Driving substrate, display panel and preparation method thereof

Abstract

The embodiment of the invention provides a driving substrate, a display panel and a preparation method thereof, relates to the technical field of display, and is used for improving the bonding yield of the display panel. The driving substrate comprises a substrate, a circuit layer and a bonding electrode, the circuit layer is arranged on the substrate; the bonding electrode is arranged on one side, far away from the substrate, of the circuit layer and is connected with the circuit layer; the bonding electrode comprises a filling part and a plurality of bonding parts, the plurality of bonding parts are arranged at intervals, and gaps among the plurality of bonding parts are filled with the filling part. The display panel is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a driving substrate, a display panel, and a method for manufacturing the same. Background Technology

[0002] The use of micro light-emitting diodes (Micro LEDs) or mini light-emitting diodes (Mini LEDs) as pixels in display panels has attracted widespread attention and research. To ensure product quality, the bonding process that connects Micro LEDs or Mini LEDs to the driving substrate needs to meet high yield requirements. Summary of the Invention

[0003] The purpose of this disclosure is to provide a driving substrate, a display panel, and a method for manufacturing the same, for improving the bonding yield of the display panel.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a driving substrate is provided. The driving substrate includes a substrate, a circuit layer, and a bonding electrode. The circuit layer is disposed on the substrate; the bonding electrode is disposed on the side of the circuit layer away from the substrate and connected to the circuit layer; the bonding electrode includes a filling portion and a plurality of bonding portions, the plurality of bonding portions being spaced apart, and the filling portion filling the gap between the plurality of bonding portions.

[0006] In the aforementioned driving substrate, the bonding electrode comprises multiple bonding portions spaced apart, with filler portions filling the spaces between them. During the bonding process between the driving substrate and the chip, the bonding portions contact and are electrically connected to the chip electrodes on the chip (i.e., electrical contact), while the filler portions of the bonding electrodes contact the chip electrodes but are not electrically connected. Thus, the actual bonding area is the sum of the areas of the multiple bonding portions. The electrical contact between the bonding electrode and the chip electrode changes from a large-area contact of the entire bonding electrode to multiple small-area contacts between the multiple bonding portions and the chip electrode, spaced apart from each other. Therefore, on the one hand, with the same bonding electrode area, the bonding area used for electrical contact with the chip electrode in the bonding electrode of this application is reduced. This increases the pressure acting on the multiple bonding portions under the same pressure during the bonding process between the driving substrate and the chip. On the other hand, since the filler portions can be softened by heating during the bonding process, and the contact between each bonding portion and the chip electrode is a small-area contact, the contact between the bonding portions and the chip electrode is more complete, improving the uniformity of the pressure acting on the bonding portions. Therefore, the bonding yield between the driver substrate and the chip is improved.

[0007] In some embodiments, the filling portion further surrounds the plurality of bonding portions.

[0008] In some embodiments, the device further includes: a pad disposed between the circuit layer and the bonding electrode, wherein, in a positive projection onto the substrate, the bonding electrode is located within the boundary of the pad, and there is a gap between the boundary of the bonding electrode and the boundary of the pad.

[0009] In some embodiments, the thickness of the filling portion is greater than the thickness of the bonding portion in a direction perpendicular to the substrate.

[0010] In some embodiments, the filling material is a thermoplastic material.

[0011] In some embodiments, the bonding portion extends along a first direction, and the plurality of bonding portions are arranged sequentially along a second direction, wherein the first direction and the second direction intersect; or, the plurality of bonding portions are arranged in multiple rows and columns.

[0012] In some embodiments, the plurality of bonding portions have the same shape and are equal in size.

[0013] In some embodiments, the plurality of bonding portions includes a plurality of first bonding portions, wherein the first bonding portions are annular and the plurality of first bonding portions are arranged sequentially around each other.

[0014] In some embodiments, the widths of the plurality of first bonding portions are equal.

[0015] In some embodiments, the plurality of bonding portions further include at least one second bonding portion, the second bonding portion being circular, elliptical, or polygonal, and each of the first bonding portions surrounds the at least one second bonding portion.

[0016] On the other hand, a display panel is provided, comprising: a driving substrate as described in any of the above embodiments; a chip disposed on one side of the driving substrate; the chip comprising a chip body and a chip electrode, the chip electrode being disposed on the side of the chip body facing the driving substrate and connected to a bonding electrode of the driving substrate.

[0017] In some embodiments, in a positive projection onto the substrate of the driving substrate, the plurality of bonding portions of the bonding electrodes are within the boundary range of the chip electrodes.

[0018] In some embodiments, the side surface of the filling portion of the bonding electrode away from the substrate and the side surface of the plurality of bonding portions of the bonding electrode away from the substrate are both in contact with the chip electrode.

[0019] The above-described display panel has the same structure and beneficial technical effects as the driving substrate provided in some of the above embodiments, and will not be described again here.

[0020] On the other hand, a method for fabricating a display panel is provided, comprising: forming a driving substrate; the driving substrate including a bonding electrode, the bonding electrode including a filling portion and a plurality of bonding portions, the plurality of bonding portions being spaced apart, the filling portion filling the gap between the plurality of bonding portions; disposing a chip on one side of the driving substrate; the chip including a chip body and a chip electrode, the chip electrode being disposed on the side of the chip body facing the driving substrate; and bonding the chip to the driving substrate to connect the chip electrode to the bonding electrode.

[0021] In some embodiments, the bonding process between the chip and the driving substrate includes: performing a first heating treatment on the bonding electrode to soften the filler portion and applying pressure to the chip to bring the filler portion into contact with the chip electrode; performing a second heating treatment on the bonding electrode and continuing to apply pressure to the chip to bond the bonding portion to the chip electrode; wherein the temperature of the first heating treatment is greater than or equal to the softening temperature of the filler portion and less than the bonding temperature between the chip electrode and the bonding portion; the temperature of the second heating treatment is greater than or equal to the bonding temperature between the chip electrode and the bonding portion and less than the decomposition temperature of the filler portion.

[0022] The beneficial effects achievable by the above-described method for manufacturing the display panel are the same as those achievable by the above-described display panel, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0024] Figure 1 This is a schematic diagram of a display device according to some embodiments;

[0025] Figure 2 for Figure 1 A sectional view of a portion of the display device along the AA direction;

[0026] Figure 3 This is a structural diagram of a chip provided according to some embodiments;

[0027] Figure 4 for Figure 3 A top view of the chip;

[0028] Figure 5 This is a structural diagram of a driving substrate provided according to some embodiments;

[0029] Figure 6 Another structural diagram of a driving substrate provided for some embodiments of this disclosure;

[0030] Figure 7 A structural diagram of a bonding electrode provided for some embodiments of this disclosure;

[0031] Figure 8 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0032] Figure 9 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0033] Figure 10 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0034] Figure 11 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0035] Figure 12 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0036] Figure 13 A structural diagram of another bonding electrode provided for some embodiments of this disclosure;

[0037] Figure 14 A structural diagram of a display panel provided for some embodiments of this disclosure;

[0038] Figure 15 A structural diagram of a display device provided for some embodiments of this disclosure;

[0039] Figure 16 A flowchart illustrating a method for fabricating a display panel according to some embodiments of this disclosure;

[0040] Figures 17-20 Structural diagrams corresponding to each step in the manufacturing method of the display panel provided for some embodiments of this disclosure;

[0041] Figure 21 This is a schematic diagram illustrating a method for manufacturing a display device according to some embodiments of the present disclosure. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0045] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0046] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0047] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0048] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0049] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0050] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0051] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0052] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0053] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the areas shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0054] like Figure 1As shown, embodiments of this disclosure provide a display device 1000, which is a product with image display functionality. Exemplarily, the display device 1000 can be any device that displays either moving (e.g., video) or fixed (e.g., still image) content, and whether it is text or an image.

[0055] For example, the display device 1000 can be any product or component with display functionality, such as a television, laptop, tablet, personal digital assistant (PDA), mobile phone, watch, clock, calculator, GPS receiver / navigator, camera, camera view display (e.g., a rearview camera display in a vehicle), wearable device, augmented reality (AR) device, virtual reality (VR) device, in-vehicle display, or flight display. Figure 1 As shown, the display device 1000 can be a mobile phone.

[0056] The aforementioned display device 1000 can be a micro light-emitting diode (MicroLED) display device or a mini light-emitting diode (Mini LED) display device.

[0057] From the perspective of the form of the display device 1000, the display device 1000 can be a flat display device, a curved display device, or a foldable display device, etc. From the perspective of the shape of the display device 1000, the display device 1000 can be rectangular or circular, etc. The embodiments of this disclosure do not specifically limit this. The following uses a rectangular and flat micro-light-emitting diode display device as an example to illustrate some embodiments of this disclosure. However, the implementation of this disclosure is not limited to this, and any other display device can be considered as long as the same technical concept is applied.

[0058] like Figure 2 As shown, the display device 1000 includes a display panel 1001; and an encapsulation layer 1002 disposed on one side of the display panel 1001. The encapsulation layer 1002 is configured to reduce the risk of moisture and oxygen from the external environment entering the display panel 1001, thereby improving the service life of the display panel 1001.

[0059] Continue to refer to Figure 2 This disclosure provides a display panel 1001, which includes a driving substrate 100 and a chip 200 stacked together.

[0060] The driving substrate 100 includes a substrate 110, a circuit layer 120, a pad 130 and a bonding electrode 140 stacked sequentially.

[0061] The substrate 110 is made of a transparent material. For example, the substrate 110 can be a transparent flexible substrate, or it can be a transparent rigid substrate, such as glass or ultra-thin glass.

[0062] The circuit layer 120 includes multiple pixel circuits configured to drive the chip 200 to emit light. The circuit layer 120 may include multiple conductive layers configured to form multiple pixel circuits and multiple signal lines for driving the pixel circuits. The pixel circuits include multiple thin-film transistors. The multiple conductive layers may include, for example, a semiconductor layer ACT, a gate conductive layer GT, and a source / drain conductive layer SD sequentially disposed along a direction perpendicular to and away from the substrate 110. Of course, the driving substrate may also include other conductive layers, such as a second source / drain conductive layer; this is not specifically limited here.

[0063] The aforementioned multiple conductive layers form multiple thin-film transistors (TFTs). The thin-film transistors (TFTs) may include a semiconductor pattern 101 located in the semiconductor layer ACT, a gate 102 located in the gate conductive layer GT, a source 103 and a drain 104 located in the source-drain conductive layer SD, and a common electrode 105 located in the source-drain conductive layer SD.

[0064] The circuit layer 120 may also include an insulating layer located between adjacent conductive layers. For example, the driving substrate 100 may include a gate insulating layer GI located between the semiconductor layer ACT and the gate conductive layer GT, an interlayer dielectric layer ILD located between the gate conductive layer GT and the source / drain conductive layer SD, and a planarization layer PLN located between the source / drain conductive layer SD and the pad 130. Of course, the circuit layer 120 may also include other insulating film layers, which will not be described in detail here.

[0065] Pad 130 includes multiple pads spaced apart on the side of the planarization layer PLN away from the substrate 110. (Continue to reference) Figure 2 The multiple pads include a first pad 131 and a second pad 132. One end of the first pad 131 is connected to the drain 104 of the thin-film transistor TFT through a via on the planarization layer PLN, so as to bring out the signal of the drain 104. One end of the second pad 132 is connected to the common electrode 105 through a via on the planarization layer PLN, so as to bring out the signal of the common electrode 105.

[0066] For example, the material of pad 130 includes copper.

[0067] The bonding electrode 140 is a structure on the driving substrate 100 used to connect with the chip 200. (Continue to refer to...) Figure 2 The bonding electrode 140 may include a first bonding electrode 1401 and a second bonding electrode 1402. The first bonding electrode 1401 is connected to the other end of the first pad 131, and the second bonding electrode 1402 is connected to the other end of the second pad 132.

[0068] For example, the material of the bonding electrode 140 includes tin.

[0069] Continue to refer to Figure 2 Chip 200 includes a chip body 21 and chip electrodes 22. Each chip 200 is connected to a pixel circuit, which drives the chip 200 to emit light. Chip 200 may include a red, green, or blue light-emitting chip, enabling the display panel 1001 to display color images.

[0070] Reference Figure 3 and Figure 4 The chip body 21 includes a first type semiconductor layer 211, an active layer 212, and a second type semiconductor layer 213 stacked sequentially. The chip electrode 22 includes a first chip electrode 221 and a second chip electrode 222. The first chip electrode 221 is located on the surface of the second type semiconductor layer 213 opposite to the active layer 212, and the second chip electrode 222 is located on the surface of the first type semiconductor layer 211 on the side of the active layer 212 and the second type semiconductor layer 213.

[0071] In some embodiments, the first type semiconductor layer 211 can be an N-type semiconductor layer, and the second type semiconductor layer 213 can be a P-type semiconductor layer. In this case, the first chip electrode 221 is an N-type electrode, and the second chip electrode 222 is a P-type electrode. Alternatively, the first type semiconductor layer 211 can be a P-type semiconductor layer, and the second type semiconductor layer 213 can be an N-type semiconductor layer. In this case, the first chip electrode 221 is a P-type electrode, and the second chip electrode 222 is an N-type electrode. This embodiment illustrates the example where the first type semiconductor layer 211 is an N-type semiconductor layer and the second type semiconductor layer 213 is a P-type semiconductor layer.

[0072] Reference Figure 2 The first chip electrode 221 of chip 200 is connected to the first bonding electrode 1401, and then connected to the thin film transistor (TFT) of the pixel circuit through the first pad 131. The second chip electrode 222 of chip 200 is connected to the second bonding electrode 1402, and then connected to the common electrode 105 through the second pad 132. In this way, the pixel circuit and the common electrode 105 can provide driving current to chip 200, so that chip 200 emits light.

[0073] To improve the fabrication efficiency of the display panel 1001, a carrier plate is used to support a large number of chips 200 during the fabrication process. These chips 200 are arranged on the carrier plate according to the required spacing and color. Then, the carrier plate supporting the chips 200 is aligned with the driving substrate 100 in a vacuum. Specifically, the chip electrodes 22 of the chips 200 are aligned one-to-one with the bonding electrodes 140 of the driving substrate 100. During the connection of the chip electrodes 22 and the bonding electrodes 140, a eutectic bonding method can be used. Specifically, the chip electrodes 22 and the bonding electrodes 140 can be heated, and appropriate pressure can be applied to the chips 200 and the driving substrate 100 to melt and react with each other, thus forming an electrical connection between the chips 200 and the driving substrate 100. To avoid excessive pressure damaging the structure of the chips 200 and causing abnormal light emission, the applied pressure cannot be too high. In related technologies, references are made to... Figure 2 and Figure 5 Since the bonding electrode 140 on the driving substrate 100 completely covers the pad 130, the pressure acting on the bonding electrode 140 will be relatively small if the pressure is not too high. This may result in insufficient contact between the chip electrode 22 and the bonding electrode 140. At the same time, the pressure acting on the bonding electrode 140 will also be uneven, which leads to a poor bonding yield between the chip electrode 22 of the chip 200 and the bonding electrode 140 on the driving substrate 100.

[0074] To address the aforementioned technical problems, some embodiments of this disclosure provide a driving substrate 100, with reference to... Figure 6 The system includes a substrate 110, a circuit layer 120, and a bonding electrode 140. The circuit layer 120 is disposed on the substrate 110; the bonding electrode 140 is disposed on the side of the circuit layer 120 away from the substrate 110 and connected to the circuit layer 120. The bonding electrode 140 includes a filling portion 141 and a plurality of bonding portions 142, the plurality of bonding portions 142 being spaced apart, and the filling portion 141 filling the gaps between the plurality of bonding portions 142.

[0075] In this embodiment, the driving substrate 100 includes a plurality of bonding portions 142 spaced apart on the bonding electrode 140, with filling portions 141 filling between the bonding portions 142. During the bonding process between the driving substrate 100 and the chip 200, the bonding portions 142 contact and are electrically connected to the chip electrode 22 on the chip 200 (i.e., electrical contact), while the filling portions 141 of the bonding electrode 140 contact the chip electrode 22 but cannot be electrically connected. Thus, the actual bonding area is the sum of the areas of the plurality of bonding portions 142. The electrical contact between the bonding electrode 140 and the chip electrode 22 changes from the original large-area contact of the entire bonding electrode to multiple small-area contacts between the plurality of bonding portions 142 and the chip electrode 22 that are spaced apart. Therefore, on the one hand, with the same area of ​​bonding electrode 140, the bonding area of ​​the bonding electrode 140 used for electrical contact with the chip electrode 22 in this application is reduced. This increases the pressure acting on the multiple bonding portions 142 under the same pressure during the bonding process of the driving substrate 100 and the chip 200. On the other hand, since the filler portion 141 can be softened by heating during the bonding process, and the contact between each bonding portion 142 and the chip electrode 22 is a small-area contact, the contact between the bonding portion 142 and the chip electrode 22 is more sufficient, improving the uniformity of the pressure acting on the bonding portion 142. Therefore, the bonding yield between the driving substrate 100 and the chip 200 is improved.

[0076] In some embodiments, continue to refer to Figure 6 and Figure 7 The filler portion 141 also surrounds multiple bonding portions 142. During the bonding process between the drive substrate 100 and the chip 200, the filler portion 141 surrounding the multiple bonding portions 142 softens due to heat. This allows for more thorough contact between the bonding portions 142 located at the edge of the bonding electrode 140 and the chip electrode 22 of the chip 200, further improving the uniformity of pressure applied to the bonding electrode 140. Furthermore, after the bonding electrode 140 is bonded to the chip electrode 22, the filler portion 141 surrounds all the bonding portions 142, providing protection.

[0077] The bonding electrode 140 includes a plurality of bonding portions 142 spaced apart, and there are various possible arrangements of the plurality of bonding portions 142.

[0078] For example, refer to Figure 7The bonding portion 142 extends along the first direction X, and multiple bonding portions 142 are arranged sequentially along the second direction Y. In this case, the bonding portion 142 can be elongated. The first direction X and the second direction Y intersect, meaning there is a certain angle between them, for example, 90° ± 10°. For ease of explanation, this embodiment uses a 90° angle (perpendicular to each other) as an example.

[0079] For example, refer to Figure 8 The bonding portion 142 may also extend along the second direction Y, and multiple bonding portions 142 may be arranged sequentially along the first direction X.

[0080] For example, refer to Figure 9 and Figure 10 Multiple bonding parts 142 are arranged in multiple rows and columns.

[0081] For example, refer to Figure 9 Multiple bonding parts 142 are arranged in multiple rows and columns in a matrix-like manner.

[0082] For example, refer to Figure 10 Multiple bonding portions 142 are arranged in multiple rows and columns. The row direction of the multiple bonding portions 142 can be a first direction X, and the column direction of the multiple bonding portions 142 can be a second direction Y. Along the second direction Y, adjacent rows of bonding portions 142 are staggered.

[0083] In some embodiments, the plurality of bonding portions 142 have the same shape and are of equal size. This ensures a uniform current density distribution in the bonding electrodes 140, thereby improving the stability of the driving substrate 100 during operation.

[0084] In some embodiments, a plurality of bonding portions 142 are arranged in multiple rows and columns. The plurality of bonding portions 142 have the same shape and size, and the distance between adjacent rows of bonding portions 142 along the second direction Y is equal, and the distance between adjacent columns of bonding portions 142 along the first direction X is equal. That is, the filling portions 141 between the plurality of bonding portions 142 are also uniformly distributed. Therefore, while improving the uniformity of the bonding electrode 140 and the chip electrode 22, the uniformity of the resistance distribution of the bonding electrode 140 can also be ensured, that is, the uniformity of the current density distribution in the bonding electrode 140 can be ensured.

[0085] In some embodiments, reference Figure 11 The plurality of bonding portions 142 include a plurality of first bonding portions 1421, the first bonding portions 1421 being annular, and the plurality of first bonding portions 1421 being arranged sequentially around each other. For example... Figure 11As shown, the plurality of bonding portions 142 include two first bonding portions 1421, which are annular, with one first bonding portion 1421 surrounding the other first bonding portion 1421.

[0086] In some embodiments, when the plurality of bonding portions 142 include a plurality of first bonding portions 1421, and the first bonding portions 1421 are annular, the centers of the plurality of first bonding portions 1421 may or may not coincide. For example... Figure 11 As shown, the centers of the multiple first bonding portions 1421 coincide.

[0087] In some embodiments, continue to refer to Figure 11 The plurality of bonding portions 142 include a plurality of first bonding portions 1421, and the widths of the plurality of first bonding portions 1421 are equal. This ensures a uniform current density distribution in the bonding electrodes 140, thereby improving the stability of the driving substrate 100 during operation.

[0088] It is understandable that when the first bonding portion 1421 is annular, the width of the first bonding portion 1421 refers to the difference between the outer diameter and the inner diameter of the first bonding portion 1421.

[0089] In some embodiments, reference Figure 12 The plurality of bonding portions 142 also include at least one second bonding portion 1422. The second bonding portion 1422 can be a block electrode, for example, the second bonding portion 1422 can be circular, elliptical or polygonal in shape, and each first bonding portion 1421 surrounds at least one second bonding portion 1422. By providing the second bonding portion 1422, the area ratio of the bonding portion 142 in the bonding electrode 140 can be increased, thereby reducing the bonding resistance between the bonding electrode 140 and the chip electrode 22.

[0090] For example, refer to Figure 12 The plurality of bonding portions 142 include a second bonding portion 1422 and a first bonding portion 1421. The second bonding portion 1422 is circular in shape, and the first bonding portion 1421 is annular in shape, with the first bonding portion 1421 surrounding the second bonding portion 1422.

[0091] In the case where the multiple bonding portions 142 include multiple first bonding portions 1421 and one second bonding portion 1422, such as Figure 12 As shown, the centers of the plurality of first bonding portions 1421 may coincide with the center of the second bonding portion 1422; or, as Figure 13 As shown, the center of the plurality of first bonding portions 1421 may not coincide with the center of the second bonding portion 1422.

[0092] It should be noted that in the phrase "the second bonding part is a circular, elliptical, or polygonal shape", "circular" includes standard circles as well as near-circular shapes, such as circles with serrated edges; similarly, "elliptical" includes standard ellipses as well as near-elliptical shapes; and "polygonal" includes triangles, quadrilaterals, pentagons, and other polygons or near-polygons.

[0093] In some embodiments, please continue to see Figure 6 and Figure 7 The driving substrate 100 further includes a pad 130 disposed between the circuit layer 120 and the bonding electrode 140. In a projected image onto the substrate 110, the bonding electrode 140 is located within the boundary of the pad 130, and there is a gap between the boundary of the bonding electrode 140 and the boundary of the pad 130. Therefore, in this embodiment, the bonding electrode 140 does not completely cover the pad 130, which is different from the bonding electrode 140 in the prior art (see reference). Figure 2 or Figure 5 In the prior art, the bonding electrode 140 completely covers the pad 130. In this embodiment, the overall area of ​​the bonding electrode 140 is reduced, which is beneficial to further increase the pressure acting on the bonding portion 142.

[0094] In some embodiments, the filler portion 141 is made of a thermoplastic material. That is, the material of the filler portion 141 undergoes plastic deformation at high temperatures, meaning the filler portion 141 expands in volume upon heating and cannot return to its original shape. Because the filler portion 141 undergoes plastic deformation upon heating, and the contact between each bonding portion 142 in the bonding electrode 140 and the chip electrode 22 is a small-area contact, the contact between the bonding portion 142 and the chip electrode 22 is more sufficient, thus ensuring the uniformity of the bonding between the bonding electrode 140 and the chip electrode 22.

[0095] In some embodiments, the thickness of the filling portion 141 is greater than the thickness of the bonding portion 142 in a direction perpendicular to the substrate 110. This design aims to ensure that during the bonding process between the chip 200 and the driving substrate 100, when the filling portion 141 is heated, it first contacts the chip electrode 22, followed by the bonding portion 142. This further enhances the extent to which the filling portion 141 can contact the chip electrode 22, thereby further improving the uniformity of the bonding.

[0096] Compared to the thickness of the bonding portion 142, if the thickness of the filler portion 141 is too large, the material of the filler portion 141 may overflow to the surface of the bonding portion 142 after lamination, resulting in an increase in the surface resistance between the bonding portion 142 and the chip electrode 22. If the thickness of the filler portion 141 is too small, the contact between the filler portion 141 and the chip electrode 22 may be insufficient, resulting in an insignificant effect on improving the uniformity of lamination. Therefore, the thickness difference between the filler portion 141 and the bonding portion 142 needs to be designed reasonably. For example, along the direction perpendicular to the substrate 110, the thickness of the filler portion 141 is 1 μm to 2 μm greater than the thickness of the bonding portion 142, for example, 1 μm, 1.2 μm, 1.6 μm, 1.8 μm, or 2 μm.

[0097] For example, along the direction perpendicular to the substrate 110, the thickness of the filling portion 141 is 3 μm, and the thickness of the bonding portion 142 is 1 μm, 1.2 μm, 1.6 μm, 1.8 μm, or 2 μm.

[0098] refer to Figure 14 The present disclosure also provides a display panel 1001, including a driving substrate 100 and a chip 200 provided in any of the above embodiments. The chip 200 is disposed on one side of the driving substrate 100. The chip 200 includes a chip body 21 and a chip electrode 22. The chip electrode 22 is disposed on the side of the chip body 21 facing the driving substrate 100 and is connected to the bonding electrode 140 of the driving substrate 100.

[0099] The display panel 1001 provided in this embodiment includes a bonding electrode 140 comprising a plurality of bonding portions 142 spaced apart, with filling portions 141 filling the spaces between the bonding portions 142. On one hand, this reduces the bonding area of ​​the bonding electrode 140 for electrical contact with the chip electrode 22, thus increasing the pressure acting on the plurality of bonding portions 142 under the same pressure during the pressing process of the driving substrate 100 and the chip 200. On the other hand, since the filling portions 141 can be softened by heating during the pressing process, and the contact between each bonding portion 142 and the chip electrode 22 is a small-area contact, the contact between the bonding portions 142 and the chip electrode 22 is more thorough, improving the uniformity of the pressure acting on the bonding portions 142. Therefore, the display panel 1001 has a high bonding yield.

[0100] In some embodiments, in a normal projection onto the substrate 110 of the driving substrate 100, a plurality of bonding portions 142 of the bonding electrodes 140 of the driving substrate 100 are within the boundary range of the chip electrode 22. In this way, the bonding portions 142 in the bonding electrodes 140 can make complete contact with the chip electrode 22, thereby reducing the bonding resistance between the bonding electrodes 140 and the chip electrode 22.

[0101] In some embodiments, before the driving substrate 100 and the chip 200 are pressed together, the thickness of the filling portion 141 of the bonding electrode 140 can be greater than the thickness of the bonding portion 142 to ensure sufficient contact between the bonding portion 142 and the chip electrode 22 during the pressing process. During the pressing process, the heated and softened filling portion 141 is squeezed around the bonding portion 142, so that after the pressing is completed, the surface of the filling portion 141 of the bonding electrode 140 away from the substrate 110 and the surface of the multiple bonding portions 142 of the bonding electrode 140 away from the substrate 110 can both contact the chip electrode 22, that is, the thickness of the filling portion 141 is equal to the thickness of the bonding portion 142. In this way, there is no gap between the surface of the bonding electrode 140 away from the substrate 110 and the chip electrode 22, and sufficient contact can be achieved, improving the structural stability of the display panel 1001.

[0102] In some embodiments, during the pressing process, the heated and softened filler portion 141 is squeezed around the bonding portion 142. Since the filler portion 141 may flow after being heated and softened, the thickness of the filler portion 141 is less than the thickness of the bonding portion 142 after the pressing is completed.

[0103] In some embodiments, the thickness of the filling portion 141 is greater than the thickness of at least a portion of the bonding portion 142.

[0104] In some embodiments, since the filler portion 141 may flow and overflow after being heated and softened, after the bonding is completed, the bonding portion 142 will have material of the filler portion 141 on the side surface away from the substrate 110 and near the edge of the filler portion 141.

[0105] refer to Figure 15 The present disclosure also provides a display device 1000, including a display panel 1001 provided in any of the above embodiments; and an encapsulation layer 1002 disposed on one side of the display panel 1001 and covering the chip 200.

[0106] In some embodiments, the encapsulation layer 1002 includes a white encapsulation layer or a black encapsulation layer.

[0107] The display device 1000 provided in this embodiment has the same structure and beneficial technical effects as the display panel 1001 described above, and will not be repeated here.

[0108] Embodiments of this disclosure also provide a method for manufacturing a display panel, referencing Figure 16 ,include:

[0109] Step S1: Reference Figure 17A driving substrate 100 is formed. The driving substrate 100 includes a bonding electrode 140. The bonding electrode 140 includes a filling portion 141 and a plurality of bonding portions 142. The plurality of bonding portions 142 are spaced apart. The filling portion 141 fills the gap between the plurality of bonding portions 142.

[0110] The structure of the driving substrate 100 can be referred to the corresponding description above, and will not be repeated here.

[0111] Step S2: As Figure 18 As shown, a chip 200 is disposed on one side of the driving substrate 100; the chip 200 includes a chip body 21 and a chip electrode 22, the chip electrode 22 being disposed on the side of the chip body 21 facing the driving substrate 100.

[0112] Here, a carrier board M can be used to carry the chip 200.

[0113] Step S3: As Figure 19 As shown, the chip 200 is bonded to the driving substrate 100, so that the chip electrode 22 is connected to the bonding electrode 140.

[0114] Specifically, step S3 includes:

[0115] Step S31: As Figure 19 As shown, the bonding electrode 140 is subjected to a first heating treatment to soften the filling portion 141, and pressure is applied to the chip 200 to bring the filling portion 141 into contact with the chip electrode 22.

[0116] Here, the temperature of the first heat treatment is greater than or equal to the softening temperature of the filler portion 141 and less than the bonding temperature between the chip electrode 22 and the bonding portion 142. Since the filler portion 141 is a hard film layer at room temperature, the bonding electrode 140 needs to undergo a first heat treatment. The temperature of the first heat treatment is within this range, which can fully soften the filler portion 141. After heating, the filler portion 141 expands in volume and undergoes plastic deformation. Furthermore, the contact between each bonding portion 142 and the chip electrode 22 is a small-area contact. In this way, before the bonding portion 142 is bonded to the chip electrode 22, the filler portion 141 can fully contact the chip electrode 22 to ensure the uniformity of the pressing.

[0117] For example, the temperature of the first heat treatment can be 100°C to 150°C, such as 100°C, 120°C, 130°C or 150°C. It is understood that the temperature of the first heat treatment can also be other temperatures, as long as the temperature of the first heat treatment is greater than or equal to the softening temperature of the filling portion 141 and less than the bonding temperature between the chip electrode 22 and the bonding portion 142.

[0118] Step S32: Perform a second heating treatment on the bonding electrode 140 and continue to apply pressure to the chip 200 so that the bonding portion 142 is bonded to the chip electrode 22.

[0119] Here, the temperature of the second heat treatment is greater than or equal to the bonding temperature between the chip electrode 22 and the bonding portion 142, but less than the decomposition temperature of the filling portion 141. The temperature of the second heat treatment is within this range, which can both prevent the decomposition of the bonding portion 142 and ensure complete bonding between the bonding portion 142 and the chip electrode 22.

[0120] For example, the temperature of the second heating treatment can be 250°C to 300°C, such as 250°C, 260°C, 280°C or 300°C. It is understood that the temperature of the second heating treatment can also be other temperatures, as long as the temperature of the second heating treatment is greater than or equal to the bonding temperature between the chip electrode 22 and the bonding portion 142 and less than the decomposition temperature of the filling portion 141.

[0121] like Figure 20 As shown, the method for preparing the above-mentioned display panel 1001 further includes: step S4: removing the carrier plate M.

[0122] The beneficial effects that can be achieved by the method for preparing the display panel 1001 provided in the embodiments of this disclosure are the same as those that can be achieved by the display panel 1001 described above, and will not be repeated here.

[0123] refer to Figure 21 After removing the carrier board M, an encapsulation layer 1002 can be formed on the display panel 1001. The encapsulation layer 1002 covers the chip 200 to protect the chip 200 and the circuits on the driving substrate 100.

[0124] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A driving substrate, characterized in that, include: Substrate; A circuit layer is disposed on the substrate; A bonding electrode is disposed on the side of the circuit layer away from the substrate and connected to the circuit layer; the bonding electrode includes a filling portion and a plurality of bonding portions, the plurality of bonding portions being spaced apart, and the filling portion filling the gap between the plurality of bonding portions.

2. The driving substrate according to claim 1, characterized in that, The filling portion also surrounds the plurality of bonding portions.

3. The driving substrate according to claim 1, characterized in that, Also includes: A pad is disposed between the circuit layer and the bonding electrode. In a positive projection onto the substrate, the bonding electrode is located within the boundary of the pad, and there is a gap between the boundary of the bonding electrode and the boundary of the pad.

4. The driving substrate according to claim 1, characterized in that, Along a direction perpendicular to the substrate, the thickness of the filling portion is greater than the thickness of the bonding portion.

5. The driving substrate according to claim 1, characterized in that, The filling part is made of thermoplastic material.

6. The driving substrate according to any one of claims 1 to 5, characterized in that, The bonding portion extends along a first direction, and the plurality of bonding portions are arranged sequentially along a second direction, wherein the first direction and the second direction intersect; or... The multiple bonding portions are arranged in multiple rows and columns.

7. The driving substrate according to any one of claims 1 to 5, characterized in that, The multiple bonding portions have the same shape and are equal in size.

8. The driving substrate according to any one of claims 1 to 5, characterized in that, The plurality of bonding portions include a plurality of first bonding portions, wherein the first bonding portions are annular and the plurality of first bonding portions are arranged sequentially around each other.

9. The driving substrate according to claim 8, characterized in that, The widths of the plurality of first bonding portions are equal.

10. The driving substrate according to claim 8, characterized in that, The plurality of bonding portions further includes at least one second bonding portion, which is circular, elliptical, or polygonal, and each of the first bonding portions surrounds the at least one second bonding portion.

11. A display panel, characterized in that, include: The driving substrate as described in any one of claims 1 to 10; A chip is disposed on one side of the driving substrate; the chip includes a chip body and a chip electrode, the chip electrode is disposed on the side of the chip body facing the driving substrate, and is connected to the bonding electrode of the driving substrate.

12. The display panel according to claim 11, characterized in that, In a normal projection onto the substrate of the driving substrate, the multiple bonding portions of the bonding electrodes are within the boundary range of the chip electrodes.

13. The display panel according to claim 11, characterized in that, The surface of the filling portion of the bonding electrode away from the substrate and the surface of the multiple bonding portions of the bonding electrode away from the substrate are in contact with the chip electrode.

14. A method for manufacturing a display panel, characterized in that, include: Forming a driving substrate; The driving substrate includes a bonding electrode, the bonding electrode includes a filling portion and a plurality of bonding portions, the plurality of bonding portions are spaced apart, and the filling portion fills the gap between the plurality of bonding portions; A chip is disposed on one side of the driving substrate; the chip includes a chip body and chip electrodes, and the chip electrodes are disposed on the side of the chip body facing the driving substrate; The chip is bonded to the driving substrate, so that the chip electrode is connected to the bonding electrode.

15. The method for manufacturing a display panel according to claim 14, characterized in that, The bonding process between the chip and the driving substrate includes: The bonding electrode is subjected to a first heating treatment to soften the filling portion, and pressure is applied to the chip to bring the filling portion into contact with the chip electrode; The bonding electrode is subjected to a second heating treatment, and pressure is continued to be applied to the chip to bond the bonding portion to the chip electrode; Wherein, the temperature of the first heat treatment is greater than or equal to the softening temperature of the filling portion and less than the bonding temperature between the chip electrode and the bonding portion; The temperature of the second heat treatment is greater than or equal to the bonding temperature between the chip electrode and the bonding portion and less than the decomposition temperature of the filling portion.

Images