Display panel and preparation method thereof

Abstract

The invention provides a display panel and a preparation method thereof. The display panel comprises a driving substrate, a pixel unit, a first transparent packaging layer and a shielding layer. The pixel units are arranged on the driving substrate in an array mode and comprise a plurality of light-emitting diodes arranged at intervals. The first transparent packaging layer is located between the adjacent light-emitting diodes and at least covers the side walls of the light-emitting diodes. The shielding layer is located on the side, away from the driving substrate, of the first transparent packaging layer and located in the area between the adjacent pixel units. Wherein the light emitting diode comprises a first surface deviating from the driving substrate, the shielding layer comprises a second surface connected with the first transparent packaging layer, and the second surface is higher than or flush with the first surface. The shielding layer is located in the area between the adjacent pixel units, so that the exposed bottom color of the driving substrate can be shielded, and the bottom color consistency of the driving substrate is improved. And as the shielding layers are not filled in the gaps among the pixel units, the problem of ink climbing does not exist, and the luminance is not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a preparation method thereof. BACKGROUND

[0002] In recent years, the Mini Light Emitting Diode (MiniLED) display screen has developed rapidly. Various packaging technologies have emerged one after another. However, the color difference between the modules of the MiniLED display screen cannot be completely solved. The color difference is mainly caused by the driving substrate used by each display module, such as the color difference of the Printed Circuit Board (PCB). On the other hand, since the Light Emitting Diode (LED) chip needs to be welded on the PCB by soldering, a strong reflective solder pin will be formed at both ends of the LED chip, and the solder pin is relatively large compared with the size of the LED chip, which will greatly reduce the contrast of the LED display screen.

[0003] In order to solve the above problems, the industry has proposed various solutions, such as filling a black film layer in the gap between the LEDs, but this is easy to cause the ink to climb up the side wall of the LED, and the degree of ink climbing is inconsistent, thereby causing inconsistent display when viewed from the side angle. Another compression process is to compress a black adhesive film into the gap between the LEDs, but the black adhesive film is easy to remain on the upper surface of the LED, thereby causing a loss of brightness.

[0004] Therefore, it is an urgent problem to be solved to improve the color consistency of the driving substrate and solve the above problems of inconsistent ink climbing degree and brightness loss. SUMMARY

[0005] The purpose of the present application is to provide a display panel and a preparation method thereof, aiming to improve the color consistency of the driving substrate.

[0006] The display panel provided by the present application is characterized in that it comprises a driving substrate, a pixel unit arranged in an array on the driving substrate and comprising a plurality of spaced-apart light emitting diodes, a first transparent encapsulation layer located between adjacent light emitting diodes and covering at least the side wall of the light emitting diode, and a shielding layer located on the side of the first transparent encapsulation layer away from the driving substrate and located in the area between adjacent pixel units. The light emitting diode comprises a first surface away from the driving substrate, and the shielding layer comprises a second surface connected to the first transparent encapsulation layer, which is higher than or flush with the first surface.

[0007] In some embodiments, the first transparent encapsulation layer comprises a first encapsulation part and a second encapsulation part, the first encapsulation part is located between adjacent pixel units and arranged around the sidewall of each pixel unit, and the second encapsulation part is located between adjacent light emitting diodes in one pixel unit; the projection of the shielding layer on the driving substrate is located in the projection range of the first encapsulation part on the driving substrate.

[0008] In some embodiments, the thickness of the first transparent encapsulation layer is greater than or equal to the thickness of the light emitting diode.

[0009] In some embodiments, the thickness of the shielding layer is less than or equal to 20 microns.

[0010] In some embodiments, when the thickness of the first transparent encapsulation layer is equal to the thickness of the light emitting diode; the first surface is flush with the second surface, and the first surface is connected with the second surface; when the thickness of the first transparent encapsulation layer is greater than the thickness of the light emitting diode, the second surface is higher than the first surface.

[0011] In some embodiments, further comprising: a second transparent encapsulation layer located on the side of the first transparent encapsulation layer away from the substrate and covering the surface of the shielding layer; the shielding layer comprises a third surface away from the driving substrate, and the second transparent encapsulation layer comprises a fourth surface away from the driving substrate, and the fourth surface is higher than or flush with the third surface of the shielding layer.

[0012] In some embodiments, the fourth surface of the second transparent encapsulation layer is a matte surface.

[0013] In some embodiments, the material of the shielding layer comprises black ink, and the optical density value of the black ink is greater than or equal to 3.

[0014] Embodiments of the present application also provide a preparation method of a display panel, comprising: providing a driving substrate; forming arrayed pixel units on the driving substrate, the pixel units comprising a plurality of spaced light emitting diodes; forming a first transparent encapsulation layer between adjacent light emitting diodes, the first transparent encapsulation layer covering at least the sidewall of the light emitting diode; forming a shielding layer on the side of the first transparent encapsulation layer away from the driving substrate, the shielding layer being located in the region between adjacent pixel units, the light emitting diode comprising a first surface away from the driving substrate, the shielding layer comprising a second surface connected with the first transparent encapsulation layer, and the second surface being higher than or flush with the first surface.

[0015] In some embodiments, the first transparent encapsulation layer comprises a first encapsulation portion, the first encapsulation portion is arranged between adjacent pixel units and around the sidewalls of each pixel unit; the method for forming the shielding layer comprises: forming the light shielding layer on the surface of the first encapsulation portion by using a process of spraying and curing at the same time.

[0016] In the display panel provided by the embodiments of the present application, the first transparent encapsulation layer is formed between adjacent light emitting diodes to encapsulate the pixel units, and the shielding layer is formed on the first transparent encapsulation layer. Since the shielding layer is located in the region between adjacent pixel units, the base color of the driving substrate exposed can be covered, so that the base color consistency of the driving substrate is improved. Since the second surface of the shielding layer is higher than or flush with the first surface of the light emitting diode, instead of being filled in the gap between the pixel units, there is no problem of ink climbing, and the first surface of the light emitting diode is not affected by the residual shielding layer material, so that the luminous brightness is not affected. Moreover, compared with forming the shielding layer in the region between adjacent light emitting diodes, forming the shielding layer only in the region between pixel units can reduce the precision of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0017] The technical solutions and other beneficial effects of the present application will become apparent from the following detailed description of the specific embodiments of the present application, combined with the accompanying drawings.

[0018] Figure 1 is a schematic diagram of the cross-sectional structure of the display panel provided by the embodiments of the present application; Figure 2 is Figure 1 is a schematic diagram of the top view structure of the display panel in the embodiment;

[0019] Figure 3 is Figure 1 is a schematic diagram of the top view structure of the pixel unit, the soldering leg and the driving substrate in the display panel;

[0020] Figure 4 is Figure 3 is a schematic diagram of the cross-sectional structure of the display panel along A-A1 in the embodiment.

[0021] Figure 5 is a schematic diagram of the cross-sectional structure of the display panel provided by some embodiments of the present application;

[0022] Figure 6 is Figure 5 is a schematic diagram of the top view structure of the first transparent encapsulation layer, the pixel unit and the shielding layer in the display panel in the embodiment;

[0023] Figure 7 is a schematic diagram of the flow of the preparation method of the display panel provided by some embodiments of the present application;

[0024] Figures 8-12 is a schematic diagram of the structure of the display panel in the preparation process.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] 100, display panel;

[0027] 10, driving substrate;

[0028] 20, pixel unit; 21, light emitting diode; 21R, red light emitting diode; 21G, green light emitting diode; 21B, blue light emitting diode; 211, first surface; 21a, pin; 211a, protrusion;

[0029] 30, first transparent encapsulation layer; 31, first encapsulation part; 32, second encapsulation part;

[0030] 40, shielding layer; 41, second surface; 42, third surface

[0031] 50, second transparent encapsulation layer; 51, fourth surface. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0033] In the description of the present application, it should be understood that the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0034] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "above" and "on" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of the specific examples are described. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application can repeatedly refer to reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or arrangements being discussed. In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0036] In one embodiment, a black film layer can be filled in the gap between the LEDs to cover the PCB ink color (i.e. the base color), which can improve the ink color consistency to some extent to improve the contrast. However, due to the concern that the ink / glue sprayed under the action of capillary will climb up the sidewall of the LED chip, and the degree of climbing ink / glue is inconsistent, which will lead to inconsistent display when viewed from the side angle. To avoid this phenomenon, a certain distance needs to be maintained from the chip during spraying, so that the primer ink or primer glue does not come into contact with the LED chip, which cannot completely cover the LED chip pin and expose part of the PCB base color, so it cannot completely cover the ink color difference, and the improvement of contrast is also limited.

[0037] In one embodiment, a "double bonding" packaging process can also be used, that is, a certain black glue film is first bonded on the LED display module by pressing, and then a layer of glue film with high light transmittance is bonded. The black glue film on the surface of the chip becomes thin because of the height difference between the LED chip and the driving substrate during bonding. This method avoids the problem of climbing glue of the primer ink / glue, but the thin black glue film remaining on the surface of the LED has a certain loss of brightness, so the black glue film cannot be completely opaque, otherwise the light transmittance of the LED display module will be greatly reduced, which cannot completely cover the PCB ink color difference and block the pin reflection.

[0038] In one embodiment, a layer of black semi-transparent protective film is bonded on the packaged LED display module, but this process cannot completely improve the problem of ink color consistency at the expense of a large amount of brightness.

[0039] Based on this, the display panel provided in the embodiments of the present application comprises a driving substrate, pixel units arranged in an array on the driving substrate and comprising a plurality of light-emitting diodes arranged at intervals, a first transparent encapsulation layer located between adjacent light-emitting diodes and covering at least the sidewalls of the light-emitting diodes, and a shielding layer located on the side of the first transparent encapsulation layer away from the driving substrate and located in the region between adjacent pixel units, wherein the light-emitting diodes comprise a first surface away from the driving substrate, and the shielding layer comprises a second surface connected to the first transparent encapsulation layer, the second surface being higher than or flush with the first surface.

[0040] The first transparent encapsulation layer is formed between adjacent light-emitting diodes to achieve encapsulation of the pixel units, and the shielding layer is formed on the first transparent encapsulation layer. Since the shielding layer is located in the region between adjacent pixel units, the base color of the driving substrate exposed can be covered, thereby improving the base color consistency of the driving substrate and improving the contrast ratio. Since the second surface of the shielding layer is higher than or flush with the first surface of the light-emitting diode, rather than being filled in the gap between the pixel units, there is no problem of ink bleeding, the first surface of the light-emitting diode is not affected by the residual shielding layer material, and there is no problem of brightness sacrifice and inability to completely improve the base color consistency caused by the use of a black translucent film layer. Moreover, compared with forming the shielding layer in the region between adjacent light-emitting diodes, forming the shielding layer in the region between pixel units can reduce the precision of the equipment.

[0041] The structure of the display panel provided in the embodiments of the present application is described below with reference to the accompanying drawings.

[0042] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the cross-sectional structure of the display panel provided in the embodiments of the present application, Figure 2 is Figure 1 a schematic diagram of the top view structure of the display panel.

[0043] The display panel 100 comprises a driving substrate 10, pixel units 20, a first transparent encapsulation layer 30, and a shielding layer 40. The pixel units 20 are arranged in an array on the driving substrate 10 and comprise a plurality of light-emitting diodes 21 arranged at intervals. The first transparent encapsulation layer 30 is located between adjacent light-emitting diodes 21 and covers at least the sidewalls of the light-emitting diodes 21. The shielding layer 40 is located on the side of the first transparent encapsulation layer 30 away from the driving substrate 10 and is located in the region between adjacent pixel units 20. The light-emitting diodes 21 comprise a first surface 211 away from the driving substrate 10, and the shielding layer 40 comprises a second surface 41 connected to the first transparent encapsulation layer 30, the second surface 41 being higher than or flush with the first surface 211.

[0044] The driving substrate 10 can include a printed circuit board for driving the light emitting diodes 21 to emit light.

[0045] The pixel unit 20 can include light emitting diodes 21 of multiple colors, for example, one pixel unit 20 can include a red light emitting diode 21R, a green light emitting diode 21G and a blue light emitting diode 21B. Compared with forming the shielding layer 40 between adjacent light emitting diodes 21, in the embodiment of the present application, since the area of the pixel unit 20 is larger than the area of the light emitting diode 21, when the shielding layer 40 is formed above the interval between adjacent pixel units 20, the opening area of the shielding layer 40 is larger, and the precision requirement of the spraying is smaller, so the equipment precision and the process difficulty can be reduced.

[0046] In some embodiments, the interval L2 between two adjacent pixel units 20 is larger than the interval L1 between adjacent light emitting diodes 21 in one pixel unit 20. Therefore, forming the shielding layer 40 above the region of the interval between the pixel units 20 with larger interval can further reduce the equipment precision and the process difficulty. Moreover, since the interval between adjacent light emitting diodes 21 is very small, the exposed bottom color of the driving substrate 10 between them can be basically ignored.

[0047] In other embodiments, the shielding layer 40 can also be arranged around a single light emitting diode 21, or around 2, 3 or 4 light emitting diodes 21.

[0048] In some embodiments, the first transparent encapsulation layer 30 includes a first encapsulation part 31 and a second encapsulation part 32, the first encapsulation part 31 is arranged between adjacent pixel units 20 and around the side wall of each pixel unit 20, and the second encapsulation part 32 is arranged between adjacent light emitting diodes 21 in one pixel unit 20. That is, the first transparent encapsulation layer 30 fills the interval between all light emitting diodes 21.

[0049] The orthographic projection of the shielding layer 40 on the driving substrate 10 can be located within the range of the orthographic projection of the first encapsulation part 31 on the driving substrate 10. In other words, the shielding layer 40 is located on the first encapsulation part 31, so as to shield the interval between adjacent pixel units 20.

[0050] The material of the shielding layer 40 can include black ink, and the optical density value of the black ink is greater than or equal to 3, so as to enhance the shielding effect and better shield the bottom color of the driving substrate 10.

[0051] In some embodiments, as shown in Figure 1 The shielding layer 40 can completely overlap with the first encapsulation part 31, that is, the projection overlap, so as to achieve complete shielding. As shown inFigure 2 As shown, the shielding layer 40 is connected with the edge of the pixel unit 20.

[0052] In some embodiments, the area of the shielding layer 40 can also be smaller than the area of the first encapsulation part 31, so that the shielding layer 40 has a certain distance from the edge of the first encapsulation part 31, which can reduce the precision requirement and avoid the process error causing the shielding layer 40 to shield the first surface 211 of the light-emitting diode 21.

[0053] The first transparent encapsulation layer 30 can just cover the entire sidewall of the light-emitting diode 21, and can further cover the upper surface (i.e. the first surface 211) of the light-emitting diode 21. Since the first transparent encapsulation layer 30 is transparent, whether the first transparent encapsulation layer 30 covers the upper surface (i.e. the first surface 211) of the light-emitting diode 21 or not, it will not affect the luminous brightness of the light-emitting diode 21.

[0054] In other words, the thickness of the first transparent encapsulation layer 30 is greater than or equal to the thickness of the light-emitting diode 21. When the thickness of the first transparent encapsulation layer 30 is equal to the thickness of the light-emitting diode 21, the first transparent encapsulation layer 30 only covers the sidewall of the light-emitting diode 21. When the thickness of the first transparent encapsulation layer 30 is greater than the thickness of the light-emitting diode 21, the first encapsulation layer also covers the first surface 211 of the light-emitting diode 21, and the upper surface of the first transparent encapsulation layer 30 is higher than the first surface 211, so that the second surface 41 of the shielding layer 40 is higher than the first surface 211.

[0055] In some embodiments, the thickness H1 of the first transparent encapsulation layer 30 is greater than the thickness H2 of the light-emitting diode 21, and the first transparent encapsulation layer 30 covers the first surface 211 of the light-emitting diode 21. In this case, the upper surface of the first transparent encapsulation layer 30 is higher than the first surface 211 of the light-emitting diode 21, and the second surface 41 of the shielding layer 40 is higher than the first surface 211 of the light-emitting diode 21. Figure 1 In some embodiments, the thickness H1 of the first transparent encapsulation layer 30 is equal to the thickness H2 of the light-emitting diode 21, and the first transparent encapsulation layer 30 just covers the sidewall of the light-emitting diode 21. In this case, the upper surface of the first transparent encapsulation layer 30 is flush with the first surface 211 of the light-emitting diode 21, and since the upper surface of the first transparent encapsulation layer 30 is connected with the second surface 41 of the shielding layer 40, the first surface 211 of the light-emitting diode 21 is flush with the second surface 41 of the shielding layer 40, and the first surface 211 is connected with the second surface 41. In this way, the shielding layer 40 can completely cover the gap between the pixel units 20, and will not cause side light leakage, so that the display tends to be consistent when viewed from the side view angle, and the bottom color of the driving substrate 10 will not be seen from the side view angle, so that the consistency of the bottom color of the driving substrate 10 is improved.

[0056] In some embodiments, since the shielding layer 40 is located above the light-emitting diode 21 (not directly above), the thickness of the shielding layer 40 can be less than or equal to 20 microns, which can reduce the influence of the shielding layer 40 on the light-emitting diode 21 in the side view angle direction, thereby reducing the influence on the visual angle.

[0057] Please refer toFigure 3 and Figure 4 , Figure 3 is Figure 1 a schematic view of a top structure of a pixel unit, a soldering leg and a driving substrate in a display panel, Figure 4 is Figure 3 a schematic view of a cross-sectional structure of the display panel along A-A1 in Figure 3 only three light emitting diodes 21 in one pixel unit 20 are shown to be soldered with the driving substrate 10 through the soldering legs 21a, and the encapsulation layer 30 and the shielding layer 40 are not shown to display the positions of the soldering legs 21a and the diodes 21. Figure 4 The shielding layer 40 is shown to display that the shielding layer 40 covers the soldering legs 21a.

[0058] As shown in Figure 3 , three light emitting diodes 21 in one pixel unit 20 are arranged along a first direction X, and the first direction X is parallel to the surface of the driving substrate 10. The soldering legs 21a are located between the driving substrate 10 and the light emitting diodes 21, each light emitting diode 21 has two soldering legs 21a, and the two soldering legs 21a are respectively arranged at the two ends of the light emitting diode 21 along a second direction Y. The second direction Y is parallel to the surface of the driving substrate 10 and perpendicular to the first direction X.

[0059] Among them, the soldering legs 21a mainly protrude from the light emitting diodes 21 along the second direction Y. That is, each soldering leg 21a includes a protruding part 211a protruding from the light emitting diode 21 along the second direction Y, and the area of the protruding part 211a accounts for more than 50% of the entire area of the soldering leg 21a. Specifically, a part of the soldering leg 21a is shielded by the light emitting diode 21, and the area of the protruding part 211a accounts for more than 90% of the area of the remaining part.

[0060] The shielding layer 40 is arranged around the pixel unit 20, that is, Figure 3 the area outside the dashed box in , so the shielding layer 40 can cover the protruding part 211a of each soldering leg 21a, and basically achieve complete shielding of the soldering leg 21a to avoid reflection of the shielding soldering leg 21a. Among them, only a small part of the soldering leg 21a between adjacent light emitting diodes 21 is not covered by the shielding layer 40, which can be ignored.

[0061] Please refer to Figure 5 and Figure 6 , Figure 5 is a schematic view of a cross-sectional structure of a display panel provided by some embodiments of the present application, Figure 6 is Figure 5 a schematic view of a top structure of a first transparent encapsulation layer, a pixel unit and a shielding layer in a display panel, that is, a second transparent encapsulation layer 50 is not shown. This embodiment is the same as Figure 1 and Figure 2The embodiments differ in the thickness of the first transparent encapsulation layer 30, the position of the shielding layer 40, and the second transparent encapsulation layer 50.

[0062] The display panel further includes a second transparent encapsulation layer 50, which is located on the side of the first transparent encapsulation layer 30 away from the substrate and covers the surface of the shielding layer 40. The second transparent encapsulation layer 50 can protect and fix the shielding layer 40 and further encapsulate and protect the light-emitting diode 21.

[0063] The shielding layer 40 includes a third surface 42 away from the driving substrate 10, and the second transparent encapsulation layer 50 includes a fourth surface 51 away from the driving substrate 10, and the fourth surface 51 is higher than or flush with the third surface 42 of the shielding layer 40. That is, the thickness of the second transparent encapsulation layer 50 is greater than or equal to the thickness of the shielding layer 40, so as to achieve the protection and fixation of the shielding layer 40. When the thickness of the second transparent encapsulation layer 50 is greater than the thickness of the shielding layer 40, the upper surface of the shielding layer 40 can also be protected.

[0064] As shown in Figure 5 , the thickness H1 of the first transparent encapsulation layer 30 is greater than the thickness H2 of the light-emitting diode 21, so that the second surface 41 of the shielding layer 40 is higher than the first surface 211 of the light-emitting diode 21.

[0065] As shown in Figure 6 , the area of the shielding layer 40 can be smaller than the area of the first encapsulation part 31, so that there is a certain distance between the shielding layer 40 and the pixel unit 20, which not only reduces the process difficulty, but also avoids the shielding of the first surface 211 of the light-emitting diode 21 by the shielding layer 40 due to process errors.

[0066] In some embodiments, the fourth surface 51 of the second transparent encapsulation layer 50 can be a matte surface, which simultaneously plays the effects of encapsulation and anti-glare.

[0067] Correspondingly, the present application provides a display panel manufacturing method. Please refer to Figure 7 , Figure 7 is a flowchart of the display panel manufacturing method provided by some embodiments of the present application. The display panel manufacturing method includes the following steps:

[0068] Step S1: providing a driving substrate;

[0069] Step S2: forming arrayed pixel units on the driving substrate, the pixel units including a plurality of spaced light-emitting diodes;

[0070] Step S3: Form a first transparent encapsulation layer between adjacent light-emitting diodes, wherein the first transparent encapsulation layer at least covers the sidewalls of the light-emitting diodes;

[0071] Step S4: A shielding layer is formed on the side of the first transparent encapsulation layer away from the driving substrate. The shielding layer is located in the region between adjacent pixel units. The light-emitting diode includes a first surface away from the driving substrate. The shielding layer includes a second surface connected to the first transparent encapsulation layer. The second surface is higher than or flush with the first surface.

[0072] In this display fabrication method, a first transparent encapsulation layer is formed between adjacent light-emitting diodes (LEDs) to encapsulate the pixel units. A masking layer is then formed on this first transparent encapsulation layer. Since the masking layer is located in the area between adjacent pixel units, it can cover the exposed background color of the driving substrate, thereby improving the background color consistency of the driving substrate. Furthermore, because the second surface of the masking layer is higher than or flush with the first surface of the LEDs, rather than filling the gaps between the pixel units, there is no ink creep problem, no residual masking layer material on the first surface of the LEDs affecting the luminous brightness, and no brightness sacrifice or incomplete improvement of background color consistency caused by using a black semi-transparent film layer. Moreover, compared to forming a masking layer in the area between adjacent LEDs, forming a masking layer only in the area between pixel units can reduce the device's precision.

[0073] The following description, in conjunction with the accompanying drawings, illustrates the method for manufacturing the display panel according to embodiments of this application. Please refer to the accompanying drawings. Figures 8-12 , Figures 8-12 This is a schematic diagram of the structure of a display panel during its manufacturing process, in which... Figure 9 yes Figure 8 A top view of the central display panel. Figure 11 yes Figure 10 A top view of the central display panel.

[0074] Step S1: Provide the driving substrate 10. See details. Figure 8 .

[0075] The driving substrate 10 may include a printed circuit board for driving the light-emitting diode 21 to emit light.

[0076] Step S2: An array of pixel units 20 is formed on the driving substrate 10. Each pixel unit 20 includes a plurality of spaced-apart light-emitting diodes 21. See details. Figure 8 and Figure 9 .

[0077] The printed circuit board has pads, and the light-emitting diode 21 can be soldered to the pads on the printed circuit board via solder feet.

[0078] Step S3: forming a first transparent encapsulation layer 30 between the adjacent light emitting diodes 21, the first transparent encapsulation layer 30 covering at least the sidewalls of the light emitting diodes 21. See Figure 10 and Figure 11 .

[0079] The first transparent encapsulation layer 30 can be formed by a proper encapsulation process to encapsulate the LED display module. The encapsulation process can be a mold encapsulation process, a vacuum glue filling process, a glue film vacuum pressing encapsulation process, or a spray encapsulation process. The material of the first transparent encapsulation layer 30 is selected to be a colorless transparent encapsulation material to reduce the influence on the brightness of the LED.

[0080] Step S4: forming a shielding layer 40 on the side of the first transparent encapsulation layer 30 away from the driving substrate 10, the shielding layer 40 being located in the region between the adjacent pixel units 20, the light emitting diode 21 including a first surface 211 away from the driving substrate 10, the shielding layer 40 including a second surface 41 connected with the first transparent encapsulation layer 30, the second surface 41 being higher than or flush with the first surface 211. See Figure 12 .

[0081] The black ink material can be sprayed on the surface of the first transparent encapsulation layer 30 according to a predetermined program by using a dispensing process or a jet printing process to form the shielding layer 40. In order to better shield the bottom color of the driving substrate 10, the shielding layer 40 is black ink with an OD value greater than or equal to 3 and low light transmittance, such as black matrix (BM) material.

[0082] The predetermined program means that the spraying should avoid the direct above of the red, green and blue light emitting diodes 21, but not avoid the soldering legs. In order to obtain higher spraying precision and efficiency, a jet printing device can be selected. At the same time, in order to avoid the diffusion of the ink after spraying to cover the light emitting diodes 21, the selected black ink can be UV-cured ink, that is, a process of jet printing and curing at the same time is adopted. At the same time, in order to avoid the influence of the black ink on the side viewing angle of the LED display module, the sprayed black ink needs to be controlled to a certain thickness, and the thickness is controlled to be less than 20 microns, for example, less than 10 microns.

[0083] The first transparent encapsulation layer 30 includes a first encapsulation part 31, the first encapsulation part 31 being located between the adjacent pixel units 20 and arranged around the sidewalls of each pixel unit 20. The method of forming the shielding layer 40 in step S4 includes: using a process of jet spraying and curing at the same time to form the light shielding layer on the surface of the first encapsulation part 31.

[0084] See Figure 5In some embodiments, the method for manufacturing the display panel further comprises: forming a second transparent encapsulation layer 50 on the side of the first transparent encapsulation layer 30 away from the substrate, the second transparent encapsulation layer 50 covering the surface of the shielding layer 40.

[0085] The shielding layer 40 comprises a third surface 42 away from the driving substrate 10, and the second transparent encapsulation layer 50 comprises a fourth surface 51 away from the driving substrate 10, the fourth surface 51 being higher than or flush with the third surface 42 of the shielding layer 40.

[0086] The second transparent encapsulation layer 50 can be a transparent matte adhesive layer formed by a vacuum filling process, which can simultaneously achieve the effects of encapsulation and anti-glare. The material of the second transparent encapsulation layer 50 can be a thermosetting resin, such as a two-component epoxy resin, or a UV curing resin, such as a UV acrylic resin or a UV epoxy resin. The UV curing resin has a higher curing efficiency. In some embodiments, the second transparent encapsulation layer 50 can also be formed by UV transfer.

[0087] In some embodiments, the first transparent encapsulation layer 30 can be made of a material with a refractive index less than that of the light-emitting diode 21 chip material (typically gallium nitride, GaN), so as to reduce interface reflection and improve light extraction efficiency. For example, the first transparent encapsulation layer 30 can be made of a material with a refractive index of 1.4-1.8, such as silicone (with a refractive index of about 1.4-1.5) and epoxy resin (with a refractive index of about 1.5-1.6).

[0088] The second transparent encapsulation layer 50 is a transparent matte adhesive layer, and the refractive index of the transparent matte layer is less than that of the first transparent encapsulation layer 30, so as to reduce reflection and increase light scattering, thereby reducing glare and improving the viewing angle. For example, the second transparent encapsulation layer 50 can be made of a material (such as acrylic resin) with a refractive index of 1.3-1.5. By introducing microstructures or textures on the surface of the transparent matte layer, light can be further scattered, reflection can be reduced, and display uniformity can be improved.

[0089] The above descriptions are only used to help understand the technical solutions and the core ideas of the present application; those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent replacements to some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel (100), characterized in that, include: Drive substrate (10); Pixel units (20) are arrayed on the driving substrate (10) and include a plurality of light-emitting diodes (21) spaced apart. A first transparent encapsulation layer (30) is located between adjacent light-emitting diodes (21) and at least covers the sidewalls of the light-emitting diodes (21); The shielding layer (40) is located on the side of the first transparent encapsulation layer (30) away from the driving substrate (10) and in the area between adjacent pixel units (20); The light-emitting diode (21) includes a first surface (211) facing away from the driving substrate (10), and the shielding layer (40) includes a second surface (41) connected to the first transparent encapsulation layer (30), the second surface (41) being higher than or flush with the first surface (211).

2. The display panel (100) according to claim 1, characterized in that, The first transparent encapsulation layer (30) includes a first encapsulation portion (31) and a second encapsulation portion (32). The first encapsulation portion (31) is located between adjacent pixel units (20) and is disposed around the sidewall of each pixel unit (20). The second encapsulation portion (32) is located between adjacent light-emitting diodes (21) in a pixel unit (20). The orthographic projection of the shielding layer (40) on the driving substrate (10) is located within the range of the orthographic projection of the first encapsulation part (31) on the driving substrate (10).

3. The display panel (100) according to claim 1, characterized in that, The thickness of the first transparent encapsulation layer (30) is greater than or equal to the thickness of the light-emitting diode (21).

4. The display panel (100) according to any one of claims 1 to 3, characterized in that, The thickness of the shielding layer (40) is less than or equal to 20 micrometers.

5. The display panel (100) according to claim 3, characterized in that, When the thickness of the first transparent encapsulation layer (30) is equal to the thickness of the light-emitting diode (21); the first surface (211) is flush with the second surface (41), and the first surface (211) is connected to the second surface (41); When the thickness of the first transparent encapsulation layer (30) is greater than the thickness of the light-emitting diode (21), the second surface (41) is higher than the first surface (211).

6. The display panel (100) according to claim 1, characterized in that, Also includes: The second transparent encapsulation layer (50) is located on the side of the first transparent encapsulation layer (30) away from the substrate and covers the surface of the shielding layer (40); The shielding layer (40) includes a third surface (42) facing away from the driving substrate (10), and the second transparent encapsulation layer (50) includes a fourth surface (51) facing away from the driving substrate (10), the fourth surface (51) being higher than or flush with the third surface (42) of the shielding layer (40).

7. The display panel (100) according to claim 6, characterized in that, The fourth surface (51) of the second transparent encapsulation layer (50) is a matte surface.

8. The display panel (100) according to claim 1, characterized in that, The material of the shielding layer (40) includes black ink, and the optical density value of the black ink is greater than or equal to 3.

9. A method for preparing a display panel (100), characterized in that, include: Provide a driving substrate (10); An array of pixel units (20) is formed on the driving substrate (10), and each pixel unit (20) includes a plurality of light-emitting diodes (21) spaced apart. A first transparent encapsulation layer (30) is formed between adjacent light-emitting diodes (21), the first transparent encapsulation layer (30) at least covering the sidewalls of the light-emitting diodes (21); A shielding layer (40) is formed on the side of the first transparent encapsulation layer (30) away from the driving substrate (10). The shielding layer (40) is located in the region between adjacent pixel units (20). The light-emitting diode (21) includes a first surface (211) away from the driving substrate (10). The shielding layer (40) includes a second surface (41) connected to the first transparent encapsulation layer (30). The second surface (41) is higher than or flush with the first surface (211).

10. The method for preparing the display panel (100) according to claim 9, characterized in that, The first transparent encapsulation layer (30) includes a first encapsulation part (31), which is located between adjacent pixel units (20) and is disposed around the sidewall of each pixel unit (20); The method of forming the shielding layer (40) includes: The light-shielding layer is formed on the surface of the first encapsulation part (31) by using a process of simultaneous spraying and curing.

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