Method for matching sheave structure parameters based on cutting wire diameter and related product

Abstract

The invention discloses a method for matching sheave structure parameters based on a cutting line diameter and a related product, which can be applied to the technical field of semiconductor precision machining, and the method comprises the following steps: determining the thickness of a cutting sheet and the diameter of a cutting line; determining a sheave spacing of a target sheave structure based on the thickness of the cutting blade and the diameter of the cutting line; target cutting tension is determined based on the diameter of the cutting line, and a target distance value between the highest point of the cutting line and the uppermost end of the grooved wheel is determined based on the target cutting tension; determining the geneva wheel opening degree and the geneva wheel bottom arc radius of the target geneva wheel structure based on the target distance value and a first preset distance; the first preset distance is the distance between the lowest point of the cutting line and the bottom of the grooved wheel. Thus, the corresponding sheave structure parameters are matched for different cutting line diameters, the target sheave structure effectively restrains the cutting line, and therefore the fluctuation of the average deviation of the thickness of the cut wafer is reduced while the low line breakage rate of the sheave area is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor precision processing, in particular to a method for matching groove wheel structure parameters based on cutting line diameter and related products. BACKGROUND

[0002] Silicon carbide (SiC) has become an ideal material for making high-temperature, high-pressure, high-frequency, high-power and radiation-resistant electronic devices due to its large band gap, high thermal conductivity, large critical breakdown field strength and high electron mobility. However, SiC is difficult to cut due to its high hardness, and is usually cut by multi-wire cutting or laser cutting.

[0003] Laser cutting has high efficiency, but it has not been mass-produced due to its high equipment cost and low process maturity. In order to minimize material loss, the diameter of the cutting line is often reduced in existing multi-wire cutting, thereby ignoring the matching relationship between the diameter of the cutting line and the structure parameters of the multi-wire groove wheel, resulting in a high wire breakage rate in the groove wheel area and a large fluctuation in the average deviation of wafer thickness after cutting.

[0004] Therefore, how to reduce the fluctuation of the average deviation of wafer thickness after cutting while ensuring a low wire breakage rate in the groove wheel area is a problem that needs to be solved by those skilled in the art. SUMMARY

[0005] In view of the above problems, the present application provides a method for matching groove wheel structure parameters based on cutting line diameter and related products. By matching corresponding groove wheel structure parameters for different cutting line diameters, the target groove wheel structure effectively constrains the cutting line, thereby reducing the fluctuation of the average deviation of wafer thickness after cutting while ensuring a low wire breakage rate in the groove wheel area.

[0006] In a first aspect, the embodiments of the present application provide a method for matching groove wheel structure parameters based on cutting line diameter, comprising:

[0007] determining wafer thickness and cutting line diameter;

[0008] determining groove wheel spacing of a target groove wheel structure based on the wafer thickness and the cutting line diameter;

[0009] determining a target cutting tension based on the cutting line diameter, and determining a target distance value between the highest point of the cutting line and the uppermost end of the groove wheel based on the target cutting tension;

[0010] determining groove wheel opening and groove wheel bottom arc radius of the target groove wheel structure based on the target distance value and a first preset distance; the first preset distance is the distance between the lowest point of the cutting line and the groove wheel bottom.

[0011] Optionally, the determination of the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter comprises:

[0012] introducing the cutting sheet thickness and the cutting line diameter into a groove wheel spacing calculation formula, and determining the groove wheel spacing of the target groove wheel structure according to the groove wheel spacing calculation formula;

[0013] the groove wheel spacing calculation formula is: groove wheel spacing = cutting sheet thickness + cutting line diameter + X;

[0014] the X is an influence coefficient related to cutting mortar; the value of the X is between 0.03mm and 0.06mm.

[0015] Optionally, the determination of the target cutting tension based on the cutting line diameter comprises:

[0016] determination of the cutting line breaking tension based on the cutting line diameter;

[0017] determination of the target cutting tension through the cutting line breaking tension based on a preset relationship between the cutting line breaking tension and the target cutting tension.

[0018] Optionally, the groove wheel depth of the target groove wheel structure is between 0.2mm and 0.5mm.

[0019] Optionally, the cutting sheet thickness is between 0.35mm and 0.7mm;

[0020] the cutting line diameter is between 0.05mm and 0.18mm.

[0021] Optionally, the target distance value is between 0.07mm and 0.25mm.

[0022] Optionally, the first preset distance is between 0.04mm and 0.08mm.

[0023] In a second aspect, an embodiment of the present application provides a device for matching groove wheel structure parameters based on a cutting line diameter, comprising:

[0024] a first determination module configured to determine a cutting sheet thickness and a cutting line diameter;

[0025] a second determination module configured to determine a groove wheel spacing of a target groove wheel structure based on the cutting sheet thickness and the cutting line diameter;

[0026] a third determination module configured to determine a target cutting tension based on the cutting line diameter, and determine a target distance value between a highest point of a cutting line and an uppermost end of a groove wheel based on the target cutting tension;

[0027] A fourth determining module is configured to determine the slot wheel opening degree and the slot wheel bottom arc radius of the target slot wheel structure based on the target distance value and a first preset distance, wherein the first preset distance is a distance between the lowest point of the cutting line and the slot wheel bottom.

[0028] In a third aspect, an apparatus for matching slot wheel structure parameters based on a cutting line diameter is provided, and the apparatus comprises:

[0029] A memory is configured to store a computer program.

[0030] A processor is configured to implement the steps of the method for matching slot wheel structure parameters based on a cutting line diameter when the computer program is executed.

[0031] In a fourth aspect, a readable storage medium is provided, and the readable storage medium stores a computer program. When the computer program is executed by a processor, the steps of the method for matching slot wheel structure parameters based on a cutting line diameter are implemented.

[0032] As can be seen from the above technical solutions, compared with the prior art, the present application has the following advantages:

[0033] The method for matching slot wheel structure parameters based on a cutting line diameter provided by the present application first determines the cutting blade thickness and the cutting line diameter, and determines the slot wheel distance of the target slot wheel structure based on the cutting blade thickness and the cutting line diameter. Then, the target cutting tension is determined based on the cutting line diameter, and the target distance value between the highest point of the cutting line and the uppermost end of the slot wheel is determined based on the target cutting tension. Finally, the slot wheel opening degree and the slot wheel bottom arc radius of the target slot wheel structure are determined based on the target distance value and a first preset distance. The first preset distance is the distance between the lowest point of the cutting line and the slot wheel bottom. In this way, by matching the corresponding slot wheel structure parameters for different cutting line diameters, the target slot wheel structure effectively constrains the cutting line, so as to reduce the fluctuation of the average deviation of the wafer thickness after cutting while ensuring a low broken line rate in the slot wheel area. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A flowchart of the method for matching slot wheel structure parameters based on a cutting line diameter provided by the present application is provided.

[0035] Figure 2 A schematic diagram of a target slot wheel structure provided by the present application is provided.

[0036] Figure 3 A schematic diagram of another target slot wheel structure provided by the present application is provided.

[0037] Figure 4 A TTV result comparison line graph provided by the present application is provided.

[0038] Figure 5 A structural schematic diagram of a device based on matching groove wheel structure parameters according to an embodiment of the present application is provided. DETAILED DESCRIPTION

[0039] As described above, the existing multi-wire cutting method has the problems of high broken wire rate in the groove wheel area and large fluctuation of wafer thickness average deviation after cutting. Specifically, in order to minimize material loss, the existing multi-wire cutting method often sets the cutting wire diameter to be very small, and does not pay attention to the matching relationship between the cutting wire diameter and the multi-wire groove wheel structure parameters. In this way, the reduction of the cutting wire diameter on the one hand leads to the reduction of the cutting tension, so that the influence of the tension on the silicon carbide wafer processing is more concentrated and sensitive, and the fluctuation of the lens thickness average deviation after cutting is large (the control difficulty is significantly increased); on the other hand, the continuous reduction of the cutting wire diameter also leads to a high broken wire rate.

[0040] To solve the above problems, an embodiment of the present application provides a method for matching groove wheel structure parameters based on cutting wire diameter, which comprises the following steps: first, determining the cutting wafer thickness and the cutting wire diameter, and determining the groove wheel pitch of the target groove wheel structure based on the cutting wafer thickness and the cutting wire diameter. Then, determining the target cutting tension based on the cutting wire diameter, and determining the target distance value between the highest point of the cutting wire and the uppermost end of the groove wheel based on the target cutting tension. Finally, determining the groove wheel opening degree and the groove wheel bottom arc radius of the target groove wheel structure based on the target distance value and the first preset distance. The first preset distance is the distance between the lowest point of the cutting wire and the groove wheel bottom.

[0041] In this way, by matching the corresponding groove wheel structure parameters for different cutting wire diameters, the target groove wheel structure effectively constrains the cutting wire, thereby reducing the fluctuation of the wafer thickness average deviation after cutting while ensuring a low broken wire rate in the groove wheel area.

[0042] It should be noted that the method for matching groove wheel structure parameters based on cutting wire diameter and related products provided by the embodiments of the present application can be applied to the field of semiconductor technology. The above is only an example and does not limit the application of the method for matching groove wheel structure parameters based on cutting wire diameter and related products provided by the embodiments of the present application.

[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0044] Figure 1A flowchart of a method for matching groove wheel structure parameters based on cutting line diameter is provided in the embodiments of the present application. In combination with Figure 1 As shown in the method for matching groove wheel structure parameters based on cutting line diameter, the method can include:

[0045] S101: Determine the cutting slice thickness and the cutting line diameter.

[0046] Further, the cutting slice thickness is between 0.35mm-0.7mm; and the cutting line diameter is between 0.05mm-0.18mm.

[0047] In actual application, in order to ensure low breakage rate of the groove wheel area while reducing the fluctuation of the average deviation of the wafer thickness after cutting, attention should be paid to the matching relationship between the cutting line diameter and the multi-line cutting groove wheel structure parameters, and the collaborative optimization between the two. Therefore, different cutting line diameters often need to correspond to different multi-line cutting machine groove wheel structures. Specifically, the method for matching groove wheel structure parameters based on cutting line diameter provided in the embodiments of the present application first needs to determine the cutting slice thickness and the cutting line diameter. The cutting slice thickness refers to the wafer thickness obtained after multi-line cutting of the original wafer to be cut required by the process; and the cutting line diameter refers to the diameter of the cutting line. The cutting slice thickness is generally 0.35mm-0.7mm, and the cutting line diameter is generally selected between 0.05mm-0.18mm.

[0048] In addition, the line type of the cutting line can be a spiral structure line.

[0049] S102: Determine the groove wheel pitch of the target groove wheel structure based on the cutting slice thickness and the cutting line diameter.

[0050] Further, the groove wheel depth of the target groove wheel structure is between 0.2mm-0.5mm.

[0051] In actual application, in order to ensure the service life of the groove wheel after greasing, the groove wheel groove depth (D) of the target groove wheel structure is generally set to be between 0.2mm-0.5mm. There is a correlation between the groove wheel pitch (P) of the target groove wheel structure, the cutting line diameter, and the cutting slice thickness. When the groove wheel pitch of the target groove wheel structure and the cutting line diameter are determined, the thickness of the cutting slice is also known. Therefore, the embodiments of the present application can determine the groove wheel pitch of the target groove wheel structure through the cutting slice thickness and the cutting line diameter based on the correlation between the three after determining the cutting slice thickness and the cutting line diameter.

[0052] In addition, since the ways of determining the groove wheel pitch of the target groove wheel structure are not the same, the embodiments of the present application can describe one possible determination method.

[0053] In one case, S102: determining the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting wire diameter, which can specifically include:

[0054] introducing the cutting sheet thickness and the cutting wire diameter into the groove wheel spacing calculation formula, and determining the groove wheel spacing of the target groove wheel structure according to the groove wheel spacing calculation formula;

[0055] The groove wheel spacing calculation formula is: groove wheel spacing = cutting sheet thickness + cutting wire diameter + X.

[0056] The X is an influence coefficient related to cutting mortar; the value of X is between 0.03mm-0.06mm.

[0057] In practical application, the cutting sheet thickness is approximately equal to the groove wheel spacing (P) minus the cutting wire diameter and the size of abrasive particles in the cutting fluid. Therefore, the groove wheel spacing calculation formula can be constructed as: groove wheel spacing = cutting sheet thickness + cutting wire diameter + X, where X is an influence coefficient related to cutting mortar, and the value of X is between 0.03mm-0.06mm. Further, after selecting the value of X, the groove wheel spacing of the target groove wheel structure can be determined by bringing the specific cutting sheet thickness and cutting wire diameter into the groove wheel spacing calculation formula. Generally, the value of the groove wheel spacing (P) of the target groove wheel structure is between 0.43mm-0.80mm.

[0058] S103: determining the target cutting tension based on the cutting wire diameter, and determining the target distance value between the highest point of the cutting wire and the uppermost end of the groove wheel based on the target cutting tension.

[0059] Further, the target distance value is between 0.07mm-0.25mm.

[0060] In practical application, in order to ensure that the cutting wire can run stably at high speed in the groove wheel, it is necessary to ensure that there is a certain distance between the highest point of the cutting wire and the uppermost end of the groove wheel, and the value of this distance is called the target distance value (Z). The value of the target distance value needs to be between 0.07mm-0.25mm. The determination of the target distance value is related to the cutting wire diameter, specifically, different cutting wire diameters adapt to different tensions, which is called the target cutting tension. The embodiment of the present application determines the target distance value according to the target cutting tension, generally the smaller the target cutting tension, the smaller the target distance value (Z). It can be understood that the target distance value (Z) needs to be selected between 0.07mm-0.25mm, and the smaller the target cutting tension, the smaller the selected target distance value (Z). For example, the target cutting tensions are 25N and 8N respectively, and the selected target distance values (Z) may be 0.18 and 0.12 respectively.

[0061] In addition, since the target cutting tension is determined in different ways, the embodiments of the present application can be described in terms of one possible determination method.

[0062] In one case, the target cutting tension is determined based on the cutting line diameter, comprising:

[0063] The breaking tension of the cutting line is determined based on the cutting line diameter;

[0064] The target cutting tension is determined based on the preset relationship between the breaking tension of the cutting line and the target cutting tension.

[0065] In practical applications, the breaking tension of the cutting line is directly related to the cutting line diameter, that is, the breaking tension of the cutting line is known given the cutting line diameter. In this case, the preset relationship between the target cutting tension and the breaking tension of the cutting line can be set in advance, for example, the target cutting tension is set to be 30%-50% of the breaking tension of the cutting line. Further, according to the preset relationship, the target cutting tension can be directly determined when the breaking tension of the cutting line is determined.

[0066] S104: Determine the slot wheel opening and the slot wheel bottom arc radius of the target slot wheel structure based on the target distance value and a first preset distance; the first preset distance is the distance between the cutting line lowest point and the slot wheel bottom.

[0067] Further, the first preset distance is between 0.04mm and 0.08mm.

[0068] In practical applications, the slot of the slot wheel is a V-shaped slot with a certain arc at the bottom, and when cutting, the cutting line lowest point and the slot wheel bottom need to have a certain distance, which is called the first preset distance (Y), which is generally selected between 0.04mm and 0.08mm. It can be understood that the adjustment of the slot wheel opening (A) and the bottom arc radius (R) of the target slot wheel structure will affect the first preset distance. Similarly, given the first preset distance, the specific adjustment value of the slot wheel opening and the bottom arc radius of the target slot wheel structure can also be determined. It should be noted that the slot wheel opening (A) is generally selected between 30° and 60°, and the bottom arc radius (R) is generally selected between 0mm and 0.04mm.

[0069] In summary, after the cutting sheet thickness and the cutting line diameter are given, the groove wheel depth (D) is between 0.2mm-0.5mm, the groove wheel pitch (P) is between 0.43mm-0.80mm, the target distance value (Z) is between 0.07mm-0.25mm, and the first preset distance (Y) is between 0.04mm-0.08mm, which are the limiting conditions. The corresponding groove wheel structure parameters (such as groove wheel depth, groove wheel pitch, groove wheel opening and groove wheel bottom arc radius) are matched for the cutting line diameter, so as to achieve the purpose of collaborative optimization.

[0070] The specific values are described below. Figure 2 A schematic diagram of a target groove wheel structure provided by the embodiment of the present application. Figure 3 A schematic diagram of another target groove wheel structure provided by the embodiment of the present application. Figure 2 And Figure 3 As shown in the figure, the value of the bottom arc radius (R) is between 0mm-0.04mm, that is, R can be a non-zero value, that is Figure 2 As shown in the figure; or it can be zero, that is Figure 3As shown. Further, under the premise of ensuring that the above constraints are met, as a first practical case, the thickness of the wafer to be cut is 500mm, the groove depth D is set to 0.4mm, the cutting line is a straight line with a diameter of 0.16mm, the target cutting tension is 40% of the cutting line breaking tension, and the cutting line breaking tension is set to 25N. Then, the groove spacing P can be obtained as 0.69mm through the groove spacing calculation formula. According to the target cutting tension, the target distance Z between the highest point of the cutting line and the uppermost end of the groove wheel is set to 0.18mm. Then, the first preset distance Y between the lowest point of the cutting line and the bottom of the groove wheel is 0.06mm. Then, the groove opening A and the bottom arc radius R of the groove wheel are set to meet this distance, respectively, A=50° and R=0.035mm. As a second practical scenario, the thickness of the wafer to be cut is 440mm, the groove depth D is set to 0.25mm, the cutting line is a spiral structure line with a diameter of 0.08mm, the target cutting tension is 44% of the cutting line breaking tension, and the cutting line breaking tension is set to 8N. Then, the groove spacing P can be obtained as 0.55mm through the groove spacing calculation formula. Based on the target cutting tension, the target distance Z between the highest point of the cutting line and the uppermost end of the groove is set to 0.12mm. Then, the first preset distance Y between the lowest point of the cutting line and the bottom of the groove is 0.05mm. Then, the groove opening A and the bottom arc radius R of the groove are set to satisfy this distance, respectively, A=30° and R=0.02mm. As a third practical scenario, the thickness of the wafer to be cut is 400mm, the groove depth D is set to 0.25mm, the cutting line is a spiral structure line with a diameter of 0.08mm, the target cutting tension is 44% of the cutting line breaking tension, and the cutting line breaking tension is set to 8N. Then, the groove spacing P can be obtained as 0.51mm through the groove spacing calculation formula. Based on the target cutting tension, the target distance Z between the highest point of the cutting line and the top of the groove wheel is set to 0.12mm. Then, the first preset distance Y between the lowest point of the cutting line and the bottom of the groove wheel is 0.05mm. Then, the groove opening A and the bottom arc radius R of the groove wheel are set to satisfy this distance, respectively, A=50° and R=0mm.

[0071] Figure 4 This application provides a TTV result comparison line graph as an embodiment of the present application. Combined with... Figure 4 As shown, the average total thickness variation (TTV) of the SiC wafers cut under the first actual condition is 11.6 μm, which is a significant improvement over the average TTV under the traditional cutting method, and the breakage rate during the cutting process is only 4.9%; the average TTV of the SiC wafers cut under the second actual condition is 8.6 μm, and the breakage rate during the cutting process is only 3.7%; the average TTV of the SiC wafers cut under the third actual condition is 6.2 μm, and the breakage rate during the cutting process is only 4.3%.

[0072] In summary, the application first determines the cutting sheet thickness and the cutting line diameter, and determines the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter. Then the target cutting tension is determined based on the cutting line diameter, and the target distance value between the highest point of the cutting line and the uppermost end of the groove wheel is determined based on the target cutting tension. Finally, the groove wheel opening degree and the groove wheel bottom arc radius of the target groove wheel structure are determined based on the target distance value and a first preset distance. The first preset distance is the distance between the lowest point of the cutting line and the groove wheel bottom. In this way, by matching the corresponding groove wheel structure parameters for different cutting line diameters, the target groove wheel structure effectively constrains the cutting line, thereby reducing the fluctuation of the average deviation of the wafer thickness after cutting while ensuring a low breakage rate in the groove wheel area.

[0073] Figure 5 A structural schematic diagram of a device for matching groove wheel structure parameters based on cutting line diameter is provided for the embodiments of the application. As shown in Figure 5 The device 500 for matching groove wheel structure parameters based on cutting line diameter includes:

[0074] A first determination module 501 for determining the cutting sheet thickness and the cutting line diameter;

[0075] A second determination module 502 for determining the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter;

[0076] A third determination module 503 for determining the target cutting tension based on the cutting line diameter, and determining the target distance value between the highest point of the cutting line and the uppermost end of the groove wheel based on the target cutting tension;

[0077] A fourth determination module 504 for determining the groove wheel opening degree and the groove wheel bottom arc radius of the target groove wheel structure based on the target distance value and a first preset distance. The first preset distance is the distance between the lowest point of the cutting line and the groove wheel bottom.

[0078] Further, the groove wheel depth of the target groove wheel structure is between 0.2mm-0.5mm; the cutting sheet thickness is between 0.35mm-0.7mm; the cutting line diameter is between 0.05mm-0.18mm; the target distance value is between 0.07mm-0.25mm; and the first preset distance is between 0.04mm-0.08mm.

[0079] As an implementation manner, for how to determine the groove wheel spacing of the target groove wheel structure, the above-mentioned second determination module 502 is specifically configured to:

[0080] introduce the cutting sheet thickness and the cutting line diameter into a groove wheel spacing calculation formula, and determine the groove wheel spacing of the target groove wheel structure according to the groove wheel spacing calculation formula;

[0081] The slot wheel spacing calculation formula is: slot wheel spacing = cutting sheet thickness + cutting line diameter + X;

[0082] The X is an influence coefficient related to cutting mortar; the value of X is between 0.03mm-0.06mm.

[0083] As an implementation, for how to determine the target cutting tension based on the cutting line diameter, the third determination module 503 is specifically configured to:

[0084] determine the cutting line breaking tension based on the cutting line diameter;

[0085] determine the target cutting tension through the cutting line breaking tension based on a preset relationship between the cutting line breaking tension and the target cutting tension.

[0086] In summary, the present application first determines the cutting sheet thickness and the cutting line diameter, and determines the slot wheel spacing of the target slot wheel structure based on the cutting sheet thickness and the cutting line diameter. Then, the target cutting tension is determined based on the cutting line diameter, and the target distance value between the highest point of the cutting line and the uppermost end of the slot wheel is determined based on the target cutting tension. Finally, the slot wheel opening and the slot wheel bottom arc radius of the target slot wheel structure are determined based on the target distance value and the first preset distance. The first preset distance is the distance between the lowest point of the cutting line and the slot wheel bottom. In this way, by matching the corresponding slot wheel structure parameters for different cutting line diameters, the target slot wheel structure effectively restrains the cutting line, thereby reducing the fluctuation of the average deviation of the wafer thickness after cutting while ensuring a low line breakage rate in the slot wheel area.

[0087] In addition, the present application also provides a device for matching slot wheel structure parameters based on cutting line diameter, comprising: a memory for storing a computer program; a processor for executing the computer program to realize the steps of the method for matching slot wheel structure parameters based on cutting line diameter as described above.

[0088] In addition, the present application also provides a readable storage medium having a computer program stored thereon, wherein the computer program is executed by a processor to realize the steps of the method for matching slot wheel structure parameters based on cutting line diameter as described above.

[0089] The above description of disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for matching the parameters of a notched wheel structure based on the cutting line diameter, characterized by, The method comprises: determining the cutting sheet thickness and the cutting line diameter; determining the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter; determining the target cutting tension based on the cutting line diameter, and determining the target distance value between the highest point of the cutting line and the uppermost end of the groove wheel based on the target cutting tension; determining the groove wheel opening degree and the groove wheel bottom arc radius of the target groove wheel structure based on the target distance value and a first preset distance; the first preset distance is the distance between the lowest point of the cutting line and the groove wheel bottom.

2. The method of claim 1, wherein, The determination of the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter comprises: introducing the cutting sheet thickness and the cutting line diameter into a groove wheel spacing calculation formula, and determining the groove wheel spacing of the target groove wheel structure according to the groove wheel spacing calculation formula; the groove wheel spacing calculation formula is: groove wheel spacing = cutting sheet thickness + cutting line diameter + X; X is an influence coefficient related to cutting mortar; the value of X is between 0.03 mm and 0.06 mm.

3. The method of claim 1, wherein, The determination of the target cutting tension based on the cutting line diameter comprises: determining the breaking tension of the cutting line based on the cutting line diameter; determining the target cutting tension through the breaking tension of the cutting line based on a preset relationship between the breaking tension of the cutting line and the target cutting tension.

4. The method of claim 1, wherein, The groove wheel depth of the target groove wheel structure is between 0.2 mm and 0.5 mm.

5. The method of claim 1, wherein, The cutting sheet thickness is between 0.35 mm and 0.7 mm; The cutting line diameter is between 0.05 mm and 0.18 mm.

6. The method of claim 1, wherein, The target distance value is between 0.07 mm and 0.25 mm.

7. The method of claim 1, wherein, The first preset distance is between 0.04 mm and 0.08 mm.

8. An apparatus for matching slot wheel structure parameters based on cutting line diameter, characterized by, It comprises: a first determination module for determining the cutting sheet thickness and the cutting line diameter; a second determination module for determining the groove wheel spacing of the target groove wheel structure based on the cutting sheet thickness and the cutting line diameter; a third determination module for determining the target cutting tension based on the cutting line diameter, and determining the target distance value between the highest point of the cutting line and the uppermost end of the groove wheel based on the target cutting tension; a fourth determination module for determining the groove wheel opening degree and the groove wheel bottom arc radius of the target groove wheel structure based on the target distance value and a first preset distance; the first preset distance is the distance between the lowest point of the cutting line and the groove wheel bottom.

9. An apparatus for matching groove wheel structure parameters based on cutting line diameter, characterized by, It comprises: a memory for storing a computer program; a processor for implementing the steps of the method for matching groove wheel structure parameters based on the cutting line diameter according to any one of claims 1 to 7 when executing the computer program.

10. A readable storage medium, characterized by, The computer program is stored on the readable storage medium, and the computer program is executed by the processor to implement the steps of the method for matching groove wheel structure parameters based on the cutting line diameter according to any one of claims 1 to 7.

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