Light-emitting module, vehicle lamp and motor vehicle
By combining a substrate layer, an insulating layer, a circuit layer, and a package, along with a dual-color injection molding process for the lens and housing, the risks of injection shrinkage and condensation are solved, enabling miniaturization and efficient heat dissipation of the light-emitting module, and reducing manufacturing difficulty and cost.
Patent Information
- Application Number
- CN202410593623.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-11-18
AI Technical Summary
Existing injection-molded light-emitting modules have risks of injection shrinkage and solidification, poor heat dissipation performance, and immature manufacturing processes.
It adopts a combined structure of substrate layer, insulating layer, circuit layer and package body, and is formed into one piece through TO packaging process. Combined with the lens and housing two-color injection molding process, it avoids injection shrinkage and condensation, and improves heat dissipation performance.
It simplifies manufacturing processes, reduces circuit board size, lowers costs, improves heat dissipation, and is suitable for integrated and modular applications.
Smart Images
Figure CN120981055A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a light-emitting module, a vehicle lamp comprising such a light-emitting module, and a motor vehicle employing such a vehicle lamp. BACKGROUND
[0002] At present, injection-molded light-emitting modules have been proposed, which comprise a circuit layer and a housing formed of an injection-molding material and injection-molded integrally with the circuit layer to water-tightly enclose a main body of the circuit layer. However, such light-emitting modules are at risk of injection-molding shrinkage and condensation, have suboptimal heat dissipation performance, and the manufacturing process is not yet mature. SUMMARY
[0003] The present application has been made to solve the above technical problems and other potential technical problems.
[0004] According to an aspect of the present application, a light-emitting module is provided. The light-emitting module comprises a substrate layer, an insulating layer disposed on the substrate layer, a circuit layer disposed on the insulating layer so as to sandwich at least a portion of the insulating layer between the circuit layer and the substrate layer, a plurality of pins extending from the circuit layer and electrically connected to the circuit layer, a light source disposed on the circuit layer or the substrate layer, an auxiliary device electrically connected to the light source and the pins, and an encapsulant encapsulating at least a portion of the substrate layer. By employing the technical solution of the present application, the following beneficial effects are achieved:
[0005] 1) The manufacturing process is simplified and improved, and the LED plastic holder and the lamp shell can be integrated in a transistor outline (TO) packaging process, thereby avoiding the risk of injection-molding shrinkage and condensation;
[0006] 2) The circuit board size is reduced, thereby making the light-emitting module smaller in volume and suitable for integrated and modular applications;
[0007] 3) The technology is mature and easy to manufacture, thereby reducing costs.
[0008] Optionally, the pin is electrically connected with the circuit layer by at least one of welding, bonding, wiring connection, lapping, splicing, crimping and clamping. Optionally, the package is formed by a TO packaging process from plastic or resin material and is integrated with the at least part of the circuit layer; the material forming the substrate layer comprises metal; the substrate layer, the insulating layer and the circuit layer together constitute an IMS board. Optionally, the package is arranged around the circuit layer and encapsulates at least part of the circuit layer. Optionally, the circuit layer is a copper (foil) substrate or an aluminum (foil) substrate, a ceramic substrate or an AMB copper clad ceramic substrate. By adopting the technical solution of the present application, appropriate circuit layer material can be selected according to actual needs.
[0009] Optionally, the auxiliary device comprises at least one of a driver IC, a capacitor, a resistor, a diode and a TVS. By adopting the technical solution of the present application, appropriate auxiliary device can be selected according to actual needs.
[0010] The light source comprises an unpackaged LED wafer or a packaged LED, and / or the LED is an RGB LED or a monochromatic LED capable of emitting red light, white light, blue light or yellow light. By adopting the technical solution of the present application, the light emitting module can have desired optical performance.
[0011] In particular, an outlight hole is arranged at a position opposite to the light source in the package, a lens is mounted in the outlight hole, and the lens is used for converging and shaping the light emitted by the light source. A protective glue is filled in the outlight hole between the light source and the lens. By adopting the technical solution of the present application, the light emitting module can have desired optical performance.
[0012] Optionally, the light emitting module further comprises a housing for accommodating at least part of both the package and the lens. The lens and the housing are formed into an integrated assembly by a two-color injection molding process; or the lens is first mounted to the housing, and then the combination of the lens and the housing is mounted to the package; or the lens is first mounted to the package, and then the housing is mounted to the combination of the lens and the package. By adopting the technical solution of the present application, the package and the housing can be formed respectively, thereby avoiding the risk of injection molding shrinkage and condensation.
[0013] Optionally, the housing has a fixing structure and / or a positioning structure, and the fixing structure comprises a buckle structure, a hot riveting structure, a lock screw structure and the like.
[0014] According to another aspect of the present application, a vehicle lamp is provided. The vehicle lamp comprises the light emitting module according to the previous aspect; and a light guide connected to the light emitting module to guide the light rays emitted by the light emitting module. By employing the technical solution of the present application, the light emitting module is applied to the vehicle lamp, so that the vehicle lamp obtains all the beneficial effects of the light emitting module of the present application.
[0015] According to another aspect of the present application, a motor vehicle is provided. The motor vehicle comprises the vehicle lamp according to the previous aspect, which is used as an ambient light or a signal light. By employing the technical solution of the present application, the light emitting module is applied to the motor vehicle, so that the motor vehicle obtains all the beneficial effects of the light emitting module of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0016] For the purpose of facilitating the understanding of the present application, the present application is described in more detail below based on exemplary embodiments and in conjunction with the drawings. The same or similar reference signs are used to represent the same or similar components in the drawings. It should be understood that the drawings are merely schematic, and the sizes and proportions of the components in the drawings are not necessarily accurate.
[0017] FIG. 1A and FIG. 1B is a perspective view of the light emitting module according to the first embodiment of the present application.
[0018] FIG. 1C is FIG. 1A and FIG. 1B is a front view of the light emitting module shown in
[0019] FIG. 1D is a sectional view taken along the section plane C-C in FIG. 1C
[0020] FIG. 2 shows the manufacturing steps of the light emitting module as shown in FIGS. 1A-1D
[0021] FIG. 3A is a perspective view of the assembly formed in step (B) in FIG. 2
[0022] FIG. 3B is a magnified view of the area A in FIG. 3A
[0023] FIG. 4 is a perspective view of the light emitting module according to the second embodiment of the present application.
[0024] FIG. 5 is a perspective view of the light emitting module according to the third embodiment of the present application.
[0025] FIG. 6 is a perspective view of a light emitting module according to a fourth embodiment of the present application. DETAILED DESCRIPTION
[0026] FIG. 1A and FIG. 1B is a perspective view of a light emitting module according to a first embodiment of the present application. FIG. 1C is FIG. 1A and FIG. 1B is a front view of a light emitting module shown in FIG. 1D is a sectional view taken along the section plane C-C in FIG. 1C FIG. 2 shows manufacturing steps of a light emitting module shown in FIGS. 1A-1D FIG. 3A is a perspective view of an assembly formed in step (B) in FIG. 2 FIG. 3B is an enlarged view of the area A in FIG. 3A
[0027] As shown in FIGS. 1A-3B A light emitting module 100 according to a first embodiment of the present application mainly includes a substrate layer 101, an insulating layer 104, a circuit layer 103, a plurality of pins (102a, 102b, 102c, 102d), a light source 109, an auxiliary device 111, a package 107, and a housing 119.
[0028] The substrate layer 101 can be a generally sheet-like member made of an appropriate metal (e.g., copper or aluminum) or an alloy. In this way, heat generated by the circuit layer 103 and the auxiliary device 111 mounted on the circuit layer 103 can be easily transferred to the substrate layer 101, and then directly dissipated to the ambient environment, and the thermal resistance is small, thereby improving the heat dissipation performance of the light emitting module 100.
[0029] The insulating layer 104 is provided on the front surface of the substrate layer 101. The circuit layer 103 is provided on the insulating layer 104, so that at least a part of the insulating layer 104 is interposed between the circuit layer 103 and the substrate layer 101. The back surface of the main body of the circuit layer 103 is exposed from the package 107, so that the heat dissipation performance can be improved. Specifically, the assembly of the substrate layer 101, the insulating layer 104, and the circuit layer 103 can be an IMS board formed by an IMS process. The circuit layer 103 can be a substrate such as a copper (foil) substrate or an aluminum (foil) substrate which is formed independently with respect to the substrate layer 101. The circuit layer 103 can be adhered to the substrate layer 101 by means of an adhesive (e.g., an adhesive having adhesiveness and additionally having thermal conductivity), or soldered to the substrate layer 101 by a surface mount technology (SMT).
[0030] The circuit layer 103 can also be formed directly on the substrate layer 101 by etching and / or cutting processes. In this way, the use of a separately formed circuit layer 103 can be avoided, thereby further improving the overall integrity and integration of the light emitting module.
[0031] The circuit layer 103 is provided with a circuit. The light source 109 can be provided on the circuit layer 103 or the substrate layer 101 and electrically connected to the circuit by a wire (e.g. a gold wire) 112, as shown in FIG. 3B In the present embodiment, the light source 109 comprises unpackaged RGB LED chips 109R, 109G and 109B capable of emitting red, green and blue light respectively. In other embodiments, the light source 109 can comprise unpackaged single color LED chips or packaged LEDs (described later).
[0032] In addition, at least one of a driver IC, a capacitor, a resistor, a diode and a TVS can be provided on the circuit layer 103, depending on the arrangement of the circuit. For example, the driver IC can control the light emission of the LEDs in the light source 109 and the capacitor can be used for filtering. These devices work in conjunction with the light source 109 to achieve control of the light emission of the light source 109 and are therefore collectively referred to as auxiliary devices 111. In some embodiments, however, the driver IC can be integrated with the LED chips, which are referred to as smart LEDs. Some of these auxiliary devices can generate heat during use, and it will be appreciated that the light source 109 can also generate some heat. It will be appreciated that the arrangement of the circuit can be adapted to suit the actual application, for example, the LEDs can be provided with or externally connected to a driver IC, and the present application does not specifically limit the specific circuit configuration in the light emitting module.
[0033] The pins 102a, 102b, 102c, 102d (hereinafter collectively referred to as pins 102 or pins 102 (a, b, c, d)) extend from the circuit layer 103 and are electrically connected to the circuit on the circuit layer 103. These pins can be electrically connected to the circuit layer 103 by means such as soldering, bonding, wire connection, lapping, splicing, crimping or clamping.
[0034] The encapsulation 107 is disposed around the circuit layer 103 and encloses at least a portion of the circuit layer 103. The encapsulation 107 can be formed by a TO packaging process from a plastic or resin material and is integral with at least a portion of the circuit layer 103. An outlight hole 115 is provided in the encapsulation 107 opposite the light source 109, in which a lens 105 is mounted for converging and shaping the light emitted by the light source 109. The lens 105 can be a dichroic lens. Preferably, a protective glue (e.g. protective silicon glue) 117 is filled in the outlight hole 115 before the lens 105 is mounted in the outlight hole 115, so as to protect the light source 109, especially when the light source 109 comprises an unpackaged LED wafer, the protective glue 117 can effectively avoid the light source 109 from being contaminated by subsequent processes. The protective glue 117 can be transparent, or fluorescent powder can be mixed in the transparent protective glue, which can be selected according to the color of the LED. In the case where the light source 109 adopts a packaged LED, the protective glue 117 can also not be filled.
[0035] The shell 119 is used to accommodate at least a portion of both the encapsulation 107 and the lens 105. Although not explicitly shown, the shell 119 can have a fixing structure and / or a positioning structure, the fixing structure comprising one or more of a snap structure, a hot riveting structure, a locking screw structure. In another example, the shell 119 can also be fixed to the encapsulation 107 by an adhesive or the like. In this way, the shell 119 can be accurately and firmly mounted to the encapsulation 107. The shell 119 also has a fixing structure on it to fix the shell 119 to the heat sink, so as to accurately and firmly mount the light emitting module to the heat sink, ensuring the optical precision and heat dissipation performance of the light emitting module.
[0036] Next, mainly referring to FIG. 2 the manufacturing steps of the light emitting module 100 are described.
[0037] First, as shown in step (A) in FIG. 2 , a substrate layer 101 in the form of a sheet is provided. Then, the insulating layer 104 and the circuit layer 103 are sequentially mounted to the substrate layer 101. An adhesive can be coated between the bonding surfaces of the insulating layer 104 and the substrate layer 101, and between the bonding surfaces of the circuit layer 103 and the insulating layer 104, to bond the insulating layer 104 and the circuit layer 103 to the substrate layer 101. Of course, the circuit layer 103 can also be soldered to the substrate layer 101 by SMT. When the substrate layer 101 is an IMS board, the circuit layer 103 can also be directly formed on the substrate layer 101 by etching and / or cutting processes.
[0038] Then, as shown in step (B) in FIG. 2As shown in step (B) of FIG. 1, the plurality of pins 102a, 102b, 102c, 102d are electrically connected to the main body of the circuit layer 103 by means such as soldering, adhesion, wiring connection, lapping, splicing, crimping, or clamping.
[0039] In addition, light sources 109, such as LEDs, and auxiliary devices 111, such as driver ICs, capacitors, resistors, diodes, TVS, etc., are mounted on the circuit layer 103. The pins of the light sources 109, including RGB LED dies 109R, 109G, and 109B, see FIG. 2, are connected to the circuit on the circuit layer 103 by means of wires 112. The wires 112 are optionally gold or aluminum wires. Aluminum wires are less expensive, while gold wires are thinner. FIG. 3A and FIG. 3B
[0040] Then, as shown in step (C) of FIG. 1, a package 107 is formed by a TO packaging process using a plastic or resin material, such that the package 107 encloses and is integral with at least a portion of the circuit layer 103. As mentioned previously, an outlight hole 115 is reserved in the package 107 at a position opposite the light sources 109. FIG. 2
[0041] Then, as shown in step (D) of FIG. 1, a protective glue (e.g., protective silicone) 117 is filled in the outlight hole 115 to protect the light sources 109. In the case where the light sources 109 are packaged LEDs, the protective glue 117 can be omitted, i.e., the step can be skipped. FIG. 2
[0042] Then, as shown in step (E) of FIG. 1, the lens 105 is mounted (e.g., adhered) into the outlight hole 115. FIG. 2
[0043] Finally, as shown in step (F) of FIG. 1, a housing 119 is provided. The housing 119 is shaped to match the outer shape of the package 107. A recess 120 is pre-set in the housing 119 to accommodate the lens 105. The housing 119 is fitted onto the package 107, thereby forming the light emitting module 100. FIG. 2
[0044] It should be understood that the above steps are not limiting. For example, in steps (E) and (F) of FIG. 1, the lens 105 and the housing 119 can be formed as an integral assembly by a two-color injection molding process, and then the assembly is mounted onto the package 107, thereby forming the light emitting module 100. Alternatively, the lens 105 can be first mounted onto the housing 119 to form an assembly, and then the assembly is mounted onto the package 107, thereby forming the light emitting module 100. FIG. 2 It should be understood that the above steps are not limiting. For example, in steps (E) and (F) of FIG. 1, the lens 105 and the housing 119 can be formed as an integral assembly by a two-color injection molding process, and then the assembly is mounted onto the package 107, thereby forming the light emitting module 100. Alternatively, the lens 105 can be first mounted onto the housing 119 to form an assembly, and then the assembly is mounted onto the package 107, thereby forming the light emitting module 100.
[0045] FIG. 4 is a perspective view of a light emitting module according to a second embodiment of the present application. FIG. 5 is a perspective view of a light emitting module according to a third embodiment of the present application. FIG. 6 is a perspective view of a light emitting module according to a fourth embodiment of the present application.
[0046] As shown in FIG. 4 , FIG. 5 and FIG. 6 , the light emitting modules according to the second, third and fourth embodiments of the present application are basically the same as the light emitting module 100 according to the first embodiment of the present application described above, and the difference between them mainly lies in that:
[0047] FIG. 4 The light emitting module according to the second embodiment of the present application shown inadopts an un-encapsulated monochromatic LED chip. The monochromatic LED chip only includes one of an LED chip capable of emitting white light, an LED chip capable of emitting amber (i.e. yellow) light, or an LED chip 109R capable of emitting red light.
[0048] Compared with the light emitting module according to the second embodiment of the present application shown in, FIG. 4 the light emitting module according to the third embodiment of the present application shown in is provided with an opening 110 in the insulating layer 104 and the circuit layer 103, so that the substrate layer 101 is exposed via the opening 110, thereby allowing the light source 109 (specifically, the LED chip 109R) to be directly mounted on the substrate layer 101 via the opening 110, instead of being mounted on the circuit layer 103 as shown in . FIG. 5 Thus, in the light emitting module according to the third embodiment of the present application shown in , the heat generated by the light source 109 (specifically, the LED chip 109R) can be more efficiently transferred into the substrate layer 101, thereby improving the heat dissipation performance. FIG. 4 FIG. 5 It can thus be conceived that other electronic components (e.g. IC chips) with large heat generation can also be directly provided on the substrate layer 101 via the opening in the insulating layer 104 and the circuit layer 103, and electrically connected with the circuit layer 103 by gold wires. In this way, the heat dissipation performance of the electronic components can be improved while maintaining the electrical functions of the electronic components.
[0049]
[0050] FIG. 6 The light emitting module according to the fourth embodiment of the present application shown in adopts an encapsulated LED 109W. In this case, as mentioned above, no protective glue can be filled in the light emitting hole between the light source (i.e. the LED 109W) and the lens 105.
[0051] In addition, it is understood that FIG. 4 , FIG. 5 and FIG. 6 The arrangement of the circuit on the light emitting module shown in Figs. 1 to 3 is adapted to the actual application.
[0052] The present application also provides a vehicle lamp comprising the light emitting module 100 described in the foregoing and a light guide. The light guide is connected to the light emitting module 100 to guide the light emitted by the light emitting module 100.
[0053] The present application also provides a motor vehicle comprising the vehicle lamp according to the present application described in the foregoing, which can be used as an ambient light or a signal light, such as a tail light, a turn signal light, a position light, a grille light, etc.
[0054] Although the technical objects, technical solutions and technical effects of the present application have been described in detail above with reference to specific embodiments, it should be understood that the above-described embodiments are only exemplary but not limiting. Any modification, equivalent replacement, improvement made by those skilled in the art within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A light-emitting module (100), characterized in that, include: Substrate layer (101); An insulating layer (104) is disposed on the substrate layer; A circuit layer (103) is disposed on the insulating layer, thereby sandwiching at least a portion of the insulating layer between the circuit layer and the substrate layer; Multiple pins (102a, 102b, 102c, 102d) extend from the circuit layer and are electrically connected to the circuit layer; A light source (109), wherein the light source is disposed on the circuit layer or the substrate layer; and Encapsulation (107) encapsulates at least a portion of the substrate layer.
2. The light-emitting module according to claim 1, wherein, The pins are electrically connected to the circuit layer by at least one of the following methods: soldering, bonding, wiring, overlapping, splicing, crimping, and snap-fitting.
3. The light-emitting module according to claim 1, wherein, The package is formed from plastic or resin material using a TO encapsulation process and is integrally formed with at least a portion of the circuit layer; The material forming the substrate layer includes metal, and The substrate layer, the insulating layer, and the circuit layer together constitute the IMS board.
4. The light-emitting module according to claim 1, wherein, The package is disposed around the circuit layer and encapsulates at least a portion of the circuit layer.
5. The light-emitting module according to claim 1, wherein, The circuit layer is a copper substrate, an aluminum substrate, a ceramic substrate, or an AMB copper-clad ceramic substrate.
6. The light-emitting module according to claim 1, wherein, The light-emitting module further includes an auxiliary device (111), which is electrically connected to the light source and the pin. The auxiliary device includes at least one of a driver IC, a capacitor, a resistor, a diode, and a TVS.
7. The light-emitting module according to claim 1, wherein, The light source includes unpackaged LED chips or packaged LEDs, and / or The LED is an RGB LED or a monochrome LED, and the monochrome LED can emit red, white, blue or yellow light.
8. The light-emitting module according to any one of claims 1 to 7, wherein, A light-emitting aperture (115) is provided in the package body at a position opposite to the light source, and a lens (105) is installed in the light-emitting aperture. The lens is used to converge and shape the light emitted by the light source. Protective adhesive is applied to the light-emitting hole between the light source and the lens.
9. The light-emitting module according to claim 8, wherein, The light-emitting module further includes a housing (119) for accommodating at least a portion of both the package and the lens. The lens and the housing are formed into a single assembly using a two-color injection molding process; or The lens is first mounted onto the housing, and then the assembly of the lens and the housing is mounted onto the package; or The lens is first mounted onto the package, and then the housing is mounted onto the assembly of the lens and the package.
10. The light-emitting module according to claim 9, wherein, The housing has a fixing structure and / or a positioning structure, wherein the fixing structure includes one or more of the following: a snap-fit structure, a hot riveting structure, and a screw-locking structure.
11. A type of vehicle light, wherein, The vehicle headlight includes: a light-emitting module according to any one of the preceding claims.
12. A motor vehicle, wherein, The motor vehicle includes the headlights according to claim 11.