 22, multiple branching cavities 41a, 41b, 41c, a partition wall 20, multiple first openings 23a, 23b, 23c, multiple second openings 24a, 24b, 24c, at least one branching structure 25a, 25b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the inlet cavity 21 is disposed on the first surface 101, spatially opposite to the first side 11 and the third side 13. The outlet cavity 22 is disposed on the first surface 101, spatially opposite to the second side 12 and the fourth side 14. A partition wall 20 is disposed between the inlet cavity 21 and the outlet cavity 22. One end of the partition wall 20 connecting to the third side 13 is close to the second side 12, and the other end connecting to the fourth side 14 is close to the first side 11. It should be noted that in this embodiment, the bottom cover 30 is assembled with the first side 11, second side 12, third side 13, fourth side 14, and first surface 101 of the base housing 2c, connecting the partition wall 20 and forming the inlet cavity 21 and the outlet cavity 22. The cooling channel inlet 31 and the cooling channel outlet 32 ​​are disposed through the bottom cover 30. Furthermore, in this embodiment, the cooling channel inlet 31 is adjacent to the third side 13 and communicates with the inlet cavity 21. The cooling channel outlet 32 ​​is adjacent to the fourth side 14 and communicates with the outlet cavity 22. Of course, this embodiment is not limited to the assembly method of the bottom cover 30 and the base housing 2c. It is worth noting that after the bottom cover 30 is assembled with the elongated rectangular base housing 2c, the partition wall 20 divides the space at the first surface 101 into an inlet cavity 21 and an outlet cavity 22, wherein the inlet cavity 21 and the outlet cavity 22 are symmetrical to each other. In this embodiment, the liquid cooling module 3c forms multiple flow distribution cavities 41a, 41b, and 41c, for example, through the assembly of the top cover 40 and the base housing 2c.The top cover 40 has a top side and a bottom side that are opposite to each other. The heat dissipation surface 43 corresponding to the electronic devices 9a, 9b, and 9c is provided on the top side of the top cover 40. The bottom side of the top cover 40 is connected to the first side 11, the second side 12, the third side 13, the fourth side 14, and the second surface 102 of the base housing 2c to form multiple flow distribution cavities 41a, 41b, and 41c. This invention is not limited to the connection method between the top cover 40 and the base housing 2c.

[0081] In this embodiment, multiple fins 42 are disposed on the bottom side of the top cover 40 and housed in multiple distribution cavities 41a, 41b, and 41c, extending from the bottom side of the top cover 40 toward the second surface 102. In other embodiments, multiple fins 42 are disposed on the second surface 102 and connected to the top cover 40, and thermally coupled to the heat dissipation surface 43 on the top side. Of course, this embodiment is not limited to these. Through the assembly of the top cover 40 and the base housing 2c, multiple distribution cavities 41a, 41b, and 41c are disposed on the second surface 102 and thermally coupled to multiple fins 42. Furthermore, the multiple fins 42 are connected to the heat dissipation surface 43, which can dissipate heat from multiple electronic devices 9a, 9b, and 9c thereon.

[0082] In this embodiment, a plurality of first ports 23a, 23b, and 23c are adjacent to the first side 11, arranged along the first direction (i.e., the Y-axis direction), and respectively connect the inlet cavity 21 and the plurality of branch cavities 41a, 41b, and 41c. A plurality of second ports 24a, 24b, and 24c are adjacent to the second side 12, arranged along the first direction (i.e., the Y-axis direction), and respectively connect the outlet cavity 22 and the plurality of branch cavities 41a, 41b, and 41c. The plurality of branch cavities 41a, 41b, and 41c correspond to the plurality of first ports 23a, 23b, and 23c near the first side 11, and correspond to the plurality of second ports 24a, 24b, and 24c near the second side 12. It should be noted that the number of each of the multiple flow-dividing chambers 41a, 41b, 41c, the multiple first ports 23a, 23b, 23c, and the multiple second ports 24a, 24b, 24c is equal, consisting of three. Flow-dividing chamber 41a, first port 23a, and second port 24a form flow channel F1. Flow-dividing chamber 41b, first port 23b, and second port 24b form flow channel F2. Flow-dividing chamber 41c, first port 23c, and second port 24c form flow channel F3. The three flow channels F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, and the flow directions of the three flow channels F1, F2, and F3 are perpendicular to the first direction (Y-axis direction) and parallel to the X-axis direction.

[0083] In this embodiment, the flow-diverting structures 25a and 25b are disposed on the first surface 101, located in the inlet cavity 21. One end of the flow-diverting structures 25a and 25b is connected to the partition wall 20, and the other end of the flow-diverting structures 25a and 25b extends along a second direction parallel to the X-axis, which is perpendicular to the first direction. Thus, the flow-diverting structure 25a provides flow-diverting functionality for adjacent first ports 23a and 23b. The flow-diverting structure 25b provides flow-diverting functionality for adjacent first ports 23b and 23c. By configuring the flow-diverting structures 25a and 25b, this invention makes the parallel flow channels F1, F2, and F3 more suitable for the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0084] In this embodiment, electronic devices 9a, 9b, and 9c are used, for example, as three power devices in a multiphase inverter to generate the drive current for the output motor. Since each power device requires separate input and output electrical connections, they must be arranged in a single direction and electrically connected to the outside via the two long sides of the heat dissipation assembly structure 1c. To meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the heat dissipation assembly structure 1c comprises multiple electronic devices 9a, 9b, and 9c disposed on the heat dissipation surface 43, arranged along the first direction (i.e., the Y-axis direction), and thermally coupled to multiple fins 42. When the multiple electronic devices 9a, 9b, and 9c are power devices of the aforementioned multiphase inverter, they can be electrically connected to the outside via the first side 11 or the second side 12. Of course, this embodiment is not limited to this. In this embodiment, after the cooling fluid enters the inlet chamber 21 through the cooling channel inlet 31, it is evenly distributed through multiple first ports 23a, 23b, and 23c by the diversion structures 25a and 25b within the inlet chamber 21, and enters multiple diversion chambers 41a, 41b, and 41c respectively. The cooling fluid in the multiple diversion chambers 41a, 41b, and 41c exchanges heat with multiple fins 42 to dissipate heat from multiple electronic devices 9a, 9b, and 9c. Subsequently, the cooling fluid in the multiple diversion chambers 41a, 41b, and 41c converges through multiple second ports 24a, 24b, and 24c to the outlet chamber 22. Finally, it is discharged from the cooling channel outlet 32.

[0085] In this embodiment, multiple flow-dividing cavities 41a, 41b, and 41c correspond to the first openings 23a, 23b, and 23c on the first side 11 and the second openings 24a, 24b, and 24c on the second side 12, forming multiple transverse flow channels F1, F2, and F3. Through the flow-dividing effect of the flow-dividing structures 25a and 25b, the multiple transverse flow channels F1, F2, and F3 are connected in parallel between the inlet cavity 21 and the outlet cavity 22, thus providing cooling fluid with equal flow rates, thereby dissipating heat from multiple electronic devices 9a, 9b, and 9c respectively. Because the flow directions of the multiple transverse flow channels F1, F2, and F3 are perpendicular to the long side, i.e., the extension directions of the first side 11 and the second side 12, and are not designed to extend along the long side, but rather adopt a short path design, the transverse flow channels F1, F2, and F2 of the multiple flow distribution chambers 41a, 41b, and 41c flow through the elongated base housing 2c along the shortest path. This helps to reduce the flow channel length and improve the uniform heat dissipation efficiency. Therefore, the cooling flow channel inlet 31 and the cooling flow channel outlet 32 ​​can be provided with cooling fluid from different ends of the long side, such as adjacent to the third side 13 and the fourth side 14. In this embodiment, the multiple first ports 23a, 23b, 23c and the multiple second ports 24a, 24b, 24c are all slotted holes extending along the first direction (i.e., the Y-axis direction). The multiple first ports 23a, 23b, 23c and the multiple second ports 24a, 24b, 24c and the multiple flow-dividing cavities 41a, 41b, 41c have the same width W in the first direction. The multiple flow channels F1, F2, F3 formed, together with the uniform flow-dividing structure 25a, 25b, can make the electronic devices 9a, 9b, 9c in the corresponding multiple flow-dividing cavities 41a, 41b, 41c in the heat dissipation assembly structure 1c have similar heat dissipation conditions. The heat generated by the multiple electronic devices 9a, 9b, 9c can be quickly and evenly carried away, effectively improving the overall heat dissipation efficiency.

[0086] It should be noted that, in this embodiment, the shunt structures 25a and 25b are, for example, elongated rectangles, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to actual application requirements. In other embodiments, omitting either the shunt structures 25a or 25b can still form a uniform shunt, allowing the parallel flow channels F1, F2, and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. Figure 14 To illustrate a second exemplary example of the flow distribution structure in the liquid cooling module of this case. In this embodiment, the structure of the base housing 2d is generally similar to... Figures 12 to 13 The base housing 2c shown uses the same component designations to represent the same components, structures, and functions, and will not be described again here. (Reference) Figure 6 , Figures 12 to 14In this embodiment, the base housing 2d includes a flow-diverting structure 25b and a flow-diverting structure 25d. The flow-diverting structures 25b and 25d are located in the inlet cavity 21 and the outlet cavity 22, respectively. The flow-diverting structure 25b, located in the inlet cavity 21, is connected at one end to the partition wall 20, and the other end extends along the second direction (i.e., the X-axis direction) toward the first side 11, providing a flow-diverting function for adjacent first openings 23b and 23c, which helps to equalize the flow rate of channels F2 and F3. The flow-diverting structure 25d, located in the outlet cavity 22, is connected at one end to the partition wall 20, and the other end extends along the second direction (i.e., the X-axis direction) toward the second side 12, providing a flow-diverting function for adjacent second openings 24a and 24b, which helps to equalize the flow rate of channels F1 and F2. The design of the flow distribution structures 25b and 25d helps to evenly distribute the flow of the parallel channels F1, F2 and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b and 9c arranged in a single direction.

[0087] Figure 15 This is to illustrate a third exemplary example of the flow distribution structure in the liquid cooling module of this case. In this embodiment, the structure of the base housing 2e is generally similar to... Figures 12 to 13 The base housing 2c shown uses the same component designations to represent the same components, structures, and functions, and will not be described again here. (Reference) Figure 6 , Figure 12 and Figure 13 , Figure 15 In this embodiment, the base housing 2e includes a flow-diverting structure 25e and a flow-diverting structure 25f. Both flow-diverting structures 25e and 25f are disposed in the inlet cavity 21 but are not connected to the partition wall 20. In this embodiment, both flow-diverting structures 25e and 25f are circular. Flow-diverting structure 25e is located on the centerline between two adjacent first openings 23a and 23b. Flow-diverting structure 25f is located on the centerline between two adjacent first openings 23b and 23c. In other embodiments, flow-diverting structure 25e may be disposed in the outlet cavity 22 and located on the centerline between two adjacent second openings 24a and 24b, or flow-diverting structure 25f may also be disposed in the outlet cavity 22 and located on the centerline between two adjacent second openings 24b and 24c. Of course, the arrangement of flow-diverting structures 25e and 25f can be adjusted according to actual application requirements, and this embodiment is not limited to this. The design of the flow distribution structures 25e and 25f helps to evenly distribute the flow of the parallel channels F1, F2, and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0088] Figure 16 This is to illustrate a fourth exemplary example of the flow distribution structure in the liquid cooling module of this case. In this embodiment, the structure of the base housing 2f is generally similar to... Figures 12 to 13 The base housing 2c shown uses the same component designations to represent the same components, structures, and functions, and will not be described again here. (Reference) Figure 6 ,Figure 12 and Figure 13 , Figure 16 In this embodiment, the base housing 2f includes a flow-diverting structure 25g and a flow-diverting structure 25h. Both flow-diverting structures 25g and 25h are disposed in the inlet cavity 21, but are not connected to the partition wall 20, and are only connected to the first surface 101 or the bottom cover 30. In this embodiment, both flow-diverting structures 25g and 25h are elongated strips, separated from the partition wall 20. Flow-diverting structure 25g extends along the centerline of two adjacent first openings 23a and 23b. Flow-diverting structure 25f extends along the centerline of two adjacent first openings 23b and 23c. In other words, both flow-diverting structures 25g and 25h extend along a second direction (i.e., the X-axis direction), perpendicular to the first direction. The arrangement of flow-diverting structures 25g and 25h in this invention helps to evenly distribute the flow of parallel channels F1, F2, and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. Of course, the 25g and 25h settings of the shunt structure can be adjusted according to actual application needs, and this case is not limited to this.

[0089] Figure 17 and Figure 18 This is a three-dimensional structural diagram illustrating the heat dissipation assembly structure of the fifth embodiment of this case. Figure 19 and Figure 20 This is an exploded view of the heat dissipation assembly structure of the fifth embodiment of this case. Figure 21 This is a schematic diagram illustrating the flow direction of the cooling fluid on the first surface of the liquid cooling module in the fifth embodiment of this case. Figure 22 This diagram illustrates the flow direction of the cooling fluid on the second surface of the liquid cooling module in the fifth embodiment of this case. In this embodiment, the heat dissipation assembly structure 1d and the liquid cooling module 3d are substantially similar in structure. Figures 12 to 13The heat dissipation assembly structure 1c and the liquid cooling module 3c shown are represented by the same component numbers, indicating the same components, structures, and functions, and will not be described again here. In this embodiment, the heat dissipation assembly structure 1d includes an elongated liquid cooling module 3d and at least two electronic devices 9a and 9b. The base housing 2g of the liquid cooling module 3d includes at least two shunt cavities 41a and 41b, at least two first ports 23a and 23b, at least two second ports 24a and 24b, and at least one shunt structure 25. It is worth noting that the shunt cavities 41a and 41b, the first ports 23a and 23b, and the second ports 24a and 24b are mutually corresponding, each having the same number, and the same number as the electronic devices 9a and 9b. In other embodiments, the number of each of the shunt cavities 41a and 41b, the first ports 23a and 23b, the second ports 24a and 24b, and the electronic devices 9a and 9b is M, where M is an integer and M ≥ 2. In other words, multiple flow-diverting cavities 41a, 41b, multiple first ports 23a, 23b, and multiple second ports 24a, 24b correspond to form M flow channels F1, F2, and the flow directions of the M flow channels F1, F2 are perpendicular to the first direction (i.e., the Y-axis direction). The number of flow-diverting structures 25 is N, where N is an integer, N≧1, and N+1=M is preferred.

[0090] In this embodiment, the flow-diverting structure 25 is disposed on the first surface 101, located in the inlet cavity 21 and connected to the partition wall 20, and is configured to provide flow-diverting function for any two adjacent first ports 23a and 23b. In other embodiments, the flow-diverting structure 25 is located in the inlet cavity 21 and the outlet cavity 22, or is separated from the partition wall 20, and is configured to provide flow-diverting function for any two adjacent first ports 23a and 23b or any two adjacent second ports 24a and 24b. Through the flow-diverting effect of the flow-diverting structure 25, multiple transverse flow channels F1 and F2 are connected in parallel between the inlet cavity 21 and the outlet cavity 22, so that there is an equal flow rate of cooling fluid, thereby dissipating heat from multiple electronic devices 9a and 9b respectively. Since the flow directions of the multiple transverse channels F1 and F2 are perpendicular to the extension directions of the first side 11 and the second side 12, the transverse channels F1 and F2 of the multiple flow-dividing cavities 41a and 41b can flow through the elongated base housing 2g via the shortest path, which helps to reduce the flow channel length and improve the uniform heat dissipation efficiency. Thus, the cooling fluid can enter the flow cavity 21 through the cooling channel inlet 31 adjacent to the third side 13. The flow-dividing structure 25 evenly distributes the multiple channels F1 and F2, ensuring that the electronic devices 9a and 9b in the corresponding multiple flow-dividing cavities 41a and 41b in the heat dissipation assembly structure 1d have similar heat dissipation conditions. This allows for the rapid and even removal of heat generated by the multiple electronic devices 9a and 9b, effectively improving the overall heat dissipation efficiency. Of course, the number of flow-dividing structures 25, corresponding to the number of flow-dividing cavities 41a and 41b, the first openings 23a and 23b, the second openings 24a and 24b, and the individual numbers of electronic devices 9a and 9b, can be adjusted according to actual application requirements. This case is not limited to this, and will not be elaborated further.

[0091] In summary, this invention provides a liquid cooling module and its applicable heat dissipation assembly structure. A flow-dividing structure is introduced into multiple parallel flow channels to effectively reduce the temperature difference between multiple electronic components and the resistance of the cooling fluid in the heat dissipation assembly structure. For the heat dissipation requirements of multiple electronic components arranged in a single direction, the liquid cooling module provides a parallel flow channel design in a long and narrow base housing. The top side of the base housing is divided into multiple flow-dividing chambers connected to the heat dissipation fins of multiple electronic components that are thermally coupled. The bottom side of the base housing is divided into inlet and outlet chambers by partition walls. The cooling fluid in the inlet chamber is evenly distributed through the flow-dividing structure and enters multiple flow-dividing chambers through multiple openings on adjacent long sides. Then, it converges into the outlet chamber through an opening on another long side to discharge the cooling fluid. Multiple flow-dividing chambers form multiple transverse flow channels corresponding to the openings on the two long sides. These transverse flow channels are connected in parallel between the inlet and outlet chambers and have equal flow rates of cooling fluid to dissipate heat from multiple electronic components. Because the flow direction of the multiple transverse channels is perpendicular to the extension direction of the long side, and is not designed to extend along the long side, but rather adopts a short-path design, the transverse channels of the multiple distribution chambers are located between the two opposite long sides of the narrow base shell, which helps to reduce the channel length and improve the uniform heat dissipation efficiency. Thus, the cooling channel inlet and outlet can be supplied with cooling fluid from different ends of the long side. Furthermore, the openings extending along the two opposite long sides and the distribution chambers connecting them have the same width. The multiple channels formed are uniformly distributed by at least one distribution structure, ensuring that the electronic devices in the corresponding distribution chambers of the heat dissipation assembly structure have similar heat dissipation conditions. This allows for the rapid and even removal of heat generated by multiple electronic devices, effectively improving the overall heat dissipation efficiency.

[0092] This case may be modified in various ways by those skilled in the art, but all of them shall not deviate from the protection sought in the claims.

Claims

1. A liquid cooling module, comprising: The base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, wherein the first side and the second side are disposed opposite to each other and extend along a first direction; as well as A bottom cover, spatially opposite to the first surface and connecting the first side, the second side, the third side, and the fourth side, wherein the base housing comprises: An inlet cavity is disposed between the first surface and the bottom cover; An outlet cavity is disposed between the first surface and the bottom cover; Multiple flow-diverting cavities are disposed on the second surface and are thermally coupled to multiple fins; A partition wall is disposed between the inlet cavity and the outlet cavity, and is connected between the first surface and the bottom cover; Multiple first ports are disposed adjacent to the first side, arranged along the first direction, and respectively connected between the inlet cavity and the multiple branch cavities; A plurality of second ports are disposed adjacent to the second side, arranged along the first direction, and respectively connected between the outlet cavity and the plurality of branch cavities, wherein the plurality of branch cavities correspond to the plurality of first ports near the first side and to the plurality of second ports near the second side; and At least one diversion structure is disposed on the bottom cover and protrudes toward the inlet cavity or the outlet cavity to provide a diversion function, wherein the cooling fluid enters the plurality of diversion cavities through the inlet cavity and the plurality of first ports respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the outlet cavity through the plurality of diversion cavities and the plurality of second ports respectively and is then discharged.

2. The liquid cooling module according to claim 1, wherein the liquid cooling module further comprises: A cooling channel inlet is provided through the bottom cover and communicates with the inlet cavity; as well as The cooling channel outlet is disposed through the bottom cover and connected to the outlet cavity.

3. The liquid cooling module according to claim 1, wherein the at least one flow splitting structure is circular and located on the midline of any two adjacent first ports or on the midline of any two adjacent second ports to provide flow splitting function.

4. The liquid cooling module according to claim 1, wherein the at least one flow splitting structure is elongated, separated from the partition wall, and extends along a second direction, the second direction being perpendicular to the first direction.

5. The liquid cooling module according to claim 1, wherein the at least one flow splitting structure is formed by the irregular bending of the partition wall.

6. The liquid cooling module according to claim 1, wherein the plurality of first ports and the plurality of second ports are all elongated holes extending along the first direction.

7. The liquid cooling module according to claim 1 further includes a top cover, the top cover having a top side and a bottom side opposite to each other, wherein the bottom side is connected to the first side, the second side, the third side, the fourth side and the second surface of the base housing to form the plurality of flow distribution cavities, the plurality of fins are accommodated in the plurality of flow distribution cavities and extend from the bottom side toward the second surface, and a heat dissipation surface is disposed on the top side and thermally coupled to the plurality of fins.

8. The liquid cooling module according to claim 1, wherein the plurality of flow distribution chambers, the plurality of first ports and the plurality of second ports are each equal in number, M, where M is an integer and M ≥ 2.

9. The liquid cooling module according to claim 8, wherein the plurality of flow distribution chambers, the plurality of first ports and the plurality of second ports correspondingly form M flow channels, and the flow direction of the M flow channels is perpendicular to the first direction.

10. A liquid cooling module, comprising: A base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, wherein the first side and the second side are disposed opposite to each other and extend along a first direction, and the base housing includes: The inlet cavity is located on the first surface; The outlet cavity is located on the first surface; Multiple flow-diverting cavities are disposed on the second surface and are thermally coupled to multiple fins; A partition wall is disposed between the inlet cavity and the outlet cavity; Multiple first ports are disposed adjacent to the first side, arranged along the first direction, and respectively connected between the inlet cavity and the multiple branch cavities; Multiple second ports are disposed adjacent to the second side, arranged along the first direction, and respectively connected between the outlet cavity and the multiple branch cavities, wherein the multiple branch cavities correspond to the multiple first ports near the first side and to the multiple second ports near the second side; as well as At least one flow-diverting structure is disposed on the first surface, located in the inlet cavity or the outlet cavity, or connected to the partition wall, to provide a flow-diverting function, wherein the cooling fluid enters the plurality of flow-diverting cavities through the inlet cavity and the plurality of first ports respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the outlet cavity through the plurality of flow-diverting cavities and the plurality of second ports respectively and is then discharged.

11. The liquid cooling module according to claim 10, further comprising: The cooling channel inlet is located adjacent to the third side and communicates with the inlet cavity; as well as The cooling channel outlet is located adjacent to the fourth side and is connected to the outlet cavity.

12. The liquid cooling module according to claim 11 further includes a bottom cover, the bottom cover being assembled with the first side, the second side, the third side, the fourth side and the first surface of the base housing, connecting the partition wall and forming the inlet cavity and the outlet cavity, the cooling channel inlet and the cooling channel outlet being disposed through the bottom cover.

13. The liquid cooling module according to claim 10, wherein one end of the at least one shunt structure is connected to the partition wall, and the other end extends along a second direction, the second direction being perpendicular to the first direction.

14. The liquid cooling module according to claim 10, wherein the at least one flow splitting structure is circular and located on the midline of any two adjacent first ports or on the midline of any two adjacent second ports to provide flow splitting function.

15. The liquid cooling module according to claim 10, wherein the at least one shunt structure is elongated, separated from the partition wall, and extends along a second direction, the second direction being perpendicular to the first direction.

16. The liquid cooling module of claim 10, wherein the at least one flow splitting structure is formed by the irregular bending of the spacer wall.

17. The liquid cooling module according to claim 10, wherein the plurality of first ports and the plurality of second ports are all elongated holes extending along the first direction.

18. The liquid cooling module according to claim 10 further includes a top cover having a top side and a bottom side opposite to each other, wherein the bottom side is connected to the first side, the second side, the third side, the fourth side and the second surface of the base housing to form the plurality of flow distribution cavities, the plurality of fins are accommodated in the plurality of flow distribution cavities and extend from the bottom side toward the second surface, and a heat dissipation surface is disposed on the top side and thermally coupled to the plurality of fins.

19. The liquid cooling module according to claim 10, wherein the plurality of flow distribution chambers, the plurality of first ports and the plurality of second ports are each equal in number, M, where M is an integer and M ≥ 2.

20. A heat dissipation assembly structure, comprising: A liquid cooling module includes a base housing and a bottom cover. The base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface. The first side and the second side are disposed opposite each other and extend along a first direction. The bottom cover is spatially opposite to the first surface and connects the first side, the second side, the third side, and the fourth side. The base housing includes: An inlet cavity is disposed between the first surface and the bottom cover; An outlet cavity is disposed between the first surface and the bottom cover; Multiple flow-diverting cavities are disposed on the second surface and are thermally coupled to multiple fins; A partition wall is disposed between the inlet cavity and the outlet cavity, and is connected between the first surface and the bottom cover; Multiple first ports are disposed adjacent to the first side, arranged along the first direction, and respectively connected between the inlet cavity and the multiple branch cavities; Multiple second ports are disposed adjacent to the second side, arranged along the first direction, and respectively connected between the outlet cavity and the multiple branch cavities, wherein the multiple branch cavities correspond to the multiple first ports near the first side and to the multiple second ports near the second side; as well as At least one diversion structure is disposed on the bottom cover or the first surface and protrudes toward the inlet cavity or the outlet cavity to provide a diversion function; and Multiple electronic devices are disposed on a heat dissipation surface, arranged along the first direction, and thermally coupled to the multiple fins. Cooling fluid enters the multiple distribution chambers through the inlet chamber and the multiple first ports, respectively, and exchanges heat with the multiple fins to dissipate heat from the multiple electronic devices. The cooling fluid then flows from the multiple distribution chambers through the multiple second ports to the outlet chamber.

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